CN101453837B - Hole electricity conduction method for printed circuit board - Google Patents
Hole electricity conduction method for printed circuit board Download PDFInfo
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- CN101453837B CN101453837B CN2007101965280A CN200710196528A CN101453837B CN 101453837 B CN101453837 B CN 101453837B CN 2007101965280 A CN2007101965280 A CN 2007101965280A CN 200710196528 A CN200710196528 A CN 200710196528A CN 101453837 B CN101453837 B CN 101453837B
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Abstract
The invention discloses a method for hole conduction of a printed circuit board. The method comprises: firstly, putting a laminated printed circuit board into black hole liquor and carrying out first black hole treatment; air drying the laminated printed circuit board which is subjected to the first black hole treatment and carrying out second black hole treatment; and air drying the laminated printed circuit board which is subjected to the second black hole treatment, wherein in the process of carrying out the second black hole treatment, the laminated printed circuit board is reversed relative to the first black hole treatment. The method for the hole conduction of the printed circuit board performs two times of black hole treatments on the laminated printed circuit board, and the laminated printed circuit board is reversed and put into the black hole liquid in the process of the second black hole treatment so as to make carbon in the black hole liquid more even and densely adhered to the hole wall of the pylomes, thereby ensuring electric conductivity of pylomes on the printed circuit board with more layers, and realizing reliable connection of circuits between any two layers of the printed circuit board.
Description
Technical field
The present invention relates to field of printed circuit board fabrication, more particularly, relate to the electricity conduction method of the through hole in a kind of printed circuit board (PCB).
Background technology
Hole electricity conduction is one of process procedure of most critical in the course of manufacturing printed circuit board.For a long time, the electroless copper plating technology is to realize the mainstream technology of hole electricity conduction (hole metallization), and what it adopted is a kind of autocatalysis redox reaction.Though this technology has been prolonged with for many years and update, but still exists the defective that is difficult to overcome, incomplete as conductionization, contaminated environment, complex process, cost is high.
A kind of hole electricity conduction of plating non-chemically technology that is used to make printed circuit board (PCB) is disclosed among the CN1063395A, and a kind of black hole method is wherein specifically disclosed, promptly, laminated printed circuit boards contains in the blank hole liquid of graphite or carbon black by being immersed, and graphite or carbon black in the blank hole liquid are coated on the hole wall of the through hole on the laminated printed circuit boards, so that through hole conducts, realize between each layer printed circuit board that circuit connects thereby make.Also disclose a kind of printed circuit board (PCB) hole electricity conduction method that adopts black hole method among the CN1733980A, wherein mentioned for special base material and can adopt twice black hole to handle.
But the defective of said method is, is only applicable to the less printed circuit board (PCB) of the number of plies, for the more for example printed circuit board (PCB) more than six layers of the number of plies, causes the electric open close of through hole easily, thereby influences the conducting property of through hole.
Summary of the invention
The objective of the invention is to cause easily the electric open close defective of through hole, a kind of printed circuit board (PCB) hole electricity conduction method that can fully guarantee the conducting property of through hole is provided at existing hole electricity conduction method.
Printed circuit board (PCB) hole electricity conduction method provided by the invention comprises: at first laminated printed circuit boards is put into blank hole liquid and carried out the black hole processing first time, this laminated printed circuit boards of handling through for the first time black hole is air-dry, carry out the black hole processing second time then, and will be somebody's turn to do through the laminated printed circuit boards of for the second time black hole processing air-dry, wherein, in carrying out the process of handling in for the second time black hole, it is the top and bottom upsets that described laminated printed circuit boards is handled with respect to for the first time black hole.
The advantage of printed circuit board (PCB) hole electricity conduction method provided by the invention is, handle by laminated printed circuit boards being carried out twice black hole, and when carrying out deceiving the hole processing second time, the upset of laminated printed circuit boards top and bottom is put into, can make carbon in the blank hole liquid more evenly and densely on the hole wall attached to through hole, therefore can fully guarantee printed circuit board (PCB), particularly the conducting property of the through hole on the more for example printed circuit board (PCB) more than six layers of the number of plies realizes between each layer printed circuit board that reliable circuit connects thereby make.
Embodiment
Below, printed circuit board (PCB) hole electricity conduction method provided by the invention is elaborated.
The hole electricity conduction method of printed circuit board (PCB) provided by the invention comprises: at first laminated printed circuit boards is put into blank hole liquid and carried out the black hole processing first time, this laminated printed circuit boards of handling through for the first time black hole is air-dry, carry out the black hole processing second time then, and will be somebody's turn to do through the laminated printed circuit boards of for the second time black hole processing air-dry.
Wherein, black hole was handled and was deceived the condition of handling in the hole for the second time and is the described first time: under 25-35 ℃ temperature laminated printed circuit boards is put into blank hole liquid dipping 45-90 second, so that the carbon in the blank hole liquid is adsorbed on the hole wall of the through hole on the laminated printed circuit boards.Described blank hole liquid contains the carbon of 0.5-10 weight %, the potash of 0.2-5 weight % and the water (total amount with blank hole liquid is a benchmark) of 85-98 weight %.
And the most important thing is, in carrying out the process of handling in for the second time black hole, it is the top and bottom upsets that described laminated printed circuit boards is handled with respect to for the first time black hole, that is to say, is up carrying out for the first time black hole when down face is carrying out that for the second time black hole is handled when handling, and is down carrying out for the first time black hole when up face is carrying out that for the second time black hole is handled when handling.
Carry out the black hole processing second time by the upset of laminated printed circuit boards top and bottom being put into blank hole liquid, can make the carbon in the blank hole liquid more evenly and densely be adsorbed on the hole wall of the through hole on the laminated printed circuit boards, therefore can fully guarantee printed circuit board (PCB), particularly the conducting property of the through hole on the more for example printed circuit board (PCB) more than six layers of the number of plies realizes between each layer printed circuit board that reliable circuit connects thereby make.In addition, the described first time of black hole processing according to actual needs can be identical with condition with other processes of for the second time black hole processing, also can be different.
Finish after black hole handles, need be under 65-75 ℃ temperature that laminated printed circuit boards is air-dry, so that the carbon that is adsorbed on the hole wall of the through hole on the laminated printed circuit boards solidifies.
Under the preferable case, repeat once the described first time of black hole processing and/or for the second time black hole and handle.That is to say, the described first time of black hole can be handled and carry out twice continuously, afterwards will be air-dry through the laminated printed circuit boards of the twice described first time of black hole processing, and then it is the upset of laminated printed circuit boards top and bottom is carried out deceiving the second time hole handle, and the laminated printed circuit boards of handling is air-dry.Perhaps, can carry out the black hole processing first time to laminated printed circuit boards earlier, afterwards will be air-dry through the laminated printed circuit boards that once the described first time, handled in black hole, and then the laminated printed circuit boards top and bottom are overturn, and carry out twice for the second time black hole continuously and handle, afterwards that the laminated printed circuit boards of handling is air-dry.Perhaps, the described first time of black hole can also be handled and carry out twice continuously, afterwards will be air-dry through the laminated printed circuit boards of the twice described first time of black hole processing, and then the laminated printed circuit boards top and bottom are overturn, and carry out twice for the second time black hole continuously and handle, afterwards that the laminated printed circuit boards of handling is air-dry, promptly the described first time of black hole processing and for the second time black hole are handled and are all carried out twice continuously respectively, to reach more excellent effect.
Under the preferable case, before repeating the described first time of black hole processing and/or the processing of for the second time black hole, earlier laminated printed circuit boards is carried out the electric charge adjustment.That is to say, between twice that carries out the continuously described first time of black hole processing and/or the processing of for the second time black hole, increase electric charge respectively and adjust operation.Described electric charge is adjusted under 20-30 ℃ temperature laminated printed circuit boards is put into adjustment liquid dipping 20-50 second.Described adjustment liquid contains the monoethanolamine of 35-55 weight %, the acetamide of 2-20 weight % and the water (total amount with adjustment liquid is a benchmark) of 25-60 weight %.The purpose that increases described electric charge adjustment operation in the processing procedure of black hole is, can make the hole wall of through hole adsorb more carbon in follow-up dipping process.
Under the preferable case, the hole electricity conduction method of described printed circuit board (PCB) also is included in and carries out the described first time black hole and earlier laminated printed circuit boards is carried out decontamination before handling and handle, with the brill dirt on the hole wall of the face of removing laminated printed circuit boards and through hole, greasy dirt, sweat stain etc.The condition that described decontamination is handled can also be carried out supersonic oscillations under 45-55 ℃ temperature printed circuit board (PCB) being put into detergent dipping 20-50 second simultaneously as selecting.Described detergent can adopt various detergent well known in the art, as contains the monoethanolamine of 10-30 weight %, the acetamide of 10-25 weight % and the water (total amount with detergent is a benchmark) of 45-75 weight %.Preferably, after decontamination, laminated printed circuit boards is carried out suitable cleaning, as the water flushing, to remove the detergent that remains on the laminated printed circuit boards.
In the actual production, because black hole is handled and need all is immersed in whole laminated printed circuit boards in the blank hole liquid, therefore the carbon in the blank hole liquid will not only be adsorbed on the hole wall of the through hole on the laminated printed circuit boards, and can be adsorbed on inevitably on the face of laminated printed circuit boards.Thereby after finishing above-mentioned operation, finish promptly that twice black hole handled and air-dry after, can carry out microetch to laminated printed circuit boards and handle, promptly the carbon that will adsorb and be solidificated on the face of laminated printed circuit boards with micro-etching agent is removed, and only keeps the carbon on the hole wall of through hole.The condition that described microetch is handled is under 28-38 ℃ temperature, and printed circuit board (PCB) is put into micro-etching agent dipping 50-80 second.Described micro-etching agent can adopt various micro-etching agent well known in the art, and as dioxysulfate water, sodium persulfate aqueous solution etc., wherein said dioxysulfate water contains the sulfuric acid of 5.0-10.0 volume % and the hydrogen peroxide of 1.5-3.5 volume %.After finishing microetch, can suitably clean laminated printed circuit boards, as the water flushing, remove with the micro-etching agent that will remain on the laminated printed circuit boards.
Afterwards, can also carry out anti-oxidant treatment, be about to laminated printed circuit boards and put into antioxidant dipping 5-20 second, cover one deck oxidation-resistant film so that go up on its surface, thereby play the effect that prevents that laminated printed circuit boards is oxidized laminated printed circuit boards.Described antioxidant can adopt various antioxidant well known in the art, is the wet chemical of 1.0-2.0 weight %, the potassium hydroxide aqueous solution of 1.0-2.0 weight %, the glycol water of 30-40 weight % or the isopropanol water solution of 10-30 weight % as concentration.At last, the laminated printed circuit boards through anti-oxidant treatment is carried out dried, dry method can be the various drying means of routine, for example carries out air-dry under 65-75 ℃ temperature.
Describe the specific embodiment of the present invention in detail below by embodiment.
Embodiment 1:
Handle in for the first time black hole: under 28 ℃ temperature six layers laminated printed circuit boards was put into the blank hole liquid dipping 60 seconds, described blank hole liquid contains the carbon of 2.6 weight %, the potash of 1.0 weight % and the water (total amount with blank hole liquid is a benchmark) of 96.4 weight %;
Air-dry: as will under 68 ℃ temperature, to carry out air-dry through the laminated printed circuit boards that handle in for the first time black hole;
Handle in for the second time black hole: under 30 ℃ the temperature overturn in the laminated printed circuit boards top and bottom after air-dry and putting into the blank hole liquid dipping 65 seconds, described blank hole liquid contains the carbon of 2.6 weight %, the potash of 1.0 weight % and the water (total amount with blank hole liquid is a benchmark) of 96.4 weight %;
Air-dry: as will to finish the laminated printed circuit boards of handling in for the second time black hole and under 70 ℃ temperature, carry out air-dry;
Microetch is handled: laminated printed circuit boards put into the dioxysulfate water micro-etching agent dipping 60 seconds of the hydrogen peroxide of the sulfuric acid that contains 6 volume % and 2 volume % under 30 ℃ temperature, and after taking out from micro-etching agent, laminated printed circuit boards is cleaned;
Anti-oxidant treatment: will be placed in the wet chemical that concentration is 1.0 weight % through the laminated printed circuit boards that microetch is handled and flood 8 seconds, to carry out anti-oxidant treatment;
Dried: will under 65 ℃ temperature, carry out air-dry through the laminated printed circuit boards of anti-oxidant treatment at last.
Embodiment 2:
Decontamination is handled: under 48 ℃ temperature seven layers laminated printed circuit boards was put into the detergent dipping 30 seconds, described detergent contains the monoethanolamine of 25 weight %, the acetamide of 17 weight % and the water (total amount with detergent is a benchmark) of 58 weight %, and after from detergent, taking out, laminated printed circuit boards is cleaned;
Handle in for the first time black hole: will put into the blank hole liquid dipping 65 seconds through the laminated printed circuit boards that decontamination is handled under 30 ℃ temperature, described blank hole liquid contains the carbon of 5 weight %, the potash of 3.5 weight % and the water (total amount with blank hole liquid is a benchmark) of 91.5 weight %;
Repeating for the first time black hole handles: repeat once deceiving the hole processing procedure the above-mentioned first time;
Air-dry: as will under 70 ℃ temperature, to carry out air-dry through the laminated printed circuit boards of the twice described first time of black hole processing;
Handle in for the second time black hole: under 32 ℃ the temperature overturn in the laminated printed circuit boards top and bottom after air-dry and putting into the blank hole liquid dipping 70 seconds, described blank hole liquid contains the carbon of 5 weight %, the potash of 3.5 weight % and the water (total amount with blank hole liquid is a benchmark) of 91.5 weight %;
Repeating for the second time black hole handles: repeat once deceiving the hole processing procedure the above-mentioned second time;
Air-dry: the laminated printed circuit boards that will finish the twice described second time of black hole processing is carried out air-dry under 72 ℃ temperature;
Microetch is handled: laminated printed circuit boards put into the dioxysulfate water micro-etching agent dipping 65 seconds of the hydrogen peroxide of the sulfuric acid that contains 7 volume % and 2.5 volume % under 32 ℃ temperature, and after taking out from micro-etching agent, laminated printed circuit boards is cleaned;
Anti-oxidant treatment: will be placed in the glycol water that concentration is 32 weight % through the laminated printed circuit boards that microetch is handled and flood 10 seconds, to carry out anti-oxidant treatment;
Dried: will under 70 ℃ temperature, carry out air-dry through the laminated printed circuit boards of anti-oxidant treatment at last.
Embodiment 3:
Decontamination is handled: under 52 ℃ temperature eight layers laminated printed circuit boards was put into the detergent dipping 40 seconds, described detergent contains the water (total amount with detergent is a benchmark) of the acetamide of monoethanolamine, 17 weight % of 25 weight % and 58 weight % and after taking out from detergent, laminated printed circuit boards is cleaned;
Handle in for the first time black hole: will put into the blank hole liquid dipping 70 seconds through the laminated printed circuit boards that decontamination is handled under 32 ℃ temperature, described blank hole liquid contains the carbon of 8 weight %, the potash of 5 weight % and the water (total amount with blank hole liquid is a benchmark) of 87 weight %;
Electric charge is adjusted: will put into through the laminated printed circuit boards that the first time, handled in black hole under 23 ℃ temperature and adjust liquid dipping 30 seconds, described adjustment liquid contains the monoethanolamine of 42 weight %, the acetamide of 10 weight % and the water (total amount with adjustment liquid is a benchmark) of 48 weight %;
Repeating for the first time black hole handles: the laminated printed circuit boards through the electric charge adjustment is repeated once the above-mentioned first time of black hole processing procedure;
Air-dry: as will under 72 ℃ temperature, to carry out air-dry through the laminated printed circuit boards of the twice described first time of black hole processing;
Handle in for the second time black hole: under 30 ℃ the temperature overturn in the laminated printed circuit boards top and bottom after air-dry and putting into the blank hole liquid dipping 80 seconds, described blank hole liquid contains the carbon of 8 weight %, the potash of 5 weight % and the water (total amount with blank hole liquid is a benchmark) of 87 weight %;
Electric charge is adjusted: will put into through the laminated printed circuit boards that the second time, handled in black hole under 26 ℃ temperature and adjust liquid dipping 40 seconds, described adjustment liquid contains the monoethanolamine of 42 weight %, the acetamide of 10 weight % and the water (total amount with adjustment liquid is a benchmark) of 48 weight %;
Repeating for the second time black hole handles: the laminated printed circuit boards through the electric charge adjustment is repeated once the above-mentioned second time of black hole processing procedure;
Air-dry: the laminated printed circuit boards that will finish the twice described second time of black hole processing is carried out air-dry under 70 ℃ temperature;
Microetch is handled: laminated printed circuit boards put into the dioxysulfate water micro-etching agent dipping 70 seconds of the hydrogen peroxide of the sulfuric acid that contains 9 volume % and 3 volume % under 35 ℃ temperature, and after taking out from micro-etching agent, laminated printed circuit boards is cleaned;
Anti-oxidant treatment: will be placed in the isopropanol water solution that concentration is 25 weight % through the laminated printed circuit boards that microetch is handled and flood 15 seconds, to carry out anti-oxidant treatment;
Dried: will under 75 ℃ temperature, carry out air-dry through the laminated printed circuit boards of anti-oxidant treatment at last.
Comparative Examples:
Decontamination is handled: under 50 ℃ temperature seven layers laminated printed circuit boards was put into the detergent dipping 35 seconds, described detergent contains monoethanolamine, 17% acetamide and the water (total amount with detergent is a benchmark) of 58 weight % of 25 weight %, and after from detergent, taking out, laminated printed circuit boards is cleaned;
Handle in for the first time black hole: will put into the blank hole liquid dipping 65 seconds through the laminated printed circuit boards that decontamination is handled under 30 ℃ temperature, described blank hole liquid contains the carbon of 2.6 weight %, the potash of 1.0 weight % and the water (total amount with blank hole liquid is a benchmark) of 96.4 weight %;
Electric charge is adjusted: will put into through the laminated printed circuit boards that the first time, handled in black hole under 25 ℃ temperature and adjust liquid dipping 35 seconds, described adjustment liquid contains the monoethanolamine of 42 weight %, the acetamide of 10 weight % and the water (total amount with adjustment liquid is a benchmark) of 48 weight %;
Repeating for the first time black hole handles: the laminated printed circuit boards through the electric charge adjustment is repeated once the above-mentioned first time of black hole processing procedure;
Air-dry: as will under 70 ℃ temperature, to carry out air-dry through the laminated printed circuit boards of the twice described first time of black hole processing;
Microetch is handled: laminated printed circuit boards put into the dioxysulfate water micro-etching agent dipping 65 seconds of the hydrogen peroxide of the sulfuric acid that contains 6 volume % and 2 volume % under 33 ℃ temperature, and after taking out from micro-etching agent, laminated printed circuit boards is cleaned;
Anti-oxidant treatment: will be placed in the glycol water that concentration is 32 weight % through the laminated printed circuit boards that microetch is handled and flood 10 seconds, to carry out anti-oxidant treatment;
Dried: will under 70 ℃ temperature, carry out air-dry through the laminated printed circuit boards of anti-oxidant treatment at last.
The printed circuit board (PCB) that is made by embodiment 1,2,3 and Comparative Examples is carried out the test of reliability, tensile strength and percentage elongation, and test result is recorded in the table 1.
Wherein, the method for testing of reliability is: get 30 samples measuring resistance before and after thermal shock [300 circulations are done in 55 ℃ of (15min)/125 ℃ (15min)], be NG if resistance variations surpasses 10%, otherwise be OK.
The assay method of tensile strength and percentage elongation is: sample is cut into the strip of wide 10mm, long 70mm, 120 ℃ of bakings 60 minutes down.Then, the two ends of sample are clamped with brass sheet do reinforcement, with this as test film.Effectively measure part: wide 10mm, long 50mm.The SD-100C type puller system of test film with Shimadzu Seisakusho Ltd. stretched, measure its tensile strength and percentage elongation.Wherein, the tension test condition is: draw speed: 10mm/min, writing speed: 50mm/min.
Computing formula is:
Tensile strength (N/mm
2)=hot strength (kg) ÷ [width (10mm) of copper facing thick (μ m) ÷ 1000 * test film]
Length * 100 of percentage elongation (100%)=(extended length during fracture) ÷ test film
The performance of the through hole on the performance of the through hole on the printed circuit board (PCB) of table 1 Comparative Examples and the printed circuit board (PCB) of the embodiment of the invention relatively
| Performance | Comparative Examples | Embodiment 1 | Embodiment 2 | Embodiment 3 |
| Reliability | 82％OK? | 100％OK? | 100％OK? | 100％OK? |
| Tensile strength (N/mm 2)? | 358.7? | 411.5? | 425.8? | 447.2? |
| Percentage elongation (%) | 20.3? | 23.5? | 24.1? | 25.6? |
Comparative result from above-mentioned table 1 as can be seen, the printed circuit board (PCB) that utilizes hole electricity conduction method provided by the invention to handle to obtain is compared with the printed circuit board (PCB) that the hole electricity conduction method processing that utilizes the Comparative Examples prior art obtains, and the performance of through hole coating aspect reliability, tensile strength and percentage elongation is all more excellent.
Claims (7)
1. the hole electricity conduction method of a printed circuit board (PCB), described method comprises: at first laminated printed circuit boards is put into blank hole liquid and carried out the black hole processing first time, this laminated printed circuit boards of handling through for the first time black hole is air-dry, carry out the black hole processing second time then, and will be somebody's turn to do through the laminated printed circuit boards of for the second time black hole processing air-dry, it is characterized in that, in carrying out the process of handling in for the second time black hole, described laminated printed circuit boards is the top and bottom upsets with respect to the described first time of black hole processing.
2. method according to claim 1, wherein, black hole was handled and was deceived the condition of handling in the hole for the second time and is the described first time: under 25-35 ℃ temperature laminated printed circuit boards is put into blank hole liquid dipping 45-90 second.
3. method according to claim 2, wherein, described blank hole liquid is carbon, the potash of 0.2-5 weight % and the water of 85-98 weight % that benchmark contains 0.5-10 weight % with its total amount.
4. according to claim 2 or 3 described methods, wherein, repeat once the described first time of black hole processing and/or for the second time black hole and handle.
5. method according to claim 4, wherein, before repeating the described first time of black hole processing and/or the processing of for the second time black hole, laminated printed circuit boards is carried out the electric charge adjustment, and described electric charge is adjusted under 20-30 ℃ temperature laminated printed circuit boards is put into adjustment liquid dipping 20-50 second.
6. method according to claim 5, wherein, described adjustment liquid is monoethanolamine, the acetamide of 2-20 weight % and the water of 25-60 weight % that benchmark contains 35-55 weight % with its total amount.
7. method according to claim 1, wherein, described method also is included in carries out earlier laminated printed circuit boards being carried out the decontamination processing before the black hole processing first time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101965280A CN101453837B (en) | 2007-11-28 | 2007-11-28 | Hole electricity conduction method for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101965280A CN101453837B (en) | 2007-11-28 | 2007-11-28 | Hole electricity conduction method for printed circuit board |
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| Publication Number | Publication Date |
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| CN101453837A CN101453837A (en) | 2009-06-10 |
| CN101453837B true CN101453837B (en) | 2011-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2007101965280A Active CN101453837B (en) | 2007-11-28 | 2007-11-28 | Hole electricity conduction method for printed circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103160896A (en) * | 2013-03-01 | 2013-06-19 | 溧阳市新力机械铸造有限公司 | Preparing method of black hole solution for printed circuit board |
| CN106319603A (en) * | 2016-08-29 | 2017-01-11 | 苏州铱诺化学材料有限公司 | Formula of blackhole hole-leveling agent |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013059985A1 (en) * | 2011-10-25 | 2013-05-02 | 建业（惠州）电路版有限公司 | Process for metallisation of holes in printed circuit board |
| CN102821555A (en) * | 2012-07-31 | 2012-12-12 | 悦虎电路(苏州)有限公司 | Processing technique of transparent insulating layer of multi-layer circuit board |
| CN105282986B (en) * | 2015-10-14 | 2018-06-26 | 苏州福莱盈电子有限公司 | A kind of production technology of fine flexible circuit board |
| CN108712830B (en) * | 2018-05-30 | 2021-02-26 | 广东天承科技股份有限公司 | Palladium-free chemical copper plating process for circuit board |
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| CN1296375A (en) * | 1999-11-12 | 2001-05-23 | 荏原优莱特科技股份有限公司 | Method for filling through hole |
| US6280641B1 (en) * | 1998-06-02 | 2001-08-28 | Mitsubishi Gas Chemical Company, Inc. | Printed wiring board having highly reliably via hole and process for forming via hole |
| CN1733980A (en) * | 2004-08-02 | 2006-02-15 | 吕桂生 | Electricity conductive liquid capable of directly galvanizing the printed board |
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- 2007-11-28 CN CN2007101965280A patent/CN101453837B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1155230A (en) * | 1995-08-23 | 1997-07-23 | 美克株式会社 | Electroplating method |
| US6280641B1 (en) * | 1998-06-02 | 2001-08-28 | Mitsubishi Gas Chemical Company, Inc. | Printed wiring board having highly reliably via hole and process for forming via hole |
| CN1296375A (en) * | 1999-11-12 | 2001-05-23 | 荏原优莱特科技股份有限公司 | Method for filling through hole |
| CN1733980A (en) * | 2004-08-02 | 2006-02-15 | 吕桂生 | Electricity conductive liquid capable of directly galvanizing the printed board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103160896A (en) * | 2013-03-01 | 2013-06-19 | 溧阳市新力机械铸造有限公司 | Preparing method of black hole solution for printed circuit board |
| CN103160896B (en) * | 2013-03-01 | 2015-06-10 | 溧阳市新力机械铸造有限公司 | Preparing method of black hole solution for printed circuit board |
| CN106319603A (en) * | 2016-08-29 | 2017-01-11 | 苏州铱诺化学材料有限公司 | Formula of blackhole hole-leveling agent |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101453837A (en) | 2009-06-10 |
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