JP5588667B2 - 半導体パッケージの製造方法及びこれによって製造された半導体パッケージ - Google Patents
半導体パッケージの製造方法及びこれによって製造された半導体パッケージ Download PDFInfo
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- JP5588667B2 JP5588667B2 JP2009290915A JP2009290915A JP5588667B2 JP 5588667 B2 JP5588667 B2 JP 5588667B2 JP 2009290915 A JP2009290915 A JP 2009290915A JP 2009290915 A JP2009290915 A JP 2009290915A JP 5588667 B2 JP5588667 B2 JP 5588667B2
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
2 第1パッド
3 ピラー型のバンプ
5 はんだ粒子
6 高分子樹脂
7 混合物
8 樹脂層
10 はんだ膜
14 第2基板
15 第2パッド
16 流動性硬化樹脂
17 アンダーフィル樹脂
50 第1端子
Claims (5)
- 第1基板に第1端子を形成する段階と、
高分子樹脂とはんだ粒子を含む混合物を供給して少なくとも前記第1端子の上部面と側面を覆う段階と、
前記はんだ粒子の融点以上の温度に前記第1基板を加熱して前記第1端子の上部面と側面を覆うはんだ膜を形成する段階と、
前記はんだ膜を形成した後に、前記高分子樹脂を除去して前記はんだ膜を露出させる段階と、
前記露出されたはんだ膜の側面を覆う流動性硬化樹脂を供給する段階と、
第2端子が形成された第2基板を前記第1基板上に位置させて前記第2端子と前記はんだ膜が互いに接するようにする段階と、
前記はんだ膜の融点以上の温度に前記第1基板を加熱して、前記はんだ膜が前記第1端子と前記第2端子を結合させるのと同時に前記流動性硬化樹脂が硬化される段階と
を含み、
前記第1端子は、前記第1基板の上部面から上に突出され、金属パッドとその上に位置した金属バンプを含み、
前記金属バンプは、ピラー型又はスタッド型である半導体パッケージの製造方法。 - 前記混合物は、延びて前記第1端子とこれに面する他の第1端子との間を覆うことを特徴とする請求項1に記載の半導体パッケージの製造方法。
- 前記第2基板は、半導体チップを含むことを特徴とする請求項1又は請求項2に記載の半導体パッケージの製造方法。
- 前記はんだ粒子は、0.1μm〜70μmの直径を有することを特徴とする請求項1に記載の半導体パッケージの製造方法。
- 前記混合物は、前記はんだ粒子と前記高分子樹脂を体積比で1:9〜5:5に含むことを特徴とする請求項1に記載の半導体パッケージの製造方法。
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KR10-2009-0055478 | 2009-06-22 | ||
KR1020090055478A KR101208028B1 (ko) | 2009-06-22 | 2009-06-22 | 반도체 패키지의 제조 방법 및 이에 의해 제조된 반도체 패키지 |
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JP2014105301A Pending JP2014195107A (ja) | 2009-06-22 | 2014-05-21 | 半導体パッケージの製造方法及びこれによって製造された半導体パッケージ |
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US (1) | US8030200B2 (ja) |
JP (2) | JP5588667B2 (ja) |
KR (1) | KR101208028B1 (ja) |
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US8709870B2 (en) * | 2009-08-06 | 2014-04-29 | Maxim Integrated Products, Inc. | Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages |
US8507325B2 (en) * | 2010-01-28 | 2013-08-13 | International Business Machines Corporation | Co-axial restraint for connectors within flip-chip packages |
JP5375708B2 (ja) * | 2010-03-29 | 2013-12-25 | パナソニック株式会社 | 半導体装置の製造方法 |
KR20120093589A (ko) * | 2011-02-15 | 2012-08-23 | 에스케이하이닉스 주식회사 | 반도체 패키지 및 그의 제조방법 |
US20130337615A1 (en) * | 2012-05-25 | 2013-12-19 | Applied Materials, Inc. | Polymer hot-wire chemical vapor deposition in chip scale packaging |
KR102275705B1 (ko) | 2014-07-11 | 2021-07-09 | 삼성전자주식회사 | 웨이퍼 대 웨이퍼 접합 구조 |
KR101619455B1 (ko) * | 2014-11-18 | 2016-05-11 | 주식회사 프로텍 | 적층형 반도체 패키지의 제조방법 |
CN107527554B (zh) * | 2017-08-23 | 2020-12-11 | 京东方科技集团股份有限公司 | 柔性显示面板及其制备方法、柔性显示装置 |
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JPH09115955A (ja) * | 1995-10-16 | 1997-05-02 | Mitsubishi Electric Corp | 半導体装置実装基板およびその製造方法 |
JP3346137B2 (ja) * | 1995-12-01 | 2002-11-18 | 松下電器産業株式会社 | 半田バンプの形成方法 |
EP0954208A4 (en) | 1996-12-27 | 2002-09-11 | Matsushita Electric Ind Co Ltd | METHOD AND DEVICE FOR FIXING AN ELECTRONIC COMPONENT ON A CIRCUIT BOARD |
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JP2003023243A (ja) * | 2001-07-05 | 2003-01-24 | Canon Inc | 配線基板 |
KR100398314B1 (ko) * | 2001-07-19 | 2003-09-19 | 한국과학기술원 | 고접착력 3층 구조 aca 필름 |
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JP4387265B2 (ja) * | 2004-07-29 | 2009-12-16 | 株式会社タムラ製作所 | 突起電極の製造方法 |
JP3955302B2 (ja) | 2004-09-15 | 2007-08-08 | 松下電器産業株式会社 | フリップチップ実装体の製造方法 |
KR100733208B1 (ko) * | 2004-10-11 | 2007-06-27 | 삼성전기주식회사 | 플립칩 실장 기술을 이용한 반도체 패키지 |
WO2007125789A1 (ja) * | 2006-04-27 | 2007-11-08 | Panasonic Corporation | 接続構造体及びその製造方法 |
JP5065657B2 (ja) * | 2006-11-27 | 2012-11-07 | パナソニック株式会社 | 電子装置およびその製造方法 |
JP4859717B2 (ja) * | 2007-03-14 | 2012-01-25 | 株式会社タムラ製作所 | はんだ組成物 |
JP5245276B2 (ja) * | 2007-04-11 | 2013-07-24 | 日本電気株式会社 | 電子部品の実装構造及びその実装方法 |
JP4569605B2 (ja) * | 2007-07-09 | 2010-10-27 | 日本テキサス・インスツルメンツ株式会社 | 半導体装置のアンダーフィルの充填方法 |
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KR101208028B1 (ko) | 2012-12-04 |
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US8030200B2 (en) | 2011-10-04 |
US20100320596A1 (en) | 2010-12-23 |
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