KR102455405B1 - 테이프 회수 방법 및 테이프 회수 장치 - Google Patents

테이프 회수 방법 및 테이프 회수 장치 Download PDF

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Publication number
KR102455405B1
KR102455405B1 KR1020170165142A KR20170165142A KR102455405B1 KR 102455405 B1 KR102455405 B1 KR 102455405B1 KR 1020170165142 A KR1020170165142 A KR 1020170165142A KR 20170165142 A KR20170165142 A KR 20170165142A KR 102455405 B1 KR102455405 B1 KR 102455405B1
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KR
South Korea
Prior art keywords
tape
holding
unnecessary
recovery
adhesive tape
Prior art date
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KR1020170165142A
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English (en)
Korean (ko)
Other versions
KR20180092265A (ko
Inventor
쵸헤이 오쿠노
Original Assignee
닛토덴코 가부시키가이샤
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Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20180092265A publication Critical patent/KR20180092265A/ko
Application granted granted Critical
Publication of KR102455405B1 publication Critical patent/KR102455405B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Labeling Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electric Cables (AREA)
KR1020170165142A 2017-02-08 2017-12-04 테이프 회수 방법 및 테이프 회수 장치 KR102455405B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-021201 2017-02-08
JP2017021201A JP6833542B2 (ja) 2017-02-08 2017-02-08 テープ回収方法およびテープ回収装置

Publications (2)

Publication Number Publication Date
KR20180092265A KR20180092265A (ko) 2018-08-17
KR102455405B1 true KR102455405B1 (ko) 2022-10-14

Family

ID=63096433

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170165142A KR102455405B1 (ko) 2017-02-08 2017-12-04 테이프 회수 방법 및 테이프 회수 장치

Country Status (4)

Country Link
JP (1) JP6833542B2 (ja)
KR (1) KR102455405B1 (ja)
CN (1) CN108400105A (ja)
TW (1) TWI796309B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7256643B2 (ja) * 2019-01-15 2023-04-12 株式会社ディスコ 剥離装置
JP7252819B2 (ja) * 2019-04-09 2023-04-05 株式会社ディスコ 剥離装置
CN111890451B (zh) * 2020-07-23 2022-02-22 华邦古楼新材料有限公司 一种热转印纸加工工艺及分切装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004043106A (ja) * 2002-07-11 2004-02-12 Hinix Kk 断裁排出装置
JP2006140251A (ja) 2004-11-11 2006-06-01 Lintec Corp シート切断方法及びマウント方法
KR101350906B1 (ko) 2012-10-08 2014-01-24 한국성전(주) 터치스크린패널용 투명도전성 필름 적재 장치 및 방법
JP2014027171A (ja) 2012-07-27 2014-02-06 Lintec Corp シート貼付装置およびシート貼付方法
US20150069696A1 (en) 2012-04-27 2015-03-12 Andreas Schilling Apparatus for overlapping and stacking sheets
JP2015056613A (ja) 2013-09-13 2015-03-23 リンテック株式会社 シート貼付装置および貼付方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05238557A (ja) * 1992-02-27 1993-09-17 Kyodo Kumiai Techno Ueebu 異形ブランク材の自動整列装置
JPH06321401A (ja) * 1993-05-12 1994-11-22 Mitsubishi Heavy Ind Ltd シート積上装置
JP5123805B2 (ja) * 2008-09-29 2013-01-23 株式会社サトー知識財産研究所 プリンターにおける台紙なしラベルのスタッカー装置およびその積層スタック方法
JP5861534B2 (ja) * 2012-03-28 2016-02-16 富士通株式会社 テープピックアップ装置及び方法
JP2014133616A (ja) 2013-01-09 2014-07-24 Nitto Denko Corp 粘着テープ接合方法および粘着テープ接合装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004043106A (ja) * 2002-07-11 2004-02-12 Hinix Kk 断裁排出装置
JP2006140251A (ja) 2004-11-11 2006-06-01 Lintec Corp シート切断方法及びマウント方法
US20150069696A1 (en) 2012-04-27 2015-03-12 Andreas Schilling Apparatus for overlapping and stacking sheets
JP2014027171A (ja) 2012-07-27 2014-02-06 Lintec Corp シート貼付装置およびシート貼付方法
KR101350906B1 (ko) 2012-10-08 2014-01-24 한국성전(주) 터치스크린패널용 투명도전성 필름 적재 장치 및 방법
JP2015056613A (ja) 2013-09-13 2015-03-23 リンテック株式会社 シート貼付装置および貼付方法

Also Published As

Publication number Publication date
KR20180092265A (ko) 2018-08-17
TWI796309B (zh) 2023-03-21
JP2018127324A (ja) 2018-08-16
TW201830583A (zh) 2018-08-16
JP6833542B2 (ja) 2021-02-24
CN108400105A (zh) 2018-08-14

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