CN109937479B - 引线框材料及其制造方法以及半导体封装件 - Google Patents

引线框材料及其制造方法以及半导体封装件 Download PDF

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Publication number
CN109937479B
CN109937479B CN201780068101.4A CN201780068101A CN109937479B CN 109937479 B CN109937479 B CN 109937479B CN 201780068101 A CN201780068101 A CN 201780068101A CN 109937479 B CN109937479 B CN 109937479B
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CN
China
Prior art keywords
roughened
alloy
layer
lead frame
conductive substrate
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CN201780068101.4A
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English (en)
Chinese (zh)
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CN109937479A (zh
Inventor
中津川达也
小林良聪
桥本真
柴田邦夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Furukawa Precision Engineering Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Furukawa Precision Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Furukawa Electric Co Ltd, Furukawa Precision Engineering Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of CN109937479A publication Critical patent/CN109937479A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
CN201780068101.4A 2016-12-27 2017-12-19 引线框材料及其制造方法以及半导体封装件 Active CN109937479B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016253968 2016-12-27
JP2016-253968 2016-12-27
PCT/JP2017/045451 WO2018123708A1 (fr) 2016-12-27 2017-12-19 Élément de grille de connexion et son procédé de fabrication et boîtier à semi-conducteur

Publications (2)

Publication Number Publication Date
CN109937479A CN109937479A (zh) 2019-06-25
CN109937479B true CN109937479B (zh) 2023-01-13

Family

ID=62707235

Family Applications (1)

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CN201780068101.4A Active CN109937479B (zh) 2016-12-27 2017-12-19 引线框材料及其制造方法以及半导体封装件

Country Status (5)

Country Link
JP (1) JP6479265B2 (fr)
KR (1) KR102482396B1 (fr)
CN (1) CN109937479B (fr)
TW (1) TWI762546B (fr)
WO (1) WO2018123708A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6805217B2 (ja) * 2018-10-18 2020-12-23 Ｊｘ金属株式会社 導電性材料、成型品及び電子部品
JP7014695B2 (ja) * 2018-10-18 2022-02-01 Ｊｘ金属株式会社 導電性材料、成型品及び電子部品
CN117043940A (zh) * 2021-07-16 2023-11-10 古河电气工业株式会社 引线框架材料及其制造方法、以及半导体封装
WO2023286697A1 (fr) * 2021-07-16 2023-01-19 古河電気工業株式会社 Matériau de grille de connexion et son procédé de production, et boîtier de semi-conducteur

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1116770A (zh) * 1994-06-06 1996-02-14 摩托罗拉公司 用来改善聚合物同金属间界面粘合性的方法和设备
CN101887877A (zh) * 2009-05-13 2010-11-17 日立电线精密株式会社 引线框、半导体装置以及引线框的制造方法
JP2013182978A (ja) * 2012-03-01 2013-09-12 Renesas Electronics Corp 半導体装置及びその製造方法
JP2014123760A (ja) * 2014-02-17 2014-07-03 Mitsui High Tec Inc リードフレーム
TW201532075A (zh) * 2014-02-05 2015-08-16 Furukawa Electric Co Ltd 電氣接點材料及其之製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2543619B2 (ja) 1990-09-05 1996-10-16 新光電気工業株式会社 半導体装置用リ―ドフレ―ム
JP3228789B2 (ja) 1992-07-11 2001-11-12 新光電気工業株式会社 樹脂用インサート部材の製造方法
JP2732490B2 (ja) * 1994-03-25 1998-03-30 日鉱金属株式会社 電子機器用高力高導電性銅合金の製造方法
JP4168077B2 (ja) * 2006-07-21 2008-10-22 株式会社神戸製鋼所 酸化膜密着性に優れた電気電子部品用銅合金板
KR101241735B1 (ko) * 2008-09-05 2013-03-08 엘지이노텍 주식회사 리드 프레임 및 그 제조방법
KR101113891B1 (ko) * 2009-10-01 2012-02-29 삼성테크윈 주식회사 리드 프레임 및 리드 프레임 제조 방법
JP5204908B1 (ja) * 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1116770A (zh) * 1994-06-06 1996-02-14 摩托罗拉公司 用来改善聚合物同金属间界面粘合性的方法和设备
CN101887877A (zh) * 2009-05-13 2010-11-17 日立电线精密株式会社 引线框、半导体装置以及引线框的制造方法
JP2013182978A (ja) * 2012-03-01 2013-09-12 Renesas Electronics Corp 半導体装置及びその製造方法
TW201532075A (zh) * 2014-02-05 2015-08-16 Furukawa Electric Co Ltd 電氣接點材料及其之製造方法
JP2014123760A (ja) * 2014-02-17 2014-07-03 Mitsui High Tec Inc リードフレーム

Also Published As

Publication number Publication date
TW201830627A (zh) 2018-08-16
CN109937479A (zh) 2019-06-25
KR20190096964A (ko) 2019-08-20
WO2018123708A1 (fr) 2018-07-05
JP6479265B2 (ja) 2019-03-06
KR102482396B1 (ko) 2022-12-28
TWI762546B (zh) 2022-05-01
JPWO2018123708A1 (ja) 2018-12-27

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