JP2017532766A - ダイレベルのレーザリフトオフ中の機械的損傷を減少させるサファイアコレクタ - Google Patents
ダイレベルのレーザリフトオフ中の機械的損傷を減少させるサファイアコレクタ Download PDFInfo
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- JP2017532766A JP2017532766A JP2017509634A JP2017509634A JP2017532766A JP 2017532766 A JP2017532766 A JP 2017532766A JP 2017509634 A JP2017509634 A JP 2017509634A JP 2017509634 A JP2017509634 A JP 2017509634A JP 2017532766 A JP2017532766 A JP 2017532766A
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- Prior art keywords
- cavity
- chip
- collector
- sapphire
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052594 sapphire Inorganic materials 0.000 title abstract description 46
- 239000010980 sapphire Substances 0.000 title abstract description 46
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 19
- 239000002699 waste material Substances 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000001627 detrimental effect Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003252 repetitive effect Effects 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Lasers (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Die Bonding (AREA)
Abstract
Description
Claims (15)
- コレクタシステムであって、
レーザリフトオフを介してサブマウントから解放されるチップを受け入れるキャビティと、
該キャビティに真空をもたらして、該キャビティから前記チップを除去する、トンネルと、
当該コレクタシステムの下側から延び、前記チップが前記キャビティに入る開口を含む、面取りされたピックアップ要素とを含む、
コレクタシステム。 - 前記開口を取り囲んで、前記キャビティに入ったチップが前記開口から出るのを防止する、障壁を含む、請求項1に記載のコレクタシステム。
- 前記面取りされたピックアップ要素は、少なくとも45度の面取り角を有する、請求項1に記載のコレクタシステム。
- 当該コレクタシステムの前記下側は、前記サブマウントの平面に対して傾斜させられている、請求項1に記載のコレクタシステム。
- 前記トンネルは、前記キャビティに接続されたフレア状の部分を含む、請求項1に記載のコレクタシステム。
- レーザリフトオフを介してサブマウントから解放されるチップを受け入れるキャビティと、
該キャビティに真空をもたらして、該キャビティから前記チップを除去する、トンネルと、
エアプッシャを介して前記キャビティ内に空気圧をもたらす少なくとも1つのパイプとを含み、
前記エアプッシャは、高速で低容量の空気流を前記キャビティ内にもたらすエアナイフを含む、
収集システム。 - 前記少なくとも1つのパイプは、前記キャビティの上半分に位置付けられ、前記キャビティの下半分に向かって方向付けられるエアプッシャを含む、請求項6に記載の収集システム。
- 前記少なくとも1つのパイプは、前記キャビティの下半分に位置付けられ、前記キャビティの上半分に向かって方向付けられるエアプッシャを含む、請求項6に記載の収集システム。
- 前記トンネルは、前記キャビティへのフレア状の連結部を含む、請求項6に記載の収集システム。
- 前記コレクタシステムの下側から延び、前記チップが前記キャビティに入る開口を含む、面取りされたピックアップ要素を含む、請求項6に記載の収集システム。
- レーザリフトオフを介してサブマウントから解放されるチップを受け入れるキャビティと、
該キャビティに真空をもたらして、該キャビティから前記チップを除去する、トンネルとを含み、
前記トンネルは、前記キャビティへのフレア状の連結部を含む、
収集システム。 - 前記キャビティの上半分に位置付けられ、前記キャビティの下半分に向かって方向付けられるエアプッシャを含む、パイプを含み、前記エアプッシャは、高速で低容量の空気流を前記キャビティ内にもたらすエアナイフを含む、請求項11に記載の収集システム。
- 前記キャビティの下半分に位置付けられ、前記キャビティの上半分に向かって方向付けられるエアプッシャを含む、パイプを含み、前記エアプッシャは、高速で低容量の空気流を前記キャビティ内にもたらすエアナイフを含む、請求項11に記載の収集システム。
- 前記コレクタシステムの下側から延び、前記チップが前記キャビティに入る開口を含む、面取りされたピックアップ要素を含む、請求項11に記載の収集システム。
- 前記コレクタシステムの下側は、前記サブマウントの平面に対して傾斜させられている、請求項11に記載の収集システム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462038988P | 2014-08-19 | 2014-08-19 | |
US62/038,988 | 2014-08-19 | ||
PCT/IB2015/055712 WO2016027186A1 (en) | 2014-08-19 | 2015-07-29 | Sapphire collector for reducing mechanical damage during die level laser lift-off |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017532766A true JP2017532766A (ja) | 2017-11-02 |
JP2017532766A5 JP2017532766A5 (ja) | 2018-09-06 |
JP7071118B2 JP7071118B2 (ja) | 2022-05-18 |
Family
ID=54065409
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017509634A Active JP7071118B2 (ja) | 2014-08-19 | 2015-07-29 | ダイレベルのレーザリフトオフ中の機械的損傷を減少させるサファイアコレクタ |
Country Status (7)
Country | Link |
---|---|
US (1) | US11311967B2 (ja) |
EP (1) | EP3183091B8 (ja) |
JP (1) | JP7071118B2 (ja) |
KR (1) | KR102410997B1 (ja) |
CN (2) | CN111496379B (ja) |
TW (1) | TWI680520B (ja) |
WO (1) | WO2016027186A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3183091B8 (en) | 2014-08-19 | 2018-09-05 | Lumileds Holding B.V. | Sapphire collector for reducing mechanical damage during die level laser lift-off |
JP6807334B2 (ja) * | 2015-05-13 | 2021-01-06 | ルミレッズ ホールディング ベーフェー | ダイレベルのリフトオフの最中におけるメカニカルダメージを低減するためのサファイアコレクタ |
JP6516624B2 (ja) * | 2015-08-11 | 2019-05-22 | 株式会社ディスコ | レーザ加工装置 |
JP7272921B2 (ja) * | 2019-09-25 | 2023-05-12 | ファナック株式会社 | バリ取り装置 |
JP7431601B2 (ja) * | 2020-02-10 | 2024-02-15 | 株式会社ディスコ | レーザー加工装置 |
CN215880324U (zh) * | 2021-09-26 | 2022-02-22 | 宁德时代新能源科技股份有限公司 | 激光焊接铜嘴、激光焊接辅助装置及激光焊接设备 |
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CN111496379B (zh) | 2022-08-26 |
US20170274474A1 (en) | 2017-09-28 |
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EP3183091A1 (en) | 2017-06-28 |
TW201616590A (zh) | 2016-05-01 |
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WO2016027186A1 (en) | 2016-02-25 |
EP3183091B1 (en) | 2018-05-16 |
US11311967B2 (en) | 2022-04-26 |
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