CN102061471A - Copper plating process - Google Patents
Copper plating process Download PDFInfo
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- CN102061471A CN102061471A CN2009102197691A CN200910219769A CN102061471A CN 102061471 A CN102061471 A CN 102061471A CN 2009102197691 A CN2009102197691 A CN 2009102197691A CN 200910219769 A CN200910219769 A CN 200910219769A CN 102061471 A CN102061471 A CN 102061471A
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- pyrophosphate
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Abstract
The invention discloses a copper plating process, belongs to the field of fine chemical engineering, and in particular relates to a copper plating process. The invention provides a high-efficiency and light-pollution copper plating process. The copper plating process comprises the following steps of: removing oil; washing with water; drying; performing plasma treatment; performing magnetron sputtering of copper; electroplating copper by using pyrophosphate; and drying.
Description
Technical field:
The invention belongs to field of fine chemical, more particularly, relate to a kind of copper-plating technique.
Background technology:
Copper coating has good ductility, associativity, plasticity-and easy polishability, is widely used in decorating the bottom of protective coating, can reduce the coating hole like this, improves the anti-corrosion performance of coating, but also can save the consumption of noble metal.Because carbon scattering and permeating in copper is relatively more difficult, in order to prevent the iron and steel local carburization, often also will adopt copper-plating technique in thermal treatment process.In addition, because the coefficient of expansion of copper and plastics is approaching, therefore, in plastic electroplating, copper coating commonly used is as conductive layer.
Pyrophosphate copper plating adopts cupric pyrophosphate as main salt, adds compositions such as coordination agent and other auxiliary complexing agents, obtains the careful bright coating of crystallization by processing condition such as control pH value, temperature, pneumatic blending.Because plating bath does not contain prussiate, dispersive ability and covering power are good, bath stability, and the current efficiency height, the processing range broad is easy to control, therefore, is very suitable for industrial mass production.
Yet, traditional copper-plating technique, though can obtain the careful bright coating of crystallization, current density is less, causes productivity lower.Though can wait and improve current density by being added with organic additive, organic additive decomposes under comparatively high temps easily, influence the plating bath purity, there are environmental issues such as wastewater treatment again in the while organic additive.
Summary of the invention:
The present invention is exactly at the problems referred to above, provide a kind of efficient, pollute little copper-plating technique.
In order to realize above-mentioned purpose of the present invention, the present invention adopts following technical scheme, and processing step of the present invention is:
1. oil removing, washing, oven dry, plasma treatment, magnetron sputtering copper;
2. pyrophosphate method of electro-plating copper
The prescription of plating bath is:
Cupric pyrophosphate 70～90g/L, potassium pyrophosphate 300～350g/L, ammonium citrate 0～15g/L, ammonium nitrate 0～20g/L, Seignette salt 0～25g/L, nitrilotriacetic acid(NTA) 0～20g/L, ammoniacal liquor 0～1ml;
The temperature of copper facing process is 45～55 ℃, and system pH is 8.2～8.8;
3. oven dry.
Beneficial effect of the present invention:
1. the current density to 1.5 the when ammonium nitrate in the plating bath can improve pyrophosphate method of electro-plating～2.5A/dm
2, play the effect that improves coating surface quality simultaneously;
2. the present invention is simple to operate, and is little to the pollution of environment, is beneficial to suitability for industrialized production.
Embodiment:
Processing step of the present invention is:
1. oil removing, washing, oven dry, plasma treatment, magnetron sputtering copper;
2. pyrophosphate method of electro-plating copper
The prescription of plating bath is:
Cupric pyrophosphate 70～90g/L, potassium pyrophosphate 300～350g/L, ammonium citrate 0～15g/L, ammonium nitrate 0～20g/L, Seignette salt 0～25g/L, nitrilotriacetic acid(NTA) 0～20g/L, ammoniacal liquor 0～1ml;
The temperature of copper facing process is 45～55 ℃, and system pH is 8.2～8.8;
3. oven dry.
Embodiment 1:
1. oil removing, washing, oven dry, plasma treatment, magnetron sputtering copper;
2. pyrophosphate method of electro-plating copper
The prescription of plating bath is:
Cupric pyrophosphate 70g/L, potassium pyrophosphate 350g/L, ammonium citrate 15g/L, ammonium nitrate 20g/L, Seignette salt 12.5g/L, nitrilotriacetic acid(NTA) 10g/L, ammoniacal liquor 1ml;
The temperature of copper facing process is 45 ℃, and system pH is 8.2;
3. oven dry.
Embodiment 2:
1. oil removing, washing, oven dry, plasma treatment, magnetron sputtering copper;
2. pyrophosphate method of electro-plating copper
The prescription of plating bath is:
Cupric pyrophosphate 90g/L, potassium pyrophosphate 300g/L, ammonium citrate 0g/L, ammonium nitrate 20g/L, Seignette salt 0g/L, nitrilotriacetic acid(NTA) 20g/L, ammoniacal liquor 0.5ml;
The temperature of copper facing process is 55 ℃, and system pH is 8.8;
3. oven dry.
Embodiment 3:
1. oil removing, washing, oven dry, plasma treatment, magnetron sputtering copper;
2. pyrophosphate method of electro-plating copper
The prescription of plating bath is:
Cupric pyrophosphate 70g/L, potassium pyrophosphate 300g/L, ammonium citrate 15g/L, ammonium nitrate 10g/L, Seignette salt 25g/L, nitrilotriacetic acid(NTA) 0g/L, ammoniacal liquor 0ml;
The temperature of copper facing process is 50 ℃, and system pH is 8.5;
3. oven dry.
Configuration is during pyrophosphate plating solution, should cry cupric phosphate with small amount of deionized water furnishing pasty state, slowly joins then in the dissolved potassium pyrophosphate, constantly stirs, until dissolving fully;
When adding nitrilotriacetic acid(NTA) in the plating bath, should earlier NaOH be dissolved in the water, the amount of NaOH is 3% of a nitrilotriacetic acid(NTA), after treating that alkali liquid temperature is lower than 60 ℃, nitrilotriacetic acid(NTA) added in the alkali lye gradually stir evenly, at last it is joined in the solution that cupric pyrophosphate and potassium pyrophosphate mixed, stir evenly again;
Add ammoniacal liquor in the plating bath, should before the pH value is adjusted, add;
Ammonium nitrate is answered the periodic analysis adjustment.
Claims (4)
1. a copper-plating technique is characterized in that, processing step of the present invention is:
(1) oil removing, washing, oven dry, plasma treatment, magnetron sputtering copper;
(2) pyrophosphate method of electro-plating copper
The prescription of plating bath is:
Cupric pyrophosphate 70～90g/L, potassium pyrophosphate 300～350g/L, ammonium citrate 0～15g/L, ammonium nitrate 0～20g/L, Seignette salt 0～25g/L, nitrilotriacetic acid(NTA) 0～20g/L, ammoniacal liquor 0～1ml;
The temperature of copper facing process is 45～55 ℃, and system pH is 8.2～8.8;
(3) oven dry.
2. a kind of copper-plating technique according to claim 1 is characterized in that, processing step of the present invention is:
(1) oil removing, washing, oven dry, plasma treatment, magnetron sputtering copper;
(2) pyrophosphate method of electro-plating copper
The prescription of plating bath is:
Cupric pyrophosphate 70g/L, potassium pyrophosphate 350g/L, ammonium citrate 15g/L, ammonium nitrate 20g/L, Seignette salt 12.5g/L, nitrilotriacetic acid(NTA) 10g/L, ammoniacal liquor 1ml;
The temperature of copper facing process is 45 ℃, and system pH is 8.2;
(3) oven dry.
3. a kind of copper-plating technique according to claim 1 is characterized in that, processing step of the present invention is:
(1) oil removing, washing, oven dry, plasma treatment, magnetron sputtering copper;
(2) pyrophosphate method of electro-plating copper
The prescription of plating bath is:
Cupric pyrophosphate 90g/L, potassium pyrophosphate 300g/L, ammonium citrate 0g/L, ammonium nitrate 20g/L, Seignette salt 0g/L, nitrilotriacetic acid(NTA) 20g/L, ammoniacal liquor 0.5ml;
The temperature of copper facing process is 55 ℃, and system pH is 8.8;
(4) oven dry.
4. a kind of copper-plating technique according to claim 1 is characterized in that, processing step of the present invention is:
(1) oil removing, washing, oven dry, plasma treatment, magnetron sputtering copper;
(2) pyrophosphate method of electro-plating copper
The prescription of plating bath is:
Cupric pyrophosphate 70g/L, potassium pyrophosphate 300g/L, ammonium citrate 15g/L, ammonium nitrate 10g/L, Seignette salt 25g/L, nitrilotriacetic acid(NTA) 0g/L, ammoniacal liquor 0ml;
The temperature of copper facing process is 50 ℃, and system pH is 8.5;
(3) oven dry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102197691A CN102061471A (en) | 2009-11-11 | 2009-11-11 | Copper plating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102197691A CN102061471A (en) | 2009-11-11 | 2009-11-11 | Copper plating process |
Publications (1)
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| CN102061471A true CN102061471A (en) | 2011-05-18 |
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| CN2009102197691A Pending CN102061471A (en) | 2009-11-11 | 2009-11-11 | Copper plating process |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102337571A (en) * | 2011-11-03 | 2012-02-01 | 厦门建霖工业有限公司 | Method for electroplating plastic base material |
| CN103668355A (en) * | 2013-12-06 | 2014-03-26 | 南京三乐电子信息产业集团有限公司 | Copper plating method for surface of tungsten helical line of travelling wave tube |
| CN104499018A (en) * | 2014-11-28 | 2015-04-08 | 广东致卓精密金属科技有限公司 | Alkaline non-cyanide pre-plated copper plating solution and process |
| CN109097772A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN110904473A (en) * | 2019-12-04 | 2020-03-24 | 中山美力特环保科技有限公司 | 5G antenna environment-friendly copper plating process |
-
2009
- 2009-11-11 CN CN2009102197691A patent/CN102061471A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102337571A (en) * | 2011-11-03 | 2012-02-01 | 厦门建霖工业有限公司 | Method for electroplating plastic base material |
| CN102337571B (en) * | 2011-11-03 | 2014-01-08 | 厦门建霖工业有限公司 | Method for electroplating plastic base material |
| CN103668355A (en) * | 2013-12-06 | 2014-03-26 | 南京三乐电子信息产业集团有限公司 | Copper plating method for surface of tungsten helical line of travelling wave tube |
| CN103668355B (en) * | 2013-12-06 | 2016-05-11 | 南京三乐电子信息产业集团有限公司 | The copper electroplating method on a kind of travelling-wave tubes tungsten helix surface |
| CN104499018A (en) * | 2014-11-28 | 2015-04-08 | 广东致卓精密金属科技有限公司 | Alkaline non-cyanide pre-plated copper plating solution and process |
| CN109097772A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN110904473A (en) * | 2019-12-04 | 2020-03-24 | 中山美力特环保科技有限公司 | 5G antenna environment-friendly copper plating process |
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Application publication date: 20110518 |