FR2963114B1 - Dispositif optique, boitier a l'echelle d'une tranche pour un tel dispositif optique et procede correspondant. - Google Patents

Dispositif optique, boitier a l'echelle d'une tranche pour un tel dispositif optique et procede correspondant.

Info

Publication number
FR2963114B1
FR2963114B1 FR1056124A FR1056124A FR2963114B1 FR 2963114 B1 FR2963114 B1 FR 2963114B1 FR 1056124 A FR1056124 A FR 1056124A FR 1056124 A FR1056124 A FR 1056124A FR 2963114 B1 FR2963114 B1 FR 2963114B1
Authority
FR
France
Prior art keywords
optical device
wafer
corresponding method
ladder housing
ladder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1056124A
Other languages
English (en)
Other versions
FR2963114A1 (fr
Inventor
Luc Andre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA, Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR1056124A priority Critical patent/FR2963114B1/fr
Priority to US13/812,405 priority patent/US20130249034A1/en
Priority to PCT/IB2011/053328 priority patent/WO2012014155A1/fr
Priority to EP11749538.2A priority patent/EP2598920A1/fr
Publication of FR2963114A1 publication Critical patent/FR2963114A1/fr
Application granted granted Critical
Publication of FR2963114B1 publication Critical patent/FR2963114B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00365—Production of microlenses
    • B29D11/00375—Production of microlenses by moulding lenses in holes through a substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/14—Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/02—Simple or compound lenses with non-spherical faces
    • G02B3/04—Simple or compound lenses with non-spherical faces with continuous faces that are rotationally symmetrical but deviate from a true sphere, e.g. so called "aspheric" lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Ophthalmology & Optometry (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Toxicology (AREA)
  • Lenses (AREA)
  • Solid State Image Pick-Up Elements (AREA)
FR1056124A 2010-07-26 2010-07-26 Dispositif optique, boitier a l'echelle d'une tranche pour un tel dispositif optique et procede correspondant. Expired - Fee Related FR2963114B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR1056124A FR2963114B1 (fr) 2010-07-26 2010-07-26 Dispositif optique, boitier a l'echelle d'une tranche pour un tel dispositif optique et procede correspondant.
US13/812,405 US20130249034A1 (en) 2010-07-26 2011-07-26 Optical Device, Wafer-Scale Package for One Such Optical Device and Corresponding Method
PCT/IB2011/053328 WO2012014155A1 (fr) 2010-07-26 2011-07-26 Dispositif optique, boitier a l'echelle d'une tranche pour un tel dispositif optique et procede correspondant
EP11749538.2A EP2598920A1 (fr) 2010-07-26 2011-07-26 Dispositif optique, boitier a l'echelle d'une tranche pour un tel dispositif optique et procede correspondant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1056124A FR2963114B1 (fr) 2010-07-26 2010-07-26 Dispositif optique, boitier a l'echelle d'une tranche pour un tel dispositif optique et procede correspondant.

Publications (2)

Publication Number Publication Date
FR2963114A1 FR2963114A1 (fr) 2012-01-27
FR2963114B1 true FR2963114B1 (fr) 2013-05-10

Family

ID=43755272

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1056124A Expired - Fee Related FR2963114B1 (fr) 2010-07-26 2010-07-26 Dispositif optique, boitier a l'echelle d'une tranche pour un tel dispositif optique et procede correspondant.

Country Status (4)

Country Link
US (1) US20130249034A1 (fr)
EP (1) EP2598920A1 (fr)
FR (1) FR2963114B1 (fr)
WO (1) WO2012014155A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109564335A (zh) * 2016-08-15 2019-04-02 索尼半导体解决方案公司 层叠透镜结构、相机模块和层叠透镜结构的制造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6918409B2 (ja) * 2017-01-26 2021-08-11 ソニーセミコンダクタソリューションズ株式会社 カメラモジュールおよびその製造方法、並びに電子機器
US10969560B2 (en) * 2017-05-04 2021-04-06 Lightpath Technologies, Inc. Integrated optical assembly and manufacturing the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6814901B2 (en) * 2001-04-20 2004-11-09 Matsushita Electric Industrial Co., Ltd. Method of manufacturing microlens array and microlens array
KR100774775B1 (ko) 2002-09-17 2007-11-07 앤터온 비.브이. 카메라 디바이스, 카메라 디바이스 제조 방법, 웨이퍼스케일 패키지 및 광학 어셈블리
JP2004110069A (ja) * 2003-11-13 2004-04-08 Nippon Sheet Glass Co Ltd 樹脂レンズアレイ
US6992843B2 (en) * 2003-12-16 2006-01-31 Metastable Instruments, Inc. Precision optical wedge light beam scanner
US20080290435A1 (en) * 2007-05-21 2008-11-27 Micron Technology, Inc. Wafer level lens arrays for image sensor packages and the like, image sensor packages, and related methods
JP2009251366A (ja) * 2008-04-08 2009-10-29 Konica Minolta Opto Inc 撮像レンズの製造方法、撮像レンズ及び撮像装置
JP2009300596A (ja) 2008-06-11 2009-12-24 Sharp Corp プラスチックレンズ、成形金型、およびプラスチックレンズの製造方法
JP4751922B2 (ja) * 2008-09-22 2011-08-17 株式会社沖データ レンズアレイユニット、光学ヘッドおよび情報装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109564335A (zh) * 2016-08-15 2019-04-02 索尼半导体解决方案公司 层叠透镜结构、相机模块和层叠透镜结构的制造方法
CN109564335B (zh) * 2016-08-15 2022-09-16 索尼半导体解决方案公司 层叠透镜结构、相机模块和层叠透镜结构的制造方法

Also Published As

Publication number Publication date
FR2963114A1 (fr) 2012-01-27
US20130249034A1 (en) 2013-09-26
WO2012014155A1 (fr) 2012-02-02
EP2598920A1 (fr) 2013-06-05

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Legal Events

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PLFP Fee payment

Year of fee payment: 6

ST Notification of lapse

Effective date: 20170331