CN103173824A - Black hole solution for printed circuit board - Google Patents
Black hole solution for printed circuit board Download PDFInfo
- Publication number
- CN103173824A CN103173824A CN2013100673651A CN201310067365A CN103173824A CN 103173824 A CN103173824 A CN 103173824A CN 2013100673651 A CN2013100673651 A CN 2013100673651A CN 201310067365 A CN201310067365 A CN 201310067365A CN 103173824 A CN103173824 A CN 103173824A
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- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- active agent
- blackening solution
- polyoxyethylene ether
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses a black hole solution for a printed circuit board. The black hole solution is characterized by comprising the following raw materials of carbon dust, Na2SiO3, NH4OH, an anionic surface active agent, a non-ionic surface active agent, an anionic nonionic composite surface active agent, and water.
Description
Technical field
The invention belongs to field of printed circuit board fabrication, relate in particular to a kind of use in printed circuit board hole blackening solution.
Background technology
Flexible printed circuit board is made of film, has the significant superiority such as flexible structure, volume are little, lightweight, not only can static deflection, can also do dynamic deflection, curling and folding.Along with the continuous fast development of printed circuit board (PCB) (PCB) processing technology, rigid-flexible provides a kind of new solution in conjunction with the interconnection problems that solves between the electronic functionalities module that appears as of printed circuit board (PCB).The printed circuit board (PCB) that rigid-flexible refers to utilize flexible parent metal and makes in different zones and rigid substrate interconnection in conjunction with printed circuit board (PCB).In hard and soft land, the conductive pattern on flexible parent metal and rigid substrate interconnects by plated through-hole usually.Rigid-flexible can connect circuit between Different Plane in conjunction with printed circuit board (PCB), can fold, crooked, crispatura, also can movable part connecting spare, realize three dimensional wiring, thereby solved the restricted problem of script in many encapsulation, improved Connection Density and reliability.In order to realize the metallization of hole wall, the method for main employing in the field of business at present " black hole " realizes.
" black hole " method is by adopting hole blackening solution dipping printed circuit board (PCB), the carbon particles that utilizes effect that positive and negative charge is inhaled mutually to make to have conducting function and the organism macromolecular material (materials such as polyimide film, epoxy resin binder, acrylic resin adhesive, epoxy glass fiber cloth) of hole wall are combined closely, for follow-up electro-coppering provides one deck reliable electroconductibility medium.But the performance of hole blackening solution still has deficiency at present, for example adopts formaldehyde to make reductive agent, because the toxicity of formaldehyde is larger, not only endangers ecotope, and carcinogenic danger is arranged.The less stable of hole blackening solution operates the careless slightly solution that will occur and decomposes.Black hole metallization processes long flow path, operation and maintenance is extremely inconvenient, and quality control is more difficult and working cost is high.
Summary of the invention
Purpose of the present invention just is to overcome the deficiencies in the prior art, a kind of hole blackening solution that can be used for printed circuit board (PCB) is provided, utilize this hole blackening solution to carry out plated through-hole, not only security is greatly improved, and can effectively control the quantity discharged of waste water, simplify production technique, reduced the production cost of printed board.
The hole blackening solution that the present invention proposes is comprised of the raw material of following ratio: the carbon dust of 2-4%, the Na of 0.5-1% by weight percentage
2SiO
3, 3-4% NH
4The negatively charged ion non-ionic composite tensio-active agent of the anion surfactant of OH, 0.5-2%, the nonionogenic tenside of 0.5-1%, 0.5-1.5% and the water of 88-93%.
Wherein, anion surfactant is: one or more in sodium lauryl sulphate, Sodium dodecylbenzene sulfonate, polyoxyethylenated alcohol sodium sulfate, alkyl polyoxyethylene ether sodium sulfate;
Nonionogenic tenside is: polysorbate, fatty alcohol-polyoxyethylene ether.Fatty Alcohol(C12-C14 and C12-C18) in described fatty alcohol-polyoxyethylene ether is: carbonatoms is the Fatty Alcohol(C12-C14 and C12-C18) of 10-20.
Negatively charged ion non-ionic composite tensio-active agent contains at least two functional groups, described functional group is selected from one or more in hydroxyl (OH), carboxyl (COOH), carbon-carbon double bond (C=C), epoxide group, itrile group (CN), sulfonic group, for example: polyoxyethylene ether sulfate, Soxylat A 25-7 soap.
Embodiment:
Below by embodiment, the hole blackening solution that the present invention proposes is elaborated.
Embodiment 1
Consisting of of the hole blackening solution that the present invention proposes: carbon dust, Na
2SiO
3, NH
4OH, anion surfactant, nonionogenic tenside, negatively charged ion non-ionic composite tensio-active agent and water.
Wherein, according to weight percent meter, the content that forms the each component of above-mentioned hole blackening solution is: carbon dust: 2-4%, Na
2SiO
3: 0.5-1%, NH
4OH:3-4%, anion surfactant: 0.5-2%, nonionogenic tenside: 0.5-1%, negatively charged ion non-ionic composite tensio-active agent: 0.5-1.5%, and water: 88-93%.
Wherein, anion surfactant is: one or more in sodium lauryl sulphate, Sodium dodecylbenzene sulfonate, polyoxyethylenated alcohol sodium sulfate, alkyl polyoxyethylene ether sodium sulfate;
Nonionogenic tenside is: polysorbate, fatty alcohol-polyoxyethylene ether.Fatty Alcohol(C12-C14 and C12-C18) in described fatty alcohol-polyoxyethylene ether is: carbonatoms is the Fatty Alcohol(C12-C14 and C12-C18) of 10-20.
Negatively charged ion non-ionic composite tensio-active agent contains at least two functional groups, described functional group is selected from one or more in hydroxyl (OH), carboxyl (COOH), carbon-carbon double bond (C=C), epoxide group, itrile group (CN), sulfonic group, for example: polyoxyethylene ether sulfate, Soxylat A 25-7 soap.
Embodiment 2
The below lists the preferred embodiment of the hole blackening solution composition of the present invention's proposition,
According to weight percent meter, the content that forms the each component of above-mentioned hole blackening solution is: carbon dust: 3%, Na
2SiO
3: 0.8%, NH
4OH:3.5%, anion surfactant: 1%, nonionogenic tenside: 0.8%, negatively charged ion non-ionic composite tensio-active agent: 1%, and water: 89.9%.
Wherein, anion surfactant is: sodium lauryl sulphate;
Nonionogenic tenside is: polysorbate.
Negatively charged ion non-ionic composite tensio-active agent is polyoxyethylene ether sulfate or Soxylat A 25-7 soap.
Above embodiment is described in detail the present invention, but above-mentioned embodiment is not in order to limit scope of the present invention, and protection scope of the present invention is defined by the appended claims.
Claims (3)
1. a use in printed circuit board hole blackening solution, is characterized in that, described hole blackening solution is comprised of following raw materials according: carbon dust, Na
2SiO
3, NH
4OH, anion surfactant, nonionogenic tenside, negatively charged ion non-ionic composite tensio-active agent and water.
2. use in printed circuit board hole blackening solution as claimed in claim 1 is characterized in that:
Wherein, according to weight percent meter, the content that forms each raw material of above-mentioned hole blackening solution is: carbon dust: 2-4%, Na
2SiO
3: 0.5-1%, NH
4OH:3-4%, anion surfactant: 0.5-2%, nonionogenic tenside: 0.5-1%, negatively charged ion non-ionic composite tensio-active agent: 0.5-1.5%, and water: 88-93%.
3. use in printed circuit board hole blackening solution as claimed in claim 1 is characterized in that:
Wherein, described anion surfactant is: one or more in sodium lauryl sulphate, Sodium dodecylbenzene sulfonate, polyoxyethylenated alcohol sodium sulfate, alkyl polyoxyethylene ether sodium sulfate;
Described nonionogenic tenside is: polysorbate, fatty alcohol-polyoxyethylene ether.Fatty Alcohol(C12-C14 and C12-C18) in described fatty alcohol-polyoxyethylene ether is: carbonatoms is the Fatty Alcohol(C12-C14 and C12-C18) of 10-20.
Described negatively charged ion non-ionic composite tensio-active agent contains at least two functional groups, described functional group is selected from one or more in hydroxyl (OH), carboxyl (COOH), carbon-carbon double bond (C=C), epoxide group, itrile group (CN), sulfonic group, for example: polyoxyethylene ether sulfate, Soxylat A 25-7 soap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100673651A CN103173824A (en) | 2013-03-01 | 2013-03-01 | Black hole solution for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100673651A CN103173824A (en) | 2013-03-01 | 2013-03-01 | Black hole solution for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103173824A true CN103173824A (en) | 2013-06-26 |
Family
ID=48633997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013100673651A Pending CN103173824A (en) | 2013-03-01 | 2013-03-01 | Black hole solution for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103173824A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104499021A (en) * | 2014-12-29 | 2015-04-08 | 广东光华科技股份有限公司 | Printed circuit board and electrocoppering process thereof |
| CN105063681A (en) * | 2015-08-28 | 2015-11-18 | 韶关硕成化工有限公司 | High-concentration carbon hole solution for PCB and preparation method thereof |
| CN105132962A (en) * | 2015-08-28 | 2015-12-09 | 韶关硕成化工有限公司 | High-concentration carbon pore solution applied to PCB boards and preparation method thereof |
| CN105177661A (en) * | 2015-08-28 | 2015-12-23 | 韶关硕成化工有限公司 | High-concentration carbon pore solution for PCB and preparation method of high-concentration carbon pore solution |
| CN107740145A (en) * | 2017-10-16 | 2018-02-27 | 广州市天承化工有限公司 | A kind of highly conductive carbon pores liquid of pcb board and its preparation method and application |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1733980A (en) * | 2004-08-02 | 2006-02-15 | 吕桂生 | Electricity conductive liquid capable of directly galvanizing the printed board |
| CN101113388A (en) * | 2006-07-28 | 2008-01-30 | 比亚迪股份有限公司 | Black-hole carbon powder cleaning agent composition and cleaning method thereof |
| CN101638802A (en) * | 2008-07-28 | 2010-02-03 | 比亚迪股份有限公司 | Pre-plating correction liquid and pre-plating treatment method for circuit board |
-
2013
- 2013-03-01 CN CN2013100673651A patent/CN103173824A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1733980A (en) * | 2004-08-02 | 2006-02-15 | 吕桂生 | Electricity conductive liquid capable of directly galvanizing the printed board |
| CN101113388A (en) * | 2006-07-28 | 2008-01-30 | 比亚迪股份有限公司 | Black-hole carbon powder cleaning agent composition and cleaning method thereof |
| CN101638802A (en) * | 2008-07-28 | 2010-02-03 | 比亚迪股份有限公司 | Pre-plating correction liquid and pre-plating treatment method for circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 王丽丽等: "印制板直接电镀工艺", 《电镀与精饰》, vol. 20, no. 6, 15 November 1998 (1998-11-15) * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104499021A (en) * | 2014-12-29 | 2015-04-08 | 广东光华科技股份有限公司 | Printed circuit board and electrocoppering process thereof |
| CN105063681A (en) * | 2015-08-28 | 2015-11-18 | 韶关硕成化工有限公司 | High-concentration carbon hole solution for PCB and preparation method thereof |
| CN105132962A (en) * | 2015-08-28 | 2015-12-09 | 韶关硕成化工有限公司 | High-concentration carbon pore solution applied to PCB boards and preparation method thereof |
| CN105177661A (en) * | 2015-08-28 | 2015-12-23 | 韶关硕成化工有限公司 | High-concentration carbon pore solution for PCB and preparation method of high-concentration carbon pore solution |
| CN107740145A (en) * | 2017-10-16 | 2018-02-27 | 广州市天承化工有限公司 | A kind of highly conductive carbon pores liquid of pcb board and its preparation method and application |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130626 |