JP6054150B2 - プローブカードケース及びプローブカードの搬送方法 - Google Patents
プローブカードケース及びプローブカードの搬送方法 Download PDFInfo
- Publication number
- JP6054150B2 JP6054150B2 JP2012256209A JP2012256209A JP6054150B2 JP 6054150 B2 JP6054150 B2 JP 6054150B2 JP 2012256209 A JP2012256209 A JP 2012256209A JP 2012256209 A JP2012256209 A JP 2012256209A JP 6054150 B2 JP6054150 B2 JP 6054150B2
- Authority
- JP
- Japan
- Prior art keywords
- probe card
- case
- case member
- probe
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
Claims (6)
- プローブカードを収納するためのプローブカードケースであって、
前記プローブカードを所定位置に載置可能とされた第1ケース部材と、
前記第1ケース部材の上側に嵌合可能とされ、前記プローブカードを固定するためのカード固定機構を有する第2ケース部材と、
前記第1ケース部材と前記第2ケース部材とを固定するためのケース固定機構と、
を具備し、
前記プローブカードを内部に収納し、前記第1ケース部材と前記第2ケース部材とを固定した状態で搬送可能とされるとともに、
前記プローブカードを前記第2ケース部材に固定した状態で、前記第2ケース部材のみと共に前記プローブカードを搬送可能とされた
ことを特徴とするプローブカードケース。 - 請求項1記載のプローブカードケースであって、
前記第2ケース部材の外側から前記カード固定機構による前記プローブカードの固定及び解除を可能とされている
ことを特徴とするプローブカードケース。 - 請求項1又は2記載のプローブカードケースであって、
前記第2ケース部材の少なくとも一部が透明とされ、内部の前記プローブカードを外部から目視可能とされている
ことを特徴とするプローブカードケース。 - 請求項1〜3のいずれか1項記載のプローブカードケースであって、
前記第2ケース部材に、持ち運ぶための取っ手が複数設けられている
ことを特徴とするプローブカードケース。 - 請求項1〜4のいずれか1項記載のプローブカードケースであって、
前記第2ケース部材の上面と前記第1ケース部材の下面に、重ね合わせた際に嵌合する嵌合部が配設されている
ことを特徴とするプローブカードケース。 - 絶縁性の基板と、
前記基板の下面側に配設されたプローブと、
前記基板の上面側に配設され、前記プローブと電気的に接続され、電気的測定装置と接続される電気的接続部と、
前記基板の周囲を囲む枠体とを具備するプローブカードを搬送するプローブカードの搬送方法であって、
請求項1乃至5のいずれか1項記載のプローブカードケース内に前記プローブカードを収容する工程と、
前記プローブカードを前記第2ケース部材に固定した状態で、前記第2ケース部材のみと共に前記プローブカードを搬送する工程と
を具備することを特徴とするプローブカードの搬送方法。
Priority Applications (14)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012256209A JP6054150B2 (ja) | 2012-11-22 | 2012-11-22 | プローブカードケース及びプローブカードの搬送方法 |
KR1020177001812A KR101783176B1 (ko) | 2012-11-22 | 2013-11-12 | 프로브 카드 케이스 및 프로브 카드의 반송 방법 |
SG10201700984PA SG10201700984PA (en) | 2012-11-22 | 2013-11-12 | Probe card case and probe card transfer method |
PCT/JP2013/080968 WO2014080850A1 (ja) | 2012-11-22 | 2013-11-12 | プローブカードケース及びプローブカードの搬送方法 |
US14/646,344 US10184954B2 (en) | 2012-11-22 | 2013-11-12 | Probe card case and probe card transfer method |
SG11201504019PA SG11201504019PA (en) | 2012-11-22 | 2013-11-12 | Probe card case and probe card transfer method |
CN201710076111.4A CN107064570B (zh) | 2012-11-22 | 2013-11-12 | 探针卡盒和探针卡输送方法 |
KR1020157012005A KR101829111B1 (ko) | 2012-11-22 | 2013-11-12 | 프로브 카드 케이스 및 프로브 카드의 반송 방법 |
MYPI2015001354A MY176287A (en) | 2012-11-22 | 2013-11-12 | Probe card case and probe card transfer method |
MYPI2017000211A MY193930A (en) | 2012-11-22 | 2013-11-12 | Probe card case and probe card transfer method |
CN201380061159.8A CN104813458B (zh) | 2012-11-22 | 2013-11-12 | 探针卡盒和探针卡输送方法 |
TW106107979A TWI635295B (zh) | 2012-11-22 | 2013-11-19 | Probe card carrier |
TW102142078A TWI596349B (zh) | 2012-11-22 | 2013-11-19 | Probe card housing and probe card transport method |
US15/428,371 US10908180B2 (en) | 2012-11-22 | 2017-02-09 | Probe card case and probe card transfer method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012256209A JP6054150B2 (ja) | 2012-11-22 | 2012-11-22 | プローブカードケース及びプローブカードの搬送方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016213304A Division JP6054574B1 (ja) | 2016-10-31 | 2016-10-31 | プローブカード搬送具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014103358A JP2014103358A (ja) | 2014-06-05 |
JP6054150B2 true JP6054150B2 (ja) | 2016-12-27 |
Family
ID=50776033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012256209A Active JP6054150B2 (ja) | 2012-11-22 | 2012-11-22 | プローブカードケース及びプローブカードの搬送方法 |
Country Status (8)
Country | Link |
---|---|
US (2) | US10184954B2 (ja) |
JP (1) | JP6054150B2 (ja) |
KR (2) | KR101783176B1 (ja) |
CN (2) | CN107064570B (ja) |
MY (2) | MY176287A (ja) |
SG (2) | SG10201700984PA (ja) |
TW (2) | TWI635295B (ja) |
WO (1) | WO2014080850A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7383486B2 (ja) | 2017-06-05 | 2023-11-20 | アクセリス テクノロジーズ, インコーポレイテッド | イオン原料物質としてヨウ化アルミニウムを使用する場合の水素共ガス |
Families Citing this family (7)
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KR101595940B1 (ko) * | 2014-10-23 | 2016-02-19 | 주식회사 인아텍 | 반도체 관련 부품을 테스트하는 다양한 사이즈의 프루브카드를 운반하는 안전 케이스 |
KR102335827B1 (ko) | 2014-12-24 | 2021-12-08 | 삼성전자주식회사 | 프로브 카드 로딩 장치, 그를 포함하는 프로브 카드 관리 시스템 |
CN108089116B (zh) * | 2017-12-01 | 2020-04-14 | 上海华岭集成电路技术股份有限公司 | 一种可旋转的探针卡 |
CN110297110B (zh) * | 2018-03-21 | 2022-02-15 | 科磊股份有限公司 | 探针结构、夹具、容置盒、自动化探针替换***及方法 |
JP2019197010A (ja) * | 2018-05-11 | 2019-11-14 | 株式会社協同 | プローブカード収納ケース |
JP7138004B2 (ja) | 2018-09-28 | 2022-09-15 | 株式会社日本マイクロニクス | プローブカード保持具 |
TWI835675B (zh) * | 2023-06-20 | 2024-03-11 | 京元電子股份有限公司 | 自動化探針卡取放裝置及其控制方法 |
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-
2012
- 2012-11-22 JP JP2012256209A patent/JP6054150B2/ja active Active
-
2013
- 2013-11-12 MY MYPI2015001354A patent/MY176287A/en unknown
- 2013-11-12 SG SG10201700984PA patent/SG10201700984PA/en unknown
- 2013-11-12 WO PCT/JP2013/080968 patent/WO2014080850A1/ja active Application Filing
- 2013-11-12 MY MYPI2017000211A patent/MY193930A/en unknown
- 2013-11-12 SG SG11201504019PA patent/SG11201504019PA/en unknown
- 2013-11-12 CN CN201710076111.4A patent/CN107064570B/zh active Active
- 2013-11-12 US US14/646,344 patent/US10184954B2/en active Active
- 2013-11-12 KR KR1020177001812A patent/KR101783176B1/ko active IP Right Grant
- 2013-11-12 CN CN201380061159.8A patent/CN104813458B/zh active Active
- 2013-11-12 KR KR1020157012005A patent/KR101829111B1/ko active IP Right Grant
- 2013-11-19 TW TW106107979A patent/TWI635295B/zh active
- 2013-11-19 TW TW102142078A patent/TWI596349B/zh active
-
2017
- 2017-02-09 US US15/428,371 patent/US10908180B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7383486B2 (ja) | 2017-06-05 | 2023-11-20 | アクセリス テクノロジーズ, インコーポレイテッド | イオン原料物質としてヨウ化アルミニウムを使用する場合の水素共ガス |
Also Published As
Publication number | Publication date |
---|---|
KR101829111B1 (ko) | 2018-02-13 |
MY193930A (en) | 2022-11-02 |
US10908180B2 (en) | 2021-02-02 |
US10184954B2 (en) | 2019-01-22 |
MY176287A (en) | 2020-07-27 |
KR101783176B1 (ko) | 2017-09-28 |
TW201435367A (zh) | 2014-09-16 |
WO2014080850A1 (ja) | 2014-05-30 |
US20150285838A1 (en) | 2015-10-08 |
TW201723505A (zh) | 2017-07-01 |
KR20150090056A (ko) | 2015-08-05 |
CN107064570A (zh) | 2017-08-18 |
US20170153272A1 (en) | 2017-06-01 |
CN104813458A (zh) | 2015-07-29 |
KR20170012579A (ko) | 2017-02-02 |
TWI635295B (zh) | 2018-09-11 |
SG11201504019PA (en) | 2015-06-29 |
SG10201700984PA (en) | 2017-04-27 |
CN104813458B (zh) | 2018-05-08 |
TWI596349B (zh) | 2017-08-21 |
CN107064570B (zh) | 2020-07-10 |
JP2014103358A (ja) | 2014-06-05 |
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