WO2017168871A1 - 基板転写方法および基板転写装置 - Google Patents

基板転写方法および基板転写装置 Download PDF

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Publication number
WO2017168871A1
WO2017168871A1 PCT/JP2016/087444 JP2016087444W WO2017168871A1 WO 2017168871 A1 WO2017168871 A1 WO 2017168871A1 JP 2016087444 W JP2016087444 W JP 2016087444W WO 2017168871 A1 WO2017168871 A1 WO 2017168871A1
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WO
WIPO (PCT)
Prior art keywords
adhesive tape
substrate
tape
wafer
ring frame
Prior art date
Application number
PCT/JP2016/087444
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English (en)
French (fr)
Japanese (ja)
Inventor
孝夫 松下
山本　雅之
Original Assignee
日東電工株式会社
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Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to CN201680084245.4A priority Critical patent/CN109155271A/zh
Priority to KR1020187024602A priority patent/KR20180129773A/ko
Publication of WO2017168871A1 publication Critical patent/WO2017168871A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/63—Connectors not provided for in any of the groups H01L24/10 - H01L24/50 and subgroups; Manufacturing methods related thereto
    • H01L24/64—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/63—Connectors not provided for in any of the groups H01L24/10 - H01L24/50 and subgroups; Manufacturing methods related thereto
    • H01L24/65—Structure, shape, material or disposition of the connectors prior to the connecting process

Definitions

  • the present invention provides a substrate transfer method in which a desired process is applied to various substrates such as semiconductor wafers, circuit boards, and LEDs (Light Emitting Diodes) adhered and held on a ring frame via an adhesive tape, and then transferred to a new adhesive tape.
  • the present invention relates to a method and a substrate transfer apparatus.
  • a general semiconductor wafer (hereinafter simply referred to as a “wafer”) is protected by attaching a protective adhesive tape (protective tape) to the surface after circuit patterns of many elements are formed on the surface.
  • the wafer whose surface is protected is ground or polished from the back surface in a back grinding process to a desired thickness.
  • the protective tape is peeled from the thinned wafer and conveyed to the dicing process, the wafer is bonded and held to the ring frame via a supporting adhesive tape (dicing tape) in order to reinforce the wafer.
  • ⁇ Wafer bonded and held on the ring frame has different processing steps depending on the semiconductor chip to be manufactured. For example, when a semiconductor chip is miniaturized, a laser dicing process is performed. At this time, if the dicing is performed from the surface on which the circuit pattern is formed, the circuit is damaged due to the influence of heat. Therefore, it is necessary to perform a half cut from the back surface before the back grinding process. When each chip is mounted at a desired position after breaking the half-cut wafer, the adhesive tape and the protective tape on the surface are peeled off because the chip is sucked and transported by the collet from the chip surface.
  • the adhesive tape is re-applied from the back side of the peeled wafer such as the adhesive tape, and bonded and held on a new ring frame, and then the wafer is broken. That is, it is necessary to transfer the wafer again to a new ring frame before breaking.
  • all of the conventional transfer methods are methods in which an adhesive tape is transferred from one surface of a wafer to the other surface of the wafer.
  • a new adhesive tape is applied to the other surface of the wafer, and the adhesive tape attached to one surface is peeled off from the wafer with the adhesive tape attached to one surface. I do.
  • the conventional transfer method can transfer the adhesive tape only from one surface of the wafer to the other surface of the wafer. Therefore, when transferring a new adhesive tape to the same surface of the wafer, conventionally, the transfer is first performed from one surface of the wafer to the other surface of the wafer, and further from the other surface of the wafer to one surface of the wafer. On the other hand, it is necessary to transfer the adhesive tape. As a result, there are problems that operations related to the transfer become complicated and the time and cost required for the transfer increase.
  • the present invention has been made in view of such circumstances, and a main object of the present invention is to provide a substrate transfer method and a substrate transfer apparatus that can accurately transfer the same surface of a substrate from an old adhesive tape to a new adhesive tape.
  • the present invention has the following configuration. That is, the present invention is a substrate transfer method for transferring a substrate adhesively held in a ring frame via a first adhesive tape to a second adhesive tape, wherein the first adhesive tape is placed on the non-holding surface side.
  • the first adhesive tape is peeled from the ring frame and the substrate while the ring frame and the substrate are held by the holding member in a state where the first adhesive tape is on the non-holding surface side.
  • the second adhesive tape is attached to the peeled surface for transfer.
  • the non-holding surface side of the substrate is transferred from the first adhesive tape to the second adhesive tape by one transfer operation. Therefore, the operation of transferring the adhesive tape to the same surface of the substrate can be further simplified.
  • the present invention may have the following configuration. That is, the present invention is a substrate transfer method for transferring a substrate adhesively held in a ring frame via a first adhesive tape to a second adhesive tape, wherein the first adhesive tape is placed on the non-holding surface side.
  • a tape peeling step for peeling the first adhesive tape attached to the substrate from the substrate after the tape cutting step; and a non-holding surface of the ring frame and the substrate after the tape peeling step.
  • a transfer step of transferring by attaching a second adhesive tape from the side is a substrate transfer method for transferring a substrate adhesively held in a ring frame via a first adhesive tape to a second adhesive tape, wherein the first adhesive tape is placed on the non-holding surface side.
  • the ring frame and the substrate are held by the holding member while the first pressure-sensitive adhesive tape is on the non-holding surface side, and the first pressure-sensitive adhesive tape is cut to Separate the substrate.
  • the 1st adhesive tape is peeled from the board
  • the non-holding surface side of the substrate is transferred from the first adhesive tape to the second adhesive tape by one transfer operation. Therefore, the operation of transferring the adhesive tape to the same surface of the substrate can be further simplified.
  • the substrate is separated from the ring frame when the first adhesive tape is peeled from the substrate. Therefore, the first adhesive tape that is bonded to the substrate is not bonded to the ring frame. Therefore, in the tape peeling step, the first pressure-sensitive adhesive tape can be suitably peeled from the substrate by applying a relatively weak force corresponding to the adhesive force between the substrate and the first pressure-sensitive adhesive tape. In other words, in the tape peeling process, the wafer is not affected by the strong adhesive force between the ring frame and the first adhesive tape, so that an excessively strong force is applied when peeling the first adhesive tape. The problem that W is damaged or dissipated can be preferably avoided.
  • the substrate can be transferred to a new adhesive tape as follows, for example.
  • the first adhesive tape may be cut so that a length of a portion of the first adhesive tape protruding from an outer diameter of the substrate is equal to or less than a thickness of the substrate. preferable. According to this method, even when the portion protruding from the outer diameter of the substrate is deformed at the edge of the wafer, it is possible to reliably avoid contact between the first adhesive tape and the holding member. Therefore, it is possible to surely avoid the trouble of peeling the first adhesive tape from the substrate by bonding the first adhesive tape and the holding member, so that the transfer accuracy can be further improved.
  • the first adhesive tape is cut so as to have the same size as the substrate. According to this method, after the first adhesive tape is cut, the adhesive surface of the first adhesive tape does not protrude outside the substrate. Therefore, it can be reliably avoided that the adhesive surface of the first adhesive tape adheres to the side surface of the substrate and the adhesive surface of the first adhesive tape adheres to the holding member. Therefore, since the first adhesive tape adheres to the holding member or the side surface of the substrate, it can be surely avoided that the process of peeling the first adhesive tape from the substrate can be avoided, so that the transfer accuracy can be further improved.
  • the substrate can be transferred to a new adhesive tape as follows, for example.
  • the first adhesive tape may be cut using a cutter blade.
  • the first adhesive tape may be cut using a laser.
  • the first pressure-sensitive adhesive tape can be suitably cut, it is possible to more reliably avoid the influence of strong adhesive force between the ring frame and the first pressure-sensitive adhesive tape in the tape peeling step. Therefore, the problem that the wafer W is damaged or dissipated by applying an excessively strong force when the first adhesive tape is peeled can be more preferably avoided.
  • the substrate may be transferred to the second adhesive tape by holding the substrate on a holding member smaller than the diameter of the substrate.
  • the first adhesive tape can be cut through the tape cutting step, the first adhesive tape can be more reliably cut along the outer shape of the substrate. Therefore, it can avoid more reliably that the 1st adhesive tape and the 2nd adhesive tape adhere in a transfer process. Further, by downsizing the holding member, it is possible to avoid an increase in the size of the substrate transfer apparatus.
  • the transfer step it is preferable to perform transfer by superimposing a new ring frame on which the second adhesive tape has been applied in advance on the substrate and attaching the second adhesive tape from the non-holding surface side of the substrate.
  • the second adhesive tape is affixed to the ring frame in advance, the process and time for transferring the substrate can be shortened. Therefore, the transfer efficiency of the substrate can be improved.
  • the present invention has the following configuration in order to achieve such an object.
  • a substrate transfer apparatus for transferring a substrate bonded and held in a ring frame via a first adhesive tape to a second adhesive tape, with the first adhesive tape on the non-holding surface side
  • the holding part that holds the ring frame and the substrate, the tape peeling part that peels the first adhesive tape from the ring frame and the substrate held by the holding part, and the first adhesive tape are peeled off.
  • a transfer mechanism that performs transfer by attaching a second adhesive tape from the non-holding surface side of the ring frame and the substrate.
  • the first adhesive tape is peeled from the ring frame and the substrate while the ring frame and the substrate are held by the holding portion in a state where the first adhesive tape is on the non-holding surface side.
  • the second adhesive tape is attached to the peeled surface for transfer.
  • the non-holding surface side of the substrate is transferred from the first adhesive tape to the second adhesive tape by one transfer operation. Therefore, the above method can be preferably performed.
  • the present invention may have the following configuration. That is, a substrate transfer apparatus for transferring a substrate bonded and held in a ring frame via a first adhesive tape to a second adhesive tape, with the first adhesive tape on the non-holding surface side A holding unit that holds the ring frame and the substrate, and the first adhesive tape is cut between the ring frame and the substrate held by the holding unit to separate the ring frame and the substrate. A tape cutting part, a tape peeling part for peeling the first adhesive tape attached to the substrate separated from the ring frame from the substrate, and the substrate from which the first adhesive tape is peeled And a transfer mechanism that performs transfer by attaching a second adhesive tape from the non-holding surface side.
  • the ring frame and the substrate are held by the holding portion while the first pressure-sensitive adhesive tape is on the non-holding surface side. Separate the substrate. And the 1st adhesive tape is peeled from the board
  • the first adhesive tape may be cut such that the length of the portion where the first adhesive tape protrudes from the outer diameter of the substrate is equal to or less than the thickness of the substrate. preferable. According to this apparatus, even when the portion protruding outward from the outer diameter of the substrate is deformed at the edge of the wafer, it is possible to reliably avoid contact between the first adhesive tape and the holding portion. Therefore, it is possible to reliably avoid the occurrence of a peeling error when the first pressure-sensitive adhesive tape and the holding portion are bonded to peel off the first pressure-sensitive adhesive tape from the substrate, so that the transfer accuracy can be further improved.
  • the first adhesive tape is preferably cut so as to have the same size as the substrate.
  • the adhesive surface of the first adhesive tape does not protrude outside the substrate. Therefore, it can be reliably avoided that the adhesive surface of the first adhesive tape adheres to the side surface of the substrate and the adhesive surface of the first adhesive tape adheres to the holding member. Accordingly, it is possible to reliably prevent the first adhesive tape from adhering to the holding part and the side surface of the substrate from interfering with the step of peeling the first adhesive tape from the substrate, so that the transfer accuracy can be further improved.
  • the substrate can be transferred to a new adhesive tape as follows, for example.
  • the first adhesive tape may be cut using a cutter blade in the tape cutting unit.
  • the first adhesive tape may be cut using a laser in the tape cutting unit.
  • the first adhesive tape can be suitably cut, it is possible to more reliably avoid the influence of strong adhesive force between the ring frame and the first adhesive tape in the tape peeling step. Therefore, the problem that the wafer W is damaged or dissipated by applying an excessively strong force when the first adhesive tape is peeled can be more preferably avoided.
  • the substrate may be transferred to the second adhesive tape by holding the substrate on a holding portion smaller than the diameter of the substrate.
  • the first adhesive tape can be cut through the tape cutting step, the first adhesive tape can be more reliably cut along the outer shape of the substrate. Therefore, it can avoid more reliably that the 1st adhesive tape and the 2nd adhesive tape adhere in a transfer process. Further, by downsizing the holding member, it is possible to avoid an increase in the size of the substrate transfer apparatus.
  • the transfer mechanism it is preferable to perform transfer by superimposing a new ring frame on which the second adhesive tape has been applied in advance on the substrate and attaching the second adhesive tape from the non-holding surface side of the substrate.
  • the second adhesive tape is affixed to the ring frame in advance, the process and time for transferring the substrate can be shortened. Therefore, the transfer efficiency of the substrate can be improved.
  • the process of transferring the same surface of the substrate from the old adhesive tape to the new adhesive tape can be executed in a simpler process. Therefore, even when a variety of processes are sequentially performed on the substrate, it is possible to quickly and suitably sequentially transfer the adhesive tape having characteristics corresponding to each process, and to appropriately perform each process.
  • FIG. 1 is a plan view showing a basic configuration of a substrate transfer apparatus according to Embodiment 1.
  • FIG. It is a figure explaining the structure of the mount frame which concerns on Example 1.
  • FIG. (A) is sectional drawing which shows the structure of the mount frame before and behind transcription
  • (b) is sectional drawing which shows the structure of the mount frame before and behind transcription
  • FIG. 3 is a perspective view of a mount frame. 3 is a front view of a mount frame storage unit according to Embodiment 1.
  • FIG. It is a front view of the 1st tape cutting mechanism which concerns on Example 1.
  • FIG. It is a figure explaining the structure of the tape peeling mechanism which concerns on Example 1.
  • FIG. 6 is a diagram for explaining the operation of the substrate transfer apparatus according to the first embodiment.
  • (A) is a flowchart explaining operation
  • (b) is the schematic explaining the structure of the mount frame in each step. It is a front view explaining the structure of the mount frame in step S1 which concerns on Example 1.
  • FIG. It is a front view explaining the structure of the mount frame in step S2 which concerns on Example 1.
  • FIG. 1 is a figure which shows the structure when cut
  • (b) is a figure which shows the structure after cut
  • FIG. It is a front view explaining the structure of the mount frame in step S5 which concerns on Example 1.
  • FIG. It is a front view explaining the structure of the mount frame in step S6 which concerns on Example 1.
  • FIG. (A) is a figure which shows the structure at the time of sticking adhesive tape T2
  • (b) is a figure which shows the structure after sticking adhesive tape T2.
  • FIG. 10 is a diagram for explaining the operation of the substrate transfer apparatus according to the second embodiment.
  • (A) is a flowchart explaining operation
  • (b) is the schematic explaining the structure of the mount frame in each step. It is a perspective view explaining the structure of the tape peeling mechanism which concerns on Example 2, and the state which peels an adhesive tape. It is a figure explaining the structure of the tape peeling mechanism which concerns on the modification of Example 1.
  • FIG. 10 is a diagram for explaining the operation of the substrate transfer apparatus according to the second embodiment.
  • (A) is a flowchart explaining operation
  • (b) is the schematic explaining the structure of the mount frame in each step. It is a perspective view explaining the structure of the tape peeling mechanism which concerns on Example 2, and the state which peels an adhesive tape. It is a figure explaining the structure of the tape peeling mechanism which concerns on the modification of Example 1.
  • FIG. 10 is a diagram for explaining the operation of the substrate transfer apparatus according to the second embodiment.
  • (A) is a flowchart explaining
  • (A) is a front view explaining the structure which makes a cutter contact a wafer holding part, and cut
  • (b) is the state which cut
  • (c) is a cross-sectional view for explaining the effect of the configuration in which the protruding portion is shorter than the thickness of the wafer.
  • Embodiment 1 of the present invention will be described below with reference to the drawings.
  • FIG. 1 shows a plan view of a basic configuration of a substrate transfer apparatus 1 according to the first embodiment.
  • the substrate transfer apparatus 1 is from a mount frame MF1 in which an adhesive tape T1 is attached to one surface of a semiconductor wafer W (hereinafter simply referred to as “wafer W”).
  • the wafer W is transferred to the mount frame MF2 in which a new adhesive tape T2 is attached to the same surface (one surface) of the wafer W.
  • the substrate transfer apparatus starts from the mount frame MF1 in which the adhesive tape T1 is attached to one surface of the wafer W (upper stage), and the other surface of the wafer W.
  • a new pressure-sensitive adhesive tape T2 is pasted (middle), and the pressure-sensitive adhesive tape T1 is peeled off and transferred from the pressure-sensitive adhesive tape T1 to the pressure-sensitive adhesive tape T2 (lower).
  • the substrate transfer apparatus 1 according to the present invention is different from the conventional substrate transfer apparatus in that the surfaces to be transferred are different.
  • the mount frame MF1 is manufactured by attaching an adhesive tape T1 to one surface of the wafer W and the ring frame f.
  • the mount frame MF2 is manufactured by attaching a new adhesive tape T2 different from the adhesive tape T1 to one surface of the wafer W and the ring frame f.
  • the ring frame f in the mount frame MF1 is denoted by reference numeral f1
  • the ring frame f in the mount frame MF2 is denoted by reference numeral f2 to distinguish between them.
  • the adhesive tape T1 is an adhesive tape for circuit protection
  • the adhesive tape T2 is a heat-resistant adhesive tape.
  • the characteristics of the pressure-sensitive adhesive tape T1 and the pressure-sensitive adhesive tape T2 are not limited to the configuration of this embodiment, and pressure-sensitive adhesive tapes having different characteristics may be appropriately used depending on the purpose of processing the wafer W.
  • the substrate transfer apparatus 1 includes a mount frame storage unit 3, a first transport mechanism 5, a holding table 7, a first tape cutting mechanism 9, an ultraviolet irradiation mechanism 11, and a tape.
  • the peeling mechanism 13, the ring frame supply unit 15, the tape applying mechanism 17, the second tape cutting mechanism 19, and the mount frame collection unit 25 are provided.
  • the x direction in FIG. 1 is the left-right direction and the z direction is the up-down direction.
  • the lower side of FIG. 1 is referred to as “front side”, and the upper side of FIG. That is, the mount frame collection unit 25 is disposed on the back side of the mount frame storage unit 3 in the substrate transfer apparatus 1 shown in FIG.
  • the arrangement of the components in the substrate transfer apparatus 1 is not limited to the configuration shown in FIG. 1 and may be changed as appropriate.
  • the mount frame storage unit 3 is provided with a storage unit 71 for storing a mount frame MF1 manufactured by attaching an adhesive tape T1 to one surface of the wafer W and the ring frame f1.
  • the storage unit 71 includes a vertical rail 73 connected and fixed to the apparatus frame, and a lifting platform 77 that is screwed up and down by a motor 75 along the vertical rail 73.
  • the mount frame storage unit 3 is configured to place the mount frame MF1 on the lifting platform 77 to move up and down the pitch. Further, the ring frame supply unit 15 and the mount frame collection unit 25 have the same configuration as the mount frame supply unit 3.
  • the configuration of the mount frame storage 3 shown in FIG. 3 is an example, and the configuration may be changed as appropriate as long as the configuration can store and supply the mount frame.
  • the first transport mechanism 5 transports the mount frame MF1 stored in the mount frame storage unit 3 to the holding table 7 disposed at the cutting position S. Further, as will be described later, the first transport mechanism 5 also has a function of transporting the ring frame f1 separated from the wafer W to the mount frame storage unit 3 when the adhesive tape T1 is cut out by the first tape cutting mechanism 9. That is, the ring frame f1 and the adhesive tape T1 separated from the wafer W are collected in the mount frame storage unit 3 by the first transport mechanism 5.
  • the adhesive tape T1 corresponds to the first adhesive tape in the present invention.
  • the holding table 7 mounts and holds the mount frame MF1 and the mount frame MF2, and reciprocates between the cutting position S, the transfer position R, the irradiation position T, and the peeling position U shown in FIG. It is configured to be possible.
  • the holding table 7 includes an annular frame holding portion 29 that holds the ring frame f and a circular wafer holding portion 31 that holds the wafer W.
  • Each of the frame holding unit 29 and the wafer holding unit 31 is configured such that the height of the mounting surface can be adjusted independently and appropriately.
  • the holding table 7 corresponds to a holding unit and a holding member in the present invention.
  • An adsorption hole for adsorbing and holding the ring frame f is formed on the holding surface of the frame holding unit 29.
  • a suction hole for sucking and holding the wafer W is formed on the holding surface of the wafer holder 31. From the viewpoint of more suitably performing the cutting of the adhesive tape T1, it is preferable that the diameter of the wafer holder 31 is equal to or less than the diameter of the wafer W.
  • the holding table 7 sucks and holds the ring frame f and the wafer W with the adhesive tape T1 on the non-holding surface side. That is, the holding table 7 holds the mount frame MF1 so that the adhesive tape T1 is on the upper surface side.
  • the first tape cutting mechanism 9 is disposed above the holding table 7 when the holding table 7 is located at the cutting position S, and includes a frame 33, a movable table 35, and a support arm 37. And a cutter unit 39.
  • the movable table 35 can be moved up and down along the frame 33.
  • the support arm 37 is provided at the lower end of the arm that is cantilevered from the movable table 35, and is configured to expand and contract in the radial direction of the wafer W.
  • the cutter unit 39 is connected to the movable table 35 via the support arm 37.
  • the cutter unit 39 is mounted with a cutter 41 with a cutting edge facing downward via a cutter holder.
  • the cutter unit 39 is configured so that the turning radius can be adjusted via the support arm 37.
  • the cutter 41 turns around the axis in the z direction via the support arm 37 and cuts the adhesive tape T1 attached to the mount frame MF1 along the outer shape of the wafer W.
  • the 1st tape cutting mechanism 9 is corresponded to the tape cutting part in this invention.
  • the ring frame supply unit 15 includes a frame transport unit F that transports a new ring frame f2 to the transfer position R.
  • the ultraviolet irradiation mechanism 11 is disposed above the holding table 7 when the holding table 7 is located at the irradiation position T, and is an adhesive tape positioned on the upper surface side of the wafer W (the non-holding surface side of the holding table 7). Irradiate ultraviolet rays to T1.
  • the adhesive tape T1 is an ultraviolet curable tape
  • the adhesive strength of the adhesive tape T1 is reduced by irradiation with ultraviolet rays, so that the adhesive tape T1 can be easily peeled off.
  • the tape peeling mechanism 13 is disposed above the holding table 7 when the holding table 7 is located at the peeling position U, and peels and collects the adhesive tape T1 from the wafer W. As shown in FIG. 5A, the tape peeling mechanism 13 includes a guide roller 83 that guides the roll-off peeling tape Q, a knife-edge peeling member 85, and a winding shaft 87 that collects the peeling tape Q. It has.
  • the peeling tape Q is guided to the peeling member 85 by the guide roller 83, and after being reversed and reversed by the peeling member 85, it is wound and collected by the winding shaft 87. That is, as shown in FIG. 5B, the holding table 7 holding the wafer W is moved while the release tape Q is attached to the adhesive tape T1 attached to the surface of the wafer W. The adhesive tape T1 is peeled off from the surface of the wafer W together with the peeling tape Q.
  • the tape applying mechanism 17 is disposed above the holding table 7 when the holding table 7 is located at the transfer position R, and includes a tape supply unit 43, an applying roller 45, and a peeling roller 49. And a tape recovery unit 51.
  • the tape supply unit 43 is loaded with a wide adhesive tape T2 wound in a roll.
  • the affixing roller 45 affixes the adhesive tape T2 over the upper surface of the wafer W carried into the transfer position R and the ring frame f2 newly supplied from the ring frame supply unit 15.
  • the wafer W is transferred to the adhesive tape T2 by the tape applying mechanism 17 to produce the mount frame MF2.
  • the tape applying mechanism 17 corresponds to the transfer mechanism in the present invention.
  • the adhesive tape corresponds to the second adhesive tape in the present invention.
  • the second tape cutting mechanism 19 is arranged above the holding table 7 when the holding table 7 is located at the transfer position R, similarly to the tape applying mechanism 17. As shown in FIG. 7, the second tape cutting mechanism 19 includes a frame 53, a support shaft 55, a support arm 57, a cutter 59, and a pressing roller 61.
  • the support shaft 55 is capable of moving up and down along the frame 53, and rotates around an axis in the z direction.
  • a plurality of support arms 57 extend in the radial direction about the support shaft 55.
  • the cutter 59 is provided at the tip of the support arm 57a, and cuts the adhered adhesive tape T2 along the ring frame f.
  • the pressing roller 61 is provided at the tip of the support arm 57b and presses while rolling the tape cutting portion on the ring frame f2.
  • the mount frame collection unit 25 collects and stores the mount frame MF2 formed by transfer from the adhesive tape T1 to the adhesive tape T2.
  • the substrate transfer apparatus 1 further includes a wafer storage unit 91, a wafer transfer mechanism 93, and a wafer alignment unit 95.
  • the wafer storage unit 91 stores the wafers W in a stacked manner.
  • the wafer transfer mechanism 93 transfers the wafer W stored in the wafer storage unit 91 to the wafer alignment unit 95.
  • the wafer alignment unit 95 aligns the transferred wafer W.
  • mount frame MF1 is already manufactured and stored in the mount frame storage portion 3
  • the substrate transfer apparatus 1 uses the wafer W to mount the mount frame MF1. It can also be used as a wafer mount device to be manufactured.
  • FIG. 8A is a flowchart showing the operation of the substrate transfer apparatus 1.
  • FIG. 8B is a diagram showing a schematic configuration of the mount frame MF in each step.
  • the surface of the wafer W on which the circuit pattern is formed will be described as the surface.
  • an adhesive tape T1 that is a protective adhesive tape is attached to the surface of the wafer W in the mount frame MF1.
  • the adhesive layer of the adhesive tape T1 is composed of an ultraviolet curable adhesive.
  • Step S1 holding the mount frame
  • the mount frame storage unit 3 stores and stores a mount frame MF1 that is manufactured by adhering the adhesive tape T1 to the surface of the wafer W.
  • the first transport mechanism 5 holds the mount frame MF1 and moves from the position indicated by the dotted line to the position indicated by the solid line as shown in FIG.
  • the first transport mechanism 5 places the mount frame MF1 on the holding table 7 located at the cutting position S with the surface to which the adhesive tape T1 is applied facing upward. After placing the mount frame MF1, the first transport mechanism 5 moves to a retracted position (a left position indicated by a dotted line as an example). After the mount frame MF1 is mounted, the frame holding unit 29 sucks and holds the ring frame f1, and the wafer holding unit 31 sucks and holds the wafer W. Thus, the holding table 7 sucks and holds the mount frame F1 with the adhesive tape T1 as the non-holding surface side. A series of steps in step S1 corresponds to a holding step in the present invention.
  • Step S2 cutting adhesive tape T1
  • the first tape cutting mechanism 9 is operated, and the cutting of the adhesive tape T1 is started. That is, when the first tape cutting mechanism 9 is operated, the cutter unit 39 is lowered to a predetermined height as shown in FIG. 10A, and the cutter 41 is pierced by the adhesive tape T1. In this state, the cutter 41 turns around the axis in the z direction passing through the center of the wafer W, and cuts the adhesive tape T1 between the wafer W and the ring frame f1. In this embodiment, since the adhesive tape T1 is cut while the cutter 41 is in contact with the outer diameter of the wafer W, the adhesive tape T1 is cut into a circle having the same size as the wafer W.
  • the cutter unit 39 rises and returns to the standby position indicated by the dotted line.
  • the ring frame f1 and the wafer W connected via the adhesive tape T1 are separated.
  • the adhesive tape T1 is cut out in the same shape and size as the wafer W while the cutter 41 is in contact with the outer diameter of the wafer W. Therefore, the portion of the adhesive tape T1 where the adhesive surface is exposed (exposed portion) P) is separated from the wafer W.
  • a series of steps in step S2 corresponds to a tape cutting step in the present invention.
  • Step S3 selection of ring frame f1
  • the ring frame f1 is collected by the first transport mechanism 5. That is, the first transport mechanism 5 moves from the retracted position to the cutting position S as shown in FIG. Then, the first transport mechanism 5 descends to a predetermined height above the mount frame MF1 and grips the ring frame f1. The first transport mechanism 5 holding the ring frame f1 by suction is raised again and moved to the left side to store the ring frame f1 in the mount frame storage unit 3.
  • step S2 since the adhesive tape T1 is cut along the outer shape of the wafer W, the cut adhesive tape T1 (the adhesive tape T1 in a portion separated from the wafer W) is moved together with the ring frame f1 to the first transport mechanism. 5 is collected.
  • the exposed adhesive tape T1 includes an exposed portion P. Therefore, since the exposed portion P of the adhesive tape T1 is collected along with the ring frame f1, it is possible to avoid exposing the adhesive surface of the adhesive tape T1 on the holding table 7 by the processes of Step S2 and Step S3.
  • Step S4 peeling of adhesive tape T1
  • the holding table 7 moves from the cutting position S to the irradiation position T while holding the wafer W by suction.
  • the ultraviolet irradiation mechanism 11 irradiates the adhesive tape T1 of the wafer W carried into the irradiation position T with ultraviolet rays. Since the adhesive layer of the adhesive tape T1 is composed of an ultraviolet curable adhesive, the adhesive strength of the adhesive tape T1 is reduced by irradiation with ultraviolet rays.
  • the holding table 7 moves from the irradiation position T to the peeling position U while holding the wafer W by suction.
  • the tape peeling mechanism 13 peels and collects the adhesive tape T1 positioned on the upper surface side of the wafer W from the wafer W. That is, as shown in FIG. 5B, the release tape Q is attached to the adhesive tape T1 attached to the surface of the wafer W held on the holding table 7. And the holding table 7 is moved to the middle right of Fig.5 (a) in the state which affixed the peeling tape Q to adhesive tape T1.
  • the peeling tape Q runs back at the tip of the peeling member 85, so that the adhesive tape T ⁇ b> 1 is integrated with the peeling tape Q and the surface of the wafer W. Is peeled off.
  • the peeling tape Q is guided to the peeling member 85 by the guide roller 83 together with the peeled adhesive tape T1, and after being reversed and reversed by the peeling member 85, it is wound and collected by the winding shaft 87.
  • step S4 corresponds to the tape peeling step in the present invention.
  • Step S5 supply of ring frame f2
  • the holding table 7 moves from the peeling position U to the transfer position R while holding the wafer W by suction.
  • the frame transport unit F sucks and holds the upper surface of the ring frame f2 stored in the ring frame supply unit 15 and moves to the transfer position R.
  • the frame transport unit F places the ring frame f2 on the ring frame holding unit 29 located at the transfer position R as shown in FIG.
  • the frame transport unit F moves to the retracted position after placing the ring frame f2.
  • the frame holding unit 29 sucks and holds the ring frame f2.
  • the supply of the ring frame f2 is completed when the ring frame f2 is sucked and held.
  • the step of supplying the ring frame f2 may be performed before the step of peeling the adhesive tape T1.
  • Step S6 adheresion of adhesive tape T2
  • the tape sticking mechanism 17 operates to start the sticking of the adhesive tape T2. That is, when the tape applying mechanism 17 is operated, as shown in FIG. 13A, the applying roller 45 is lowered to a predetermined height and rolls from right to left in the drawing. When the sticking roller 45 rolls, the adhesive tape T2 loaded in the tape supply unit 43 is stuck over the upper surfaces of the wafer W and the ring frame f2 (FIG. 13B).
  • the upper surface of the wafer W is the surface side of the wafer W from which the adhesive tape T1 has been peeled off. Therefore, when the adhesive tape T2 is attached, the surface of the wafer W is transferred from the adhesive tape T1 to the new adhesive tape T2. That is, transfer is performed on the same surface of the wafer W, and a new mount frame MF2 is manufactured.
  • a series of steps in step S5 corresponds to a transfer step in the present invention.
  • Step S7 cutting adhesive tape T2
  • the second tape cutting mechanism 19 is actuated to start cutting the adhesive tape T2. That is, as shown in FIG. 14, when the second tape cutting mechanism 19 is operated, the support shaft 55 is lowered to a predetermined height, and the cutter 59 is pierced by the adhesive tape T2. In this state, the support shaft 55 is rotated around the axis in the z direction, and the adhesive tape T2 is cut into a circle along the ring frame f2.
  • the part where the adhesive tape T2 is cut on the ring frame f2 is pressed by the rolling pressing roller 61. Thereafter, the peeling roller 49 provided in the tape applying mechanism 17 is rolled from the right to the left in the figure, and the unnecessary adhesive tape T2 remaining outside the cutting line is peeled from the ring frame f2. The peeled unnecessary adhesive tape T2 is wound and collected by the tape collecting unit 51.
  • Step S8 (Mount frame collection) After the adhesive tape T2 has been attached and cut, the mount frame is collected. That is, the second transport device (not shown) transports the mount frame MF2 formed by sticking the adhesive tape T2 to the mount frame collection unit 25. The mount frame collection unit 25 collects and stores the mount frame MF2.
  • transfer is performed from the mount frame MF1 configured by adhering the adhesive tape T1 to the surface of the wafer W to the mount frame MF2 configured by adhering the adhesive tape T2 to the surface of the wafer W. All steps are completed.
  • the adhesive tape T3 is attached to the other surface of the wafer W with respect to the wafer W (FIG. 15, upper stage) having the adhesive tape T1 attached to one surface. Is peeled off (FIG. 15, middle). And it is necessary to affix the new adhesive tape T2 on one surface of the wafer W after the adhesive tape T1 is peeled off and peel off the adhesive tape T3 (FIG. 15, lower stage).
  • the present inventors have obtained the following knowledge as a result of repeatedly conducting experiments and the like.
  • the adhesive tape T1 is peeled directly from each of the ring frame f1 and the wafer W, there is a concern that the wafer W may be damaged or a peeling failure may occur depending on the material of the ring frame f1, the wafer W, and the adhesive tape T1. . That is, depending on the material of each component, the adhesive force B1 between the ring frame f1 and the adhesive tape T1 and the adhesive force B2 between the wafer W and the adhesive tape T1 are different. In view of general examples of materials used as the ring frame f1, the wafer W, and the adhesive tape, the adhesive force B1 is usually stronger than the adhesive force B2.
  • the protective adhesive tape affixed to the wafer surface is selected according to the contents of each process, such as solvent-resistant tape, heat-resistant tape, dicing tape, and pickup tape. It is necessary to replace the tape with new adhesive tapes having the required characteristics.
  • the conventional transfer method requires two transfer processes each time the adhesive tape is pasted on the same surface of the wafer, so that it is difficult to continuously perform various processes on the wafer.
  • the substrate transfer apparatus 1 includes a first tape cutting mechanism 9 and a tape peeling mechanism 13.
  • the first tape cutting mechanism 9 separates the wafer W and the ring frame f1 by cutting the adhesive tape T1 between the wafer W and the ring frame f1.
  • the tape peeling mechanism 13 peels the adhesive tape T1 from the wafer W separated from the ring frame f1.
  • step S3 the adhesive tape T1 adhered to the wafer W is not adhered to the ring frame f1. Therefore, the tape peeling mechanism 13 can suitably peel off the adhesive tape T1 by applying a relatively weak force according to the adhesive force B2 between the wafer W and the adhesive tape T1. That is, the problem that the wafer W is damaged or dissipated by applying an excessively strong force according to the adhesive force B1 between the ring frame f1 and the adhesive tape T1 can be preferably avoided.
  • the adhesive tape T1 can be peeled from the wafer W by a relatively weak force corresponding to the adhesive force B2
  • the adhesive tape T1 when the adhesive tape T1 is peeled from the wafer W, the other of the mount frame MF1 is separated by another adhesive tape. There is no need to support the surface. Therefore, in the substrate transfer method according to the first embodiment, the adhesive tape can be replaced (transferred) on the same surface of the mount frame MF1 by one transfer (FIG. 2A). As a result, it is possible to simplify the process required to replace the adhesive tape on the same surface of the mount frame MF1, and to greatly reduce the cost.
  • the holding table 7 can freely reciprocate at least between the cutting position S, the transfer position R, and the peeling position U while holding the mount frame MF1. That is, since a series of steps for performing the transfer process of the adhesive tape are all performed on the same holding table 7, it is not necessary to transfer the wafer W from the holding table 7 to another holding table during the transfer process. .
  • the holding table 7 holds the wafer W. Transferring from the adhesive tape T1 to the adhesive tape T2 on the same surface of the wafer W can be executed in a state where the wafer W is stably held.
  • the adhesive tape having the characteristics corresponding to the contents of the necessary process can be obtained with the holding table 7 stably holding the wafer W. It can be easily and sequentially transferred. As a result, even when various processes such as acid / alkaline processing and breaking processing are continuously performed on a wafer that has been subjected to thinning processing or singulation processing, appropriate adhesion can be achieved with a simple process. Since the transfer can be sequentially performed on the tape, the processing on the wafer can be suitably executed.
  • the first tape cutting mechanism 9 cuts the adhesive tape T1 of the mount frame MF1 held on the holding table 7 to the same size as the wafer W.
  • the adhesive tape T1 that protrudes outward from one surface of the wafer W, that is, the exposed portion P is separated from the wafer W.
  • the separated exposed portion P is collected by the first transport mechanism 5 together with the ring frame f1 and stored in the mount frame storage portion 3.
  • the adhesive surface of the adhesive tape T1 does not protrude outside the wafer W after the adhesive tape T1 is cut out. Therefore, when the adhesive tape T1 is peeled off from the surface of the wafer W, it is ensured that the adhesive surface of the adhesive tape T1 adheres to the side surface of the wafer W and that the adhesive surface of the adhesive tape T1 adheres to the holding table 7. Can be avoided. Therefore, the process of peeling the adhesive tape T1 can be performed with higher accuracy. Further, in the holding table 7 according to the first embodiment, since the wafer holding unit 31 can be made smaller than the diameter of the wafer W, an increase in the size of the substrate transfer apparatus 1 can be avoided.
  • FIG. 16A is a flowchart illustrating the operation of the substrate transfer apparatus according to the second embodiment.
  • FIG. 16B is a diagram illustrating a schematic configuration of the mount frame MF in each step according to the second embodiment.
  • the configuration of the substrate transfer apparatus according to the second embodiment is the same as that of the substrate transfer apparatus 1 according to the first embodiment.
  • the operation of the substrate transfer apparatus according to the second embodiment is different from the operation according to the first embodiment in that steps S2 to S4 according to the first embodiment are omitted.
  • Example 2 first, the mounting frame MF1 is sucked and held on the holding table 7 with the adhesive tape T1 on the non-holding surface side (step S1A). Then, the tape peeling mechanism 13 peels the adhesive tape T1 from each of the ring frame f1 and the wafer W (step S2A).
  • the tape applying mechanism 17 applies a new adhesive tape T2 to the ring frame f1 after the adhesive tape T1 has been peeled off and the upper surface side (non-holding surface side) of the wafer W to create a new mount frame MF2 (step) S3A). Thereafter, the adhesive tape T2 is cut along the upper surface of the ring frame f1 (step S4A), and the mount frame MF2 is recovered (step S5A).
  • Step S1A holding the mount frame
  • the process of step S1A is common to step S1 of the first embodiment. That is, the first transport mechanism 5 holds the mount frame MF1 stored in the mount frame storage unit 3, and the holding table positioned at the cutting position S with the surface to which the adhesive tape T1 is applied facing upward. 7 mounts the mount frame MF1 (FIG. 9). The holding table 7 sucks and holds the mount frame F1 with the adhesive tape T1 as the non-holding surface side.
  • Step S2A peeling of adhesive tape T1
  • the holding table 7 moves from the cutting position S to the irradiation position T while holding the mount frame MF1 by suction.
  • the ultraviolet irradiation mechanism 11 irradiates the adhesive tape T1 of the mount frame MF1 carried into the irradiation position T with ultraviolet rays. Since the adhesive layer of the adhesive tape T1 is composed of an ultraviolet curable adhesive, the adhesive strength of the adhesive tape T1 is reduced by irradiation with ultraviolet rays.
  • the holding table 7 moves from the irradiation position T to the peeling position U with the mount frame MF1 being sucked and held.
  • the tape peeling mechanism 13 peels and collects the adhesive tape T1 located on the upper surface side of the wafer W from the mount frame MF1. That is, as shown in FIG. 17, the release tape Q is attached to the adhesive tape T1 attached to the surface of the mount frame MF1. And the holding table 7 is moved in the state which affixed the peeling tape Q to adhesive tape T1.
  • the peeling tape Q runs back at the tip of the peeling member 85, so that the adhesive tape T1 is integrated with the peeling tape Q and the ring frame f1 and the wafer W. Is peeled off from the surface. Since the adhesive force of the adhesive tape T1 is reduced by the ultraviolet irradiation, the adhesive tape T1 can be easily peeled from the ring frame f1 even if the force applied to the mount frame MF1 is relatively weak.
  • the peeling tape Q is guided to the peeling member 85 by the guide roller 83 together with the peeled adhesive tape T1, and after being reversed and reversed by the peeling member 85, it is wound and collected by the winding shaft 87.
  • Step S3A (Affixing adhesive tape T2) After the peeling of the adhesive tape T1 is completed, the tape applying mechanism 17 is activated and the application of the adhesive tape T2 is started.
  • the recovery process of the ring frame f1 and the supply process of the ring frame f2 are omitted. Therefore, in Example 2, the adhesive tape T2 is attached to the wafer W and the ring frame f1.
  • the process itself for applying the adhesive tape T2 is the same as that in the first embodiment. That is, when the tape applying mechanism 17 is operated, as shown in FIG. 13A, the applying roller 45 is lowered to a predetermined height and rolls from right to left in the drawing. When the sticking roller 45 rolls, the adhesive tape T2 loaded in the tape supply unit 43 is stuck over the upper surfaces of the wafer W and the ring frame f1 (FIG. 13B).
  • the upper surface of the wafer W is the surface side of the wafer W from which the adhesive tape T1 has been peeled off. Therefore, when the adhesive tape T2 is attached, the surface of the wafer W is transferred from the adhesive tape T1 to the new adhesive tape T2. That is, transfer is performed on the same surface of the wafer W, and a new mount frame MF2 is manufactured.
  • a series of steps in step S3A corresponds to a transfer step in the present invention.
  • Step S4A cutting adhesive tape T2
  • the second tape cutting mechanism 19 is activated to start cutting the adhesive tape T2.
  • the process of step S4A is common to step S7 according to the first embodiment. That is, as shown in FIG. 14, when the second tape cutting mechanism 19 is operated, the cutter 59 is pierced into the adhesive tape T2 on the ring frame f1. In this state, the support shaft 55 is rotated about the axis in the z direction, and the adhesive tape T2 is cut into a circle along the ring frame f1.
  • the part where the adhesive tape T2 is cut on the ring frame f1 is pressed by the rolling pressing roller 61. Thereafter, the peeling roller 49 provided in the tape applying mechanism 17 is rolled from the right to the left in the drawing, and the unnecessary adhesive tape T2 remaining outside the cutting line is peeled from the ring frame f1. The peeled unnecessary adhesive tape T2 is wound and collected by the tape collecting unit 51.
  • Step S5A mount frame collection
  • the mount frame is collected in the same manner as in Example 1. That is, the second transport device (not shown) transports the mount frame MF2 formed by sticking the adhesive tape T2 to the mount frame collection unit 25.
  • the mount frame collection unit 25 collects and stores the mount frame MF2.
  • the adhesive tape T1 can be attached to the adhesive tape T2 on the same surface of the wafer W by one transfer process. Therefore, as in the first embodiment, it is possible to simplify the process required to replace the adhesive tape on the same surface of the mount frame MF1, and to greatly reduce the cost. In addition, since a series of processes are performed on the same holding table 7, even when various processes are continuously performed on a wafer that has been subjected to a thinning process or an individualized process, it is appropriate. The process of sequentially transferring to a suitable adhesive tape can be suitably executed.
  • Example 2 the adhesive tape T1 is simultaneously peeled from the ring frame f1 and the wafer W, and the adhesive tape T2 is attached to the same peeled surface. Therefore, in the second embodiment, unlike the first embodiment, the step of cutting the adhesive tape T1 and the series of steps of replacing the ring frame f1 with the ring frame f2 can be omitted. Therefore, in the second embodiment, the first tape cutting mechanism 9, the ring frame f2, and the ring frame supply unit 15 can be omitted, so that the substrate transfer apparatus 1 can be prevented from being enlarged and the cost can be reduced.
  • the present invention is not limited to the above embodiment, and can be modified as follows.
  • the ultraviolet curable adhesive tape T1 and the ultraviolet irradiation mechanism 11 are used.
  • the configuration is limited to the configuration using ultraviolet rays. Absent. That is, as an example, a thermosetting pressure-sensitive adhesive tape may be used as the pressure-sensitive adhesive tape T1, and the pressure-sensitive adhesive force may be reduced by heating the pressure-sensitive adhesive tape T1 as a stage before peeling the pressure-sensitive adhesive tape T1.
  • the adhesive force is reduced before the adhesive tape T1 is peeled off, so that the force required for peeling the adhesive tape T1 can be made relatively low.
  • the process of reducing the adhesive force of adhesive tape T1 before peeling adhesive tape T1 (preliminary operation).
  • the structure which does not perform may be sufficient.
  • the step of performing the preliminary operation by irradiating ultraviolet rays may be omitted.
  • the cut-off portion of the adhesive tape T1 is collected together with the ring frame f1 in step S3, but is not limited thereto. That is, a configuration may be adopted in which the cut-out portion of the adhesive tape T1 is peeled from the ring frame f1, and only the cut-out portion of the adhesive tape T1 is collected.
  • the adhesive tape T2 is applied over the ring frame f1 and the other surface of the wafer W in step S6 without newly using the ring frame f2 even in the configuration according to the first embodiment. Can be pasted. Therefore, since the ring frame f2 and the ring frame supply unit 15 can be omitted, it is possible to avoid an increase in the size of the substrate transfer apparatus 1 and to reduce the cost.
  • the adhesive tape T2 is attached to the upper surface of the ring frame f2 and the wafer W in step S6.
  • the ring frame f2 with the adhesive tape T2 attached in advance may be supplied to the wafer W carried into the transfer position R, and the adhesive tape T2 may be attached to the upper surface of the wafer W.
  • the first tape cutting mechanism 9 is configured to use the cutter 41, but may be configured to cut the adhesive tape with a laser instead of the cutter blade.
  • the semiconductor wafer has been described as an example of the substrate.
  • the apparatus can be applied to substrates of various shapes and sizes such as LED substrates and circuit boards.
  • the shape of the adhesive tape T1 cut in the tape cutting step is changed according to the outer shape of the substrate to be applied.
  • the substrate support frame to be used is not limited to the wafer ring frame f, and a square frame or the like corresponding to the shape of the substrate to be used can also be used.
  • a rectangular frame for example, a plurality of rectangular substrates can be bonded and held with an adhesive tape, and dead space can be reduced. As a result, work efficiency can be improved.
  • the transfer source ring frame f1 and the transfer destination new ring frame f2 have the same shape, but frames having different shapes may be used in combination.
  • a pre-cut type adhesive tape T2 previously cut into a ring frame shape may be attached to the ring frame f2.
  • step S2 the cutter 41 is cut while being in contact with the outer shape of the wafer while being held by the wafer holder 31 smaller than the diameter of the wafer W.
  • the tape cutting process according to step S2 is not limited to the configuration in which such an adhesive tape T1 is cut out to the same size as the wafer W. That is, as shown in FIG. 18A, the adhesive tape T1 may be cut while the cutter 41 is in contact with the outer shape of the wafer holder 31 while being held by the wafer holder 31 larger than the diameter of the wafer W. .
  • the adhesive tape T1 is cut out so as to have a larger size than the diameter of the wafer W in step S2.
  • the length k of the portion of the adhesive tape T1 that is cut out after the tape cutting step is outside the wafer W is the thickness of the wafer W as shown in FIG. G or less is preferable.
  • the cutter 41 is not brought into contact with either the outer diameter of the wafer W or the outer diameter of the wafer holding unit 31.
  • a configuration in which the adhesive tape T1 is cut out to be slightly wider than the wafer W may be employed.
  • the difference between the radius Tr of the removed adhesive tape T1 and the radius Wr of the wafer W is preferably equal to or less than the thickness G of the wafer W.
  • the adhesive tape T1 When the length k is equal to or less than the thickness G, as shown in FIG. 16C, the adhesive tape T1 is deformed so as to be bent at the end of the wafer W from the position indicated by the dotted line to the position indicated by the solid line in the transfer process. Even if it is a case, it can avoid reliably that the adhesive tape T1 and the wafer holding part 31 contact. Therefore, since the adhesive tape T1 and the wafer holding unit 31 are bonded to each other, it is possible to more reliably avoid the operation of peeling the adhesive tape T1 from the wafer W, so that the transfer to the adhesive tape T2 is more suitably performed. it can.
  • the radius D of the wafer holder 31 is smaller than the radius Tr of the cut adhesive tape T1.
  • the cutter 41 can be cut so as to penetrate the adhesive tape T1, the adhesive tape T1 can be more suitably cut.
  • “cutting the adhesive tape along the outer shape of the wafer” in the tape cutting step means not only the case where the adhesive tape T1 is cut to the same size as the wafer W. The case where the adhesive tape T1 is cut to a size wider than the outer shape of the wafer W to the extent that the adhesion between the cut adhesive tape T1 and the wafer holding unit 31 can be surely avoided is included.
  • Example 2 In Example 2 described above, after the adhesive tape T1 is peeled off, the ring frame f1 is reused and the adhesive tape T2 is attached to the non-holding surface side of the ring frame f1 and the wafer W. Absent. That is, in the second embodiment, similarly to the first embodiment, after the adhesive tape T1 is peeled off, the ring frame f1 may be recovered and a new ring frame f2 may be supplied.
  • a configuration may be adopted in which it is possible to select whether to reuse the ring frame f1 after the adhesive tape T1 is peeled off or replace the ring frame f1 with the ring frame f2.
  • the ring frame to which the adhesive tape T2 is attached can be appropriately selected as f1 or f2 according to the shape and processing of the wafer W, so that the versatility of the transfer process can be improved.

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JP2020068326A (ja) * 2018-10-25 2020-04-30 リンテック株式会社 被着体処理方法

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