JP5120514B2 - 回路接続材料並びに回路端子の接続構造及び接続方法 - Google Patents
回路接続材料並びに回路端子の接続構造及び接続方法 Download PDFInfo
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- JP5120514B2 JP5120514B2 JP2012078289A JP2012078289A JP5120514B2 JP 5120514 B2 JP5120514 B2 JP 5120514B2 JP 2012078289 A JP2012078289 A JP 2012078289A JP 2012078289 A JP2012078289 A JP 2012078289A JP 5120514 B2 JP5120514 B2 JP 5120514B2
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Description
(1)加熱により遊離ラジカルを発生する硬化剤としてパーオキシエステル
(2)分子量10000以上の水酸基含有樹脂
(3)アクリレート、メタクリレート、及び、マレイミド化合物から選択されるラジカル重合性物質
(4)金属粒子、カーボン粒子、遷移金属類の表面を貴金属類で被覆した粒子、及び、非導電性のガラス、セラミック又はプラスチックに導通層を形成し最外層を貴金属類とした粒子から選択される導電性粒子
ラジカル重合性の官能基はアクリル基であるであることが好ましい。
アクリレート(メタクリレート)の具体例としては、メチルアクリレート、エチルアクリレート、イソプロピルアクリレート、イソブチルアクリレート、エチレングリコールジアクリレート、ジエチレングリコールジアクリレート、トリメチロールプロパントリアクリレート、テトラメチロールメタンテトラアクリレート、2−ヒドロキシ−1,3−ジアクリロキシプロパン、2,2−ビス〔4−(アクリロキシメトキシ)フェニル〕プロパン、2,2−ビス〔4−(アクリロキシポリエトキシ)フェニル〕プロパン、ジシクロペンテニルアクリレート、トリシクロデカニルアクリレート、トリス(アクリロイロキシエチル)イソシアヌレート等がある。これらは単独又は併用して用いることができ、必要によっては、ハイドロキノン、メチルエーテルハイドロキノン類などの重合禁止剤を適宜用いてもよい。また、ジシクロペンテニル基及び/又はトリシクロデカニル基及び/又はトリアジン環を有する場合は、耐熱性が向上するので好ましい。
(ただしnは1〜3の整数である)
フェノキシ樹脂(ユニオンカーバイド株式会社製、商品名PKHC、平均分子量45,000)50gを、重量比でトルエン(沸点110.6℃、SP値8.90)/酢酸エチル(沸点77.1℃、SP値9.10)=50/50の混合溶剤に溶解して、固形分40%の溶液とした。
ラジカル重合性物質としてトリグリセリンジアクリレート、リン酸エステル型アクリレート(共栄社油脂株式会社製、商品名P2m)を用いて、フェノキシ樹脂/トリグリセリンジアクリレート、リン酸エステル型アクリレートの固形重量比を50g/49g/1g(参考例2)、30g/69g/1g(参考例3)、70g/29g/1g(参考例4)としたほかは、参考例1と同様にして回路接続材料を得た。この回路接続材料を用いて、参考例1と同様にして回路を接続した。
硬化剤の配合量を2gとしたほかは、実施例2と同様にして回路接続材料を得た。
硬化剤をt−ブチルパーオキシ2−エチルヘキサノネート(日本油脂株式会社製、商品名パーブチルO)としたほかは、実施例1と同様にして回路接続材料を得た。
平均分子量45,000のフェノキシ樹脂(PKHC)100gに末端カルボキシル基含有ブタジエン−アクリロニトリル共重合体(HycarCTBNX1009−SP、宇部興産(株)製)25gを一般的方法で反応させて、カルボキシル基含有ブタジエン−アクリロニトリル共重合体で変性したフェノキシ樹脂を作製した。このフェノキシ樹脂を用い、フェノキシ樹脂/トリグリセリンジアクリレート、リン酸エステル型アクリレートの固形重量比を60g/39g/1gとしたほかは実施例1と同様にして回路接続材料を得た。
平均分子量45,000のフェノキシ樹脂(PKHC)100gにエポキシ基含有アクリル共重合体25gで変性したフェノキシ樹脂を作製した。このフェノキシ樹脂を用い、フェノキシ樹脂/トリグリセリンジアクリレート、リン酸エステル型アクリレートの固形重量比を60g/39g/1gとしたほかは実施例1と同様にして回路接続材料を得た。
エポキシ基含有アクリル共重合体(アクリルゴム)を用いフェノキシ樹脂/アクリルゴム/トリグリセリンジアクリレート、リン酸エステル型アクリレートの固形重量比を40g/20g/39g/1gとしたほかは実施例1と同様にして回路接続材料を得た。
平均分子量45,000のフェノキシ樹脂(PKHC)100gに末端にアクリル基を持つモノイソシアネート5gを一般的方法で反応させて、アクリル基で変性したフェノキシ樹脂を作製した。このフェノキシ樹脂を用い、フェノキシ樹脂/トリグリセリンジアクリレート、リン酸エステル型アクリレートの固形重量比を60g/39g/1gとしたほかは実施例1と同様にして回路接続材料を得た。
導電性粒子を平均粒径2μmのNi粒子の表面をAuで被覆(被覆厚み0.08μm)したものを用いて、0.5体積部としたほかは、実施例1と同様にして回路接続材料を得た。
導電性粒子の粒径を5μmとしたほかは、実施例1と同様にして回路接続材料を得た。
ラジカル重合性物質として2,2−ビス{4−(アクリロキシ・ジエトキシ)フェニル}プロパン(新中村化学(株)製、商品名 A−BPE−4)を用い、フェノキシ樹脂/2,2−ビス{4−(アクリロキシ・ジエトキシ)フェニル}プロパン、リン酸エステル型アクリレートの固形重量比を60g/39g/1g他は実施例1と同様にして回路接続材料を得た。
ラジカル重合性物質としてジシクロペンテニルアクリレート(共栄社油脂株式会社製、商品名DCP−A)を用い、フェノキシ樹脂/ジシクロペンテニルアクリレート、リン酸エステル型アクリレートの固形重量比を60g/39g/1gとしたほかは、実施例1と同様にして回路接続材料を得た。
ラジカル重合性物質としてトリス(アクリロイロキシエチル)イソシアヌレートを用い、フェノキシ樹脂/トリス(アクリロイロキシエチル)イソシアヌレート、リン酸エステル型アクリレートの固形重量比を60g/39g/1gとしたほかは、実施例1と同様にして回路接続材料を得た。
ラジカル重合性物質として4,4’−ビスマレイミドジフェニルメタン30gとジアリルビスフェノールA35gを120℃で20分間加熱混合したものとリン酸エステル型アクリレート(共栄社油脂株式会社製、商品名P−2m)を用いた。
ラジカル重合性物質として4,4’−ビスマレイミドジフェニルメタン30gとジアリルビスフェノールA20gを120℃で20分間加熱混合したものを用いたほかは、実施例14と同様にして回路接続材料を得た。
導電性粒子を平均粒径2μmのNi粒子の表面をPdで被覆(被覆厚み0.04μm)したものを用いて、0.5体積%としたほかは、実施例1と同様にして回路接続材料を得た。
フェノキシ樹脂(PKHC)、ビスフェノールA型エポキシ樹脂(YL980、油化シェル株式会社製品名)、イミダゾール系マイクロカプセル型硬化剤(3941HP 株式会社旭化成製商品名)を用いて、フェノキシ樹脂/ビスフェノールA型エポキシ樹脂/イミダゾール系マイクロカプセル型硬化剤の固形重量比を40/20/40とした他は、実施例1と同様にして回路接続材料を得た。
回路の接続後、上記接続部を含むFPCの隣接回路間の抵抗値を、初期と、85℃、85%RHの高温高湿槽中に500時間保持した後にマルチメータで測定した。抵抗値は隣接回路間の抵抗150点の平均(x+3σ)で示した。実施例1で得られた回路接続材料は良好な接続信頼性を示した。また、初期の接続抵抗も低く、高温高湿試験後の抵抗の上昇もわずかであり、高い耐久性を示した。また、実施例2〜18も実施例1と同様に良好な信頼性が得られた。これらに対して、比較例は、硬化反応が不十分であるため接着状態が悪く、初期の接続抵抗が高くなった。
回路の接続後、90度剥離、剥離速度50mm/分で接着力測定を行った。比較例は硬化反応が不十分で、接着強度に200gf/cm程度と接着力が低かったが、実施例1〜18では1000gf/cm程度と良好な接着力が得られた。
得られた回路接続材料を30℃の恒温槽で30日間処理し、上記と同様にして回路の接続を行い保存性を評価した。
得られた回路接続材料を用いて、ライン幅50μm、ピッチ100μm、厚み18μmの銅回路を交互に250本配置した櫛形回路を有するプリント基板とライン幅50μm、ピッチ100μm、厚み18μmの銅回路を500本有するフレキシブル回路板(FPC)を160℃、3MPaで10秒間加熱加圧して幅2mmにわたり接続した。この接続体の櫛形回路に100Vの電圧を印加し、85℃85%RH高温高湿試験500時間後の絶縁抵抗値を測定した。
厚み35μm、5mm×5mmの回路用接続材料を用い、これを厚み0.7mm、15mm×15mmのガラスにはさみ、150℃、2MPa、10秒の条件で加熱加圧を行った。初期の面積(A)と加熱加圧後の面積(B)を用いて流動性(B)/(A)の値を求めたところ、実施例1は1.9であり、実施例2〜10についても1.3〜3.0の範囲内であった。
実施例1の回路用接続材料の、硬化後の40℃での弾性率を測定したところ1500MPaであった。
得られた回路接続材料を用いて、示差走査熱量計(DSC TAインスツルメント社製 商品名910型)を用いて10℃/分の測定において、発熱反応の立ち上がり温度(Ta)、ピーク温度(Tp)、終了温度(Te)を求めた。
る。
[図2]図2は、本発明の一実施例を説明する、回路基板の仮接続工程を示す断面図であ
る。
Claims (13)
- 相対峙する回路電極間に介在され、相対向する回路電極を加圧し加圧方向の電極間を電気的に接続するフィルム状異方導電性回路接続材料であって、下記(1)〜(4)の成分を必須とするフィルム状異方導電性回路接続材料。
(1)加熱により遊離ラジカルを発生する硬化剤としてパーオキシエステル
(2)分子量10000以上の水酸基含有樹脂
(3)アクリレート、メタクリレート、及び、マレイミド化合物から選択されるラジカル重合性物質
(4)金属粒子、カーボン粒子、遷移金属類の表面を貴金属類で被覆した粒子、及び、非導電性のガラス、セラミック又はプラスチックに導通層を形成し最外層を貴金属類とした粒子から選択される導電性粒子 - 加熱により遊離ラジカルを発生する硬化剤の半減期10時間の温度が40℃以上かつ、半減期1分の温度が180℃以下である請求項1記載の回路接続材料。
- 加熱により遊離ラジカルを発生する硬化剤の半減期10時間の温度が60℃以上かつ、半減期1分の温度が170℃以下である請求項2記載の回路接続材料。
- パーオキシエステルがクミルパーオキシネオデカノエート、1,1,3,3−テトラメチルブチルパーオキシネオデカノエート、1−シクロヘキシル−1−メチルエチルパーオキシノエデカノエート、t−ヘキシルパーオキシネオデカノエート、t−ブチルパーオキシピバレート、1,1,3,3−テトラメチルブチルパーオキシ−2−エチルヘキサノネート、2,5−ジメチル−2,5−ジ(2−エチルヘキサノイルパーオキシ)ヘキサン、1−シクロヘキシル−1−メチルエチルパーオキシ−2−エチルヘキサノネート、t−ヘキシルパーオキシ−2−エチルヘキサノネート、t−ブチルパーオキシ−2−エチルヘキサノネート、t−ブチルパーオキシイソブチレート、1,1−ビス(t−ブチルパーオキシ)シクロヘキサン、t−ヘキシルパーオキシイソプロピルモノカーボネート、t−ブチルパーオキシ−3,5,5−トリメチルヘキサノネート、t−ブチルパーオキシラウレート、2,5−ジメチル−2,5−ジ(m−トルオイルパーオキシ)ヘキサン、t−ブチルパーオキシイソプロピルモノカーボネート、t−ブチルパーオキシ−2−エチルヘキシルモノカーボネート、t−ヘキシルパーオキシベンゾエート、及び、t−ブチルパーオキシアセテートから選択されることを特徴とする請求項1〜3のいずれか一項に記載の回路接続材料。
- 分子量10000以上の水酸基含有樹脂がフェノキシ樹脂である請求項1〜5のいずれか一項に記載の回路接続材料。
- 分子量10000以上の水酸基含有樹脂がカルボキシル基含有のエラストマーで変性されたフェノキシ樹脂であることを特徴とする請求項1〜6のいずれか一項に記載の回路接続材料。
- 分子量10000以上の水酸基含有樹脂がエポキシ基含有のエラストマーで変性されたフェノキシ樹脂であることを特徴とする請求項1〜6のいずれか一項に記載の回路接続材料。
- アクリルゴムを含有する請求項1〜8のいずれか一項に記載の回路接続材料。
- 第一の接続端子を有する第一の回路部材と、第二の接続端子を有する第二の回路部材とが、第一の接続端子と第二の接続端子を対向して配置されており、前記対向配置した第一の接続端子と第二の接続端子の間に請求項1〜9のいずれか一項に記載の回路接続材料が介在されており、前記対向配置した第一の接続端子と第二の接続端子が電気的に接続されている回路端子の接続構造。
- 第一の接続端子を有する第一の回路部材と、第二の接続端子を有する第二の回路部材とを、第一の接続端子と第二の接続端子を対向して配置し、前記対向配置した第一の接続端子と第二の接続端子の間に請求項1〜9のいずれか一項に記載の回路接続材料を介在させ、加熱加圧して前記対向配置した第一の接続端子と第二の接続端子を電気的に接続させる回路端子の接続方法。
- 第一の接続端子を有する第一の回路部材と、第二の接続端子を有する第二の回路部材とが、第一の接続端子と第二の接続端子を対向して配置されており、前記対向配置した第一の接続端子と第二の接続端子の間にラジカル重合による硬化性を有する回路接続材料が介在されており、前記接続端子の少なくとも一方の表面が金、銀、錫及び白金族から選ばれる金属であり、前記対向配置した第一の接続端子と第二の接続端子が電気的に接続されており、
前記ラジカル重合による硬化性を有する回路接続材料が請求項1〜9のいずれか一項に記載の回路接続材料である回路端子の接続構造。 - 第一の接続端子を有する第一の回路部材と、第二の接続端子を有する第二の回路部材とを、第一の接続端子と第二の接続端子を対向して配置し、前記対向配置した第一の接続端子と第二の接続端子の間にラジカル重合による硬化性を有する回路接続材料を介在させ、加熱加圧して前記対向配置した第一の接続端子と第二の接続端子を電気的に接続させる回路端子の接続方法であって、前記接続端子の少なくとも一方の表面が金、銀、錫及び白金族から選ばれる金属であり、ラジカル重合による硬化性を有する回路接続材料を表面が金、銀、錫及び白金族から選ばれる金属である一方の接続端子に形成した後、もう一方の回路電極を位置合わせし加熱、加圧して接続し、
前記ラジカル重合による硬化性を有する回路接続材料が請求項1〜9のいずれか一項に記載の回路接続材料である回路端子の接続方法。
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Families Citing this family (102)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7967943B2 (en) * | 1997-03-31 | 2011-06-28 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
JP3587859B2 (ja) | 1997-03-31 | 2004-11-10 | 日立化成工業株式会社 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
JP4605184B2 (ja) * | 1999-08-25 | 2011-01-05 | 日立化成工業株式会社 | 配線接続材料及びそれを用いた配線板製造方法 |
US6762249B1 (en) * | 1999-08-25 | 2004-07-13 | Hitachi Chemical Company, Ltd. | Wiring-connecting material and process for producing circuit board with the same |
CN101037572A (zh) | 1999-08-25 | 2007-09-19 | 日立化成工业株式会社 | 粘合剂,配线端子的连接方法和配线结构体 |
JP3365367B2 (ja) | 1999-09-14 | 2003-01-08 | ソニーケミカル株式会社 | Cog実装品および接続材料 |
JP4513147B2 (ja) * | 1999-12-02 | 2010-07-28 | 日立化成工業株式会社 | 回路接続方法 |
MY124944A (en) * | 2000-02-09 | 2006-07-31 | Hitachi Chemical Co Ltd | Resin composition, adhesives prepared therewith for bonding circuit members,and circuits boards |
JP2001262078A (ja) | 2000-03-17 | 2001-09-26 | Sony Chem Corp | 接続材料 |
JP2007169632A (ja) * | 2000-04-25 | 2007-07-05 | Hitachi Chem Co Ltd | 回路接続用接着剤並びにそれを用いた回路接続方法及び回路接続構造体 |
KR100463558B1 (ko) * | 2000-04-25 | 2004-12-29 | 히다치 가세고교 가부시끼가이샤 | 회로접속용 접착제 및 그것을 사용한 회로접속방법 및 회로접속구조체 |
JP4852785B2 (ja) * | 2000-11-29 | 2012-01-11 | 日立化成工業株式会社 | 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法 |
JP4788036B2 (ja) * | 2000-11-29 | 2011-10-05 | 日立化成工業株式会社 | 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法 |
JP2002184487A (ja) | 2000-12-15 | 2002-06-28 | Sony Chem Corp | 異方性導電接着剤 |
JP2002203871A (ja) * | 2000-12-28 | 2002-07-19 | Hitachi Chem Co Ltd | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
JP2002201456A (ja) * | 2000-12-28 | 2002-07-19 | Hitachi Chem Co Ltd | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
JP2003064332A (ja) * | 2001-08-30 | 2003-03-05 | Hitachi Chem Co Ltd | 回路接続用接着剤及びそれを用いた回路接続構造体 |
JP4696360B2 (ja) * | 2000-12-28 | 2011-06-08 | 日立化成工業株式会社 | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
JP4788038B2 (ja) * | 2000-12-28 | 2011-10-05 | 日立化成工業株式会社 | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
JP2002201440A (ja) * | 2000-12-28 | 2002-07-19 | Hitachi Chem Co Ltd | 異方導電性樹脂フィルム状形成物及びそれを用いた回路板の接続方法並びに接続構造体 |
JP4158434B2 (ja) * | 2001-07-05 | 2008-10-01 | 株式会社ブリヂストン | 異方性導電フィルム |
KR100527990B1 (ko) * | 2001-11-30 | 2005-11-09 | 미쯔이카가쿠 가부시기가이샤 | 회로 접속용 페이스트, 이방성 도전 페이스트 및 이들의사용방법 |
JP2005330297A (ja) * | 2003-06-20 | 2005-12-02 | Hitachi Chem Co Ltd | 接着材テープの接着材形成方法 |
JP2004331910A (ja) * | 2003-05-12 | 2004-11-25 | Seiko Epson Corp | 異方導電性接着剤、実装方法、電気光学装置モジュールおよび電子機器 |
CN100380741C (zh) * | 2003-06-25 | 2008-04-09 | 日立化成工业株式会社 | 电路连接材料、电路构件的连接结构及其制造方法 |
JP4720073B2 (ja) * | 2003-08-07 | 2011-07-13 | 日立化成工業株式会社 | 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置 |
JP2005194393A (ja) * | 2004-01-07 | 2005-07-21 | Hitachi Chem Co Ltd | 回路接続用接着フィルム及び回路接続構造体 |
JP4655487B2 (ja) * | 2004-02-16 | 2011-03-23 | 日立化成工業株式会社 | 接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、並びに回路部材の接続構造及びその製造方法 |
JP2005320491A (ja) * | 2004-05-11 | 2005-11-17 | Hitachi Chem Co Ltd | 接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、並びに回路部材の接続構造及びその製造方法 |
JP2005325312A (ja) * | 2004-05-17 | 2005-11-24 | Hitachi Chem Co Ltd | 接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、並びに回路部材の接続構造及びその製造方法 |
JP4941804B2 (ja) * | 2005-03-02 | 2012-05-30 | Dic株式会社 | エポキシ樹脂組成物、その硬化物、半導体封止材料、新規フェノール樹脂、および新規エポキシ樹脂 |
DE102005021086A1 (de) * | 2005-05-06 | 2006-11-09 | Basf Coatings Ag | Beschichtungsstoff, Verfahren zu seiner Herstellung und seine Verwendung zur Herstellung haftfester, korrosionshemmender Beschichtungen |
JP4844003B2 (ja) * | 2005-05-10 | 2011-12-21 | 日立化成工業株式会社 | 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 |
US20060286721A1 (en) * | 2005-06-16 | 2006-12-21 | Daoqiang Lu | Breakable interconnects and structures formed thereby |
JP3852858B1 (ja) * | 2005-08-16 | 2006-12-06 | 株式会社日立製作所 | 半導体放射線検出器、放射線検出モジュールおよび核医学診断装置 |
KR100673778B1 (ko) * | 2005-08-19 | 2007-01-24 | 제일모직주식회사 | 저온 속경화형 이방성 도전 필름용 조성물, 그로부터제조된 이방성 도전 필름 및 그 제조방법 |
JP5061509B2 (ja) * | 2005-12-01 | 2012-10-31 | 日立化成工業株式会社 | 接着剤組成物並びにこれを用いた接続体及び半導体装置 |
ATE540426T1 (de) | 2006-07-21 | 2012-01-15 | Hitachi Chemical Co Ltd | Material zur verbindung von leiterplatten, stromkreisverbindungsstruktur und verfahren zur verbindung des leiterplattenelements |
WO2008015759A1 (en) * | 2006-08-04 | 2008-02-07 | Hitachi Chemical Co., Ltd. | Film adhesive, adhesive sheet, and semiconductor device using the same |
US20100243303A1 (en) | 2006-08-22 | 2010-09-30 | Hitachi Chemical Company, Ltd. | Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member |
JP4650456B2 (ja) * | 2006-08-25 | 2011-03-16 | 日立化成工業株式会社 | 回路接続材料、これを用いた回路部材の接続構造及びその製造方法 |
EP2058903A1 (en) | 2006-08-29 | 2009-05-13 | Hitachi Chemical Company, Ltd. | Anisotropic conductive tape and method of manufacturing it, connected structure and method of connecting circuit member by use of the tape |
KR100813355B1 (ko) | 2006-12-13 | 2008-03-12 | 엘에스전선 주식회사 | 이방 도전성 접착제 |
KR100835818B1 (ko) | 2006-12-27 | 2008-06-09 | 제일모직주식회사 | 이방 도전성 필름 조성물 및 그로부터 제조되는 이방도전성 필름 |
EP2110424B1 (en) * | 2007-02-06 | 2016-04-27 | Nippon Kasei Chemical Company Limited | Adhesive resin composition and bonding method |
KR100844383B1 (ko) * | 2007-03-13 | 2008-07-07 | 도레이새한 주식회사 | 반도체 칩 적층용 접착 필름 |
US8524816B2 (en) * | 2007-03-15 | 2013-09-03 | Magni Industries, Inc. | Coating resistant to bio-diesel fuels |
JP5222490B2 (ja) * | 2007-04-25 | 2013-06-26 | デクセリアルズ株式会社 | 異方導電性フィルム及び接続構造体 |
KR20100020029A (ko) * | 2007-06-13 | 2010-02-19 | 히다치 가세고교 가부시끼가이샤 | 회로 접속용 필름상 접착제 |
JP5292838B2 (ja) * | 2007-08-30 | 2013-09-18 | 日立化成株式会社 | 接着剤、及び回路部材の接続構造体 |
CN102977798B (zh) * | 2007-09-05 | 2015-04-29 | 日立化成株式会社 | 粘接剂以及使用该粘接剂的连接结构体 |
KR100929593B1 (ko) * | 2007-09-20 | 2009-12-03 | 제일모직주식회사 | 이방 도전성 접착 조성물 및 그를 포함하는 이방 도전성 필름 |
EP2206756A1 (en) * | 2007-10-29 | 2010-07-14 | Hitachi Chemical Company, Ltd. | Circuit connecting material, connection structure and method for producing the same |
JP5226562B2 (ja) * | 2008-03-27 | 2013-07-03 | デクセリアルズ株式会社 | 異方性導電フィルム、並びに、接合体及びその製造方法 |
KR101371953B1 (ko) | 2008-04-17 | 2014-03-07 | 히타치가세이가부시끼가이샤 | 접착재 테이프 및 접착재 테이프 권중체 |
JP5499448B2 (ja) * | 2008-07-16 | 2014-05-21 | デクセリアルズ株式会社 | 異方性導電接着剤 |
JP4897778B2 (ja) | 2008-11-20 | 2012-03-14 | ソニーケミカル&インフォメーションデバイス株式会社 | 接続フィルム、並びに、接合体及びその製造方法 |
US20110300326A1 (en) | 2009-02-27 | 2011-12-08 | Hitachi Chemical Company, Ltd. | Adhesive material reel |
US20120015126A1 (en) * | 2009-03-26 | 2012-01-19 | Hitachi Chemical Company, Ltd. | Adhesive material reel |
WO2010125965A1 (ja) * | 2009-04-28 | 2010-11-04 | 日立化成工業株式会社 | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及び回路部材の接続方法 |
JP4905502B2 (ja) * | 2009-05-21 | 2012-03-28 | 日立化成工業株式会社 | 回路板の製造方法及び回路接続材料 |
JP2010004067A (ja) * | 2009-09-16 | 2010-01-07 | Hitachi Chem Co Ltd | 回路接続材料 |
KR101388851B1 (ko) * | 2009-11-04 | 2014-04-23 | 히타치가세이가부시끼가이샤 | 접착제, 회로 접속 구조체 및 반도체 장치 |
EP2558543B1 (en) | 2010-04-16 | 2017-08-30 | Valspar Sourcing, Inc. | Coating compositions for packaging articles and methods of coating |
JP5504225B2 (ja) * | 2010-08-31 | 2014-05-28 | 積水化学工業株式会社 | 異方性導電材料及び接続構造体 |
CN107033730B (zh) | 2011-02-07 | 2021-03-05 | 宣伟投资管理有限公司 | 容器和其它制品用涂料组合物和涂布方法 |
JP5387592B2 (ja) * | 2011-02-07 | 2014-01-15 | 日立化成株式会社 | 回路接続材料、及び回路部材の接続構造の製造方法 |
BR112013029413B1 (pt) | 2011-05-18 | 2021-08-10 | Hitachi Chemical Company, Ltd. | Material de ligação de circuito, estrutura de ligação de elementos de circuito e método de fabricação de estrutura de ligação de elementos de circuito |
JP5867508B2 (ja) | 2011-09-06 | 2016-02-24 | 日立化成株式会社 | 回路接続材料及び接続体 |
WO2013042203A1 (ja) | 2011-09-20 | 2013-03-28 | 日立化成株式会社 | 接着剤組成物、フィルム状接着剤、接着シート、回路接続体及び回路部材の接続方法 |
KR101381118B1 (ko) | 2011-11-04 | 2014-04-04 | 제일모직주식회사 | 이방 전도성 접착 필름용 조성물 및 이를 이용한 이방 전도성 접착 필름 |
TWI580745B (zh) | 2011-12-16 | 2017-05-01 | 日立化成股份有限公司 | 接著劑組成物、膜狀接著劑、接著片、連接結構體及連接結構體的製造方法 |
KR102152473B1 (ko) | 2011-12-16 | 2020-09-04 | 히타치가세이가부시끼가이샤 | 접착제 조성물, 필름상 접착제, 접착 시트, 접속 구조체 및 접속 구조체의 제조 방법 |
US8497579B1 (en) * | 2012-02-16 | 2013-07-30 | Chipbond Technology Corporation | Semiconductor packaging method and structure thereof |
JP5895585B2 (ja) * | 2012-02-23 | 2016-03-30 | 日立金属株式会社 | 接着剤、接着フィルム、積層フィルム、配線フィルム及び多層配線フィルム |
JP2013206765A (ja) * | 2012-03-29 | 2013-10-07 | Tanaka Kikinzoku Kogyo Kk | ダイボンド用導電性ペースト及び該導電性ペーストによるダイボンド方法 |
JP6107816B2 (ja) | 2012-04-13 | 2017-04-05 | 日立化成株式会社 | 回路接続材料、接続構造体及びその製造方法 |
RU2618704C2 (ru) | 2012-08-09 | 2017-05-11 | Вэлспар Сорсинг, Инк. | Композиции для контейнеров и других изделий и способы их применения |
WO2014025411A1 (en) | 2012-08-09 | 2014-02-13 | Valspar Sourcing, Inc. | Container coating system |
JP6029922B2 (ja) * | 2012-10-05 | 2016-11-24 | デクセリアルズ株式会社 | 回路接続材料及びその製造方法、並びにそれを用いた実装体の製造方法 |
KR101551758B1 (ko) * | 2012-12-11 | 2015-09-09 | 제일모직주식회사 | 이방 도전성 필름용 조성물 및 이방 도전성 필름 |
JP6108232B2 (ja) * | 2012-12-12 | 2017-04-05 | 日立金属株式会社 | 接着剤組成物、接着剤ワニス、接着フィルム、及び配線フィルム |
JP6065604B2 (ja) * | 2013-01-22 | 2017-01-25 | 日立金属株式会社 | 接着剤ワニス、接着フィルム、及び配線フィルム |
JP6123547B2 (ja) | 2013-07-26 | 2017-05-10 | 日立化成株式会社 | 回路接続材料、回路接続構造体、回路接続構造体の製造方法、接着剤組成物、及び接着剤シート |
JP2015098575A (ja) | 2013-10-16 | 2015-05-28 | 日立化成株式会社 | 接着剤組成物及び接続体 |
WO2015068611A1 (ja) * | 2013-11-07 | 2015-05-14 | 東洋インキScホールディングス株式会社 | 導電性接着剤、導電性接着シート、配線デバイス、および配線デバイスの製造方法 |
JP6106148B2 (ja) * | 2013-11-27 | 2017-03-29 | 日東電工株式会社 | 導電性粘着テープ、電子部材及び粘着剤 |
CN106536624B (zh) | 2014-04-14 | 2019-11-19 | 宣伟投资管理有限公司 | 制备用于容器和其它制品的组合物的方法以及使用所述组合物的方法 |
JP2016044222A (ja) | 2014-08-21 | 2016-04-04 | 日立化成株式会社 | 接着剤組成物及び接続構造体 |
CN106574033B (zh) * | 2014-09-17 | 2019-07-05 | 日产化学工业株式会社 | 包含热固性树脂的膜形成用组合物 |
JP6562614B2 (ja) * | 2014-10-23 | 2019-08-21 | リンテック株式会社 | 接着剤組成物および接着シート |
KR102489187B1 (ko) * | 2014-10-28 | 2023-01-17 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름, 그 제조 방법, 및 접속 구조체 |
JP6834946B2 (ja) | 2015-04-23 | 2021-02-24 | 昭和電工マテリアルズ株式会社 | 接着剤組成物及び接続構造体 |
CN107636107B (zh) | 2015-06-10 | 2021-01-05 | 昭和电工材料株式会社 | 粘接剂组合物以及连接体 |
CN107922817B (zh) | 2015-09-04 | 2021-05-28 | 昭和电工材料株式会社 | 粘接剂组合物、各向异性导电性粘接剂组合物、电路连接材料及连接体 |
TWI614275B (zh) | 2015-11-03 | 2018-02-11 | Valspar Sourcing Inc | 用於製備聚合物的液體環氧樹脂組合物 |
JP6237944B1 (ja) * | 2017-02-03 | 2017-11-29 | 東洋インキScホールディングス株式会社 | 熱硬化性接着シート、およびその利用 |
CN110402269B (zh) * | 2017-03-13 | 2022-05-03 | 琳得科株式会社 | 树脂组合物及树脂片 |
JP2018178064A (ja) * | 2017-04-21 | 2018-11-15 | 株式会社カネカ | アクリル系接着剤組成物 |
JPWO2018230470A1 (ja) * | 2017-06-12 | 2020-03-19 | 積水化学工業株式会社 | 樹脂粒子、導電性粒子、導電材料、接着剤、接続構造体及び液晶表示素子 |
TWI765028B (zh) * | 2017-06-30 | 2022-05-21 | 日商琳得科股份有限公司 | 樹脂薄片、層合體及樹脂薄片的製造方法 |
JPWO2023276889A1 (ja) | 2021-07-01 | 2023-01-05 |
Family Cites Families (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6023139B2 (ja) | 1974-03-25 | 1985-06-06 | 日本ペイント株式会社 | 熱硬化性アクリル樹脂組成物 |
JPS5233696B2 (ja) | 1974-04-01 | 1977-08-30 | ||
CA1068205A (en) | 1975-03-27 | 1979-12-18 | Yutaka Hori | Heat-curable composite sheet |
JPS5290537A (en) * | 1976-01-23 | 1977-07-29 | Asahi Chem Ind Co Ltd | Polymerizable adhesive composition |
US4212959A (en) * | 1978-05-09 | 1980-07-15 | Mitsubishi Denki Kabushiki Kaisha | Heat resistant resin composition |
JPS58167124A (ja) * | 1982-03-29 | 1983-10-03 | Nippon Oil & Fats Co Ltd | プラスチツクレンズの製造法 |
JPS59159866A (ja) * | 1983-03-02 | 1984-09-10 | Yokohama Rubber Co Ltd:The | 接着剤組成物 |
JPS59221371A (ja) | 1983-05-31 | 1984-12-12 | Yokohama Rubber Co Ltd:The | 導電性接着剤 |
AU572615B2 (en) * | 1983-12-27 | 1988-05-12 | Sony Corporation | Electrically conductive adhesive sheet circuit board and electrical connection structure |
US5158818A (en) * | 1984-01-30 | 1992-10-27 | National Starch And Chemical Investment Holding Corporation | Conductive die attach tape |
JPS60262430A (ja) | 1984-06-08 | 1985-12-25 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
JPS61148277A (ja) | 1984-12-22 | 1986-07-05 | Denki Kagaku Kogyo Kk | 接着剤組成物 |
JPH0638436B2 (ja) | 1985-02-22 | 1994-05-18 | カシオ計算機株式会社 | 半導体ペレツトと基板の接合方法 |
CA1272536A (en) * | 1985-05-28 | 1990-08-07 | Tsutomu Suda | Propylene polymer composition |
JPS61296077A (ja) | 1985-06-25 | 1986-12-26 | Three Bond Co Ltd | 二液接触硬化型導電性接着剤 |
CN1003524B (zh) * | 1985-10-14 | 1989-03-08 | 株式会社日立制作所 | 无电浸镀金溶液 |
JPH0765023B2 (ja) | 1985-12-13 | 1995-07-12 | ソニーケミカル株式会社 | フィルム状導電異方性接着剤 |
US4740657A (en) | 1986-02-14 | 1988-04-26 | Hitachi, Chemical Company, Ltd | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
JP2527166B2 (ja) * | 1986-09-27 | 1996-08-21 | 住友ベークライト株式会社 | 接着剤層を有するポリエ−テルイミドフイルム |
US5001542A (en) | 1988-12-05 | 1991-03-19 | Hitachi Chemical Company | Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips |
JPH03137121A (ja) | 1989-06-19 | 1991-06-11 | Showa Denko Kk | 導電性樹脂接続材 |
JPH04115407A (ja) | 1990-09-03 | 1992-04-16 | Soken Kagaku Kk | 異方導電性接着剤組成物 |
JPH07123179B2 (ja) | 1990-10-05 | 1995-12-25 | 信越ポリマー株式会社 | 異方導電接着剤による回路基板の接続構造 |
US5096962A (en) | 1990-11-29 | 1992-03-17 | Lord Corporation | Acrylic adhesive compositions |
JP2927001B2 (ja) * | 1990-12-17 | 1999-07-28 | 住友電気工業株式会社 | フレキシブル印刷配線板用接着剤組成物 |
AU3975793A (en) | 1992-04-03 | 1993-11-08 | Thermoset Plastics, Inc. | Conductor-filled thermosetting resin |
US5208266A (en) * | 1992-04-28 | 1993-05-04 | Toshimichi Yamazaki | Lightly crosslinked polymeric foams and process for making same |
JPH05347464A (ja) | 1992-06-16 | 1993-12-27 | Ricoh Co Ltd | 電気回路基板の接続構造および接続方法 |
JPH06295617A (ja) * | 1993-04-06 | 1994-10-21 | Fuji Kobunshi Kogyo Kk | 異方導電性接着剤組成物 |
US5395876A (en) | 1993-04-19 | 1995-03-07 | Acheson Industries, Inc. | Surface mount conductive adhesives |
JP3408301B2 (ja) | 1993-12-16 | 2003-05-19 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 異方性導電膜 |
JPH07326635A (ja) * | 1994-05-31 | 1995-12-12 | Hitachi Chem Co Ltd | 接着剤および半導体装置 |
JPH08111124A (ja) | 1994-10-11 | 1996-04-30 | Sony Chem Corp | 異方導電性接着剤フィルム |
JPH08253739A (ja) | 1995-01-19 | 1996-10-01 | Sumitomo Bakelite Co Ltd | 熱硬化性接着テープおよびその製造方法 |
JPH08319461A (ja) | 1995-03-20 | 1996-12-03 | Sumitomo Bakelite Co Ltd | 半導体装置 |
JPH08315885A (ja) | 1995-05-16 | 1996-11-29 | Hitachi Chem Co Ltd | 回路接続材料 |
JPH08325543A (ja) * | 1995-06-05 | 1996-12-10 | Soken Chem & Eng Co Ltd | 異方導電性接着剤 |
JPH0925394A (ja) | 1995-07-10 | 1997-01-28 | Toyo Electric Mfg Co Ltd | 耐熱性熱硬化性樹脂組成物 |
JPH0955448A (ja) | 1995-08-10 | 1997-02-25 | Mitsui High Tec Inc | 半導体装置の製造方法 |
JPH0995652A (ja) | 1995-09-28 | 1997-04-08 | Sumitomo Bakelite Co Ltd | 導電性樹脂ペースト |
JP3344886B2 (ja) | 1995-12-20 | 2002-11-18 | 住友ベークライト株式会社 | 異方導電フィルム |
JPH09176309A (ja) | 1995-12-22 | 1997-07-08 | Sumitomo Bakelite Co Ltd | 熱硬化性樹脂組成物および熱硬化性接着テープ |
JPH09291259A (ja) | 1996-04-26 | 1997-11-11 | Sumitomo Bakelite Co Ltd | 低温加熱硬化型異方導電性接着剤 |
TW345727B (en) * | 1996-08-22 | 1998-11-21 | Hitachi Ltd | Resin encapsulated semiconductor device and process for producing the same |
JPH10212364A (ja) * | 1996-11-26 | 1998-08-11 | Ajinomoto Co Inc | 積層板用プリプレグ及びこれを用いたプリント配線板の製造方法 |
JPH10273626A (ja) | 1997-03-31 | 1998-10-13 | Hitachi Chem Co Ltd | 回路接続材料及び回路板の製造法 |
JP3587859B2 (ja) | 1997-03-31 | 2004-11-10 | 日立化成工業株式会社 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
JP4717334B2 (ja) | 1997-03-31 | 2011-07-06 | 日立化成工業株式会社 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
US7967943B2 (en) * | 1997-03-31 | 2011-06-28 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
JP3877090B2 (ja) | 1997-03-31 | 2007-02-07 | 日立化成工業株式会社 | 回路接続材料及び回路板の製造法 |
JP4794704B2 (ja) * | 1998-03-31 | 2011-10-19 | 日立化成工業株式会社 | 回路接続材料、回路端子の接続構造および回路端子の接続方法 |
JP4794702B2 (ja) * | 1998-03-31 | 2011-10-19 | 日立化成工業株式会社 | 回路接続材料、回路端子の接続構造および回路端子の接続方法 |
US6762249B1 (en) * | 1999-08-25 | 2004-07-13 | Hitachi Chemical Company, Ltd. | Wiring-connecting material and process for producing circuit board with the same |
CN101037572A (zh) * | 1999-08-25 | 2007-09-19 | 日立化成工业株式会社 | 粘合剂,配线端子的连接方法和配线结构体 |
CN100380741C (zh) * | 2003-06-25 | 2008-04-09 | 日立化成工业株式会社 | 电路连接材料、电路构件的连接结构及其制造方法 |
JP2005194393A (ja) * | 2004-01-07 | 2005-07-21 | Hitachi Chem Co Ltd | 回路接続用接着フィルム及び回路接続構造体 |
-
1998
- 1998-03-31 JP JP54145798A patent/JP3587859B2/ja not_active Expired - Fee Related
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JP4858623B2 (ja) | 2012-01-18 |
WO1998044067A1 (en) | 1998-10-08 |
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AU6520798A (en) | 1998-10-22 |
EP0979854A4 (en) | 2000-07-12 |
EP0979854B1 (en) | 2006-10-04 |
KR20010005805A (ko) | 2001-01-15 |
KR100333456B1 (ko) | 2002-04-18 |
JP2012184424A (ja) | 2012-09-27 |
EP1890324A3 (en) | 2008-06-11 |
JP5120515B2 (ja) | 2013-01-16 |
DE69836078D1 (de) | 2006-11-16 |
DE69836078T2 (de) | 2007-05-10 |
EP1542273A1 (en) | 2005-06-15 |
EP1717851A1 (en) | 2006-11-02 |
US7629056B2 (en) | 2009-12-08 |
US6777464B1 (en) | 2004-08-17 |
EP1717851B1 (en) | 2012-10-17 |
JP3587859B2 (ja) | 2004-11-10 |
TWI229119B (en) | 2005-03-11 |
EP1890324A2 (en) | 2008-02-20 |
JP2010219039A (ja) | 2010-09-30 |
EP0979854A1 (en) | 2000-02-16 |
EP1542273B1 (en) | 2013-09-25 |
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