TWI350781B - - Google Patents
Info
- Publication number
- TWI350781B TWI350781B TW093141817A TW93141817A TWI350781B TW I350781 B TWI350781 B TW I350781B TW 093141817 A TW093141817 A TW 093141817A TW 93141817 A TW93141817 A TW 93141817A TW I350781 B TWI350781 B TW I350781B
- Authority
- TW
- Taiwan
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004044188A JP2005236082A (ja) | 2004-02-20 | 2004-02-20 | レーザーダイシング用粘着シート及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200533450A TW200533450A (en) | 2005-10-16 |
TWI350781B true TWI350781B (zh) | 2011-10-21 |
Family
ID=34709138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93141817A TW200533450A (en) | 2004-02-20 | 2004-12-31 | Adhesive sheet for laser dicing and its manufacturing method |
Country Status (7)
Country | Link |
---|---|
US (2) | US7564119B2 (zh) |
EP (1) | EP1566236B1 (zh) |
JP (1) | JP2005236082A (zh) |
KR (1) | KR101116484B1 (zh) |
CN (1) | CN100523107C (zh) |
DE (1) | DE602005005872T2 (zh) |
TW (1) | TW200533450A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI593775B (zh) * | 2013-04-05 | 2017-08-01 | Nitto Denko Corp | Adhesive tape |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4107417B2 (ja) * | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
JPWO2005112091A1 (ja) * | 2004-05-18 | 2008-03-27 | 日立化成工業株式会社 | 粘接着シート並びにそれを用いた半導体装置及びその製造方法 |
JP4165467B2 (ja) * | 2004-07-12 | 2008-10-15 | セイコーエプソン株式会社 | ダイシングシート、半導体装置の製造方法 |
WO2007001078A1 (ja) | 2005-06-27 | 2007-01-04 | Nitto Denko Corporation | レーザ加工用表面保護シート |
JP4762671B2 (ja) * | 2005-10-26 | 2011-08-31 | 古河電気工業株式会社 | ダイシングテープ、および半導体ウェハダイシング方法 |
US20070111480A1 (en) * | 2005-11-16 | 2007-05-17 | Denso Corporation | Wafer product and processing method therefor |
JP4927393B2 (ja) * | 2005-11-30 | 2012-05-09 | 古河電気工業株式会社 | ダイシングテープ |
JP4777761B2 (ja) * | 2005-12-02 | 2011-09-21 | 株式会社ディスコ | ウエーハの分割方法 |
TW200800584A (en) * | 2006-04-03 | 2008-01-01 | Gunze Kk | Surface protective tape used for back grinding of semiconductor wafer and base film for the surface protective tape |
JP2008279597A (ja) | 2006-05-10 | 2008-11-20 | Oji Paper Co Ltd | 凹凸パターン形成シートおよびその製造方法、反射防止体、位相差板、工程シート原版ならびに光学素子の製造方法 |
JP4438961B2 (ja) * | 2006-06-20 | 2010-03-24 | 電気化学工業株式会社 | 多層フィルム |
JP2008060170A (ja) * | 2006-08-29 | 2008-03-13 | Nitto Denko Corp | ウォータージェットレーザダイシング用粘着シート |
JP4767144B2 (ja) * | 2006-10-04 | 2011-09-07 | 日東電工株式会社 | レーザ加工用粘着シート |
US20090261084A1 (en) * | 2006-12-05 | 2009-10-22 | Lintec Corporation | Laser Dicing Sheet and Manufacturing Method For Chip Body |
US8114520B2 (en) * | 2006-12-05 | 2012-02-14 | Lintec Corporation | Laser dicing sheet and process for producing chip body |
JP5059559B2 (ja) * | 2006-12-05 | 2012-10-24 | リンテック株式会社 | レーザーダイシングシートおよびチップ体の製造方法 |
JP5727688B2 (ja) * | 2008-03-31 | 2015-06-03 | リンテック株式会社 | エネルギー線硬化型重合体、エネルギー線硬化型粘着剤組成物、粘着シートおよび半導体ウエハの加工方法 |
JP5456642B2 (ja) * | 2009-12-24 | 2014-04-02 | 日東電工株式会社 | フリップチップ型半導体裏面用フィルム |
CN103238205B (zh) * | 2010-12-06 | 2016-05-18 | 木本股份有限公司 | 激光切割用辅助片 |
DE102011100608B4 (de) | 2011-03-03 | 2024-03-28 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Suspension zum Schutz eines Halbleitermaterials und Verfahren zur Herstellung eines Halbleiterkörpers |
JP5978051B2 (ja) * | 2011-10-17 | 2016-08-24 | 日東電工株式会社 | 粘着テープ用フィルムおよび粘着テープ |
WO2013146616A1 (ja) * | 2012-03-28 | 2013-10-03 | 株式会社 きもと | 機能性粘着シート |
WO2013146617A1 (ja) | 2012-03-30 | 2013-10-03 | 株式会社 きもと | 易剥離性粘着フィルム及び金属板の加工方法 |
US20150037915A1 (en) * | 2013-07-31 | 2015-02-05 | Wei-Sheng Lei | Method and system for laser focus plane determination in a laser scribing process |
US10147630B2 (en) * | 2014-06-11 | 2018-12-04 | John Cleaon Moore | Sectional porous carrier forming a temporary impervious support |
JP6399923B2 (ja) * | 2014-12-24 | 2018-10-03 | 株式会社ディスコ | 板状物のレーザー加工方法 |
JP6980684B2 (ja) * | 2016-11-02 | 2021-12-15 | リンテック株式会社 | ダイシングシート |
JP6286014B2 (ja) * | 2016-12-19 | 2018-02-28 | パナック株式会社 | 工程用保護フィルム |
CN110128958A (zh) * | 2018-02-09 | 2019-08-16 | 日东电工株式会社 | 切割带 |
JP7141924B2 (ja) * | 2018-02-09 | 2022-09-26 | 日東電工株式会社 | ダイシングテープ |
JP6783958B2 (ja) * | 2018-08-10 | 2020-11-11 | リンテック株式会社 | 粘着シート用基材及び電子部品加工用粘着シート |
JP7319044B2 (ja) * | 2018-12-14 | 2023-08-01 | Tdk株式会社 | 素子アレイの製造装置と特定素子の除去装置 |
CN112620973B (zh) * | 2020-12-18 | 2023-04-07 | 西安晟光硅研半导体科技有限公司 | 一种碳化硅晶片单向三层双向六级台阶切割工艺 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63310132A (ja) | 1987-06-12 | 1988-12-19 | F S K Kk | ウエハ貼着用粘着シ−ト |
JP3520996B2 (ja) * | 1991-12-24 | 2004-04-19 | 三菱化学ポリエステルフィルム株式会社 | 半導体ウエハ貼着用粘着シート |
JP3299601B2 (ja) | 1993-07-27 | 2002-07-08 | リンテック株式会社 | ウェハ貼着用粘着シート |
JPH07221052A (ja) * | 1994-02-04 | 1995-08-18 | Furukawa Electric Co Ltd:The | 半導体ウエハ固定用粘着テープ |
JP2601131Y2 (ja) * | 1994-12-15 | 1999-11-08 | 日東電工株式会社 | セパレータ付粘着シート |
TW340967B (en) | 1996-02-19 | 1998-09-21 | Toray Industries | An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device |
JPH1083975A (ja) * | 1996-09-06 | 1998-03-31 | Omron Corp | 導体ウエハの粘着テープおよび貼着方法 |
DE69728653T2 (de) * | 1996-10-03 | 2005-03-24 | Teijin Ltd. | Trennfolie |
US5994205A (en) * | 1997-02-03 | 1999-11-30 | Kabushiki Kaisha Toshiba | Method of separating semiconductor devices |
JP3886225B2 (ja) * | 1997-09-24 | 2007-02-28 | 日東電工株式会社 | 両面粘着シ―ト類 |
JP3763710B2 (ja) * | 1999-09-29 | 2006-04-05 | 信越化学工業株式会社 | 防塵用カバーフィルム付きウエハ支持台及びその製造方法 |
JP4438973B2 (ja) * | 2000-05-23 | 2010-03-24 | アムコア テクノロジー,インコーポレイテッド | シート状樹脂組成物及びそれを用いた半導体装置の製造方法 |
JP4659300B2 (ja) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
JP2003033887A (ja) | 2000-09-13 | 2003-02-04 | Hamamatsu Photonics Kk | レーザ加工方法 |
JP4109823B2 (ja) * | 2000-10-10 | 2008-07-02 | 株式会社東芝 | 半導体装置の製造方法 |
JP2002173649A (ja) * | 2000-12-04 | 2002-06-21 | Asahi Rubber Kk | 巻回テープ |
JP4087144B2 (ja) | 2001-04-23 | 2008-05-21 | 古河電気工業株式会社 | レーザーダイシング用粘着テープ |
JP4886937B2 (ja) | 2001-05-17 | 2012-02-29 | リンテック株式会社 | ダイシングシート及びダイシング方法 |
JP4780855B2 (ja) | 2001-05-24 | 2011-09-28 | 株式会社きもと | 印刷用シート |
US20030026932A1 (en) * | 2001-07-30 | 2003-02-06 | Johnson John R. | Multilayer laminate |
US20030107807A1 (en) * | 2001-12-06 | 2003-06-12 | Yuuji Saiki | Optical member and liquid crystal display |
JP3838637B2 (ja) * | 2002-06-10 | 2006-10-25 | 日東電工株式会社 | ガラス基板ダイシング用粘着シートおよびガラス基板ダイシング方法 |
JP2004051914A (ja) * | 2002-07-24 | 2004-02-19 | Lintec Corp | 積層シートおよびその製造方法 |
JP2005032903A (ja) * | 2003-07-10 | 2005-02-03 | Oki Electric Ind Co Ltd | 半導体装置及びその製造方法 |
-
2004
- 2004-02-20 JP JP2004044188A patent/JP2005236082A/ja active Pending
- 2004-12-31 TW TW93141817A patent/TW200533450A/zh not_active IP Right Cessation
-
2005
- 2005-02-10 EP EP20050002826 patent/EP1566236B1/en not_active Expired - Fee Related
- 2005-02-10 US US11/054,795 patent/US7564119B2/en not_active Expired - Fee Related
- 2005-02-10 DE DE200560005872 patent/DE602005005872T2/de active Active
- 2005-02-18 KR KR1020050013605A patent/KR101116484B1/ko active IP Right Grant
- 2005-02-21 CN CNB2005100093793A patent/CN100523107C/zh not_active Expired - Fee Related
-
2009
- 2009-06-15 US US12/484,939 patent/US7767556B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI593775B (zh) * | 2013-04-05 | 2017-08-01 | Nitto Denko Corp | Adhesive tape |
Also Published As
Publication number | Publication date |
---|---|
CN100523107C (zh) | 2009-08-05 |
DE602005005872T2 (de) | 2009-06-10 |
EP1566236B1 (en) | 2008-04-09 |
US20050186709A1 (en) | 2005-08-25 |
US7767556B2 (en) | 2010-08-03 |
KR20060042991A (ko) | 2006-05-15 |
US20090253231A1 (en) | 2009-10-08 |
DE602005005872D1 (de) | 2008-05-21 |
EP1566236A1 (en) | 2005-08-24 |
JP2005236082A (ja) | 2005-09-02 |
KR101116484B1 (ko) | 2012-03-07 |
CN1657584A (zh) | 2005-08-24 |
TW200533450A (en) | 2005-10-16 |
US7564119B2 (en) | 2009-07-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |