WO2009150821A1 - Separating device and separating method for electronic component manufacture - Google Patents

Separating device and separating method for electronic component manufacture Download PDF

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Publication number
WO2009150821A1
WO2009150821A1 PCT/JP2009/002585 JP2009002585W WO2009150821A1 WO 2009150821 A1 WO2009150821 A1 WO 2009150821A1 JP 2009002585 W JP2009002585 W JP 2009002585W WO 2009150821 A1 WO2009150821 A1 WO 2009150821A1
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WO
WIPO (PCT)
Prior art keywords
manufacturing
singulation
individualized
sealed substrate
parts
Prior art date
Application number
PCT/JP2009/002585
Other languages
French (fr)
Japanese (ja)
Inventor
東秀和
森澤匡史
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to KR1020117000658A priority Critical patent/KR101930496B1/en
Priority to CN2009801206225A priority patent/CN102047399A/en
Publication of WO2009150821A1 publication Critical patent/WO2009150821A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Definitions

  • the present invention relates to an individualizing device and an individualizing method for manufacturing electronic components, which are used when a plurality of electronic components are manufactured by dividing a sealed substrate having a plurality of regions into regions. It is about.
  • FIG. 5 (1) is a perspective view schematically showing a sealed substrate as an object to be singulated from the substrate side
  • FIG. 5 (2) is an example of a sealed substrate
  • 5 (3) is a plan view showing another example of a sealed substrate as viewed from the sealing resin side
  • FIG. 5 (4) shows a memory card as an example of a separated sealed substrate.
  • FIG. 5 in order to make it easy to understand, any figure included in this application document is schematically omitted or exaggerated as appropriate.
  • the sealed substrate 91 has a substrate 92 made of a lead frame, a printed circuit board, or the like, and a sealing resin 93 formed on one surface of the substrate 92.
  • the substrate 92 is divided into a plurality of lattice-shaped regions 96 by a boundary line 94 in the X direction and a boundary line 95 in the Y direction, which are virtually provided.
  • Each region 96 is mounted with a chip-like component (not shown) made of one or more semiconductor chips.
  • chip-like components hereinafter referred to as “chips” are respectively attached to a plurality of regions 96 provided on the substrate 92.
  • the plurality of chips mounted on the substrate 92 are collectively sealed with a sealing resin 93.
  • the sealed substrate 91 is completed.
  • the sealed substrate 91 is cut along the boundary lines 94 and 95.
  • the sealed substrate 91 is divided into a plurality of electronic components respectively corresponding to the regions 96.
  • the separated electronic component having the sealing resin 93 is often called a package (see, for example, Patent Document 1).
  • the singulation apparatus has three basic components.
  • the three components are a receiving part that receives the sealed substrate formed in the previous process (resin sealing process), a separate part that separates the sealed substrate, and a separate part. It is a paying-out part which carries out the formed several electronic components (package) to the following process (for example, packaging process) (for example, refer patent document 1).
  • each component described above and each component in Patent Document 1 generally correspond as follows.
  • the “substrate loading part A” in Patent Document 1 corresponds to the receiving part
  • the “cutting mechanism C” corresponds to the singulation part
  • the “package housing part F” corresponds to the dispensing part.
  • the substrate 92 By the way, in recent years, there is a tendency for the substrate 92 to become larger due to the demand for lower prices for electronic components. In addition, due to a demand for miniaturization and the like, the number of electronic components that can be removed from one substrate 92, that is, the number of regions 96 tends to increase (see FIG. 5B). Further, the sealed substrate 91 is roughly divided into blocks due to a demand for warpage prevention in the sealed substrate 91, and a plurality of regions 96 in each block and a sealing provided independently for each block. In some cases, a plurality of island-shaped portions 97 made of the resin 93 are formed on the sealed substrate 91 (see FIG. 5 (3)). As described above, in recent years, the specifications of the sealed substrate 91 are various.
  • the base material of the substrate 92 is a metal material, a composite material (such as glass epoxy) composed of a thermosetting resin and a glass cloth base (or glass nonwoven base), or a film material (polyimide) composed of a soft resin. Film) and the like, and various materials such as ceramic materials having high hardness but brittleness.
  • the specifications of the sealing resin 93 are various. Specifically, as the sealing resin 93, an epoxy resin containing silica fine particles as a filler and having a high hardness of the resin itself, or a silicone resin having a low hardness and high adhesiveness to a rotary blade is used. Yes.
  • the boundary lines of the regions 96 of the substrate 92 that is, the boundary lines 94 and 95 that are lines for cutting the sealed substrate 91 are It was only a straight line.
  • the planar shape is basically a rectangle (in other words, the planar shape is a rectangle as a schematic shape)
  • the sealed substrate which has the boundary line containing at least any one of a curve or a broken line has appeared by this.
  • the memory card 98 shown in FIG. 5 (4) is an example of a package having a bent portion 99 including a curved line or a broken line.
  • a broken line here means the line produced
  • the sealed substrate 91 is cut by a dicer along a straight side of the outer shape of the memory card 98.
  • the sealed substrate is cut along the side including the bent portion 99 in the outer shape of the memory card 98 by a cutting device using laser light, water jet, or the like.
  • two types of cutting devices having different cutting mechanisms are used to cut a side composed of a straight line and a side including the bent portion 99, respectively.
  • the applicant of the present application proposed an individualizing device provided with two pieces of the same kind of individualizing parts corresponding to an increase in the number of electronic parts to be taken on one substrate 92.
  • a singulation apparatus in which two different singulation parts are provided corresponding to a package including a curved line or a polygonal line in an outer shape in plan view has been proposed.
  • the singulation is usually performed by completely cutting (full cut) the sealed substrate.
  • individualization is also performed by partially cutting (half-cutting) the sealed substrate and then cleaving (breaking). Therefore, the term “cutting” is appropriately used as a term for dividing the sealed substrate into pieces, instead of “cutting”.
  • the specifications of the sealed substrate and the package are various, and the specifications required by the user are also various. If it is attempted to change or add to the individualization unit as appropriate in order to meet such various demands, the conventional individualization device will take time for such work, and the productivity of the package will be reduced. There was a problem.
  • the problem to be solved by the present invention is that when a user's required specification is changed, the individualization unit can be assembled, changed, added and removed in a short time according to the required specification. Is to provide a device.
  • an singulation apparatus for manufacturing an electronic component according to the present invention includes: When manufacturing a plurality of electronic components by separating a sealed substrate (3) formed by resin-sealing chips respectively mounted in a plurality of regions provided on the substrate into regions.
  • An individualizing device for manufacturing electronic parts comprising: an individualizing part that partially cuts and a payout part (C) that pays out a plurality of electronic parts processed by the individualizing part, A plurality of the singulated portions are provided between the receiving portion (A) and the payout portion (C), Each of the plurality of individualized parts is detachable and replaceable with respect to another individualized part, the receiving part (A) or the payout part (C).
  • the singulation apparatus for manufacturing an electronic component according to the present invention is the above-described singulation apparatus,
  • the plurality of individualized parts each have a cutting mechanism that uses any of a rotary blade (7), laser light, water jet, wire saw, or band saw,
  • the cutting mechanisms that each of the plurality of singulation parts has are of the same type.
  • the singulation apparatus for manufacturing an electronic component according to the present invention is the above-described singulation apparatus,
  • the plurality of individualized parts each have a cutting mechanism that uses any of a rotary blade (7), laser light, water jet, wire saw, or band saw, At least one cutting mechanism among the cutting mechanisms that each of the plurality of individualized parts has is different from other cutting mechanisms.
  • the singulation apparatus for manufacturing an electronic component according to the present invention is the above-described singulation apparatus, At least one individualized part among the plurality of individualized parts is for processing the sealed substrate (3) along a curved line or a broken line.
  • the singulation apparatus for manufacturing an electronic component according to the present invention is the above-described singulation apparatus, At least one individualized part among the plurality of individualized parts is intended for finishing.
  • the method for individualizing the electronic component manufacturing according to the present invention is as follows.
  • a method for singulating an electronic component comprising: a step of partially cutting the sealed substrate (3); and a step of dispensing a plurality of electronic components processed by the singulated portion.
  • the plurality of sealed substrates (3) are each processed using the same type of cutting mechanism that each of the plurality of individualized parts has.
  • the method for individualizing the electronic component manufacturing according to the present invention is as follows.
  • a method for singulating an electronic component comprising: a step of partially cutting the sealed substrate (3); and a step of dispensing a plurality of electronic components processed by the singulated portion.
  • the machining step at least one of the cutting mechanisms included in each of the plurality of singulated portions, and a cutting mechanism of a different type from the other cutting mechanisms and another cutting mechanism are sequentially used.
  • the sealed substrate (3) is processed.
  • the processing step includes a step of processing the sealed substrate (3) along a curved line or a broken line using at least one of the plurality of individualized portions, and the plurality of individual pieces. And a step of processing the sealed substrate along a straight line using another singulated portion of the singulated portion.
  • the method for singulation for manufacturing an electronic component according to the present invention is the above-described singulation method,
  • the processing step includes a step of performing a finishing process using at least one individualized part among the plurality of individualized parts.
  • each of the plurality of individualized parts is detachable and replaceable with respect to the other individualized parts, the receiving part (A) or the payout part (C).
  • the user's required specifications are changed, the following can be easily realized in a short time.
  • it can be changed to an individualized part having a desired cutting mechanism in place of the installed individualized part according to the required specifications.
  • the required specifications in addition to the mounted individualized parts, it is possible to add individualized parts having a desired cutting mechanism. 3rdly, the separation part which became unnecessary can be removed.
  • the cutting mechanism used by each of the plurality of individualized parts may be the same type.
  • segmentation part which has the same kind of cutting mechanism can be expanded. Therefore, an increase in the processing capability of the singulation apparatus can be easily realized.
  • At least one cutting mechanism among cutting mechanisms used by each of the plurality of singulated parts may be of a different type from other cutting mechanisms.
  • the optimal processing means can be selected and used according to the shape and material of the processing part.
  • at least one of the plurality of singulated parts may cut the sealed substrate (3) along a curved line or a broken line.
  • At least one of the plurality of individualized parts may be intended for finishing.
  • the process for individualization and finishing can be performed by one unitization apparatus.
  • FIG. 1 is a schematic plan view showing a singulation apparatus for manufacturing an electronic component according to Embodiment 1 of the present invention.
  • FIG. 2 is a schematic plan view showing a singulation apparatus for manufacturing an electronic component according to Embodiment 2 of the present invention.
  • FIG. 3 is a schematic plan view showing a singulation apparatus for manufacturing an electronic component according to Embodiment 3 of the present invention.
  • FIG. 4 is a schematic plan view showing a singulation apparatus for manufacturing an electronic component according to Embodiment 4 of the present invention.
  • FIG. 5 (1) is a perspective view schematically showing a sealed substrate as an object to be singulated from the substrate side
  • FIG. 5 (2) is an example of a sealed substrate.
  • 5 (3) is a plan view showing another example of the sealed substrate as viewed from the sealing resin side
  • FIG. 5 (4) is a plan view showing the memory card.
  • the electronic component singulation device (S1) includes a receiving part (A), an individualization part (B1, B2), and a payout part (C).
  • Each of the singulation parts (B1, B2) has a rotary blade (7) as a cutting mechanism, and each of the singulation parts (B1, B2) or other component receiving part (A) or It is detachable with respect to the payout part (C), and is appropriately selected according to the user's required specifications for assembly / change / addition / removal.
  • the cutting mechanism of the individualized parts (B1, B2) is not limited to the one using the rotary blade (7), and may use a water jet, a laser beam, a wire saw, or a band saw. Different cutting mechanisms may be used for the individualized parts (B1, B2). For example, the cutting mechanism of one piece part (B1) may use a water jet, and the cutting mechanism of the other piece part (B2) may use a rotary blade (7).
  • FIG. 1 is a schematic plan view showing a singulation apparatus for manufacturing an electronic component according to the present embodiment.
  • the singulation apparatus S1 shown in FIG. 1 is an singulation apparatus that divides a sealed substrate into a plurality of electronic components.
  • the singulation apparatus S1 includes a receiving unit A, a singulation unit B1, a singulation unit B2, and a payout unit C as components (modules).
  • a plurality of (two in FIG. 1) individualized parts that is, an individualized part B1 and an individualized part B2 are provided between the receiving part (A) and the payout part (C).
  • the receiving part A, the individualized part B1, the individualized part B2, and the payout part C are configured to be detachable and replaceable with respect to other components.
  • each of the receiving unit A, the individualized unit B1, the individualized unit B2, and the payout unit C is prepared in advance so as to have a plurality of different specifications according to the expected required specifications.
  • the basic unit 1 is configured to include the receiving portion A, the singulated portion B1, the singulated portion B2, and the payout portion C.
  • a prestage 2 is provided in the receiving part A.
  • a sealed substrate 3 conveyed from a resin sealing device that is a device in the previous process is received.
  • This sealed substrate 3 corresponds to the sealed substrate 91 shown in FIG.
  • the sealed substrate 3 is disposed on the prestage 2 with the sealing resin 93 side shown in FIG.
  • the sealed substrate 3 is aligned as necessary.
  • chips are mounted in a plurality of lattice-shaped regions, and the plurality of chips are collectively sealed with resin. Yes.
  • Each cutting unit B1, B2 is provided with a cutting table 4 respectively.
  • the cutting table 4 is movable in the Y direction in the figure and is rotatable in the ⁇ direction.
  • a cutting stage 5 is attached on the cutting table 4.
  • Two spindle motors 6 are provided in the inner part of each of the individualized parts B1 and B2. In each of the singulation parts B1 and B2, the two spindle motors 6 can move independently in the X direction.
  • a rotary blade 7 is attached to each of the two spindle motors 6. Each of these rotary blades 7 cuts the sealed substrate 3 into individual pieces by rotating in a plane along the Y direction. Therefore, in the present embodiment, the cutting mechanism using the rotary blade 7 is provided in each of the individualized part B1 and the individualized part B2.
  • a tray 8 is provided in the payout part C.
  • the tray 8 accommodates an assembly 9 composed of a plurality of electronic components separated into individual pieces B1 and B2 from the cutting stage 5 via a main transport mechanism (not shown). Then, the plurality of electronic components respectively accommodated in the tray 8 are delivered from the delivery unit C and conveyed to the next process (for example, an inspection process).
  • the main transport mechanism (not shown) is located at a position that is commonly applied to each component, that is, the receiving portion A, the separating portion B1, the separating portion B2, and the dispensing portion C. Is provided. In FIG. 1, this position is indicated by an arrow (thick solid line arrow) extending rightward along the X direction.
  • the individualized part B1 is configured to be detachable and replaceable with respect to other components, that is, the receiving part A and the individualized part B2.
  • the singulation part B2 is configured to be detachable and replaceable with respect to other components, that is, the singulation part B1 and the payout part C.
  • a cutting mechanism other than the rotary blade 7 may be used in the individualized part B1 and the individualized part B2.
  • the same kind of cutting mechanism can also be used in each piece part.
  • cutting using either a laser beam, a water jet (with or without use with an abrasive), a wire saw, a band saw, or the like is performed in both the individualized part B1 and the individualized part B2.
  • a mechanism can be selected and used.
  • the rotary blade 7 or the individualized portion B2 A cutting mechanism having a band saw may be used.
  • a cutting mechanism using a laser beam, a water jet, or a wire saw is used in the individualized part B1 and the individualized part B2. Use it.
  • a payout unit C having various components can be employed.
  • a payout unit C having a mechanism for storing a plurality of electronic components in a tray, a mechanism for storing the electronic components in a tube, a mechanism for transferring and carrying out the bulk as it is, and the like can be employed.
  • the sealed substrate 3 is received in the receiving part A.
  • the sealed substrate 3 is transferred to the separation part B1, the sealed substrate 3 is cut into pieces by the rotary blade 7. During this time, after receiving the next sealed substrate 3 in the receiving portion A and transferring the sealed substrate 3 to the individualized portion B2, the sealed substrate 3 is rotated by the rotary blade 7 of the individualized portion B2. Cut into pieces. Thereby, the sealed substrate 3 can be separated into pieces by the rotary blade 7 in each of the separated parts B1 and B2.
  • the assembly 9 composed of a plurality of electronic components separated in the individualization part B1 is accommodated in the tray 8 from the cutting stage 5 via the main transport mechanism (not shown). Thereafter, the assembly 9 is transported from the tray 8 to the next process (for example, an inspection process).
  • the assembly 9 composed of a plurality of electronic components separated in the individualization part B2 is accommodated in the tray 8 from the cutting stage 5 via the main transport mechanism (not shown). Thereafter, the assembly 9 is transported from the tray 8 to the next process.
  • the individual blades B1 and B2 are cut into separate sealed substrates 3 by the rotary blades 7 respectively. And can be singulated.
  • a process when individualizing the sealed substrate 3 to use a plurality of individualization units in parallel is performed. The ability is greatly improved.
  • the singulation apparatus S1 for manufacturing electronic parts are as follows. First, the singulation device S1 is provided with a plurality of singulation parts B1 and B2 having the same type of cutting mechanism. Second, the singulation units B1 and B2 are prepared in advance so as to have different types of specifications according to the expected required specifications. Third, the individualized parts B1 and B2 are detachable and replaceable with respect to other components.
  • the singulation device is assembled using the singulation parts B1, B2,.
  • the singulation apparatus S1 having the optimum singulation units B1, B2,... According to the required specifications and demands of a certain user is realized in a short time.
  • the individualized portions B1 and B2 can be provided with additional individualized portions, or the individualized portions B1. , B2 can be removed from the individualized part.
  • the singulation device corresponding to the increase or decrease in demand is realized in a short time.
  • the singulation device since a part unnecessary for the user is not included in the individualizing device, it is possible to reduce the footprint and cost of the individualizing device.
  • This specification may be, for example, an abrasive grain size or a rotational speed.
  • the abrasive grain size of the rotary blade 7 included in the singulated part B1 is set to a specification suitable for substrate cutting, and the abrasive grain size of the rotary blade 7 included in the singulated part B2 is specified to be suitable for cutting sealing resin.
  • substrate can be cut using the rotary blade 7 which the singulation part B1 has, and sealing resin can be cut using the rotary blade 7 which the singulation part B2 has after that. Therefore, the sealed substrate 3 is singulated under optimum processing conditions for each processing portion by using different rotary blades 7 having optimum specifications corresponding to each of the substrate constituting the sealed substrate 3 and the sealing resin. can do.
  • the specifications relating to the rotary blades 7 respectively included in the individualized parts B1 and B2 may be different for each individualized part.
  • the abrasive grain size of the rotary blade 7 of the individualized part B1 used earlier is suitable for rough cutting and the abrasive grain size of the rotary blade 7 of the individualized part B2 used later is used.
  • the optimum individual piece is obtained by exchanging the individualized parts B1, B2,... With individualized parts having different specifications in accordance with changes in market trends, technological trends, etc. Can be realized.
  • the individualized parts B1, B2,... That use a cutting mechanism having a rotary blade 7 are used. What is necessary is just to replace
  • the newly installed individualized part there is an individualized part using a laser beam, a water jet, or a wire saw.
  • all or part of the individualized parts B1, B2,... May be replaced with individualized parts that use laser light, or may be replaced with individualized parts that use a water jet. It may be replaced with an individualized part using a wire saw.
  • FIG. 2 is a schematic plan view showing the singulation apparatus for manufacturing an electronic component according to the present embodiment.
  • the singulation apparatus S ⁇ b> 2 for manufacturing an electronic component according to this embodiment includes a receiving unit A, singulation units B ⁇ b> 1 and B ⁇ b> 2, a cleaning unit D, an inspection unit E, and a dispensing unit C. And each as a component (module).
  • the singulation device S2 is configured by providing a cleaning unit D and an inspection unit E between the singulation unit B2 and the dispensing unit C in the singulation device S1 shown in FIG. .
  • a main transport mechanism (not shown) is provided at a position that is commonly applied to the receiving part A, the singulation parts B1 and B2, the cleaning part D, and the payout part C among the constituent elements. .
  • the cleaning unit D and the inspection unit E are configured to be detachable and replaceable with respect to other components.
  • each of the cleaning unit D and the inspection unit E is prepared in advance so as to have a plurality of different specifications according to expected required specifications.
  • the cleaning unit D is provided with a cleaning mechanism 10.
  • the cleaning mechanism 10 is provided with a cleaning roller 11 made of a water-absorbing material such as a sponge so as to be rotatable about an axis along the Y direction.
  • a water tank (not shown) is provided below the cleaning roller 11. The cleaning roller 11 rotates in a state where the water stored in the water tank is sucked.
  • an assembly 9 composed of a plurality of electronic components (packages) formed by cutting the sealed substrate 3 is disposed above the cleaning mechanism 10.
  • the assembly 9 is adsorbed and fixed by a main transport mechanism (not shown) on the substrate side surface (the front side surface of the paper in the figure).
  • the assembly 9 is adsorbed and fixed on the surface of the substrate 92 shown in FIG.
  • the assembly 9 attracted and fixed by the main transport mechanism moves from the left to the right in the figure.
  • the surface of the assembly 9 on the side of the sealing resin comes into contact with the cleaning roller 11 that rotates while sucking water.
  • the surface of the assembly 9 on the sealing resin side is cleaned.
  • air preferably hot air
  • the inspection unit E is provided with an inspection table 12, and the inspection table 12 is rotatable in the ⁇ direction.
  • An inspection stage 13 is attached on the inspection table 12.
  • a plurality of cleaned electronic components are transferred to the inspection stage 13 from a sub-transport mechanism (not shown) branched from the main transport mechanism that holds and fixes the assembly 9 composed of a plurality of electronic components.
  • the movement path of the sub transport mechanism between the cleaning unit D and the inspection unit E is indicated by a thick solid arrow along the Y direction.
  • the inspection unit E is a part that performs an appearance inspection of the electronic component. And in the back part of the test
  • the camera 14 is movable in the X direction and the Y direction.
  • the inspection unit E is provided with a control unit (not shown).
  • the control unit performs image processing based on a still image of the electronic component received from the camera 14, and compares the obtained image data with previously stored data to determine whether the electronic component is a good product or a defective product. It is determined whether it is. And a control part memorizes data (what is called map data) about a good article and a defective article in aggregate 9 as needed.
  • an assembly 9 composed of a plurality of electronic components separated into individual parts B, cleaned in the cleaning part D, and inspected by the inspection part E is provided in the cleaning part Housed from the D side via a main transport mechanism (not shown).
  • a main transport mechanism not shown
  • the control unit not shown
  • only non-defective products out of the electronic components stored in the tray 8 are conveyed to the next process (for example, a packaging process). Further, defective products are accommodated in a defective product tray (not shown).
  • the singulation apparatus S2 having the optimum singulation parts B1, B2,..., The cleaning part D, and the inspection part E is manufactured in a short time.
  • the optimum singulation apparatus S2 corresponding to the increase or decrease in demand is realized in a short time.
  • the cleaning unit D may perform cleaning using, for example, steam or a cleaning agent instead of cleaning using the cleaning roller 11 and water.
  • the inspection unit E for example, a current inspection or the like may be performed instead of the appearance inspection (optical inspection).
  • FIG. 3 is a schematic plan view showing the singulation apparatus for manufacturing the electronic component according to the present embodiment.
  • the singulation apparatus S3 for manufacturing electronic components according to the present embodiment differs from the singulation apparatus S2 of the second embodiment in the following points. That is, a plurality of individualized parts are constituted by an individualized part B2 and an individualized part B3 having different types of specifications.
  • an individualized part B3 that uses a water jet by a cutting mechanism is mounted.
  • a water jet unit 15 is provided in the singulation part B3.
  • part containing a curve, a broken line, etc. can be cut
  • the sealed substrate 3 is received in the receiving portion A.
  • the sealed substrate 3 is transferred to the singulation part B3. Thereafter, the water jet unit 15 is used to cut the sides of the sealed substrate 3 including curved lines, broken lines, and the like.
  • the sealed substrate 3 is transferred to the separation part B2. After that, the rotary blade 7 is used to cut a side formed by a straight line in the sealed substrate 3.
  • the sealed substrate 3 is formed using different types of cutting mechanisms according to the characteristics of the sealed substrate 3.
  • the sealed substrate 3 is separated into pieces by cutting sequentially. Therefore, the sealed substrate 3 can be separated into pieces using a plurality of optimum cutting mechanisms according to the characteristics of the sealed substrate 3 using a single singulation device.
  • the individualized part B1 shown in FIG. 1 is replaced with an individualized part B3 using a water jet, thereby being used for manufacturing a package having a rectangular planar shape.
  • the singulation device S1 (see FIG. 1) can be changed to the singulation device S3 suitable for manufacturing a memory card in a short time.
  • the singulation unit B3 may be replaced with a singulation unit that uses laser light. Moreover, you may replace
  • the specifications regarding the cutting mechanism used by the individualized parts B3 and B2 may be different for each individualized part.
  • a substance generated by melting the sealing resin may adhere to the part cut (fused) by using laser light. It can be removed by using a water jet. Thereby, finishing can be performed using a water jet by the individualized part B2 used later. Therefore, the cutting quality can be improved.
  • FIG. 4 is a schematic plan view showing a singulation apparatus for manufacturing an electronic component according to the present embodiment.
  • the singulation apparatus S4 for manufacturing an electronic component according to the present embodiment has three singulation parts B3, B4, and B2.
  • the individualized parts B3 and B4 have the same type of cutting mechanism, for example, a cutting mechanism that uses a water jet.
  • the singulation part B2 has two spindle motors 6 to which the rotary blades 7 are attached. And since each singulation part is detachable and replaceable with respect to the other singulation part, the receiving part A or the payout part C, the number of singulation parts B3 and B4 having the water jet unit 15 is set.
  • the operation of increasing / decreasing or increasing / decreasing the number of separated parts B2 having two spindle motors 6 can be performed in a short time.
  • the side including the curved line and the broken line is cut by the two individualized parts B3 and B4 each having the water jet unit 15, and the straight part is formed by the individualized part B2 having the rotary blade 7.
  • the edge can be cut.
  • specifications and numbers can be changed in a short time for the singulation unit that cuts a side including a curved line, a broken line, and the like and the singulation unit that cuts a side consisting of a straight line. Therefore, it is possible to adjust the ability to cut a side including a curved line or a broken line and the ability to cut a side made of a straight line in a short time.
  • the two singulation parts B3 and B4 using the water jet can be replaced with two singulation parts using the laser beam.
  • the two singulation parts B3 and B4 can be replaced with two singulation parts using a wire saw.
  • the positions of the individualized parts B3 and B4 that use the water jet and the individualized part B2 that uses the rotary blade 7 can be exchanged.
  • the number of singulation parts using the water jet can be one, and the number of singulation parts using the rotary blade 7 can be two.
  • the specifications regarding the water jet used by the individualized parts B3 and B4 may be different for each individualized part.
  • This specification may be, for example, the abrasive grain size or the pressure of the processing water.
  • the abrasive grain size of the water jet of the individualized part B3 used earlier is set to a specification suitable for cutting the substrate, and the abrasive grain size of the water jet of the individualized part B4 used later is sealed.
  • another inspection unit can be attached to the inspection unit E in accordance with the user's required specifications, and another inspection for the package can be performed by the other inspection unit.
  • another inspection an electric current inspection, an appearance inspection on the surface opposite to the surface to be inspected by the inspection unit E, or the like can be adopted.
  • the sealed substrate may be separated by completely cutting (full cut) the sealed substrate at the individualized portion, the sealed substrate is partially separated at the individualized portion. May be cut (half cut) and then cleaved in subsequent steps. This cleaving may be performed by an individualizing device or may be performed by another device in a subsequent process.

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Abstract

Separating sections of a separating device, which is used to separate sealed substrates to manufacture electronic components, can be assembled, changed, added, or removed quickly according to specifications requested by a user. An electronic component separating device (S1) is equipped with a receiving section (A), separating sections (B1, B2), and a delivery section (C). The separating sections (B1, B2) each have a rotary blade (7) as a cutting mechanism, and each can be attached to or detached from another separating section (B1, B2), or a receiving section (A) or a delivery section (C), which are the other components, and may be assembled, changed, added, or removed selectively to meet specifications requested by a user. The cutting mechanism of the separating sections (B1, B2) is not limited to the rotary blades (7), and a water jet, a laser beam, a wire saw, or a band saw could be used. The cutting mechanisms of the separating sections (B1, B2) may be different. For example, the cutting mechanism of the separating section B1 may utilize a water jet, and the cutting mechanism of the separating section B2 may utilize a rotary blade (7).

Description

電子部品製造用の個片化装置及び個片化方法Separation apparatus and method for manufacturing electronic parts
　本発明は、複数の領域を有する封止済基板を領域毎に個片化することによって複数の電子部品を製造する際に使用される、電子部品製造用の個片化装置及び個片化方法に関するものである。 The present invention relates to an individualizing device and an individualizing method for manufacturing electronic components, which are used when a plurality of electronic components are manufactured by dividing a sealed substrate having a plurality of regions into regions. It is about.
　複数の電子部品を効率よく製造する目的で従来から実施されている方式の１つに、封止済基板を個片化する方式がある。個片化の対象物である封止済基板について、図５を参照して説明する。図５（１）は個片化の対象物である封止済基板を基板側から見て概略的に示す斜視図であり、図５（２）は封止済基板の１つの例を、図５（３）は封止済基板の他の例をそれぞれ封止樹脂側から見て示す平面図であり、図５（４）は個片化された封止済基板の一例としてのメモリーカードを示す平面図である。なお、本出願書類に含まれるいずれの図についても、わかりやすくするために、適宜省略し又は誇張して模式的に描かれている。 One method that has been used for the purpose of efficiently producing a plurality of electronic components is a method of separating a sealed substrate. A sealed substrate which is an object to be singulated will be described with reference to FIG. FIG. 5 (1) is a perspective view schematically showing a sealed substrate as an object to be singulated from the substrate side, and FIG. 5 (2) is an example of a sealed substrate. 5 (3) is a plan view showing another example of a sealed substrate as viewed from the sealing resin side, and FIG. 5 (4) shows a memory card as an example of a separated sealed substrate. FIG. In addition, in order to make it easy to understand, any figure included in this application document is schematically omitted or exaggerated as appropriate.
　図５に示されているように、封止済基板９１は、リードフレームやプリント基板等からなる基板９２と、基板９２の片方の面において形成された封止樹脂９３とを有する。基板９２は、それぞれ仮想的に設けられたＸ方向における境界線９４とＹ方向における境界線９５とによって、格子状の複数の領域９６に区切られている。各領域９６には、それぞれ１又は複数の半導体チップ等からなるチップ状部品（図示なし）が装着されている。 As shown in FIG. 5, the sealed substrate 91 has a substrate 92 made of a lead frame, a printed circuit board, or the like, and a sealing resin 93 formed on one surface of the substrate 92. The substrate 92 is divided into a plurality of lattice-shaped regions 96 by a boundary line 94 in the X direction and a boundary line 95 in the Y direction, which are virtually provided. Each region 96 is mounted with a chip-like component (not shown) made of one or more semiconductor chips.
　ここで、封止済基板９１を使用して複数の電子部品を製造する方式について説明する。まず、基板９２に設けられた複数の領域９６にチップ状部品（以下「チップ」という。）を各々装着する。次に、基板９２に装着された複数のチップを、封止樹脂９３によって一括して樹脂封止する。これによって、封止済基板９１が完成する。次に、その封止済基板９１を、境界線９４、９５に沿って切断する。これによって、封止済基板９１が、領域９６にそれぞれ対応する複数の電子部品に個片化される。なお、封止樹脂９３を有する個片化された電子部品は、しばしばパッケージと呼ばれる（例えば、特許文献１参照）。 Here, a method of manufacturing a plurality of electronic components using the sealed substrate 91 will be described. First, chip-like components (hereinafter referred to as “chips”) are respectively attached to a plurality of regions 96 provided on the substrate 92. Next, the plurality of chips mounted on the substrate 92 are collectively sealed with a sealing resin 93. Thereby, the sealed substrate 91 is completed. Next, the sealed substrate 91 is cut along the boundary lines 94 and 95. As a result, the sealed substrate 91 is divided into a plurality of electronic components respectively corresponding to the regions 96. Note that the separated electronic component having the sealing resin 93 is often called a package (see, for example, Patent Document 1).
　封止済基板９１を切断（個片化）する工程においては、切削機構として回転刃を使用する切断装置（ダイサ）やレーザ光等を使用する切断装置等のような、いわゆる個片化装置が使用されている。そして、個片化装置は、３つの基本的な構成要素を有する。それら３つの構成要素とは、前工程（樹脂封止工程）において形成された封止済基板を受け入れる受け入れ部と、封止済基板を個片化する個片化部と、個片化されて形成された複数の電子部品（パッケージ）を次工程（例えば、包装工程）に搬出する払い出し部とである（例えば、特許文献１参照）。 In the process of cutting (separating) the sealed substrate 91, a so-called individualizing device such as a cutting device (dicer) using a rotary blade as a cutting mechanism or a cutting device using laser light or the like is used. in use. The singulation apparatus has three basic components. The three components are a receiving part that receives the sealed substrate formed in the previous process (resin sealing process), a separate part that separates the sealed substrate, and a separate part. It is a paying-out part which carries out the formed several electronic components (package) to the following process (for example, packaging process) (for example, refer patent document 1).
　上述した各構成要素と特許文献１における各構成要素とは、概ね次のように対応する。特許文献１における「基板の装填部Ａ」が受け入れ部に、「切削機構Ｃ」が個片化部に、「パッケージ収容部Ｆ」が払い出し部に、それぞれ相当する。 Each component described above and each component in Patent Document 1 generally correspond as follows. The “substrate loading part A” in Patent Document 1 corresponds to the receiving part, the “cutting mechanism C” corresponds to the singulation part, and the “package housing part F” corresponds to the dispensing part.
　ところで、近年、電子部品に対する低価格化の要請から、基板９２が大型化する傾向にある。また、小型化等の要請から、１枚の基板９２における電子部品の取れ数、すなわち領域９６の数が増える傾向にある（図５（２）参照）。また、封止済基板９１における反り防止等の要請から、封止済基板９１が大まかなブロックに分けられており、各ブロック内の複数の領域９６とブロック毎に独立して設けられた封止樹脂９３からなる島状部９７が封止済基板９１に複数個形成される場合もある（図５（３）参照）。これらのように、近年では、封止済基板９１の仕様が様々になっている。 By the way, in recent years, there is a tendency for the substrate 92 to become larger due to the demand for lower prices for electronic components. In addition, due to a demand for miniaturization and the like, the number of electronic components that can be removed from one substrate 92, that is, the number of regions 96 tends to increase (see FIG. 5B). Further, the sealed substrate 91 is roughly divided into blocks due to a demand for warpage prevention in the sealed substrate 91, and a plurality of regions 96 in each block and a sealing provided independently for each block. In some cases, a plurality of island-shaped portions 97 made of the resin 93 are formed on the sealed substrate 91 (see FIG. 5 (3)). As described above, in recent years, the specifications of the sealed substrate 91 are various.
　また、近年、パッケージの仕様が様々になっている。具体的には、積層された複数のチップを有するパッケージ、透光性樹脂からなる封止樹脂を有する光電子部品のパッケージ等が採用されている。これに伴い、第１に、基板９２の仕様が様々になっている。具体的には、基板９２のベース材が、金属材料、熱硬化性樹脂とガラス布基材（又はガラス不織布基材）とからなる複合材料（ガラスエポキシ等）、柔らかい樹脂からなるフィルム材料（ポリイミドフィルム等）、硬度は高いが脆性を有するセラミックス材料等のように様々になっている。 In recent years, package specifications have been varied. Specifically, a package having a plurality of stacked chips, a package of optoelectronic components having a sealing resin made of a translucent resin, and the like are employed. Along with this, first, the specifications of the substrate 92 are varied. Specifically, the base material of the substrate 92 is a metal material, a composite material (such as glass epoxy) composed of a thermosetting resin and a glass cloth base (or glass nonwoven base), or a film material (polyimide) composed of a soft resin. Film) and the like, and various materials such as ceramic materials having high hardness but brittleness.
　また、第２に、封止樹脂９３の仕様が様々になっている。具体的には、封止樹脂９３として、フィラーとしてシリカの微粒子を含むとともに樹脂自体の硬度が高いエポキシ樹脂が使用されたり、硬度が低く回転刃に対する粘着性が高いシリコーン樹脂が使用されたりしている。 Second, the specifications of the sealing resin 93 are various. Specifically, as the sealing resin 93, an epoxy resin containing silica fine particles as a filler and having a high hardness of the resin itself, or a silicone resin having a low hardness and high adhesiveness to a rotary blade is used. Yes.
　以上の２つのことから、近年、封止済基板９１を構成する基板９２と封止樹脂９３との組合せが多岐にわたるようになった。これにより、１種類の切断装置を使用して封止済基板９１を個片化することが困難になってきている。したがって、電子部品のメーカーは、複数種類の切断装置を準備する必要に迫られている。 From the above two reasons, in recent years, there are a wide variety of combinations of the substrate 92 and the sealing resin 93 constituting the sealed substrate 91. This makes it difficult to singulate the sealed substrate 91 using one type of cutting device. Therefore, manufacturers of electronic components are urged to prepare a plurality of types of cutting devices.
　また、従来は、パッケージの平面形状は長方形（正方形を含む）だけだったので、基板９２の各領域９６の境界線、すなわち封止済基板９１が切断される線である境界線９４、９５は直線だけであった。しかし、近年では、平面形状が基本的には長方形であるが（言い換えれば平面形状が概略形状としては長方形であるが）、平面視した外形の一部に曲線又は折れ線を含むパッケージが登場するようになった。そして、このことにより、曲線又は折れ線の少なくともいずれかを含む境界線を有する封止済基板が登場してきた。図５（４）に示されたメモリーカード９８は、曲線又は折れ線を含む屈曲部９９を有するパッケージの一例である。なお、ここでいう折れ線とは、線分（有限直線）がつなぎ合わされて生成された線を意味する。 Conventionally, since the planar shape of the package was only a rectangle (including a square), the boundary lines of the regions 96 of the substrate 92, that is, the boundary lines 94 and 95 that are lines for cutting the sealed substrate 91 are It was only a straight line. However, in recent years, although the planar shape is basically a rectangle (in other words, the planar shape is a rectangle as a schematic shape), a package that includes a curved line or a polygonal line in a part of a planar view appears. Became. And the sealed substrate which has the boundary line containing at least any one of a curve or a broken line has appeared by this. The memory card 98 shown in FIG. 5 (4) is an example of a package having a bent portion 99 including a curved line or a broken line. In addition, a broken line here means the line produced | generated by connecting the line segment (finite straight line).
　ここで、図５（４）を参照して、封止済基板を個片化してメモリーカード９８を製造する工程を説明する。この場合には、まず、ダイサによって、メモリーカード９８の外形のうち直線からなる辺に沿って封止済基板９１を切断する。次に、レーザ光やウォータージェット等を使用する切断装置によって、メモリーカード９８の外形のうち屈曲部９９を含む辺に沿って封止済基板を切断する。言い換えると、異なる切削機構を有する２種類の切断装置を使用して、直線からなる辺と屈曲部９９を含む辺とをそれぞれ切断している。 Here, with reference to FIG. 5 (4), a process of manufacturing the memory card 98 by dividing the sealed substrate into individual pieces will be described. In this case, first, the sealed substrate 91 is cut by a dicer along a straight side of the outer shape of the memory card 98. Next, the sealed substrate is cut along the side including the bent portion 99 in the outer shape of the memory card 98 by a cutting device using laser light, water jet, or the like. In other words, two types of cutting devices having different cutting mechanisms are used to cut a side composed of a straight line and a side including the bent portion 99, respectively.
　本出願の出願人は、１枚の基板９２における電子部品の取れ数の増加に対応して、同種の個片化部が２個設けられた個片化装置を提案した。また、平面視した外形に曲線又は折れ線を含むパッケージに対応して、異種の個片化部が２個設けられた個片化装置を提案した。これらの内容は、本出願の出願人の出願による特許文献２に記載されている。 The applicant of the present application proposed an individualizing device provided with two pieces of the same kind of individualizing parts corresponding to an increase in the number of electronic parts to be taken on one substrate 92. In addition, a singulation apparatus in which two different singulation parts are provided corresponding to a package including a curved line or a polygonal line in an outer shape in plan view has been proposed. These contents are described in Patent Document 2 filed by the applicant of the present application.
　なお、個片化は、通常、封止済基板を完全に切断（フルカット）することによって行われる。しかし、個片化は、封止済基板を部分的に切削（ハーフカット）してその後に割断する（ブレークする）ことによっても行われる。そこで、封止済基板を個片化する際の用語として、「切断」に代えて「切削」という用語を適宜使用する。 In addition, the singulation is usually performed by completely cutting (full cut) the sealed substrate. However, individualization is also performed by partially cutting (half-cutting) the sealed substrate and then cleaving (breaking). Therefore, the term “cutting” is appropriately used as a term for dividing the sealed substrate into pieces, instead of “cutting”.
特開２００４－２０７４２４号公報（第２～３頁、図１、図２）Japanese Patent Application Laid-Open No. 2004-207424 (pages 2 to 3, FIGS. 1 and 2) 特開２００８－１５３５６５号公報（段落［００５０］、［００５１］）JP 2008-153565 A (paragraphs [0050] and [0051])
　上述したとおり封止済基板やパッケージの仕様は様々であり、ユーザーが要求する仕様も多様である。そのような多様な要望に応じるために個片化部を適宜変更したり増設したりしようとすると、従来の個片化装置ではそれらの作業に時間が掛かるため、パッケージの生産性が低下するという問題が生じていた。本発明が解決しようとする課題は、ユーザーの要求仕様が変更された場合に、その要求仕様に応じて個片化部の組立・変更・増設・取り外しを短時間で行うことができる個片化装置を提供することである。 As described above, the specifications of the sealed substrate and the package are various, and the specifications required by the user are also various. If it is attempted to change or add to the individualization unit as appropriate in order to meet such various demands, the conventional individualization device will take time for such work, and the productivity of the package will be reduced. There was a problem. The problem to be solved by the present invention is that when a user's required specification is changed, the individualization unit can be assembled, changed, added and removed in a short time according to the required specification. Is to provide a device.
　以下の説明における（）内の数字・記号は、図面における符号を示しており、説明における用語と図面に示された構成要素とを対比しやすくする目的で記載されたものである。また、これらの数字は、「説明における用語を、図面に示された構成要素に限定して解釈すること」を意味するものではない。 Numerals / symbols in parentheses in the following description indicate reference numerals in the drawings, and are described for the purpose of facilitating the comparison of the terms in the description and the components shown in the drawings. Further, these numbers do not mean “interpreting the terms in the description limited to the components shown in the drawings”.
　上述の課題を解決するために、本発明に係る電子部品製造用の個片化装置は、
　基板に設けられた複数の領域に各々装着されたチップを樹脂封止することによって形成された封止済基板（３）を領域毎に個片化することによって複数の電子部品を製造する際に使用され、封止済基板（３）を受け入れる受け入れ部（Ａ）と、封止済基板（３）を切断して個片化する又は割断によって個片化するために封止済基板（３）を部分的に切削する個片化部と、該個片化部で加工された複数の電子部品を払い出す払い出し部（Ｃ）とを備える電子部品製造用の個片化装置であって、
　前記受け入れ部（Ａ）と前記払い出し部（Ｃ）の間に前記個片化部が複数設けられ、
　前記複数の個片化部の各々は他の個片化部、前記受け入れ部（Ａ）又は前記払い出し部（Ｃ）に対して着脱可能かつ交換可能であることを特徴とする。 In order to solve the above-described problem, an singulation apparatus for manufacturing an electronic component according to the present invention includes:
When manufacturing a plurality of electronic components by separating a sealed substrate (3) formed by resin-sealing chips respectively mounted in a plurality of regions provided on the substrate into regions. A receiving part (A) used to receive a sealed substrate (3) and a sealed substrate (3) to cut and separate the sealed substrate (3) or to separate by cleaving An individualizing device for manufacturing electronic parts, comprising: an individualizing part that partially cuts and a payout part (C) that pays out a plurality of electronic parts processed by the individualizing part,
A plurality of the singulated portions are provided between the receiving portion (A) and the payout portion (C),
Each of the plurality of individualized parts is detachable and replaceable with respect to another individualized part, the receiving part (A) or the payout part (C).
　また、本発明に係る電子部品製造用の個片化装置は、上述の個片化装置において、
　前記複数の個片化部は回転刃（７）、レーザ光、ウォータージェット、ワイヤソー、又はバンドソーのうちいずれかを使用する切削機構を各々有するとともに、
　前記複数の個片化部が各々有する切削機構は同じ種類のものであることを特徴とする。 In addition, the singulation apparatus for manufacturing an electronic component according to the present invention is the above-described singulation apparatus,
The plurality of individualized parts each have a cutting mechanism that uses any of a rotary blade (7), laser light, water jet, wire saw, or band saw,
The cutting mechanisms that each of the plurality of singulation parts has are of the same type.
　また、本発明に係る電子部品製造用の個片化装置は、上述の個片化装置において、
　前記複数の個片化部は回転刃（７）、レーザ光、ウォータージェット、ワイヤソー、又はバンドソーのうちいずれかを使用する切削機構を各々有するとともに、
　前記複数の個片化部が各々有する切削機構のうち少なくとも１個の切削機構は他の切削機構とは異なる種類のものであることを特徴とする。 In addition, the singulation apparatus for manufacturing an electronic component according to the present invention is the above-described singulation apparatus,
The plurality of individualized parts each have a cutting mechanism that uses any of a rotary blade (7), laser light, water jet, wire saw, or band saw,
At least one cutting mechanism among the cutting mechanisms that each of the plurality of individualized parts has is different from other cutting mechanisms.
　また、本発明に係る電子部品製造用の個片化装置は、上述の個片化装置において、
　前記複数の個片化部のうち少なくとも１個の個片化部は曲線又は折れ線に沿って封止済基板（３）を加工するものであることを特徴とする。 In addition, the singulation apparatus for manufacturing an electronic component according to the present invention is the above-described singulation apparatus,
At least one individualized part among the plurality of individualized parts is for processing the sealed substrate (3) along a curved line or a broken line.
　また、本発明に係る電子部品製造用の個片化装置は、上述の個片化装置において、
　前記複数の個片化部のうち少なくとも１個の個片化部は仕上げ加工を目的とするものであることを特徴とする。 In addition, the singulation apparatus for manufacturing an electronic component according to the present invention is the above-described singulation apparatus,
At least one individualized part among the plurality of individualized parts is intended for finishing.
　また、本発明に係る電子部品製造用の個片化方法は、
　基板に設けられた複数の領域に各々装着されたチップを樹脂封止することによって形成された封止済基板（３）を領域毎に個片化することによって複数の電子部品を製造する際に使用され、封止済基板（３）を受け入れる工程と、複数の個片化部を各々使用して、封止済基板（３）を切断して個片化する又は割断によって個片化するために封止済基板（３）を部分的に切削する加工工程と、前記個片化部で加工された複数の電子部品を払い出す工程とを備える電子部品製造用の個片化方法であって、
　前記加工工程では、前記複数の個片化部が各々有する同じ種類の切削機構を使用して複数の封止済基板（３）を各々加工することを特徴とする。 In addition, the method for individualizing the electronic component manufacturing according to the present invention is as follows.
When manufacturing a plurality of electronic components by separating a sealed substrate (3) formed by resin-sealing chips respectively mounted in a plurality of regions provided on the substrate into regions. Used to receive the sealed substrate (3) and to cut and separate the sealed substrate (3) using each of the plurality of singulation parts, or to singulate by cleaving A method for singulating an electronic component, comprising: a step of partially cutting the sealed substrate (3); and a step of dispensing a plurality of electronic components processed by the singulated portion. ,
In the processing step, the plurality of sealed substrates (3) are each processed using the same type of cutting mechanism that each of the plurality of individualized parts has.
　また、本発明に係る電子部品製造用の個片化方法は、
　基板に設けられた複数の領域に各々装着されたチップを樹脂封止することによって形成された封止済基板（３）を領域毎に個片化することによって複数の電子部品を製造する際に使用され、封止済基板（３）を受け入れる工程と、複数の個片化部を各々使用して、封止済基板（３）を切断して個片化する又は割断によって個片化するために封止済基板（３）を部分的に切削する加工工程と、前記個片化部で加工された複数の電子部品を払い出す工程とを備える電子部品製造用の個片化方法であって、
　前記加工工程では、前記複数の個片化部が各々有する切削機構のうち少なくとも１個の切削機構であって他の切削機構とは異なる種類の切削機構と他の切削機構とを順次使用して封止済基板（３）を加工することを特徴とする。 In addition, the method for individualizing the electronic component manufacturing according to the present invention is as follows.
When manufacturing a plurality of electronic components by separating a sealed substrate (3) formed by resin-sealing chips respectively mounted in a plurality of regions provided on the substrate into regions. Used to receive the sealed substrate (3) and to cut and separate the sealed substrate (3) using each of the plurality of singulation parts, or to singulate by cleaving A method for singulating an electronic component, comprising: a step of partially cutting the sealed substrate (3); and a step of dispensing a plurality of electronic components processed by the singulated portion. ,
In the machining step, at least one of the cutting mechanisms included in each of the plurality of singulated portions, and a cutting mechanism of a different type from the other cutting mechanisms and another cutting mechanism are sequentially used. The sealed substrate (3) is processed.
　また、本発明に係る電子部品製造用の個片化方法は、上述の個片化方法において、
　前記加工工程は、前記複数の個片化部のうち少なくとも１個の個片化部を使用して曲線又は折れ線に沿って封止済基板（３）を加工する工程と、前記複数の個片化部のうち他の個片化部を使用して直線に沿って封止済基板を加工する工程とを有することを特徴とする。 In addition, the method for singulation for manufacturing an electronic component according to the present invention is the above-described singulation method,
The processing step includes a step of processing the sealed substrate (3) along a curved line or a broken line using at least one of the plurality of individualized portions, and the plurality of individual pieces. And a step of processing the sealed substrate along a straight line using another singulated portion of the singulated portion.
　また、本発明に係る電子部品製造用の個片化方法は、上述の個片化方法において、
　前記加工工程は、前記複数の個片化部のうち少なくとも１個の個片化部を使用して仕上げ加工を行う工程を有することを特徴とする。 In addition, the method for singulation for manufacturing an electronic component according to the present invention is the above-described singulation method,
The processing step includes a step of performing a finishing process using at least one individualized part among the plurality of individualized parts.
　本発明によれば、複数の個片化部の各々は他の個片化部、受け入れ部（Ａ）又は払い出し部（Ｃ）に対して着脱可能かつ交換可能である。このことにより、ユーザーの要求仕様が変更された場合において次のことが短時間で容易に実現される。第１に、要求仕様に応じて、装着されていた個片化部に代えて所望の切削機構を有する個片化部に変更することができる。第２に、要求仕様に応じて、装着されていた個片化部に加えて所望の切削機構を有する個片化部を増設することができる。第３に、不要になった個片化部を取り外すことができる。 According to the present invention, each of the plurality of individualized parts is detachable and replaceable with respect to the other individualized parts, the receiving part (A) or the payout part (C). As a result, when the user's required specifications are changed, the following can be easily realized in a short time. First, it can be changed to an individualized part having a desired cutting mechanism in place of the installed individualized part according to the required specifications. Secondly, according to the required specifications, in addition to the mounted individualized parts, it is possible to add individualized parts having a desired cutting mechanism. 3rdly, the separation part which became unnecessary can be removed.
　また、本発明によれば、複数の個片化部が各々使用する切削機構を同じ種類のものにしてもよい。これにより、同じ種類の切削機構を有する個片化部を増設することができる。したがって、個片化装置の処理能力の増大が容易に実現される。 Further, according to the present invention, the cutting mechanism used by each of the plurality of individualized parts may be the same type. Thereby, the division | segmentation part which has the same kind of cutting mechanism can be expanded. Therefore, an increase in the processing capability of the singulation apparatus can be easily realized.
　また、本発明によれば、複数の個片化部が各々使用する切削機構のうち少なくとも１個の切削機構を他の切削機構とは異なる種類のものにしてもよい。これにより、加工部位の形状や材質等に応じて最適な加工手段を選択して使用することができる。また、複数の個片化部のうち少なくとも１個の個片化部は曲線又は折れ線に沿って封止済基板（３）を切削するものにしてもよい。これにより、要求される電子部品の形状が、曲線又は折れ線に沿った切削を必要とする部分と、それ以外の切削（例えば直線からなる辺に沿った切削）で加工可能な部分を含むものであるときに、各部分に適した加工を１台の個片化装置によって行うことができる。 Further, according to the present invention, at least one cutting mechanism among cutting mechanisms used by each of the plurality of singulated parts may be of a different type from other cutting mechanisms. Thereby, the optimal processing means can be selected and used according to the shape and material of the processing part. In addition, at least one of the plurality of singulated parts may cut the sealed substrate (3) along a curved line or a broken line. As a result, when the required shape of the electronic component includes a part that requires cutting along a curved line or a polygonal line and a part that can be processed by other cutting (for example, cutting along a side consisting of a straight line). In addition, processing suitable for each part can be performed by a single singulation device.
　また、本発明によれば、複数の個片化部のうち少なくとも１個の個片化部は仕上げ加工を目的とするものとしてもよい。これにより、１台の個片化装置によって個片化のための加工と仕上げ加工を行うことができる。 Further, according to the present invention, at least one of the plurality of individualized parts may be intended for finishing. Thereby, the process for individualization and finishing can be performed by one unitization apparatus.
図１は、本発明の実施例１に係る電子部品製造用の個片化装置を示す概略平面図である。FIG. 1 is a schematic plan view showing a singulation apparatus for manufacturing an electronic component according to Embodiment 1 of the present invention. 図２は、本発明の実施例２に係る電子部品製造用の個片化装置を示す概略平面図である。FIG. 2 is a schematic plan view showing a singulation apparatus for manufacturing an electronic component according to Embodiment 2 of the present invention. 図３は、本発明の実施例３に係る電子部品製造用の個片化装置を示す概略平面図である。FIG. 3 is a schematic plan view showing a singulation apparatus for manufacturing an electronic component according to Embodiment 3 of the present invention. 図４は、本発明の実施例４に係る電子部品製造用の個片化装置を示す概略平面図である。FIG. 4 is a schematic plan view showing a singulation apparatus for manufacturing an electronic component according to Embodiment 4 of the present invention. 図５（１）は個片化の対象物である封止済基板を基板側から見て概略的に示す斜視図であり、図５（２）は封止済基板の１つの例を、図５（３）は封止済基板の他の例をそれぞれ封止樹脂側から見て示す平面図であり、図５（４）はメモリーカードを示す平面図である。FIG. 5 (1) is a perspective view schematically showing a sealed substrate as an object to be singulated from the substrate side, and FIG. 5 (2) is an example of a sealed substrate. 5 (3) is a plan view showing another example of the sealed substrate as viewed from the sealing resin side, and FIG. 5 (4) is a plan view showing the memory card.
　電子部品の個片化装置（Ｓ１）は、受け入れ部（Ａ）と個片化部（Ｂ１、Ｂ２）と払い出し部（Ｃ）とを備える。個片化部（Ｂ１、Ｂ２）は、いずれも切断機構として回転刃（７）を有し、それぞれ他の個片化部（Ｂ１、Ｂ２）又は他の構成要素である受け入れ部（Ａ）若しくは払い出し部（Ｃ）に対して着脱自在であり、ユーザーの要求仕様に応じて適宜選択されて組立・変更・増設・取り外しがなされる。個片化部（Ｂ１、Ｂ２）が有する切断機構は、回転刃（７）を用いるものに限らず、ウォータージェット、レーザ光、ワイヤソー、又はバンドソーを用いるものであってもよい。個片化部（Ｂ１、Ｂ２）の切断機構は異種のものであってもよい。例えば、一方の個片化部（Ｂ１）の切断機構はウォータージェットを用いるものとし、他方の個片化部（Ｂ２）の切断機構は回転刃（７）を用いるものとしてもよい。 The electronic component singulation device (S1) includes a receiving part (A), an individualization part (B1, B2), and a payout part (C). Each of the singulation parts (B1, B2) has a rotary blade (7) as a cutting mechanism, and each of the singulation parts (B1, B2) or other component receiving part (A) or It is detachable with respect to the payout part (C), and is appropriately selected according to the user's required specifications for assembly / change / addition / removal. The cutting mechanism of the individualized parts (B1, B2) is not limited to the one using the rotary blade (7), and may use a water jet, a laser beam, a wire saw, or a band saw. Different cutting mechanisms may be used for the individualized parts (B1, B2). For example, the cutting mechanism of one piece part (B1) may use a water jet, and the cutting mechanism of the other piece part (B2) may use a rotary blade (7).
　本発明に係る電子部品製造用の個片化装置の実施例１を、図１を参照して説明する。図１は、本実施例に係る電子部品製造用の個片化装置を示す概略平面図である。図１に示された個片化装置Ｓ１は、封止済基板を複数の電子部品に個片化する個片化装置である。そして、図１に示されているように、個片化装置Ｓ１は、受け入れ部Ａと個片化部Ｂ１と個片化部Ｂ２と払い出し部Ｃとを、それぞれ構成要素（モジュール）として有する。 Embodiment 1 of a singulation apparatus for manufacturing electronic parts according to the present invention will be described with reference to FIG. FIG. 1 is a schematic plan view showing a singulation apparatus for manufacturing an electronic component according to the present embodiment. The singulation apparatus S1 shown in FIG. 1 is an singulation apparatus that divides a sealed substrate into a plurality of electronic components. As shown in FIG. 1, the singulation apparatus S1 includes a receiving unit A, a singulation unit B1, a singulation unit B2, and a payout unit C as components (modules).
　本実施例においては、受け入れ部（Ａ）と払い出し部（Ｃ）の間に個片化部Ｂ１と個片化部Ｂ２という複数個（図１では２個）の個片化部が設けられている。また、受け入れ部Ａと個片化部Ｂ１と個片化部Ｂ２と払い出し部Ｃとが、それぞれ他の構成要素に対して着脱可能かつ交換可能であるようにして構成されている。また、受け入れ部Ａと個片化部Ｂ１と個片化部Ｂ２と払い出し部Ｃとのそれぞれが、予想される要求仕様に応じた異なる複数種の仕様を有するようにして、予め用意されている。更に、本発明においては、受け入れ部Ａと個片化部Ｂ１と個片化部Ｂ２と払い出し部Ｃとを含むようにして、基本ユニット１が構成されている。 In the present embodiment, a plurality of (two in FIG. 1) individualized parts, that is, an individualized part B1 and an individualized part B2 are provided between the receiving part (A) and the payout part (C). Yes. In addition, the receiving part A, the individualized part B1, the individualized part B2, and the payout part C are configured to be detachable and replaceable with respect to other components. In addition, each of the receiving unit A, the individualized unit B1, the individualized unit B2, and the payout unit C is prepared in advance so as to have a plurality of different specifications according to the expected required specifications. . Furthermore, in the present invention, the basic unit 1 is configured to include the receiving portion A, the singulated portion B1, the singulated portion B2, and the payout portion C.
　図１に示されているように、受け入れ部Ａにはプレステージ２が設けられている。このプレステージ２において、前工程の装置である樹脂封止装置から搬送された封止済基板３が受け入れられる。この封止済基板３は、図５に示された封止済基板９１に相当する。封止済基板３は、図５に示されている封止樹脂９３の側を下にしてプレステージ２に配置される。このプレステージ２において、必要に応じて封止済基板３の位置合わせが行われる。なお、図５に示された封止済基板９１と同様に、封止済基板３においては、格子状の複数の領域にそれぞれチップが装着され、複数のチップが一括して樹脂封止されている。 As shown in FIG. 1, a prestage 2 is provided in the receiving part A. In this pre-stage 2, a sealed substrate 3 conveyed from a resin sealing device that is a device in the previous process is received. This sealed substrate 3 corresponds to the sealed substrate 91 shown in FIG. The sealed substrate 3 is disposed on the prestage 2 with the sealing resin 93 side shown in FIG. In the prestage 2, the sealed substrate 3 is aligned as necessary. As in the sealed substrate 91 shown in FIG. 5, in the sealed substrate 3, chips are mounted in a plurality of lattice-shaped regions, and the plurality of chips are collectively sealed with resin. Yes.
　各個片化部Ｂ１、Ｂ２には、それぞれ切断用テーブル４が設けられている。切断用テーブル４は、図のＹ方向に移動可能であり、かつ、θ方向に回動可能である。切断用テーブル４の上には、切断用ステージ５が取り付けられている。各個片化部Ｂ１、Ｂ２の奥の部分には、それぞれ２個のスピンドルモータ６が設けられている。各個片化部Ｂ１、Ｂ２のそれぞれにおいて、２個のスピンドルモータ６は独立してＸ方向に移動可能である。２個のスピンドルモータ６には、それぞれ回転刃７が取り付けられている。これらの回転刃７は、それぞれＹ方向に沿う面内において回転することによって封止済基板３を切断して個片化する。したがって、本実施例では、回転刃７を使用した切削機構が個片化部Ｂ１と個片化部Ｂ２とにそれぞれ設けられていることになる。 Each cutting unit B1, B2 is provided with a cutting table 4 respectively. The cutting table 4 is movable in the Y direction in the figure and is rotatable in the θ direction. A cutting stage 5 is attached on the cutting table 4. Two spindle motors 6 are provided in the inner part of each of the individualized parts B1 and B2. In each of the singulation parts B1 and B2, the two spindle motors 6 can move independently in the X direction. A rotary blade 7 is attached to each of the two spindle motors 6. Each of these rotary blades 7 cuts the sealed substrate 3 into individual pieces by rotating in a plane along the Y direction. Therefore, in the present embodiment, the cutting mechanism using the rotary blade 7 is provided in each of the individualized part B1 and the individualized part B2.
　払い出し部Ｃには、トレイ８が設けられている。トレイ８には、各個片化部Ｂ１、Ｂ２において個片化された複数の電子部品からなる集合体９が、切断用ステージ５から主搬送機構（図示なし）を経由してそれぞれ収容される。そして、トレイ８にそれぞれ収容された複数の電子部品は払い出し部Ｃから払い出され、次工程（例えば、検査工程）に搬送される。 In the payout part C, a tray 8 is provided. The tray 8 accommodates an assembly 9 composed of a plurality of electronic components separated into individual pieces B1 and B2 from the cutting stage 5 via a main transport mechanism (not shown). Then, the plurality of electronic components respectively accommodated in the tray 8 are delivered from the delivery unit C and conveyed to the next process (for example, an inspection process).
　なお、本実施例では、主搬送機構（図示なし）は、各構成要素、すなわち受け入れ部Ａと個片化部Ｂ１と個片化部Ｂ２と払い出し部Ｃに対して共通に適用される位置に設けられている。そして、この位置は、図１において、Ｘ方向に沿って右に延びる矢印（太い実線の矢印）によって示されている。 In the present embodiment, the main transport mechanism (not shown) is located at a position that is commonly applied to each component, that is, the receiving portion A, the separating portion B1, the separating portion B2, and the dispensing portion C. Is provided. In FIG. 1, this position is indicated by an arrow (thick solid line arrow) extending rightward along the X direction.
　ここで、各個片化部Ｂ１、Ｂ２について説明する。個片化部Ｂ１は、他の構成要素、すなわち受け入れ部Ａと個片化部Ｂ２とに対して、着脱可能かつ交換可能であるようにして構成されている。個片化部Ｂ２は、他の構成要素、すなわち個片化部Ｂ１と払い出し部Ｃとに対して、着脱可能かつ交換可能であるようにして構成されている。これらのことにより、封止済基板３を個片化して製造する電子部品に対する需要が減少した場合には、個片化部Ｂ１と個片化部Ｂ２とのいずれかを取り外すことができる。また、封止済基板３を個片化して製造する電子部品に対する需要が増加した場合には、個片化部Ｂ２と払い出し部Ｃとの間に、２個のスピンドルモータ６を有する１個の個片化部（図示なし）を更に装着することができる。 Here, the individual singulation parts B1 and B2 will be described. The individualized part B1 is configured to be detachable and replaceable with respect to other components, that is, the receiving part A and the individualized part B2. The singulation part B2 is configured to be detachable and replaceable with respect to other components, that is, the singulation part B1 and the payout part C. By these things, when the demand with respect to the electronic component manufactured by individualizing the sealed board | substrate 3 reduces, either individualization part B1 or individualization part B2 can be removed. In addition, when the demand for electronic parts manufactured by separating the sealed substrate 3 into individual pieces increases, one piece of spindle motor 6 is provided between the separate portion B2 and the payout portion C. A separate part (not shown) can be further mounted.
　また、本発明の全体において、個片化部Ｂ１及び個片化部Ｂ２にて、回転刃７以外の切削機構を使用してもよい。その際、各個片化部にて同種の切削機構を使用することもできる。例えば、個片化部Ｂ１と個片化部Ｂ２の双方にて、レーザ光、ウォータージェット（研磨材との併用の有無を問わない）、ワイヤソー、又は、バンドソー等のうちのいずれかを用いる切削機構を選択して使用することもできる。例えば、長方形であるような平面形状を有する電子部品、言い換えれば直線からなる辺のみを有する電子部品を製造する場合には、個片化部Ｂ１及び個片化部Ｂ２にて、回転刃７又はバンドソーを有する切削機構を使用すればよい。また、曲線や折れ線等を含むような平面形状を有する電子部品を製造する場合には、個片化部Ｂ１及び個片化部Ｂ２にて、レーザ光、ウォータージェット、又はワイヤソーを用いる切削機構を使用すればよい。 Further, in the whole of the present invention, a cutting mechanism other than the rotary blade 7 may be used in the individualized part B1 and the individualized part B2. In that case, the same kind of cutting mechanism can also be used in each piece part. For example, cutting using either a laser beam, a water jet (with or without use with an abrasive), a wire saw, a band saw, or the like is performed in both the individualized part B1 and the individualized part B2. A mechanism can be selected and used. For example, when manufacturing an electronic component having a planar shape such as a rectangle, in other words, an electronic component having only a side consisting of a straight line, the rotary blade 7 or the individualized portion B2 A cutting mechanism having a band saw may be used. Further, when manufacturing an electronic component having a planar shape including a curved line, a broken line, etc., a cutting mechanism using a laser beam, a water jet, or a wire saw is used in the individualized part B1 and the individualized part B2. Use it.
　また、本発明の全体において、様々な構成要素を有する払い出し部Ｃを採用することができる。例えば、複数の電子部品をトレイに収容する機構、チューブに収容する機構、ばらのままで移載して搬出する機構等を有する払い出し部Ｃを採用することができる。 In addition, in the whole of the present invention, a payout unit C having various components can be employed. For example, a payout unit C having a mechanism for storing a plurality of electronic components in a tray, a mechanism for storing the electronic components in a tube, a mechanism for transferring and carrying out the bulk as it is, and the like can be employed.
　以下、本実施例に係る電子部品製造用の個片化装置Ｓ１の動作を説明する。まず、受け入れ部Ａにおいて封止済基板３を受け入れる。 Hereinafter, the operation of the singulation apparatus S1 for manufacturing electronic parts according to the present embodiment will be described. First, the sealed substrate 3 is received in the receiving part A.
　次に、封止済基板３を個片化部Ｂ１に移送した後に、回転刃７によって封止済基板３を切断して個片化する。この間に、受け入れ部Ａにおいて次の封止済基板３を受け入れて、この封止済基板３を個片化部Ｂ２に移送した後に、個片化部Ｂ２の回転刃７によって封止済基板３を切断して個片化する。これにより、各個片化部Ｂ１、Ｂ２のそれぞれにおいて、回転刃７によって並行して封止済基板３を個片化することができる。 Next, after the sealed substrate 3 is transferred to the separation part B1, the sealed substrate 3 is cut into pieces by the rotary blade 7. During this time, after receiving the next sealed substrate 3 in the receiving portion A and transferring the sealed substrate 3 to the individualized portion B2, the sealed substrate 3 is rotated by the rotary blade 7 of the individualized portion B2. Cut into pieces. Thereby, the sealed substrate 3 can be separated into pieces by the rotary blade 7 in each of the separated parts B1 and B2.
　次に、個片化部Ｂ１において個片化された複数の電子部品からなる集合体９を、切断用ステージ５から主搬送機構（図示なし）を経由してトレイ８に収容する。その後に、集合体９をトレイ８から次工程（例えば、検査工程）に搬送する。 Next, the assembly 9 composed of a plurality of electronic components separated in the individualization part B1 is accommodated in the tray 8 from the cutting stage 5 via the main transport mechanism (not shown). Thereafter, the assembly 9 is transported from the tray 8 to the next process (for example, an inspection process).
　次に、個片化部Ｂ２において個片化された複数の電子部品からなる集合体９を、切断用ステージ５から主搬送機構（図示なし）を経由してトレイ８に収容する。その後に、集合体９をトレイ８から次工程に搬送する。 Next, the assembly 9 composed of a plurality of electronic components separated in the individualization part B2 is accommodated in the tray 8 from the cutting stage 5 via the main transport mechanism (not shown). Thereafter, the assembly 9 is transported from the tray 8 to the next process.
　ここで、２組の集合体９をそれぞれ収容して次工程に順次搬送する工程と並行して、各個片化部Ｂ１、Ｂ２のそれぞれにおいて、回転刃７によって別の封止済基板３を切断して個片化することができる。以上説明したように、本実施例に係る電子部品製造用の個片化方法によれば、複数の個片化部を並行して使用するため封止済基板３を個片化する際の処理能力が大幅に向上する。 Here, in parallel with the process of accommodating each of the two sets 9 and sequentially transporting them to the next process, the individual blades B1 and B2 are cut into separate sealed substrates 3 by the rotary blades 7 respectively. And can be singulated. As described above, according to the individualization method for manufacturing an electronic component according to the present embodiment, a process when individualizing the sealed substrate 3 to use a plurality of individualization units in parallel is performed. The ability is greatly improved.
　本実施例に係る電子部品製造用の個片化装置Ｓ１の特徴は、次の通りである。第１に、個片化装置Ｓ１に、同種の切削機構を有する個片化部Ｂ１、Ｂ２が複数個設けられていることである。第２に、個片化部Ｂ１、Ｂ２が、予想される要求仕様に応じた異なる複数種の仕様を有するようにして予め用意されていることである。第３に、個片化部Ｂ１、Ｂ２が、それぞれ他の構成要素に対して着脱可能かつ交換可能になっていることである。 Features of the singulation apparatus S1 for manufacturing electronic parts according to the present embodiment are as follows. First, the singulation device S1 is provided with a plurality of singulation parts B1 and B2 having the same type of cutting mechanism. Second, the singulation units B1 and B2 are prepared in advance so as to have different types of specifications according to the expected required specifications. Third, the individualized parts B1 and B2 are detachable and replaceable with respect to other components.
　本実施例によれば、これらの特徴により、予想される要求仕様に応じた異なる複数種の仕様を有するようにして予め用意された複数種の個片化部のうち、同種の個片化部からなる個片化部Ｂ１、Ｂ２、・・・を使用して個片化装置が組み立てられる。これにより、あるユーザーの要求仕様と需要とに応じた最適な個片化部Ｂ１、Ｂ２、・・・を有する個片化装置Ｓ１が短時間に実現される。 According to the present embodiment, due to these features, the same kind of singulation parts among the plural kinds of singulation parts prepared in advance so as to have different kinds of specifications according to the expected required specifications. The singulation device is assembled using the singulation parts B1, B2,. As a result, the singulation apparatus S1 having the optimum singulation units B1, B2,... According to the required specifications and demands of a certain user is realized in a short time.
　また、封止済基板３を個片化して製造する電子部品に対する需要の増減に対応して、個片化部Ｂ１、Ｂ２に個片化部を増設することができ、又は個片化部Ｂ１、Ｂ２から個片化部を取り外すことができる。これにより、現行の個片化装置を変更することによって、需要の増減に対応する個片化装置が短時間に実現される。また、ユーザーにとって不要な部分が個片化装置に含まれないので、個片化装置の小フットプリント化と低コスト化とが可能になる。 Further, in response to an increase or decrease in demand for electronic components that are manufactured by separating the sealed substrate 3, the individualized portions B1 and B2 can be provided with additional individualized portions, or the individualized portions B1. , B2 can be removed from the individualized part. Thus, by changing the current singulation device, the singulation device corresponding to the increase or decrease in demand is realized in a short time. In addition, since a part unnecessary for the user is not included in the individualizing device, it is possible to reduce the footprint and cost of the individualizing device.
　また、個片化部Ｂ１、Ｂ２がそれぞれ有する回転刃７に関する仕様を個片化部毎に異なることとしてもよい。この仕様は、例えば、砥粒径でもよく、回転速度でもよい。例えば、個片化部Ｂ１が有する回転刃７の砥粒径を基板の切削に適した仕様にし、個片化部Ｂ２が有する回転刃７の砥粒径を封止樹脂の切削に適した仕様にする。これにより、個片化部Ｂ１が有する回転刃７を使用して基板を切削し、その後に個片化部Ｂ２が有する回転刃７を使用して封止樹脂を切削することができる。したがって、封止済基板３を構成する基板と封止樹脂とのそれぞれに対応する最適な仕様を有する異なる回転刃７によって、加工部位毎に最適な加工条件で封止済基板３を個片化することができる。 Moreover, it is good also as the specification regarding the rotary blade 7 which each individualization part B1 and B2 has differ for every individualization part. This specification may be, for example, an abrasive grain size or a rotational speed. For example, the abrasive grain size of the rotary blade 7 included in the singulated part B1 is set to a specification suitable for substrate cutting, and the abrasive grain size of the rotary blade 7 included in the singulated part B2 is specified to be suitable for cutting sealing resin. To. Thereby, a board | substrate can be cut using the rotary blade 7 which the singulation part B1 has, and sealing resin can be cut using the rotary blade 7 which the singulation part B2 has after that. Therefore, the sealed substrate 3 is singulated under optimum processing conditions for each processing portion by using different rotary blades 7 having optimum specifications corresponding to each of the substrate constituting the sealed substrate 3 and the sealing resin. can do.
　また、切削機構が封止済基板３に与える影響を考慮して、個片化部Ｂ１、Ｂ２がそれぞれ有する回転刃７に関する仕様を個片化部毎に異なることとしてもよい。例えば、先に使用される個片化部Ｂ１が有する回転刃７の砥粒径を粗い切削に適したものにするとともに、後に使用される個片化部Ｂ２が有する回転刃７の砥粒径を細かい切削に適したものにすることができる。これにより、後に使用される個片化部Ｂ２によって仕上げ加工を行うことができる。したがって、切断品位の向上を図ることができる。 Further, in consideration of the influence of the cutting mechanism on the sealed substrate 3, the specifications relating to the rotary blades 7 respectively included in the individualized parts B1 and B2 may be different for each individualized part. For example, the abrasive grain size of the rotary blade 7 of the individualized part B1 used earlier is suitable for rough cutting and the abrasive grain size of the rotary blade 7 of the individualized part B2 used later is used. Can be made suitable for fine cutting. Thereby, finishing can be performed by the individualized part B2 used later. Therefore, the cutting quality can be improved.
　更に、本発明の全体において、市場動向や技術動向等の変化に応じて、個片化部Ｂ１、Ｂ２、・・・を異なる仕様を有する個片化部に交換することにより、最適な個片化装置を実現することができる。例えば、メモリーカードのように曲線や折れ線等を含む平面形状を有する電子部品の需要が増大した場合には、回転刃７を有する切削機構を使用する個片化部Ｂ１、Ｂ２、・・・を適当な個片化部に交換すればよい。新たに装着される個片化部としては、レーザ光、ウォータージェット、又は、ワイヤソーを使用する個片化部が挙げられる。例えば、個片化部Ｂ１、Ｂ２、・・・のすべて又は一部を、レーザ光を使用する個片化部に交換してもよく、ウォータージェットを使用する個片化部に交換してもよく、ワイヤソーを使用する個片化部に交換してもよい。 Furthermore, in the whole of the present invention, the optimum individual piece is obtained by exchanging the individualized parts B1, B2,... With individualized parts having different specifications in accordance with changes in market trends, technological trends, etc. Can be realized. For example, when the demand for electronic parts having a planar shape including a curve, a broken line, etc., such as a memory card, increases, the individualized parts B1, B2,... That use a cutting mechanism having a rotary blade 7 are used. What is necessary is just to replace | exchange for a suitable piece part. As the newly installed individualized part, there is an individualized part using a laser beam, a water jet, or a wire saw. For example, all or part of the individualized parts B1, B2,... May be replaced with individualized parts that use laser light, or may be replaced with individualized parts that use a water jet. It may be replaced with an individualized part using a wire saw.
　本発明に係る電子部品製造用の個片化装置の実施例２を、図２を参照して説明する。図２は、本実施例に係る電子部品製造用の個片化装置を示す概略平面図である。図２に示されているように、本実施例に係る電子部品製造用の個片化装置Ｓ２は、受け入れ部Ａと個片化部Ｂ１、Ｂ２と洗浄部Ｄと検査部Ｅと払い出し部Ｃとを、それぞれ構成要素（モジュール）として有する。そして、個片化装置Ｓ２は、図１に示された個片化装置Ｓ１における個片化部Ｂ２と払い出し部Ｃとの間に洗浄部Ｄと検査部Ｅとが設けられて構成されている。更に、主搬送機構（図示なし）が、各構成要素のうち受け入れ部Ａと個片化部Ｂ１、Ｂ２と洗浄部Ｄと払い出し部Ｃとに対して共通に適用される位置に設けられている。 Embodiment 2 of the singulation apparatus for manufacturing an electronic component according to the present invention will be described with reference to FIG. FIG. 2 is a schematic plan view showing the singulation apparatus for manufacturing an electronic component according to the present embodiment. As shown in FIG. 2, the singulation apparatus S <b> 2 for manufacturing an electronic component according to this embodiment includes a receiving unit A, singulation units B <b> 1 and B <b> 2, a cleaning unit D, an inspection unit E, and a dispensing unit C. And each as a component (module). The singulation device S2 is configured by providing a cleaning unit D and an inspection unit E between the singulation unit B2 and the dispensing unit C in the singulation device S1 shown in FIG. . Further, a main transport mechanism (not shown) is provided at a position that is commonly applied to the receiving part A, the singulation parts B1 and B2, the cleaning part D, and the payout part C among the constituent elements. .
　ここで、本実施例においては、実施例１に加えて、洗浄部Ｄと検査部Ｅとが、それぞれ他の構成要素に対して着脱可能かつ交換可能であるようにして構成されている。また、洗浄部Ｄと検査部Ｅとのそれぞれが、予想される要求仕様に応じた異なる複数種の仕様を有するようにして予め用意されている。 Here, in this embodiment, in addition to the first embodiment, the cleaning unit D and the inspection unit E are configured to be detachable and replaceable with respect to other components. In addition, each of the cleaning unit D and the inspection unit E is prepared in advance so as to have a plurality of different specifications according to expected required specifications.
　以下、図２に示された個片化装置Ｓ２において、図１に示された個片化装置Ｓ１とは相違する構成要素について説明する。図２に示されているように、洗浄部Ｄには、洗浄機構１０が設けられている。洗浄機構１０には、Ｙ方向に沿う軸を中心にして回転可能であるようにして、スポンジ等の吸水性材料からなる洗浄ローラ１１が設けられている。洗浄ローラ１１の下方には、水槽（図示なし）が設けられている。洗浄ローラ１１は、水槽に貯留された水を吸い込んだ状態で回転する。 Hereinafter, the components of the singulation apparatus S2 shown in FIG. 2 that are different from the singulation apparatus S1 shown in FIG. 1 will be described. As shown in FIG. 2, the cleaning unit D is provided with a cleaning mechanism 10. The cleaning mechanism 10 is provided with a cleaning roller 11 made of a water-absorbing material such as a sponge so as to be rotatable about an axis along the Y direction. A water tank (not shown) is provided below the cleaning roller 11. The cleaning roller 11 rotates in a state where the water stored in the water tank is sucked.
　また、洗浄機構１０の上方には、封止済基板３が切断されて形成された複数の電子部品（パッケージ）からなる集合体９が配置される。集合体９は、その基板側の面（図の用紙における表側の面）において主搬送機構（図示なし）によって吸着固定されている。言い換えれば、集合体９は、図５に示された基板９２の側の面において吸着固定されている。そして、主搬送機構によって吸着固定された集合体９は、図の左から右へと移動する。その移動に伴い、集合体９の封止樹脂側の面（図の用紙における裏側の面）が、水を吸い込んだ状態で回転する洗浄ローラ１１に接触する。これにより、集合体９の封止樹脂側の面が洗浄される。その後に、洗浄された集合体９の全幅に対してエア（好ましくはホットエア）を噴射する。これにより、集合体９に付着した水を吹き飛ばすとともに、集合体９の表面を乾燥させる。 Also, above the cleaning mechanism 10, an assembly 9 composed of a plurality of electronic components (packages) formed by cutting the sealed substrate 3 is disposed. The assembly 9 is adsorbed and fixed by a main transport mechanism (not shown) on the substrate side surface (the front side surface of the paper in the figure). In other words, the assembly 9 is adsorbed and fixed on the surface of the substrate 92 shown in FIG. Then, the assembly 9 attracted and fixed by the main transport mechanism moves from the left to the right in the figure. Along with the movement, the surface of the assembly 9 on the side of the sealing resin (the surface on the back side of the paper in the figure) comes into contact with the cleaning roller 11 that rotates while sucking water. Thereby, the surface of the assembly 9 on the sealing resin side is cleaned. Thereafter, air (preferably hot air) is sprayed over the entire width of the cleaned assembly 9. Thereby, the water adhering to the aggregate 9 is blown off, and the surface of the aggregate 9 is dried.
　図２に示されているように、検査部Ｅには検査用テーブル１２が設けられており、検査用テーブル１２はθ方向に回動可能である。検査用テーブル１２の上には、検査用ステージ１３が取り付けられている。検査用ステージ１３には、複数の電子部品からなる集合体９を吸着固定している主搬送機構から分岐した副搬送機構（図示なし）から、洗浄された複数の電子部品が移載される。図２には、洗浄部Ｄと検査部Ｅとの間における副搬送機構の移動経路が、Ｙ方向に沿う太い実線の矢印で示されている。 As shown in FIG. 2, the inspection unit E is provided with an inspection table 12, and the inspection table 12 is rotatable in the θ direction. An inspection stage 13 is attached on the inspection table 12. A plurality of cleaned electronic components are transferred to the inspection stage 13 from a sub-transport mechanism (not shown) branched from the main transport mechanism that holds and fixes the assembly 9 composed of a plurality of electronic components. In FIG. 2, the movement path of the sub transport mechanism between the cleaning unit D and the inspection unit E is indicated by a thick solid arrow along the Y direction.
　検査部Ｅは、電子部品の外観検査を行う部分である。そして、検査部Ｅの奥の部分においては、電子部品の静止画像を撮影するカメラ１４が設けられている。カメラ１４は、Ｘ方向とＹ方向とに移動可能である。ここで、検査部Ｅには制御部（図示なし）が設けられている。この制御部は、カメラ１４から受け取った電子部品の静止画像に基づいて画像処理を行い、得られた画像データと予め記憶したデータとを比較することによって、その電子部品が良品であるか不良品であるかを判定する。そして、制御部は、必要に応じて、集合体９における良品と不良品とに関するデータ（いわゆるマップデータ）を記憶する。 The inspection unit E is a part that performs an appearance inspection of the electronic component. And in the back part of the test | inspection part E, the camera 14 which image | photographs the still image of an electronic component is provided. The camera 14 is movable in the X direction and the Y direction. Here, the inspection unit E is provided with a control unit (not shown). The control unit performs image processing based on a still image of the electronic component received from the camera 14, and compares the obtained image data with previously stored data to determine whether the electronic component is a good product or a defective product. It is determined whether it is. And a control part memorizes data (what is called map data) about a good article and a defective article in aggregate 9 as needed.
　払い出し部Ｃに設けられたトレイ８には、個片化部Ｂにおいて個片化され、洗浄部Ｄにおいて洗浄され、検査部Ｅによって検査された複数の電子部品からなる集合体９が、洗浄部Ｄの側から主搬送機構（図示なし）を経由して収容される。本実施例では、制御部（図示なし）に記憶されたマップデータに基づいて、トレイ８に収容された電子部品のうちの良品のみが、次工程（例えば、包装工程）に搬送される。また、不良品が、不良品トレイ（図示なし）に収容される。 On the tray 8 provided in the dispensing unit C, an assembly 9 composed of a plurality of electronic components separated into individual parts B, cleaned in the cleaning part D, and inspected by the inspection part E is provided in the cleaning part Housed from the D side via a main transport mechanism (not shown). In the present embodiment, based on the map data stored in the control unit (not shown), only non-defective products out of the electronic components stored in the tray 8 are conveyed to the next process (for example, a packaging process). Further, defective products are accommodated in a defective product tray (not shown).
　本実施例によれば、最適な個片化部Ｂ１、Ｂ２、・・・と洗浄部Ｄと検査部Ｅとを有する個片化装置Ｓ２が、短時間に製造される。加えて、需要の増減に対応する最適な個片化装置Ｓ２が短時間に実現される。 According to the present embodiment, the singulation apparatus S2 having the optimum singulation parts B1, B2,..., The cleaning part D, and the inspection part E is manufactured in a short time. In addition, the optimum singulation apparatus S2 corresponding to the increase or decrease in demand is realized in a short time.
　なお、本実施例においては、洗浄部Ｄにおいて、洗浄ローラ１１と水とを使用した洗浄に代えて、例えば、スチームや洗浄剤等を使用した洗浄を行ってもよい。また、検査部Ｅにおいて、外観検査（光学的な検査）に代えて、例えば、通電検査等を行ってもよい。 In the present embodiment, the cleaning unit D may perform cleaning using, for example, steam or a cleaning agent instead of cleaning using the cleaning roller 11 and water. Further, in the inspection unit E, for example, a current inspection or the like may be performed instead of the appearance inspection (optical inspection).
　本発明に係る電子部品製造用の個片化装置の実施例３を、図３を参照して説明する。図３は、本実施例に係る電子部品製造用の個片化装置を示す概略平面図である。本実施例に係る電子部品製造用の個片化装置Ｓ３は、実施例２の個片化装置Ｓ２に対して次の点が異なる。それは、複数の個片化部が、異なる種類の仕様を有する個片化部Ｂ２と個片化部Ｂ３とによって構成されていることである。 Embodiment 3 of the singulation apparatus for manufacturing electronic parts according to the present invention will be described with reference to FIG. FIG. 3 is a schematic plan view showing the singulation apparatus for manufacturing the electronic component according to the present embodiment. The singulation apparatus S3 for manufacturing electronic components according to the present embodiment differs from the singulation apparatus S2 of the second embodiment in the following points. That is, a plurality of individualized parts are constituted by an individualized part B2 and an individualized part B3 having different types of specifications.
　具体的には、実施例２の個片化部Ｂ１に代えて、切削機構にてウォータージェットを使用する個片化部Ｂ３が装着されている。個片化部Ｂ３には、ウォータージェットユニット１５が設けられている。このことにより、ウォータージェットを使用する個片化部Ｂ３によって曲線や折れ線等を含む辺を切断し、回転刃７を使用する個片化部Ｂ２によって直線からなる辺を切断することができる。 Specifically, instead of the individualized part B1 of Example 2, an individualized part B3 that uses a water jet by a cutting mechanism is mounted. A water jet unit 15 is provided in the singulation part B3. By this, the side | part containing a curve, a broken line, etc. can be cut | disconnected by the separation part B3 which uses a water jet, and the edge | side which consists of a straight line can be cut | disconnected by the separation part B2 which uses the rotary blade 7. FIG.
　本実施例に係る電子部品製造用の個片化方法によれば、まず、受け入れ部Ａにおいて封止済基板３を受け入れる。 According to the singulation method for manufacturing an electronic component according to the present embodiment, first, the sealed substrate 3 is received in the receiving portion A.
　次に、封止済基板３を個片化部Ｂ３に移送する。その後に、ウォータージェットユニット１５を使用して、封止済基板３における曲線や折れ線等を含む辺を切断する。 Next, the sealed substrate 3 is transferred to the singulation part B3. Thereafter, the water jet unit 15 is used to cut the sides of the sealed substrate 3 including curved lines, broken lines, and the like.
　次に、封止済基板３を個片化部Ｂ２に移送する。その後に、回転刃７を使用して、封止済基板３における直線からなる辺を切断する。 Next, the sealed substrate 3 is transferred to the separation part B2. After that, the rotary blade 7 is used to cut a side formed by a straight line in the sealed substrate 3.
　以上説明したように、本実施例に係る電子部品製造用の個片化方法によれば、封止済基板３の特徴に応じて、異なる種類の切削機構を使用して封止済基板３を順次切削することによって、封止済基板３を個片化する。したがって、１台の個片化装置を使用して、封止済基板３の特徴に応じた最適な複数の切削機構によって、封止済基板３を個片化することができる。 As described above, according to the singulation method for manufacturing an electronic component according to the present embodiment, the sealed substrate 3 is formed using different types of cutting mechanisms according to the characteristics of the sealed substrate 3. The sealed substrate 3 is separated into pieces by cutting sequentially. Therefore, the sealed substrate 3 can be separated into pieces using a plurality of optimum cutting mechanisms according to the characteristics of the sealed substrate 3 using a single singulation device.
　また、本実施例によれば、図１に示された個片化部Ｂ１を、ウォータージェットを使用する個片化部Ｂ３に交換することによって、長方形の平面形状を有するパッケージの製造に使用されている個片化装置Ｓ１（図１参照）を、メモリーカードの製造に適した個片化装置Ｓ３に短時間で変更することができる。 In addition, according to the present embodiment, the individualized part B1 shown in FIG. 1 is replaced with an individualized part B3 using a water jet, thereby being used for manufacturing a package having a rectangular planar shape. The singulation device S1 (see FIG. 1) can be changed to the singulation device S3 suitable for manufacturing a memory card in a short time.
　なお、個片化部Ｂ３を、レーザ光を使用する個片化部に交換してもよい。また、個片化部Ｂ３を、ワイヤソーを使用する個片化部に交換してもよい。また、ウォータージェットを使用する個片化部Ｂ３と回転刃７を使用する個片化部Ｂ２の位置を交換することもできる。 Note that the singulation unit B3 may be replaced with a singulation unit that uses laser light. Moreover, you may replace | isolate the singulation part B3 with the singulation part which uses a wire saw. Further, the positions of the individualized part B3 using the water jet and the individualized part B2 using the rotary blade 7 can be exchanged.
　また、切削機構が封止済基板３に与える影響を考慮して、個片化部Ｂ３、Ｂ２がそれぞれ使用する切削機構に関する仕様を個片化部毎に異なることとしてもよい。例えば、先に使用される個片化部Ｂ３が有する切削機構をレーザ光を用いるものとし、後に使用される個片化部Ｂ２が有する切削機構をウォータージェットを用いるものとすることができる。この場合には、レーザ光を使用することによって切断（溶断）された部分に、封止樹脂が溶融して生成された物質が付着するおそれがあるが、この付着した物質（溶融付着物）を、ウォータージェットを使用することによって除去することができる。このことにより、後に使用される個片化部Ｂ２によって、ウォータージェットを使用して仕上げ加工を行うことができる。したがって、切断品位の向上を図ることができる。 Also, in consideration of the influence of the cutting mechanism on the sealed substrate 3, the specifications regarding the cutting mechanism used by the individualized parts B3 and B2 may be different for each individualized part. For example, it is possible to use a laser beam for the cutting mechanism of the individualized part B3 used first, and use a water jet for the cutting mechanism of the individualized part B2 used later. In this case, there is a possibility that a substance generated by melting the sealing resin may adhere to the part cut (fused) by using laser light. It can be removed by using a water jet. Thereby, finishing can be performed using a water jet by the individualized part B2 used later. Therefore, the cutting quality can be improved.
　本発明に係る電子部品製造用の個片化装置の実施例４を、図４を参照して説明する。図４は、本実施例に係る電子部品製造用の個片化装置を示す概略平面図である。本実施例に係る電子部品製造用の個片化装置Ｓ４は、３個の個片化部Ｂ３、Ｂ４、Ｂ２を有する。個片化部Ｂ３、Ｂ４は、同種の切削機構、例えばウォータージェットを使用する切削機構を有する。また、個片化部Ｂ２は回転刃７が取り付けられた２個のスピンドルモータ６を有する。そして、各個片化部が他の個片化部、受け入れ部Ａ又は払い出し部Ｃに対して着脱可能かつ交換可能であるため、ウォータージェットユニット１５を有する個片化部Ｂ３、Ｂ４の設置台数を増減させたり、２個のスピンドルモータ６を有する個片化部Ｂ２の設置台数を増減させたりする作業を、短時間に行うことができる。 Embodiment 4 of the singulation apparatus for manufacturing electronic parts according to the present invention will be described with reference to FIG. FIG. 4 is a schematic plan view showing a singulation apparatus for manufacturing an electronic component according to the present embodiment. The singulation apparatus S4 for manufacturing an electronic component according to the present embodiment has three singulation parts B3, B4, and B2. The individualized parts B3 and B4 have the same type of cutting mechanism, for example, a cutting mechanism that uses a water jet. Further, the singulation part B2 has two spindle motors 6 to which the rotary blades 7 are attached. And since each singulation part is detachable and replaceable with respect to the other singulation part, the receiving part A or the payout part C, the number of singulation parts B3 and B4 having the water jet unit 15 is set. The operation of increasing / decreasing or increasing / decreasing the number of separated parts B2 having two spindle motors 6 can be performed in a short time.
　本実施例によれば、それぞれウォータージェットユニット１５を有する２個の個片化部Ｂ３、Ｂ４によって曲線や折れ線等を含む辺を切断し、回転刃７を有する個片化部Ｂ２によって直線からなる辺を切断することができる。また、曲線や折れ線等を含む辺を切断する個片化部と、直線からなる辺を切断する個片化部について、仕様及び数を短時間に変更することができる。したがって、曲線や折れ線等を含む辺を切断する能力と直線からなる辺を切断する能力の調整を短時間に図ることができる。 According to the present embodiment, the side including the curved line and the broken line is cut by the two individualized parts B3 and B4 each having the water jet unit 15, and the straight part is formed by the individualized part B2 having the rotary blade 7. The edge can be cut. In addition, specifications and numbers can be changed in a short time for the singulation unit that cuts a side including a curved line, a broken line, and the like and the singulation unit that cuts a side consisting of a straight line. Therefore, it is possible to adjust the ability to cut a side including a curved line or a broken line and the ability to cut a side made of a straight line in a short time.
　本実施例においても、ウォータージェットを使用する２個の個片化部Ｂ３、Ｂ４を、レーザ光を使用する２個の個片化部に交換することができる。また、２個の個片化部Ｂ３、Ｂ４を、ワイヤソーを使用する２個の個片化部に交換することができる。また、ウォータージェットを使用する個片化部Ｂ３、Ｂ４と、回転刃７を使用する個片化部Ｂ２との位置を交換することもできる。また、ウォータージェットを使用する個片化部を１個にするとともに、回転刃７を使用する個片化部を２個にすることもできる。 Also in the present embodiment, the two singulation parts B3 and B4 using the water jet can be replaced with two singulation parts using the laser beam. Also, the two singulation parts B3 and B4 can be replaced with two singulation parts using a wire saw. Further, the positions of the individualized parts B3 and B4 that use the water jet and the individualized part B2 that uses the rotary blade 7 can be exchanged. In addition, the number of singulation parts using the water jet can be one, and the number of singulation parts using the rotary blade 7 can be two.
　また、個片化部Ｂ３、Ｂ４がそれぞれ使用するウォータージェットに関する仕様を個片化部毎に異なることとしてもよい。この仕様は、例えば、砥粒径でもよく、加工水の圧力でもよい。例えば、先に使用される個片化部Ｂ３が有するウォータージェットの砥粒径を基板の切削に適した仕様にし、後に使用される個片化部Ｂ４が有するウォータージェットの砥粒径を封止樹脂の切削に適した仕様にする。これにより、個片化部Ｂ３を使用して基板を切削し、その後に個片化部Ｂ４を使用して封止樹脂を切削することができる。したがって、封止済基板３を構成する基板と封止樹脂のそれぞれに対応する最適な加工条件で、封止済基板３を切断して個片化することができる。 In addition, the specifications regarding the water jet used by the individualized parts B3 and B4 may be different for each individualized part. This specification may be, for example, the abrasive grain size or the pressure of the processing water. For example, the abrasive grain size of the water jet of the individualized part B3 used earlier is set to a specification suitable for cutting the substrate, and the abrasive grain size of the water jet of the individualized part B4 used later is sealed. Use specifications suitable for resin cutting. Thereby, a board | substrate can be cut using the separated part B3, and sealing resin can be cut using the separated part B4 after that. Therefore, the sealed substrate 3 can be cut into individual pieces under optimum processing conditions corresponding to the substrate and the sealing resin that constitute the sealed substrate 3.
　なお、ここまでの各実施例では、各個片化部Ｂ１～Ｂ４においてそれぞれ１個の切断用テーブル４が設けられた構成について説明した。この構成に限らず、各個片化部Ｂ１～Ｂ４にそれぞれ２個以上の切断用テーブル４を設けてもよい。そして、切断用テーブル４のそれぞれに、例えば、図１に示された２個のスピンドルモータを対応させることができる。これによれば、個片化装置の処理能力がいっそう向上する。 In each of the embodiments so far, the configuration in which one cutting table 4 is provided in each of the singulation parts B1 to B4 has been described. Not limited to this configuration, two or more cutting tables 4 may be provided in each of the singulation parts B1 to B4. Then, for example, the two spindle motors shown in FIG. 1 can correspond to each of the cutting tables 4. According to this, the processing capability of the singulation apparatus is further improved.
　また、各実施例において説明した各構成要素に加えて、更に他の構成要素を装着することもできる。例えば、ユーザーの要求仕様に応じて、検査部Ｅに別の検査部を装着して、この別の検査部によってパッケージに対する別の検査を行うことができる。この別の検査としては、通電検査や、検査部Ｅによって検査する面の反対面に対する外観検査等を採用することができる。 In addition to the components described in each embodiment, other components can be mounted. For example, another inspection unit can be attached to the inspection unit E in accordance with the user's required specifications, and another inspection for the package can be performed by the other inspection unit. As this another inspection, an electric current inspection, an appearance inspection on the surface opposite to the surface to be inspected by the inspection unit E, or the like can be adopted.
　また、封止済基板の個片化は、個片化部で封止済基板を完全に切断（フルカット）することによって行ってもよいが、個片化部で封止済基板を部分的に切削（ハーフカット）し、その後の工程で割断により行ってもよい。この割断は個片化装置で行ってもよく、後工程の別の装置で行ってもよい。 Moreover, although the sealed substrate may be separated by completely cutting (full cut) the sealed substrate at the individualized portion, the sealed substrate is partially separated at the individualized portion. May be cut (half cut) and then cleaved in subsequent steps. This cleaving may be performed by an individualizing device or may be performed by another device in a subsequent process.
　また、本発明は、上述の各実施例に限定されるものではなく、本発明の趣旨を逸脱しない範囲内で、必要に応じて、任意にかつ適宜に組み合わせ、変更し、又は選択して採用できるものである。 In addition, the present invention is not limited to the above-described embodiments, and may be arbitrarily combined, changed, or selected as necessary without departing from the spirit of the present invention. It can be done.
　Ａ　　受け入れ部
　Ｂ１、Ｂ２、Ｂ３、Ｂ４　　個片化部
　Ｃ　　払い出し部
　Ｄ　　洗浄部
　Ｅ　　検査部
　Ｓ１、Ｓ２、Ｓ３、Ｓ４　　個片化装置
　１　　基本ユニット
　２　　プレステージ
　３　　封止済基板
　４　　切断用テーブル
　５　　切断用ステージ
　６　　スピンドルモータ
　７　　回転刃（切削機構）
　８　　トレイ
　９　　集合体
　１０　　洗浄機構
　１１　　洗浄ローラ
　１２　　検査用テーブル
　１３　　検査用ステージ
　１４　　カメラ
　１５　　ウォータージェットユニット A Receiving part B1, B2, B3, B4 Dividing part C Dispensing part D Cleaning part E Inspection part S1, S2, S3, S4 Dividing apparatus 1 Basic unit 2 Prestage 3 Sealed substrate 4 Cutting table 5 Cutting Stage 6 Spindle Motor 7 Rotary Blade (Cutting Mechanism)
8 tray 9 assembly 10 cleaning mechanism 11 cleaning roller 12 inspection table 13 inspection stage 14 camera 15 water jet unit

Claims (9)

  1. 　基板に設けられた複数の領域に各々装着されたチップを樹脂封止することによって形成された封止済基板を領域毎に個片化することによって複数の電子部品を製造する際に使用され、封止済基板を受け入れる受け入れ部と、封止済基板を切断して個片化する又は割断によって個片化するために封止済基板を部分的に切削する個片化部と、該個片化部で加工された複数の電子部品を払い出す払い出し部とを備える電子部品製造用の個片化装置であって、
    　前記受け入れ部と前記払い出し部の間に前記個片化部が複数設けられ、
    　前記複数の個片化部の各々は他の個片化部、前記受け入れ部又は前記払い出し部に対して着脱可能かつ交換可能であることを特徴とする電子部品製造用の個片化装置。     It is used when manufacturing a plurality of electronic components by separating a sealed substrate formed by resin-sealing a chip mounted in each of a plurality of regions provided on the substrate, for each region, A receiving part for receiving the sealed substrate, a singulated part that cuts the sealed substrate into pieces or cuts the sealed substrate partially in order to divide into pieces, and the pieces A singulation device for manufacturing electronic components, comprising a payout unit for paying out a plurality of electronic components processed by the conversion unit,
    A plurality of the singulation parts are provided between the receiving part and the payout part,
    Each of the plurality of individualized parts is detachable and replaceable with respect to another individualized part, the receiving part or the payout part.
  2. 　請求項１に記載された電子部品製造用の個片化装置において、
    　前記複数の個片化部は回転刃、レーザ光、ウォータージェット、ワイヤソー、又はバンドソーのうちいずれかを使用する切削機構を各々有するとともに、
    　前記複数の個片化部が各々有する切削機構は同じ種類のものであることを特徴とする電子部品製造用の個片化装置。     The singulation apparatus for manufacturing an electronic component according to claim 1,
    The plurality of individualized parts each have a cutting mechanism that uses any of a rotary blade, laser light, water jet, wire saw, or band saw,
    An individualizing device for manufacturing an electronic component, wherein the plurality of individualizing portions have the same type of cutting mechanism.
  3. 　請求項１に記載された電子部品製造用の個片化装置において、
    　前記複数の個片化部は回転刃、レーザ光、ウォータージェット、ワイヤソー、又はバンドソーのうちいずれかを使用する切削機構を各々有するとともに、
    　前記複数の個片化部が各々有する切削機構のうち少なくとも１個の切削機構は他の切削機構とは異なる種類のものであることを特徴とする電子部品製造用の個片化装置。     The singulation apparatus for manufacturing an electronic component according to claim 1,
    The plurality of individualized parts each have a cutting mechanism that uses any of a rotary blade, laser light, water jet, wire saw, or band saw,
    An individualizing device for manufacturing an electronic component, wherein at least one of the cutting mechanisms included in each of the plurality of individualized parts is of a different type from the other cutting mechanisms.
  4. 　請求項３に記載された電子部品製造用の個片化装置において、
    　前記複数の個片化部のうち少なくとも１個の個片化部は曲線又は折れ線に沿って封止済基板を加工するものであることを特徴とする電子部品製造用の個片化装置。     In the singulation apparatus for manufacturing an electronic component according to claim 3,
    An individualization apparatus for manufacturing electronic parts, wherein at least one individualization part among the plurality of individualization parts processes a sealed substrate along a curved line or a broken line.
  5. 　請求項１～４のいずれかに記載された電子部品製造用の個片化装置において、
    　前記複数の個片化部のうち少なくとも１個の個片化部は仕上げ加工を目的とするものであることを特徴とする電子部品製造用の個片化装置。     The singulation apparatus for manufacturing an electronic component according to any one of claims 1 to 4,
    An individualizing apparatus for manufacturing an electronic component, wherein at least one individualizing part among the plurality of individualizing parts is for finishing.
  6. 　基板に設けられた複数の領域に各々装着されたチップを樹脂封止することによって形成された封止済基板を領域毎に個片化することによって複数の電子部品を製造する際に使用され、封止済基板を受け入れる工程と、複数の個片化部を各々使用して、封止済基板を切断して個片化する又は割断によって個片化するために封止済基板を部分的に切削する加工工程と、前記個片化部で加工された複数の電子部品を払い出す工程とを備える電子部品製造用の個片化方法であって、
    　前記加工工程では、前記複数の個片化部が各々有する同じ種類の切削機構を使用して複数の封止済基板を各々加工することを特徴とする電子部品製造用の個片化方法。     It is used when manufacturing a plurality of electronic components by separating a sealed substrate formed by resin-sealing a chip mounted in each of a plurality of regions provided on the substrate, for each region, Receiving the sealed substrate, and using each of the plurality of singulation parts to cut the sealed substrate into pieces, or to partially separate the sealed substrate into pieces by cleaving An individualization method for manufacturing an electronic component comprising: a cutting step for cutting; and a step of dispensing a plurality of electronic components processed by the individualization unit,
    In the processing step, a plurality of sealed substrates are each processed using the same type of cutting mechanism that each of the plurality of individualized parts has, and the individualized method for manufacturing an electronic component is characterized in that:
  7. 　基板に設けられた複数の領域に各々装着されたチップを樹脂封止することによって形成された封止済基板を領域毎に個片化することによって複数の電子部品を製造する際に使用され、封止済基板を受け入れる工程と、複数の個片化部を各々使用して、封止済基板を切断して個片化する又は割断によって個片化するために封止済基板を部分的に切削する加工工程と、前記個片化部で加工された複数の電子部品を払い出す工程とを備える電子部品製造用の個片化方法であって、
    　前記加工工程では、前記複数の個片化部が各々有する切削機構のうち少なくとも１個の切削機構であって他の切削機構とは異なる種類の切削機構と他の切削機構とを順次使用して封止済基板を加工することを特徴とする電子部品製造用の個片化方法。     It is used when manufacturing a plurality of electronic components by separating a sealed substrate formed by resin-sealing a chip mounted in each of a plurality of regions provided on the substrate, for each region, Receiving the sealed substrate, and using each of the plurality of singulation parts to cut the sealed substrate into pieces, or to partially separate the sealed substrate into pieces by cleaving An individualization method for manufacturing an electronic component comprising: a cutting step for cutting; and a step of dispensing a plurality of electronic components processed by the individualization unit,
    In the machining step, at least one of the cutting mechanisms included in each of the plurality of singulated portions, and a cutting mechanism of a different type from the other cutting mechanisms and another cutting mechanism are sequentially used. A method for singulation for manufacturing an electronic component, characterized by processing a sealed substrate.
  8. 　請求項７に記載された電子部品製造用の個片化方法において、
    　前記加工工程は、前記複数の個片化部のうち少なくとも１個の個片化部を使用して曲線又は折れ線に沿って封止済基板を加工する工程と、前記複数の個片化部のうち他の個片化部を使用して直線に沿って封止済基板を加工する工程とを有することを特徴とする電子部品製造用の個片化方法。     The singulation method for manufacturing an electronic component according to claim 7,
    The processing step includes a step of processing a sealed substrate along a curved line or a polygonal line using at least one individualized portion of the plurality of individualized portions, and the plurality of individualized portions. And a step of processing the sealed substrate along a straight line using another individualized portion.
  9. 　請求項７に記載された電子部品製造用の個片化方法において、
    　前記加工工程は、前記複数の個片化部のうち少なくとも１個の個片化部を使用して仕上げ加工を行う工程を有することを特徴とする電子部品製造用の個片化方法。     The singulation method for manufacturing an electronic component according to claim 7,
    The said process step has the process of performing a finishing process using at least 1 piece separation part among said several piece division parts, The piece separation method for electronic component manufacture characterized by the above-mentioned.
PCT/JP2009/002585 2008-06-13 2009-06-09 Separating device and separating method for electronic component manufacture WO2009150821A1 (en)

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US9065031B2 (en) 2010-07-23 2015-06-23 Sharp Kabushiki Kaisha Light-emitting device with liquid-repellent layer and manufacturing method therefore
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JP2009302323A (en) 2009-12-24
JP5511154B2 (en) 2014-06-04

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