CN116435236A - Substrate processing system and substrate processing method - Google Patents

Substrate processing system and substrate processing method Download PDF

Info

Publication number
CN116435236A
CN116435236A CN202310366231.3A CN202310366231A CN116435236A CN 116435236 A CN116435236 A CN 116435236A CN 202310366231 A CN202310366231 A CN 202310366231A CN 116435236 A CN116435236 A CN 116435236A
Authority
CN
China
Prior art keywords
substrate
section
frame
unit
conveying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310366231.3A
Other languages
Chinese (zh)
Inventor
田村武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN116435236A publication Critical patent/CN116435236A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

A substrate processing system is provided with: an ultraviolet irradiation section for irradiating ultraviolet rays to a protective tape protecting the substrate; a mounting unit for mounting the substrate to a frame via an adhesive tape provided on a side opposite to the protective tape after ultraviolet irradiation with respect to the substrate; and a peeling section that peels the protective tape from the substrate attached to the frame via the adhesive tape, wherein the ultraviolet irradiation section is provided so as to overlap the attachment section in a vertical direction of the attachment section.

Description

Substrate processing system and substrate processing method
The present application is a divisional application of the invention patent application with the application date of 2018, 8, 15, 201880054597.4 and the invention name of the substrate processing system and the substrate processing method. The priority of the japanese prior application JP2017-163600 is claimed, with priority date being 28 of 2017, 8.
Technical Field
The present disclosure relates to a substrate processing system and a substrate processing method.
Background
In recent years, in order to cope with the demands for downsizing and weight saving of semiconductor devices, elements, circuits, terminals, and the like have been formed on the 1 st main surface of a substrate such as a semiconductor wafer, and then the 2 nd main surface of the substrate on the opposite side from the 1 st main surface has been ground, whereby the substrate has been thinned. Slicing is performed after or before the thinning.
During the processing such as thinning and dicing, the 1 st main surface of the substrate is protected by a protective tape. As the protective tape, a protective tape whose adhesive force is reduced by irradiation of ultraviolet rays is used. After the adhesive force is lowered, the protective tape can be simply peeled from the substrate by a peeling operation.
After irradiating ultraviolet rays to the protective tape and before peeling the protective tape from the substrate, the substrate is mounted to the frame via an adhesive tape different from the protective tape. The adhesive tape is attached to the frame so as to cover the opening of the annular frame, and is bonded to the 2 nd main surface of the substrate at the opening of the frame.
The apparatus of patent document 1 includes: a processing unit for grinding the back surface of the wafer; a UV irradiation section for irradiating ultraviolet rays to a protective tape protecting a surface of a wafer; a mounting unit for mounting the wafer on the frame via an adhesive tape attached to the back surface of the wafer; and a peeling section for peeling the protective tape from the wafer.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2002-343756
Disclosure of Invention
Problems to be solved by the invention
One aspect of the present disclosure provides a technique capable of reducing an installation area of a substrate processing system when viewed in a vertical direction.
For solving the problems ofScheme (1)
A substrate processing system according to an aspect of the present disclosure includes:
an ultraviolet irradiation section for irradiating ultraviolet rays to a protective tape protecting the substrate;
a mounting unit for mounting the substrate to a frame via an adhesive tape provided on a side opposite to the protective tape after ultraviolet irradiation with respect to the substrate; and
a peeling part peeling the protective tape from the substrate mounted on the frame via the adhesive tape,
the ultraviolet irradiation portion is provided so as to overlap the mounting portion in a vertical direction of the mounting portion.
ADVANTAGEOUS EFFECTS OF INVENTION
According to an aspect of the present disclosure, the installation area of the substrate processing system when viewed in the vertical direction can be reduced.
Drawings
Fig. 1 is a perspective view showing a substrate before being processed by a substrate processing system according to an embodiment.
Fig. 2 is a perspective view showing a substrate processed by the substrate processing system according to the embodiment.
Fig. 3 is a plan view showing a substrate processing system according to an embodiment.
Fig. 4 is a view showing a slicing section according to an embodiment.
Fig. 5 is a diagram showing a rough grinding section of a thinned section according to an embodiment.
Fig. 6 is a view showing an ultraviolet irradiation section according to an embodiment.
Fig. 7 is a diagram showing an attachment portion according to an embodiment.
Fig. 8 is a diagram showing a peeling section according to an embodiment.
Fig. 9 is a diagram showing an ID attaching unit according to an embodiment.
Fig. 10 is a flowchart showing a substrate processing method according to an embodiment.
Fig. 11 is a plan view showing a main part of a substrate processing system according to an embodiment.
Fig. 12 is a side view showing an attachment portion according to an embodiment, and an ultraviolet irradiation portion and a delivery portion provided above the attachment portion so as to overlap the attachment portion.
Fig. 13 is a side view showing a peeling portion and an ID attaching portion provided above the peeling portion so as to overlap the peeling portion according to an embodiment.
Fig. 14 is a diagram showing the operation of the 2 nd sub-conveying section according to one embodiment.
Fig. 15 is a side view showing a peeling portion and an ID attaching portion provided above the peeling portion so as to overlap the peeling portion in modification 1.
Fig. 16 is a plan view showing a main part of a substrate processing system according to modification 2.
Detailed Description
Embodiments of the present disclosure will be described below with reference to the drawings. In the drawings, the same or corresponding structures are denoted by the same or corresponding reference numerals, and description thereof is omitted. In the following description, the X direction, the Y direction, and the Z direction are directions perpendicular to each other, the X direction and the Y direction are horizontal directions, and the Z direction is a vertical direction. The rotation direction about the vertical axis as the rotation center is also referred to as θ direction. In the present specification, the lower side refers to the lower side in the vertical direction, and the upper side refers to the upper side in the vertical direction.
Fig. 1 is a perspective view showing a substrate before being processed by a substrate processing system according to an embodiment. The substrate 10 is, for example, a semiconductor substrate, a sapphire substrate, or the like. The 1 st main surface 11 of the substrate 10 is divided by a plurality of traces formed in a lattice shape, and elements, circuits, terminals, and the like are formed in advance in the divided regions. The substrate 10 is divided along a plurality of tracks formed in a lattice shape, and chips 13 (see fig. 2) are obtained.
A protective tape 14 is attached to the 1 st main surface 11 of the substrate 10. The protective tape 14 protects the 1 st main surface 11 of the substrate 10 during processing such as dicing and thinning, and protects components, circuits, terminals, and the like formed in advance on the 1 st main surface 11. The protective tape 14 covers the entire 1 st main surface 11 of the substrate 10.
The protective tape 14 is composed of a sheet-like base material and an adhesive applied to the surface of the sheet-like base material. The adhesive may be one which cures upon irradiation with ultraviolet rays to reduce the adhesive force. The protective tape 14 can be simply peeled from the substrate 10 by a peeling operation after the adhesive force is reduced.
Fig. 2 is a perspective view showing a substrate processed by the substrate processing system according to the embodiment. The substrate 10 is cut into pieces and thinned, and then mounted on a frame 19 via an adhesive tape 18. The protective tape 14 shown in fig. 1 can be peeled off and removed from the substrate 10.
The adhesive tape 18 is composed of a sheet-like substrate and an adhesive applied to the surface of the sheet-like substrate. The adhesive tape 18 is attached to the frame 19 so as to cover the opening of the annular frame 19, and is bonded to the substrate 10 at the opening of the frame 19. This allows the substrate 10 to be conveyed while holding the frame 19, and thus allows the substrate 10 to be handled more easily.
As shown in fig. 2, a DAF (Die Attach Film) 15 may be provided between the adhesive tape 18 and the substrate 10. DAF15 is an adhesive sheet for die bonding. DAF15 is used for lamination of chips 13 and the like. DAF15 may have any of conductivity and insulation.
The DAF15 is formed smaller than the opening of the frame 19 and is provided inside the frame 19. The DAF15 covers the entire 2 nd main surface 12 of the substrate 10. In addition, in the case where the chips 13 are not stacked, the DAF15 is not required, and therefore, the substrate 10 may be mounted on the frame 19 only via the adhesive tape 18.
Fig. 3 is a plan view showing a substrate processing system according to an embodiment. In fig. 3, the in-feed cassette 35 and the out-feed cassette 45 are cut away to illustrate the inside of the in-feed cassette 35 and the inside of the out-feed cassette 45. In fig. 3, arrows show the moving directions of the substrate 10 and the frame 19 at the mounting portion 500, the peeling portion 600, and the like.
The substrate processing system 1 performs various processes such as dicing of the substrate 10, thinning of the substrate 10, irradiation of ultraviolet rays to the protective tape 14, mounting of the substrate 10, peeling of the protective tape 14 from the substrate 10, and pasting of an ID to the frame 19.
The substrate processing system 1 includes: the control unit 20, the feeding unit 30, the feeding unit 40, the main conveying path 50, the main conveying unit 58, and various processing units. The processing unit is not particularly limited, and includes, for example, a dicing unit 100, a thinning unit 200, an ultraviolet irradiation unit 400, a mounting unit 500, a peeling unit 600, and an ID attaching unit 700.
The control unit 20 is constituted by, for example, a computer, and includes: a CPU (Central Processing Unit: central processing unit) 21, a storage medium 22 such as a memory, an input interface 23, and an output interface 24. The control unit 20 performs various controls by causing the CPU21 to execute a program stored in the storage medium 22. The control unit 20 receives a signal from the outside through the input interface 23, and transmits a signal to the outside through the output interface 24.
The program of the control unit 20 is stored in and loaded from an information storage medium. Examples of the information storage medium include a Hard Disk (HD), a Flexible Disk (FD), an optical disk (CD), a magneto-optical disk (MO), and a memory card. The program may be downloaded from a server via the internet and installed.
The loading unit 30 loads the loading cassette 35 accommodating the substrate 10 before processing from the outside. The feed cassette 35 accommodates a plurality of substrates 10 before being attached to the frame 19 via, for example, the adhesive tape 18, with a space therebetween in the Z direction.
The feed cassette 35 has a plurality of horizontally arranged paired storage plates 36 at intervals in the Z direction to store a plurality of substrates 10 at intervals in the Z direction. As shown in fig. 3, the paired storage plates 36 support both end portions of the substrate 10 in the Y direction.
The feeding cassette 35 may also horizontally house the substrate 10 with the protective tape 14 facing upward, so as to suppress deformation such as tilting of the protective tape 14. The substrate 10 taken out from the loading cassette 35 is turned upside down and then transported to a processing unit such as the dicing unit 100.
The loading unit 30 includes a loading plate 31 on which the loading cassette 35 is loaded. The mounting plate 31 is provided in a plurality in a row in the Y direction. The number of the mounting plates 31 is not limited to the number shown in the figure.
The delivery unit 40 is configured to deliver the delivery cassette 45 accommodating the processed substrate 10 to the outside. The feed cassette 45 accommodates a plurality of substrates 10 mounted on the frame 19 via, for example, the adhesive tape 18 at intervals in the Z direction.
The feed cassette 45 has a plurality of pairs of storage plates 46 arranged horizontally at intervals in the Z direction to store a plurality of substrates 10 at intervals in the Z direction. As shown in fig. 3, the pair of receiving plates 46 support both ends of the frame 19 in the Y direction.
The delivery unit 40 includes a mounting plate 41 on which the delivery cassette 45 is mounted. The plurality of mounting plates 41 are provided in a row in the Y direction. The number of the mounting plates 41 is not limited to the number shown in the figure.
The main transport path 50 is a path through which the main transport section 58 transports the substrate 10 with respect to the carry-in section 30, the carry-out section 40, and the plurality of processing sections, and extends in the Y direction, for example. The main conveyance path 50 is provided with a Y-axis guide 51 extending in the Y-direction, and the Y-axis slider 52 is movable along the Y-axis guide 51.
The main conveying section 58 holds the substrate 10 and moves along the main conveying path 50 to convey the substrate 10. The main transport section 58 may hold the substrate 10 via the frame 19. The main transport section 58 vacuum-sucks the substrate 10 and the frame 19, but may electrostatically suck the substrate 10 and the frame 19. The main conveying section 58 includes a Y-axis slider 52 or the like as a conveying base, and moves in the Y direction. The main conveying unit 58 is movable not only in the Y direction but also in the X direction, the Z direction, and the θ direction.
The main transport section 58 may have a plurality of holding sections for holding the substrate 10. The plurality of holding portions are arranged at intervals in the Z direction. The plurality of holding portions may be used differently depending on the processing stage of the substrate 10.
For example, the main conveying section 58 includes: a 1 st holding portion for taking out the substrate 10 from the carry-in cassette 35; and a 2 nd holding portion for conveying the substrate 10 having reduced strength by processing such as dicing and thinning. The 2 nd holding portion may be used to convey the substrate 10 before being mounted on the frame 19. In this case, the main conveying portion 58 may further have a 3 rd holding portion for conveying the substrate 10 mounted after the frame 19. The 3 rd holding portion holds the substrate 10 via the frame 19.
The feeding section 30, the feeding section 40, and the plurality of processing sections are provided adjacent to the main conveyance path 50 when viewed in the vertical direction. For example, the longitudinal direction of the main conveyance path 50 is set to the Y direction. The feeding portion 30 and the discharging portion 40 are provided adjacently on one side (left side in fig. 3, hereinafter also referred to as "front side") in the X direction of the main conveying path 50. The slicing unit 100, the thinning unit 200, the peeling unit 600, and the ID attaching unit 700 are provided adjacently on the opposite side (right side in fig. 3, hereinafter also referred to as "rear side") of the main conveyance path 50 in the X direction. The peeling part 600 and the ID attaching part 700 are laminated in the Z direction, and the ID attaching part 700 is provided above the peeling part 600 so as to overlap the peeling part 600. Further, a mounting portion 500 is provided adjacent to one end portion of the main conveyance path 50 in the Y direction. The mounting portion 500 and the ultraviolet irradiation portion 400 are stacked in the Z direction, and the ultraviolet irradiation portion 400 is provided above the mounting portion 500 so as to overlap the mounting portion 500.
According to the present embodiment, the feeding section 30 and the plurality of processing sections are provided adjacent to the main conveying path 50. Therefore, the main transport section 58 can transfer the substrate 10 to and from the carry-in section 30 and the plurality of processing sections. This allows the main conveying unit 58 to be multifunctional, thereby increasing the amount of work of the main conveying unit 58 and improving the utilization rate of the main conveying unit 58.
Further, according to the present embodiment, the delivery portion 40 is also provided adjacent to the main conveying path 50. Therefore, the main conveying section 58 can convey the substrate 10 to the delivery section 40. This allows the main conveying unit 58 to be further multifunctional, thereby further increasing the amount of work of the main conveying unit 58 and further improving the utilization rate of the main conveying unit 58. Further, since the delivery unit 40 and the plurality of processing units are provided adjacent to the main conveyance path 50, when an abnormality occurs in the substrate 10 in one processing unit, the abnormal substrate 10 can be promptly conveyed to the delivery unit 40 without being conveyed to another processing unit.
The arrangement and the number of the processing units are not limited to those shown in fig. 3, and may be arbitrarily selected. The plurality of processing units may be arranged in a dispersed or combined manner in arbitrary units. The following describes each processing unit.
Fig. 4 is a view showing a slicing section according to an embodiment. The dicing section 100 is used for dicing the substrate 10. In the present specification, dicing of the substrate 10 refers to processing for dividing the substrate 10 into a plurality of chips 13, and dividing the substrate 10 includes forming a division start point on the substrate 10. The slicing unit 100 includes, for example: a dicing table 110, a substrate processing section 120, and a moving mechanism section 130.
The dicing table 110 holds the substrate 10 via the protective tape 14. For example, the dicing stage 110 horizontally holds the substrate 10 with the 2 nd main surface 12 of the substrate 10 facing upward. As the dicing table 110, for example, a vacuum chuck is used, but an electrostatic chuck or the like may be used.
The substrate processing section 120 performs dicing of the substrate 10 held by the dicing table 110, for example. The substrate processing section 120 includes, for example, a laser oscillator 121 and an optical system 122 for irradiating the substrate 10 with laser light from the laser oscillator 121. The optical system 122 is configured by a condensing lens or the like that condenses the laser beam from the laser oscillator 121 toward the substrate 10.
The moving mechanism 130 moves the dicing table 110 and the substrate processing section 120 relatively. The moving mechanism 130 is configured by, for example, an xyzθ table that moves the dicing table 110 in the X direction, the Y direction, the Z direction, and the θ direction.
The control unit 20 controls the substrate processing unit 120 and the moving mechanism unit 130 to slice the substrate 10 along the trace of the substrate 10. As shown in fig. 4, the modified layer 2 serving as a starting point of fracture may be formed inside the substrate 10, or a laser processing groove may be formed on a laser irradiation surface (for example, an upper surface in fig. 4) of the substrate 10. The laser processing groove may penetrate the substrate 10 in the plate thickness direction or may not penetrate the substrate 10.
When the modified layer 2 is formed inside the substrate 10, a laser beam having transparency to the substrate 10 is used. The modified layer 2 is formed by, for example, locally melting and solidifying the inside of the substrate 10. On the other hand, in the case of forming a laser processing groove on the laser irradiation surface of the substrate 10, a laser beam having absorbability with respect to the substrate 10 is used.
In the present embodiment, the substrate processing unit 120 has the laser oscillator 121 for irradiating the substrate 10 with laser light, but may have a cutting blade for cutting the substrate 10, or may have a scribe line for forming a scribe line on the surface of the substrate 10.
In the present embodiment, the dicing section 100 is provided as a part of the substrate processing system 1, but may be provided outside the substrate processing system 1. In this case, after the substrate 10 is sliced, it is fed from the outside to the feeding unit 30, taken out from the feeding cassette 35 in the feeding unit 30, and fed to the thinning unit 200 instead of the slicing unit 100.
The thinning portion 200 (see fig. 3) is for thinning the substrate 10 by processing the 2 nd main surface 12 of the sliced substrate 10 on the opposite side of the 1 st main surface 11 protected by the protective tape 14.
When the dicing section 100 forms the start point of division, a processing stress is applied to the substrate 10 by the thinning section 200, and the crack progresses from the start point of division in the thickness direction, thereby dividing the substrate 10 into the plurality of chips 13.
In the case where the modified layer 2 is formed in the substrate 10 by the dicing section 100, the substrate 10 is thinned by the thinning section 200, and the modified layer 2 is removed.
For example, as shown in fig. 3, the thinning unit 200 includes: turntable 201, chuck table 202, rough grinding section 210, finish grinding section 220, and damaged layer removing section 230.
The turntable 201 rotates around the center line of the turntable 201. A plurality of (for example, four in fig. 3) chuck tables 202 are arranged at equal intervals around the rotation center line of the turntable 201.
The plurality of chuck tables 202 rotate together with the turntable 201 about the center line of the turntable 201. The center line of the turntable 201 is vertical. Each time the turntable 201 rotates, the chuck table 202 facing the rough grinding section 210, the finish grinding section 220, and the damaged layer removing section 230 is changed.
Each chuck table 202 holds the substrate 10 via the protective tape 14. Chuck table 202 holds substrate 10 horizontally with 2 nd major surface 12 of substrate 10 facing upward. As the chuck table 202, for example, a vacuum chuck is used, but an electrostatic chuck or the like may be used.
Fig. 5 is a diagram showing a rough grinding section of a thinned section according to an embodiment. The rough grinding section 210 is used for rough grinding of the substrate 10. For example, as shown in fig. 5, the rough grinding part 210 has a rotary grinding stone 211. The rotary grindstone 211 rotates around its center line and descends, and processes the upper surface (i.e., the 2 nd main surface 12) of the substrate 10 held by the chuck table 202.
The refining unit 220 is used for refining the substrate 10. The structure of the finish grinding section 220 is substantially the same as that of the rough grinding section 210. The average particle diameter of the abrasive grains of the rotary grindstone of the finish grinding section 220 is smaller than the average particle diameter of the abrasive grains of the rotary grindstone of the rough grinding section 210.
The damaged layer removing portion 230 is for removing a damaged layer formed on the 2 nd main surface 12 of the substrate 10 by grinding such as rough grinding, finish grinding, or the like. For example, the damaged layer removing portion 230 supplies a processing liquid to the substrate 10 and performs a wet etching process to remove the damaged layer. The method for removing the damaged layer is not particularly limited.
The thinning portion 200 may have a polishing portion for polishing the substrate 10. The structure of the polishing section is substantially the same as that of the rough polishing section 210. Examples of polishing of the substrate 10 include CMP (Chemical MechanicalPolishing: chemical mechanical polishing). The thinned portion 200 may have a defect removing portion that forms a defect removing portion (e.g., crystal defect or strain) for capturing impurities. The number of chuck tables 202 is four in fig. 3, but may be changed as appropriate according to the number of kinds of processing. Further, one processing unit (for example, the damaged layer removing unit 230) may perform a plurality of types of processing (for example, damaged layer removal and defect removal formation).
Fig. 6 is a view showing an ultraviolet irradiation section according to an embodiment. The ultraviolet irradiation section 400 irradiates ultraviolet rays to the protective tape 14, and the protective tape 14 protects the substrate 10 which has been sliced and thinned. The adhesive of the protective tape 14 can be cured by irradiation of ultraviolet rays, and the adhesive force of the protective tape 14 can be reduced. After the adhesive force is reduced, the protective tape 14 can be simply peeled from the substrate 10 by a peeling operation.
The ultraviolet irradiation section 400 has a UV lamp 410 inside a case into which the substrate 10 protected by the protective tape 14 is fed. The UV lamp 410 irradiates ultraviolet rays to the protective tape 14 from the opposite side of the protective tape 14 from the substrate 10 as a reference.
Fig. 7 is a diagram showing an attachment portion according to an embodiment. In fig. 7, a two-dot chain line shows a state after the adhesive tape 18 and the DAF15 are mounted. The mounting portion 500 mounts the substrate 10 on the frame 19 via the adhesive tape 18 provided on the opposite side of the protective tape 14 from the substrate 10 after ultraviolet irradiation. The adhesive tape 18 is attached to the frame 19 so as to cover the opening of the annular frame 19, and is bonded to the substrate 10 at the opening of the frame 19.
The mounting unit 500 may mount the substrate 10, which has been cut into pieces and thinned, to the frame 19 only by the adhesive tape 18, but in fig. 7, the substrate 10 is mounted to the frame 19 by the adhesive tape 18 and the DAF15 stacked in advance. The DAF15 is formed smaller than the opening of the frame 19 and is provided inside the frame 19. The DAF15 covers the entire 2 nd main surface 12 of the substrate 10.
The mounting portion 500 includes, for example: a mounting table 510 for holding the substrate 10 and the frame 19; and a laminating roller 520 for attaching the substrate 10 to the frame 19 held by the mounting table 510 via the adhesive tape 18.
The mounting table 510 holds the frame 19 and the substrate 10 disposed in the opening of the frame 19 in parallel. The frame 19 and the substrate 10 may be held horizontally. The upper surface of the frame 19 and the upper surface of the substrate 10 may have a height difference therebetween to the same extent as the thickness of the DAF 15. In addition, in the case where the DAF15 is not used, the upper surface of the frame 19 and the upper surface of the substrate 10 may be disposed on the same plane.
The adhesive tape 18 and the like are supplied in a state wound around the core, and are pulled out from the core to be used. The adhesive tape 18 is laminated on the substrate 10 while being closely adhered to the laminating roller 520 by tension and passing between the laminating roller 520 and the substrate 10. The adhesive tape 18 is laminated on the frame 19 while being closely adhered to the laminating roller 520 by tension and passing between the laminating roller 520 and the frame 19.
As shown in fig. 7, the mounting portion 500 sequentially bonds the adhesive tape 18 to the frame 19 and the substrate 10 from one end side to the other end side of the frame 19. This can suppress the entry of air and the like. In addition, since the substrate 10 is held flat during the bonding of the adhesive tape 18 to the substrate 10, breakage of the substrate 10 can be suppressed.
Fig. 8 is a diagram showing a peeling section according to an embodiment. In fig. 8, the two-dot chain line shows a state before the protective tape 14 is peeled off. The peeling section 600 peels the protective tape 14 from the substrate 10 mounted on the frame 19 via the adhesive tape 18. The unnecessary protective tape 14 can be removed. The peeling section 600 includes, for example, a peeling table 610 and a peeling roller 620.
The protective tape 14 is peeled from the substrate 10 while being closely adhered to the peeling roller 620 by tension and passing between the peeling roller 620 and the substrate 10. During this time, the peeling stage 610 holds the substrate 10 and the frame 19 flat by means of the adhesive tape 18 or the like. The protective tape 14 peeled from the substrate 10 is wound around a winding core, not shown.
As shown in fig. 8, the peeling section 600 peels the protective tape 14 from the substrate 10 while sequentially deforming the protective tape from one end side toward the other end side of the substrate 10. This enables smooth separation between the protective tape 14 and the substrate 10. Further, since the substrate 10 is held flat during the peeling between the protective tape 14 and the substrate 10, breakage of the substrate 10 can be suppressed.
The separation section 600 may separate the protective tape 14 from the substrate 10 in parallel.
Fig. 9 is a diagram showing an ID attaching unit according to an embodiment. The ID-joining unit 700 reads the identification information 16 (see fig. 2) of the substrate 10 from which the protective tape 14 has been peeled, prints the read identification information 16 on the label 17 (see fig. 2), and joins the printed label 17 to the frame 19. The identification information 16 is information for identifying the substrate 10, and is represented by a number, a character, a symbol, a one-dimensional code, a two-dimensional code, or the like.
The ID attaching unit 700 includes, for example: an ID paste station 710, a reading device 720, and a label printing device 730. The ID attaching stage 710 holds the substrate 10 and the frame 19 via an adhesive tape 18 or the like. The reading device 720 is used for reading the identification information 16 formed on the substrate 10 in advance. The label printing apparatus 730 prints the identification information 16 read by the reading apparatus 720 on the label 17, and attaches the printed label 17 to the frame 19 by a laminator or the like. The identification information 16 printed on the label 17 and the identification information 16 formed in advance on the substrate 10 may represent the same content in different forms as shown in fig. 2.
Next, a substrate processing method using the substrate processing system 1 having the above-described configuration will be described. Fig. 10 is a flowchart showing a substrate processing method according to an embodiment.
As shown in fig. 10, the substrate processing method includes: a feeding step S101, a dicing step S102, a thinning step S103, an ultraviolet irradiation step S104, an attachment step S105, a peeling step S106, an ID bonding step S107, and a feeding step S108. These steps are performed under the control of the control unit 20. The order of these steps is not limited to the order shown in fig. 10. For example, the slicing step S102 may be performed after the thinning step S103.
In the carry-in step S101, the main transport section 58 takes out the substrate 10 from the carry-in cassette 35 disposed in the carry-in section 30, and transports the taken-out substrate 10 to the dicing section 100.
In the dicing step S102, as shown in fig. 4, the dicing section 100 performs dicing of the substrate 10. During dicing of the substrate 10, the 1 st main surface 11 of the substrate 10 is protected by the protective tape 14. The substrate 10 sliced in the slicing unit 100 is transported to the thinning unit 200 by the main transport unit 58.
In the thinning process S103, as shown in fig. 5, the thinning unit 200 performs processing on the 2 nd main surface 12 of the substrate 10, thereby thinning the substrate 10. During the thinning of the substrate 10, the 1 st main surface 11 of the substrate 10 is protected by the protective tape 14. The substrate 10 thinned by the thinning unit 200 is conveyed to the delivery unit 300 described later by the main conveying unit 58, and then the substrate 10 is conveyed to the ultraviolet irradiation unit 400 by the 1 st sub-conveying unit 910 described later.
In the ultraviolet irradiation step S104, as shown in fig. 6, the ultraviolet irradiation section 400 irradiates the protective tape 14 with ultraviolet rays. The adhesive of the protective tape 14 can be cured by irradiation of ultraviolet rays, and the adhesive force of the protective tape 14 can be reduced. After the adhesive force is reduced, the protective tape 14 can be simply peeled from the substrate 10 by a peeling operation.
The ultraviolet irradiation step S104 may be performed after the mounting step S105, but is performed before the mounting step S105 in the present embodiment. This can prevent the adhesive tape 18 attached to the substrate 10 in the mounting step S105 from being degraded by ultraviolet irradiation. The substrate 10 with the protective tape 14 irradiated with ultraviolet light by the ultraviolet light irradiation section 400 is transported to the mounting section 500 by a 1 st sub-transport section 910 described later.
In the mounting step S105, as shown in fig. 7, the mounting portion 500 mounts the substrate 10, which has been cut into pieces and thinned, on the frame 19 via the adhesive tape 18. The mounting unit 500 may mount the substrate 10, which has been cut into pieces and thinned, to the frame 19 only by the adhesive tape 18, but in the present embodiment, the substrate 10 is mounted to the frame 19 by the adhesive tape 18 and the DAF15 stacked in advance. The substrate 10 mounted on the frame 19 by the adhesive tape 18 in the mounting portion 500 is transported to the peeling portion 600 by a 2 nd sub-transport portion 920 described later.
In the peeling step S106, as shown in fig. 8, the peeling part 600 peels off the protective tape 14 from the substrate 10 mounted on the frame 19 via the adhesive tape 18 by the mounting part 500. The unnecessary protective tape 14 can be removed. The substrate 10 having the protective tape 14 peeled at the peeling section 600 is conveyed to the ID pasting section 700 by a 3 rd sub-conveying section 930 described later.
In the ID attaching step S107, as shown in fig. 9, the ID attaching unit 700 reads the identification information 16 (see fig. 2) formed in advance on the substrate 10, prints the read identification information 16 on the label 17 (see fig. 2), and attaches the printed label 17 to the frame 19.
In the feeding step S108, the main transport section 58 transports the substrate 10 from the ID attaching section 700 to the feeding section 40, and the feeding section 40 accommodates the substrate 10 in the feeding cassette 45. The delivery cassette 45 is delivered from the delivery unit 40 to the outside. The substrate 10 that is sent out together with the send-out cassette 45 to the outside is picked up in units of chips 13. Thus, the chip 13 is manufactured.
Fig. 11 is a plan view showing a main part of a substrate processing system according to an embodiment.
Fig. 12 is a side view showing an attachment portion according to an embodiment, and an ultraviolet irradiation portion and a delivery portion provided above the attachment portion so as to overlap the attachment portion. Fig. 13 is a side view showing a peeling portion and an ID attaching portion provided above the peeling portion so as to overlap the peeling portion according to an embodiment. In fig. 11 to 13, arrows show the moving directions of the substrate 10 and the frame 19 at the mounting portion 500, the peeling portion 600, and the like.
The substrate processing system 1 includes a mounting unit 500. As shown in fig. 12, the mounting portion 500 includes, for example: a mount 510, a laminating roller 520, a mount guide 530, a frame supply unit 540, and a frame conveying unit 550.
As shown in fig. 11, the mount guide 530 extends in the X direction, and a pair is provided at an interval in the Y direction. The mount 510 is movable along a pair of mount guides 530. As a driving source for moving the mount 510, for example, a servomotor is used.
As shown in fig. 12, a laminating roller 520 is provided above the rear end of the mount guide 530, and a frame supply unit 540 is provided below the front end of the mount guide 530. The frame supply unit 540 is a member for feeding the frame box 541 accommodating the frame 19 before the mounting substrate 10 from the outside. The frame cassette 541 accommodates a plurality of frames 19 in a row in the Z direction. The frame 19 may be assembled to the frame supply unit 540 by an operator without the frame cassette 541. The frame 19 may be assembled to the frame supply unit 540 in a plurality of pieces each time.
As shown in fig. 3, the feeding portion 30 and the discharging portion 40 are provided on one side (front side) in the width direction of the main conveying path 50, and the mounting portion 500 may be provided adjacent to one end in the length direction of the main conveying path 50. In this case, as shown in fig. 12, the frame cassette 541 may be fed from the front side to the frame supply unit 540. The articles before treatment (substrate 10, frame 19) are fed in from the front side, and the articles after treatment (frame 19 on which substrate 10 is mounted) are fed out from the front side. The article feeding and discharging can be concentrated on the front side, and maintenance and conveying efficiency can be improved.
The frame conveying unit 550 takes out the frame 19 from the frame cassette 541 arranged in the frame supplying unit 540, and places the taken-out frame 19 on the mounting table 510. The frame conveying section 550 is disposed between a pair of mount guides 530, for example, when viewed in the Z direction, and is movable in the Z direction. As a driving source for moving the frame conveying unit 550, a servo motor or the like is used, for example.
The frame conveying portion 550 has an adsorbing portion 559 for adsorbing the frame 19. The suction units 559 are provided at intervals in the X direction, for example, and suction both ends of the frame 19 in the X direction. The suction portion 559 has a suction hole. The gas of the suction hole is sucked by a suction source such as a vacuum pump. When the suction source is operated, a negative pressure is generated in the suction portion 559, and the frame transfer portion 550 vacuum-sucks the frame 19. On the other hand, the vacuum suction of the frame 19 is released by stopping the operation of the suction source and opening the suction hole to the atmosphere by the frame conveying unit 550. Positive pressure may be generated in the frame conveying unit 550 when the vacuum suction is released. In the present specification, negative pressure means a pressure lower than atmospheric pressure, and positive pressure means a pressure higher than atmospheric pressure.
At the end of the mount guide 530 on the main conveyance path 50 side (front side), the mount 510 acquires the frame 19 from the frame conveyance unit 550. Specifically, first, the frame conveying unit 550 is raised from the position shown by the solid line in fig. 12 to the position shown by the two-dot chain line in fig. 12, and passes between the pair of mount guides 530 provided at intervals in the Y direction in the Z direction. At this time, the mount 510 stands by at the retracted position where the frame conveying unit 550 is not prevented from ascending. After that, when the mount table 510 is moved directly below the frame conveying unit 550, the frame conveying unit 550 is lowered, and the frame 19 held by the frame conveying unit 550 is placed on the mount table 510.
Thereafter, the mounting table 510 is moved away from the main transport path 50 in the X direction (rear side), and the substrate 10 is acquired from the 1 st sub-transport section 910 described below while being moved directly below the laminating roller 520. The substrate 10 is disposed at the opening of the frame 19, and the mounting table 510 holds the substrate 10 via the protective tape 14.
Thereafter, the mount 510 is further moved in the X direction (rear side) so as to be away from the main conveyance path 50, and is moved directly below the laminating roller 520. As shown in fig. 7, the laminating roller 520 bonds the adhesive tape 18 to the frame 19 placed on the mounting table 510 and the substrate 10 disposed at the opening of the frame 19. The adhesive tape 18 is provided on the opposite side (upper side) of the protective tape 14 with respect to the substrate 10.
The substrate processing system 1 includes an ultraviolet irradiation section 400. As shown in fig. 11 and 12, the ultraviolet irradiation section 400 is provided above the mounting section 500 so as to overlap the mounting section 500. For example, the ultraviolet irradiation section 400 is provided so as to overlap with the pair of mount guides 530 when viewed in the Z direction.
Since the ultraviolet irradiation section 400 and the mounting section 500 are laminated in the Z direction, the installation area of the substrate processing system 1 when viewed in the Z direction can be reduced as compared with a case where the ultraviolet irradiation section 400 and the mounting section 500 are arranged in a lateral direction when viewed in the Z direction. In addition, the flow of transporting the substrate 10 from the ultraviolet irradiation section 400 to the mounting section 500 is preferable.
The substrate processing system 1 may include a delivery unit 300 for acquiring the sliced and thinned substrate 10 from the main transport unit 58 (see fig. 3). The delivery unit 300 acquires the substrate 10 from the main transport unit 58, and transfers the acquired substrate 10 to a 1 st sub-transport unit 910 described later.
The delivery portion 300 is provided adjacent to the main conveyance path 50 as shown in fig. 11, and is provided above the attachment portion 500 so as to overlap the attachment portion 500 as shown in fig. 12. For example, the delivery unit 300 is provided so as to overlap with the pair of mount guides 530 when viewed in the Z direction. In the case where the mounting portion 500 is provided adjacent to the Y-direction end of the main conveying path 50, the delivery portion 300 is also provided adjacent to the Y-direction end of the main conveying path 50.
Since the transfer portion 300 and the mounting portion 500 are stacked in the Z direction, the installation area of the substrate processing system 1 when viewed in the Z direction can be reduced as compared with a case where the mounting portion 500 and the transfer portion 300 are arranged in a lateral direction when viewed in the Z direction. The transfer section 300 can be disposed at the same height as the ultraviolet irradiation section 400, and the transfer section 300 can be disposed beside the ultraviolet irradiation section 400, so that the flow of transporting the substrate 10 from the transfer section 300 to the ultraviolet irradiation section 400 is preferable.
For example, as shown in fig. 11, the delivery portion 300, the ultraviolet irradiation portion 400, and the laminating roller 520 are arranged in this order from the front side to the rear side as viewed in the Z direction. Therefore, the flow of the substrate 10 from the delivery unit 300 to the mounting table 510 via the ultraviolet irradiation unit 400 can be optimized, and the transfer efficiency of the substrate 10 can be improved.
The delivery unit 300 may also serve as an alignment unit for acquiring information for positioning the mounting position of the substrate 10 with respect to the frame 19. Thus, for example, when the substrate 10 is displaced due to the transfer of the substrate 10 between the thinning unit 200 and the main conveying unit 58, the transfer of the substrate 10 between the main conveying unit 58 and the transfer unit 300, or the like, the positions of the substrate 10 in the X direction, the Y direction, and the θ direction can be corrected. The correction is performed so that the center of the opening of the frame 19 coincides with the center of the substrate 10, and so that the orientation of the substrate 10 with respect to the frame 19 is a predetermined orientation.
As shown in fig. 12, the interface 300 includes, for example: a transfer stage 310 for holding the substrate 10; an imaging unit 320 for imaging the image of the substrate 10 held by the transfer stage 310; and a rotation driving unit 330 for rotating the transfer table 310. As the transfer stage 310, for example, a vacuum chuck is used, but an electrostatic chuck or the like may be used. The imaging unit 320 is provided above the transfer table 310, for example, and images the substrate 10 from above the substrate 10 held by the transfer table 310. The rotation driving unit 330 changes the imaging position of the substrate 10 held by the transfer table 310 by rotating the transfer table 310.
The transfer unit 300 converts the image of the substrate 10 captured by the imaging unit 320 into an electrical signal and transmits the electrical signal to the control unit 20. The control unit 20 performs image processing on the image of the substrate 10 captured by the imaging unit 320, and detects the position of the substrate 10 held by the transfer table 310. As this detection method, a known method such as a method of matching a pattern (for example, a divided pattern) of the substrate 10 with a reference pattern, a method of determining the center point of the substrate 10 and the orientation of the substrate 10 from a plurality of points on the outer periphery of the substrate 10, and the like are used. The orientation of the substrate 10 is detected from the position of a notch or the like formed in the outer periphery of the substrate 10. Instead of recesses, alignment planes may also be used. Thus, the control unit 20 can grasp the position of the substrate 10 in the coordinate system fixed to the transfer table 310.
The θ -direction positioning of the substrate 10 is performed by, for example, rotating the transfer stage 310. On the other hand, the X-direction positioning of the substrate 10 and the Y-direction positioning of the substrate 10 are performed after the holding of the substrate 10 by the transfer table 310 is released, and the substrate 10 is transferred from the transfer section 300 to the mounting section 500 via the ultraviolet irradiation section 400. For example, the X-direction positioning of the substrate 10, the Y-direction positioning of the substrate 10 is performed when the 1 st sub-conveying unit 910, which will be described later, acquires the substrate 10 from the transfer table 310, or when the 1 st sub-conveying unit 910 transfers the substrate 10 to the mounting table 510. This positions the mounting position of the substrate 10 on the mounting table 510, and further positions the mounting position of the substrate 10 on the frame 19.
The substrate processing system 1 includes a peeling section 600. As shown in fig. 13, the peeling section 600 includes, for example: a peeling table 610, a peeling roller 620, and a peeling table guide 630.
As shown in fig. 11, the peeling table guides 630 extend in the X direction, and a pair is provided at a spacing in the Y direction. The peeling table 610 is movable along a pair of peeling table guides 630. As a driving source for moving the peeling table 610, for example, a servomotor is used.
As shown in fig. 13, the peeling stage 610 acquires the frame 19 from a 2 nd sub-conveying section 920 described later at the center portion in the X direction of the peeling stage guide 630. The substrate 10 is mounted on the frame 19 in advance by means of the adhesive tape 18. The peeling stage 610 holds the substrate 10 and the frame 19 via the adhesive tape 18.
Thereafter, the peeling table 610 moves away from the main conveyance path 50 in the X direction (rear side) and moves directly below the peeling roller 620. As shown in fig. 8, the peeling roller 620 sequentially deforms the protective tape 14 from one end side to the other end side of the substrate 10, and peels the protective tape from the substrate 10.
The substrate processing system 1 may include an ID attaching unit 700. As shown in fig. 11 and 13, the ID attaching part 700 is provided adjacent to the main conveying path 50. The main conveying unit 58 conveys the frame 19 to which the tag 17 is attached by the ID attaching unit 700 from the ID attaching unit 700 to the feeding unit 40, and stores the frame in the feeding cassette 45 disposed in the feeding unit 40.
As shown in fig. 11 and 13, the ID attaching portion 700 may be provided above the peeling portion 600 so as to overlap the peeling portion 600 in the substrate processing system 1. For example, the ID attaching section 700 is provided so as to overlap the pair of peeling table guides 630 when viewed in the Z direction.
Since the peeling section 600 and the ID attaching section 700 are laminated in the Z direction, the installation area of the substrate processing system 1 when viewed in the Z direction can be reduced as compared with a case where the peeling section 600 and the ID attaching section 700 are arranged in a lateral direction when viewed in the Z direction. In addition, the flow of transporting the substrate 10 from the peeling section 600 to the ID attaching section 700 is preferable.
As shown in fig. 11, the substrate processing system 1 may include: the main conveying unit 58 (see fig. 3), the 1 st sub conveying unit 910, the 2 nd sub conveying unit 920, and the 3 rd sub conveying unit 930. The main transport section 58 transports the substrate 10 from the carry-in section 30 to the transfer section 300 via the dicing section 100 and the thinning section 200. The 1 st sub-conveying section 910 conveys the substrate 10 from the transfer section 300 to the mounting section 500 via the ultraviolet irradiation section 400. The 2 nd sub-conveying section 920 conveys the substrate 10 from the mounting section 500 to the peeling section 600, and turns the substrate 10 upside down. The 3 rd sub-conveying section 930 conveys the substrate 10 from the peeling section 600 to the ID attaching section 700. The main transport section 58 transports the substrate 10 from the ID attaching section 700 to the delivery section 40.
The 1 st sub-conveying section 910 is movable in the X-direction and the Z-direction. For example, as shown in fig. 11, the X-axis guide 911 is fixed to the mounting portion 500. The Z-axis guide 913 is fixed to the X-axis slider 912 that moves in the X-direction along the X-axis guide 911. The 1 st sub-conveying section 910 is fixed to a Z-axis slider 914 that moves in the Z-direction along the Z-axis guide 913. The 1 st sub-conveying section 910 may be movable in the Y direction for positioning the substrate 10 in the Y direction.
The 1 st sub-conveying part 910 adsorbs the substrate 10. The 1 st sub-conveying section 910 may have a suction surface larger than the main surface (for example, the 2 nd main surface 12) of the substrate 10 in order to suppress deformation and breakage of the substrate 10. The entire 2 nd main surface 12 of the substrate 10 can be held flat, and deformation and breakage of the substrate 10 can be suppressed.
The 1 st sub-conveying section 910 is constituted by, for example, a porous chuck, and has a porous body. The gas of the pores of the porous body is sucked by a suction source such as a vacuum pump. By operating the suction source, a negative pressure is generated in the 1 st sub-conveying section 910, and the 1 st sub-conveying section 910 vacuum-sucks the substrate 10. On the other hand, the 1 st sub-conveying section 910 releases the vacuum suction of the substrate 10 by stopping the operation of the suction source and opening the pores of the porous body to the atmosphere. When the vacuum suction is released, a positive pressure may be generated in the 1 st sub-conveying section 910.
The 1 st sub-conveying section 910 conveys the substrate 10 from the transfer section 300 to the mounting section 500 via the ultraviolet irradiation section 400 by holding the substrate 10 and moving in the X-direction and the Z-direction. For example, the substrate 10 is lifted from the interface table 310, passed over the UV lamps 410, and lowered on the mounting table 510. As a driving source for moving the 1 st sub-conveying unit 910, a servo motor or the like is used, for example.
The 1 st sub-conveying part 910 holds the substrate 10 from above in such a manner that the protective tape 14 is directed downward, and moves in the X direction above the UV lamp 410 extending in the Y direction. The Y-direction dimension of the UV lamp 410 is larger than the diameter of the substrate 10 so that the UV lamp 410 can irradiate the Y-direction entirety of the protective tape 14. The speed at which the 1 st sub-feeding portion 910 passes over the UV lamp 410 is set so as to sufficiently reduce the adhesive force of the protective tape 14.
According to the present embodiment, since the 1 st sub-conveying section 910 holds the substrate 10 during irradiation of ultraviolet rays to the protective tape 14, it is possible to hold and convey another substrate 10 by the main conveying section 58. Therefore, the conveyance efficiency of the substrate 10 in the entire substrate processing system 1 can be improved, and the processing speed of the substrate 10 in the entire substrate processing system 1 can be improved.
The 2 nd sub-conveying unit 920 is movable in the Y direction and the Z direction. For example, as shown in fig. 12, the Y-axis guide 921 is fixed to the attachment portion 500 and the peeling portion 600. The Y-axis guide 921 is provided so as to span both the attachment portion 500 and the peeling portion 600 when viewed in the Z-direction. The Z-axis guide 923 is fixed to a Y-axis slider 922 that moves in the Y direction along the Y-axis guide 921. The flip portion 925 is fixed to a Z-axis slider 924 that moves in the Z-direction along the Z-axis guide 923. The reversing section 925 holds the 2 nd sub-conveying section 920 so as to be reversible up and down around a reversing shaft 926. The axial direction of the flipping shaft 926 is set to the Y direction in the present embodiment, but may be set to the X direction.
The 2 nd sub-conveying part 920 has a suction part 929 for sucking the frame 19. The suction portions 929 are provided in plural (see fig. 14) at intervals in the axial direction (for example, Y direction) of the reversing shaft 926, and suction both end portions of the frame 19 in the Y direction. The suction portion 929 has suction holes. The gas of the suction hole is sucked by a suction source such as a vacuum pump. By operating the suction source, a negative pressure is generated in the 2 nd sub-conveying unit 920, and the 2 nd sub-conveying unit 920 vacuum-sucks the frame 19. On the other hand, the suction hole is opened to the atmosphere by stopping the operation of the suction source, and the 2 nd sub-conveying part 920 releases the vacuum suction of the frame 19. When the vacuum suction is released, a positive pressure may be generated in the 2 nd sub-conveying part 920.
Fig. 14 is a diagram showing the operation of the 2 nd sub-conveying section according to one embodiment. In fig. 14, arrows show the moving direction of the substrate 10 and the frame 19 from the mounting portion 500 to the peeling portion 600. The 2 nd sub-conveying section 920 conveys the substrate 10 mounted on the frame 19 via the adhesive tape 18 from the mounting section 500 to the peeling section 600 by holding the frame 19 and moving in the Y-direction and the Z-direction. As a driving source for moving the 2 nd sub-conveying part 920, a servo motor or the like is used, for example.
After lifting the frame 19 from the mounting table 510, the 2 nd sub-conveying unit 920 moves the frame 19 from, for example, the position shown by a solid line in fig. 14 to the position shown by a one-dot chain line in fig. 14 by the reversing unit 925. Thereby, the substrate 10 attached to the frame 19 via the adhesive tape 18 is turned upside down. Thereafter, the 2 nd sub-conveying unit 920 places the frame 19 on the peeling table 610 as shown by a two-dot chain line in fig. 14. The peeling table 610 holds the Y-direction central portion of the frame 19 so as not to interfere with the plurality of suction portions 929 provided at intervals in the axial direction (Y-direction in the present embodiment) of the reversing shaft 926.
According to the present embodiment, the substrate 10 is turned upside down by the turning portion 925 during the conveyance from the mounting portion 500 to the peeling portion 600. This makes it possible to reverse the arrangement between the adhesive tape 18 and the protective tape 14 provided across the substrate 10. Specifically, the adhesive tape 18 is disposed on the lower side of the substrate 10, and the protective tape 14 is disposed on the upper side of the substrate 10. The protective tape 14 is disposed on the opposite side of the peeling stage 610 with respect to the substrate 10, and is therefore easily peeled from the substrate 10.
The 3 rd sub-conveying section 930 is movable in the X-direction and the Z-direction. For example, as shown in fig. 11, the X-axis guide 931 is fixed with respect to the peeling portion 600. The Z-axis guide 933 is fixed to the X-axis slider 932 that moves in the X-direction along the X-axis guide 931. The 3 rd sub conveying section 930 is fixed to a Z-axis slider 934 that moves in the Z-direction along a Z-axis guide 933. The 3 rd sub-conveying section 930 may be movable in the Y direction for positioning the substrate 10 in the Y direction.
The 3 rd sub-conveying section 930 has an adsorbing section 939 for adsorbing the frame 19. The suction units 939 are provided at intervals in the X direction, for example, and suction both ends of the frame 19 in the X direction. The suction portion 939 has a suction hole. The gas of the suction hole is sucked by a suction source such as a vacuum pump. By operating the suction source, a negative pressure is generated in the 3 rd sub-conveying section 930, and the 3 rd sub-conveying section 930 vacuum-sucks the frame 19. On the other hand, the 3 rd sub-conveying section 930 releases the vacuum suction of the frame 19 by stopping the operation of the suction source and opening the suction hole to the atmosphere. When the vacuum suction is released, a positive pressure may be generated in the 3 rd sub-conveying section 930.
The 3 rd sub-conveying section 930 conveys the substrate 10 attached to the frame 19 via the adhesive tape 18 from the peeling section 600 to the ID attaching section 700 by holding the frame 19 and moving in the X-direction and the Z-direction. For example, the substrate 10 is lifted up from the peeling stage 610 and lowered down at the ID paste stage 710. As a driving source for moving the 3 rd sub-conveying unit 930, a servo motor or the like is used, for example.
In the following modification 1, unlike the above embodiment, the 3 rd sub-conveying section 930 is not provided, and the main conveying section 58 is caused to function as the 3 rd sub-conveying section 930. That is, the main transport section 58 transports the substrate 10 from the peeling section 600 to the ID attaching section 700. Hereinafter, the differences will be mainly described.
Fig. 15 is a side view showing a peeling portion and an ID attaching portion provided above the peeling portion so as to overlap the peeling portion in modification 1. In fig. 15, arrows show the moving directions of the substrate 10 and the frame 19 at the peeling portion 600 and the like. As shown in fig. 15, the peeling section 600 is provided adjacent to the main conveyance path 50.
The peeling stage 610 acquires the frame 19 from the 2 nd sub-conveying section 920 at the center portion in the X direction of the peeling stage guide 630. The substrate 10 is mounted on the frame 19 in advance by means of the adhesive tape 18. The peeling stage 610 holds the substrate 10 and the frame 19 via the adhesive tape 18.
Thereafter, the peeling table 610 moves away from the main conveyance path 50 in the X direction (rear side) and moves directly below the peeling roller 620. As shown in fig. 8, the peeling roller 620 sequentially deforms the protective tape 14 from one end side to the other end side of the substrate 10, and peels the protective tape from the substrate 10.
Thereafter, the peeling table 610 moves in the X direction (front side) so as to approach the main conveying path 50, and the frame 19 is transferred to the main conveying portion 58 (see fig. 3) at the end of the peeling table guide 630 on the main conveying path 50 side (front side). The main conveying unit 58 moves in the Z direction and the X direction while holding the frame 19, and places the frame 19 on the ID application stage 710.
According to the present modification, unlike the above embodiment, the 3 rd sub-conveying section 930 is not provided, and the main conveying section 58 is caused to function as the 3 rd sub-conveying section 930. That is, the main transport section 58 transports the substrate 10 from the peeling section 600 to the ID attaching section 700. This can make the main conveying unit 58 multifunctional, increase the work load of the main conveying unit 58, and improve the utilization of the main conveying unit 58.
In the following modification 2, unlike the above embodiment and the above modification 1, the 1 st sub-conveying unit 910 is not provided, and the main conveying unit 58 functions as the 1 st sub-conveying unit 910. That is, the main transport section 58 transports the substrate 10, which has been sliced and thinned, to the ultraviolet irradiation section 400 and the mounting section 500 in the order of the ultraviolet irradiation section 400 and the mounting section 500. In the present modification, since the 1 st sub-conveying section 910 is not provided, the transfer section 300 that transfers the substrate 10 from the main conveying section 58 to the 1 st sub-conveying section 910 may be omitted. Hereinafter, the differences will be mainly described.
Fig. 16 is a plan view showing a main part of a substrate processing system according to modification 2. In fig. 16, arrows show the moving directions of the substrate 10 and the frame 19 at the mounting portion 500, the peeling portion 600, and the like. As shown in fig. 16, the ultraviolet irradiation section 400 and the mounting section 500 are provided adjacent to the main conveyance path 50. When the mounting portion 500 is provided adjacent to one end of the main conveying path 50 in the Y direction, the ultraviolet irradiation portion 400 is also provided adjacent to one end of the main conveying path 50 in the Y direction.
The main transport section 58 (see fig. 3) holds the substrate 10 and moves in the Y direction and the Z direction, thereby transporting the substrate 10 to the ultraviolet irradiation section 400 and the mounting section 500 in the order of the ultraviolet irradiation section 400 and the mounting section. The main conveying section 58 is first inserted into the ultraviolet irradiation section 400 from the main conveying path 50.
The main conveying portion 58 holds the substrate 10 from above with the protective tape 14 facing downward, and moves in the Y direction above the UV lamp 410 extending in the X direction. The X-direction dimension of the UV lamp 410 is larger than the diameter of the substrate 10 so that the UV lamp 410 can irradiate the whole X-direction of the protective tape 14. The speed at which the main conveying portion 58 passes over the UV lamp 410 is set so as to sufficiently reduce the adhesive force of the protective tape 14.
Next, the main conveying unit 58 is pulled out from the ultraviolet irradiation unit 400 to the main conveying path 50, descends the main conveying path 50, and is inserted into the mounting unit 500 from the main conveying path 50. Thereafter, the main transport section 58 descends inside the mounting section 500, and transfers the substrate 10 to the mounting table 510.
The mount 510 acquires both the substrate 10 and the frame 19 at an end of the mount guide 530 on the main conveyance path 50 side (front side). The mounting table 510 may first acquire either the substrate 10 or the frame 19.
According to the present modification, unlike the above embodiment and the above modification 1, the 1 st sub-conveying section 910 is not provided, and the main conveying section 58 functions as the 1 st sub-conveying section 910. That is, the main transport section 58 transports the substrate 10, which has been sliced and thinned, to the ultraviolet irradiation section 400 and the mounting section 500 in the order of the ultraviolet irradiation section 400 and the mounting section 500. This can make the main conveying unit 58 multifunctional, increase the work load of the main conveying unit 58, and improve the utilization of the main conveying unit 58.
Embodiments and the like of the substrate processing system and the substrate processing method of the present disclosure have been described above, but the present disclosure is not limited to the above embodiments and the like. Various changes, modifications, substitutions, additions, deletions, and combinations can be made within the scope described in the claims. These are of course also within the technical scope of the present disclosure.
The present application claims priority from japanese patent application No. 2017-163600, which was filed in the japanese franchise on month 8, 28, and the entire contents of this japanese patent application No. 2017-163600 are incorporated herein by reference.
Description of the reference numerals
1. A substrate processing system; 10. a substrate; 14. a protective tape; 18. an adhesive tape; 19. a frame; 20. a control unit; 30. a feeding section; 35. feeding into a box; 40. a delivery unit; 45. delivering the box; 50. a main conveying path; 58. a main conveying section; 100. a slicing section; 200. a thinning section; 300. a connecting section; 400. an ultraviolet irradiation section; 500. a mounting part; 600. a peeling section; 700. an ID sticking part; 910. a 1 st auxiliary conveying unit; 920. a 2 nd sub-conveying part; 930. and a 3 rd sub-conveying part.

Claims (4)

1. A substrate transfer system for transferring a substrate between a mounting portion for forming a mounted object to be mounted on a frame by an adhesive tape, a loading portion for loading a loading cassette accommodating the substrate before being mounted on the frame by the adhesive tape, a discharge portion for discharging the loading cassette accommodating the substrate after being mounted on the frame by the adhesive tape, and a processing portion for performing processing for reducing the strength of the substrate, the substrate transfer system comprising:
a main conveyance path provided adjacent to the feeding unit, the mounting unit, the discharging unit, and the processing unit when viewed in a vertical direction; and
a main conveying section that holds the substrate and moves along the main conveying path to convey the substrate,
the main conveying section includes: a 1 st holding portion for taking out the substrate from the carry-in cassette; and a 2 nd holding unit for conveying the substrate processed by the processing unit.
2. The substrate transport system of claim 1, wherein the 2 nd holding portion is configured to transport the substrate prior to being mounted to the frame.
3. The substrate transport system according to claim 1 or claim 2, wherein the main transport section is further provided with a 3 rd holding section for transporting the substrate after being mounted on the frame.
4. A substrate conveying method is characterized in that a substrate is conveyed among an installation part, a feeding part, a discharging part and a processing part, wherein the installation part is used for forming an installation object of the substrate installed on a frame through an adhesive tape by attaching the adhesive tape to the substrate and the frame, the feeding part is used for feeding a feeding box containing the substrate before being installed on the frame through the adhesive tape from outside, the discharging part is used for discharging the discharging box containing the substrate after being installed on the frame through the adhesive tape to the outside, the processing part is used for processing for reducing the strength of the substrate,
the substrate conveying method further includes a substrate moving step of moving a main conveying section for holding the substrate along a main conveying path provided adjacent to the carry-in section, the mounting section, the carry-out section, and the processing section,
in the substrate moving step, the 1 st holding portion takes out the substrate from the loading cassette, and the 2 nd holding portion conveys the substrate processed by the processing portion.
CN202310366231.3A 2017-08-28 2018-08-15 Substrate processing system and substrate processing method Pending CN116435236A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017163600 2017-08-28
JP2017-163600 2017-08-28
PCT/JP2018/030350 WO2019044506A1 (en) 2017-08-28 2018-08-15 Substrate processing system, and substrate processing method
CN201880054597.4A CN111052341A (en) 2017-08-28 2018-08-15 Substrate processing system and substrate processing method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201880054597.4A Division CN111052341A (en) 2017-08-28 2018-08-15 Substrate processing system and substrate processing method

Publications (1)

Publication Number Publication Date
CN116435236A true CN116435236A (en) 2023-07-14

Family

ID=65525535

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202310366231.3A Pending CN116435236A (en) 2017-08-28 2018-08-15 Substrate processing system and substrate processing method
CN201880054597.4A Pending CN111052341A (en) 2017-08-28 2018-08-15 Substrate processing system and substrate processing method

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201880054597.4A Pending CN111052341A (en) 2017-08-28 2018-08-15 Substrate processing system and substrate processing method

Country Status (5)

Country Link
JP (4) JPWO2019044506A1 (en)
KR (2) KR20240038173A (en)
CN (2) CN116435236A (en)
TW (1) TWI772493B (en)
WO (1) WO2019044506A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020191430A (en) * 2019-05-24 2020-11-26 株式会社ディスコ Processing method for wafer and tape peeling device
JP7358014B2 (en) * 2019-10-29 2023-10-10 株式会社ディスコ processing equipment
WO2023176611A1 (en) * 2022-03-14 2023-09-21 株式会社荏原製作所 Substrate polishing device, substrate polishing method, polishing device, and polishing method

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3483633B2 (en) * 1993-12-24 2004-01-06 東京エレクトロン株式会社 Processing device and transport method
JPH11163082A (en) * 1997-11-28 1999-06-18 Dainippon Screen Mfg Co Ltd Method and device for substrate transportation
JP3560823B2 (en) * 1998-08-18 2004-09-02 リンテック株式会社 Wafer transfer device
JP2002343756A (en) 2001-05-21 2002-11-29 Tokyo Seimitsu Co Ltd Water planarizing apparatus
JP4748901B2 (en) * 2001-09-06 2011-08-17 日東電工株式会社 Semiconductor wafer mounting method and cassette used therefor
JP4435542B2 (en) * 2002-11-18 2010-03-17 東京エレクトロン株式会社 Insulating film forming equipment
JP2004193189A (en) * 2002-12-09 2004-07-08 Matsushita Electric Ind Co Ltd Production management system of semiconductor device
JP2004363165A (en) * 2003-06-02 2004-12-24 Tokyo Seimitsu Co Ltd Device and method for wafer processing
JP4371890B2 (en) * 2004-04-14 2009-11-25 リンテック株式会社 Pasting device and pasting method
JP2006278630A (en) * 2005-03-29 2006-10-12 Lintec Corp Wafer transfer apparatus
JP2007214457A (en) * 2006-02-10 2007-08-23 Tokyo Seimitsu Co Ltd Wafer processing equipment and method therefor
JP4841262B2 (en) * 2006-02-13 2011-12-21 株式会社東京精密 Wafer processing equipment
JP2007235068A (en) 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd Wafer machining method
JP4693696B2 (en) * 2006-06-05 2011-06-01 株式会社東京精密 Work processing device
JP4859814B2 (en) * 2007-11-06 2012-01-25 株式会社東京精密 Wafer processing equipment
JP6100484B2 (en) * 2012-08-09 2017-03-22 リンテック株式会社 Conveying apparatus and conveying method
JP6235279B2 (en) * 2013-09-18 2017-11-22 株式会社ディスコ Wafer processing method
JP2015119085A (en) * 2013-12-19 2015-06-25 株式会社ディスコ Method for processing device wafer
JP6283573B2 (en) * 2014-06-03 2018-02-21 東京エレクトロン株式会社 Peeling apparatus, peeling system, peeling method, program, and computer storage medium
JP2016001677A (en) * 2014-06-12 2016-01-07 株式会社ディスコ Wafer processing method
JP6636696B2 (en) * 2014-12-25 2020-01-29 日東電工株式会社 Semiconductor wafer mounting method and semiconductor wafer mounting apparatus
JP6625857B2 (en) * 2015-10-14 2019-12-25 株式会社ディスコ Wafer processing method

Also Published As

Publication number Publication date
JP2024036600A (en) 2024-03-15
WO2019044506A1 (en) 2019-03-07
KR20200039008A (en) 2020-04-14
JP7434463B2 (en) 2024-02-20
TW201921463A (en) 2019-06-01
KR20240038173A (en) 2024-03-22
KR102649682B1 (en) 2024-03-21
JPWO2019044506A1 (en) 2020-09-10
JP2021170659A (en) 2021-10-28
TWI772493B (en) 2022-08-01
CN111052341A (en) 2020-04-21
JP2022169731A (en) 2022-11-09
JP7133686B2 (en) 2022-09-08

Similar Documents

Publication Publication Date Title
JP7434463B2 (en) Substrate transfer system and substrate transfer method
JP4401322B2 (en) Support plate separation apparatus and support plate separation method using the same
JP7042944B2 (en) Transport equipment and board processing system
JP2010278065A (en) Method and device for mounting of wafer
JP2005175384A (en) Sticking method and peeling method of masking tape
CN110199379B (en) Method and apparatus for processing semiconductor substrate
JP2009200420A (en) Adhesive tape sticking device
JP2018049914A (en) Wafer dividing method
CN108735918B (en) Apparatus and method for manufacturing flexible device
KR20230055955A (en) Processing apparatus
CN112005359B (en) Substrate processing system and substrate processing method
JP2005276987A (en) Ultra-thin chip manufacturing process and manufacturing apparatus therefor
JP2002353170A (en) Dividing system, dividing method and dicing device for semiconductor wafer
CN111052313A (en) Substrate processing method
JP4293356B2 (en) Semiconductor wafer supply and recovery method and apparatus using the same
WO2019208337A1 (en) Substrate processing system and substrate processing method
JP2019021674A (en) Substrate processing system and substrate processing method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination