KR20050084553A - 적층 세라믹 전자 부품 및 그 제조방법 - Google Patents
적층 세라믹 전자 부품 및 그 제조방법 Download PDFInfo
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- KR20050084553A KR20050084553A KR1020057004422A KR20057004422A KR20050084553A KR 20050084553 A KR20050084553 A KR 20050084553A KR 1020057004422 A KR1020057004422 A KR 1020057004422A KR 20057004422 A KR20057004422 A KR 20057004422A KR 20050084553 A KR20050084553 A KR 20050084553A
- Authority
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- South Korea
- Prior art keywords
- ceramic
- coil
- element portion
- ceramic layer
- permeability
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 148
- 238000000034 method Methods 0.000 title description 11
- 239000000463 material Substances 0.000 claims description 20
- 239000003990 capacitor Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 238000010030 laminating Methods 0.000 claims description 12
- 239000002002 slurry Substances 0.000 claims description 12
- 229910010293 ceramic material Inorganic materials 0.000 claims description 8
- 230000008034 disappearance Effects 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 2
- 230000035699 permeability Effects 0.000 abstract description 70
- 229910000859 α-Fe Inorganic materials 0.000 abstract description 26
- 239000010410 layer Substances 0.000 description 51
- 239000002994 raw material Substances 0.000 description 14
- 239000004020 conductor Substances 0.000 description 13
- 239000011148 porous material Substances 0.000 description 13
- 238000010304 firing Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 239000011229 interlayer Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000002270 dispersing agent Substances 0.000 description 3
- 238000007667 floating Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910007565 Zn—Cu Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/075—Ladder networks, e.g. electric wave filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/0026—Multilayer LC-filter
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0057—Constructional details comprising magnetic material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Filters And Equalizers (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
Claims (7)
- 세라믹층과 내부 전극을 적층하여 구성한 제1 소자부와,세라믹층과 내부 전극을 적층하여 구성한 제2 소자부를 구비하고,적어도 상기 제1 소자부와 상기 제2 소자부를 적층하여 세라믹 적층체를 구성하며, 상기 제1 소자부의 세라믹층의 공공율(空孔率; porosity)과 상기 제2 소자부의 세라믹층의 공공율이 다른 것을 특징으로 하는 적층 세라믹 전자 부품.
- 제1항에 있어서, 상기 제1 소자부가 내부 전극을 전기적으로 접속하여 구성한 제1 코일을 내장하고, 상기 제2 소자부가 내부 전극을 전기적으로 접속하여 구성한 제2 코일을 내장하며, 상기 제1 코일과 상기 제2 코일이 전기적으로 접속하여 인덕터를 구성하고 있는 것을 특징으로 하는 적층 세라믹 전자 부품.
- 제1항에 있어서, 상기 제1 소자부가 내부 전극을 전기적으로 접속하여 구성한 코일을 내장하고, 상기 제2 소자부가 세라믹층을 사이에 두고 대향하는 내부 전극으로 구성한 커패시터를 내장하며, 상기 제2 소자부의 세라믹층의 공공율이, 상기 제1 소자부의 세라믹층의 공공율보다 낮고, 상기 코일과 상기 커패시터가 전기적으로 접속하여 LC필터를 구성하고 있는 것을 특징으로 하는 적층 세라믹 전자 부품.
- 제1항, 제2항 또는 제3항에 있어서, 상기 제1 소자부 및 상기 제2 소자부의 세라믹층은 동일 종류의 세라믹 재료로 이루어지는 것을 특징으로 하는 적층 세라믹 전자 부품.
- 세라믹층과 내부 전극을 적층하여 구성한 제1 소자부와, 세라믹층과 내부 전극을 적층하여 구성한 제2 소자부를 구비하고, 적어도 상기 제1 소자부와 상기 제2 소자부를 적층하여 세라믹 적층체를 구성한 적층 세라믹 전자 부품의 제조방법으로서,상기 제1 소자부의 세라믹층이 되는 세라믹 슬러리에의 입상 소실재(粒狀 燒失材)의 첨가량과, 상기 제2 소자부의 세라믹층이 되는 세라믹 슬러리에의 입상 소실재의 첨가량을 다르게 하여, 세라믹층의 공공율이 서로 다른 제1 소자부 및 제2 소자부를 제작하는 것을 특징으로 하는 적층 세라믹 전자 부품의 제조방법.
- 제5항에 있어서, 상기 제1 소자부의 세라믹층이 되는 세라믹 슬러리 또는 상기 제2 소자부의 세라믹층이 되는 세라믹 슬러리의 어느 한 쪽에는 입상 소실재는 첨가되지 않는 것을 특징으로 하는 적층 세라믹 전자 부품의 제조방법.
- 제5항 또는 제6항에 있어서, 상기 제1 소자부 및 상기 제2 소자부의 세라믹층이 되는 세라믹 슬러리는 동일 종류의 세라믹 재료를 이용하는 것을 특징으로 하는 적층 세라믹 전자 부품의 제조방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2003-00341438 | 2003-09-30 | ||
JP2003341438 | 2003-09-30 |
Publications (2)
Publication Number | Publication Date |
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KR20050084553A true KR20050084553A (ko) | 2005-08-26 |
KR100678325B1 KR100678325B1 (ko) | 2007-02-02 |
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KR1020057004422A KR100678325B1 (ko) | 2003-09-30 | 2004-08-31 | 적층 세라믹 전자 부품 및 그 제조방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7251120B2 (ko) |
JP (1) | JPWO2005034151A1 (ko) |
KR (1) | KR100678325B1 (ko) |
CN (1) | CN1701399A (ko) |
WO (1) | WO2005034151A1 (ko) |
Families Citing this family (26)
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JP4650119B2 (ja) * | 2005-06-23 | 2011-03-16 | 株式会社村田製作所 | 積層型電子部品 |
US20070014243A1 (en) * | 2005-07-14 | 2007-01-18 | Yahoo! Inc. | System and method for provisioning a user device |
JP4811464B2 (ja) * | 2006-06-20 | 2011-11-09 | 株式会社村田製作所 | 積層コイル部品 |
TW200829099A (en) * | 2006-10-05 | 2008-07-01 | Mitsui Mining & Smelting Co | Capacitor layer-forming material, method for producing capacitor layer-forming material, and printed wiring board comprising built-in capacitor obtained by using the capacitor layer-forming material |
JP5194635B2 (ja) * | 2007-08-20 | 2013-05-08 | 株式会社村田製作所 | セラミック多層基板及びその製造方法 |
JP6005945B2 (ja) * | 2011-03-18 | 2016-10-12 | 日本碍子株式会社 | 複合電子部品 |
KR101983150B1 (ko) * | 2013-10-11 | 2019-05-28 | 삼성전기주식회사 | 적층형 인덕터 및 그 제조 방법 |
KR20150053170A (ko) * | 2013-11-07 | 2015-05-15 | 삼성전기주식회사 | 적층형 전자부품 및 그 제조방법 |
KR102004787B1 (ko) * | 2014-04-02 | 2019-07-29 | 삼성전기주식회사 | 적층형 전자부품 및 그 제조방법 |
JP6156345B2 (ja) * | 2014-12-10 | 2017-07-05 | 株式会社村田製作所 | 電子部品及びその製造方法 |
GB2535481A (en) * | 2015-02-17 | 2016-08-24 | Skf Ab | Electrically insulated bearing |
JP6536437B2 (ja) * | 2016-03-04 | 2019-07-03 | 株式会社村田製作所 | 電子部品 |
JP6508126B2 (ja) * | 2016-05-26 | 2019-05-08 | 株式会社村田製作所 | コイル部品 |
CN109313981B (zh) * | 2016-06-16 | 2021-05-14 | 株式会社村田制作所 | 电子部件的制造方法 |
KR20180033883A (ko) * | 2016-09-26 | 2018-04-04 | 삼성전기주식회사 | 인덕터 |
JP6520888B2 (ja) * | 2016-10-31 | 2019-05-29 | 株式会社村田製作所 | 複合型電子部品 |
JP6575773B2 (ja) * | 2017-01-31 | 2019-09-18 | 株式会社村田製作所 | コイル部品、及び該コイル部品の製造方法 |
JP2018152448A (ja) * | 2017-03-13 | 2018-09-27 | アンリツ株式会社 | チョークコイル実装基板 |
US11094447B2 (en) * | 2017-03-30 | 2021-08-17 | Rohm Co., Ltd. | Chip inductor and method for manufacturing the same |
US10595411B2 (en) * | 2017-05-10 | 2020-03-17 | Power Wave Electronics Co., Ltd. | Method for manufacturing chip signal elements |
JP7044508B2 (ja) * | 2017-09-29 | 2022-03-30 | 太陽誘電株式会社 | 磁気結合型コイル部品 |
JP2019096818A (ja) | 2017-11-27 | 2019-06-20 | 株式会社村田製作所 | 積層型コイル部品 |
JP6407400B1 (ja) * | 2017-12-26 | 2018-10-17 | Tdk株式会社 | 積層コイル部品 |
KR102393212B1 (ko) * | 2018-02-22 | 2022-05-02 | 삼성전기주식회사 | 인덕터 |
JP7092070B2 (ja) * | 2019-03-04 | 2022-06-28 | 株式会社村田製作所 | 積層型コイル部品 |
JP2021093468A (ja) * | 2019-12-11 | 2021-06-17 | Tdk株式会社 | コイル部品 |
Family Cites Families (14)
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JP3624681B2 (ja) * | 1997-04-18 | 2005-03-02 | 松下電器産業株式会社 | 複合磁性材料およびその製造方法 |
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JP3891523B2 (ja) * | 1998-03-04 | 2007-03-14 | 株式会社シンク・ラボラトリー | 円筒体の砥石研磨装置 |
JP2910758B1 (ja) * | 1998-04-27 | 1999-06-23 | 株式会社村田製作所 | 積層型lc部品 |
JP4300493B2 (ja) | 1998-06-05 | 2009-07-22 | 日立金属株式会社 | セラミック積層体及びその製造方法 |
JP2000164455A (ja) * | 1998-11-27 | 2000-06-16 | Taiyo Yuden Co Ltd | チップ状電子部品とその製造方法 |
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JP2001114569A (ja) * | 1999-10-20 | 2001-04-24 | Murata Mfg Co Ltd | セラミックスラリー組成物、セラミックグリーンシート及び積層セラミック電子部品の製造方法 |
US6477031B1 (en) * | 2000-03-22 | 2002-11-05 | Tdk Corporation | Electronic component for high frequency signals and method for fabricating the same |
JP2003152490A (ja) * | 2001-11-16 | 2003-05-23 | Murata Mfg Co Ltd | 積層型lc複合部品 |
KR100544908B1 (ko) | 2002-04-01 | 2006-01-24 | 가부시키가이샤 무라타 세이사쿠쇼 | 세라믹 전자부품 및 그 제조방법 |
JP3933077B2 (ja) * | 2002-04-01 | 2007-06-20 | 株式会社村田製作所 | セラミック電子部品の製造方法 |
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2004
- 2004-08-31 US US10/526,409 patent/US7251120B2/en active Active
- 2004-08-31 JP JP2005514371A patent/JPWO2005034151A1/ja active Pending
- 2004-08-31 WO PCT/JP2004/012546 patent/WO2005034151A1/ja active IP Right Grant
- 2004-08-31 KR KR1020057004422A patent/KR100678325B1/ko active IP Right Grant
- 2004-08-31 CN CNA2004800007594A patent/CN1701399A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JPWO2005034151A1 (ja) | 2006-12-14 |
CN1701399A (zh) | 2005-11-23 |
KR100678325B1 (ko) | 2007-02-02 |
US7251120B2 (en) | 2007-07-31 |
US20060014303A1 (en) | 2006-01-19 |
WO2005034151A1 (ja) | 2005-04-14 |
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