JP6749118B2 - 基板転写方法および基板転写装置 - Google Patents

基板転写方法および基板転写装置 Download PDF

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Publication number
JP6749118B2
JP6749118B2 JP2016066291A JP2016066291A JP6749118B2 JP 6749118 B2 JP6749118 B2 JP 6749118B2 JP 2016066291 A JP2016066291 A JP 2016066291A JP 2016066291 A JP2016066291 A JP 2016066291A JP 6749118 B2 JP6749118 B2 JP 6749118B2
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JP
Japan
Prior art keywords
adhesive tape
substrate
tape
wafer
ring frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016066291A
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English (en)
Japanese (ja)
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JP2017183413A (ja
Inventor
孝夫 松下
孝夫 松下
山本　雅之
雅之 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2016066291A priority Critical patent/JP6749118B2/ja
Priority to CN201680084245.4A priority patent/CN109155271A/zh
Priority to KR1020187024602A priority patent/KR20180129773A/ko
Priority to PCT/JP2016/087444 priority patent/WO2017168871A1/ja
Priority to TW106106932A priority patent/TW201801240A/zh
Publication of JP2017183413A publication Critical patent/JP2017183413A/ja
Application granted granted Critical
Publication of JP6749118B2 publication Critical patent/JP6749118B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/63—Connectors not provided for in any of the groups H01L24/10 - H01L24/50 and subgroups; Manufacturing methods related thereto
    • H01L24/64—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/63—Connectors not provided for in any of the groups H01L24/10 - H01L24/50 and subgroups; Manufacturing methods related thereto
    • H01L24/65—Structure, shape, material or disposition of the connectors prior to the connecting process

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2016066291A 2016-03-29 2016-03-29 基板転写方法および基板転写装置 Active JP6749118B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016066291A JP6749118B2 (ja) 2016-03-29 2016-03-29 基板転写方法および基板転写装置
CN201680084245.4A CN109155271A (zh) 2016-03-29 2016-12-15 基板转印方法和基板转印装置
KR1020187024602A KR20180129773A (ko) 2016-03-29 2016-12-15 기판 전사 방법 및 기판 전사 장치
PCT/JP2016/087444 WO2017168871A1 (ja) 2016-03-29 2016-12-15 基板転写方法および基板転写装置
TW106106932A TW201801240A (zh) 2016-03-29 2017-03-03 基板轉印方法及基板轉印裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016066291A JP6749118B2 (ja) 2016-03-29 2016-03-29 基板転写方法および基板転写装置

Publications (2)

Publication Number Publication Date
JP2017183413A JP2017183413A (ja) 2017-10-05
JP6749118B2 true JP6749118B2 (ja) 2020-09-02

Family

ID=59963906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016066291A Active JP6749118B2 (ja) 2016-03-29 2016-03-29 基板転写方法および基板転写装置

Country Status (5)

Country Link
JP (1) JP6749118B2 (ko)
KR (1) KR20180129773A (ko)
CN (1) CN109155271A (ko)
TW (1) TW201801240A (ko)
WO (1) WO2017168871A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020068326A (ja) * 2018-10-25 2020-04-30 リンテック株式会社 被着体処理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003168656A (ja) * 2001-11-30 2003-06-13 Hitachi Ltd 半導体装置の製造方法
JP2005260154A (ja) * 2004-03-15 2005-09-22 Tokyo Seimitsu Co Ltd チップ製造方法
JP2007088038A (ja) * 2005-09-20 2007-04-05 Lintec Corp 貼替装置及び貼替方法
JP2013254807A (ja) * 2012-06-06 2013-12-19 Mitsubishi Electric Corp 半導体装置の製造装置および半導体装置の製造方法
JP6143331B2 (ja) * 2013-03-01 2017-06-07 株式会社ディスコ ウエーハの加工方法
JP6473359B2 (ja) * 2015-03-20 2019-02-20 リンテック株式会社 シート剥離装置

Also Published As

Publication number Publication date
TW201801240A (zh) 2018-01-01
JP2017183413A (ja) 2017-10-05
CN109155271A (zh) 2019-01-04
WO2017168871A1 (ja) 2017-10-05
KR20180129773A (ko) 2018-12-05

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