JP4397819B2 - カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法 - Google Patents
カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法 Download PDFInfo
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- JP4397819B2 JP4397819B2 JP2004568903A JP2004568903A JP4397819B2 JP 4397819 B2 JP4397819 B2 JP 4397819B2 JP 2004568903 A JP2004568903 A JP 2004568903A JP 2004568903 A JP2004568903 A JP 2004568903A JP 4397819 B2 JP4397819 B2 JP 4397819B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0055—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element
- G02B13/006—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element at least one element being a compound optical element, e.g. cemented elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
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-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Lens Barrels (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
- Blocking Light For Cameras (AREA)
Description
Claims (4)
- 像獲得素子と、レンズ要素を支持するレンズ基板とを備え、前記レンズ要素は、前記像獲得素子上に被写体を投影し、前記レンズ基板と前記像獲得素子との間にスペーサが位置しており、
前記スペーサは、第1及び第2の接着層と、前記レンズ基板と前記像獲得素子の間に所定の間隔を維持するためのガラススペーサ基板とを備えており、
前記接着層は、紫外線硬化樹脂と熱硬化樹脂のうちの一方を備えており、
前記スペーサ基板は、前記第1の接着層により、前記像獲得素子に接着されており、前記レンズ基板は、前記第2の接着層により、前記スペーサ基板に接着されており、
前記スペーサ基板は、前記レンズ要素の主光学軸に対して同軸上に位置する穴を備えており、
前記レンズ基板に反射防止層が設けられている、ことを特徴とするカメラ・デバイス。 - 像獲得素子と、第1のレンズ要素を支持する第1のレンズ基板とを備え、前記第1のレンズ要素は、前記像獲得素子上に被写体を投影し、前記第1のレンズ基板と前記像獲得素子との間にスペーサが位置しており、
前記スペーサは、第1及び第2の接着層であって、それぞれが紫外線硬化樹脂と熱硬化樹脂のうちの一方を備える第1及び第2の接着層と、前記第1のレンズ基板と前記像獲得素子の間に所定の間隔を維持するためのガラススペーサ基板とを備えており、
前記スペーサ基板は、前記第1の接着層により、前記像獲得素子に接着されており、
第2のレンズ要素を支持する第2のレンズ基板が、前記第2のレンズ要素と前記第1のレンズ要素と前記スペーサ基板と前記像獲得素子とを通る主光学軸に沿って整列されて、前記第1のレンズ要素にスタックされており、
前記スペーサ基板は、前記レンズ要素の主光学軸に対して同軸上に位置する穴を備えており、
前記レンズ基板に反射防止層が設けられている、ことを特徴とするカメラ・デバイス。 - 像獲得素子と、前記像獲得素子上に被写体を投影するレンズ要素と、前記レンズ要素と前記像獲得素子の所定の間隔を維持するためのスペーサ手段と、前記レンズを支持するためのレンズ基板とを備え、前記スペーサ手段が接着層を備えるとともに、
前記スペーサ手段がスペーサ基板をさらに備え、
前記スペーサ基板が、前記レンズ要素の主光学軸に対して同軸上に位置する穴を備えており、前記レンズ基板に反射防止層が設けられている、
ことを特徴とするカメラ・デバイス。 - 像獲得素子と、前記像獲得素子上に被写体を投影するレンズ要素と、前記レンズ要素と前記像獲得素子の所定の間隔を維持するためのスペーサ手段と、前記レンズを支持するためのレンズ基板とを備え、前記スペーサ手段が接着層を備えるとともに、
前記レンズ基板に反射防止層が設けられたことを特徴とするカメラ・デバイス。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02078852 | 2002-09-17 | ||
EP02079107 | 2002-10-01 | ||
EP02079106 | 2002-10-01 | ||
PCT/IB2003/003920 WO2004027880A2 (en) | 2002-09-17 | 2003-09-16 | Camera device, method of manufacturing a camera device, wafer scale package |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009033092A Division JP4874350B2 (ja) | 2002-09-17 | 2009-02-16 | カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005539276A JP2005539276A (ja) | 2005-12-22 |
JP4397819B2 true JP4397819B2 (ja) | 2010-01-13 |
Family
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004568903A Expired - Lifetime JP4397819B2 (ja) | 2002-09-17 | 2003-09-16 | カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法 |
JP2009033092A Expired - Lifetime JP4874350B2 (ja) | 2002-09-17 | 2009-02-16 | カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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JP2009033092A Expired - Lifetime JP4874350B2 (ja) | 2002-09-17 | 2009-02-16 | カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US7564496B2 (ja) |
EP (2) | EP1543564A2 (ja) |
JP (2) | JP4397819B2 (ja) |
KR (3) | KR20070096020A (ja) |
CN (1) | CN100440544C (ja) |
AU (1) | AU2003263417A1 (ja) |
WO (1) | WO2004027880A2 (ja) |
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CN1682377A (zh) | 2005-10-12 |
KR20050048635A (ko) | 2005-05-24 |
AU2003263417A1 (en) | 2004-04-08 |
US7564496B2 (en) | 2009-07-21 |
EP1543564A2 (en) | 2005-06-22 |
KR100774775B1 (ko) | 2007-11-07 |
KR20070089889A (ko) | 2007-09-03 |
CN100440544C (zh) | 2008-12-03 |
JP2005539276A (ja) | 2005-12-22 |
US20070275505A1 (en) | 2007-11-29 |
JP4874350B2 (ja) | 2012-02-15 |
JP2009153178A (ja) | 2009-07-09 |
EP2273555A2 (en) | 2011-01-12 |
WO2004027880A2 (en) | 2004-04-01 |
WO2004027880A3 (en) | 2005-01-13 |
US20060044450A1 (en) | 2006-03-02 |
EP2273555A3 (en) | 2012-09-12 |
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