CN106852026A

CN106852026A - Suitable for the black holes production technology of HDI products

Info

Publication number: CN106852026A
Application number: CN201611071727.4A
Authority: CN
Inventors: 宋建远; 谢萍萍; 王淑怡; 张盼盼
Original assignee: Shenzhen Suntak Multilayer PCB Co Ltd
Current assignee: Shenzhen Suntak Multilayer PCB Co Ltd
Priority date: 2016-11-29
Filing date: 2016-11-29
Publication date: 2017-06-13

Abstract

The invention provides a kind of black holes production technology suitable for HDI products, the heavy process for copper of substitution traditional chemical.The beneficial effects of the present invention are：Conductive particle is adsorbed in by hole wall according to the attracting principle of different electricity, conductive particle layer is formed, then unnecessary conductive particle layer is removed by microetch, be easy to follow-up electroplating technology, simplify production procedure, reduce production cost.

Description

Suitable for the black holes production technology of HDI products

Technical field

The present invention relates to wiring board manufacture field, a kind of black holes production technology suitable for HDI products is referred in particular to.

Background technology

HDI is that the English of High Density Interconnector is write a Chinese character in simplified form, and high density interconnection (HDI) manufacture is printing A field with fastest developing speed in circuit-board industry, wherein, the hole metallization technology of HDI wiring boards is wiring board manufacturing technology One of key, the plate hole metallization production procedure of current HDI wiring boards uses traditional electroless copper plating technique, but electroless copper plating to adopt In redox solution containing harm ecological environment various chemical substances, such as EDTA, NTA, EDTP and easily it is carcinogenic Formaldehyde, wastewater treatment is complicated, high cost；In addition, electroless copper plating use redox solution less stable, solution point Analysis, maintenance are complicated；Meanwhile, the mechanical performance of the layers of copper that electroless copper plating is plated is poor, and technological process is cumbersome, accordingly, it would be desirable to A kind of novel process of the heavy copper of energy substituted chemistry.

The content of the invention

The technical problems to be solved by the invention are：Electroless copper plating work is substituted using the more simple black holes technique of flow Skill, reduces the production cost of HDI products.

In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention is：A kind of black holes life suitable for HDI products Production. art, comprises the following steps successively：

S1, oil removal treatment is carried out to the through hole of wiring board using oil removing liquid medicine, the hole wall of wiring board is formed positively charged membrane；

S2, wiring board is immersed in conductive particle suspension, by conductive particle by the hole wall of physical action assist side Form conductive particle layer；

S3, by wiring board hole wall and copper face conductive particle layer drying, make conductive particle layer solidification；

S4, unnecessary on wiring board conductive particle layer is removed by microetch treatment.

Further, treatment conductive particle suspension is also included between step S1 and S2, makes conductive particle electronegative ion.

Further, wiring board time of repose in oil removing liquid medicine is 30-60s in step S1.

Further, wiring board time of repose in conductive particle suspension is 4-6mi n in step S2.

Further, the drying time of wiring board is controlled in 15-60min in step S3.

Further, the drying temperature of wiring board is controlled at 135-175 DEG C in step S3.

Further, the thickness in step S4 to PCB surface layers of copper microetch is 0.2-0.5 microns.

Further, also include successively before step S1 into plate, bulk, recovery washing, washing, removing glue, recovery washing, water The step of washing, neutralize, washing, checking.

Further, the step of also including washing, anti-oxidant, washing, drying, ejecting plate successively after step S4.

The beneficial effects of the present invention are：Conductive particle is adsorbed in by hole wall according to the attracting principle of different electricity, forms conductive Stratum granulosum, then unnecessary conductive particle layer is removed by microetch, subsequent technique is convenient for, production procedure is simplified, reduce Production cost.

Brief description of the drawings

Concrete technology flow process of the invention is described in detail in detail below in conjunction with the accompanying drawings：

Fig. 1 is schematic flow sheet of the invention；

Fig. 2 is the schematic diagram of formation positively charged membrane in oil removing process of the invention；

Fig. 3 is the schematic diagram of formation conductive particle layer in black holes chemical industry skill of the invention；

Fig. 4 is that the schematic diagram after Excess conductive stratum granulosum is removed in microetch technique of the invention；

1- layers of copper；2- glass fibres or resin；3- positively charged membranes；4- conductive particles layer.

Specific embodiment

To describe technology contents of the invention, structural feature, the objects and the effects in detail, below in conjunction with implementation method And coordinate accompanying drawing to be explained in detail.

Fig. 1 to Fig. 3 is referred to, a kind of black holes production technology suitable for HDI products is comprised the following steps successively：

Knowable to foregoing description, the beneficial effects of the present invention are：Conductive particle is adsorbed according to the principle that different electricity is attracting In hole wall, conductive particle layer is formed, then unnecessary conductive particle layer is removed by microetch, be convenient for subsequent technique, simplified Production procedure, reduces production cost.

Implement example

Copper face, wetting hole wall are cleaned without chelating using in weakly alkaline, because the solution carries carbonium, therefore meeting Adsorb on the hole wall of assist side, make hole wall be in electropositive.

Wiring board is immersed in weakly alkaline conductive particle suspension again, the suspension liquid with conductive particle as matrix, led to The attracting physical characteristic of different electricity is crossed by the hole wall of conductive particle attachment assist side, it is preferred that conductive particle is carbon particle, its The middle a diameter of 80-300nm of carbon particle.

Wiring board is carried out into drying and processing, is that, in order to prevent in hole, the moisture content especially inside aperture or deep hole is not complete When drying, the conductive particle layer follow-up microetch stage of formation is washed out by hydro-peening.

Fig. 4 is referred to, due to monoblock wiring board is immersed in conducting solution, conductive particle is not only deposited on hole wall, also Board substrate copper surface and internal layer copper ring side can be deposited on, therefore in order to increase between base material copper or hole wall copper and electro-coppering Adhesion, it is clean that unnecessary conductive particle has to removal.

By way of losing copper, erosion copper liquid medicine can pass through the gap of conductive layer to reach copper face, by conductive layer from inside to outside Peel off, the glass fibre of board substrate and the conductive layer of resin surface are finally obtained because bottom remains without copper Required circuit boards half-finished product.

Embodiment 1

Also include treatment conductive particle suspension between step S1 and S2, make conductive particle electronegative ion.

Conductive particle is switched into elecrtonegativity, conductive particle can be made to be easier to be attached to wiring board in electropositive hole wall On.

Embodiment 2

Wiring board time of repose in liquid medicine is 30-60s in step S1.

Wiring board stands 30-60s in liquid medicine, is to ensure that the hole wall of wiring board forms enough positively charged membranes.

Embodiment 3

Wiring board time of repose in conducting solution is 4-6min in step S2.

Wiring board time of repose in conducting solution is 4-6min, is to ensure the deposition foot of the conductive particle on wiring board Enough form conductive layer.

Embodiment 4

The drying time of wiring board is controlled in 15-60min in step S3.

To adapt to the wiring board of different-thickness, corresponding drying time is set.

Embodiment 5

The drying temperature of wiring board is controlled at 135-175 DEG C in step S3.

To adapt to the wiring board of different-thickness, corresponding drying temperature is set.

Embodiment 6

Thickness in step S4 to PCB surface layers of copper microetch is 0.2-0.5 microns.

Thickness to PCB surface layers of copper microetch is 0.2-0.5 microns, you can ensured unnecessary conductive layer from layers of copper Peel off.

Embodiment 7

Also include successively before step S1 into plate, it is bulk, reclaim washing, washing, removing glue, reclaim washing, wash, neutralization, The step of washing, inspection.

With this technological process process circuit plate, can guarantee that production efficiency is maximized.

Embodiment 8

The step of also including washing, anti-oxidant, washing, drying, ejecting plate successively after step S4.

Embodiments of the invention are the foregoing is only, the scope of the claims of the invention is not thereby limited, it is every to utilize this hair Equivalent structure or equivalent flow conversion that bright specification and accompanying drawing content are made, or directly or indirectly it is used in other related skills Art field, is included within the scope of the present invention.

Claims

1., suitable for the black holes production technology of HDI products, comprise the following steps successively：

S2, by wiring board immerse conductive particle suspension in, conductive particle is formed by the hole wall of physical action assist side Conductive particle layer；

2. as claimed in claim 1 suitable for the black holes production technology of HDI products, it is characterised in that：Between step S1 and S2 Also include treatment conductive particle suspension, make conductive particle electronegative ion.

3. as claimed in claim 1 suitable for the black holes production technology of HDI products, it is characterised in that：Wiring board in step S1 Time of repose is 30-60s in oil removing liquid medicine.

4. as claimed in claim 1 suitable for the black holes production technology of HDI products, it is characterised in that：Wiring board in step S2 Time of repose is 4-6min in conductive particle suspension.

5. as claimed in claim 1 suitable for the black holes production technology of HDI products, it is characterised in that：Wiring board in step S3 Drying time control in 15-60min.

6. as claimed in claim 5 suitable for the black holes production technology of HDI products, it is characterised in that：Wiring board in step S3 Drying temperature control at 135-175 DEG C.

7. as claimed in claim 1 suitable for the black holes production technology of HDI products, it is characterised in that：To circuit in step S4 The thickness of plate surface layers of copper microetch is 0.2-0.5 microns.

8. as claimed in claim 1 suitable for the black holes production technology of HDI products, it is characterised in that：Before step S1 also according to It is secondary including enter plate, it is bulk, reclaim washing, washing, removing glue, reclaim washing, washing, neutralize, wash, inspection the step of.

9. as claimed in claim 1 suitable for the black holes production technology of HDI products, it is characterised in that：After step S4 also according to It is secondary including washing, it is anti-oxidant, washing, drying, ejecting plate the step of.