JP2018152448A - チョークコイル実装基板 - Google Patents
チョークコイル実装基板 Download PDFInfo
- Publication number
- JP2018152448A JP2018152448A JP2017047100A JP2017047100A JP2018152448A JP 2018152448 A JP2018152448 A JP 2018152448A JP 2017047100 A JP2017047100 A JP 2017047100A JP 2017047100 A JP2017047100 A JP 2017047100A JP 2018152448 A JP2018152448 A JP 2018152448A
- Authority
- JP
- Japan
- Prior art keywords
- choke coil
- circuit board
- coil
- board
- choke
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
- H01F27/2828—Construction of conductive connections, of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/343—Preventing or reducing surge voltages; oscillations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/40—Structural association with built-in electric component, e.g. fuse
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
10 チョークコイル
11 本体部
12,13 外部電極
14 導体部
20 RFC
21 絶縁性基板
21a 上面
21b 下面
25 コイル本体
25a,25b 端子部
26,27 抵抗体
30 回路基板
Claims (5)
- コイル状の導体部(14)が埋め込まれた本体部(11)、及び、前記本体部の長手方向の両端部を覆うようにそれぞれ設けられ、前記導体部の両端に電気的に接続された第1及び第2の外部電極(12,13)を有するチョークコイル(10)と、
前記チョークコイルが実装される回路基板(30)と、を含むチョークコイル実装基板(1)であって、
前記長手方向が前記回路基板の基板面に対して垂直となる状態で、前記第1の外部電極が前記回路基板に電気的に接続されていることを特徴とするチョークコイル実装基板。 - 絶縁性基板(21)と、
前記絶縁性基板の一面(21a)側に導体で渦巻き状に複数周パターン形成されたコイル本体(25)と、
前記絶縁性基板の一面側で、前記コイル本体の最外端と最内端にパターン形成されたワイヤボンディング用の端子部(25a,25b)と、
前記絶縁性基板の一面側で、前記コイル本体の異なる周の導体間を等価的に抵抗成分で接続するようにパターン形成され、前記導体間の線間容量、浮遊容量に起因する共振を抑圧する抵抗体(26,27)と、を有する高周波用チョークコイル(20)が前記回路基板に実装されており、
前記チョークコイルの前記第2の外部電極が、前記高周波用チョークコイルの最外端の前記端子部にワイヤボンディングにより電気的に接続されていることを特徴とする請求項1に記載のチョークコイル実装基板。 - 前記チョークコイルが直方体形状であることを特徴とする請求項1に記載のチョークコイル実装基板。
- 前記チョークコイルが直方体形状であることを特徴とする請求項2に記載のチョークコイル実装基板。
- 前記チョークコイルの前記第2の外部電極の上面の高さと、前記高周波用チョークコイルの最外端の前記端子部の高さが等しいことを特徴とする請求項2又は請求項4に記載のチョークコイル実装基板。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017047100A JP2018152448A (ja) | 2017-03-13 | 2017-03-13 | チョークコイル実装基板 |
CN201810144993.8A CN108573801B (zh) | 2017-03-13 | 2018-02-12 | 扼流圈装配基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017047100A JP2018152448A (ja) | 2017-03-13 | 2017-03-13 | チョークコイル実装基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2018152448A true JP2018152448A (ja) | 2018-09-27 |
Family
ID=63576648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017047100A Pending JP2018152448A (ja) | 2017-03-13 | 2017-03-13 | チョークコイル実装基板 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2018152448A (ja) |
CN (1) | CN108573801B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111986877A (zh) * | 2019-05-24 | 2020-11-24 | 株式会社村田制作所 | 层叠型线圈部件 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10199908A (ja) * | 1997-01-04 | 1998-07-31 | T I F:Kk | 半導体装置およびその製造方法 |
US6418029B1 (en) * | 2000-02-28 | 2002-07-09 | Mckee James S. | Interconnect system having vertically mounted passive components on an underside of a substrate |
JP2004214651A (ja) * | 2002-12-27 | 2004-07-29 | Samsung Electronics Co Ltd | 光モジュール |
US20050189138A1 (en) * | 2002-07-30 | 2005-09-01 | Richard Bardsley | Electronic assembly and method of manufacture thereof |
JP2016146423A (ja) * | 2015-02-09 | 2016-08-12 | アンリツ株式会社 | 高周波用チョークコイルおよびその製造方法 |
JP2016213310A (ja) * | 2015-05-08 | 2016-12-15 | 株式会社村田製作所 | フレキシブル基板、電子機器および電子機器の製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100678325B1 (ko) * | 2003-09-30 | 2007-02-02 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 세라믹 전자 부품 및 그 제조방법 |
DE102009008110A1 (de) * | 2009-02-09 | 2010-08-19 | Epcos Ag | Hochfrequenz-Schwingdrossel |
CN102881403B (zh) * | 2012-10-18 | 2015-03-11 | 深圳顺络电子股份有限公司 | 一种叠层电感器 |
KR101642578B1 (ko) * | 2013-10-16 | 2016-08-10 | 삼성전기주식회사 | 코일부품, 그 실장기판 및 포장체 |
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2017
- 2017-03-13 JP JP2017047100A patent/JP2018152448A/ja active Pending
-
2018
- 2018-02-12 CN CN201810144993.8A patent/CN108573801B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10199908A (ja) * | 1997-01-04 | 1998-07-31 | T I F:Kk | 半導体装置およびその製造方法 |
US6418029B1 (en) * | 2000-02-28 | 2002-07-09 | Mckee James S. | Interconnect system having vertically mounted passive components on an underside of a substrate |
US20050189138A1 (en) * | 2002-07-30 | 2005-09-01 | Richard Bardsley | Electronic assembly and method of manufacture thereof |
JP2004214651A (ja) * | 2002-12-27 | 2004-07-29 | Samsung Electronics Co Ltd | 光モジュール |
JP2016146423A (ja) * | 2015-02-09 | 2016-08-12 | アンリツ株式会社 | 高周波用チョークコイルおよびその製造方法 |
JP2016213310A (ja) * | 2015-05-08 | 2016-12-15 | 株式会社村田製作所 | フレキシブル基板、電子機器および電子機器の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111986877A (zh) * | 2019-05-24 | 2020-11-24 | 株式会社村田制作所 | 层叠型线圈部件 |
CN111986877B (zh) * | 2019-05-24 | 2023-03-10 | 株式会社村田制作所 | 层叠型线圈部件 |
Also Published As
Publication number | Publication date |
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CN108573801A (zh) | 2018-09-25 |
CN108573801B (zh) | 2021-03-23 |
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