WO2009150821A1 - Dispositif de séparation et procédé de séparation pour la fabrication de composants électroniques - Google Patents

Dispositif de séparation et procédé de séparation pour la fabrication de composants électroniques Download PDF

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Publication number
WO2009150821A1
WO2009150821A1 PCT/JP2009/002585 JP2009002585W WO2009150821A1 WO 2009150821 A1 WO2009150821 A1 WO 2009150821A1 JP 2009002585 W JP2009002585 W JP 2009002585W WO 2009150821 A1 WO2009150821 A1 WO 2009150821A1
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WO
WIPO (PCT)
Prior art keywords
manufacturing
singulation
individualized
sealed substrate
parts
Prior art date
Application number
PCT/JP2009/002585
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English (en)
Japanese (ja)
Inventor
東秀和
森澤匡史
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to KR1020117000658A priority Critical patent/KR101930496B1/ko
Priority to CN2009801206225A priority patent/CN102047399A/zh
Publication of WO2009150821A1 publication Critical patent/WO2009150821A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Definitions

  • the present invention relates to an individualizing device and an individualizing method for manufacturing electronic components, which are used when a plurality of electronic components are manufactured by dividing a sealed substrate having a plurality of regions into regions. It is about.
  • FIG. 5 (1) is a perspective view schematically showing a sealed substrate as an object to be singulated from the substrate side
  • FIG. 5 (2) is an example of a sealed substrate
  • 5 (3) is a plan view showing another example of a sealed substrate as viewed from the sealing resin side
  • FIG. 5 (4) shows a memory card as an example of a separated sealed substrate.
  • FIG. 5 in order to make it easy to understand, any figure included in this application document is schematically omitted or exaggerated as appropriate.
  • the sealed substrate 91 has a substrate 92 made of a lead frame, a printed circuit board, or the like, and a sealing resin 93 formed on one surface of the substrate 92.
  • the substrate 92 is divided into a plurality of lattice-shaped regions 96 by a boundary line 94 in the X direction and a boundary line 95 in the Y direction, which are virtually provided.
  • Each region 96 is mounted with a chip-like component (not shown) made of one or more semiconductor chips.
  • chip-like components hereinafter referred to as “chips” are respectively attached to a plurality of regions 96 provided on the substrate 92.
  • the plurality of chips mounted on the substrate 92 are collectively sealed with a sealing resin 93.
  • the sealed substrate 91 is completed.
  • the sealed substrate 91 is cut along the boundary lines 94 and 95.
  • the sealed substrate 91 is divided into a plurality of electronic components respectively corresponding to the regions 96.
  • the separated electronic component having the sealing resin 93 is often called a package (see, for example, Patent Document 1).
  • the singulation apparatus has three basic components.
  • the three components are a receiving part that receives the sealed substrate formed in the previous process (resin sealing process), a separate part that separates the sealed substrate, and a separate part. It is a paying-out part which carries out the formed several electronic components (package) to the following process (for example, packaging process) (for example, refer patent document 1).
  • each component described above and each component in Patent Document 1 generally correspond as follows.
  • the “substrate loading part A” in Patent Document 1 corresponds to the receiving part
  • the “cutting mechanism C” corresponds to the singulation part
  • the “package housing part F” corresponds to the dispensing part.
  • the substrate 92 By the way, in recent years, there is a tendency for the substrate 92 to become larger due to the demand for lower prices for electronic components. In addition, due to a demand for miniaturization and the like, the number of electronic components that can be removed from one substrate 92, that is, the number of regions 96 tends to increase (see FIG. 5B). Further, the sealed substrate 91 is roughly divided into blocks due to a demand for warpage prevention in the sealed substrate 91, and a plurality of regions 96 in each block and a sealing provided independently for each block. In some cases, a plurality of island-shaped portions 97 made of the resin 93 are formed on the sealed substrate 91 (see FIG. 5 (3)). As described above, in recent years, the specifications of the sealed substrate 91 are various.
  • the base material of the substrate 92 is a metal material, a composite material (such as glass epoxy) composed of a thermosetting resin and a glass cloth base (or glass nonwoven base), or a film material (polyimide) composed of a soft resin. Film) and the like, and various materials such as ceramic materials having high hardness but brittleness.
  • the specifications of the sealing resin 93 are various. Specifically, as the sealing resin 93, an epoxy resin containing silica fine particles as a filler and having a high hardness of the resin itself, or a silicone resin having a low hardness and high adhesiveness to a rotary blade is used. Yes.
  • the boundary lines of the regions 96 of the substrate 92 that is, the boundary lines 94 and 95 that are lines for cutting the sealed substrate 91 are It was only a straight line.
  • the planar shape is basically a rectangle (in other words, the planar shape is a rectangle as a schematic shape)
  • the sealed substrate which has the boundary line containing at least any one of a curve or a broken line has appeared by this.
  • the memory card 98 shown in FIG. 5 (4) is an example of a package having a bent portion 99 including a curved line or a broken line.
  • a broken line here means the line produced
  • the sealed substrate 91 is cut by a dicer along a straight side of the outer shape of the memory card 98.
  • the sealed substrate is cut along the side including the bent portion 99 in the outer shape of the memory card 98 by a cutting device using laser light, water jet, or the like.
  • two types of cutting devices having different cutting mechanisms are used to cut a side composed of a straight line and a side including the bent portion 99, respectively.
  • the applicant of the present application proposed an individualizing device provided with two pieces of the same kind of individualizing parts corresponding to an increase in the number of electronic parts to be taken on one substrate 92.
  • a singulation apparatus in which two different singulation parts are provided corresponding to a package including a curved line or a polygonal line in an outer shape in plan view has been proposed.
  • the singulation is usually performed by completely cutting (full cut) the sealed substrate.
  • individualization is also performed by partially cutting (half-cutting) the sealed substrate and then cleaving (breaking). Therefore, the term “cutting” is appropriately used as a term for dividing the sealed substrate into pieces, instead of “cutting”.
  • the specifications of the sealed substrate and the package are various, and the specifications required by the user are also various. If it is attempted to change or add to the individualization unit as appropriate in order to meet such various demands, the conventional individualization device will take time for such work, and the productivity of the package will be reduced. There was a problem.
  • the problem to be solved by the present invention is that when a user's required specification is changed, the individualization unit can be assembled, changed, added and removed in a short time according to the required specification. Is to provide a device.
  • an singulation apparatus for manufacturing an electronic component according to the present invention includes: When manufacturing a plurality of electronic components by separating a sealed substrate (3) formed by resin-sealing chips respectively mounted in a plurality of regions provided on the substrate into regions.
  • An individualizing device for manufacturing electronic parts comprising: an individualizing part that partially cuts and a payout part (C) that pays out a plurality of electronic parts processed by the individualizing part, A plurality of the singulated portions are provided between the receiving portion (A) and the payout portion (C), Each of the plurality of individualized parts is detachable and replaceable with respect to another individualized part, the receiving part (A) or the payout part (C).
  • the singulation apparatus for manufacturing an electronic component according to the present invention is the above-described singulation apparatus,
  • the plurality of individualized parts each have a cutting mechanism that uses any of a rotary blade (7), laser light, water jet, wire saw, or band saw,
  • the cutting mechanisms that each of the plurality of singulation parts has are of the same type.
  • the singulation apparatus for manufacturing an electronic component according to the present invention is the above-described singulation apparatus,
  • the plurality of individualized parts each have a cutting mechanism that uses any of a rotary blade (7), laser light, water jet, wire saw, or band saw, At least one cutting mechanism among the cutting mechanisms that each of the plurality of individualized parts has is different from other cutting mechanisms.
  • the singulation apparatus for manufacturing an electronic component according to the present invention is the above-described singulation apparatus, At least one individualized part among the plurality of individualized parts is for processing the sealed substrate (3) along a curved line or a broken line.
  • the singulation apparatus for manufacturing an electronic component according to the present invention is the above-described singulation apparatus, At least one individualized part among the plurality of individualized parts is intended for finishing.
  • the method for individualizing the electronic component manufacturing according to the present invention is as follows.
  • a method for singulating an electronic component comprising: a step of partially cutting the sealed substrate (3); and a step of dispensing a plurality of electronic components processed by the singulated portion.
  • the plurality of sealed substrates (3) are each processed using the same type of cutting mechanism that each of the plurality of individualized parts has.
  • the method for individualizing the electronic component manufacturing according to the present invention is as follows.
  • a method for singulating an electronic component comprising: a step of partially cutting the sealed substrate (3); and a step of dispensing a plurality of electronic components processed by the singulated portion.
  • the machining step at least one of the cutting mechanisms included in each of the plurality of singulated portions, and a cutting mechanism of a different type from the other cutting mechanisms and another cutting mechanism are sequentially used.
  • the sealed substrate (3) is processed.
  • the processing step includes a step of processing the sealed substrate (3) along a curved line or a broken line using at least one of the plurality of individualized portions, and the plurality of individual pieces. And a step of processing the sealed substrate along a straight line using another singulated portion of the singulated portion.
  • the method for singulation for manufacturing an electronic component according to the present invention is the above-described singulation method,
  • the processing step includes a step of performing a finishing process using at least one individualized part among the plurality of individualized parts.
  • each of the plurality of individualized parts is detachable and replaceable with respect to the other individualized parts, the receiving part (A) or the payout part (C).
  • the user's required specifications are changed, the following can be easily realized in a short time.
  • it can be changed to an individualized part having a desired cutting mechanism in place of the installed individualized part according to the required specifications.
  • the required specifications in addition to the mounted individualized parts, it is possible to add individualized parts having a desired cutting mechanism. 3rdly, the separation part which became unnecessary can be removed.
  • the cutting mechanism used by each of the plurality of individualized parts may be the same type.
  • segmentation part which has the same kind of cutting mechanism can be expanded. Therefore, an increase in the processing capability of the singulation apparatus can be easily realized.
  • At least one cutting mechanism among cutting mechanisms used by each of the plurality of singulated parts may be of a different type from other cutting mechanisms.
  • the optimal processing means can be selected and used according to the shape and material of the processing part.
  • at least one of the plurality of singulated parts may cut the sealed substrate (3) along a curved line or a broken line.
  • At least one of the plurality of individualized parts may be intended for finishing.
  • the process for individualization and finishing can be performed by one unitization apparatus.
  • FIG. 1 is a schematic plan view showing a singulation apparatus for manufacturing an electronic component according to Embodiment 1 of the present invention.
  • FIG. 2 is a schematic plan view showing a singulation apparatus for manufacturing an electronic component according to Embodiment 2 of the present invention.
  • FIG. 3 is a schematic plan view showing a singulation apparatus for manufacturing an electronic component according to Embodiment 3 of the present invention.
  • FIG. 4 is a schematic plan view showing a singulation apparatus for manufacturing an electronic component according to Embodiment 4 of the present invention.
  • FIG. 5 (1) is a perspective view schematically showing a sealed substrate as an object to be singulated from the substrate side
  • FIG. 5 (2) is an example of a sealed substrate.
  • 5 (3) is a plan view showing another example of the sealed substrate as viewed from the sealing resin side
  • FIG. 5 (4) is a plan view showing the memory card.
  • the electronic component singulation device (S1) includes a receiving part (A), an individualization part (B1, B2), and a payout part (C).
  • Each of the singulation parts (B1, B2) has a rotary blade (7) as a cutting mechanism, and each of the singulation parts (B1, B2) or other component receiving part (A) or It is detachable with respect to the payout part (C), and is appropriately selected according to the user's required specifications for assembly / change / addition / removal.
  • the cutting mechanism of the individualized parts (B1, B2) is not limited to the one using the rotary blade (7), and may use a water jet, a laser beam, a wire saw, or a band saw. Different cutting mechanisms may be used for the individualized parts (B1, B2). For example, the cutting mechanism of one piece part (B1) may use a water jet, and the cutting mechanism of the other piece part (B2) may use a rotary blade (7).
  • FIG. 1 is a schematic plan view showing a singulation apparatus for manufacturing an electronic component according to the present embodiment.
  • the singulation apparatus S1 shown in FIG. 1 is an singulation apparatus that divides a sealed substrate into a plurality of electronic components.
  • the singulation apparatus S1 includes a receiving unit A, a singulation unit B1, a singulation unit B2, and a payout unit C as components (modules).
  • a plurality of (two in FIG. 1) individualized parts that is, an individualized part B1 and an individualized part B2 are provided between the receiving part (A) and the payout part (C).
  • the receiving part A, the individualized part B1, the individualized part B2, and the payout part C are configured to be detachable and replaceable with respect to other components.
  • each of the receiving unit A, the individualized unit B1, the individualized unit B2, and the payout unit C is prepared in advance so as to have a plurality of different specifications according to the expected required specifications.
  • the basic unit 1 is configured to include the receiving portion A, the singulated portion B1, the singulated portion B2, and the payout portion C.
  • a prestage 2 is provided in the receiving part A.
  • a sealed substrate 3 conveyed from a resin sealing device that is a device in the previous process is received.
  • This sealed substrate 3 corresponds to the sealed substrate 91 shown in FIG.
  • the sealed substrate 3 is disposed on the prestage 2 with the sealing resin 93 side shown in FIG.
  • the sealed substrate 3 is aligned as necessary.
  • chips are mounted in a plurality of lattice-shaped regions, and the plurality of chips are collectively sealed with resin. Yes.
  • Each cutting unit B1, B2 is provided with a cutting table 4 respectively.
  • the cutting table 4 is movable in the Y direction in the figure and is rotatable in the ⁇ direction.
  • a cutting stage 5 is attached on the cutting table 4.
  • Two spindle motors 6 are provided in the inner part of each of the individualized parts B1 and B2. In each of the singulation parts B1 and B2, the two spindle motors 6 can move independently in the X direction.
  • a rotary blade 7 is attached to each of the two spindle motors 6. Each of these rotary blades 7 cuts the sealed substrate 3 into individual pieces by rotating in a plane along the Y direction. Therefore, in the present embodiment, the cutting mechanism using the rotary blade 7 is provided in each of the individualized part B1 and the individualized part B2.
  • a tray 8 is provided in the payout part C.
  • the tray 8 accommodates an assembly 9 composed of a plurality of electronic components separated into individual pieces B1 and B2 from the cutting stage 5 via a main transport mechanism (not shown). Then, the plurality of electronic components respectively accommodated in the tray 8 are delivered from the delivery unit C and conveyed to the next process (for example, an inspection process).
  • the main transport mechanism (not shown) is located at a position that is commonly applied to each component, that is, the receiving portion A, the separating portion B1, the separating portion B2, and the dispensing portion C. Is provided. In FIG. 1, this position is indicated by an arrow (thick solid line arrow) extending rightward along the X direction.
  • the individualized part B1 is configured to be detachable and replaceable with respect to other components, that is, the receiving part A and the individualized part B2.
  • the singulation part B2 is configured to be detachable and replaceable with respect to other components, that is, the singulation part B1 and the payout part C.
  • a cutting mechanism other than the rotary blade 7 may be used in the individualized part B1 and the individualized part B2.
  • the same kind of cutting mechanism can also be used in each piece part.
  • cutting using either a laser beam, a water jet (with or without use with an abrasive), a wire saw, a band saw, or the like is performed in both the individualized part B1 and the individualized part B2.
  • a mechanism can be selected and used.
  • the rotary blade 7 or the individualized portion B2 A cutting mechanism having a band saw may be used.
  • a cutting mechanism using a laser beam, a water jet, or a wire saw is used in the individualized part B1 and the individualized part B2. Use it.
  • a payout unit C having various components can be employed.
  • a payout unit C having a mechanism for storing a plurality of electronic components in a tray, a mechanism for storing the electronic components in a tube, a mechanism for transferring and carrying out the bulk as it is, and the like can be employed.
  • the sealed substrate 3 is received in the receiving part A.
  • the sealed substrate 3 is transferred to the separation part B1, the sealed substrate 3 is cut into pieces by the rotary blade 7. During this time, after receiving the next sealed substrate 3 in the receiving portion A and transferring the sealed substrate 3 to the individualized portion B2, the sealed substrate 3 is rotated by the rotary blade 7 of the individualized portion B2. Cut into pieces. Thereby, the sealed substrate 3 can be separated into pieces by the rotary blade 7 in each of the separated parts B1 and B2.
  • the assembly 9 composed of a plurality of electronic components separated in the individualization part B1 is accommodated in the tray 8 from the cutting stage 5 via the main transport mechanism (not shown). Thereafter, the assembly 9 is transported from the tray 8 to the next process (for example, an inspection process).
  • the assembly 9 composed of a plurality of electronic components separated in the individualization part B2 is accommodated in the tray 8 from the cutting stage 5 via the main transport mechanism (not shown). Thereafter, the assembly 9 is transported from the tray 8 to the next process.
  • the individual blades B1 and B2 are cut into separate sealed substrates 3 by the rotary blades 7 respectively. And can be singulated.
  • a process when individualizing the sealed substrate 3 to use a plurality of individualization units in parallel is performed. The ability is greatly improved.
  • the singulation apparatus S1 for manufacturing electronic parts are as follows. First, the singulation device S1 is provided with a plurality of singulation parts B1 and B2 having the same type of cutting mechanism. Second, the singulation units B1 and B2 are prepared in advance so as to have different types of specifications according to the expected required specifications. Third, the individualized parts B1 and B2 are detachable and replaceable with respect to other components.
  • the singulation device is assembled using the singulation parts B1, B2,.
  • the singulation apparatus S1 having the optimum singulation units B1, B2,... According to the required specifications and demands of a certain user is realized in a short time.
  • the individualized portions B1 and B2 can be provided with additional individualized portions, or the individualized portions B1. , B2 can be removed from the individualized part.
  • the singulation device corresponding to the increase or decrease in demand is realized in a short time.
  • the singulation device since a part unnecessary for the user is not included in the individualizing device, it is possible to reduce the footprint and cost of the individualizing device.
  • This specification may be, for example, an abrasive grain size or a rotational speed.
  • the abrasive grain size of the rotary blade 7 included in the singulated part B1 is set to a specification suitable for substrate cutting, and the abrasive grain size of the rotary blade 7 included in the singulated part B2 is specified to be suitable for cutting sealing resin.
  • substrate can be cut using the rotary blade 7 which the singulation part B1 has, and sealing resin can be cut using the rotary blade 7 which the singulation part B2 has after that. Therefore, the sealed substrate 3 is singulated under optimum processing conditions for each processing portion by using different rotary blades 7 having optimum specifications corresponding to each of the substrate constituting the sealed substrate 3 and the sealing resin. can do.
  • the specifications relating to the rotary blades 7 respectively included in the individualized parts B1 and B2 may be different for each individualized part.
  • the abrasive grain size of the rotary blade 7 of the individualized part B1 used earlier is suitable for rough cutting and the abrasive grain size of the rotary blade 7 of the individualized part B2 used later is used.
  • the optimum individual piece is obtained by exchanging the individualized parts B1, B2,... With individualized parts having different specifications in accordance with changes in market trends, technological trends, etc. Can be realized.
  • the individualized parts B1, B2,... That use a cutting mechanism having a rotary blade 7 are used. What is necessary is just to replace
  • the newly installed individualized part there is an individualized part using a laser beam, a water jet, or a wire saw.
  • all or part of the individualized parts B1, B2,... May be replaced with individualized parts that use laser light, or may be replaced with individualized parts that use a water jet. It may be replaced with an individualized part using a wire saw.
  • FIG. 2 is a schematic plan view showing the singulation apparatus for manufacturing an electronic component according to the present embodiment.
  • the singulation apparatus S ⁇ b> 2 for manufacturing an electronic component according to this embodiment includes a receiving unit A, singulation units B ⁇ b> 1 and B ⁇ b> 2, a cleaning unit D, an inspection unit E, and a dispensing unit C. And each as a component (module).
  • the singulation device S2 is configured by providing a cleaning unit D and an inspection unit E between the singulation unit B2 and the dispensing unit C in the singulation device S1 shown in FIG. .
  • a main transport mechanism (not shown) is provided at a position that is commonly applied to the receiving part A, the singulation parts B1 and B2, the cleaning part D, and the payout part C among the constituent elements. .
  • the cleaning unit D and the inspection unit E are configured to be detachable and replaceable with respect to other components.
  • each of the cleaning unit D and the inspection unit E is prepared in advance so as to have a plurality of different specifications according to expected required specifications.
  • the cleaning unit D is provided with a cleaning mechanism 10.
  • the cleaning mechanism 10 is provided with a cleaning roller 11 made of a water-absorbing material such as a sponge so as to be rotatable about an axis along the Y direction.
  • a water tank (not shown) is provided below the cleaning roller 11. The cleaning roller 11 rotates in a state where the water stored in the water tank is sucked.
  • an assembly 9 composed of a plurality of electronic components (packages) formed by cutting the sealed substrate 3 is disposed above the cleaning mechanism 10.
  • the assembly 9 is adsorbed and fixed by a main transport mechanism (not shown) on the substrate side surface (the front side surface of the paper in the figure).
  • the assembly 9 is adsorbed and fixed on the surface of the substrate 92 shown in FIG.
  • the assembly 9 attracted and fixed by the main transport mechanism moves from the left to the right in the figure.
  • the surface of the assembly 9 on the side of the sealing resin comes into contact with the cleaning roller 11 that rotates while sucking water.
  • the surface of the assembly 9 on the sealing resin side is cleaned.
  • air preferably hot air
  • the inspection unit E is provided with an inspection table 12, and the inspection table 12 is rotatable in the ⁇ direction.
  • An inspection stage 13 is attached on the inspection table 12.
  • a plurality of cleaned electronic components are transferred to the inspection stage 13 from a sub-transport mechanism (not shown) branched from the main transport mechanism that holds and fixes the assembly 9 composed of a plurality of electronic components.
  • the movement path of the sub transport mechanism between the cleaning unit D and the inspection unit E is indicated by a thick solid arrow along the Y direction.
  • the inspection unit E is a part that performs an appearance inspection of the electronic component. And in the back part of the test
  • the camera 14 is movable in the X direction and the Y direction.
  • the inspection unit E is provided with a control unit (not shown).
  • the control unit performs image processing based on a still image of the electronic component received from the camera 14, and compares the obtained image data with previously stored data to determine whether the electronic component is a good product or a defective product. It is determined whether it is. And a control part memorizes data (what is called map data) about a good article and a defective article in aggregate 9 as needed.
  • an assembly 9 composed of a plurality of electronic components separated into individual parts B, cleaned in the cleaning part D, and inspected by the inspection part E is provided in the cleaning part Housed from the D side via a main transport mechanism (not shown).
  • a main transport mechanism not shown
  • the control unit not shown
  • only non-defective products out of the electronic components stored in the tray 8 are conveyed to the next process (for example, a packaging process). Further, defective products are accommodated in a defective product tray (not shown).
  • the singulation apparatus S2 having the optimum singulation parts B1, B2,..., The cleaning part D, and the inspection part E is manufactured in a short time.
  • the optimum singulation apparatus S2 corresponding to the increase or decrease in demand is realized in a short time.
  • the cleaning unit D may perform cleaning using, for example, steam or a cleaning agent instead of cleaning using the cleaning roller 11 and water.
  • the inspection unit E for example, a current inspection or the like may be performed instead of the appearance inspection (optical inspection).
  • FIG. 3 is a schematic plan view showing the singulation apparatus for manufacturing the electronic component according to the present embodiment.
  • the singulation apparatus S3 for manufacturing electronic components according to the present embodiment differs from the singulation apparatus S2 of the second embodiment in the following points. That is, a plurality of individualized parts are constituted by an individualized part B2 and an individualized part B3 having different types of specifications.
  • an individualized part B3 that uses a water jet by a cutting mechanism is mounted.
  • a water jet unit 15 is provided in the singulation part B3.
  • part containing a curve, a broken line, etc. can be cut
  • the sealed substrate 3 is received in the receiving portion A.
  • the sealed substrate 3 is transferred to the singulation part B3. Thereafter, the water jet unit 15 is used to cut the sides of the sealed substrate 3 including curved lines, broken lines, and the like.
  • the sealed substrate 3 is transferred to the separation part B2. After that, the rotary blade 7 is used to cut a side formed by a straight line in the sealed substrate 3.
  • the sealed substrate 3 is formed using different types of cutting mechanisms according to the characteristics of the sealed substrate 3.
  • the sealed substrate 3 is separated into pieces by cutting sequentially. Therefore, the sealed substrate 3 can be separated into pieces using a plurality of optimum cutting mechanisms according to the characteristics of the sealed substrate 3 using a single singulation device.
  • the individualized part B1 shown in FIG. 1 is replaced with an individualized part B3 using a water jet, thereby being used for manufacturing a package having a rectangular planar shape.
  • the singulation device S1 (see FIG. 1) can be changed to the singulation device S3 suitable for manufacturing a memory card in a short time.
  • the singulation unit B3 may be replaced with a singulation unit that uses laser light. Moreover, you may replace
  • the specifications regarding the cutting mechanism used by the individualized parts B3 and B2 may be different for each individualized part.
  • a substance generated by melting the sealing resin may adhere to the part cut (fused) by using laser light. It can be removed by using a water jet. Thereby, finishing can be performed using a water jet by the individualized part B2 used later. Therefore, the cutting quality can be improved.
  • FIG. 4 is a schematic plan view showing a singulation apparatus for manufacturing an electronic component according to the present embodiment.
  • the singulation apparatus S4 for manufacturing an electronic component according to the present embodiment has three singulation parts B3, B4, and B2.
  • the individualized parts B3 and B4 have the same type of cutting mechanism, for example, a cutting mechanism that uses a water jet.
  • the singulation part B2 has two spindle motors 6 to which the rotary blades 7 are attached. And since each singulation part is detachable and replaceable with respect to the other singulation part, the receiving part A or the payout part C, the number of singulation parts B3 and B4 having the water jet unit 15 is set.
  • the operation of increasing / decreasing or increasing / decreasing the number of separated parts B2 having two spindle motors 6 can be performed in a short time.
  • the side including the curved line and the broken line is cut by the two individualized parts B3 and B4 each having the water jet unit 15, and the straight part is formed by the individualized part B2 having the rotary blade 7.
  • the edge can be cut.
  • specifications and numbers can be changed in a short time for the singulation unit that cuts a side including a curved line, a broken line, and the like and the singulation unit that cuts a side consisting of a straight line. Therefore, it is possible to adjust the ability to cut a side including a curved line or a broken line and the ability to cut a side made of a straight line in a short time.
  • the two singulation parts B3 and B4 using the water jet can be replaced with two singulation parts using the laser beam.
  • the two singulation parts B3 and B4 can be replaced with two singulation parts using a wire saw.
  • the positions of the individualized parts B3 and B4 that use the water jet and the individualized part B2 that uses the rotary blade 7 can be exchanged.
  • the number of singulation parts using the water jet can be one, and the number of singulation parts using the rotary blade 7 can be two.
  • the specifications regarding the water jet used by the individualized parts B3 and B4 may be different for each individualized part.
  • This specification may be, for example, the abrasive grain size or the pressure of the processing water.
  • the abrasive grain size of the water jet of the individualized part B3 used earlier is set to a specification suitable for cutting the substrate, and the abrasive grain size of the water jet of the individualized part B4 used later is sealed.
  • another inspection unit can be attached to the inspection unit E in accordance with the user's required specifications, and another inspection for the package can be performed by the other inspection unit.
  • another inspection an electric current inspection, an appearance inspection on the surface opposite to the surface to be inspected by the inspection unit E, or the like can be adopted.
  • the sealed substrate may be separated by completely cutting (full cut) the sealed substrate at the individualized portion, the sealed substrate is partially separated at the individualized portion. May be cut (half cut) and then cleaved in subsequent steps. This cleaving may be performed by an individualizing device or may be performed by another device in a subsequent process.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Dicing (AREA)

Abstract

Des sections de séparation d'un dispositif de séparation, qui est utilisé pour séparer des substrats scellés pour fabriquer des composants électroniques, peuvent être assemblées, modifiées, ajoutées, ou retirées rapidement conformément à des spécifications demandées par un utilisateur. Un dispositif de séparation de composants électroniques (S1) est équipé d'une section de réception (A), de sections de séparation (B1, B2) et d'une section de distribution (C). Les sections de séparation (B1, B2) comportent chacune une lame rotative (7) en tant que mécanisme de coupe, et chacune peut être fixée à ou détachée d'une autre section de séparation (B1, B2), ou d'une section de réception (A) ou d'une section de distribution (C), qui sont les autres composants, et peut être assemblée, modifiée, ajoutée, ou retirée de manière sélective pour satisfaire à des spécifications demandées par un utilisateur. Le mécanisme de coupe des sections de séparation (B1, B2) n'est pas limité aux lames rotatives (7), et un jet d'eau, un faisceau laser, une scie à fil ou une scie à bande pourrait être utilisé. Les mécanismes de coupe des sections de séparation (B1, B2) peuvent être différents. Par exemple, le mécanisme de coupe de la section de séparation (B1) peut utiliser un jet d'eau, et le mécanisme de coupe de la section de séparation (B2) peut utiliser une lame rotative (7).
PCT/JP2009/002585 2008-06-13 2009-06-09 Dispositif de séparation et procédé de séparation pour la fabrication de composants électroniques WO2009150821A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020117000658A KR101930496B1 (ko) 2008-06-13 2009-06-09 전자부품 제조용 개편화장치 및 개편화방법
CN2009801206225A CN102047399A (zh) 2008-06-13 2009-06-09 电子部件制造用的切片装置及切片方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008155555A JP5511154B2 (ja) 2008-06-13 2008-06-13 電子部品製造用の個片化装置及び個片化方法
JP2008-155555 2008-06-13

Publications (1)

Publication Number Publication Date
WO2009150821A1 true WO2009150821A1 (fr) 2009-12-17

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JP (1) JP5511154B2 (fr)
KR (1) KR101930496B1 (fr)
CN (1) CN102047399A (fr)
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WO (1) WO2009150821A1 (fr)

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US9065031B2 (en) 2010-07-23 2015-06-23 Sharp Kabushiki Kaisha Light-emitting device with liquid-repellent layer and manufacturing method therefore
JP6235391B2 (ja) * 2014-03-27 2017-11-22 Ｔｏｗａ株式会社 検査用治具、切断装置及び切断方法
JP6333650B2 (ja) * 2014-07-18 2018-05-30 Ｔｏｗａ株式会社 切断装置及び切断方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003092305A (ja) * 2001-09-17 2003-03-28 Towa Corp 電子部品の樹脂封止成形装置
JP2003152005A (ja) * 2001-11-19 2003-05-23 Towa Corp 半導体素子の樹脂封止成形装置
JP2003209130A (ja) * 2002-01-17 2003-07-25 Towa Corp 電子部品の樹脂成形方法及び装置
JP2004207424A (ja) * 2002-12-25 2004-07-22 Towa Corp 基板の切断方法及び装置
JP2005085790A (ja) * 2003-09-04 2005-03-31 Towa Corp 基板の切断方法及び装置
JP2005190077A (ja) * 2003-12-25 2005-07-14 Towa Corp 処理装置及び処理装置用プログラム供給方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003092305A (ja) * 2001-09-17 2003-03-28 Towa Corp 電子部品の樹脂封止成形装置
JP2003152005A (ja) * 2001-11-19 2003-05-23 Towa Corp 半導体素子の樹脂封止成形装置
JP2003209130A (ja) * 2002-01-17 2003-07-25 Towa Corp 電子部品の樹脂成形方法及び装置
JP2004207424A (ja) * 2002-12-25 2004-07-22 Towa Corp 基板の切断方法及び装置
JP2005085790A (ja) * 2003-09-04 2005-03-31 Towa Corp 基板の切断方法及び装置
JP2005190077A (ja) * 2003-12-25 2005-07-14 Towa Corp 処理装置及び処理装置用プログラム供給方法

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CN102047399A (zh) 2011-05-04
KR20110028349A (ko) 2011-03-17
TWI524402B (zh) 2016-03-01
TW201007831A (en) 2010-02-16
KR101930496B1 (ko) 2018-12-19
JP2009302323A (ja) 2009-12-24
JP5511154B2 (ja) 2014-06-04

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