JP4768012B2 - 集積回路の他の集積回路への積層構造 - Google Patents
集積回路の他の集積回路への積層構造 Download PDFInfo
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Description
図1には、第1半導体パッケージ12及び重ね合わされる第2半導体パッケージ14を有する積層半導体パッケージ10が示される。第1半導体パッケージ12と第2半導体パッケージ14との間には薄膜材16の形態の介在要素が配置される。薄膜材16の両側(すなわち上面及び下面)には粘着性があり、一形態において粘着剤は熱によって活性化する。膜として、薄膜16は前もって比較的的確な寸法を有する所望の的確な形状に形成することができる。他の種類の粘着剤を使用することもできる。薄膜材16は柔軟性及び適合性(すなわち表面一致性)があり、半導体パッケージによって定義されるどのような厚み、すなわち寸法をも有し得る。第1半導体パッケージ12は、第1半導体パッケージ12内の半導体ダイ(図示略)への電気的接続を行う複数の導電ボールを有している。例えば、導電ボール18はこのような複数の導電ボールのうちの一つである。ここで定義され用いられるように、導電ボールはどのような導電材からも作られる。導電ボールは下部基板、すなわち複数の導電接点を有するマザーボード30上に配置される。また、第1半導体パッケージ12は基板20を有している。基板20は、半導体パッケージ基板に共通して用いられる導電フィルム(すなわち、基板)、FR4、ビスマレイミド/トリアジン(BT)積層板又は他の有機材料のような様々な材料から形成可能である。基板20にはモールドキャップ22が重ね合わされ、その大きさは半導体パッケージ本体の大きさ及び半田ラン24等の近接する半田ランによって決定される。ここで用いられる単語「半田ラン」はいずれの形状の電気接点をも含む。更に、単語「半田」は従来の半田組成に加えて導電ペースト、ポリマーバンプ等の様々な導電材料を含む。モールドキャップ22は一般的に樹脂成形材である。成形が完了すると、基板20及びモールドキャップ22は互いに一体化される。第2半導体パッケージ14もまた導電ボール28のような複数の導電ボールを有している。導電ボールはパッケージ基板27と当接している。半導体パッケージ基板27にはモールドキャップ26が重ね合わされる。成形が完了すると、モールドキャップ26は、パッケージ基板27と一体化される。モールドキャップ26は様々な従来のモールド複合材のうちのいずれかからも形成される。2つの半導体パッケージのみが図示されているが、この構造においていくつの半導体パッケージが積層されても良い。したがって最後、すなわち頂部側半導体パッケージは下側のパッケージ基板における一端から他端へ完全に延びるモールドキャップを有することができる。また、モールドキャップ以外の構造が用いられても良い。例えば、例示されたモールドキャップに代えて、グロブトップ、所定のセラミック中空構造、所定の金属中空構造、ガラス等を用いても良い。また、最後、すなわち頂部側半導体パッケージは下側のパッケージ基板の一端から他端まで延びない構造によって実施されても良い。
Claims (5)
- 第1面及び第2面を備える第1半導体パッケージを準備することであって、前記第1面は該第1面に設けられて前記第1半導体パッケージへの電気的接続を行う複数の第1導電バンプを有し、前記第1面の反対側にある非平面状の前記第2面はモールドキャップ及び隣接する複数の半田ランを有することと、
第2半導体パッケージを前記第1半導体パッケージの上に重ねるように配置することであって、前記第2半導体パッケージは第1面及び該第1面の反対側にある第2面を備え、前記第2面は該第2面の中央部の外側に位置して前記第1半導体パッケージの前記隣接する複数の半田ランと接触する第2の複数の導電バンプを有することと、
介在要素を前記第1半導体パッケージと前記第2半導体パッケージとの間に直接接触するように配置することであって、前記介在要素は前記第1半導体パッケージ及び前記第2半導体パッケージの各々に接着し且つ前記介在要素に接触する前記第1半導体パッケージ及び前記第2半導体パッケージの隣接面に剛性を提供するのに十分な粘着性を有することと、
前記介在要素を前記第1半導体パッケージ及び前記第2半導体パッケージの少なくとも一つの周囲の外側へ横方向に延出させるとともに前記介在要素を一つの角度に曲折させることと、
前記第2の複数の導電バンプ及び前記半田ランを介して、前記第1半導体パッケージと前記第2半導体パッケージとの間の直接的な電気的接触を行うことと、
下部基板を前記第1半導体パッケージに接続することであって、前記下部基板は複数の接点を有し、各接点を前記第1半導体パッケージの前記第1の複数の導電バンプのうちの少なくとも1つに接触させることと、
を備える半導体パッケージの積層方法。 - 前記第1半導体パッケージ又は前記第2半導体パッケージのうちの一つの外側に沿って前記介在要素を延出させるとともに曲折させることと、
前記下部基板に向かって且つ同下部基板を通過するように前記介在要素を曲折することと、
前記介在要素に電気的又は物理的接触のうちの少なくとも一方を前記下部基板の背面側から行うことと、
を更に備える請求項1に記載の方法。 - 第1面及び第2面を備える第1半導体パッケージであって、前記第1面は該第1面に設けられて前記第1半導体パッケージへの電気的接続を行う複数の第1導電バンプを有し、前記第1面の反対側にある非平面状の前記第2面はモールドキャップ及び隣接する複数の電気的接点を有することと、
前記第1半導体パッケージに重なり合う第2半導体パッケージであって、前記第2半導体パッケージは第1面及び該第1面の反対側にある第2面を備え、その第2面は該第2面の中央部の外側に位置して前記第1半導体パッケージの前記隣接する複数の電気的接点と接触する複数の第2導電バンプを有し、前記第2半導体パッケージは複数の第2導電バンプを介して前記第1半導体パッケージと直接的な電気的接触を行うことと、
前記第1半導体パッケージと前記第2半導体パッケージとの間に直接接触するように配置される介在要素であって、前記介在要素は前記第1半導体パッケージ及び前記第2半導体パッケージの各々に接着し且つ前記介在要素に接触する前記第1半導体パッケージ及び前記第2半導体パッケージの隣接面に剛性を提供するのに十分な粘着性を有し、前記介在要素は前記第1半導体パッケージ及び前記第2半導体パッケージに対して表面適合性を有し、前記介在要素は前記第1半導体パッケージ及び前記第2半導体パッケージの少なくとも一つの周囲の外側へ横方向に延出するとともに所定量だけ曲折することと、
複数の接点を有する下部基板であって、前記下部基板における前記複数の接点の各々は前記第1半導体パッケージにおける前記複数の第1導電バンプのうちの少なくとも1つに接触することと、
を備える積層半導体パッケージアッセンブリ。 - 前記介在要素は前記第1半導体パッケージ及び前記第2半導体パッケージの周囲から外側に向けて横方向に延びる請求項3に記載の積層半導体パッケージアッセンブリ。
- 前記介在要素は、前記第1半導体パッケージ及び前記第2半導体パッケージの周囲から外側に向けて横方向に延びるとともに、電気的又は物理的接触のうちの少なくとも一方を前記下部基板の背面側から行うために前記下部基板に向かって且つ同下部基板を通過するように曲げられる請求項4に記載の積層半導体パッケージアッセンブリ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US11/108,223 | 2005-04-18 | ||
US11/108,223 US7196427B2 (en) | 2005-04-18 | 2005-04-18 | Structure having an integrated circuit on another integrated circuit with an intervening bent adhesive element |
PCT/US2006/006426 WO2006112949A2 (en) | 2005-04-18 | 2006-02-23 | Structure for stacking an integrated circuit on another integrated circuit |
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JP2008537333A JP2008537333A (ja) | 2008-09-11 |
JP2008537333A5 JP2008537333A5 (ja) | 2009-04-16 |
JP4768012B2 true JP4768012B2 (ja) | 2011-09-07 |
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JP2008506456A Expired - Fee Related JP4768012B2 (ja) | 2005-04-18 | 2006-02-23 | 集積回路の他の集積回路への積層構造 |
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US (1) | US7196427B2 (ja) |
EP (1) | EP1875503A4 (ja) |
JP (1) | JP4768012B2 (ja) |
KR (1) | KR101237669B1 (ja) |
WO (1) | WO2006112949A2 (ja) |
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JP4508016B2 (ja) * | 2005-07-07 | 2010-07-21 | パナソニック株式会社 | 部品実装方法 |
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EP1875503A2 (en) | 2008-01-09 |
KR101237669B1 (ko) | 2013-02-26 |
US7196427B2 (en) | 2007-03-27 |
WO2006112949A2 (en) | 2006-10-26 |
US20060231938A1 (en) | 2006-10-19 |
KR20080013864A (ko) | 2008-02-13 |
JP2008537333A (ja) | 2008-09-11 |
WO2006112949A3 (en) | 2007-03-22 |
EP1875503A4 (en) | 2010-01-20 |
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