CN103167747A - Manufacturing method of printed circuit board - Google Patents
Manufacturing method of printed circuit board Download PDFInfo
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- CN103167747A CN103167747A CN2013100670155A CN201310067015A CN103167747A CN 103167747 A CN103167747 A CN 103167747A CN 2013100670155 A CN2013100670155 A CN 2013100670155A CN 201310067015 A CN201310067015 A CN 201310067015A CN 103167747 A CN103167747 A CN 103167747A
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- circuit board
- printed circuit
- pcb
- hole
- black
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Abstract
The invention discloses a manufacturing method of a printed circuit board. The method comprises the following steps: (1) providing the printed circuit board and drilling the printed circuit board to obtain a through hole; (2) cleaning the printed circuit board by deionized water to remove impurities in the through hole; (3) drying the cleaned printed circuit board by using warm air of 50 DEG C to remove residual water on the printed circuit board, and further removing impurity particles on the printed circuit board; (4) enabling the dried printed circuit board to be steeped in black hole solution to make a black hole board; (5) drying the black hole board to enable the black hole solution coated on the surface of the printed circuit board to form a black film; (6) removing the black film on the surface of the printed circuit board; and (7) using an electroplating method to conduct electrocoppering to the printed circuit board after the step (6), and therefore forming an electroplating covering film in the through hole.
Description
Technical field
The invention belongs to field of printed circuit board fabrication, relate in particular to a kind of preparation method of printed circuit board (PCB).
Background technology
Flexible printed circuit board is made of film, has the significant superiority such as flexible structure, volume are little, lightweight, not only can static deflection, can also do dynamic deflection, curling and folding.Along with the continuous fast development of printed circuit board (PCB) (PCB) process technology, rigid-flexible provides a kind of new solution in conjunction with the interconnection problems that solves between the electronic functionalities module that appears as of printed circuit board (PCB).The printed circuit board (PCB) that rigid-flexible refers to utilize flexible parent metal and makes in zones of different and rigid substrate interconnection in conjunction with printed circuit board (PCB).In hard and soft land, the conductive pattern on flexible parent metal and rigid substrate interconnects by plated-through hole usually.Rigid-flexible can connect circuit between Different Plane in conjunction with printed circuit board (PCB), can fold, crooked, crispatura, also can movable part connecting spare, realize three dimensional wiring, thereby solved the restricted problem of script in many encapsulation, improved Connection Density and reliability.In order to realize the metallization of hole wall, the method for main employing in the field of business at present " black hole " realizes.
" black hole " method is by adopting hole blackening solution dipping printed circuit board (PCB), the carbon particle that utilizes effect that positive and negative charge is inhaled mutually to make to have conducting function and the organic substance macromolecular material (materials such as polyimide film, epobond epoxyn, acrylic resin adhesive, epoxy glass fiber cloth) of hole wall are combined closely, for follow-up electro-coppering provides one deck reliable conductivity medium.But the performance of hole blackening solution still has deficiency at present, for example adopts formaldehyde to make reducing agent, because the toxicity of formaldehyde is larger, not only endangers biological environment, and carcinogenic danger is arranged.The less stable of hole blackening solution operates the careless slightly solution that will occur and decomposes.Black hole metallization processes long flow path, operation and maintenance is extremely inconvenient, and quality control is more difficult and operating cost is high.
Summary of the invention
Purpose of the present invention just is to overcome the deficiencies in the prior art, a kind of method that adopts hole blackening solution to make printed circuit board (PCB) is provided, utilize the method, not only fail safe is greatly improved, and can effectively control the discharge capacity of waste water, simplify production technology, reduced the production cost of printed circuit board (PCB).
The method that the employing hole blackening solution that the present invention proposes is made printed circuit board (PCB) comprises the steps:
(1) provide printed circuit board (PCB), this printed circuit board (PCB) is holed to obtain through hole, wherein printed wiring board is copper clad laminate.
(2) adopt deionized water that above-mentioned printed circuit board (PCB) is cleaned, to remove the impurity in described through hole.
(3) adopt temperature to be that the warm braw of 50 degrees centigrade carries out the printed circuit board (PCB) after cleaning air-dry, removing water remaining on printed circuit board (PCB), and further remove the impurity particle on printed circuit board (PCB);
(4) printed circuit board (PCB) after air-dry is impregnated into hole blackening solution, to make black hole plate;
(5) black hole plate is carried out drying and process, thereby make the hole blackening solution that is coated in printed circuit board surface form black thin film
(6) black thin film of printed circuit board surface is removed;
(7) adopt electric plating method to carry out electro-coppering to step (6) printed circuit board (PCB) afterwards and process, thereby form the electro-coppering coating in described through hole.
Wherein, described hole blackening solution is comprised of the raw material of following ratio: the carbon dust of 2-4%, the Na of 0.5-1% by weight percentage
2SiO
3, 3-4% NH
4The anion non-ionic composite surfactant of the anion surfactant of OH, 0.5-2%, the non-ionic surface active agent of 0.5-1%, 0.5-1.5% and the water of 88-93%.
Wherein, anion surfactant is: one or more in lauryl sodium sulfate, neopelex, sodium sulfate of polyethenoxy ether of fatty alcohol, alkyl polyoxyethylene ether sodium sulphate;
Non-ionic surface active agent is: polysorbate, AEO.Fatty alcohol in described AEO is: carbon number is the fatty alcohol of 10-20.
Anion non-ionic composite surfactant contains at least two functional groups, described functional group is selected from one or more in hydroxyl (OH), carboxyl (COOH), carbon-carbon double bond (C=C), epoxide group, itrile group (CN), sulfonic group, for example: polyoxyethylene ether sulfate, APEO soap.
Embodiment:
Preparation method to the printed circuit board (PCB) of the present invention's proposition is elaborated below by embodiment.
Embodiment 1
The method that the employing hole blackening solution that the present invention proposes is made printed circuit board (PCB) comprises the steps:
(1) provide printed circuit board (PCB), this printed circuit board (PCB) is holed to obtain through hole; Wherein printed wiring board is copper clad laminate.
(2) adopt deionized water that above-mentioned printed circuit board (PCB) is cleaned, to remove the impurity in described through hole.
(3) adopt temperature to be that the warm braw of 50 degrees centigrade carries out the printed circuit board (PCB) after cleaning air-dry, removing water remaining on printed circuit board (PCB), and further remove the impurity particle on printed circuit board (PCB);
(4) printed circuit board (PCB) after air-dry is impregnated into hole blackening solution, to make black hole plate;
(5) black hole plate is carried out drying and process, thereby make the hole blackening solution that is coated in printed circuit board surface form black thin film
(6) black thin film of printed circuit board surface is removed;
(7) adopt electric plating method to carry out electro-coppering to step (6) printed circuit board (PCB) afterwards and process, thereby form the electro-coppering coating in described through hole.
Wherein, described hole blackening solution is comprised of the raw material of following ratio: the carbon dust of 2-4%, the Na of 0.5-1% by weight percentage
2SiO
3, 3-4% NH
4The anion non-ionic composite surfactant of the anion surfactant of OH, 0.5-2%, the non-ionic surface active agent of 0.5-1%, 0.5-1.5% and the water of 88-93%.
Wherein, anion surfactant is: one or more in lauryl sodium sulfate, neopelex, sodium sulfate of polyethenoxy ether of fatty alcohol, alkyl polyoxyethylene ether sodium sulphate;
Non-ionic surface active agent is: polysorbate, AEO.Fatty alcohol in described AEO is: carbon number is the fatty alcohol of 10-20.
Anion non-ionic composite surfactant contains at least two functional groups, described functional group is selected from one or more in hydroxyl (OH), carboxyl (COOH), carbon-carbon double bond (C=C), epoxide group, itrile group (CN), sulfonic group, for example: polyoxyethylene ether sulfate, APEO soap.
Embodiment 2
The below introduces the printed circuit board (PCB) preparation method's of the present invention's proposition preferred embodiment,
The method that the employing hole blackening solution that the present invention proposes is made printed circuit board (PCB) comprises the steps:
(1) provide printed circuit board (PCB), this printed circuit board (PCB) is holed to obtain through hole; Wherein printed wiring board is copper clad laminate.
(2) adopt deionized water that above-mentioned printed circuit board (PCB) is cleaned, to remove the impurity in described through hole.
(3) adopt temperature to be that the warm braw of 50 degrees centigrade carries out the printed circuit board (PCB) after cleaning air-dry, removing water remaining on printed circuit board (PCB), and further remove the impurity particle on printed circuit board (PCB);
(4) printed circuit board (PCB) after air-dry is impregnated into hole blackening solution, to make black hole plate;
(5) black hole plate is carried out drying and process, thereby make the hole blackening solution that is coated in printed circuit board surface form black thin film
(6) black thin film of printed circuit board surface is removed;
(7) adopt electric plating method to carry out electro-coppering to step (6) printed circuit board (PCB) afterwards and process, thereby form the electro-coppering coating in described through hole.
Wherein, according to weight percent meter, the content of the each component of hole blackening solution of the present invention is: carbon dust: 3%, Na
2SiO
3: 0.8%, NH
4OH:3.5%, anion surfactant: 1%, non-ionic surface active agent: 0.8%, anion non-ionic composite surfactant: 1%, and water: 89.9%.
Wherein, anion surfactant is: lauryl sodium sulfate;
Non-ionic surface active agent is: polysorbate.
Anion non-ionic composite surfactant is polyoxyethylene ether sulfate or APEO soap.
Above execution mode is described in detail the present invention, but above-mentioned execution mode is not in order to limit scope of the present invention, and protection scope of the present invention is defined by the appended claims.
Claims (3)
1. the preparation method of a printed circuit board (PCB), is characterized in that, comprises the steps:
(1) provide printed circuit board (PCB), this printed circuit board (PCB) is holed to obtain through hole, wherein, printed wiring board is copper clad laminate;
(2) adopt deionized water that above-mentioned printed circuit board (PCB) is cleaned, to remove the impurity in described through hole;
(3) adopt temperature to be that the warm braw of 50 degrees centigrade carries out the printed circuit board (PCB) after cleaning air-dry, removing water remaining on printed circuit board (PCB), and further remove the impurity particle on printed circuit board (PCB);
(4) printed circuit board (PCB) after air-dry is impregnated into hole blackening solution, to make black hole plate;
(5) black hole plate is carried out drying and process, thereby make the hole blackening solution that is coated in printed circuit board surface form black thin film;
(6) black thin film of printed circuit board surface is removed;
(7) adopt electric plating method to carry out electro-coppering to step (6) printed circuit board (PCB) afterwards and process, thereby form the electro-coppering coating in described through hole.
2. the preparation method of printed circuit board (PCB) as claimed in claim 1 is characterized in that:
Wherein, described hole blackening solution is comprised of the raw material of following ratio: the carbon dust of 2-4%, the Na of 0.5-1% by weight percentage
2SiO
3, 3-4% NH
4The anion non-ionic composite surfactant of the anion surfactant of OH, 0.5-2%, the non-ionic surface active agent of 0.5-1%, 0.5-1.5% and the water of 88-93%.
3. the preparation method of printed circuit board (PCB) as claimed in claim 1 is characterized in that:
Wherein, described anion surfactant is: one or more in lauryl sodium sulfate, neopelex, sodium sulfate of polyethenoxy ether of fatty alcohol, alkyl polyoxyethylene ether sodium sulphate;
Described non-ionic surface active agent is: polysorbate, AEO.Fatty alcohol in described AEO is: carbon number is the fatty alcohol of 10-20.
Described anion non-ionic composite surfactant contains at least two functional groups, described functional group is selected from one or more in hydroxyl (OH), carboxyl (COOH), carbon-carbon double bond (C=C), epoxide group, itrile group (CN), sulfonic group, for example: polyoxyethylene ether sulfate, APEO soap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310067015.5A CN103167747B (en) | 2013-03-01 | 2013-03-01 | A kind of preparation method of printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310067015.5A CN103167747B (en) | 2013-03-01 | 2013-03-01 | A kind of preparation method of printed circuit board (PCB) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103167747A true CN103167747A (en) | 2013-06-19 |
| CN103167747B CN103167747B (en) | 2016-01-06 |
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| CN201310067015.5A Active CN103167747B (en) | 2013-03-01 | 2013-03-01 | A kind of preparation method of printed circuit board (PCB) |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104302124A (en) * | 2014-08-27 | 2015-01-21 | 无锡长辉机电科技有限公司 | Manufacturing technology of double-faced flexibility printed board |
| CN104388996A (en) * | 2014-10-30 | 2015-03-04 | 苏州禾川化学技术服务有限公司 | Black hole liquid and preparation method thereof |
| CN106231815A (en) * | 2016-08-22 | 2016-12-14 | 台山市精诚达电路有限公司 | A kind of HDI soft or hard plate hole metallization processes |
| CN109152239A (en) * | 2017-06-28 | 2019-01-04 | 聂菲菲 | A kind of preparation method of printed circuit board hole blackening solution |
| CN110300495A (en) * | 2018-03-23 | 2019-10-01 | 睿明科技股份有限公司 | Substrate film coating method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4622108A (en) * | 1986-05-05 | 1986-11-11 | Olin Hunt Specialty Products, Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
| CN1733980A (en) * | 2004-08-02 | 2006-02-15 | 吕桂生 | Electricity conductive liquid capable of directly galvanizing the printed board |
| CN101113388A (en) * | 2006-07-28 | 2008-01-30 | 比亚迪股份有限公司 | Black-hole carbon powder cleaning agent composition and cleaning method thereof |
| CN101394712A (en) * | 2007-09-21 | 2009-03-25 | 清华大学 | Hole blackening solution and preparation thereof |
-
2013
- 2013-03-01 CN CN201310067015.5A patent/CN103167747B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4622108A (en) * | 1986-05-05 | 1986-11-11 | Olin Hunt Specialty Products, Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
| CN1733980A (en) * | 2004-08-02 | 2006-02-15 | 吕桂生 | Electricity conductive liquid capable of directly galvanizing the printed board |
| CN101113388A (en) * | 2006-07-28 | 2008-01-30 | 比亚迪股份有限公司 | Black-hole carbon powder cleaning agent composition and cleaning method thereof |
| CN101394712A (en) * | 2007-09-21 | 2009-03-25 | 清华大学 | Hole blackening solution and preparation thereof |
Non-Patent Citations (1)
| Title |
|---|
| 王丽丽: "印制板直接电镀工艺", 《电镀与精饰》, vol. 20, no. 6, 15 November 1998 (1998-11-15), pages 10 - 12 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104302124A (en) * | 2014-08-27 | 2015-01-21 | 无锡长辉机电科技有限公司 | Manufacturing technology of double-faced flexibility printed board |
| CN104388996A (en) * | 2014-10-30 | 2015-03-04 | 苏州禾川化学技术服务有限公司 | Black hole liquid and preparation method thereof |
| CN106231815A (en) * | 2016-08-22 | 2016-12-14 | 台山市精诚达电路有限公司 | A kind of HDI soft or hard plate hole metallization processes |
| CN109152239A (en) * | 2017-06-28 | 2019-01-04 | 聂菲菲 | A kind of preparation method of printed circuit board hole blackening solution |
| CN110300495A (en) * | 2018-03-23 | 2019-10-01 | 睿明科技股份有限公司 | Substrate film coating method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103167747B (en) | 2016-01-06 |
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