IT1180059B - Dissipatore di calore per dispositivi semiconduttori - Google Patents

Dissipatore di calore per dispositivi semiconduttori

Info

Publication number
IT1180059B
IT1180059B IT67374/84A IT6737484A IT1180059B IT 1180059 B IT1180059 B IT 1180059B IT 67374/84 A IT67374/84 A IT 67374/84A IT 6737484 A IT6737484 A IT 6737484A IT 1180059 B IT1180059 B IT 1180059B
Authority
IT
Italy
Prior art keywords
heat dissipator
semiconductive devices
semiconductive
devices
dissipator
Prior art date
Application number
IT67374/84A
Other languages
English (en)
Other versions
IT8467374A0 (it
IT8467374A1 (it
Inventor
Ronald B Lavochkin
Original Assignee
Imc Magnetics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imc Magnetics Corp filed Critical Imc Magnetics Corp
Publication of IT8467374A0 publication Critical patent/IT8467374A0/it
Publication of IT8467374A1 publication Critical patent/IT8467374A1/it
Application granted granted Critical
Publication of IT1180059B publication Critical patent/IT1180059B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IT67374/84A 1983-06-16 1984-04-13 Dissipatore di calore per dispositivi semiconduttori IT1180059B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/504,726 US4509839A (en) 1983-06-16 1983-06-16 Heat dissipator for semiconductor devices

Publications (3)

Publication Number Publication Date
IT8467374A0 IT8467374A0 (it) 1984-04-13
IT8467374A1 IT8467374A1 (it) 1985-10-13
IT1180059B true IT1180059B (it) 1987-09-23

Family

ID=24007476

Family Applications (1)

Application Number Title Priority Date Filing Date
IT67374/84A IT1180059B (it) 1983-06-16 1984-04-13 Dissipatore di calore per dispositivi semiconduttori

Country Status (7)

Country Link
US (1) US4509839A (it)
JP (1) JPS6014459A (it)
CA (1) CA1204522A (it)
DE (1) DE3422362A1 (it)
FR (1) FR2547675B1 (it)
GB (1) GB2141580B (it)
IT (1) IT1180059B (it)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1209579B (it) * 1984-08-08 1989-08-30 Macario Varese As Impianto per lo smistamento di colli, con carrelli a movimentazione autonoma.
JPH0135482Y2 (it) * 1985-03-26 1989-10-30
US4707726A (en) * 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
US4729426A (en) * 1986-03-06 1988-03-08 Thermalloy Incorporated Bonded clip heat sink
JPS62281241A (ja) * 1986-05-29 1987-12-07 Mitsubishi Electric Corp 陰極線管
JPS6380439A (ja) * 1986-09-22 1988-04-11 Mitsubishi Electric Corp シヤドウマスクの表面処理方法
US4710852A (en) * 1986-09-26 1987-12-01 General Motors Corporation Spring retainer for encapsulated semiconductor device
FR2604593A1 (fr) * 1986-09-30 1988-04-01 Trt Telecom Radio Electr Clip pour le maintien du boitier d'un composant semi-conducteur monte sur une plaque support
US4716494A (en) * 1986-11-07 1987-12-29 Amp Incorporated Retention system for removable heat sink
DE8703782U1 (de) * 1987-03-13 1987-07-23 Loewe Opta Gmbh, 8640 Kronach Einrichtung zum Festhalten eines Kühlkörpers auf der Kühlfläche eines integrierten Bausteins
US4776178A (en) * 1987-11-02 1988-10-11 Whirlpool Corporation Thermostat mounting system for automatic defrost refrigerator
US4923179A (en) * 1987-11-02 1990-05-08 Chrysler Corporation Spring panel heat sink for electrical components
US4922601A (en) * 1987-11-02 1990-05-08 Chrysler Corporation Method of making a heat sink for electrical components
US4891735A (en) * 1987-11-02 1990-01-02 Chrysler Motors Corporation Heat sink for electrical components
US4845590A (en) * 1987-11-02 1989-07-04 Chrysler Motors Corporation Heat sink for electrical components
US4888637A (en) * 1988-01-15 1989-12-19 Chrysler Motors Corporation Multiple semiconductor heat sink/mounting assembly
JPH0210626A (ja) * 1988-06-27 1990-01-16 Mitsubishi Electric Corp シヤドウマスクの電子反射膜の形成方法
JPH0275132A (ja) * 1988-09-09 1990-03-14 Hitachi Ltd シャドウマスク形カラー陰極線管
US4933746A (en) * 1988-09-12 1990-06-12 Aavid Engineering, Inc. Three-legged clip
JPH0317930A (ja) * 1989-06-13 1991-01-25 Mitsubishi Electric Corp カラーブラウン管の製造方法
DE9004903U1 (de) * 1990-04-30 1990-07-05 Ing. Rolf Seifert electronic GmbH, 5828 Ennepetal Kühlkörper und Feder zur Klemmhalterung eines zu kühlenden Bauteiles
US5283467A (en) * 1992-06-05 1994-02-01 Eaton Corporation Heat sink mounting system for semiconductor devices
US5329426A (en) * 1993-03-22 1994-07-12 Digital Equipment Corporation Clip-on heat sink
US5464054A (en) * 1993-08-09 1995-11-07 Thermalloy, Inc. Spring clamp and heat sink assembly
US5829516A (en) * 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
US5386338A (en) * 1993-12-20 1995-01-31 Thermalloy, Inc. Heat sink attachment assembly
US5477916A (en) * 1995-02-27 1995-12-26 Lin; Shih-Jen Retainer frame assembly for dissipating heat generated on an integrated circuit chip
US5581442A (en) * 1995-06-06 1996-12-03 Wakefield Engineering, Inc. Spring clip for clamping a heat sink module to an electronic module
TW305051B (it) 1995-09-18 1997-05-11 Hitachi Ltd
CN1152428C (zh) * 1995-10-13 2004-06-02 热合金公司 可焊式晶体管夹子和夹子与散热器的组合装置
US5587608A (en) * 1995-10-27 1996-12-24 Meng; Ching-Ming Structure heat sink for power semiconductors
DE29517365U1 (de) * 1995-11-02 1997-02-27 Robert Bosch Gmbh, 70469 Stuttgart Verschluß zum Verbinden mindestens eines ersten Teils mit einem zweiten Teil
CA2282644A1 (en) * 1997-02-27 1998-09-03 John Cennamo Spring clip for attaching an electronic component to a heat sink and an assembly utilizing the same
US5991154A (en) * 1997-10-07 1999-11-23 Thermalloy, Inc. Attachment of electronic device packages to heat sinks
GB2330690A (en) * 1997-10-27 1999-04-28 Thomson Multimedia Sa A clip-on heat sink
US6068051A (en) * 1998-03-23 2000-05-30 Intel Corporation Channeled heat sink
US5930116A (en) * 1998-06-12 1999-07-27 Harman International Industries, Incorporated Integrated clamping mechanism
US6128191A (en) * 1998-11-20 2000-10-03 Lucent Technologies Inc. Heat sink with integral self-locking clamp
US6266244B1 (en) 1999-10-25 2001-07-24 Harman International Industries Incorporated Mounting method and apparatus for electrical components
JP4218184B2 (ja) * 2000-05-19 2009-02-04 株式会社デンソー 半導体装置の実装構造
US6496371B2 (en) * 2001-03-30 2002-12-17 Intel Corporation Heat sink mounting method and apparatus
US6351381B1 (en) 2001-06-20 2002-02-26 Thermal Corp. Heat management system
US6388882B1 (en) 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
US6449157B1 (en) * 2001-10-03 2002-09-10 Ho Kang Chu IC package assembly with retention mechanism
US20050160568A1 (en) * 2002-03-21 2005-07-28 Aavid Thermalloy, Llc Support clip
TW520133U (en) * 2002-05-17 2003-02-01 Hon Hai Prec Ind Co Ltd A clip assembly
US6947283B2 (en) * 2002-10-01 2005-09-20 Intel Corporation Heat sink and retaining clip assembly
DE10326458B4 (de) * 2003-06-12 2006-05-04 Phoenix Contact Gmbh & Co. Kg Kühlanordnung für elektronische Bauelemente
US20050225945A1 (en) * 2004-04-08 2005-10-13 Kechuan Liu Universal mountable heat sink with integral spring clip
US7206206B2 (en) * 2004-06-24 2007-04-17 Inventec Corporation Radiator structure
US20110013374A1 (en) * 2009-07-16 2011-01-20 Kechuan Kevin Liu Integral Spring Clip for Heat Dissipators
DE102010042211A1 (de) * 2010-10-08 2012-04-12 Eta Plus Electronic Gmbh Kühlvorrichtung für Halbleiterbauelemente
US9591788B2 (en) * 2011-04-13 2017-03-07 Siemens Aktiengesellschaft Coupling system between a waste-heat generator and a waste-heat receiver
USD758327S1 (en) 2014-09-30 2016-06-07 Valeo Vision Heat sink for a lighting device module for a vehicle

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3548927A (en) * 1968-11-29 1970-12-22 Intern Electronic Research Co Heat dissipating retainer for electronic component
US3572428A (en) * 1969-01-29 1971-03-23 Motorola Inc Clamping heat sink
US3694703A (en) * 1970-09-02 1972-09-26 Staver Co Inc The Heat dissipator for encased semiconductor device having heat tab extending therefrom
US3942854A (en) * 1974-10-09 1976-03-09 Burroughs Corporation Hold down device for use in electronic systems employing integrated circuits
US4019983A (en) * 1974-10-10 1977-04-26 Houdaille Industries, Inc. Disinfection system and method
JPS5827945B2 (ja) * 1975-07-23 1983-06-13 マツダ カズオ キユウギキ
US4012769A (en) 1975-08-04 1977-03-15 Thermalloy Incorporated Heat sink with parallel flat faces
US4054901A (en) * 1975-10-14 1977-10-18 Thermalloy, Inc. Index mounting unitary heat sink apparatus with apertured base
US4215361A (en) * 1978-09-12 1980-07-29 Aavid Engineering, Inc. Winged self-fastened heat sinks for semiconductor devices
US4235285A (en) * 1979-10-29 1980-11-25 Aavid Engineering, Inc. Self-fastened heat sinks
DE3143339A1 (de) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
US4421161A (en) * 1982-05-06 1983-12-20 Burroughs Corporation Heat exchanger for integrated circuit packages
DE8329394U1 (de) * 1983-10-12 1984-01-12 Triumph-Adler Aktiengesellschaft für Büro- und Informationstechnik, 8500 Nürnberg Vorrichtung zum befestigen von leistungstransistoren an einem kuehlblech

Also Published As

Publication number Publication date
GB2141580B (en) 1986-09-03
CA1204522A (en) 1986-05-13
IT8467374A0 (it) 1984-04-13
GB2141580A (en) 1984-12-19
FR2547675B1 (fr) 1988-07-29
DE3422362A1 (de) 1984-12-20
US4509839A (en) 1985-04-09
JPS6014459A (ja) 1985-01-25
GB8405054D0 (en) 1984-04-04
FR2547675A1 (fr) 1984-12-21
IT8467374A1 (it) 1985-10-13

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970429