TWI651295B - 基板處理裝置及基板處理方法 - Google Patents

基板處理裝置及基板處理方法 Download PDF

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Publication number
TWI651295B
TWI651295B TW106137740A TW106137740A TWI651295B TW I651295 B TWI651295 B TW I651295B TW 106137740 A TW106137740 A TW 106137740A TW 106137740 A TW106137740 A TW 106137740A TW I651295 B TWI651295 B TW I651295B
Authority
TW
Taiwan
Prior art keywords
substrate
sublimation
substance
liquid
pattern forming
Prior art date
Application number
TW106137740A
Other languages
English (en)
Chinese (zh)
Other versions
TW201825447A (zh
Inventor
佐佐木悠太
塙洋祐
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW201825447A publication Critical patent/TW201825447A/zh
Application granted granted Critical
Publication of TWI651295B publication Critical patent/TWI651295B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW106137740A 2016-12-26 2017-11-01 基板處理裝置及基板處理方法 TWI651295B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016-250700 2016-12-26
JP2016250700 2016-12-26
JP2017204294A JP7001423B2 (ja) 2016-12-26 2017-10-23 基板処理装置及び基板処理方法
JP2017-204294 2017-10-23

Publications (2)

Publication Number Publication Date
TW201825447A TW201825447A (zh) 2018-07-16
TWI651295B true TWI651295B (zh) 2019-02-21

Family

ID=62785872

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106137740A TWI651295B (zh) 2016-12-26 2017-11-01 基板處理裝置及基板處理方法

Country Status (3)

Country Link
JP (1) JP7001423B2 (ja)
KR (1) KR102052799B1 (ja)
TW (1) TWI651295B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI762895B (zh) * 2019-05-29 2022-05-01 日商斯庫林集團股份有限公司 含有昇華性物質的液體之製造方法、基板乾燥方法及基板處理裝置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7232583B2 (ja) * 2018-07-25 2023-03-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7300272B2 (ja) * 2018-08-24 2023-06-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
WO2020039835A1 (ja) * 2018-08-24 2020-02-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7122911B2 (ja) * 2018-08-31 2022-08-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TWI756719B (zh) 2019-06-28 2022-03-01 日商斯庫林集團股份有限公司 基板處理液
JP2023020501A (ja) * 2021-07-30 2023-02-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及び基板処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013042094A (ja) * 2011-08-19 2013-02-28 Central Glass Co Ltd ウェハの洗浄方法
JP2015050414A (ja) * 2013-09-04 2015-03-16 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥装置
JP2015142069A (ja) * 2014-01-30 2015-08-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TW201606072A (zh) * 2014-06-11 2016-02-16 杜邦三井氟化合物股份有限公司 供乾燥半導體圖案之用的置換溶液，及乾燥半導體圖案的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005223184A (ja) * 2004-02-06 2005-08-18 Nippon Zeon Co Ltd 洗浄液及びその利用
JP2006041065A (ja) * 2004-07-26 2006-02-09 Nippon Zeon Co Ltd 固体噴霧洗浄方法
JP5647845B2 (ja) * 2010-09-29 2015-01-07 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥装置及び基板乾燥方法
US9673037B2 (en) * 2011-05-31 2017-06-06 Law Research Corporation Substrate freeze dry apparatus and method
JP2016025233A (ja) * 2014-07-22 2016-02-08 株式会社東芝 基板処理装置、及び基板処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013042094A (ja) * 2011-08-19 2013-02-28 Central Glass Co Ltd ウェハの洗浄方法
JP2015050414A (ja) * 2013-09-04 2015-03-16 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥装置
JP2015142069A (ja) * 2014-01-30 2015-08-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TW201606072A (zh) * 2014-06-11 2016-02-16 杜邦三井氟化合物股份有限公司 供乾燥半導體圖案之用的置換溶液，及乾燥半導體圖案的方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI762895B (zh) * 2019-05-29 2022-05-01 日商斯庫林集團股份有限公司 含有昇華性物質的液體之製造方法、基板乾燥方法及基板處理裝置

Also Published As

Publication number Publication date
TW201825447A (zh) 2018-07-16
JP7001423B2 (ja) 2022-01-19
KR20180075380A (ko) 2018-07-04
KR102052799B1 (ko) 2019-12-05
JP2018107426A (ja) 2018-07-05

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