KR101025389B1 - 프로브 장치 및 프로브 방법 - Google Patents

프로브 장치 및 프로브 방법 Download PDF

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Publication number
KR101025389B1
KR101025389B1 KR1020080064975A KR20080064975A KR101025389B1 KR 101025389 B1 KR101025389 B1 KR 101025389B1 KR 1020080064975 A KR1020080064975 A KR 1020080064975A KR 20080064975 A KR20080064975 A KR 20080064975A KR 101025389 B1 KR101025389 B1 KR 101025389B1
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KR
South Korea
Prior art keywords
test head
probe
probe card
holding
main body
Prior art date
Application number
KR1020080064975A
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English (en)
Korean (ko)
Other versions
KR20090024056A (ko
Inventor
다이사쿠 아메미야
히로시 아메미야
Original Assignee
도쿄엘렉트론가부시키가이샤
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Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20090024056A publication Critical patent/KR20090024056A/ko
Application granted granted Critical
Publication of KR101025389B1 publication Critical patent/KR101025389B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020080064975A 2007-09-03 2008-07-04 프로브 장치 및 프로브 방법 KR101025389B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007228078A JP5076750B2 (ja) 2007-09-03 2007-09-03 プローブ装置及びプローブ方法
JPJP-P-2007-00228078 2007-09-03

Publications (2)

Publication Number Publication Date
KR20090024056A KR20090024056A (ko) 2009-03-06
KR101025389B1 true KR101025389B1 (ko) 2011-03-29

Family

ID=40462527

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080064975A KR101025389B1 (ko) 2007-09-03 2008-07-04 프로브 장치 및 프로브 방법

Country Status (4)

Country Link
JP (1) JP5076750B2 (zh)
KR (1) KR101025389B1 (zh)
CN (1) CN101382580B (zh)
TW (1) TWI453846B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101688049B1 (ko) 2010-12-03 2016-12-20 삼성전자 주식회사 테스터 및 그 테스터를 포함한 테스트 장치
CN102507996B (zh) * 2011-09-27 2014-02-26 沈玉良 探针卡升降机构
KR101958856B1 (ko) * 2012-06-08 2019-03-15 스티칭 컨티뉴테이트 베이제르트 엔지니어링 프로브 장치
CN103575294B (zh) * 2012-07-27 2016-02-24 中国航空工业第六一八研究所 硅微陀螺芯片探针卡
JP6054150B2 (ja) 2012-11-22 2016-12-27 日本電子材料株式会社 プローブカードケース及びプローブカードの搬送方法
KR101380375B1 (ko) 2013-04-25 2014-04-02 성정임 평판 디스플레이 패널 검사용 프로브장치
JP6041175B2 (ja) 2015-03-30 2016-12-07 株式会社東京精密 プローバ
CN105080803B (zh) * 2015-08-21 2018-08-07 京东方科技集团股份有限公司 基板承载结构、减压干燥设备及减压干燥方法
KR102446953B1 (ko) * 2016-02-24 2022-09-23 세메스 주식회사 정렬 지그 및 이를 이용하여 테스트 헤드를 프로브 스테이션에 정렬하는 방법
US11125814B2 (en) * 2017-02-22 2021-09-21 Sintokogio, Ltd. Test system
JP7267058B2 (ja) * 2019-03-26 2023-05-01 東京エレクトロン株式会社 検査装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07169803A (ja) * 1993-12-16 1995-07-04 Tokyo Seimitsu Co Ltd ウエハプローバ
KR19990028749U (ko) * 1997-12-27 1999-07-15 구본준 반도체 프로버장비
US6048750A (en) 1997-11-24 2000-04-11 Micron Technology, Inc. Method for aligning and connecting semiconductor components to substrates
JP2002022767A (ja) 2000-05-31 2002-01-23 Advantest Corp プローブコンタクトシステムの平面調整機構

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2965174B2 (ja) * 1991-07-05 1999-10-18 株式会社東京精密 半導体素子検査装置
JP3095318B2 (ja) * 1993-11-25 2000-10-03 東京エレクトロン株式会社 被検査体のテスト装置
JP2967860B2 (ja) * 1994-11-15 1999-10-25 株式会社東京精密 ウエハプローバ
JPH1050778A (ja) * 1996-08-03 1998-02-20 Tokyo Electron Ltd 重量物移動装置及び検査装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07169803A (ja) * 1993-12-16 1995-07-04 Tokyo Seimitsu Co Ltd ウエハプローバ
US6048750A (en) 1997-11-24 2000-04-11 Micron Technology, Inc. Method for aligning and connecting semiconductor components to substrates
KR19990028749U (ko) * 1997-12-27 1999-07-15 구본준 반도체 프로버장비
JP2002022767A (ja) 2000-05-31 2002-01-23 Advantest Corp プローブコンタクトシステムの平面調整機構

Also Published As

Publication number Publication date
JP5076750B2 (ja) 2012-11-21
CN101382580A (zh) 2009-03-11
TW200935535A (en) 2009-08-16
TWI453846B (zh) 2014-09-21
JP2009060037A (ja) 2009-03-19
KR20090024056A (ko) 2009-03-06
CN101382580B (zh) 2011-07-20

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