CN102047399A - Separating device and separating method for electronic component manufacture - Google Patents
Separating device and separating method for electronic component manufacture Download PDFInfo
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- CN102047399A CN102047399A CN2009801206225A CN200980120622A CN102047399A CN 102047399 A CN102047399 A CN 102047399A CN 2009801206225 A CN2009801206225 A CN 2009801206225A CN 200980120622 A CN200980120622 A CN 200980120622A CN 102047399 A CN102047399 A CN 102047399A
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- 238000005520 cutting process Methods 0.000 claims abstract description 90
- 230000007246 mechanism Effects 0.000 claims abstract description 72
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 38
- 238000007789 sealing Methods 0.000 claims description 138
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Dicing (AREA)
Abstract
The invention provides a separating device and a separating method for separating a sealed substrate to manufacture electronic components, wherein assembly, alteration, extension, and removal of an separating part are attained in a short period of time according to requirement specifications of users. An electronic component separating device (S1) is equipped with a receiving section (A), separating sections (B1, B2), and a delivery section (C). The separating sections (B1, B2) each have a rotary blade (7) as a cutting mechanism, and each can be attached to or detached from another separating section (B1, B2), or a receiving section (A) or a delivery section (C), which are the other components, and may be assembled, changed, added, or removed selectively to meet specifications requested by a user. The cutting mechanism of the separating sections (B1, B2) is not limited to the rotary blades (7), and a water jet, a laser beam, a wire saw, or a band saw could be used. The cutting mechanisms of the separating sections (B1, B2) may be different. For example, the cutting mechanism of the separating section B1 may utilize a water jet, and the cutting mechanism of the separating section B2 may utilize a rotary blade (7).
Description
Technical field
The present invention relates to hermetic sealing substrate by will having a plurality of zones by the slicing device and the dicing method of each zone section employed electronic unit manufacturing usefulness when making a plurality of electronic unit.
Background technology
In order to make a plurality of electronic units efficiently,, the mode with the section of hermetic sealing substrate is arranged as one of existing mode of having implemented.With reference to the hermetic sealing substrate of Fig. 5 explanation as the slice object thing.Fig. 5 (1) observes as the hermetic sealing substrate of slice object thing and the stereogram that shows briefly from substrate-side, Fig. 5 (2) observes a routine vertical view that also shows of hermetic sealing substrate from the sealing resin side, Fig. 5 (3) observes another routine and show vertical view of hermetic sealing substrate from the sealing resin side, and Fig. 5 (4) is the vertical view that shows as the memory card of one example of hermetic sealing substrate after cutting into slices.Need to prove, in arbitrary diagram that the application's book is comprised,, will suitably omit or amplify and schematic depiction for easy understanding.
As shown in Figure 5, hermetic sealing substrate 91 has: the substrate 92 that is made of lead frame or printed base plate etc.; And at the formed sealing resin 93 of the one side of substrate 92.Substrate 92 is divided into cancellate a plurality of regional 96 by boundary line 94 on the directions X of imagination setting respectively and the boundary line 95 on the Y direction.Be separately installed with in each zone 96 by 1 or the shaped like chips parts (not shown) that constitute such as a plurality of semiconductor chips.
The mode of a plurality of electronic units of hermetic sealing substrate 91 manufacturings of using is described herein.At first, be arranged at a plurality of regional 96 difference mounting core sheet components (hereinafter referred to as " chip ") of substrate 92.Secondly, a plurality of chips that are installed on substrate 92 are resin-sealed in batch by sealing resin 93.Thus, finish hermetic sealing substrate 91.Next, 94,95 with these hermetic sealing substrate 91 cut-outs along the boundary line.Thus, hermetic sealing substrate 91 is sliced into and a plurality of electronic units that zone 96 is corresponding respectively.In addition, the electronic unit that generally will have after the section of sealing resin 93 is called packaging part (for example with reference to patent documentation 1).
Will be hermetic sealing substrate 91 cut off in the operation of (section), use as use the so-called slicing devices such as shearing device of rotating knife as the shearing device (slicing machine) of cutting mechanism or use laser etc.In addition, slicing device has three basic constituent elements.These three inscapes are meant: the carrier that is undertaken on the hermetic sealing substrate that forms in the preceding operation (resin-sealed operation); Section portion with the section of hermetic sealing substrate; The formed a plurality of electronic units in back (packaging part) of will cutting into slices are sent the unloading part (for example with reference to patent documentation 1) to subsequent processing (for example packaging process).
Above-mentioned each inscape is roughly following corresponding with each inscape of offering 1 in patent justice.That is, " the filling department A of substrate " of patent documentation 1 is equivalent to carrier, and " cutting mechanism C " is equivalent to section portion, and " packaging part resettlement section F " is equivalent to unloading part.
Yet, in recent years, because to the requirement of the low price of electronic unit, substrate 92 tendencies maximize.In addition, because to the requirement of miniaturization etc., the cut number of the electronic unit in the plate base 92, promptly regional 96 number has the tendency (with reference to Fig. 5 (2)) of increase.In addition, because the warpage of hermetic sealing substrate 91 prevents to wait requirement, also have following situation: hermetic sealing substrate 91 is divided into large stretch of block, and a plurality of regional 96 in each block forming a plurality of (with reference to Fig. 5 (3)) on the hermetic sealing substrate 91 with the island portion 97 that the sealing resin 93 that independently is provided with by each block is constituted.Therefore, in recent years, the specification of hermetic sealing substrate 91 is of all kinds.
In addition, in recent years, the specification of packaging part is of all kinds.The packaging part of the optoelectronic component that particularly, adopt packaging part, has the sealing resin that constitutes by translucent resin etc. with stacked a plurality of chips.Follow in this, the first, the specification of substrate 92 is of all kinds.Particularly, the base material of substrate 92 for as metal material, the membrane material (polyimide film etc.) that constitutes by the composite material (glass epoxide etc.) of heat-curing resin and glass cloth base material (or glass non-woven fabrics base material) formation, by soft resin, hardness height but the materials miscellaneous such as pottery of enbrittling.
In addition, the second, the specification of potting resin 93 is of all kinds.Particularly, as sealing resin 93, used the particulate that contains silicon as filler and the higher epoxy resin of the hardness of resin own, or used the low and high silicone resin of hardness the adherence of rotating knife.
From above 2, in recent years, the substrate 92 that constitutes hermetic sealing substrate 91 is more and more polynary with the combination of sealing resin 93.Therefore, a kind of shearing device of more and more difficult use hermetic sealing substrate 91 sections.Therefore, the manufacturing of electronic unit is forced to need to prepare the shearing device of a plurality of kinds.
In addition, in the past, because the plan view shape of packaging part only is rectangle (comprising square), so the boundary line in each zone 96 of substrate 92, i.e. conduct cut off, and the boundary line 94,95 of the line of hermetic sealing substrate 91 only was a straight line.Yet in recent years, though plan view shape is essentially rectangle (in other words, plan view shape is general shape with the rectangle), the part of the profile under also having occurred overlooking comprises the packaging part of curve or broken line.In addition, at least one the hermetic sealing substrate of boundary line that contains curve or broken line has also appearred having thus.Memory card 98 shown in Fig. 5 (4) is packaging part one examples with the bend 99 that contains curve or broken line.Need to prove that the broken line of indication herein means that line segment (finite straight line) is connected with each other and the line that generates.
Illustrate that with reference to Fig. 5 (4) the hermetic sealing substrate section is to make the operation of memory card 98 herein.In this case, at first cut off hermetic sealing substrate 91 along the limit that constitutes by straight line in the profile of memory card 98 by slicing machine.Secondly, by using the shearing device of laser or water cutter (water jet) etc., cut off hermetic sealing substrate along the limit that comprises bend 99 in the profile of memory card 98.In other words, use two kinds of shearing devices, cut off limit that constitutes by straight line and the limit that comprises bend 99 respectively with different cutting mechanisms.
The application's applicant for the increase of the cutting number of tackling the electronic unit in the plate base 92, and has proposed to be provided with the slicing device of the section portion of two identical type.In addition, the packaging part that profile comprises curve or broken line is overlooked down in reply, has proposed to be provided with the slicing device of two different types of section portions.These contents have been recorded in the application's the patent documentation that the applicant applied for 2.
In addition, hermetic sealing substrate (the full cut-out) carries out by cutting off fully usually in section.Yet section also can be by cutting hermetic sealing substrate (half cut-off) and carrying out in the mode of being cut off (brisement) thereafter partly.Therefore, as the term when hermetic sealing substrate is cut into slices, suitably use " cutting " such term to replace " cut-out ".
Patent documentation 1: TOHKEMY 2004-207424 communique (the 2nd～3 page, Fig. 1, Fig. 2)
Patent documentation 2: TOHKEMY 2008-153565 communique (paragraph [0050], [0051])
Summary of the invention
As mentioned above, the specification of hermetic sealing substrate or packaging part is various, and the desired specification of user is also quite various.Suitably change in order to satisfy above-mentioned various demand or when setting up section portion, use the words of existing slicing device to need spended time carry out above-mentioned operation, therefore produce the problem that the productivity ratio of packaging part reduces.The problem that the present invention will solve is, be provided at the user require the specification change time can satisfy this and require specification and at short time the cut into slices assembling of portion, the slicing device that changes, sets up, dismantles.
The below numeral in (), the symbol in the symbolic representation accompanying drawing in the explanation are put down in writing in order to be easy to term in the comparative illustration and inscape shown in the drawings.In addition, these numerals are not to mean " term in will illustrating is defined in inscape shown in the drawings and explains ".
For solving above-mentioned problem, the slicing device of electronic unit manufacturing usefulness of the present invention uses when hermetic sealing substrate (3) is made a plurality of electronic unit by each zone section of being located at a plurality of zones on the substrate, described hermetic sealing substrate (3) is by carrying out resin-sealed formation to being installed on the chip that is located at a plurality of described zones on the substrate respectively, and the slicing device of described electronic unit manufacturing usefulness possesses: accept the carrier (A) of hermetic sealing substrate (3); Cut hermetic sealing substrate (3) partly and hermetic sealing substrate (3) cut into monolithic or by cutting off the section portion that forms monolithic; And the unloading part (C) that will send by a plurality of electronic units after the processing of this section portion, the slicing device of described electronic unit manufacturing usefulness is characterised in that,
Between described carrier (A) and described unloading part (C), be provided with a plurality of described section portion,
Each section portion of a plurality of described section portion can dismounting with respect to other section portions, described carrier (A) or described unloading part (C) and can change.
In addition, the slicing device of electronic unit manufacturing usefulness of the present invention is characterized in that based on above-mentioned slicing device, and a plurality of described sliced sections do not have any one the cutting mechanism in use rotating knife (7), laser, water cutter, scroll saw or the band saw,
The cutting mechanism that a plurality of described sliced sections do not have is an identical type.
In addition, the slicing device of electronic unit manufacturing usefulness of the present invention is characterized in that based on above-mentioned slicing device, and a plurality of described sliced sections do not have any one the cutting mechanism in use rotating knife (7), laser, water cutter, scroll saw or the band saw,
At least one cutting mechanism in the cutting mechanism that a plurality of described sliced sections do not have and other cutting mechanisms are variety classes.
In addition, the slicing device of electronic unit manufacturing usefulness of the present invention is characterized in that based on above-mentioned slicing device, and at least one the section portion in a plurality of described section portion processes hermetic sealing substrate (3) along curve or broken line.
In addition, the slicing device of electronic unit manufacturing usefulness of the present invention is characterized in that based on above-mentioned slicing device, and at least one the section portion in a plurality of described section portion is used for fine finishining.
In addition, the dicing method of electronic unit manufacturing usefulness of the present invention uses when hermetic sealing substrate (3) is made a plurality of electronic unit by each zone section of being located at a plurality of zones on the substrate, described hermetic sealing substrate (3) is by carrying out resin-sealed formation to being installed on the chip that is located at a plurality of described zones on the substrate respectively, and the dicing method of described electronic unit manufacturing usefulness comprises: accept the operation of hermetic sealing substrate (3); Use a plurality of section portion to cut hermetic sealing substrate (3) partly respectively and hermetic sealing substrate (3) cut into monolithic or by cutting off the manufacturing procedure that forms monolithic; And the operation that will send by a plurality of electronic units after the processing of described section portion, the dicing method of described electronic unit manufacturing usefulness is characterised in that,
In described manufacturing procedure, use the cutting mechanism of the identical type that a plurality of described sliced sections do not have respectively a plurality of hermetic sealing substrates (3) to be processed.
In addition, the dicing method of electronic unit manufacturing usefulness of the present invention uses when hermetic sealing substrate (3) is made a plurality of electronic unit by each zone section of being located at a plurality of zones on the substrate, described hermetic sealing substrate (3) is by carrying out resin-sealed formation to being installed on the chip that is located at a plurality of described zones on the substrate respectively, and the dicing method of described electronic unit manufacturing usefulness comprises: accept the operation of hermetic sealing substrate (3); Use a plurality of section portion to cut hermetic sealing substrate (3) partly respectively and hermetic sealing substrate (3) cut into monolithic or by cutting off the manufacturing procedure that forms monolithic; And the operation that will send by a plurality of electronic units after the processing of described section portion, the dicing method of described electronic unit manufacturing usefulness is characterised in that,
In described manufacturing procedure, use at least one cutting mechanism in the cutting mechanism that a plurality of described sliced sections do not have in regular turn and be cutting mechanism and other cutting mechanisms of the kind that differs from other cutting mechanisms, hermetic sealing substrate (3) is processed.
In addition, the dicing method of electronic unit manufacturing usefulness of the present invention is based on above-mentioned dicing method, it is characterized in that described manufacturing procedure comprises: the operation of using at least one the section portion in a plurality of described section portion hermetic sealing substrate (3) to be processed along curve or broken line; And the operation of using other section portions in a plurality of described section portion hermetic sealing substrate to be processed along straight line.
In addition, the dicing method of electronic unit manufacturing usefulness of the present invention is characterized in that based on above-mentioned dicing method, and described manufacturing procedure comprises that at least one the section portion that uses in a plurality of described section portion carries out accurately machined operation.
According to the present invention, each section portion of a plurality of section portion can dismounting with respect to other section portions, carrier (A) or unloading part (C) and can change.Thus, when the user require specification when change can be achieved as follows item in the short time.The first, can be according to requiring specification, replace mounted section portion and change to section portion with required cutting mechanism.The second, can should require specification, except mounted section portion, set up section portion again with required cutting mechanism.The 3rd, can dismantle unwanted section portion.
In addition, according to the present invention, a plurality of section portion the cutting mechanism that uses respectively can be identical type.Thus, can set up the section portion of cutting mechanism with identical type.Therefore, can easily increase the disposal ability of slicing device.
In addition, according to the present invention, a plurality of section portion at least one cutting mechanism in the cutting mechanism that uses respectively can differ from the kind of other cutting mechanisms.Thus, can answer the shape of working position or material etc. to select to use best organisation of working.In addition, hermetic sealing substrate (3) also can cut along curve or broken line at least one the section portion in a plurality of section portion.Thus, when the shape of the electronic unit that requires comprises when needing part that the part of cutting along curve or broken line and cutting that can be by in addition (for example cutting on the limit that is made of straight line, edge) process, can be suitable for the processing of each several part by a slicing device.
In addition, according to the present invention, at least one the section portion in a plurality of section portion also can be used for fine finishining.Thus, can by a slicing device carry out in order to the section processing and fine finishining.
Description of drawings
Fig. 1 is the concise and to the point vertical view of slicing device of the electronic unit manufacturing usefulness of expression embodiments of the invention 1.
Fig. 2 is the concise and to the point vertical view of slicing device of the electronic unit manufacturing usefulness of expression embodiments of the invention 2.
Fig. 3 is the concise and to the point vertical view of slicing device of the electronic unit manufacturing usefulness of expression embodiments of the invention 3.
Fig. 4 is the concise and to the point vertical view of slicing device of the electronic unit manufacturing usefulness of expression embodiments of the invention 4.
Fig. 5 (1) represents briefly from the stereogram of substrate-side observation as the hermetic sealing substrate of slice object thing, Fig. 5 (2) is that expression is observed the vertical view of an example of hermetic sealing substrate from the sealing resin side, Fig. 5 (3) is that expression is observed another routine vertical view of hermetic sealing substrate from the sealing resin side, and Fig. 5 (4) is the vertical view of expression memory card.
Embodiment
The slicing device of electronic unit (S1) possesses carrier (A), section portion (B1, B2) and unloading part (C).Section portion (B1, B2) all has the rotating knife (7) as shut-off mechanism, respectively or freely, suitably select and assemble, change, set up, dismantle according to user's the specification that requires as the carrier (A) of other inscapes or unloading part (C) dismounting with respect to other section portions (B1, B2).The shut-off mechanism that section portion (B1, B2) is had is not limited to use rotating knife (7), also can make water cutter, laser, scroll saw or band saw.The shut-off mechanism of section portion (B1, B2) can be a variety classes.For example, the shut-off mechanism of a section portion (B1) makes the water cutter, and the shut-off mechanism of another section portion (B2) uses rotating knife (7).
The embodiment 1 of the slicing device of electronic unit manufacturing usefulness of the present invention is described with reference to Fig. 1.Fig. 1 is the concise and to the point vertical view of slicing device of the electronic unit manufacturing usefulness of expression present embodiment.Slicing device S1 shown in Figure 1 is the slicing device that is sliced into a plurality of electronic units in order to general's hermetic sealing substrate.In addition, as shown in Figure 1, slicing device S1 has carrier A, the B1 of section portion, the B2 of section portion, unloading part C as each inscape (module).
In the present embodiment, between carrier (A) and unloading part (C), be provided with so a plurality of (among Fig. 1 being two) the section portion of B1 of section portion and the B2 of section portion.In addition, constitute respectively can dismounting with respect to other inscapes and can change for carrier A, the B1 of section portion, the B2 of section portion and unloading part C.In addition, prepare carrier A, the B1 of section portion, the B2 of section portion and unloading part C in advance, these structural elements have the multiple different specification that requires specification corresponding to anticipation respectively.Further, in the present invention, elementary cell 1 constitutes and comprises carrier A, the B1 of section portion, the B2 of section portion and unloading part C.
As shown in Figure 1, be provided with preposition microscope carrier 2 at carrier A.Accept from hermetic sealing substrate 3 at this preposition microscope carrier 2 as the resin sealing apparatus conveyance of the device of preceding operation.This hermetic sealing substrate 3 be equivalent to hermetic sealing substrate 91 shown in Figure 5.Hermetic sealing substrate 3 is disposed at preposition microscope carrier 2 in sealing resin shown in Figure 5 93 sides mode down.At this preposition microscope carrier 2, carry out the contraposition of hermetic sealing substrate 3 as required.In addition, with hermetic sealing substrate 91 shown in Figure 5 similarly, chip is installed in the cancellate a plurality of zones in hermetic sealing substrate 3 respectively, and a plurality of chips are resin-sealed in batch.
Be respectively equipped with cut-out workbench 4 at each B1 of section portion, B2.Cut off and to move along illustrated Y direction, and can rotate around the θ direction with workbench 4.On cutting off, be equipped with and cut off with microscope carrier 5 with workbench 4.Depths part at each B1 of section portion, B2 is respectively equipped with two spindle drive motors 6.Two spindle drive motors 6 can independently move along directions X respectively at each B1 of section portion, B2.Be separately installed with rotating knife 7 at two spindle drive motors 6.These rotating knifes 7 along rotating in the face of Y direction, are incited somebody to action hermetic sealing substrate 3 cut-outs respectively thus.Therefore, in the present embodiment, used the cutting mechanism of rotating knife 7 to be arranged at B1 of section portion and the B2 of section portion respectively.
Be provided with pallet 8 at unloading part C.The aggregate 9 that is made of a plurality of electronic units after each B1 of section portion, B2 section respectively is contained in pallet 8 with microscope carrier 5 via main transport mechanism (not shown) from cutting off.Then, a plurality of electronic units that are contained in pallet 8 respectively are sent from unloading part C, and conveyance is to subsequent processing (for example checking operation).
In addition, in the present embodiment, main transport mechanism (not shown) is arranged on respect to each inscape, is the position that carrier A, the B1 of section portion, the B2 of section portion and unloading part C are suitable for jointly.Need to prove that this position is arrow (arrow of the heavy line) expression to extend along directions X in Fig. 1 to the right.
Herein, describe at each B1 of section portion, B2.The B1 of section portion constitutes with respect to other inscapes, is that carrier A and the B2 of section portion can dismounting and can change.The B2 of section portion constitutes can dismounting with respect to other inscapes, i.e. the section B1 of portion and unloading part C and can change.Thus, when the needs of the electronic unit of making inciting somebody to action hermetic sealing substrate 3 sections reduce, can dismantle any one among B1 of section portion and the B2 of section portion.In addition, when the needs of the electronic unit of making inciting somebody to action hermetic sealing substrate 3 sections increase, the section portion (not shown) with two spindle drive motors 6 can be installed further between B2 of section portion and unloading part C.
In addition, in integral body of the present invention, also can in B of section portion 1 and the B2 of section portion, use rotating knife 7 cutting mechanism in addition.At this moment, can in each section portion, use the cutting mechanism of identical type.For example, at the B1 of section portion and the B2 of section portion among both, can select to utilize and use wherein each cutting mechanism such as laser, water cutter (no matter whether with grinding-material and with), scroll saw or band saw.For example, manufacturing has the electronic unit of the plan view shape as rectangle, when in other words only having the electronic unit on the limit that is made of straight line, needs only and use the cutting mechanism with rotating knife 7 or band saw in B1 of section portion and the B2 of section portion.In addition, when manufacturing has as the electronic unit of the plan view shape that contains curve or broken line etc., as long as in B1 of section portion and the B2 of section portion, use cutting mechanism with laser, water cutter or scroll saw.
In addition, in integral body of the present invention, can adopt unloading part C with various inscapes.For example, can adopt have with a plurality of electronic component storings in the mechanism of pallet, be contained in the mechanism of flexible pipe and the state that separating under the unloading part C of transfer and the mechanism that sends etc.
Below, the action of slicing device S1 of the electronic unit manufacturing usefulness of present embodiment is described.At first, accept hermetic sealing substrate 3 at carrier A.
Secondly, after hermetic sealing substrate 3 has been transferred to the B1 of section portion, cut into monolithic by rotating knife 7 hermetic sealing substrate 3.During this period, accept next one hermetic sealing substrate 3 at carrier A, and with this after hermetic sealing substrate 3 has been transferred to the B2 of section portion, the rotating knife 7 by the B2 of section portion hermetic sealing substrate 3 cuts into monolithic.Thus, can in each B1 of section portion, B2, pass through rotating knife 7 hermetic sealing substrate 3 sections concurrently respectively.
Secondly, the aggregate that a plurality of electronic unit constituted 9 after the B1 of section portion section is accommodated to pallet 8 via main transport mechanism (not shown) with microscope carrier 5 from cutting off.Aggregate 9 from pallet 8 conveyances to subsequent processing (for example checked operation) thereafter.
Secondly, the aggregate that a plurality of electronic unit constituted 9 after the B2 of section portion section is accommodated to pallet 8 via main transport mechanism (not shown) with microscope carrier 5 from cutting off.Thereafter, with aggregate 9 from pallet 8 conveyances to subsequent processing.
Herein, can with two groups of aggregates 9 are accommodated respectively and conveyance in regular turn to the operation of subsequent processing concurrently, respectively each B1 of section portion, B2 by rotating knife 7 with another hermetic sealing substrate 3 cut into monolithic.As discussed above, according to the dicing method of the electronic unit manufacturing usefulness of present embodiment, because the parallel a plurality of section portion that uses, the disposal ability in the time of therefore can significantly promoting hermetic sealing substrate 3 sections.
The feature of the slicing device S1 of the electronic unit manufacturing usefulness of present embodiment is as follows.The first, be provided with a plurality of B1 of section portion, B2 at slicing device S1 with cutting mechanism of identical type.The second, prepare the B1 of section portion, the B2 that have corresponding to the multiple different size that requires specification of anticipation in advance.The 3rd, the B1 of section portion, B2 respectively can dismounting with respect to other inscapes and can be changed.
According to these features of present embodiment, the B1 of section portion, the B2 that can use in the pre-prepd multiple section portion that has corresponding to the multiple different size that requires specification of anticipation, the section portion of identical type is constituted ... assemble slicing device.Thus, can realize having the B1 of section portion, the slicing device S1 of B2 that require specification and the best that needs in the short time according to the user.
In addition, can tackle the increase and decrease of the needs of the electronic unit that 3 sections of hermetic sealing substrate are made, in the B1 of section portion, B2, set up section portion or from the B1 of section portion, B2 dismounting section portion.Thus, by changing existing slicing device, can realize and the corresponding slicing device of increase and decrease that needs in the short time.In addition, because the unwanted part of user is not included in the slicing device, so the floor space of slicing device is dwindled to reduce with cost and is become possibility.
In addition, the B1 of section portion, rotating knife that B2 had respectively 7 relevant specifications can change according to each section portion.This specification for example can be abrasive particle diameter, rotary speed.For example, the abrasive particle diameter that makes the rotating knife 7 that the B1 of section portion had is the specification that is suitable for the substrate cutting, and making the abrasive particle diameter of the rotating knife 7 that the B2 of section portion had is the specification that is suitable for the sealing resin cutting.Thus, the rotating knife 7 cutting substrates that can use the B1 of section portion to be had, the rotating knife 7 cutting sealing resins that use the B2 of section portion to be had thereafter.Therefore, can be by having and the substrate that constitutes hermetic sealing substrate 3 and the sealing resin different rotary cutter 7 of corresponding optimum specifications respectively, cut into slices with the processing conditions of the most suitable each working position hermetic sealing substrate 3.
In addition, also can consider cutting mechanism, and the B1 of section portion, rotating knife that B2 had respectively 7 relevant specifications are changed according to each section portion the influence of hermetic sealing substrate 3.For example, the abrasive particle diameter of the rotating knife 7 that the B1 of section portion that elder generation is used is had is the specification that is suitable for rough cut, and the abrasive particle diameter of the rotating knife 7 that the B2 of section portion that the back is used is had is the specification that is suitable for upper cut.Thus, can carry out fine finishining by the B2 of section portion that use the back.Therefore, can realize cutting off the lifting of quality.
Further, in integral body of the present invention, according to variations such as market trends or technology trends, with the B1 of section portion, B2 ... be replaced with section portion, thus, can realize best slicing device with different size.For example, when the demand of the electronic unit that memory card is had like that the plan view shape that comprises curve or broken line etc. increases, use is had the cutting mechanism of rotating knife 7 the B1 of section portion, B2 ... being replaced with suitable section portion gets final product.As the section portion of new installation, can enumerate the section portion that for example uses laser, water cutter or scroll saw.For example, can with the B1 of section portion, B2 ... all or part of be replaced with the section portion that uses laser, also can be replaced with the section portion that makes the water cutter, also can be replaced with the section portion that uses scroll saw.
The embodiment 2 of the slicing device of electronic unit manufacturing usefulness of the present invention is described with reference to Fig. 2.Fig. 2 is the concise and to the point vertical view of slicing device of the electronic unit manufacturing usefulness of expression present embodiment.As shown in Figure 2, the slicing device S2 of the electronic unit manufacturing usefulness of present embodiment has carrier A, the B1 of section portion, B2, the clean D of portion, the E of inspection portion and unloading part C respectively as inscape (module).In addition, be provided with between the B2 of section portion that constitutes at slicing device S1 shown in Figure 1 of slicing device S2 and the unloading part C and clean the D of portion and E is closed in inspection.Further, main transport mechanism (not shown) is arranged at respect to each inscape, is the position that carrier A, the B1 of section portion, B2, the clean D of portion and unloading part C are suitable for jointly.
Herein, in the present embodiment, except that embodiment 1 was described, cleaning that the D of portion, the E of inspection portion also constitute respectively can dismounting with respect to other inscapes and can change.In addition, prepare clean D of portion and the E of inspection portion that has respectively corresponding to the multiple different size that requires specification of anticipation in advance.
Below, in slicing device S2 shown in Figure 2, the inscape different with slicing device S1 shown in Figure 1 is described.As shown in Figure 2, be provided with clean mechanism 10 at the clean D of portion.Be provided with by water-absorbing materials such as sponges and constitute and can be the clean roller 11 of center rotation with axle cleaning mechanism 10 along the Y direction.Below clean roller 11, be provided with tank (not shown).Clean under roller 11 stores the water in tank in suction the state and rotate.
In addition, above clean mechanism 10, dispose by cutting off the aggregate 9 of hermetic sealing substrate 3 back a plurality of electronic units (packaging part) formations that form.Aggregate 9 is fixing by main transport mechanism (not shown) absorption at the face of its substrate-side (at the face of the face side of drawing).In other words, aggregate 9 is adsorbed fixing at the face of substrate shown in Figure 5 92 sides.In addition, the adsorbed fixing aggregate 9 of main transport mechanism moves right from the figure left-hand.Along with this moves, the clean roller 11 that rotates under the face of the sealing resin side of aggregate 9 (at the face of the rear side of drawing) and the state that has sucked water contacts.Thus, clean the face of the sealing resin side of aggregate 9.Thereafter, to the overall with injection air of cleaned aggregate 9 (preferred hot-air).Thus, when the water that is attached to aggregate 9 is blown off, make the dry tack free of aggregate 9.
As shown in Figure 2, be provided with inspection with workbench 12, check with workbench 12 and can rotate around the θ direction at the E of inspection portion.On checking, be equipped with and check with microscope carrier 13 with workbench 12.Cleaned a plurality of electronic units are transferred load to inspection microscope carrier 13 from adsorbing the secondary transport mechanism (not shown) that main transport mechanism branched out of fixing the aggregate 9 that is made of a plurality of electronic units.In Fig. 2, use the mobile route of representing to clean the secondary transport mechanism between D of portion and the E of inspection portion along the arrow of the heavy line of Y direction.
The E of inspection portion is the part of carrying out the visual examination of electronic unit.And, be provided with the camera 14 of the still image of taking electronic unit in the depths part of the E of inspection portion.Camera 14 can move along directions X and Y direction.Here, be provided with control part (not shown) at the E of inspection portion.This control part carries out image processing according to the still image of the electronic unit that obtains from camera 14, and with view data that obtains and the data of storing in advance relatively, judges that thus this electronic unit is qualified product or defective item.Then, control part is stored the qualified product in the relevant aggregate 9 and the data (so-called mapping (enum) data) of defective item as required.
Will be in the B of section portion section, clean that the D of portion cleans and check by the E of inspection portion after the aggregate that a plurality of electronic unit constituted 9 be contained in the pallet 8 that is located at unloading part C via main transport mechanism (not shown) from cleaning the D of portion side.In the present embodiment, according to the mapping (enum) data that is stored in control part (not shown), will be contained in qualified product conveyance in the electronic unit of pallet 8 to subsequent processing (for example packaging process).In addition, defective item is contained in defective item pallet (not shown).
According to present embodiment, can the short time make have the best B1 of section portion, B2 ..., clean the slicing device S2 of D of portion and the E of inspection portion.And then, can realize and the corresponding best slicing device S2 of increase and decrease that needs in the short time.
In addition, in the present embodiment, in the clean D of portion, can for example use the clean replacement of steam or remover etc. to use cleaning of clean roller 11 and water.In addition, at the E of inspection portion, the inspection of can for example switching on waits and replaces visual examination (optical inspection).
The embodiment 3 of the slicing device of electronic unit manufacturing usefulness of the present invention is described with reference to Fig. 3.Fig. 3 is the concise and to the point vertical view of slicing device of the electronic unit manufacturing usefulness of expression present embodiment.The slicing device S3 of the electronic unit manufacturing usefulness of present embodiment is compared to the slicing device S2 of the embodiment 2 point difference in the following stated.That is section portion B2 and the section portion B3 formation of a plurality of section portions, by having different types of specification.
Particularly, replace the B1 of section portion of embodiment 2, the B3 of section portion with the cutting mechanism that makes the water cutter is installed.Be provided with water cutter unit 15 at the B3 of section portion.Thus, can cut off the limit that comprises curve or broken line etc., cut off the limit that straight line constituted by the B2 of section portion that uses rotating knife 7 by the B3 of section portion that makes the water cutter.
According to the dicing method of the electronic unit manufacturing usefulness of present embodiment, at first, accept hermetic sealing substrate 3 at carrier A.
Secondly, hermetic sealing substrate 3 is transferred to the B3 of section portion.Make water cutter unit 15 cut off the limit that in hermetic sealing substrate 3 comprise curve or broken line etc. thereafter.
Secondly, hermetic sealing substrate 3 is transferred to the B2 of section portion.Use rotating knife 7 cut off limit that hermetic sealing substrate 3 cathetus constituted thereafter.
As discussed above, according to the dicing method of the electronic unit manufacturing usefulness of present embodiment, use different types of cutting mechanism to cut hermetic sealing substrate 3 in regular turn accordingly with the feature of hermetic sealing substrate 3, hermetic sealing substrate 3 sections thus.Therefore, can use a slicing device, by 3 sections of optimal a plurality of cutting mechanisms corresponding hermetic sealing substrate with the feature of hermetic sealing substrate 3.
In addition, according to present embodiment, by the B1 of section portion shown in Figure 1 is replaced with the B3 of section portion that makes the water cutter, and can will when having the packaging part of rectangular plan view shape, manufacturing be altered to the slicing device S3 that is suitable for making memory card by employed slicing device S1 (with reference to Fig. 1) in the short time.
In addition, also the B3 of section portion can be exchanged into the section portion that uses laser.In addition, also the B3 of section portion can be exchanged into the section portion that uses scroll saw.In addition, also can the place-exchange of the B3 of section portion with the B2 of section portion that uses rotating knife 7 of water cutter will be made.
In addition, also can consider cutting mechanism to the influence of hermetic sealing substrate 3, make the B3 of section portion, B2 the relevant specification of cutting mechanism used respectively change according to each section portion.For example, the cutting mechanism that the B3 of section portion that elder generation is used is had uses laser, and the cutting mechanism that the B2 of section portion that the back is used is had makes the water cutter.In this case, by using laser to cut off the part of (fusing),, can remove these materials that adheres to (smelting attachment) by making the water cutter though might adhere to the material that generates because of the sealing resin fusion.Thus, can make the water cutter carry out fine finishining by the B2 of section portion that use the back.Therefore, can realize cutting off the lifting of quality.
The embodiment 4 of the slicing device of electronic unit manufacturing usefulness of the present invention is described with reference to Fig. 4.Fig. 4 is the concise and to the point vertical view of slicing device of the electronic unit manufacturing usefulness of expression present embodiment.The slicing device S4 of the electronic unit manufacturing usefulness of present embodiment has three B3 of section portion, B4, B2.The B3 of section portion, B4 have the cutting mechanism of identical type, for example make the cutting mechanism of water cutter.In addition, the B2 of section portion has two spindle drive motors 6 that rotating knife 7 is installed.And, because each section portion can dismounting with respect to other section portions, carrier A or unloading part C and can change, therefore can the short time have water cutter unit 15 the B3 of section portion, B4 the increase and decrease operation that the platform number is set or have the increase and decrease operation that the platform number is set of the B2 of section portion of two spindle drive motors 6.
According to present embodiment, can cut off the limit that comprises curve or broken line etc. by two B3 of section portion, B4 that have water cutter unit 15 respectively, cut off the limit that straight line constituted by the B2 of section portion with rotating knife 7.In addition, about the section portion and the section portion that cuts off the limit that straight line constituted on the limit that comprises curve or broken line etc. in order to cut-out, its specification and number can change in the short time.Therefore, can adjust the ability of cutting off the limit that comprises curve or broken line etc. and the ability of cutting off the limit that straight line constituted in the short time.
In the present embodiment, also two B3 of section portion, B4 that make the water cutter can be exchanged into two section portions that use laser.In addition, also two B3 of section portion, B4 can be exchanged into two section portions that use scroll saw.In addition, also can the place-exchange of the B2 of section portion of the B3 of section portion, the B4 of water cutter and use rotating knife 7 will be made.In addition, also can will make the section portion of water cutter be made as one, and will use the section portion of rotating knife 7 to be made as two.
In addition, the B3 of section portion, B4 the relevant specification of water cutter used respectively can change according to each section portion.This specification for example can be the abrasive particle diameter, also can be the pressure of process water.For example, the abrasive particle diameter of the water cutter that the B3 of section portion that elder generation is used is had is the specification that is suitable for the substrate cutting, and the abrasive particle diameter of the water cutter that the B4 of section portion that the back is used is had is to be suitable for the specification that sealing resin cuts.Thus, can use the B3 of section portion cutting substrate, use the B4 of section portion cutting sealing resin thereafter.Therefore, can be to cut into monolithic with the corresponding respectively optimal process condition of the substrate that constitutes hermetic sealing substrate 3 and sealing resin hermetic sealing substrate 3.
In addition, in the various embodiments described above, illustrated to be respectively equipped with the formation of a cut-out among each B1～B4 of section portion with workbench 4.But be not limited to this, also can plural cut-out workbench 4 be set respectively at each B1～B4 of section portion.In addition, for example can make two spindle drive motors shown in Figure 1 cut off with workbench 4 corresponding with each.Thus, can further promote the disposal ability of slicing device.
In addition, except each illustrated inscape of each embodiment, also other inscapes can be installed further.For example, can at the E of inspection portion other inspection portions be installed, packaging part be carried out other inspections by described other inspection portions according to user's the specification that requires.Check as other, can adopt visual examination that the opposing face of the face that energising checks or the E of inspection portion is checked carries out etc.
In addition, the section of hermetic sealing substrate can by will be by section portion the hermetic sealing substrate mode of fully cutting off (the full cut-out) carry out, also can be by cut (half cut-off) hermetic sealing substrate and cut off in operation utilization thereafter and to carry out partly by section portion.This cuts off and can be undertaken by slicing device, also can be undertaken by other devices of subsequent handling.
In addition, the present invention is not limited to the various embodiments described above, in the scope that does not break away from purport of the present invention, according to needs, can make up arbitrarily and suitably, changes or select and adopt.
Symbol description
The A carrier
B1, B2, B3, B4 section section
The C unloading part
D cleans section
E inspection section
S1, S2, S3, S4 slicing device
1 elementary cell
2 preposition microscope carriers
3 hermetic sealing substrates
4 cut-out workbench
5 cut-out microscope carriers
6 spindle drive motors
7 rotating knifes (cutting mechanism)
8 pallets
9 aggregates
10 clean mechanism
11 clean roller
12 inspection workbench
13 inspection microscope carriers
14 cameras
15 water cuttves
Claims (9)
1. the slicing device of an electronic unit manufacturing usefulness, it uses when hermetic sealing substrate is made a plurality of electronic unit by each zone section of being located at a plurality of zones on the substrate, described hermetic sealing substrate is by carrying out resin-sealed formation to being installed on the chip that is located at a plurality of described zones on the substrate respectively, and the slicing device of described electronic unit manufacturing usefulness possesses: accept the carrier of hermetic sealing substrate; Cut hermetic sealing substrate partly and hermetic sealing substrate cut into monolithic or by cutting off the section portion that forms monolithic; And the unloading part that will send by a plurality of electronic units after the processing of this section portion, the slicing device of described electronic unit manufacturing usefulness is characterised in that,
Between described carrier and described unloading part, be provided with a plurality of described section portion,
Each section portion of a plurality of described section portion can dismounting with respect to other section portions, described carrier or described unloading part and can change.
2. the slicing device of electronic unit manufacturing usefulness as claimed in claim 1 is characterized in that,
A plurality of described sliced sections do not have any one the cutting mechanism that uses in rotating knife, laser, water cutter, scroll saw or the band saw,
The cutting mechanism that a plurality of described sliced sections do not have is an identical type.
3. the slicing device of electronic unit manufacturing usefulness as claimed in claim 1 is characterized in that,
A plurality of described sliced sections do not have any one the cutting mechanism that uses in rotating knife, laser, water cutter, scroll saw or the band saw,
At least one cutting mechanism in the cutting mechanism that a plurality of described sliced sections do not have and other cutting mechanisms are variety classes.
4. the slicing device of electronic unit manufacturing usefulness as claimed in claim 3 is characterized in that,
At least one section portion in a plurality of described section portion processes hermetic sealing substrate along curve or broken line.
5. as the slicing device of each described electronic unit manufacturing usefulness in the claim 1～4, it is characterized in that,
At least one section portion in a plurality of described section portion is used for fine finishining.
6. the dicing method of an electronic unit manufacturing usefulness, it uses when hermetic sealing substrate is made a plurality of electronic unit by each zone section of being located at a plurality of zones on the substrate, described hermetic sealing substrate is by carrying out resin-sealed formation to being installed on the chip that is located at a plurality of described zones on the substrate respectively, and the dicing method of described electronic unit manufacturing usefulness comprises: accept the operation of hermetic sealing substrate; Use a plurality of section portion to cut hermetic sealing substrate partly respectively and hermetic sealing substrate cut into monolithic or by cutting off the manufacturing procedure that forms monolithic; And the operation that will send by a plurality of electronic units after the processing of described section portion, the dicing method of described electronic unit manufacturing usefulness is characterised in that,
In described manufacturing procedure, use the cutting mechanism of the identical type that a plurality of described sliced sections do not have respectively a plurality of hermetic sealing substrates to be processed.
7. the dicing method of an electronic unit manufacturing usefulness, it uses when hermetic sealing substrate is made a plurality of electronic unit by each zone section of being located at a plurality of zones on the substrate, described hermetic sealing substrate is by carrying out resin-sealed formation to being installed on the chip that is located at a plurality of described zones on the substrate respectively, and the dicing method of described electronic unit manufacturing usefulness comprises: accept the operation of hermetic sealing substrate; Use a plurality of section portion to cut hermetic sealing substrate partly respectively and hermetic sealing substrate cut into monolithic or by cutting off the manufacturing procedure that forms monolithic; And the operation that will send by a plurality of electronic units after the processing of described section portion, the dicing method of described electronic unit manufacturing usefulness is characterised in that,
In described manufacturing procedure, use at least one cutting mechanism in the cutting mechanism that a plurality of described sliced sections do not have in regular turn and be cutting mechanism and other cutting mechanisms of the kind that differs from other cutting mechanisms, hermetic sealing substrate is processed.
8. the dicing method of electronic unit manufacturing usefulness as claimed in claim 7 is characterized in that,
Described manufacturing procedure comprises: the operation of using at least one the section portion in a plurality of described section portion along curve or broken line hermetic sealing substrate to be processed; And the operation of using other section portions in a plurality of described section portion hermetic sealing substrate to be processed along straight line.
9. the dicing method of electronic unit manufacturing usefulness as claimed in claim 7 is characterized in that,
Described manufacturing procedure comprises that at least one the section portion that uses in a plurality of described section portion carries out accurately machined operation.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008155555A JP5511154B2 (en) | 2008-06-13 | 2008-06-13 | Separation apparatus and method for manufacturing electronic parts |
| JP2008-155555 | 2008-06-13 | ||
| PCT/JP2009/002585 WO2009150821A1 (en) | 2008-06-13 | 2009-06-09 | Separating device and separating method for electronic component manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102047399A true CN102047399A (en) | 2011-05-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009801206225A Pending CN102047399A (en) | 2008-06-13 | 2009-06-09 | Separating device and separating method for electronic component manufacture |
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| Country | Link |
|---|---|
| JP (1) | JP5511154B2 (en) |
| KR (1) | KR101930496B1 (en) |
| CN (1) | CN102047399A (en) |
| TW (1) | TWI524402B (en) |
| WO (1) | WO2009150821A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104952767A (en) * | 2014-03-27 | 2015-09-30 | 东和株式会社 | Inspecting jig, cutting device and cutting method |
| CN105280526A (en) * | 2014-07-18 | 2016-01-27 | 东和株式会社 | Cutting device and cutting method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US9065031B2 (en) | 2010-07-23 | 2015-06-23 | Sharp Kabushiki Kaisha | Light-emitting device with liquid-repellent layer and manufacturing method therefore |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2003092305A (en) * | 2001-09-17 | 2003-03-28 | Towa Corp | Apparatus for sealing and molding electronic part with resin |
| JP2003152005A (en) * | 2001-11-19 | 2003-05-23 | Towa Corp | Resin sealing molding device of semiconductor element |
| JP2003209130A (en) * | 2002-01-17 | 2003-07-25 | Towa Corp | Resin molding method and apparatus for electronic part |
| JP2004207424A (en) * | 2002-12-25 | 2004-07-22 | Towa Corp | Cutting-off method and equipment of substrate |
| JP4426799B2 (en) * | 2003-09-04 | 2010-03-03 | Ｔｏｗａ株式会社 | Substrate cutting method and apparatus |
| JP2005190077A (en) * | 2003-12-25 | 2005-07-14 | Towa Corp | Processor and program supply method for processor |
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2008
- 2008-06-13 JP JP2008155555A patent/JP5511154B2/en active Active
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- 2009-06-09 KR KR1020117000658A patent/KR101930496B1/en active IP Right Grant
- 2009-06-09 WO PCT/JP2009/002585 patent/WO2009150821A1/en active Application Filing
- 2009-06-09 CN CN2009801206225A patent/CN102047399A/en active Pending
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104952767A (en) * | 2014-03-27 | 2015-09-30 | 东和株式会社 | Inspecting jig, cutting device and cutting method |
| CN104952767B (en) * | 2014-03-27 | 2018-05-22 | 东和株式会社 | It checks with fixture, disconnecting device and cutting-off method |
| CN105280526A (en) * | 2014-07-18 | 2016-01-27 | 东和株式会社 | Cutting device and cutting method |
| CN105280526B (en) * | 2014-07-18 | 2018-04-10 | 东和株式会社 | Shearing device and cutting-off method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110028349A (en) | 2011-03-17 |
| TWI524402B (en) | 2016-03-01 |
| TW201007831A (en) | 2010-02-16 |
| KR101930496B1 (en) | 2018-12-19 |
| WO2009150821A1 (en) | 2009-12-17 |
| JP2009302323A (en) | 2009-12-24 |
| JP5511154B2 (en) | 2014-06-04 |
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Application publication date: 20110504 |