CN106319603A - Formula of blackhole hole-leveling agent - Google Patents

Formula of blackhole hole-leveling agent Download PDF

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Publication number
CN106319603A
CN106319603A CN201610749809.3A CN201610749809A CN106319603A CN 106319603 A CN106319603 A CN 106319603A CN 201610749809 A CN201610749809 A CN 201610749809A CN 106319603 A CN106319603 A CN 106319603A
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CN
China
Prior art keywords
parts
brightener
solvent
emulsifying agent
surfactant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610749809.3A
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Chinese (zh)
Inventor
朱伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU YINUO CHEMICAL MATERIALS CO Ltd
Original Assignee
SUZHOU YINUO CHEMICAL MATERIALS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU YINUO CHEMICAL MATERIALS CO Ltd filed Critical SUZHOU YINUO CHEMICAL MATERIALS CO Ltd
Priority to CN201610749809.3A priority Critical patent/CN106319603A/en
Publication of CN106319603A publication Critical patent/CN106319603A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34Pretreatment of metallic surfaces to be electroplated

Abstract

The invention discloses a formula of a blackhole hole-leveling agent. The formula comprises an emulsifier, an alkaline substance, a surfactant, a brightener and a solvent. The formula comprises, by weight, 95-105 parts of the emulsifier, 22-27 parts of the alkaline substance, 4-5 parts of the surfactant, 2 parts of the brightener and 950-1,100 parts of the solvent. The blackhole hole-leveling agent prepared through the formula has the good leveling effect on glass fiber and a base material of the surface of the hole wall, and the quality of subsequent plating can be improved.

Description

A kind of black holes conditioner formula
Technical field
The present invention relates to electroplating technology field, be specifically related to a kind of black holes conditioner formula.
Background technology
Black holes Direct Electroplating technology is the copper-plated a kind of new technology of substituted chemistry.It uses extremely strong fine of conductive capability The dark solution (being referred to as blank hole liquid, English name Blackhole) of white carbon black or graphite composition is adsorbed on the hole wall surface of base material, Conductive layer that form uniform and delicate, that be firmly combined with.
In order to ensure blank hole liquid reliable attachment on the hole wall surface of base material, black holes Direct Electroplating technology generally includes two Road black holes flow process, and between a black holes and secondary black holes, need to use black holes conditioner that base material is processed, its purpose It is to flatten hole wall surface, and negative charge original on hole wall surface is adjusted to electropositive, promote in blank hole liquid electronegative Carbon black particle adsorb on hole wall.
Therefore, the proportioning of black holes conditioner is the most rationally directly connected to the quality quality of plating.
Summary of the invention
It is an object of the invention to provide a kind of black holes conditioner formula.
For achieving the above object, the present invention adopts the following technical scheme that
A kind of black holes conditioner formula, including following components: emulsifying agent, alkaline matter, surfactant, brightener and molten Agent;
The parts by weight of described component are: emulsifying agent 95-105 part, alkaline matter 22-27 part, surfactant 4-5 part, Brightener 2 parts, solvent 950-1100 part.
As further improved technical scheme of the present invention, including following components: emulsifying agent, alkaline matter, surface activity Agent, brightener and solvent;
The parts by weight of described component are: emulsifying agent 100 parts, alkaline matter 25 parts, 5 parts of surfactant, brightener 2 Part, solvent 1000 parts.
As further improved technical scheme of the present invention, including following components: emulsifying agent, alkaline matter, surface activity Agent, brightener and solvent;
The parts by weight of described component are: emulsifying agent 95 parts, alkaline matter 22 parts, 4 parts of surfactant, brightener 2 parts, Solvent 1100 parts.
As further improved technical scheme of the present invention, including following components: emulsifying agent, alkaline matter, surface activity Agent, brightener and solvent;
The parts by weight of described component are: emulsifying agent 105 parts, alkaline matter 27 parts, 5 parts of surfactant, brightener 2 Part, solvent 950 parts.
As further improved technical scheme of the present invention, described emulsifying agent is monoethanolamine, and described alkaline matter is hydrogen Potassium oxide, described brightener is quaternary ammoniated imidazoles, and described solvent is water.
Relative to prior art, the method have technical effect that:
Black holes conditioner made by the formula of the present invention is effective to the leveling of hole wall surface glass fibre, base material, can To improve the quality of follow-up plating.
Detailed description of the invention
Describe the present invention below with reference to detailed description of the invention.But these embodiments are not limiting as this Bright, structure, method or conversion functionally that those of ordinary skill in the art is made according to these embodiments all comprise Within the scope of the present invention.
The invention provides a kind of black holes conditioner formula, including following components: emulsifying agent, alkaline matter, surface activity Agent, brightener and solvent;
The parts by weight of described component are: emulsifying agent 95-105 part, alkaline matter 22-27 part, surfactant 4-5 part, Brightener 2 parts, solvent 950-1100 part.
Described emulsifying agent is monoethanolamine, and described alkaline matter is potassium hydroxide, and described brightener is quaternary ammoniated imidazoles, institute Stating solvent is water.
It should be noted that surfactant is electric charge adjusts cationic surfactant.
Embodiment one
The invention provides a kind of black holes conditioner formula, including following components: emulsifying agent, alkaline matter, surface activity Agent, brightener and solvent;
The parts by weight of described component are: emulsifying agent 100 parts, alkaline matter 25 parts, 5 parts of surfactant, brightener 2 Part, solvent 1000 parts.
Described emulsifying agent is monoethanolamine, and described alkaline matter is potassium hydroxide, and described brightener is quaternary ammoniated imidazoles, institute Stating solvent is water.
Embodiment two
The invention provides a kind of black holes conditioner formula, including following components: emulsifying agent, alkaline matter, surface activity Agent, brightener and solvent;
The parts by weight of described component are: emulsifying agent 95 parts, alkaline matter 22 parts, 4 parts of surfactant, brightener 2 parts, Solvent 1100 parts.
Described emulsifying agent is monoethanolamine, and described alkaline matter is potassium hydroxide, and described brightener is quaternary ammoniated imidazoles, institute Stating solvent is water.
Embodiment three
The invention provides a kind of black holes conditioner formula, including following components: emulsifying agent, alkaline matter, surface activity Agent, brightener and solvent;
The parts by weight of described component are: emulsifying agent 105 parts, alkaline matter 27 parts, 5 parts of surfactant, brightener 2 Part, solvent 950 parts.
Described emulsifying agent is monoethanolamine, and described alkaline matter is potassium hydroxide, and described brightener is quaternary ammoniated imidazoles, institute Stating solvent is water.
Relative to prior art, the method have technical effect that:
Black holes conditioner made by the formula of the present invention is effective to the leveling of hole wall surface glass fibre, base material, can To improve the quality of follow-up plating.
Last it is noted that embodiment of above is only in order to illustrate technical scheme, it is not intended to limit;To the greatest extent The present invention has been described in detail by pipe with reference to aforementioned embodiments, it will be understood by those within the art that: it depends on So the technical scheme described in aforementioned each embodiment can be modified, or wherein portion of techniques feature is equal to Replace;And these amendments or replacement, do not make the essence of appropriate technical solution depart from the present invention each embodiment technical scheme Spirit and scope.

Claims (5)

1. a black holes conditioner formula, it is characterised in that include following components: emulsifying agent, alkaline matter, surfactant, Brightener and solvent;
The parts by weight of described component are: emulsifying agent 95-105 part, alkaline matter 22-27 part, surfactant 4-5 part, light Agent 2 parts, solvent 950-1100 part.
Black holes conditioner formula the most according to claim 1, it is characterised in that include following components: emulsifying agent, basic species Matter, surfactant, brightener and solvent;
The parts by weight of described component are: emulsifying agent 100 parts, alkaline matter 25 parts, 5 parts of surfactant, and brightener 2 parts is molten Agent 1000 parts.
Black holes conditioner formula the most according to claim 1, it is characterised in that include following components: emulsifying agent, basic species Matter, surfactant, brightener and solvent;
The parts by weight of described component are: emulsifying agent 95 parts, alkaline matter 22 parts, 4 parts of surfactant, brightener 2 parts, solvent 1100 parts.
Black holes conditioner formula the most according to claim 1, it is characterised in that include following components: emulsifying agent, basic species Matter, surfactant, brightener and solvent;
The parts by weight of described component are: emulsifying agent 105 parts, alkaline matter 27 parts, 5 parts of surfactant, and brightener 2 parts is molten Agent 950 parts.
5. according to the black holes conditioner formula that any one of claim 1-4 is described, it is characterised in that described emulsifying agent is single second Hydramine, described alkaline matter is potassium hydroxide, and described brightener is quaternary ammoniated imidazoles, and described solvent is water.
CN201610749809.3A 2016-08-29 2016-08-29 Formula of blackhole hole-leveling agent Pending CN106319603A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610749809.3A CN106319603A (en) 2016-08-29 2016-08-29 Formula of blackhole hole-leveling agent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610749809.3A CN106319603A (en) 2016-08-29 2016-08-29 Formula of blackhole hole-leveling agent

Publications (1)

Publication Number Publication Date
CN106319603A true CN106319603A (en) 2017-01-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610749809.3A Pending CN106319603A (en) 2016-08-29 2016-08-29 Formula of blackhole hole-leveling agent

Country Status (1)

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CN (1) CN106319603A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107022162A (en) * 2017-03-31 2017-08-08 深圳市星扬化工有限公司 A kind of Organic Conductive Films conditioner and preparation method thereof
CN108822974A (en) * 2018-05-23 2018-11-16 昆山市线路板厂 A kind of flexible electric circuit board conditioner
CN109511228A (en) * 2018-12-21 2019-03-22 苏州美吉纳纳米新材料科技有限公司 Conditioner and preparation method thereof before a kind of selectivity PCB black holes
CN109825375A (en) * 2019-02-26 2019-05-31 湖南互连微电子材料有限公司 A kind of cleaning conditioner and its application method

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1733980A (en) * 2004-08-02 2006-02-15 吕桂生 Electricity conductive liquid capable of directly galvanizing the printed board
CN101394712A (en) * 2007-09-21 2009-03-25 清华大学 Hole blackening solution and preparation thereof
CN101040065B (en) * 2004-10-13 2010-08-18 麦克德米德有限公司 Process for preparing a non-conductive substrate for electroplating
CN101967628A (en) * 2009-07-27 2011-02-09 深圳市正天伟科技有限公司 Pore wall charge regulating agent for circuit board
CN101453837B (en) * 2007-11-28 2011-03-30 比亚迪股份有限公司 Hole electricity conduction method for printed circuit board
CN104105362A (en) * 2014-07-08 2014-10-15 深圳华麟电路技术有限公司 Black hole horizontal production line technological process and black hole groove structure
CN104294340A (en) * 2014-09-26 2015-01-21 无锡长辉机电科技有限公司 PCB black hole process
CN104562115A (en) * 2014-07-04 2015-04-29 广东丹邦科技有限公司 Black hole liquid for printed circuit board and preparation method of black hole liquid
CN104818506A (en) * 2015-05-28 2015-08-05 哈尔滨工业大学 Solution for metalizing printed circuit board hole
CN103222351B (en) * 2011-10-25 2015-12-16 建业(惠州)电路版有限公司 The metallized method of printed circuit board aperture

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1733980A (en) * 2004-08-02 2006-02-15 吕桂生 Electricity conductive liquid capable of directly galvanizing the printed board
CN101040065B (en) * 2004-10-13 2010-08-18 麦克德米德有限公司 Process for preparing a non-conductive substrate for electroplating
CN101394712A (en) * 2007-09-21 2009-03-25 清华大学 Hole blackening solution and preparation thereof
CN101453837B (en) * 2007-11-28 2011-03-30 比亚迪股份有限公司 Hole electricity conduction method for printed circuit board
CN101967628A (en) * 2009-07-27 2011-02-09 深圳市正天伟科技有限公司 Pore wall charge regulating agent for circuit board
CN103222351B (en) * 2011-10-25 2015-12-16 建业(惠州)电路版有限公司 The metallized method of printed circuit board aperture
CN104562115A (en) * 2014-07-04 2015-04-29 广东丹邦科技有限公司 Black hole liquid for printed circuit board and preparation method of black hole liquid
CN104105362A (en) * 2014-07-08 2014-10-15 深圳华麟电路技术有限公司 Black hole horizontal production line technological process and black hole groove structure
CN104294340A (en) * 2014-09-26 2015-01-21 无锡长辉机电科技有限公司 PCB black hole process
CN104818506A (en) * 2015-05-28 2015-08-05 哈尔滨工业大学 Solution for metalizing printed circuit board hole

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107022162A (en) * 2017-03-31 2017-08-08 深圳市星扬化工有限公司 A kind of Organic Conductive Films conditioner and preparation method thereof
CN108822974A (en) * 2018-05-23 2018-11-16 昆山市线路板厂 A kind of flexible electric circuit board conditioner
CN109511228A (en) * 2018-12-21 2019-03-22 苏州美吉纳纳米新材料科技有限公司 Conditioner and preparation method thereof before a kind of selectivity PCB black holes
CN109511228B (en) * 2018-12-21 2020-12-04 苏州美吉纳纳米新材料科技有限公司 Selective PCB (printed circuit board) pre-hole-blackening hole-finishing agent and preparation method thereof
CN109825375A (en) * 2019-02-26 2019-05-31 湖南互连微电子材料有限公司 A kind of cleaning conditioner and its application method

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Application publication date: 20170111