CN100451178C - Electricity conductive liquid capable of directly galvanizing the printed board - Google Patents
Electricity conductive liquid capable of directly galvanizing the printed board Download PDFInfo
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- CN100451178C CN100451178C CNB2004100202226A CN200410020222A CN100451178C CN 100451178 C CN100451178 C CN 100451178C CN B2004100202226 A CNB2004100202226 A CN B2004100202226A CN 200410020222 A CN200410020222 A CN 200410020222A CN 100451178 C CN100451178 C CN 100451178C
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- conductive liquid
- liquid
- electricity conductive
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- printed board
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Abstract
The present invention relates to an electricity conductive liquid capable of directly electroplating a printed board, which is characterized in that the electricity conductive liquid is formed by the raw materials in proportionality, such as two to five percents graphite, 0.5 to one percent Na< 2 >SiO< 3 >, 0.5 to two percents anionic surface active agent, two to four percents NH< 4 >OH and 88 to 96 percents water. The present invention has the advantages that the electricity conductive liquid has good stability; in the adsorption process of a copper covered board on which holes are drilled, no hydrogen gas precipitates; the interconnected quality between layers of the printed board can be ensured. In the adsorption process, the electricity conductive liquid is in physical property and does not have chemical reaction; the phenomenon that other components are consumed because of the chemical reaction does not happen, so that the liquid does not need analysing and adjusting; according to the depletion of actual production, a new liquid (black hole liquid) is added, and therefore, the working performance can be ensured. The present invention can be used and repaired simply and reliably; working hours can be saved, and the consumption of materials is reduced. The discharge of waste water is effectively controlled, and the production cost of printed boards is also reduced.
Description
Technical field:
The invention belongs to a kind of conductive liquid of metal, particularly a kind of conductive liquid that makes the printed board Direct Electroplating.
Background technology:
Hole metallization is the industrial link of most critical in the printed circuit board (pcb) manufacturing processed.For a long time, the electroless copper plating technology is to realize the mainstream technology of hole metallization, and it is a kind of autocatalysis oxygen reduction reaction.Though this technology has been prolonged with for many years and carried out continuous improvement, but still the shortcoming that is difficult to overcome below existing: 1, adopt formaldehyde (Formaldehyde) to make reductive agent, not only endanger ecotope, and carcinogenic danger is arranged.2, the network of electroless copper and agent EDTA are difficult for biodegrade, and wastewater treatment is difficulty very.3, the less stable of chemical copper plating solution is operated the careless slightly solution that will occur and decomposed, and is very strict to the requirement of monitoring and maintenance.4, the mechanical property of the coating of electroless copper (for example: unit elongation, tensile strength) is all less than electroplating copper plate.5, chemical-copper-plating process long flow path, operation and maintenance are extremely inconvenient, and quality control is difficulty and working cost height relatively.
Summary of the invention:
Purpose of the present invention just is to overcome above-mentioned the deficiencies in the prior art, and provide a kind of conductive liquid that makes the printed board Direct Electroplating, utilize this conductive liquid to carry out the technology of plated through-hole, man-hour can be saved, reduce materials consumption, and controlled discharged waste water effectively, reduced the production cost of printed board.
Technical scheme of the present invention is: a kind of conductive liquid that makes the printed board Direct Electroplating is characterized in that: made according to following ratio by following raw materials according: graphite 3.5%Na
2SiO
30.5% anion surfactant 1%NH
4OH 2% water 93%.
The median size of above-mentioned graphite is 0.2 μ m.
Advantage of the present invention is: 1, the black liquor be made up of extremely strong meticulous carbon black of conductive capability or graphite of this conductive liquid, general designation blank hole liquid (Blackhole).Because it has satisfactory stability, therefore no hydrogen is separated out in finishing the adsorption process of the copper-clad plate after the boring, can ensure the inter-level interconnects quality of printed board.And it is physical property in adsorption process, and chemical reaction does not take place, and does not also just have the phenomenon that consumes other composition because of chemical reaction.Therefore need not to analyze and adjust solution, can add new liquid (blank hole liquid) according to the impairment of actual production fully, can guarantee its serviceability.2, the using and safeguarding not only simply but also reliable of this solution, practical value is very high.3, use the present invention to carry out metallized technology, can save man-hour, reduce materials consumption, and controlled discharged waste water effectively, reduced the production cost of printed board.
Embodiment:
Graphite with 3.5%, 0.5% Na
2SiO
3, 1% anion surfactant, 2% NH
4The stirring that neutralizes of OH and 93% water, synthetic at last this conductive liquid, i.e. blank hole liquid.The median size of above-mentioned graphite is 0.2 μ m.
Blank hole liquid can adopt impregnated and these two kinds of methods of horizontal in application.
1. impregnated: relatively be fit to small business,, use producer under existing condition, finish with dipping → oven dry two-step approach because need not to acquire equipment in this way.2. horizontal: must adopt special equipment to implement, in relatively being fit to, large-lot producer, it can realize the whole processing procedure of black holeization in the short period of time with single stage method, and can improve throughput greatly.
PCB manufacturer can decide according to enterprise condition and select impregnated or horizontal for use.
Below be the technical process and the processing condition of impregnated:
One, technical process:
Cleaning → washing → whole hole → washing → deionization is washed → is blotted → blank hole liquid → drying → microetch → washing → air-dry → electro-coppering
Two, tank liquor configuration and processing condition
Three, precaution
1, blank hole liquid should have recirculation unit, with ultrasonic wave mode the best, forbids the pollution of acids, oils and other impurity on sea line.
2, the drying of impregnated can be utilized baking oven or drying tunnel, and temperature 105-110 ℃, 5 minutes time.Horizontal is provided with cold and hot air-dry section.
3, under normal operation, blank hole liquid need not to carry out the adjustment of pH value, but impregnated brings into unavoidably in operation and take phenomenon out of, build use for some time after, detect pH value with the pH value tester, replenish liquid (BB-2) adjustment standard with blank hole liquid.
4, the storage temperature of blank hole liquid is 2-40 ℃.
5, on special base material, as polyimide, polyester, tetrafluoroethylene etc., can adopt twice black hole to handle, its technical process is as follows:
Cleaning → washing → whole hole → washing → deionization washing → drying → blank hole liquid → drying → blank hole liquid → drying → microetch → washing → air-dry → electro-coppering.
Claims (2)
1, a kind of conductive liquid that makes the printed board Direct Electroplating is characterized in that: made according to following ratio by following raw materials according: graphite 3.5%
Na
2SiO
30.5%
Anion surfactant 1%
NH
4OH 2%
Water 93%.
2, the conductive liquid that makes the printed board Direct Electroplating according to claim 1 is characterized in that: the median size of above-mentioned graphite is 0.2 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100202226A CN100451178C (en) | 2004-08-02 | 2004-08-02 | Electricity conductive liquid capable of directly galvanizing the printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100202226A CN100451178C (en) | 2004-08-02 | 2004-08-02 | Electricity conductive liquid capable of directly galvanizing the printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1733980A CN1733980A (en) | 2006-02-15 |
| CN100451178C true CN100451178C (en) | 2009-01-14 |
Family
ID=36076584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100202226A Expired - Fee Related CN100451178C (en) | 2004-08-02 | 2004-08-02 | Electricity conductive liquid capable of directly galvanizing the printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100451178C (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101394712B (en) | 2007-09-21 | 2010-08-25 | 清华大学 | Hole blackening solution and preparation thereof |
| TWI408003B (en) * | 2007-09-28 | 2013-09-11 | Hon Hai Prec Ind Co Ltd | Solution for preparing the through hole walls for electroplating and method of making the same |
| CN101453837B (en) * | 2007-11-28 | 2011-03-30 | 比亚迪股份有限公司 | Hole electricity conduction method for printed circuit board |
| KR101537638B1 (en) * | 2010-05-18 | 2015-07-17 | 삼성전자 주식회사 | Plating method for resin using graphene thin layer |
| CN102647858A (en) * | 2012-05-15 | 2012-08-22 | 金悦通电子（翁源）有限公司 | Processing method of printed circuit board (PCB) |
| CN103173824A (en) * | 2013-03-01 | 2013-06-26 | 溧阳市新力机械铸造有限公司 | Black hole solution for printed circuit board |
| CN103167747B (en) * | 2013-03-01 | 2016-01-06 | 溧阳市新力机械铸造有限公司 | A kind of preparation method of printed circuit board (PCB) |
| CN104562115B (en) * | 2014-07-04 | 2017-07-11 | 广东丹邦科技有限公司 | Blank hole liquid for printed circuit board and preparation method thereof |
| CN104388996A (en) * | 2014-10-30 | 2015-03-04 | 苏州禾川化学技术服务有限公司 | Black hole liquid and preparation method thereof |
| CN104703411A (en) * | 2015-04-01 | 2015-06-10 | 竞陆电子(昆山)有限公司 | Horizontal plated-through hole production line pH monitoring device |
| CN104818506A (en) * | 2015-05-28 | 2015-08-05 | 哈尔滨工业大学 | Solution for metalizing printed circuit board hole |
| CN106319603A (en) * | 2016-08-29 | 2017-01-11 | 苏州铱诺化学材料有限公司 | Formula of blackhole hole-leveling agent |
| CN106559961B (en) * | 2016-08-31 | 2021-10-08 | 广东天承科技股份有限公司 | Conductive liquid, preparation method thereof and conductive treatment method |
| CN106852026A (en) * | 2016-11-29 | 2017-06-13 | 深圳崇达多层线路板有限公司 | Suitable for the black holes production technology of HDI products |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4622108A (en) * | 1986-05-05 | 1986-11-11 | Olin Hunt Specialty Products, Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
| CN1109924A (en) * | 1994-03-28 | 1995-10-11 | 美克株式会社 | Plating surface of unconductor |
| CN1182107A (en) * | 1996-11-13 | 1998-05-20 | 马忠好 | Outer conductive paint for glass bulb of display tube and its preparation |
| CN1367211A (en) * | 2002-02-24 | 2002-09-04 | 青岛石墨股份有限公司 | Graphite conducting coating material |
-
2004
- 2004-08-02 CN CNB2004100202226A patent/CN100451178C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4622108A (en) * | 1986-05-05 | 1986-11-11 | Olin Hunt Specialty Products, Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
| CN1109924A (en) * | 1994-03-28 | 1995-10-11 | 美克株式会社 | Plating surface of unconductor |
| CN1182107A (en) * | 1996-11-13 | 1998-05-20 | 马忠好 | Outer conductive paint for glass bulb of display tube and its preparation |
| CN1367211A (en) * | 2002-02-24 | 2002-09-04 | 青岛石墨股份有限公司 | Graphite conducting coating material |
Non-Patent Citations (4)
| Title |
|---|
| 印制板直接电镀工艺. 王丽丽.电镀与精饰，第20卷第6期. 1998 |
| 印制板直接电镀工艺. 王丽丽.电镀与精饰，第20卷第6期. 1998 * |
| 印制线路板孔金属化电镀工艺. 蔡积庆.电镀与涂饰，第12卷第3期. 1993 |
| 印制线路板孔金属化电镀工艺. 蔡积庆.电镀与涂饰，第12卷第3期. 1993 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1733980A (en) | 2006-02-15 |
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Granted publication date: 20090114 Termination date: 20120802 |