TWI798500B - 加成硬化型聚矽氧樹脂組成物、其硬化物及光半導體裝置 - Google Patents

加成硬化型聚矽氧樹脂組成物、其硬化物及光半導體裝置 Download PDF

Info

Publication number: TWI798500B
Authority: TW; Taiwan
Prior art keywords: sio; component; addition; resin composition; cured product
Prior art date: 2018-10-30

Application number

TW108138975A

Other languages

English (en)

Chinese (zh)

Other versions

TW202024240A (zh

Inventor

小林之人

小材利之

茂木勝成

Original Assignee

日商信越化學工業股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2018-10-30

Filing date

2019-10-29

Publication date

2023-04-11

2019-10-29 Application filed by 日商信越化學工業股份有限公司 filed Critical 日商信越化學工業股份有限公司

2020-07-01 Publication of TW202024240A publication Critical patent/TW202024240A/zh

2023-04-11 Application granted granted Critical

2023-04-11 Publication of TWI798500B publication Critical patent/TWI798500B/zh

Links

229920001296 polysiloxane Polymers 0.000 title claims abstract description 75
-1 polysiloxane Polymers 0.000 title claims abstract description 72
239000011342 resin composition Substances 0.000 title claims abstract description 20
239000004065 semiconductor Substances 0.000 title claims description 24
230000003287 optical effect Effects 0.000 title claims description 22
238000013006 addition curing Methods 0.000 title 1
125000003342 alkenyl group Chemical group 0.000 claims abstract description 25
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 15
125000001183 hydrocarbyl group Chemical group 0.000 claims abstract description 12
239000003054 catalyst Substances 0.000 claims abstract description 10
229910052751 metal Inorganic materials 0.000 claims abstract description 8
229920006136 organohydrogenpolysiloxane Polymers 0.000 claims abstract description 8
239000002184 metal Substances 0.000 claims abstract description 7
239000000203 mixture Substances 0.000 claims description 48
239000000463 material Substances 0.000 claims description 18
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 17
125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 9
125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 8
229910004283 SiO 4 Inorganic materials 0.000 claims description 6
229910052710 silicon Inorganic materials 0.000 claims description 4
229920002050 silicone resin Polymers 0.000 abstract description 6
239000000047 product Substances 0.000 description 26
230000015572 biosynthetic process Effects 0.000 description 10
238000003786 synthesis reaction Methods 0.000 description 10
229920001577 copolymer Polymers 0.000 description 9
KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 8
AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 8
UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 8
230000000052 comparative effect Effects 0.000 description 8
150000001875 compounds Chemical class 0.000 description 8
238000001816 cooling Methods 0.000 description 8
239000002683 reaction inhibitor Substances 0.000 description 8
238000003756 stirring Methods 0.000 description 8
239000000758 substrate Substances 0.000 description 8
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
239000013078 crystal Substances 0.000 description 7
238000000034 method Methods 0.000 description 7
229920001843 polymethylhydrosiloxane Polymers 0.000 description 7
229920005989 resin Polymers 0.000 description 7
239000011347 resin Substances 0.000 description 7
239000004615 ingredient Substances 0.000 description 6
238000002156 mixing Methods 0.000 description 6
125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 6
239000002253 acid Substances 0.000 description 5
238000006243 chemical reaction Methods 0.000 description 5
BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 5
239000000945 filler Substances 0.000 description 5
229920002554 vinyl polymer Polymers 0.000 description 5
LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
125000005370 alkoxysilyl group Chemical group 0.000 description 4
125000000217 alkyl group Chemical group 0.000 description 4
239000012141 concentrate Substances 0.000 description 4
239000003623 enhancer Substances 0.000 description 4
125000000524 functional group Chemical group 0.000 description 4
229940098779 methanesulfonic acid Drugs 0.000 description 4
229910052697 platinum Inorganic materials 0.000 description 4
229910000030 sodium bicarbonate Inorganic materials 0.000 description 4
235000017557 sodium bicarbonate Nutrition 0.000 description 4
239000000853 adhesive Substances 0.000 description 3
230000001070 adhesive effect Effects 0.000 description 3
239000003795 chemical substances by application Substances 0.000 description 3
238000004132 cross linking Methods 0.000 description 3
238000001723 curing Methods 0.000 description 3
125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 3
238000006459 hydrosilylation reaction Methods 0.000 description 3
238000006386 neutralization reaction Methods 0.000 description 3
150000002894 organic compounds Chemical class 0.000 description 3
150000001451 organic peroxides Chemical class 0.000 description 3
QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 2
125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
229910004298 SiO 2 Inorganic materials 0.000 description 2
238000007259 addition reaction Methods 0.000 description 2
125000004432 carbon atom Chemical group C* 0.000 description 2
125000004122 cyclic group Chemical group 0.000 description 2
239000004205 dimethyl polysiloxane Substances 0.000 description 2
235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 2
230000000694 effects Effects 0.000 description 2
230000002401 inhibitory effect Effects 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
150000003961 organosilicon compounds Chemical class 0.000 description 2
NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
239000000843 powder Substances 0.000 description 2
RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
ZICNIEOYWVIEQJ-UHFFFAOYSA-N (2-methylbenzoyl) 2-methylbenzenecarboperoxoate Chemical compound CC1=CC=CC=C1C(=O)OOC(=O)C1=CC=CC=C1C ZICNIEOYWVIEQJ-UHFFFAOYSA-N 0.000 description 1
AGKBXKFWMQLFGZ-UHFFFAOYSA-N (4-methylbenzoyl) 4-methylbenzenecarboperoxoate Chemical compound C1=CC(C)=CC=C1C(=O)OOC(=O)C1=CC=C(C)C=C1 AGKBXKFWMQLFGZ-UHFFFAOYSA-N 0.000 description 1
WHTVZRBIWZFKQO-AWEZNQCLSA-N (S)-chloroquine Chemical compound ClC1=CC=C2C(N[C@@H](C)CCCN(CC)CC)=CC=NC2=C1 WHTVZRBIWZFKQO-AWEZNQCLSA-N 0.000 description 1
KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 1
WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 description 1
XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
241000208340 Araliaceae Species 0.000 description 1
239000004342 Benzoyl peroxide Substances 0.000 description 1
OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
239000004215 Carbon black (E152) Substances 0.000 description 1
OJYKBUHBVFPYSX-UHFFFAOYSA-N Cc1ccc(cc1)C(=O)OOOC(=O)OCCCCCCOC(=O)OOOC(=O)c1ccc(C)cc1 Chemical compound Cc1ccc(cc1)C(=O)OOOC(=O)OCCCCCCOC(=O)OOOC(=O)c1ccc(C)cc1 OJYKBUHBVFPYSX-UHFFFAOYSA-N 0.000 description 1
ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
239000004593 Epoxy Substances 0.000 description 1
KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
235000003140 Panax quinquefolius Nutrition 0.000 description 1
OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
239000004954 Polyphthalamide Substances 0.000 description 1
239000004793 Polystyrene Substances 0.000 description 1
BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
239000006087 Silane Coupling Agent Substances 0.000 description 1
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
230000006750 UV protection Effects 0.000 description 1
150000001336 alkenes Chemical class 0.000 description 1
125000002947 alkylene group Chemical group 0.000 description 1
HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
229940045985 antineoplastic platinum compound Drugs 0.000 description 1
125000003710 aryl alkyl group Chemical group 0.000 description 1
125000003118 aryl group Chemical group 0.000 description 1
QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
239000012964 benzotriazole Substances 0.000 description 1
235000019400 benzoyl peroxide Nutrition 0.000 description 1
125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
239000007809 chemical reaction catalyst Substances 0.000 description 1
239000007795 chemical reaction product Substances 0.000 description 1
239000000460 chlorine Substances 0.000 description 1
229910052801 chlorine Inorganic materials 0.000 description 1
125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
229960003677 chloroquine Drugs 0.000 description 1
WHTVZRBIWZFKQO-UHFFFAOYSA-N chloroquine Natural products ClC1=CC=C2C(NC(C)CCCN(CC)CC)=CC=NC2=C1 WHTVZRBIWZFKQO-UHFFFAOYSA-N 0.000 description 1
238000004587 chromatography analysis Methods 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
239000000084 colloidal system Substances 0.000 description 1
238000013329 compounding Methods 0.000 description 1
239000003431 cross linking reagent Substances 0.000 description 1
229910002026 crystalline silica Inorganic materials 0.000 description 1
125000000753 cycloalkyl group Chemical group 0.000 description 1
125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
238000002845 discoloration Methods 0.000 description 1
KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
239000008393 encapsulating agent Substances 0.000 description 1
125000003700 epoxy group Chemical group 0.000 description 1
150000002148 esters Chemical group 0.000 description 1
NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
125000001033 ether group Chemical group 0.000 description 1
125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
238000011049 filling Methods 0.000 description 1
235000008434 ginseng Nutrition 0.000 description 1
150000008282 halocarbons Chemical group 0.000 description 1
230000020169 heat generation Effects 0.000 description 1
229930195733 hydrocarbon Natural products 0.000 description 1
150000002430 hydrocarbons Chemical class 0.000 description 1
239000001257 hydrogen Substances 0.000 description 1
229910052739 hydrogen Inorganic materials 0.000 description 1
150000002432 hydroperoxides Chemical class 0.000 description 1
NYMPGSQKHIOWIO-UHFFFAOYSA-N hydroxy(diphenyl)silicon Chemical compound C=1C=CC=CC=1[Si](O)C1=CC=CC=C1 NYMPGSQKHIOWIO-UHFFFAOYSA-N 0.000 description 1
239000012535 impurity Substances 0.000 description 1
239000011256 inorganic filler Substances 0.000 description 1
229910003475 inorganic filler Inorganic materials 0.000 description 1
150000002688 maleic acid derivatives Chemical class 0.000 description 1
UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical compound [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 description 1
QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
125000000962 organic group Chemical group 0.000 description 1
229910052763 palladium Inorganic materials 0.000 description 1
125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical compound [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 description 1
229910052698 phosphorus Inorganic materials 0.000 description 1
239000011574 phosphorus Substances 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
229920006375 polyphtalamide Polymers 0.000 description 1
229920002223 polystyrene Polymers 0.000 description 1
238000003825 pressing Methods 0.000 description 1
230000001737 promoting effect Effects 0.000 description 1
125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
238000004080 punching Methods 0.000 description 1
230000002787 reinforcement Effects 0.000 description 1
229910052703 rhodium Inorganic materials 0.000 description 1
239000010948 rhodium Substances 0.000 description 1
MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
BDDWSAASCFBVBK-UHFFFAOYSA-N rhodium;triphenylphosphane Chemical compound [Rh].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 BDDWSAASCFBVBK-UHFFFAOYSA-N 0.000 description 1
238000007142 ring opening reaction Methods 0.000 description 1
238000000926 separation method Methods 0.000 description 1
229910000077 silane Inorganic materials 0.000 description 1
235000012239 silicon dioxide Nutrition 0.000 description 1
239000007787 solid Substances 0.000 description 1
239000000126 substance Substances 0.000 description 1
229910052717 sulfur Inorganic materials 0.000 description 1
239000011593 sulfur Substances 0.000 description 1
GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
150000003609 titanium compounds Chemical class 0.000 description 1
125000003944 tolyl group Chemical group 0.000 description 1
IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
125000005023 xylyl group Chemical group 0.000 description 1
150000003755 zirconium compounds Chemical class 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Microelectronics & Electronic Packaging (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Power Engineering (AREA)
Compositions Of Macromolecular Compounds (AREA)
Adhesives Or Adhesive Processes (AREA)
Led Device Packages (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

TW108138975A 2018-10-30 2019-10-29 加成硬化型聚矽氧樹脂組成物、其硬化物及光半導體裝置 TWI798500B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2018-203987		2018-10-30
JP2018203987A JP7021049B2 (ja)	2018-10-30	2018-10-30	付加硬化型シリコーン樹脂組成物、その硬化物、及び光半導体装置

Publications (2)

Publication Number	Publication Date
TW202024240A TW202024240A (zh)	2020-07-01
TWI798500B true TWI798500B (zh)	2023-04-11

Family

ID=70495448

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW108138975A TWI798500B (zh)	2018-10-30	2019-10-29	加成硬化型聚矽氧樹脂組成物、其硬化物及光半導體裝置

Country Status (4)

Country	Link
JP (1)	JP7021049B2 (ja)
KR (1)	KR20200049595A (ja)
CN (1)	CN111117256B (ja)
TW (1)	TWI798500B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6966411B2 (ja) *	2018-11-02	2021-11-17	信越化学工業株式会社	付加硬化型シリコーン樹脂組成物、その硬化物、及び光半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN104114645A (zh) *	2011-11-25	2014-10-22	Lg化学株式会社	可固化组合物

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB2287033B (en) *	1994-03-04	1998-05-13	Gen Electric	Addition curable silicone psa
JP4648099B2 (ja)	2005-06-07	2011-03-09	信越化学工業株式会社	ダイボンディング用シリコーン樹脂組成物
JP5392805B2 (ja) *	2005-06-28	2014-01-22	東レ・ダウコーニング株式会社	硬化性オルガノポリシロキサン樹脂組成物および光学部材
JP2009256400A (ja) *	2008-04-11	2009-11-05	Shin Etsu Chem Co Ltd	半導体素子用シリコーン接着剤
JP2010285571A (ja) *	2009-06-15	2010-12-24	Shin-Etsu Chemical Co Ltd	ダイボンディング用シリコーン樹脂組成物
JP5553018B2 (ja) *	2010-12-16	2014-07-16	信越化学工業株式会社	硬化性オルガノポリシロキサン組成物、光学素子封止材及び光学素子
JP5575820B2 (ja) *	2012-01-31	2014-08-20	信越化学工業株式会社	硬化性オルガノポリシロキサン組成物、光学素子封止材および光学素子
JP2013159671A (ja) *	2012-02-02	2013-08-19	Dow Corning Toray Co Ltd	硬化性シリコーン組成物、その硬化物、および光半導体装置
JP2014031394A (ja) *	2012-08-01	2014-02-20	Shin Etsu Chem Co Ltd	付加硬化型シリコーン組成物、及び該組成物の硬化物により半導体素子が被覆された半導体装置
CN107779091B (zh) *	2013-03-28	2020-05-19	美国陶氏有机硅公司	有机硅氧烷组合物和涂层、制成品、方法及用途
KR101591167B1 (ko)	2013-04-04	2016-02-02	주식회사 엘지화학	경화성 조성물
CN105492539B (zh)	2013-08-29	2019-05-07	美国陶氏有机硅公司	可固化有机硅组合物、其固化产物及光学半导体器件
CN106414611B (zh) *	2014-05-19	2020-03-17	信越化学工业株式会社	加成固化性液态硅橡胶组合物
WO2015178475A1 (ja) *	2014-05-23	2015-11-26	株式会社ダイセル	分岐鎖状ポリオルガノシロキシシルアルキレン、その製造方法、硬化性樹脂組成物、及び半導体装置
EP3184589B1 (en) *	2015-12-22	2019-05-01	Shin-Etsu Chemical Co., Ltd.	Addition-curable silicone resin composition and a semiconductor device
JPWO2017122712A1 (ja)	2016-01-15	2018-11-01	株式会社ダイセル	硬化性樹脂組成物、硬化物、封止材、及び半導体装置
US10947384B2 (en) *	2016-09-07	2021-03-16	Daicel Corporation	Curable resin composition, cured product thereof, and semiconductor device
JP6702233B2 (ja) *	2017-03-09	2020-05-27	信越化学工業株式会社	付加硬化型オルガノポリシロキサン樹脂組成物、該組成物の硬化物及び該硬化物を有する半導体装置
JP6981939B2 (ja) *	2018-08-28	2021-12-17	信越化学工業株式会社	付加硬化型シリコーン組成物及び半導体装置

2018
- 2018-10-30 JP JP2018203987A patent/JP7021049B2/ja active Active
2019
- 2019-10-25 KR KR1020190133381A patent/KR20200049595A/ko active Search and Examination
- 2019-10-28 CN CN201911031298.1A patent/CN111117256B/zh active Active
- 2019-10-29 TW TW108138975A patent/TWI798500B/zh active

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN104114645A (zh) *	2011-11-25	2014-10-22	Lg化学株式会社	可固化组合物

Also Published As

Publication number	Publication date
CN111117256A (zh)	2020-05-08
TW202024240A (zh)	2020-07-01
CN111117256B (zh)	2022-01-04
KR20200049595A (ko)	2020-05-08
JP2020070324A (ja)	2020-05-07
JP7021049B2 (ja)	2022-02-16

Publication	Publication Date	Title
JP5524424B1 (ja)	2014-06-18	光半導体素子封止用シリコーン組成物および光半導体装置
TWI734899B (zh)	2021-08-01	晶粒黏著用聚矽氧樹脂組成物及硬化物
TWI798283B (zh)	2023-04-11	加成硬化型聚矽氧組成物、硬化物、光學元件
JP7041094B6 (ja)	2023-12-18	ダイボンディング用シリコーン組成物、その硬化物、及び光半導体装置
TWI831858B (zh)	2024-02-11	加成硬化型聚矽氧樹脂組成物、其硬化物，及光半導體裝置
TWI830872B (zh)	2024-02-01	晶片黏合用矽氧樹脂組成物、硬化物及光半導體裝置
KR20070095799A (ko)	2007-10-01	반도체 장치의 제조 방법
TWI798500B (zh)	2023-04-11	加成硬化型聚矽氧樹脂組成物、其硬化物及光半導體裝置
JP7270574B2 (ja)	2023-05-10	付加硬化型シリコーン組成物、シリコーン硬化物、及び、光学素子
JP7128162B2 (ja)	2022-08-30	付加硬化型シリコーン組成物及び光学素子
TW202111008A (zh)	2021-03-16	加成硬化型聚矽氧樹脂組成物、該組成物之製造方法，及光半導體裝置
CN113493677B (zh)	2024-03-22	固晶用有机硅组合物、其固化物及光半导体装置
TWI837415B (zh)	2024-04-01	加成硬化型聚矽氧組成物及光學元件
TW202043419A (zh)	2020-12-01	黏晶用有機改質矽氧樹脂組成物、其硬化物及光半導體元件