JPWO2016021618A1 - 配線回路部品の作製方法、配線回路部品を作製するための金型、樹脂製配線回路部品 - Google Patents
配線回路部品の作製方法、配線回路部品を作製するための金型、樹脂製配線回路部品 Download PDFInfo
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- JPWO2016021618A1 JPWO2016021618A1 JP2016540254A JP2016540254A JPWO2016021618A1 JP WO2016021618 A1 JPWO2016021618 A1 JP WO2016021618A1 JP 2016540254 A JP2016540254 A JP 2016540254A JP 2016540254 A JP2016540254 A JP 2016540254A JP WO2016021618 A1 JPWO2016021618 A1 JP WO2016021618A1
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- 229920005989 resin Polymers 0.000 title claims abstract description 90
- 239000011347 resin Substances 0.000 title claims abstract description 90
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 238000004891 communication Methods 0.000 claims abstract description 40
- 239000011162 core material Substances 0.000 claims abstract description 38
- 238000000465 moulding Methods 0.000 claims description 40
- 229920000515 polycarbonate Polymers 0.000 claims description 14
- 239000004417 polycarbonate Substances 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 11
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 6
- 230000001105 regulatory effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000003763 resistance to breakage Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1635—Making multilayered or multicoloured articles using displaceable mould parts, e.g. retractable partition between adjacent mould cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2628—Moulds with mould parts forming holes in or through the moulded article, e.g. for bearing cages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1615—The materials being injected at different moulding stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2055/00—Use of specific polymers obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in a single one of main groups B29K2023/00 - B29K2049/00, e.g. having a vinyl group, as moulding material
- B29K2055/02—ABS polymers, i.e. acrylonitrile-butadiene-styrene polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2069/00—Use of PC, i.e. polycarbonates or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0005—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0007—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0011—Electromagnetic wave shielding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
2 基板部
3 表側配線
4 連通配線
5 裏側配線
6 一方面溝
7 連通部
8 他方面溝
11 第1固定金型
12 第2固定金型
13 溝用突起
14 連通ピン
15 ピン
16 平面部位
17 中心ピン
18 第1押ピン
19 第2押ピン
21 可動金型
22、23 コア部材
25 プレート
26 操作ピン
31 第1樹脂流路
32 第2樹脂流路
34 傾き駒
Claims (5)
- 配線を行うための一方面溝を一方面に形成すると共に、成形面からコア材を突出させることで配線を行うための他方面溝を他方面に形成し、更に、前記一方面溝と前記他方面溝をつなぐ連通部を形成するように、非通電性樹脂製の基板部を成形し、
成形面から前記コア材を没動させた後、前記基板部に対して導電可能な状態になる導電側樹脂を供給して、前記一方面溝、前記他方面溝、前記連通部に導電可能な状態になる導電側樹脂を成形した
ことを特徴とする配線回路部品の作製方法。 - 固定側の第1固定金型、第2固定金型と、可動側の可動金型が備えられ、
前記可動金型には、前記第1固定金型、前記第2固定金型との対向面に出没自在な他方面突起が備えられ、
前記第1固定金型には、前記可動金型との対向面に一方面突起及び、連通ピンが備えられると共に、前記第2固定金型には、前記可動金型との対向面に平面部位が備えられ、
前記第1固定金型には、前記可動金型の前記他方面突起が突出している状態で、前記第1固定金型と前記可動金型が型締めされた際に、空間部に非通電性樹脂を供給し、前記一方面突起の部位の一方面溝、前記連通ピンの部位の連通部、前記他方面突起の部位の他方面溝を有する基板部を成形する第1樹脂供給部が備えられ、
前記第2固定金型には、前記可動金型に成形後の前記基板部が装着されたまま、前記可動金型の前記他方面突起を没動させた状態で、前記第2固定金型と前記可動金型が型締めされた際に、前記基板部の一方面溝、前記他方面溝、前記連通部に、導電可能な状態になる導電側樹脂を供給して配線部を成形する第2樹脂供給部が備えられている
ことを特徴とする配線回路部品を作製するための金型。 - 請求項2に記載の配線回路部品を作製するための金型において、
前記他方面突起は複数種類備えられて共通のプレートに固定され、
前記プレートが前記可動金型に往復移動自在に支持され、
前記プレートが往復移動することにより前記他方面突起が前記第2固定金型との対向面で出没自在とされ、
前記可動金型には、前記プレートを往復移動させるための傾動部材が備えられ、
前記傾動部材は、一方側に傾くことで前記他方面突起を突出させる状態に前記プレートを移動させ、他方側に傾くことで前記他方面突起を没動させる状態に前記プレートを移動させ、
前記第1固定金型には、前記可動金型との間で型締めされた際に、前記傾動部材を一方側に傾け規制する第1押ピンが備えられ、
前記第2固定金型には、前記可動金型との間で型締めされた際に、前記プレートを介して前記傾動部材を一方側に傾け規制する第2押ピンが備えられている
ことを特徴とする配線回路部品を作製するための金型。 - 請求項2もしくは請求項3に記載の配線回路部品を作製するための金型において、
前記第1樹脂供給部から供給される非通電性樹脂は、防磁体となるABS樹脂であり、
前記第2樹脂供給部から供給される導電可能な状態になる導電側樹脂は、めっきにより金属を被覆できるポリカーボネートである
ことを特徴とする配線回路部品を作製するための金型。 - 非通電性樹脂製の基板部と、
前記基板部の一方面に設けられ、導電可能な状態になる導電側樹脂製の一方面側の配線と、
前記基板部の他方面に設けられ、導電可能な状態になる導電側樹脂製の他方面側の配線と、
前記一方面側の配線、及び、前記他方面側の配線をつなぐ導電側樹脂製の連通部の配線とを備えた
ことを特徴とする樹脂製配線回路部品。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2014159877 | 2014-08-05 | ||
JP2014159877 | 2014-08-05 | ||
PCT/JP2015/072147 WO2016021618A1 (ja) | 2014-08-05 | 2015-08-04 | 配線回路部品の作製方法、配線回路部品を作製するための金型、樹脂製配線回路部品 |
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JPWO2016021618A1 true JPWO2016021618A1 (ja) | 2017-06-01 |
JP6278370B2 JP6278370B2 (ja) | 2018-02-14 |
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US (1) | US10390437B2 (ja) |
EP (1) | EP3197248B1 (ja) |
JP (1) | JP6278370B2 (ja) |
WO (1) | WO2016021618A1 (ja) |
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US10785871B1 (en) * | 2018-12-12 | 2020-09-22 | Vlt, Inc. | Panel molded electronic assemblies with integral terminals |
US10158357B1 (en) | 2016-04-05 | 2018-12-18 | Vlt, Inc. | Method and apparatus for delivering power to semiconductors |
US11336167B1 (en) | 2016-04-05 | 2022-05-17 | Vicor Corporation | Delivering power to semiconductor loads |
US10903734B1 (en) | 2016-04-05 | 2021-01-26 | Vicor Corporation | Delivering power to semiconductor loads |
JP7074075B2 (ja) | 2019-01-09 | 2022-05-24 | トヨタ自動車株式会社 | 推定装置 |
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US10390437B2 (en) | 2019-08-20 |
WO2016021618A1 (ja) | 2016-02-11 |
EP3197248A1 (en) | 2017-07-26 |
EP3197248B1 (en) | 2020-07-15 |
JP6278370B2 (ja) | 2018-02-14 |
EP3197248A4 (en) | 2018-03-07 |
US20170231096A1 (en) | 2017-08-10 |
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