JP5076750B2 - プローブ装置及びプローブ方法 - Google Patents

プローブ装置及びプローブ方法 Download PDF

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Publication number
JP5076750B2
JP5076750B2 JP2007228078A JP2007228078A JP5076750B2 JP 5076750 B2 JP5076750 B2 JP 5076750B2 JP 2007228078 A JP2007228078 A JP 2007228078A JP 2007228078 A JP2007228078 A JP 2007228078A JP 5076750 B2 JP5076750 B2 JP 5076750B2
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JP
Japan
Prior art keywords
test head
probe
probe card
holding
inspection apparatus
Prior art date
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Active
Application number
JP2007228078A
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English (en)
Japanese (ja)
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JP2009060037A (ja
Inventor
大作 雨宮
浩 雨宮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2007228078A priority Critical patent/JP5076750B2/ja
Priority to KR1020080064975A priority patent/KR101025389B1/ko
Priority to TW097133597A priority patent/TWI453846B/zh
Priority to CN2008102118163A priority patent/CN101382580B/zh
Publication of JP2009060037A publication Critical patent/JP2009060037A/ja
Application granted granted Critical
Publication of JP5076750B2 publication Critical patent/JP5076750B2/ja
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2007228078A 2007-09-03 2007-09-03 プローブ装置及びプローブ方法 Active JP5076750B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007228078A JP5076750B2 (ja) 2007-09-03 2007-09-03 プローブ装置及びプローブ方法
KR1020080064975A KR101025389B1 (ko) 2007-09-03 2008-07-04 프로브 장치 및 프로브 방법
TW097133597A TWI453846B (zh) 2007-09-03 2008-09-02 Detection device and detection method
CN2008102118163A CN101382580B (zh) 2007-09-03 2008-09-03 探测器装置以及探测方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007228078A JP5076750B2 (ja) 2007-09-03 2007-09-03 プローブ装置及びプローブ方法

Publications (2)

Publication Number Publication Date
JP2009060037A JP2009060037A (ja) 2009-03-19
JP5076750B2 true JP5076750B2 (ja) 2012-11-21

Family

ID=40462527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007228078A Active JP5076750B2 (ja) 2007-09-03 2007-09-03 プローブ装置及びプローブ方法

Country Status (4)

Country Link
JP (1) JP5076750B2 (zh)
KR (1) KR101025389B1 (zh)
CN (1) CN101382580B (zh)
TW (1) TWI453846B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101829111B1 (ko) 2012-11-22 2018-02-13 재팬 일렉트로닉 메트리얼스 코오포레이숀 프로브 카드 케이스 및 프로브 카드의 반송 방법

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101688049B1 (ko) 2010-12-03 2016-12-20 삼성전자 주식회사 테스터 및 그 테스터를 포함한 테스트 장치
CN102507996B (zh) * 2011-09-27 2014-02-26 沈玉良 探针卡升降机构
KR101958856B1 (ko) * 2012-06-08 2019-03-15 스티칭 컨티뉴테이트 베이제르트 엔지니어링 프로브 장치
CN103575294B (zh) * 2012-07-27 2016-02-24 中国航空工业第六一八研究所 硅微陀螺芯片探针卡
KR101380375B1 (ko) 2013-04-25 2014-04-02 성정임 평판 디스플레이 패널 검사용 프로브장치
JP6041175B2 (ja) 2015-03-30 2016-12-07 株式会社東京精密 プローバ
CN105080803B (zh) * 2015-08-21 2018-08-07 京东方科技集团股份有限公司 基板承载结构、减压干燥设备及减压干燥方法
KR102446953B1 (ko) * 2016-02-24 2022-09-23 세메스 주식회사 정렬 지그 및 이를 이용하여 테스트 헤드를 프로브 스테이션에 정렬하는 방법
US11125814B2 (en) * 2017-02-22 2021-09-21 Sintokogio, Ltd. Test system
JP7267058B2 (ja) * 2019-03-26 2023-05-01 東京エレクトロン株式会社 検査装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2965174B2 (ja) * 1991-07-05 1999-10-18 株式会社東京精密 半導体素子検査装置
JP3095318B2 (ja) * 1993-11-25 2000-10-03 東京エレクトロン株式会社 被検査体のテスト装置
JP2967798B2 (ja) * 1993-12-16 1999-10-25 株式会社東京精密 ウエハプローバ
JP2967860B2 (ja) * 1994-11-15 1999-10-25 株式会社東京精密 ウエハプローバ
JPH1050778A (ja) * 1996-08-03 1998-02-20 Tokyo Electron Ltd 重量物移動装置及び検査装置
US6048750A (en) 1997-11-24 2000-04-11 Micron Technology, Inc. Method for aligning and connecting semiconductor components to substrates
KR19990028749U (ko) * 1997-12-27 1999-07-15 구본준 반도체 프로버장비
US6441629B1 (en) 2000-05-31 2002-08-27 Advantest Corp Probe contact system having planarity adjustment mechanism

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101829111B1 (ko) 2012-11-22 2018-02-13 재팬 일렉트로닉 메트리얼스 코오포레이숀 프로브 카드 케이스 및 프로브 카드의 반송 방법

Also Published As

Publication number Publication date
KR101025389B1 (ko) 2011-03-29
CN101382580A (zh) 2009-03-11
TW200935535A (en) 2009-08-16
TWI453846B (zh) 2014-09-21
JP2009060037A (ja) 2009-03-19
KR20090024056A (ko) 2009-03-06
CN101382580B (zh) 2011-07-20

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