DE3382294D1 - Mittel zum verhindern des durchbruchs einer isolierschicht in halbleiteranordnungen. - Google Patents

Mittel zum verhindern des durchbruchs einer isolierschicht in halbleiteranordnungen.

Info

Publication number
DE3382294D1
DE3382294D1 DE8383101657T DE3382294T DE3382294D1 DE 3382294 D1 DE3382294 D1 DE 3382294D1 DE 8383101657 T DE8383101657 T DE 8383101657T DE 3382294 T DE3382294 T DE 3382294T DE 3382294 D1 DE3382294 D1 DE 3382294D1
Authority
DE
Germany
Prior art keywords
breakdown
preventing
insulating layer
semiconductor devices
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8383101657T
Other languages
English (en)
Inventor
Hiroyuki Kinoshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2702382A external-priority patent/JPS58143561A/ja
Priority claimed from JP57064684A external-priority patent/JPS58182271A/ja
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE3382294D1 publication Critical patent/DE3382294D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/402—Field plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0266—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312—Gate electrodes for field effect devices
    • H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
    • H01L29/42376—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the length or the sectional shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE8383101657T 1982-02-22 1983-02-21 Mittel zum verhindern des durchbruchs einer isolierschicht in halbleiteranordnungen. Expired - Lifetime DE3382294D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2702382A JPS58143561A (ja) 1982-02-22 1982-02-22 半導体装置
JP57064684A JPS58182271A (ja) 1982-04-20 1982-04-20 半導体装置

Publications (1)

Publication Number Publication Date
DE3382294D1 true DE3382294D1 (de) 1991-07-04

Family

ID=26364889

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383101657T Expired - Lifetime DE3382294D1 (de) 1982-02-22 1983-02-21 Mittel zum verhindern des durchbruchs einer isolierschicht in halbleiteranordnungen.

Country Status (3)

Country Link
US (1) US5113230A (de)
EP (1) EP0087155B1 (de)
DE (1) DE3382294D1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2635411A1 (fr) * 1988-08-11 1990-02-16 Sgs Thomson Microelectronics Memoire de type eprom a haute densite d'integration avec une organisation en damier, un facteur de couplage ameliore et une possibilite de redondance
US5268589A (en) * 1990-09-28 1993-12-07 Siemens Aktiengesellschaft Semiconductor chip having at least one electrical resistor means
EP0598146A1 (de) * 1992-11-16 1994-05-25 ALCATEL BELL Naamloze Vennootschap Schutzanordnung gegen elektrostatische Entladungen
TW344130B (en) 1995-10-11 1998-11-01 Int Rectifier Corp Termination structure for semiconductor device and process for its manufacture
US5940721A (en) * 1995-10-11 1999-08-17 International Rectifier Corporation Termination structure for semiconductor devices and process for manufacture thereof

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3518506A (en) * 1967-12-06 1970-06-30 Ibm Semiconductor device with contact metallurgy thereon,and method for making same
US3862017A (en) * 1970-02-04 1975-01-21 Hideo Tsunemitsu Method for producing a thin film passive circuit element
JPS5928992B2 (ja) * 1975-02-14 1984-07-17 日本電信電話株式会社 Ｍｏｓトランジスタおよびその製造方法
JPS5275987A (en) * 1975-12-22 1977-06-25 Hitachi Ltd Gate protecting device
JPS5299786A (en) * 1976-02-18 1977-08-22 Agency Of Ind Science & Technol Mos integrated circuit
JPS54137286A (en) * 1978-04-17 1979-10-24 Nec Corp Semiconductor device
JPS556870A (en) * 1978-06-29 1980-01-18 Nec Corp Mos type semiconductor device
CA1142271A (en) * 1979-03-28 1983-03-01 Thomas E. Hendrickson Field effect semiconductor device
US4288806A (en) * 1979-05-29 1981-09-08 Xerox Corporation High voltage MOSFET with overlapping electrode structure
JPS5811750B2 (ja) * 1979-06-04 1983-03-04 株式会社日立製作所 高耐圧抵抗素子
JPS5651874A (en) * 1979-10-05 1981-05-09 Nec Corp Semiconductor device
JPS5852347B2 (ja) * 1980-02-04 1983-11-22 株式会社日立製作所 高耐圧半導体装置
JPS56169368A (en) * 1980-05-30 1981-12-26 Sharp Corp High withstand voltage mos field effect semiconductor device
JPS5724563A (en) * 1980-07-21 1982-02-09 Nec Corp Semiconductor device
US4424579A (en) * 1981-02-23 1984-01-03 Burroughs Corporation Mask programmable read-only memory stacked above a semiconductor substrate

Also Published As

Publication number Publication date
US5113230A (en) 1992-05-12
EP0087155A2 (de) 1983-08-31
EP0087155A3 (en) 1986-08-20
EP0087155B1 (de) 1991-05-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee