CN104818506A - Solution for metalizing printed circuit board hole - Google Patents
Solution for metalizing printed circuit board hole Download PDFInfo
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- CN104818506A CN104818506A CN201510282631.1A CN201510282631A CN104818506A CN 104818506 A CN104818506 A CN 104818506A CN 201510282631 A CN201510282631 A CN 201510282631A CN 104818506 A CN104818506 A CN 104818506A
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Abstract
The invention relates to a solution for metalizing a printed circuit board hole, and aims to solve the problem of high resistance of the carbon material in the black hole making solution in the existing method. The solution comprises a graphite cream, an anionic surfactant, a nonionic surfactant and deionized water. The pH value of the solution is 7.5-10.5. The graphite system has lower resistance, and thus, has higher conductivity, thereby achieving favorable conducting effects under the condition of adsorbing fewer black hole making materials. The solution is applicable to the technical field of hole metalization.
Description
Technical field
The present invention relates to a kind of for the metallized solution of printed circuit board aperture.
Background technology
Existing black holes technology is mainly using carbon black or nano-sized carbon as the carbon material in hole blackening solution, and these carbon material resistance are larger.Along with people are to the high-density requirement of printed board, this makes the aperture-hole depth rate of printed board more and more less.The aperture plating of thick printed circuit board requires that the condition that it is adsorbing as far as possible few carbon material is issued to identical conductive effect.And the black holes carbon material resistance adopted at present is comparatively large, above-mentioned requirements can not be met.
Summary of the invention
The present invention is the problem that the carbon material resistance that will solve in existing method hole blackening solution is large, provides a kind of for the metallized solution of printed circuit board aperture
A kind of aquadag, 0.5 ~ 2 part of anion surfactant, 0.5 ~ 1 portion of nonionogenic tenside and 88 ~ 93 parts of deionized waters comprising 2 ~ 5 parts for the metallized solution of printed circuit board aperture by mass fraction of the present invention; PH wherein for the metallized solution of printed circuit board aperture is 7.5 ~ 10.5; Anion surfactant is that one or more in sodium lauryl sulphate, Sodium dodecylbenzene sulfonate, polyoxyethylenated alcohol sodium sulfate and pareth sulfate are by arbitrarily than the mixture formed.
The aperture of current circuit card is more and more less, and the aperture plating of thick printed circuit board requires that again it is issued to identical conductive effect in the condition of the less black holes formed material of absorption.The graphite system that the present invention adopts is less due to its resistance, thus has better electroconductibility, can better meet this requirement.
Embodiment
Embodiment one: present embodiment one is used for the metallized solution of printed circuit board aperture, comprises 2 ~ 5 parts of aquadags, 0.5 ~ 2 part of anion surfactant, 0.5 ~ 1 portion of nonionogenic tenside and 88 ~ 93 parts of deionized waters by mass fraction; PH wherein for the metallized solution of printed circuit board aperture is 7.5 ~ 10.5; Anion surfactant is that one or more in sodium lauryl sulphate, Sodium dodecylbenzene sulfonate, polyoxyethylenated alcohol sodium sulfate and pareth sulfate are by arbitrarily than the mixture formed.
The aperture of current circuit card is more and more less, and the aperture plating of thick printed circuit board requires that again it is issued to identical conductive effect in the condition of the less black holes formed material of absorption.The graphite system that present embodiment adopts is less due to its resistance, thus has better electroconductibility, can better meet this requirement.
Embodiment two: present embodiment and embodiment one are unlike the described aquadag, 1.5 parts of anion surfactants, 0.5 portion of nonionogenic tenside and the 92 parts of deionized waters that comprise 3 parts for the metallized solution of printed circuit board aperture by mass fraction; PH wherein for the metallized solution of printed circuit board aperture is 8.Other steps are identical with embodiment one with parameter.
Embodiment three: present embodiment and embodiment one or two unlike: described nonionogenic tenside is alkylphenol polyoxyethylene, high-carbon fatty alcohol polyoxyethylene ether, sorbitan ester, sucrose ester or polyoxyethylene carboxylate.Other steps are identical with embodiment one or two with parameter.
Embodiment four: one of present embodiment and embodiment one to three unlike: the described pH for the metallized solution of printed circuit board aperture adopts potassium hydroxide solution or ammonia soln to regulate.Other steps are identical with one of embodiment one to three with parameter.
Embodiment five: one of present embodiment and embodiment one to four unlike: the preparation method of this described solution is: one: the aquadag, 0.5 ~ 2 part of anion surfactant, 0.5 ~ 1 portion of nonionogenic tenside and 88 ~ 93 parts of deionized waters that take 2 ~ 5 parts by mass fraction; Two: aquadag is joined in deionized water, obtain mixed solution A; Three: in mixed solution A, add anion surfactant, obtain mixing solutions B; Four: in mixing solutions B, add 0.5 ~ 1 part of nonionogenic tenside, then mechanical stirring 3min, then add alkaline matter adjustment pH to 8, namely complete; Wherein alkaline matter is potassium hydroxide solution or ammonia soln.Other steps are identical with one of embodiment one to four with parameter.
Nonionogenic tenside described in present embodiment is alkylphenol polyoxyethylene, high-carbon fatty alcohol polyoxyethylene ether, sorbitan ester, sucrose ester or polyoxyethylene carboxylate.Anion surfactant is that one or more in sodium lauryl sulphate, Sodium dodecylbenzene sulfonate, polyoxyethylenated alcohol sodium sulfate and pareth sulfate are by arbitrarily than the mixture formed.
By following verification experimental verification beneficial effect of the present invention:
Test 1, this test are used for the metallized solution of printed circuit board aperture comprises 3 parts aquadag, 1.5 parts of Sodium dodecylbenzene sulfonatees, 0.5 part of alkylphenol polyoxyethylene and 92 parts of deionized waters by mass fraction; Concentration is wherein adopted to be that to regulate for the pH of the metallized solution of printed circuit board aperture be 8 for the potassium hydroxide solution of 5mol/L.Preparation method is: one: the aquadag, 1.5 parts of Sodium dodecylbenzene sulfonatees, 0.5 part of alkylphenol polyoxyethylene and the 92 parts of deionized waters that take 3 parts by mass fraction; Two: 3 parts of aquadags are joined in 92 parts of deionized waters, obtains mixed solution A; Three: in mixed solution A, add 1.5 parts of Sodium dodecylbenzene sulfonatees, obtain mixing solutions B; Four: in mixing solutions B, add 0.5 part of alkylphenol polyoxyethylene, then mechanical stirring 3min, then the potassium hydroxide solution adjustment pH to 8 adding that concentration is 5mol/L, namely complete.
That this test is prepared is used for the metallized solution of printed circuit board aperture through pcb board macropore simulation plating, found that can realize copper coating smoothly covers.Illustrate that the graphite system that this test adopts is less due to its resistance, thus there is better electroconductibility, good conductive effect can be issued in the condition of the less black holes formed material of absorption.
Test 2, this test are used for the metallized solution of printed circuit board aperture comprises 3 parts aquadag, 1.5 parts of Sodium dodecylbenzene sulfonatees, 0.5 part of alkylphenol polyoxyethylene and 92 parts of deionized waters by mass fraction; Concentration is wherein adopted to be that to regulate for the pH of the metallized solution of printed circuit board aperture be 8 for the ammonia soln of 14mol/L.Preparation method is: one: the aquadag, 1.5 parts of Sodium dodecylbenzene sulfonatees, 0.5 part of alkylphenol polyoxyethylene and the 92 parts of deionized waters that take 3 parts by mass fraction; Two: 3 parts of aquadags are joined in 92 parts of deionized waters, obtains mixed solution A; Three: in mixed solution A, add 1.5 parts of Sodium dodecylbenzene sulfonatees, obtain mixing solutions B; Four: in mixing solutions B, add 0.5 part of alkylphenol polyoxyethylene, then mechanical stirring 3min, then the ammonia soln adjustment pH to 8 adding that concentration is 14mol/L, namely complete.
That this test is prepared is used for the metallized solution of printed circuit board aperture through pcb board macropore simulation plating, found that can realize copper coating smoothly covers.Illustrate that the graphite system that this test adopts is less due to its resistance, thus there is better electroconductibility, good conductive effect can be issued in the condition of the less black holes formed material of absorption.
Claims (5)
1., for the metallized solution of printed circuit board aperture, it is characterized in that this solution comprises aquadag, 0.5 ~ 2 part of anion surfactant, 0.5 ~ 1 portion of nonionogenic tenside and 88 ~ 93 parts of deionized waters of 2 ~ 5 parts by mass fraction; PH wherein for the metallized solution of printed circuit board aperture is 7.5 ~ 10.5; Anion surfactant is that one or more in sodium lauryl sulphate, Sodium dodecylbenzene sulfonate, polyoxyethylenated alcohol sodium sulfate and pareth sulfate are by arbitrarily than the mixture formed.
2. one according to claim 1 is used for the metallized solution of printed circuit board aperture, it is characterized in that the described aquadag, 1.5 parts of anion surfactants, 0.5 portion of nonionogenic tenside and the 92 parts of deionized waters that comprise 3 parts for the metallized solution of printed circuit board aperture by mass fraction; PH wherein for the metallized solution of printed circuit board aperture is 8.
3. one according to claim 1 is used for the metallized solution of printed circuit board aperture, it is characterized in that described nonionogenic tenside is alkylphenol polyoxyethylene, high-carbon fatty alcohol polyoxyethylene ether, sorbitan ester, sucrose ester or polyoxyethylene carboxylate.
4. one according to claim 1 is used for the metallized solution of printed circuit board aperture, it is characterized in that the described pH for the metallized solution of printed circuit board aperture adopts potassium hydroxide solution or ammonia soln to regulate.
5. one according to claim 1 is used for the metallized solution of printed circuit board aperture, it is characterized in that the preparation method of this described solution is: one: the aquadag, 0.5 ~ 2 part of anion surfactant, 0.5 ~ 1 portion of nonionogenic tenside and 88 ~ 93 parts of deionized waters that take 2 ~ 5 parts by mass fraction; Two: aquadag is joined in deionized water, obtain mixed solution A; Three: in mixed solution A, add anion surfactant, obtain mixing solutions B; Four: in mixing solutions B, add 0.5 ~ 1 part of nonionogenic tenside, then mechanical stirring 3min, then add alkaline matter adjustment pH to 8, namely complete; Wherein alkaline matter is potassium hydroxide solution or ammonia soln.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510282631.1A CN104818506A (en) | 2015-05-28 | 2015-05-28 | Solution for metalizing printed circuit board hole |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510282631.1A CN104818506A (en) | 2015-05-28 | 2015-05-28 | Solution for metalizing printed circuit board hole |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105063681A (en) * | 2015-08-28 | 2015-11-18 | 韶关硕成化工有限公司 | High-concentration carbon hole solution for PCB and preparation method thereof |
| CN105132962A (en) * | 2015-08-28 | 2015-12-09 | 韶关硕成化工有限公司 | High-concentration carbon pore solution applied to PCB boards and preparation method thereof |
| CN105177661A (en) * | 2015-08-28 | 2015-12-23 | 韶关硕成化工有限公司 | High-concentration carbon pore solution for PCB and preparation method of high-concentration carbon pore solution |
| CN106319603A (en) * | 2016-08-29 | 2017-01-11 | 苏州铱诺化学材料有限公司 | Formula of blackhole hole-leveling agent |
| CN108034973A (en) * | 2017-12-06 | 2018-05-15 | 深圳市贝加电子材料有限公司 | The direct electroplating hole metallization solution and preparation method of a kind of printed circuit board (PCB) |
| CN109152239A (en) * | 2017-06-28 | 2019-01-04 | 聂菲菲 | A kind of preparation method of printed circuit board hole blackening solution |
| CN112159997A (en) * | 2020-09-21 | 2021-01-01 | 广东硕成科技有限公司 | Metal-containing/carbon nanoparticle composition for rigid plate hole metallization |
| CN114351197A (en) * | 2021-11-30 | 2022-04-15 | 武汉格智新材料有限公司 | Graphite shadow metallization auxiliary agent and preparation method and application thereof |
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| CN1733980A (en) * | 2004-08-02 | 2006-02-15 | 吕桂生 | Electricity conductive liquid capable of directly galvanizing the printed board |
| CN101394712A (en) * | 2007-09-21 | 2009-03-25 | 清华大学 | Hole blackening solution and preparation thereof |
| CN103491727A (en) * | 2013-09-29 | 2014-01-01 | 哈尔滨工业大学 | Method using printed circuit board graphite oxide reduction method to carry out hole conductivity |
| CN104388996A (en) * | 2014-10-30 | 2015-03-04 | 苏州禾川化学技术服务有限公司 | Black hole liquid and preparation method thereof |
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2015
- 2015-05-28 CN CN201510282631.1A patent/CN104818506A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1733980A (en) * | 2004-08-02 | 2006-02-15 | 吕桂生 | Electricity conductive liquid capable of directly galvanizing the printed board |
| CN101394712A (en) * | 2007-09-21 | 2009-03-25 | 清华大学 | Hole blackening solution and preparation thereof |
| CN103491727A (en) * | 2013-09-29 | 2014-01-01 | 哈尔滨工业大学 | Method using printed circuit board graphite oxide reduction method to carry out hole conductivity |
| CN104388996A (en) * | 2014-10-30 | 2015-03-04 | 苏州禾川化学技术服务有限公司 | Black hole liquid and preparation method thereof |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105063681A (en) * | 2015-08-28 | 2015-11-18 | 韶关硕成化工有限公司 | High-concentration carbon hole solution for PCB and preparation method thereof |
| CN105132962A (en) * | 2015-08-28 | 2015-12-09 | 韶关硕成化工有限公司 | High-concentration carbon pore solution applied to PCB boards and preparation method thereof |
| CN105177661A (en) * | 2015-08-28 | 2015-12-23 | 韶关硕成化工有限公司 | High-concentration carbon pore solution for PCB and preparation method of high-concentration carbon pore solution |
| CN106319603A (en) * | 2016-08-29 | 2017-01-11 | 苏州铱诺化学材料有限公司 | Formula of blackhole hole-leveling agent |
| CN109152239A (en) * | 2017-06-28 | 2019-01-04 | 聂菲菲 | A kind of preparation method of printed circuit board hole blackening solution |
| CN108034973A (en) * | 2017-12-06 | 2018-05-15 | 深圳市贝加电子材料有限公司 | The direct electroplating hole metallization solution and preparation method of a kind of printed circuit board (PCB) |
| CN112159997A (en) * | 2020-09-21 | 2021-01-01 | 广东硕成科技有限公司 | Metal-containing/carbon nanoparticle composition for rigid plate hole metallization |
| CN112159997B (en) * | 2020-09-21 | 2022-03-15 | 广东硕成科技股份有限公司 | Metal-containing/carbon nanoparticle composition for rigid plate hole metallization |
| CN114351197A (en) * | 2021-11-30 | 2022-04-15 | 武汉格智新材料有限公司 | Graphite shadow metallization auxiliary agent and preparation method and application thereof |
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Application publication date: 20150805 |