CN1682377A - 照相装置、制造照相装置的方法以及晶片尺度的封装 - Google Patents
照相装置、制造照相装置的方法以及晶片尺度的封装 Download PDFInfo
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- CN1682377A CN1682377A CNA038220296A CN03822029A CN1682377A CN 1682377 A CN1682377 A CN 1682377A CN A038220296 A CNA038220296 A CN A038220296A CN 03822029 A CN03822029 A CN 03822029A CN 1682377 A CN1682377 A CN 1682377A
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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- G02B13/0055—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element
- G02B13/006—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element at least one element being a compound optical element, e.g. cemented elements
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- G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
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- Transforming Light Signals Into Electric Signals (AREA)
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Abstract
Description
Claims (19)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02078852 | 2002-09-17 | ||
EP02078852.7 | 2002-09-17 | ||
EP02079107.5 | 2002-10-01 | ||
EP02079106 | 2002-10-01 | ||
EP02079106.7 | 2002-10-01 | ||
EP02079107 | 2002-10-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1682377A true CN1682377A (zh) | 2005-10-12 |
CN100440544C CN100440544C (zh) | 2008-12-03 |
Family
ID=32033880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB038220296A Expired - Lifetime CN100440544C (zh) | 2002-09-17 | 2003-09-16 | 照相装置、制造照相装置的方法以及晶片尺度的封装 |
Country Status (7)
Country | Link |
---|---|
US (2) | US7564496B2 (zh) |
EP (2) | EP2273555A3 (zh) |
JP (2) | JP4397819B2 (zh) |
KR (3) | KR100774775B1 (zh) |
CN (1) | CN100440544C (zh) |
AU (1) | AU2003263417A1 (zh) |
WO (1) | WO2004027880A2 (zh) |
Cited By (36)
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CN101473439A (zh) * | 2006-04-17 | 2009-07-01 | 全视Cdm光学有限公司 | 阵列成像***及相关方法 |
CN101606243A (zh) * | 2006-11-17 | 2009-12-16 | 德萨拉北美公司 | 在利用光学堆栈的相机***中减小内部噪声的结构及方法 |
US7703997B2 (en) | 2006-01-18 | 2010-04-27 | Visera Technologies, Co., Ltd. | Image sensor module having precise image-projection control |
CN101009779B (zh) * | 2006-01-24 | 2010-06-16 | 采钰科技股份有限公司 | 高精密度成像控制的影像感应模块 |
CN101990711A (zh) * | 2007-11-27 | 2011-03-23 | 赫普塔冈有限公司 | 密封的透镜叠组 |
CN102004296A (zh) * | 2009-08-28 | 2011-04-06 | 夏普株式会社 | 光学元件模块、电子元件模块及制造方法和电子信息设备 |
CN101675658B (zh) * | 2007-09-27 | 2011-07-27 | Lg伊诺特有限公司 | 摄像头模块 |
CN102236234A (zh) * | 2010-05-05 | 2011-11-09 | 黄珀慧 | 数字光学镜头的遮光片与载体结构及其制法 |
CN101606381B (zh) * | 2006-11-16 | 2012-06-13 | 德萨拉北美公司 | 在利用光学堆栈的照相机***中的杂散光控制及相关方法 |
US8203647B2 (en) | 2010-02-11 | 2012-06-19 | Himax Semiconductor, Inc. | Image sensor module and method for manufacturing the same |
CN102540383A (zh) * | 2010-12-16 | 2012-07-04 | 鸿富锦精密工业(深圳)有限公司 | 镜头模组制造方法 |
CN102667568A (zh) * | 2009-11-05 | 2012-09-12 | 柯尼卡美能达先进多层薄膜株式会社 | 摄像装置以及该摄像装置的制造方法 |
US8270098B2 (en) | 2008-02-20 | 2012-09-18 | Konica Minolto Opto, Inc. | Image pickup lens, image pickup apparatus, mobile terminal, and method for manufacturing image pickup lens |
CN102738183A (zh) * | 2011-04-12 | 2012-10-17 | 奇景光电股份有限公司 | 晶片级微电子成像器 |
CN102778736A (zh) * | 2011-05-13 | 2012-11-14 | 昆山西钛微电子科技有限公司 | 免调焦光学摄像头模组 |
CN101512768B (zh) * | 2006-07-17 | 2012-11-21 | 数字光学东方公司 | 相机***及相关方法 |
US8361830B2 (en) | 2010-04-09 | 2013-01-29 | Himax Semiconductor, Inc. | Image sensor module and method of manufacturing the same |
CN101813815B (zh) * | 2008-09-25 | 2013-03-27 | 夏普株式会社 | 光学元件模块、电子元件模块及其制造方法 |
CN103050502A (zh) * | 2012-12-28 | 2013-04-17 | 格科微电子(上海)有限公司 | 晶圆级镜头模组阵列、阵列组合及两者的制作方法 |
US8456560B2 (en) | 2007-01-26 | 2013-06-04 | Digitaloptics Corporation | Wafer level camera module and method of manufacture |
US8477437B2 (en) | 2008-02-12 | 2013-07-02 | Konica Minolta Opto, Inc. | Lens unit, image capturing lens, image capturing device and portable terminal |
US8493672B2 (en) | 2008-02-12 | 2013-07-23 | Konica Minolta Opto, Inc. | Imaging lens, image pickup device and portable terminal |
CN103221867A (zh) * | 2010-11-25 | 2013-07-24 | 索尼公司 | 光学单元和图像拾取设备 |
CN103229084A (zh) * | 2010-08-17 | 2013-07-31 | 赫普塔冈微光学有限公司 | 制造多个用于相机的光学装置的方法 |
CN103314313A (zh) * | 2011-01-21 | 2013-09-18 | 富士胶片株式会社 | 堆叠型透镜阵列及透镜模块 |
US8599301B2 (en) | 2006-04-17 | 2013-12-03 | Omnivision Technologies, Inc. | Arrayed imaging systems having improved alignment and associated methods |
US8605208B2 (en) | 2007-04-24 | 2013-12-10 | Digitaloptics Corporation | Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly |
CN103620468A (zh) * | 2011-06-17 | 2014-03-05 | 柯尼卡美能达株式会社 | 晶片透镜的制造方法及晶片透镜、透镜单元的制造方法及透镜单元 |
CN101681085B (zh) * | 2007-04-24 | 2014-11-19 | 数字光学公司 | 采用晶片级光学***的自动聚焦/变焦模块 |
CN105487147A (zh) * | 2016-01-25 | 2016-04-13 | 瑞声声学科技(苏州)有限公司 | 镜头及其切割方法 |
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CN101930105B (zh) * | 2008-09-25 | 2017-06-06 | 夏普株式会社 | 光学元件模块、电子元件模块及其制造方法 |
CN110596868A (zh) * | 2018-05-25 | 2019-12-20 | 安特尔耀恩国际有限公司 | 光学单元和层叠体 |
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CN110596868B (zh) * | 2018-05-25 | 2023-12-22 | 安特尔耀恩国际有限公司 | 光学单元和层叠体 |
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KR100774775B1 (ko) | 2007-11-07 |
JP2005539276A (ja) | 2005-12-22 |
KR20070096020A (ko) | 2007-10-01 |
KR20050048635A (ko) | 2005-05-24 |
EP2273555A3 (en) | 2012-09-12 |
US20060044450A1 (en) | 2006-03-02 |
JP2009153178A (ja) | 2009-07-09 |
CN100440544C (zh) | 2008-12-03 |
WO2004027880A2 (en) | 2004-04-01 |
EP1543564A2 (en) | 2005-06-22 |
EP2273555A2 (en) | 2011-01-12 |
JP4874350B2 (ja) | 2012-02-15 |
US20070275505A1 (en) | 2007-11-29 |
KR20070089889A (ko) | 2007-09-03 |
JP4397819B2 (ja) | 2010-01-13 |
WO2004027880A3 (en) | 2005-01-13 |
AU2003263417A1 (en) | 2004-04-08 |
US7564496B2 (en) | 2009-07-21 |
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