CN105905600A - Electronic component conveying apparatus and electronic component inspecting device - Google Patents

Electronic component conveying apparatus and electronic component inspecting device Download PDF

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Publication number
CN105905600A
CN105905600A CN201610055013.8A CN201610055013A CN105905600A CN 105905600 A CN105905600 A CN 105905600A CN 201610055013 A CN201610055013 A CN 201610055013A CN 105905600 A CN105905600 A CN 105905600A
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CN
China
Prior art keywords
mentioned
handle part
supply
electronic unit
delivery section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610055013.8A
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Chinese (zh)
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CN105905600B (en
Inventor
清水博之
下岛聪兴
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Seiko Epson Corp
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Seiko Epson Corp
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Publication date
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Publication of CN105905600A publication Critical patent/CN105905600A/en
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Publication of CN105905600B publication Critical patent/CN105905600B/en
Expired - Fee Related legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/918—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with at least two picking-up heads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The present invention provides an electronic component conveying device, and an electronic component inspecting device, wherein the number of conveyed electronic components per unit time is increased. The electronic component conveying device comprises a conveying part for conveying a plurality of electronic components, a supplying and holding part for holding the above plurality of electronic components and putting the above plurality of electronic components onto the conveying part, and a supplying, recycling and holding part for holding, supplying and recycling the above plurality of electronic components. The holding interval of the supplying and holding part is adjusted to be the same with the interval of electronic components conveyed by the conveying part. The holding interval of electronic components on the supplying, recycling and holding part is larger than the interval of electronic components conveyed by the conveying part. The plurality of electronic components are conveyed onto the conveying part by the supplying and holding part. The above plurality of electronic components are taken out from the conveying part by the supplying, recycling and holding part in batches.

Description

Electronic component handling apparatus and electronic component inspection device
Technical field
The present invention relates to electronic component handling apparatus and electronic component inspection device.
Background technology
In the past, it is known to check the electronic unit inspection of the electrical characteristics of the electronic units such as such as IC device Look into device, be assembled with for IC device is transported to inspection portion in this electronic component inspection device The electronic component handling apparatus of maintaining part.When checking IC device, IC device is configured at maintaining part, Make each termination contact of multiple probes and the IC device being arranged at maintaining part.
Above-mentioned electronic component handling apparatus have heat in advance or cool down IC device by IC device adjust The soaking plate, plate will be soaked adjust the IC device after temperature and carry of the whole temperature for being suitable to check To inspection portion vicinity supply shuttle, carry out being configured with the pallet of IC device and soak between plate First device conveying of the conveying of the IC device between the conveying of IC device and immersion plate and supply shuttle Head, conveying check after the reclaiming shuttle, carry out supplying the IC device between shuttle and inspection portion of IC device The conveying of part and inspection portion and the second device delivery head of the conveying of IC device reclaimed between shuttle, And carry out reclaiming the conveying of the IC device between the pallet of the IC device that shuttle and configuration are recovered 3rd device conveying is first-class.
First device delivery head, the second device delivery head and the 3rd device delivery head are respectively provided with many The hands unit of individual holding IC device.It addition, each hands unit is respectively provided with the nozzle of absorption IC device, Utilize the absorption of this nozzle thus hold IC device 90.It addition, supply shuttle and recovery shuttle have respectively Having the pocket portion configuring multiple IC devices, inspection portion has the maintaining part configuring multiple IC devices.
It addition, patent document 1 discloses that each adsorption head 81 that can regulate multi-joint adsorption head 80 The IC process device transport apparatus at adsorption head interval 90.
In this IC process device transport apparatus, making adsorption head interval 90 is user tray 100 N times of 202, interval, device storage pocket portion, primary sorption/discharge is multiple by test device (DUT)。
Patent documentation 1: Japanese Unexamined Patent Publication 8-264993 publication
In existing electronic component handling apparatus, by spacing and the supply of the maintaining part in inspection portion The spacing in the pocket portion of shuttle is set as identical.In this case, if the spacing in pocket portion of supply shuttle is the Below the maximum spacing of the nozzle of the hands unit of one device delivery head, then by the first device delivery head The spacing of the nozzle of hands unit is adjusted to identical with the spacing in the pocket portion supplying shuttle, thus the first device IC device can be configured at the pocket portion of supply shuttle by whole hands unit of delivery head simultaneously.
But, the nozzle of the hands unit of gap ratio the first device delivery head in the pocket portion of supply shuttle In the case of maximum spacing is big, whole hands unit of the first device delivery head cannot be simultaneously by IC device Part is configured at the pocket portion of supply shuttle, and IC device is configured at supply by the first device delivery head several times The pocket portion of shuttle.Therefore, the quantity of the IC device of time per unit conveying reduces.3rd device is defeated Send head too.
It addition, in the IC process device transport apparatus described in patent documentation 1, utilization is many Connection adsorption head 80, in user tray 100, primary sorption/discharge is multiple by test device, but Patent documentation 1 is silent on how by multiple multiple guarantors being configured at inspection portion by test device Hold portion.Therefore, in the IC process device transport apparatus described in patent documentation 1, it is impossible to Increase the quantity of the IC device of time per unit conveying.
Summary of the invention
It is an object of the invention to provide the quantity of the electronic unit that can increase time per unit conveying Electronic component handling apparatus and electronic component inspection device.
The present invention is in order to solve at least some of of above-mentioned problem and to complete, it is possible to as following Mode or application examples realize.
Application examples 1
The electronic component handling apparatus of the present invention is characterised by possessing: can configure and carry many The delivery section of individual electronic unit, multiple above-mentioned electronic unit can be held and they are configured at above-mentioned The supply handle part of delivery section and multiple above-mentioned electronic unit can be held and carry out supplying and returning Handle part is reclaimed in the supply received, and the electronic unit of above-mentioned supply handle part holds spacing and can be adjusted to Identical with the electronic unit disposition interval of above-mentioned delivery section, the ministry of electronics industry of handle part is reclaimed in above-mentioned supply The electronic unit disposition interval that part holds the above-mentioned delivery section of gap ratio is big, and above-mentioned supply handle part will be many Individual above-mentioned electronic unit is configured at above-mentioned delivery section, and above-mentioned supply reclaims handle part by multiple above-mentioned electricity Subassembly takes out from above-mentioned delivery section several times.
Thereby, it is possible to increase the quantity of the electronic unit of time per unit conveying.
Application examples 2
In the electronic component handling apparatus of the present invention, it is preferable that above-mentioned supply handle part is by multiple State electronic unit unification and be configured at above-mentioned delivery section.
Thereby, it is possible to increase the quantity of the electronic unit of time per unit conveying.
Application examples 3
In the electronic component handling apparatus of the present invention, it is preferable that above-mentioned supply reclaims handle part from handle Holding the time configuring above-mentioned electronic unit configures above-mentioned electricity than above-mentioned supply handle part from holding to The time of subassembly is short.
Thereby, it is possible to increase the quantity of the electronic unit of time per unit conveying.
Application examples 4
In the electronic component handling apparatus of the present invention, it is preferable that above-mentioned supply handle part can be towards joining Put multiple above-mentioned electronic unit direction and with configure multiple above-mentioned electronic units direction orthogonal Direction is moved.
Thereby, it is possible to easily hold electronic unit.
Application examples 5
The electronic component handling apparatus of the present invention is characterised by possessing: can configure and carry many The delivery section of individual electronic unit, the multiple above-mentioned electronic unit being configured at above-mentioned delivery section can be held And recovery handle part that they are taken out from above-mentioned delivery section and multiple above-mentioned electronics can be held Handle part, the electronic unit of above-mentioned recovery handle part are reclaimed in parts the supply carrying out supplying and reclaiming Hold spacing and can be adjusted to identical with the electronic unit disposition interval of above-mentioned delivery section, above-mentioned supply The electronic unit reclaiming handle part holds the electronic unit disposition interval of the above-mentioned delivery section of gap ratio greatly, Above-mentioned supply is reclaimed handle part and multiple above-mentioned electronic units is configured at above-mentioned delivery section several times, on State recovery handle part to be taken out from above-mentioned delivery section by multiple above-mentioned electronic units.
Thereby, it is possible to increase the quantity of the electronic unit of time per unit conveying.
Application examples 6
In the electronic component handling apparatus of the present invention, it is preferable that above-mentioned recovery handle part is by multiple State electronic unit unification to take out from above-mentioned delivery section.
Thereby, it is possible to increase the quantity of the electronic unit of time per unit conveying.
Application examples 7
In the electronic component handling apparatus of the present invention, it is preferable that above-mentioned supply reclaims handle part from handle Holding the time configuring above-mentioned electronic unit configures above-mentioned electricity than above-mentioned recovery handle part from holding to The time of subassembly is short.
Thereby, it is possible to increase the quantity of the electronic unit of time per unit conveying.
Application examples 8
In the electronic component handling apparatus of the present invention, it is preferable that above-mentioned recovery handle part can be towards joining Put multiple above-mentioned electronic unit direction and with configure multiple above-mentioned electronic units direction orthogonal Direction is moved.
Thereby, it is possible to easily hold electronic unit.
Application examples 9
In the electronic component handling apparatus of the present invention, it is preferable that configure multiple in above-mentioned delivery section The direction of above-mentioned electronic unit is identical with the conveying direction of above-mentioned delivery section.
Reclaim handle part configuration thereby, it is possible to shorten supply or take out institute in the case of electronic unit The time needed.
Application examples 10
In the electronic component handling apparatus of the present invention, it is preferable that reclaim handle part in above-mentioned supply and join In the case of putting or take out above-mentioned electronic unit, above-mentioned supply reclaim handle part can towards with configuration The direction that the direction of multiple above-mentioned electronic units is orthogonal is moved, and above-mentioned delivery section can be multiple towards configuration The direction of above-mentioned electronic unit is moved.
Reclaim handle part configuration thereby, it is possible to shorten supply or take out institute in the case of electronic unit The time needed.
Application examples 11
In the electronic component handling apparatus of the present invention, it is preferable that above-mentioned delivery section will be configured at The spacing of multiple above-mentioned electronic units is set to a, by above-mentioned supply reclaim handle part hold multiple on Stating the spacing of electronic unit when being set to b, b/a is the integer of more than 2.
Thus, in the case of supply is reclaimed handle part configuration or taken out electronic unit, it is possible to The configuration of minimal number of times or taking-up electronic unit.
Application examples 12
In the electronic component handling apparatus of the present invention, it is preferable that have and can keep the above-mentioned ministry of electronics industry The maintaining part of part, handle part is reclaimed in above-mentioned supply can press the above-mentioned ministry of electronics industry to above-mentioned maintaining part Part.
Thereby, it is possible to made by inspection handle part pressing electronic unit the terminal of electronic unit with It is arranged at the probe electrical connection of maintaining part.
Application examples 13
In the electronic component handling apparatus of the present invention, it is preferable that handle part and upper is reclaimed in above-mentioned supply State delivery section and be respectively arranged with 2.
Thus, two delivery section and two supplies are reclaimed handle part and are mended the most in time Fill, it is possible to increase the quantity of the electronic unit of time per unit conveying further.
Application examples 14
The electronic component inspection device of the present invention is characterised by possessing: can configure and carry many The delivery section of individual electronic unit, multiple above-mentioned electronic unit can be held and they are configured at above-mentioned The supply handle part of delivery section, multiple above-mentioned electronic unit can be held and carry out supplying and reclaim Supply is reclaimed handle part and checks the inspection portion of above-mentioned electronic unit, above-mentioned supply handle part Electronic unit holds spacing and can be adjusted to identical with the electronic unit disposition interval of above-mentioned delivery section, The electronic unit of the electronic unit holding above-mentioned delivery section of gap ratio that handle part is reclaimed in above-mentioned supply is joined Putting spacing big, multiple above-mentioned electronic units are configured at above-mentioned delivery section by above-mentioned supply handle part, on State supply recovery handle part to be taken out from above-mentioned delivery section several times by multiple above-mentioned electronic units.
Thereby, it is possible to increase the quantity of the electronic unit of time per unit conveying.Thereby, it is possible to subtract The inspection portion out-of-operation time less, increase the inspection quantity of the electronic unit of time per unit.
Application examples 15
The electronic component inspection device of the present invention is characterised by possessing: can configure and carry many The delivery section of individual electronic unit, the multiple above-mentioned electronic unit being configured at above-mentioned delivery section can be held And they are taken out from above-mentioned delivery section recovery handle part, multiple above-mentioned electronic unit can be held And carry out the supply recovery handle part supplying and reclaiming and the inspection checking above-mentioned electronic unit Portion, the electronic unit of above-mentioned recovery handle part holds spacing and can be adjusted to and the electricity of above-mentioned delivery section Subassembly disposition interval is identical, and the electronic unit holding gap ratio that handle part is reclaimed in above-mentioned supply is above-mentioned The electronic unit disposition interval of delivery section is big, and above-mentioned supply reclaims handle part by multiple above-mentioned ministrys of electronics industry Part is configured at above-mentioned delivery section several times, above-mentioned recovery handle part by multiple above-mentioned electronic units from upper State delivery section to take out.
Thereby, it is possible to increase the quantity of the electronic unit of time per unit conveying.Thereby, it is possible to subtract The inspection portion out-of-operation time less, increase the inspection quantity of the electronic unit of time per unit.
Application examples 16
In the electronic component inspection device of the present invention, it is preferable that handle part is reclaimed in above-mentioned supply can be right Above-mentioned inspection portion supplies and reclaims above-mentioned electronic unit.
Thereby, it is possible to utilize supply to reclaim handle part, electronic unit supply to inspection portion and is examined Look into, and supply can be utilized after inspection to reclaim handle part by electronic unit from the recovery of inspection portion.
Accompanying drawing explanation
Fig. 1 is the brief vertical view of the first embodiment of the electronic component inspection device representing the present invention Figure.
Fig. 2 is the block diagram of the electronic component inspection device shown in Fig. 1.
Fig. 3 is bowing of the main portions in the inspection portion representing the electronic component inspection device shown in Fig. 1 View.
Fig. 4 is cuing open of the main portions in the inspection portion representing the electronic component inspection device shown in Fig. 1 View.
Fig. 5 is the main portions of the device supply unit representing the electronic component inspection device shown in Fig. 1 Sectional view.
Fig. 6 is the main portions of the device recoverer representing the electronic component inspection device shown in Fig. 1 Sectional view.
Fig. 7 is the second device delivery head main representing the electronic component inspection device shown in Fig. 1 The sectional view at position.
Fig. 8 is the first device delivery head main representing the electronic component inspection device shown in Fig. 1 The sectional view at position.
Fig. 9 is the 3rd device delivery head main representing the electronic component inspection device shown in Fig. 1 The sectional view at position.
Figure 10 is for the electronic component inspection device shown in explanatory diagram 1 and the existing ministry of electronics industry Part checks the figure of the action of device.
Figure 11 is for the electronic component inspection device shown in explanatory diagram 1 and existing electronic unit Check the figure of the action of device.
Figure 12 is for the electronic component inspection device shown in explanatory diagram 1 and the existing ministry of electronics industry Part checks the figure of the action of device.
Figure 13 is for the electronic component inspection device shown in explanatory diagram 1 and the existing ministry of electronics industry Part checks the figure of the action of device.
Figure 14 is for the electronic component inspection device shown in explanatory diagram 1 and the existing ministry of electronics industry Part checks the figure of the action of device.
Figure 15 is for the electronic component inspection device shown in explanatory diagram 1 and the existing ministry of electronics industry Part checks the figure of the action of device.
Figure 16 is for the electronic component inspection device shown in explanatory diagram 1 and the existing ministry of electronics industry Part checks the figure of the action of device.
Figure 17 is to represent the electronic component inspection device shown in Fig. 1 and the inspection of existing electronic unit Look into the chart of time required for the action of device.
Figure 18 is briefly bowing of the second embodiment of the electronic component inspection device representing the present invention View.
Detailed description of the invention
Hereinafter, shown with reference to the accompanying drawings embodiment describes the electronic unit conveying dress of the present invention in detail Put and electronic component inspection device.
First embodiment
Fig. 1 is the brief vertical view of the first embodiment of the electronic component inspection device representing the present invention Figure.Fig. 2 is the block diagram of the electronic component inspection device shown in Fig. 1.Fig. 3 is to represent shown in Fig. 1 The top view of main portions in inspection portion of electronic component inspection device.Fig. 4 is to represent Fig. 1 institute The sectional view of the main portions in the inspection portion of the electronic component inspection device shown.Fig. 5 is to represent Fig. 1 The sectional view of the main portions of the device supply unit of shown electronic component inspection device.Fig. 6 is table The sectional view of the main portions of the device recoverer of the electronic component inspection device shown in diagram 1.Figure 7 is the main portions of the second device delivery head representing the electronic component inspection device shown in Fig. 1 Sectional view.Fig. 8 is the first device delivery head representing the electronic component inspection device shown in Fig. 1 The sectional view of main portions.Fig. 9 is the 3rd device representing the electronic component inspection device shown in Fig. 1 The sectional view of the main portions of part delivery head.Figure 10～Figure 16 is namely for shown in explanatory diagram 1 Electronic component inspection device and the figure of action of existing electronic component inspection device.Figure 17 It is represent the electronic component inspection device shown in Fig. 1 and existing electronic component inspection device dynamic The chart of the time required for work.Figure 18 is the of the electronic component inspection device representing the present invention The schematic top of two embodiments.
Additionally, below, for convenience of description, as it is shown in figure 1,3 mutually orthogonal axles are set For X-axis, Y-axis and Z axis (Figure 18 is too).It addition, X-axis will be comprised and Y-axis exists Interior X/Y plane is set to level, and Z axis is set to vertical.It addition, the side of X-axis will be parallel to To being referred to as " X-direction ", the direction being parallel to Y-axis is referred to as " Y-direction ", is parallel to Z axis Direction is referred to as " Z-direction ".It addition, the direction of the arrow by each to X-axis, Y-axis and Z axis axle It is referred to as positive side, the direction contrary with arrow is referred to as minus side.It addition, by the conveying side of electronic unit To upstream side referred to as " upstream side ", downstream is referred to as in " downstream ".It addition, at this " level " mentioned in application specification is not limited to perfectly level, as long as not hindering electronic unit Conveying, also comprise relative to the level state that somewhat (e.g., less than about 5 °) tilt.
It addition, below, for convenience of description, the upside in Fig. 4～Fig. 9 is referred to as " on " or Person " top ", downside is referred to as D score or " lower section ", and right side is referred to as " right ", and left side is referred to as " left ".
Additionally, in Figure 10～Figure 16, in order to make it easy to understand, existing inspection device is also marked Note checks, with present embodiment, the reference that device 1 is identical.
Inspection device (electronic component inspection device) 1 shown in Fig. 1 is e.g. used for checking/testing (hereinafter referred to as " checking ") BGA (Ball grid array) encapsulation, LGA (Land grid Array) IC device, LCD (Liquid Crystal Display), the CIS (CMOS such as encapsulation Image Sensor) etc. the device of electrical characteristics of electronic unit.Below additionally, for convenience of description, To use IC device to illustrate as the situation of above-mentioned electronic unit carrying out checking for representative, It is designated as " IC device 90 ".
As it is shown in figure 1, check device 1 be divided into pallet supply area A1, device supply area (with The most referred to as " supply area ") A2, inspection area A3, device recovery zone are (hereinafter referred to as " recovery zone ") A4, pallet removing region A5.Above-mentioned each region each other by not shown wall portion, Shutters etc. separate.And, supply area A2 becomes and is divided by wall portion, shutter etc. First Room R1, it addition, inspection area A3 becomes second divided by wall portion, shutter etc. Room R2, it addition, recovery zone A4 becomes the 3rd Room divided by wall portion, shutter etc. R3.It addition, the first Room R1 (supply area A2), the second Room R2 (inspection area A3) with And the 3rd Room R3 (recovery zone A4) be respectively structured as being able to ensure that air-tightness, thermal insulation.By This, the first Room R1, the second Room R2 and the 3rd Room R3 be able to maintain as far as possible humidity, Temperature.Additionally, respectively by the humidity specified and regulation in the first Room R1 and the second Room R2 Temperature control.
IC device 90 removes region A5 in order via above-mentioned from pallet supply area A1 to pallet Each region, checks at the inspection area A3 of midway.So check that device 1 possesses in each district Territory conveying IC device 90 also has the electronic component handling apparatus in control portion 80, in inspection area The inspection portion 16 that checks and not shown inspection control portion is carried out in A3.Additionally, checking In device 1, the structure in addition to inspection portion 16 and inspection control portion constitute the ministry of electronics industry Part conveyer device.
Pallet supply area A1 is the multiple IC devices 90 being supplied to be arranged with the state of inspection The region of pallet 200.In the A1 of pallet supply area, it is possible to the multiple pallet of stacking 200.
Supply area A2 is by the multiple IC devices on the pallet 200 from pallet supply area A1 Part 90 is fed separately to the region of inspection area A3.Additionally, to cross over pallet supply area A1 The the first conveyor pallet structure carrying pallet 200 one by one it is provided with the mode of supply area A2 11A, the second conveyor pallet structure 11B.
Supply area A2 is provided with the temperature adjustment portion as the configuration section configuring IC device 90 (immersion plate) the 12, first device delivery head (supply handle part) 13 and the conveying of the 3rd pallet Mechanism 15.
Temperature adjustment portion 12 is to heat or cool down multiple IC device 90 to be adjusted by this IC device 90 Whole (control) is the device of the temperature being suitable to inspection.That is, temperature adjustment portion 12 is configuration IC device Part 90 temperature control unit (parts) that this IC device 90 can be heated and cool down. In the construction shown in fig. 1, temperature adjustment portion 12 configures along Y-direction, is fixed with 2.And And, it is moved to (conveying comes) by the first conveyor pallet structure 11A from pallet supply area A1 Pallet 200 on IC device 90 carried, be placed in a certain temperature adjustment portion 12.
First device delivery head 13 is supported in the A2 of supply area can in X direction (first Direction), Y-direction (third direction) and Z-direction (second direction) mobile.Thus, The pallet 200 that one device delivery head 13 is responsible for from pallet supply area A1 is moved to adjusts with temperature The conveying of the IC device 90 between portion 12 and temperature adjustment portion 12 and device supply unit described later The conveying of the IC device 90 between 14.
As shown in Figure 8, the first device delivery head 13 has as the holding holding IC device 90 Multiple hands unit 131 in portion.It is not particularly limited as long as the quantity of this hands unit 131 is multiple, In the present embodiment, as an example, the situation of 8 is described.Additionally, 8 hands unit 131 in ranks shape, and X-direction is configured with 4, and Y-direction is configured with 2, is only capable of seeing in Fig. 8 4 hands unit 131 to 1 row arrangement in X direction.The structure of each hands unit 131 is identical, So following one hands unit 131 of explanation typically.It addition, in the explanation of action, represent Property 4 hands unit 131 can being seen of ground explanation.Hands unit 131 possesses adsorption nozzle 132, IC device 90 is held by absorption.That is, hands unit 131 is joined in the leading section of adsorption nozzle 132 Under the state being equipped with IC device 90, drive not shown pumping to draw air (fluid), make absorption The inner chamber of nozzle 132 becomes negative pressure state, thus utilizes the leading section of adsorption nozzle 132 to hold and (inhale Attached holding) IC device 90.It addition, drive not shown other pump supply air by adsorption nozzle The negative pressure state of the inner chamber of 132 releases, thus the IC device that 132, adsorbed nozzle is hold 90 decontrol.
It addition, the spacing of hands unit 131 (electronic unit holding spacing) P5 can regulate (adjustment), Can suitably regulate.In the present embodiment, in inspection portion 16 and device supply unit 14 Spacing P5 of hands unit 131 is regulated (setting) is and between the maintaining part 161 in inspection portion 16 Away from (electronic unit disposition interval) P1 and the suction of the hands unit 175 of the second device delivery head 17 The spacing (electronic unit holding spacing) the 1/2 of P4 (b) of attached nozzle 176, device supply unit Spacing (electronic unit disposition interval) situation identical for P2 (a) in the pocket portion 141 of 14 is said Bright.
3rd conveyor pallet structure 15 is the sky of the state being removed by whole IC devices 90 The mechanism that pallet 200 carries in X direction.And, after this conveying, empty pallet 200 passes through Second conveyor pallet structure 11B returns pallet supply area A1 from supply area A2.
Inspection area A3 is the region checking IC device 90.In this inspection area, A3 is provided with Device supply unit as the delivery section (supply delivery section) that can configure and carry IC device 90 (supply shuttle) 14, inspection portion the 16, second device delivery head (supply reclaim handle part) 17, with And the device as the delivery section (recovery delivery section) that can configure and carry IC device 90 reclaims Portion's (recovery shuttle) 18.
Device supply unit 14 has the configuration plate of configuration IC device 90 and can move in X direction Dynamic device supply unit main body, configuration plate is can be arranged at device supply unit master in the way of loading and unloading Body.This device supply unit 14 is defeated by being adjusted the IC device 90 after (temperature controls) by temperature Delivering to the device near inspection portion 16, being supported to can be in supply area A2 and inspection area Move in X direction between A3.IC device 90 in temperature adjustment portion 12 is carried by the first device 13 carry and are placed in device supply unit 14.Additionally, in device supply unit 14, with temperature Adjustment portion 12 is identical, it is possible to heats or cools down IC device 90, is adjusted by this IC device 90 For being suitable to the temperature checked.
Illustrate in greater detail device supply unit 14, as it is shown in figure 5, upper at device supply unit 14 Surface configuration has multiple recesses that is the pocket portion (electronic unit of storage (configuration) IC device 90 Configuration section) 141.Each IC device 90 is incorporated in each pocket portion 141, is thus configured at device and supplies To portion 14.
The shape in each pocket portion 141, size (size) and configuration (position) are according to the IC checked The shape of device 90, size (size), the configuration etc. of maintaining part 161 in inspection portion 16 set. In the present embodiment, to the maintaining part that spacing P2 in pocket portion 141 is set as inspection portion 16 The situation of the 1/2 of spacing P4 of spacing P1 of 161 and the adsorption nozzle 176 of hands unit 175 Illustrate.
If additionally, spacing P2 (a) and spacing P1 and a magnitude relationship of spacing P4 (b) It is not particularly limited greatly than spacing P2 away from P1 and spacing P4, preferably P1/P2 and P4 B ()/P2 (a) is the integer of more than 2.
It addition, in the present embodiment, the Z-direction from Fig. 1 is observed, the profile in pocket portion 141 It is the shape i.e. tetragon corresponding with the profile of IC device 90.
As long as be not particularly limited it addition, the quantity in pocket portion 141 is multiple, in present embodiment In, as an example, the situation that 8 (4 × 2) are individual is described.Additionally, 8 pocket portions 141 in Ranks shape, X-direction is configured with 4, and Y-direction is configured with 2, is only capable of seeing along X in Fig. 5 4 pocket portions 141 of the 1 row arrangement in direction.It addition, in the explanation of action, say typically Bright 4 the pocket portions 141 that can be seen.
Inspection portion 16 is the unit of the electrical characteristics checking/test IC device 90, is i.e. checking IC The parts of this IC device 90 are kept in the case of device 90.It is provided with in inspection portion 16 and is keeping The multiple probes electrically connected with the terminal of this IC device 90 under the state having IC device 90.And, The terminal of IC device 90 electrically connects (contact) with probe, carries out IC device 90 via probe Check.The inspection of IC device 90 is had according to the not shown checker being connected with inspection portion 16 In the standby storage part checking control portion, the program of storage is carried out.Additionally, in inspection portion 16, Identical with temperature adjustment portion 12, it is possible to heat or cool down IC device 90, by this IC device 90 It is adjusted to the temperature being suitable to check.
Illustrate in greater detail inspection portion 16, as shown in Figure 3 and 4, upper in inspection portion 16 Surface configuration has multiple recesses that is the maintaining part (ministry of electronics industry of storage (holding) IC device 90 Part configuration section) 161.Each IC device 90 is incorporated in each maintaining part 161, is thus configured at inspection Look into portion 16.
The shape of each maintaining part 161, size (size) and configuration (position) are according to inspection The shape of IC device 90, size (size) etc. set.In the present embodiment, by maintaining part Spacing P1 of 161 is set as the adsorption nozzle 176 of the hands unit 175 with the second device delivery head 17 Spacing P4 identical.
Additionally, in the present embodiment, the Z-direction from Fig. 1 observes (vertical view), IC device The profile of 90 is tetragon, and therefore, the profile of maintaining part 161 is and the profile of IC device 90 Corresponding shape i.e. tetragon.
As long as be not particularly limited it addition, the quantity of maintaining part 161 is multiple, this embodiment party In formula, as an example, the situation of 8 is described.Additionally, 8 maintaining parts 161 are in ranks Shape, X-direction is configured with 4, and Y-direction is configured with 2.It addition, in the explanation of action, 4 maintaining parts 161 that 1 row in X direction arrange are described typically.
Second device delivery head 17 is supported in the A3 of inspection area can be along Y-direction and Z Direction is moved.It addition, the device that the second device delivery head 17 can will be moved to from supply area A2 IC device 90 on part supply unit 14 carries and is placed in inspection portion 16, it addition, can be by IC device 90 in inspection portion 16 carries and is placed on device recoverer 18.It addition, in inspection In the case of looking into IC device 90, the second device delivery head 17 presses IC device 90 to inspection portion 16, IC device 90 is thus made to abut with inspection portion 16.Thus, as it has been described above, IC device 90 Terminal electrically connects with the probe in inspection portion 16.
As it is shown in fig. 7, the second device delivery head 17 has multiple hands unit 175 as holding IC The handle part of device 90.It is not particularly limited as long as the quantity of this hands unit 175 is multiple, In the present embodiment, as an example, the situation of 8 is described.Additionally, 8 hands unit 175 in ranks shape, and X-direction is configured with 4, and Y-direction is configured with 2, is only capable of seeing in Fig. 7 4 hands unit 175 to 1 row arrangement in X direction.The structure of each hands unit 175 is identical, So following one hands unit 175 of explanation typically.It addition, in the explanation of action, represent Property 4 hands unit 175 can being seen of ground explanation.Hands unit 175 possesses adsorption nozzle 176, IC device 90 is held by absorption.That is, hands unit 175 is joined in the leading section of adsorption nozzle 176 Under the state being equipped with IC device 90, drive not shown pumping to draw air (fluid), make absorption The inner chamber of nozzle 176 becomes negative pressure state, thus utilizes the leading section of adsorption nozzle 176 to hold and (inhale Attached holding) IC device 90.It addition, drive not shown other pump supply air, absorption is sprayed The negative pressure state of the inner chamber of mouth 176 releases, thus the IC device that adsorbed nozzle 176 is held 90 decontrol.
It addition, by spacing (the electronic unit holding spacing) P4 of hands unit 175 and inspection portion 16 Spacing P1 of maintaining part 161 be set as identical.
It addition, in each hands unit 175, identical with temperature adjustment portion 12, it is possible to heating or Cooling IC device 90, is adjusted to the temperature being suitable to check by IC device 90.
Device recoverer 18 has the configuration plate of configuration IC device 90 and can move in X direction Dynamic device recoverer main body, configuration plate is can be arranged at device recoverer master in the way of loading and unloading Body.This device recoverer 18 is that the IC device 90 inspection in inspection portion 16 finished carries To the device of recovery zone A4, be supported to can inspection area A3 and recovery zone A4 it Between move in X direction.IC device 90 in inspection portion 16 is defeated by the second device delivery head 17 Send and be placed in device recoverer 18.
Illustrate in greater detail device recoverer 18, as shown in Figure 6, upper at device recoverer 18 Surface configuration has the pocket portion (electronic unit of the multiple recesses as storage (configuration) IC device 90 Configuration section) 181.Each IC device 90 is incorporated in each pocket portion 181, is thus configured at device and returns Receipts portion 18.
The shape in each pocket portion 181, size (size) and configuration (position) are according to the IC checked The shape of device 90, size (size), the configuration etc. of maintaining part 161 in inspection portion 16 set. In the present embodiment, set by spacing (electronic unit disposition interval) P3 in pocket portion 181 Adsorption nozzle 176 for spacing P1 of maintaining part 161 in inspection portion 16 and hands unit 175 The situation of the 1/2 of spacing P4 illustrates.
As long as additionally, spacing P3 (a) and spacing P1 and the magnitude relationship of spacing P4 (b) Spacing P1 and spacing P4 are not particularly limited greatly than spacing P3, preferably P1/P3 and P4 B ()/P3 (a) is the integer of more than 2.
It addition, in the present embodiment, the Z-direction from Fig. 1 is observed, the profile in pocket portion 181 It is the shape i.e. tetragon corresponding with the profile of IC device 90.
As long as be not particularly limited it addition, the quantity in pocket portion 181 is multiple, in present embodiment In, as an example, the situation that 8 (4 × 2) are individual is described.Additionally, 8 pocket portions 181 in Ranks shape, X-direction is configured with 4, and Y-direction is configured with 2, is only capable of seeing along X in Fig. 6 4 pocket portions 181 of the 1 row arrangement in direction.It addition, in the explanation of action, say typically Bright 4 the pocket portions 181 that can be seen.
Recovery zone A4 is the region reclaimed and check the IC device 90 terminated.In this recovery zone A4 is provided with recovery pallet the 19, the 3rd device delivery head (recovery handle part) 20 and the 6th Conveyor pallet structure 21.It addition, also prepared the pallet 200 of sky at recovery zone A4.
Recovery pallet 19 is fixed in the A4 of recovery zone, in the construction shown in fig. 1, along X Direction is configured with 3.It addition, the pallet 200 of sky is configured with 3 the most in X direction.And, The IC device 90 moved on the device recoverer 18 of recovery zone A4 is carried and is placed in Any one in the pallet 200 of above-mentioned recovery pallet 19 and sky.Thus, according to inspection Result reclaims and classification IC device 90.
3rd device delivery head 20 be supported in the A4 of recovery zone can in X direction, Y side To and Z-direction move.Thus, the 3rd device delivery head 20 can be by IC device 90 from device Part recoverer 18 is delivered to recovery pallet 19, empty pallet 200.
As it is shown in figure 9, the 3rd device delivery head 20 has multiple hands unit 201 as holding IC The handle part of device 90.It is not particularly limited as long as the quantity of this hands unit 201 is multiple, In the present embodiment, as an example, the situation of 8 is described.Additionally, 8 hands unit 201 in ranks shape, and X-direction is configured with 4, and Y-direction is configured with 2, is only capable of seeing in Fig. 9 4 hands unit 201 to 1 row arrangement in X direction.The structure of each hands unit 201 is identical, So following one hands unit 201 of explanation typically.It addition, in the explanation of action, represent Property 4 hands unit 201 can being seen of ground explanation.Hands unit 201 possesses adsorption nozzle 202, IC device 90 is held by absorption.That is, hands unit 201 is joined in the leading section of adsorption nozzle 202 Under the state being equipped with IC device 90, drive not shown pumping to draw air (fluid), make absorption The inner chamber of nozzle 202 becomes negative pressure state, thus utilizes the leading section of adsorption nozzle 202 to hold and (inhale Attached holding) IC device 90.It addition, drive not shown other pump supply air, absorption is sprayed The negative pressure state of the inner chamber of mouth 202 releases, thus the IC device that 202, adsorbed nozzle is hold Part 90 is decontroled.
It addition, the spacing of hands unit 201 (electronic unit holding spacing) P6 can regulate (adjustment), Can suitably adjust.In the present embodiment, in inspection portion 16 and device recoverer 18 Spacing P6 of hands unit 201 is regulated (setting) is and between the maintaining part 161 in inspection portion 16 Away from P1 and spacing P4 of the adsorption nozzle 176 of the hands unit 175 of the second device delivery head 17 1/2, situation that spacing P3 (a) in the pocket portion 181 of device recoverer 18 is identical illustrates.
6th conveyor pallet structure 21 is will to remove, from pallet, the empty pallet that region A5 is moved to 200 mechanisms carried in X direction.And, after this conveying, empty pallet 200 is configured at back Receive the position of IC device 90, become any one in above-mentioned 3 empty pallets 200.
It is to reclaim and remove to be arranged with the multiple IC devices checking complete state that pallet removes region A5 The region of the pallet 200 of 90.In pallet removes region A5, it is possible to the multiple pallet of stacking 200.
It addition, in the way of crossing over recovery zone A4 and pallet removing region A5, be provided with one by one 4th conveyor pallet structure 22A, the 5th conveyor pallet structure 22B of conveying pallet 200.
4th conveyor pallet structure 22A is will to be placed with the pallet checking complete IC device 90 200 are delivered to pallet from recovery zone A4 removes the mechanism of region A5.5th conveyor pallet structure 22B is that from pallet, the empty pallet 200 being used for reclaiming IC device 90 is removed region A5 conveying Mechanism to recovery zone A4.
The control portion that checks of above-mentioned checker according to being such as stored in the program of not shown storage part, Carry out being configured at the inspection etc. of the electrical characteristics of the IC device 90 in inspection portion 16.
It addition, as in figure 2 it is shown, check device 1 have control portion 80 and with control portion 80 electricity Connect and carry out checking each operating portion 6 operated of device 1.Control portion 80 such as controls the first torr Disk carrying mechanism 11A, the second conveyor pallet structure 11B, temperature adjustment portion the 12, first device are defeated Send 13, device supply unit the 14, the 3rd conveyor pallet structure 15, inspection portion the 16, second device Delivery head 17, device recoverer the 18, the 3rd device delivery head the 20, the 6th conveyor pallet structure 21, Each portions such as the 4th conveyor pallet structure 22A, the 5th conveyor pallet structure 22B, display part 62 Drive.
It addition, operating portion 6 has input unit 61 and the display part of display image carrying out each input 62.Input unit 61 is not particularly limited, such as, can enumerate keyboard, mouse etc..It addition, display Portion 62 is not particularly limited, such as, can enumerate display panels, organic EL display panel etc.. The operation of the operating portion 6 of operator (operator) such as makes cursor move by operation inputting part 61 Move to the position respectively operating button (icon) shown on display part 62 and select (click) Complete.
Additionally, input unit 61 is not limited to said structure, such as, can enumerate the mechanical types such as button Operation button etc..It addition, operating portion 6 is not limited to said structure, such as can enumerate can Carry out the device etc. of the display of the inputs such as touch panel and image.Additionally, by aforesaid operations portion 6 Display part 62 constitute reporting unit.
It follows that the action when IC device 90 of conveying inspection device 1 is described.
It addition, in order to make it easy to understand, the most also illustrate to carry the IC device of existing inspection device Action when 90.
Premise checks spacing P1 and second device of the maintaining part 161 in the inspection portion 16 of device 1 Spacing P4 of the adsorption nozzle 176 of the hands unit 175 of delivery head 17 is more than the first device delivery head Maximum spacing and the 3rd device of spacing P5 of the adsorption nozzle 132 of the hands unit 131 of 13 are defeated Send the maximum spacing of spacing P6 of the adsorption nozzle 202 of the hands unit 201 of 20, in this situation Under, check that device 1 can increase the quantity of the IC device 90 of time per unit conveying and constitute.
First, the size in each portion checking device 1 of present embodiment will be as it has been described above, portion will be checked Spacing P1 of the maintaining part 161 of 16 and the absorption of the hands unit 175 of the second device delivery head 17 Spacing P4 of nozzle 176 is set as identical.Additionally, P1 and P4 e.g. 60mm.
It addition, the pocket portion of spacing P2 in pocket portion 141 of device supply unit 14, device recoverer 18 Spacing P3 of 181, the hands unit 131 of the first device delivery head 13 adsorption nozzle 132 between Away from P5, the spacing P6 phase of the adsorption nozzle 202 of the hands unit 201 of the 3rd device delivery head 20 With, this spacing P2, P3, P5 and P6 are the 1/2 of spacing P1 and P4.Additionally, P2, P3, P5 and P6 e.g. 30mm.
On the other hand, shown in the size such as Figure 10 (b) in each portion of existing inspection device, by device Spacing P12 in pocket portion 141 of part supply unit 14, inspection portion 16 maintaining part 161 spacing P11, Spacing P13 in pocket portion 181 of device recoverer 18, the hands unit 175 of the second device delivery head 17 Spacing P14 of adsorption nozzle 176 be set as identical.
Additionally, P11, P12, P13 and P14 e.g. 60mm.
It addition, spacing P15 of the adsorption nozzle 132 of the hands unit 131 of the first device delivery head 13, It is identical with spacing P16 of the adsorption nozzle 202 of the hands unit 201 of the 3rd device delivery head 20, This spacing P15 and P16 be spacing P11, the 1/2 of P12, P13 and P14.Additionally, P15 And P16 e.g. 30mm.
First, the action of existing inspection device is described.
[operation 2-1]
In existing inspection device, as shown in Figure 10 (b), the first device delivery head 13 utilizes Each hands unit 131, holds the IC device 90 being configured at temperature adjustment portion 12, towards Z The positive side shifting in direction, at least 1 direction towards X-direction and Y-direction is moved and is i.e. supplied towards device The top in portion 14 is moved, and moves towards Z-direction minus side, by two IC in 4 IC devices 90 Device 90 is configured at two pocket portions 141 in 4 pocket portions 141 of device supply unit 14.Should Time required for operation 2-1 is set to " 1 ".Additionally, the above-mentioned required time is without " second " Etc. unit, but represent with relative value, it addition, be not accurate value but rough value.
[operation 2-2]
It follows that as shown in Figure 11 (b), the first device delivery head 13 towards the positive side shifting of Z-direction, Towards the positive side shifting of X-direction, move towards Z-direction minus side, remaining two IC devices 90 are joined It is placed in remaining two pocket portions 141 of device supply unit 14.By the time required for this operation 2-2 It is set to " 1 ".So, in existing inspection device, the first device delivery head 13 will be hold 4 (multiple) IC devices 90 points 2 times (repeatedly) be configured at each of device supply unit 14 Pocket portion 141.
[operation 2-3]
It follows that as shown in Figure 12 (b), device supply unit 14 is towards the positive side shifting of X-direction i.e. Lower section towards the second device delivery head 17 is moved.Time required for this operation 2-3 is set to “0.5”。
[operation 2-4]
It follows that as shown in Figure 13 (b), the second device delivery head 17 moves towards Z-direction minus side, Utilize each hands unit 175, each IC device 90 being configured at device supply unit 14 is held (taking-up), towards the positive side shifting of Z-direction, moves i.e. so that each IC device 90 towards Y-direction minus side The mode of the top being positioned at each maintaining part 161 in inspection portion 16 moves, and moves towards Z-direction minus side, Each IC device 90 is configured at each maintaining part 161 in inspection portion 16.Required for this operation 2-4 Time be set to " 0.5 ".So, in existing inspection device, the second device delivery head 17 Take out unified for 4 IC devices 90 from each pocket portion 141 of device supply unit 14, and unification is joined It is placed in each maintaining part 161 in inspection portion 16.
Additionally, it follows that utilize the second device delivery head 17 to press each IC to each maintaining part 161 Device 90 and utilize inspection portion 16 to carry out the inspection of each IC device 90.
[operation 2-5]
It follows that as shown in Figure 14 (b), the second device delivery head 17 utilizes each hands unit 175, The IC device 90 of each maintaining part 161 being configured at inspection portion 16 is held, towards Z-direction Positive side shifting, i.e. moves towards the top of device recoverer 18, towards Z side towards the positive side shifting of Y-direction Move to minus side, each IC device 90 is configured at each pocket portion 181 of device recoverer 18.Will Time required for this operation 2-5 is set to " 0.5 ".So, in existing inspection device, the Unified for 4 the IC devices 90 each maintaining part 161 from inspection portion 16 is taken by two device delivery heads 17 Go out, and the unified each pocket portion 181 being configured at device recoverer 18.
[operation 2-6]
It follows that as shown in Figure 15 (b), device recoverer 18 is towards the positive side shifting of X-direction.
And, the 3rd device delivery head 20 moves towards at least 1 direction of X-direction and Y-direction Dynamic i.e. top towards device recoverer 18 is moved, and moves towards Z-direction minus side, utilizes 4 hands lists 4 hands unit 201 in unit 201, to 4 the IC devices 90 being configured at device recoverer 18 In two IC devices 90 hold.
Time required for this operation 2-6 is set to " 1 ".
[operation 2-7]
It follows that as shown in Figure 16 (b), the 3rd device delivery head 20 towards the positive side shifting of Z-direction, Towards the positive side shifting of X-direction, move towards Z-direction minus side, remaining two to device recoverer 18 Individual IC device 90 holds.Time required for this operation 2-7 is set to " 1 ".So, In existing inspection device, the 3rd device delivery head 20 points will be configured at device recoverer 2 times 4 IC devices 90 of 18 take out.
Additionally, it follows that the 3rd device delivery head 20 is according to checking result, by each IC device 90 are delivered to some in the pallet 200 of recovery pallet 19 and sky.
Here, to the time ratio of configuration after the second device delivery head 17 holds IC device 90 First device delivery head 13 is short to the time of configuration after holding IC device 90.One of its reason It is at the first device delivery head 13 in the case of device supply unit 14 configures IC device 90, the One device delivery head 13 not only moves along Z-direction, moves the most in X direction, and at the second device Delivery head 17 is in the case of device supply unit 14 takes out IC device 90 and to device recoverer In the case of 18 configuration IC devices 90, the second device delivery head 17 moves along Z-direction, device Supply unit 14 and device recoverer 18 move in X direction.
Equally, to the time ratio of configuration after the second device delivery head 17 holds IC device 90 3rd device delivery head 20 is short to the time of configuration after holding IC device 90.One of its reason It is configured at the situation of IC device 90 to device recoverer 18 also in the 3rd device delivery head 20 Under, the 3rd device delivery head 20 not only moves along Z-direction, moves the most in X direction, and Two device delivery heads 17 are in the case of device supply unit 14 takes out IC device 90 and to device In the case of recoverer 18 configures IC device 90, the second device delivery head 17 moves along Z-direction, Device supply unit 14 and device recoverer 18 move in X direction.
But, in existing inspection device, the second device delivery head 17 is by 4 IC devices 90 unified each maintaining parts 161 from inspection portion 16 are taken out, and unification is configured at device recoverer 18 Each pocket portion 181, the first device delivery head 13 points 2 times is by 4 the IC devices 90 that hold It is configured at each pocket portion 141 of device supply unit 14, it addition, the 3rd device delivery head 20 points 2 times 4 the IC devices 90 being configured at device recoverer 18 are taken out.That is, it needs to the time short The action frequency of two device delivery heads 17 is 1 time when the supply of IC device 90, at IC device 90 is 1 time when reclaiming, and i.e. adds up to 2 times (operation 2-4, operation 2-5), but requires time for long The action frequency of the first device delivery head 13 and the 3rd device delivery head 20 is respectively 2 times, i.e. Add up to 4 times (operation 2-1, operation 2-2, operation 2-6, operation 2-7).Therefore, existing Check that in device, the time required for the conveying of IC device 90 is elongated, time per unit conveying The quantity of IC device 90 reduces.
It follows that the action checking device 1 of explanation present embodiment.
[operation 1-1]
In the inspection device 1 of present embodiment, as shown in Figure 10 (a), the first device conveying 13 utilize each hands unit 131, and the IC device 90 being configured at temperature adjustment portion 12 is carried out handle Holding, towards the positive side shifting of Z-direction, i.e. court is moved at least 1 direction towards X-direction and Y-direction The top of device supply unit 14 is moved, and moves towards Z-direction minus side, is configured by each IC device 90 Each pocket portion 141 in device supply unit 14.Time required for this operation 1-1 is set to " 1 ". So, in checking device 1, the first device delivery head 13 is by 4 (multiple) that hold The unified each pocket portion 141 being configured at device supply unit 14 of IC device 90.
[operation 1-2]
It follows that as shown in Figure 11 (a), device supply unit 14 is towards the i.e. court of the positive side shifting of X-direction The lower section of the second device delivery head 17 is moved.
It addition, the second device delivery head 17 moves towards Z-direction minus side, utilize 4 hands unit Two hands unit 175 in 175, in 4 the IC devices 90 being configured at device supply unit 14 Two IC devices 90 carry out holding (taking-up).Time required for this operation 1-2 is set to “0.5”。
[operation 1-3]
It follows that as shown in Figure 12 (a), the second device delivery head 17 towards the positive side shifting of Z-direction, Device supply unit 14 is towards the positive side shifting of X-direction, and the second device delivery head 17 is towards Z-direction minus side Mobile, utilize remaining two hands unit 175, to being configured at remaining the two of device supply unit 14 Individual IC device 90 holds.Time required for this operation 1-3 is set to " 0.5 ".So, In checking device 1, the second device delivery head 17 points 2 times (repeatedly) is by 4 (multiple) IC device 90 takes out from each pocket portion 141 of device supply unit 14.
[operation 1-4]
It follows that as shown in Figure 13 (a), the second device delivery head 17 towards the positive side shifting of Z-direction, Move i.e. towards Y-direction minus side so that each IC device 90 is positioned at each maintaining part 161 in inspection portion 16 The mode of top move, move towards Z-direction minus side, each IC device 90 be configured at inspection portion Each maintaining part 161 of 16.Time required for this operation 1-4 is set to " 0.5 ".So, exist Checking in device 1, the second device delivery head 17 is configured at inspection by unified for 4 IC devices 90 Each maintaining part 161 in portion 16.
Additionally, it follows that utilize the second device delivery head 17 to press respectively to each maintaining part 161 IC device 90 and utilize inspection portion 16 to carry out the inspection of each IC device 90.
[operation 1-5]
It follows that as shown in Figure 14 (a), the second device delivery head 17 utilizes each hands unit 175, The IC device 90 of each maintaining part 161 being configured at inspection portion 16 is held, towards Z-direction Positive side shifting, i.e. moves towards the top of device recoverer 18, towards Z side towards the positive side shifting of Y-direction Move to minus side, two IC devices 90 in 4 IC devices 90 are configured at device recoverer Two pocket portions 181 in 4 pocket portions 181 of 18.Time required for this operation 1-5 is set to “0.5”。
[operation 1-6]
It follows that as shown in Figure 15 (a), the second device delivery head 17 towards the positive side shifting of Z-direction, Device recoverer 18 is towards the positive side shifting of X-direction, and the second device delivery head 17 is towards Z-direction minus side Mobile, remaining two IC devices 90 are configured at remaining two pockets of device recoverer 18 Portion 181.Time required for this operation 1-6 is set to " 0.5 ".So, device 1 is being checked In, 4 IC devices 90 points are configured at device recoverer 18 2 times by the second device delivery head 17 Each pocket portion 181.
[operation 1-7]
It follows that as shown in Figure 16 (a), device recoverer 18 is towards the positive side shifting of X-direction.
And, the 3rd device delivery head 20 moves towards at least 1 direction of X-direction and Y-direction Dynamic i.e. top towards device recoverer 18 is moved, and moves towards Z-direction minus side, utilizes each hands unit 201, each IC device 90 being configured at device recoverer 18 is held.By this operation 1-6 The required time is set to " 1 ".So, in checking device 1, the 3rd device delivery head 20 Take out unified for 4 the IC devices 90 being configured at device recoverer 18.
Additionally, it follows that the 3rd device delivery head 20 is according to checking result, by each IC device 90 are delivered to some in the pallet 200 of recovery pallet 19 and sky.
Checking in device 1, the second device delivery head 17 by 4 IC devices 90 points 2 times from Each pocket portion 141 of device supply unit 14 takes out, it addition, joined for 2 times by 4 IC devices 90 points It is placed in each pocket portion 181 of device recoverer 18, and the first device delivery head 13 is by 4 hold The unified each pocket portion 141 being configured at device supply unit 14 of individual IC device 90, it addition, the 3rd device Part delivery head 20 is unified holds 4 the IC devices 90 being configured at device recoverer 18.That is, need The action frequency wanting time short the second device delivery head 17 is 2 when the supply of IC device 90 Secondary, be 2 times when the recovery of IC device 90, i.e. add up to 4 times (operation 1-2, operation 1-3, Operation 1-5, operation 1-6), and require time for the first long device delivery head 13 and the 3rd device The action frequency of delivery head 20 is respectively 1 time, i.e. adds up to 2 times (operation 1-1, operation 1-7). Therefore, in checking device 1, the time required for the conveying of IC device 90 shortens, it is possible to increase Add the quantity of the IC device 90 of time per unit conveying.
The figure of Figure 17 indicates above result.The transverse axis of Figure 17 is the inspection of present embodiment Look into each operation 1-1 of the action of device 1～each operation of the action of 1-7 and existing inspection device 2-1～2-7, the longitudinal axis is the checking required for each operation 1-1 of device 1～1-7 of present embodiment Time required for time (wanted time) and each operation 2-1 of existing inspection device～2-7.
As shown in figure 17, in the inspection device 1 of present embodiment, operation 1-2 and operation The time that 1-6 needs is respectively shortened the institute of operation 2-2 for existing inspection device and operation 2-6 Want the half of time, it follows that in checking device 1, compared with existing inspection device, Time required for the conveying of IC device 90 is shortened.
As described above, according to this inspection device 1, by increasing capacitance it is possible to increase time per unit carries The quantity of IC device 90.
Thereby, it is possible to reduce the inspection portion 16 out-of-operation time, it is possible to increase time per unit The inspection quantity of IC device 90.
Second embodiment
Figure 18 is briefly bowing of the second embodiment of the electronic component inspection device representing the present invention View.
Following description the second embodiment, but in the difference with above-mentioned first embodiment being The heart illustrates, and omits the explanation of identical item.
As shown in figure 18, in the inspection device 1 of the second embodiment, device supply unit 14, Device recoverer 18 and the second device delivery head 17 are configured with 2 along Y-direction respectively.Thus, The quantity of the IC device 90 of time per unit conveying can be increased, by increasing capacitance it is possible to increase time per unit The inspection quantity of IC device 90.
It addition, have 2 device supply units 14, so can supplement in time each other, Equally, there are 2 device recoverers 18, so can supplement in time each other, equally, There are 2 the second device delivery heads 17, so can supplement in time each other.
Thereby, it is possible to increase the quantity of the IC device 90 of time per unit conveying further, it is possible to Increase the inspection quantity of the IC device 90 of time per unit further.
By above such second embodiment, it is possible to play and above-mentioned first embodiment phase Same effect.
Above, illustrate according to embodiment illustrated the electronic component handling apparatus of the present invention with And electronic component inspection device, but the present invention is not limited to this, and Each part can be replaced into tool There is the arbitrary structures of identical function.Alternatively, it is also possible to other arbitrary structures thing additional.
It addition, the present invention can also be by the structure of any more than 2 in the respective embodiments described above (feature) combines.
The explanation of reference
1 ... check device (electronic component inspection device)；11A ... the first conveyor pallet structure； 11B ... the second conveyor pallet structure；12 ... temperature adjustment portion (immersion plate)；13 ... the first device is defeated Send head；131 ... hands unit；132 ... adsorption nozzle；14 ... device supply unit (supply shuttle)；141… Pocket portion；15 ... the 3rd conveyor pallet structure；16 ... inspection portion；161 ... maintaining part；17 ... second Device delivery head；175 ... hands unit；176 ... adsorption nozzle；18 ... device recoverer (recovery shuttle)； 181 ... pocket portion；19 ... recovery pallet；20 ... the 3rd device delivery head；201 ... hands unit；202… Adsorption nozzle；21 ... the 6th conveyor pallet structure；22A ... the 4th conveyor pallet structure；22B… 5th conveyor pallet structure；6 ... operating portion；61 ... input unit；62 ... display part；80 ... control Portion；90 ... IC device；200 ... pallet；A1 ... pallet supply area；A2 ... device supply area (supply area)；A3 ... inspection area；A4 ... device recovery zone (recovery zone)；A5… Pallet removes region；R1 ... the first Room；R2 ... the second Room；R3 ... the 3rd Room；P1～P6 ... Away from；P11～P16 ... spacing.

Claims (16)

1. an electronic component handling apparatus, it is characterised in that possess:
Delivery section, it can configure and carry multiple electronic unit；
Supply handle part, it can hold multiple above-mentioned electronic unit and by multiple above-mentioned electronic units It is configured at above-mentioned delivery section；And
Handle part is reclaimed in supply, and it can hold multiple above-mentioned electronic unit and supply and reclaim multiple Above-mentioned electronic unit,
The electronic unit of above-mentioned supply handle part holds spacing and can be adjusted to and above-mentioned delivery section Electronic unit disposition interval is identical,
The ministry of electronics industry of the electronic unit holding above-mentioned delivery section of gap ratio of handle part is reclaimed in above-mentioned supply Part disposition interval is big,
Multiple above-mentioned electronic units are configured at above-mentioned delivery section by above-mentioned supply handle part,
Above-mentioned supply is reclaimed handle part and is taken from above-mentioned delivery section several times by multiple above-mentioned electronic units Go out.
Electronic component handling apparatus the most according to claim 1, it is characterised in that
Above-mentioned supply handle part is configured at above-mentioned delivery section by unified for multiple above-mentioned electronic units.
Electronic component handling apparatus the most according to claim 1 and 2, it is characterised in that
Above-mentioned supply reclaims handle part from holding to the time configuring above-mentioned electronic unit than above-mentioned confession Short from holding to the time configuring above-mentioned electronic unit to handle part.
4. according to the electronic component handling apparatus according to any one of claims 1 to 3, its feature It is,
Above-mentioned supply handle part can towards configure multiple above-mentioned electronic units direction and with configuration many The direction that the direction of individual above-mentioned electronic unit is orthogonal is moved.
5. an electronic component handling apparatus, it is characterised in that possess:
Delivery section, it can configure and carry multiple electronic unit；
Reclaiming handle part, it can hold and be configured at the multiple above-mentioned electronic unit of above-mentioned delivery section also Multiple above-mentioned electronic units are taken out from above-mentioned delivery section；And
Handle part is reclaimed in supply, and it can hold multiple above-mentioned electronic unit and supply and reclaim multiple Above-mentioned electronic unit,
The electronic unit of above-mentioned recovery handle part holds spacing and can be adjusted to and above-mentioned delivery section Electronic unit disposition interval is identical,
The ministry of electronics industry of the electronic unit holding above-mentioned delivery section of gap ratio of handle part is reclaimed in above-mentioned supply Part disposition interval is big,
Above-mentioned supply is reclaimed handle part and multiple above-mentioned electronic units is configured at above-mentioned conveying several times Portion,
Multiple above-mentioned electronic units are taken out by above-mentioned recovery handle part from above-mentioned delivery section.
Electronic component handling apparatus the most according to claim 5, it is characterised in that
Multiple above-mentioned electronic unit unifications are taken out by above-mentioned recovery handle part from above-mentioned delivery section.
7. according to the electronic component handling apparatus described in claim 5 or 6, it is characterised in that
Above-mentioned supply reclaims handle part from holding to above-mentioned time of the time ratio configuring above-mentioned electronic unit Receive handle part short from holding to the time configuring above-mentioned electronic unit.
8. according to the electronic component handling apparatus according to any one of claim 5～7, its feature It is,
Above-mentioned recovery handle part can towards configure multiple above-mentioned electronic units direction and with configuration many The direction that the direction of individual above-mentioned electronic unit is orthogonal is moved.
9. according to the electronic component handling apparatus according to any one of claim 1～8, its feature It is,
The direction of multiple above-mentioned electronic units and the conveying of above-mentioned delivery section is configured in above-mentioned delivery section Direction is identical.
10. according to the electronic component handling apparatus according to any one of claim 1～9, its feature It is,
In the case of above-mentioned supply is reclaimed handle part configuration or taken out above-mentioned electronic unit, above-mentioned Supply is reclaimed handle part and can be moved towards the direction orthogonal with the direction configuring multiple above-mentioned electronic units Dynamic, above-mentioned delivery section can move towards the direction configuring multiple above-mentioned electronic units.
11. according to the electronic component handling apparatus according to any one of claim 1～10, and it is special Levy and be,
Spacing at the multiple above-mentioned electronic unit by being configured at above-mentioned delivery section is set to a, by above-mentioned Supply reclaims the spacing of multiple above-mentioned electronic unit that handle part holds when being set to b, b/a be 2 with On integer.
12. according to the electronic component handling apparatus according to any one of claim 1～11, and it is special Levy and be,
Above-mentioned electronic component handling apparatus has the maintaining part that can keep above-mentioned electronic unit,
Handle part is reclaimed in above-mentioned supply can press above-mentioned electronic unit to above-mentioned maintaining part.
13. according to the electronic component handling apparatus according to any one of claim 1～12, and it is special Levy and be,
Handle part is reclaimed in above-mentioned supply and above-mentioned delivery section is each provided with 2.
14. 1 kinds of electronic component inspection device, it is characterised in that possess:
Delivery section, it can configure and carry multiple electronic unit；
Supply handle part, it can hold multiple above-mentioned electronic unit and by multiple above-mentioned electronic units It is configured at above-mentioned delivery section；
Handle part is reclaimed in supply, and it can hold multiple above-mentioned electronic unit and supply and reclaim multiple Above-mentioned electronic unit；And
Inspection portion, above-mentioned electronic unit checks by it,
The electronic unit of above-mentioned supply handle part holds spacing and can be adjusted to and above-mentioned delivery section Electronic unit disposition interval is identical,
The ministry of electronics industry of the electronic unit holding above-mentioned delivery section of gap ratio of handle part is reclaimed in above-mentioned supply Part disposition interval is big,
Multiple above-mentioned electronic units are configured at above-mentioned delivery section by above-mentioned supply handle part,
Above-mentioned supply is reclaimed handle part and is taken from above-mentioned delivery section several times by multiple above-mentioned electronic units Go out.
15. 1 kinds of electronic component inspection device, it is characterised in that possess:
Delivery section, it can configure and carry multiple electronic unit；
Reclaiming handle part, it can hold and be configured at the multiple above-mentioned electronic unit of above-mentioned delivery section also Multiple above-mentioned electronic units are taken out from above-mentioned delivery section；
Handle part is reclaimed in supply, and it can hold multiple above-mentioned electronic unit and supply and reclaim multiple Above-mentioned electronic unit；And
Inspection portion, above-mentioned electronic unit checks by it,
The electronic unit of above-mentioned recovery handle part holds spacing and can be adjusted to and above-mentioned delivery section Electronic unit disposition interval is identical,
The ministry of electronics industry of the electronic unit holding above-mentioned delivery section of gap ratio of handle part is reclaimed in above-mentioned supply Part disposition interval is big,
Above-mentioned supply is reclaimed handle part and multiple above-mentioned electronic units is configured at above-mentioned conveying several times Portion,
Multiple above-mentioned electronic units are taken out by above-mentioned recovery handle part from above-mentioned delivery section.
16. according to the electronic component inspection device described in claims 14 or 15, it is characterised in that
Above-mentioned supply is reclaimed handle part and can be supplied above-mentioned inspection portion and reclaim above-mentioned electronic unit.
CN201610055013.8A 2015-02-25 2016-01-27 Electronic component handling apparatus and electronic component inspection device Expired - Fee Related CN105905600B (en)

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