CN105905600B - Electronic component handling apparatus and electronic component inspection device - Google Patents
Electronic component handling apparatus and electronic component inspection device Download PDFInfo
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- CN105905600B CN105905600B CN201610055013.8A CN201610055013A CN105905600B CN 105905600 B CN105905600 B CN 105905600B CN 201610055013 A CN201610055013 A CN 201610055013A CN 105905600 B CN105905600 B CN 105905600B
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- supply
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/918—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with at least two picking-up heads
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention provides electronic component handling apparatus and electronic component inspection device, can increase the quantity of the electronic unit conveyed per unit time.Electronic component handling apparatus has the delivery section that can configure and convey multiple electronic units, multiple above-mentioned electronic units can be held and they are configured to the supply handle part of above-mentioned delivery section, and the supply recycling handle part that multiple above-mentioned electronic units can be held and supplied and recycled, the electronic unit holding spacing of above-mentioned supply handle part can be adjusted to identical as the electronic unit of above-mentioned delivery section configuration spacing, it is bigger than the electronic unit of above-mentioned delivery section configuration spacing that the electronic unit of above-mentioned supply recycling handle part holds spacing, multiple above-mentioned electronic units are configured at above-mentioned delivery section by above-mentioned supply handle part, above-mentioned supply recycling handle part takes out multiple above-mentioned electronic units from above-mentioned delivery section several times.
Description
Technical field
The present invention relates to electronic component handling apparatus and electronic component inspection devices.
Background technology
In the past, there is known the electronic component inspection devices for checking the electrical characteristics of electronic unit such as IC devices, in the electricity
Subassembly check device is assembled with the electronic component handling apparatus of the maintaining part for IC devices to be transported to inspection portion.It is checking
IC devices are configured at maintaining part when IC devices, make each termination contact of the multiple probes and IC devices that are set to maintaining part.
There is above-mentioned electronic component handling apparatus heating in advance or cooling IC devices to be adjusted to be suitable for checking by IC devices
Temperature immersion plate, the IC devices after temperature will be adjusted by immersion plate be transported to supply shuttle near inspection portion, match
It is equipped with the pallet of IC devices and impregnates the conveying of the IC devices between plate and impregnate plate and supply the conveying of the IC devices between shuttle
The first device delivery head, conveying check after IC devices recycling shuttle, supply IC devices between shuttle and inspection portion
It conveys the second device delivery head of the conveying of the IC devices between inspection portion and recycling shuttle and carries out recycling shuttle and configure quilt
Third device delivery head of the conveying of IC devices between the pallet of the IC devices of recycling etc..
First device delivery head, the second device delivery head and third device delivery head are respectively provided with multiple holding IC devices
Hand unit.In addition, each hand unit is respectively provided with the nozzle of absorption IC devices, adsorbed using the nozzle to hold IC devices
90.In addition, supply shuttle and recycling shuttle are respectively provided with the pocket portion for configuring multiple IC devices, inspection portion, which has, configures multiple IC devices
Maintaining part.
In addition, patent document 1 discloses the adsorption head interval 90 for each adsorption head 81 that can adjust multi-joint adsorption head 80
IC processing device transport apparatus.
In the IC processing device transport apparatus, it is the device storage pocket portion of user tray 100 to make adsorption head interval 90
N times of interval 202, primary absorption/release is multiple by test device (DUT).
Patent document 1：Japanese Unexamined Patent Publication 8-264993 bulletins
It, will be between the spacing of the maintaining part in the portion that checks and the pocket portion of supply shuttle in existing electronic component handling apparatus
Away from being set as identical.In this case, if the spacing in the pocket portion of supply shuttle is the nozzle of the hand unit of the first device delivery head
The spacing of the nozzle of the hand unit of first device delivery head hereinafter, is then adjusted to the spacing with the pocket portion for supplying shuttle by maximum spacing
Identical, thus IC devices can be configured at the pocket portion of supply shuttle by whole hand units of the first device delivery head simultaneously.
However, bigger than the maximum spacing of the nozzle of the hand unit of the first device delivery head in the spacing for supplying the pocket portion of shuttle
In the case of, IC devices can not be configured at the pocket portion of supply shuttle, the first device by whole hand units of the first device delivery head simultaneously
IC devices are configured at the pocket portion of supply shuttle by delivery head several times.Therefore, the quantity of the IC devices conveyed per unit time is reduced.
Third device delivery head is also the same.
In addition, in IC processing device transport apparatus recorded in patent document 1, using multi-joint adsorption head 80, with
Once adsorb/discharge in family pallet 100 it is multiple by test device, but in patent document 1 without how recording by multiple quilts
Test device is configured at multiple maintaining parts in inspection portion.Therefore, the IC processing device transport apparatus recorded in patent document 1
In, the quantity of the IC devices conveyed per unit time can not be increased.
Invention content
The object of the present invention is to provide the electronic unit for the quantity that can increase the electronic unit conveyed per unit time is defeated
Send device and electronic component inspection device.
The present invention is at least part in order to solve the above problems and completes, and can be used as mode below or answer
Use-case is realized.
Application examples 1
The electronic component handling apparatus of the present invention is characterized in that having：It can configure and convey multiple electronic units
Delivery section, can hold multiple above-mentioned electronic units and by they be configured at above-mentioned delivery section supply handle part and can
The supply recycling handle part for holding multiple above-mentioned electronic units and being supplied and being recycled, the electronic unit of above-mentioned supply handle part
, the electronics of above-mentioned supply recycling handle part identical as the electronic unit of above-mentioned delivery section configuration spacing can be adjusted to by holding spacing
Component holds that spacing is bigger than the electronic unit of above-mentioned delivery section configuration spacing, and above-mentioned supply handle part is by multiple above-mentioned electronic units
It is configured at above-mentioned delivery section, above-mentioned supply recycling handle part takes out multiple above-mentioned electronic units from above-mentioned delivery section several times.
Thereby, it is possible to increase the quantity of the electronic unit conveyed per unit time.
Application examples 2
In the electronic component handling apparatus of the present invention, it is preferable that above-mentioned supply handle part unites multiple above-mentioned electronic units
One is configured at above-mentioned delivery section.
Thereby, it is possible to increase the quantity of the electronic unit conveyed per unit time.
Application examples 3
In the electronic component handling apparatus of the present invention, it is preferable that above-mentioned supply recycling handle part is above-mentioned from holding to configuring
The time of electronic unit is shorter than the time of above-mentioned supply handle part above-mentioned electronic unit from holding to configuring.
Thereby, it is possible to increase the quantity of the electronic unit conveyed per unit time.
Application examples 4
In the electronic component handling apparatus of the present invention, it is preferable that above-mentioned supply handle part can be towards the multiple above-mentioned electricity of configuration
The direction of subassembly and the direction orthogonal with multiple directions of above-mentioned electronic unit are configured are moved.
Thereby, it is possible to be easy to hold electronic unit.
Application examples 5
The electronic component handling apparatus of the present invention is characterized in that having：It can configure and convey multiple electronic units
Delivery section can hold the multiple above-mentioned electronic units for being configured at above-mentioned delivery section and be returned what they took out from above-mentioned delivery section
The supply recycling handle part received handle part and multiple above-mentioned electronic units can be held and supplied and recycled, above-mentioned time
, above-mentioned confession identical as the electronic unit of above-mentioned delivery section configuration spacing can be adjusted to by receiving the electronic unit holding spacing of handle part
Bigger than the electronic unit of above-mentioned delivery section configuration spacing to the electronic unit holding spacing of recycling handle part, handle is recycled in above-mentioned supply
It holds portion and multiple above-mentioned electronic units is configured at above-mentioned delivery section several times, above-mentioned recycling handle part is by multiple above-mentioned electronic units
It is taken out from above-mentioned delivery section.
Thereby, it is possible to increase the quantity of the electronic unit conveyed per unit time.
Application examples 6
In the electronic component handling apparatus of the present invention, it is preferable that above-mentioned recycling handle part unites multiple above-mentioned electronic units
One takes out from above-mentioned delivery section.
Thereby, it is possible to increase the quantity of the electronic unit conveyed per unit time.
Application examples 7
In the electronic component handling apparatus of the present invention, it is preferable that above-mentioned supply recycling handle part is above-mentioned from holding to configuring
The time of electronic unit is shorter than the time of above-mentioned recycling handle part above-mentioned electronic unit from holding to configuring.
Thereby, it is possible to increase the quantity of the electronic unit conveyed per unit time.
Application examples 8
In the electronic component handling apparatus of the present invention, it is preferable that above-mentioned recycling handle part can be towards the multiple above-mentioned electricity of configuration
The direction of subassembly and the direction orthogonal with multiple directions of above-mentioned electronic unit are configured are moved.
Thereby, it is possible to be easy to hold electronic unit.
Application examples 9
In the electronic component handling apparatus of the present invention, it is preferable that configure multiple above-mentioned electronic units in above-mentioned delivery section
Direction it is identical as the conveying direction of above-mentioned delivery section.
The required time in the case of thereby, it is possible to shorten supply recycling handle part configuration or take out electronic unit.
Application examples 10
In the electronic component handling apparatus of the present invention, it is preferable that in above-mentioned supply recycling handle part configuration or take out
In the case of stating electronic unit, above-mentioned supply recycling handle part can be towards orthogonal with multiple directions of above-mentioned electronic unit are configured
Direction is moved, and above-mentioned delivery section can be moved towards the direction for configuring multiple above-mentioned electronic units.
The required time in the case of thereby, it is possible to shorten supply recycling handle part configuration or take out electronic unit.
Application examples 11
In the electronic component handling apparatus of the present invention, it is preferable that in the multiple above-mentioned electronics that will be configured at above-mentioned delivery section
The spacing of component is set as a, and when the spacing for multiple above-mentioned electronic units that above-mentioned supply recycling handle part is held is set as b, b/a is
2 or more integer.
It, can be with minimal time as a result, in the case of supply recycling handle part configuration or taking-up electronic unit
Electronic unit is taken out in number configuration.
Application examples 12
In the electronic component handling apparatus of the present invention, it is preferable that the maintaining part of above-mentioned electronic unit can be kept by having, on
Above-mentioned electronic unit can be pressed to above-mentioned maintaining part by stating supply recycling handle part.
Thereby, it is possible to make the terminal of electronic unit by pressing electronic unit by inspection handle part and be set to maintaining part
Probe electrical connection.
Application examples 13
In the electronic component handling apparatus of the present invention, it is preferable that above-mentioned supply recycling handle part and above-mentioned delivery section difference
It is provided with 2.
Two delivery sections and two supply recycling handle parts are supplemented in time each other as a result, can be further
Increase the quantity of the electronic unit conveyed per unit time.
Application examples 14
The electronic component inspection device of the present invention is characterized in that having：It can configure and convey multiple electronic units
Delivery section can hold multiple above-mentioned electronic units and they are configured at the supply handle part of above-mentioned delivery section, can be held
Multiple above-mentioned electronic units and the supply recycling handle part for being supplied and being recycled and the inspection for checking above-mentioned electronic unit
Portion, the electronic unit of above-mentioned supply handle part, which holds spacing, can be adjusted to configure spacing phase with the electronic unit of above-mentioned delivery section
Together, the electronic unit holding spacing of above-mentioned supply recycling handle part is bigger than the electronic unit of above-mentioned delivery section configuration spacing, above-mentioned
Multiple above-mentioned electronic units are configured at above-mentioned delivery section by supply handle part, and above-mentioned supply recycles handle part by multiple above-mentioned electronics
Component takes out from above-mentioned delivery section several times.
Thereby, it is possible to increase the quantity of the electronic unit conveyed per unit time.It is inoperative thereby, it is possible to reduce inspection portion
Time, increase the inspection quantity of electronic unit per unit time.
Application examples 15
The electronic component inspection device of the present invention is characterized in that having：It can configure and convey multiple electronic units
Delivery section can hold the multiple above-mentioned electronic units for being configured at above-mentioned delivery section and be returned what they took out from above-mentioned delivery section
In receipts handle part, the supply recycling handle part that multiple above-mentioned electronic units can be held and supplied and recycled and inspection
The inspection portion of electronic unit is stated, the electronic unit of above-mentioned recycling handle part, which holds spacing, can be adjusted to the electricity with above-mentioned delivery section
Subassembly configuration spacing is identical, and the electronic unit of above-mentioned supply recycling handle part holds electronic unit of the spacing than above-mentioned delivery section
It is big to configure spacing, multiple above-mentioned electronic units are configured at above-mentioned delivery section by above-mentioned supply recycling handle part several times, above-mentioned time
Handle part is received to take out multiple above-mentioned electronic units from above-mentioned delivery section.
Thereby, it is possible to increase the quantity of the electronic unit conveyed per unit time.It is inoperative thereby, it is possible to reduce inspection portion
Time, increase the inspection quantity of electronic unit per unit time.
Application examples 16
In the electronic component inspection device of the present invention, it is preferable that above-mentioned supply recycling handle part can supply above-mentioned inspection portion
Give and recycle above-mentioned electronic unit.
Thereby, it is possible to which electronic unit is supplied to inspection portion and is checked using supply recycling handle part, and can be
Electronic unit is recycled from inspection portion using supply recycling handle part after inspection.
Description of the drawings
Fig. 1 is the schematic top for the first embodiment for indicating the electronic component inspection device of the present invention.
Fig. 2 is the block diagram of electronic component inspection device shown in FIG. 1.
Fig. 3 is the vertical view of the main portions in the inspection portion for indicating electronic component inspection device shown in FIG. 1.
Fig. 4 is the sectional view of the main portions in the inspection portion for indicating electronic component inspection device shown in FIG. 1.
Fig. 5 is the sectional view of the main portions for the device supply unit for indicating electronic component inspection device shown in FIG. 1.
Fig. 6 is the sectional view of the main portions for the device recoverer for indicating electronic component inspection device shown in FIG. 1.
Fig. 7 is the sectional view of the main portions for the second device delivery head for indicating electronic component inspection device shown in FIG. 1.
Fig. 8 is the sectional view of the main portions for the first device delivery head for indicating electronic component inspection device shown in FIG. 1.
Fig. 9 is the sectional view of the main portions for the third device delivery head for indicating electronic component inspection device shown in FIG. 1.
Figure 10 is for illustrating the dynamic of electronic component inspection device shown in FIG. 1 and existing electronic component inspection device
The figure of work.
Figure 11 is for illustrating the dynamic of electronic component inspection device shown in FIG. 1 and existing electronic component inspection device
The figure of work.
Figure 12 is for illustrating the dynamic of electronic component inspection device shown in FIG. 1 and existing electronic component inspection device
The figure of work.
Figure 13 is for illustrating the dynamic of electronic component inspection device shown in FIG. 1 and existing electronic component inspection device
The figure of work.
Figure 14 is for illustrating the dynamic of electronic component inspection device shown in FIG. 1 and existing electronic component inspection device
The figure of work.
Figure 15 is for illustrating the dynamic of electronic component inspection device shown in FIG. 1 and existing electronic component inspection device
The figure of work.
Figure 16 is for illustrating the dynamic of electronic component inspection device shown in FIG. 1 and existing electronic component inspection device
The figure of work.
Figure 17 is the action institute for indicating electronic component inspection device shown in FIG. 1 and existing electronic component inspection device
The chart of the time needed.
Figure 18 is the schematic top for the second embodiment for indicating the electronic component inspection device of the present invention.
Specific implementation mode
Hereinafter, the electronic component handling apparatus that the present invention will be described in detail of embodiment shown in reference to the accompanying drawings and the ministry of electronics industry
Part check device.
First embodiment
Fig. 1 is the schematic top for the first embodiment for indicating the electronic component inspection device of the present invention.Fig. 2 is Fig. 1
Shown in electronic component inspection device block diagram.Fig. 3 be indicate electronic component inspection device shown in FIG. 1 inspection portion it is main
The vertical view at position.Fig. 4 is the sectional view of the main portions in the inspection portion for indicating electronic component inspection device shown in FIG. 1.Fig. 5
It is the sectional view of the main portions for the device supply unit for indicating electronic component inspection device shown in Fig. 1.Fig. 6 is to indicate Fig. 1 institutes
The sectional view of the main portions of the device recoverer for the electronic component inspection device shown.Fig. 7 is to indicate the ministry of electronics industry shown in FIG. 1
The sectional view of the main portions of second device delivery head of part check device.Fig. 8 is to indicate electronic unit inspection dress shown in FIG. 1
The sectional view of the main portions for the first device delivery head set.Fig. 9 is the third for indicating electronic component inspection device shown in FIG. 1
The sectional view of the main portions of device delivery head.Figure 10~Figure 16 is namely for illustrating that electronic unit inspection shown in FIG. 1 fills
It sets and the figure of the action of existing electronic component inspection device.Figure 17 be indicate electronic component inspection device shown in FIG. 1 with
And the chart of the action required time of existing electronic component inspection device.Figure 18 is the electronic unit inspection for indicating the present invention
Look into the schematic top of the second embodiment of device.
In addition, hereinafter, for convenience of description, as shown in Figure 1,3 mutually orthogonal axis are set as X-axis, Y-axis and Z axis
(Figure 18 is also the same).In addition, by being set as horizontal comprising the X/Y plane including X-axis and Y-axis, Z axis is set as vertical.In addition, will put down
Row is known as " X-direction " in the direction of X-axis, and the direction for being parallel to Y-axis is known as " Y-direction ", and the direction for being parallel to Z axis is known as the " side Z
To ".In addition, the direction of the arrow of X-axis, Y-axis and each axis of Z axis is known as positive side, the direction opposite with arrow is known as negative side.
In addition, the upstream side of the conveying direction of electronic unit is referred to as " upstream side ", downstream side is referred to as in " downstream side ".In addition,
The "horizontal" mentioned in the specification of the present application is not limited to fully horizontally, as long as not hindering the conveying of electronic unit, also includes
Relative to horizontal slightly (being, for example, less than 5 ° or so) inclined state.
In addition, hereinafter, for convenience of description, the upside in Fig. 4~Fig. 9 is known as "upper" or " top ", downside is known as
"lower" or " lower section ", right side are known as " right side ", and left side is known as " left side ".
In addition, in Figure 10~Figure 16, in order to make it easy to understand, also being marked to existing check device and present embodiment
1 identical reference numeral of check device.
Check device (electronic component inspection device) 1 shown in FIG. 1 is, for example, for checking/testing (hereinafter referred to as
" inspection ") BGA (Ball grid array) encapsulation, LGA (Land grid array) encapsulation etc. IC devices, LCD (Liquid
Crystal Display), the devices of the electrical characteristics of electronic units such as CIS (CMOS Image Sensor).In addition, below in order to
Convenient for explanation, to use IC devices to be illustrated as the case where the above-mentioned electronic unit checked as representative, it is denoted as " IC devices
Part 90 ".
As shown in Figure 1, check device 1 is divided for pallet supply area A1, device supply area (hereinafter referred to as " drainage area
Domain ") A2, inspection area A3, device recovery zone (hereinafter referred to as " recovery zone ") A4, pallet remove region A5.It is above-mentioned each
Region is each other by separations such as wall portion (not shown), shutters.Moreover, supply area A2 become by wall portion, shutter etc. divide and
At the first Room R1, in addition, inspection area A3 become the second Room R2 made of the divisions such as wall portion, shutter, in addition, recovery area
Domain A4 becomes the third room R3 made of the divisions such as wall portion, shutter.In addition, the first Room R1 (supply area A2), second Room R2
(inspection area A3) and third room R3 (recovery zone A4) are respectively structured as to ensure air-tightness, thermal insulation.As a result, first
Room R1, second Room R2 and third room R3 are able to maintain humidity, temperature as far as possible.In addition, the first Room R1 and second Room
It is controlled respectively by defined humidity and defined temperature in R2.
IC devices 90 remove region A5 from pallet supply area A1 to pallet in order via above-mentioned each region, in midway
Inspection area A3 is checked.Check device 1 has in each region conveying IC devices 90 and the electronics with control unit 80 in this way
Component conveying apparatus, the inspection portion 16 checked in the A3 of inspection area and inspection control unit (not shown).In addition,
In check device 1, electronic component handling apparatus is constituted by the structure in addition to inspection portion 16 and other than checking control unit.
Pallet supply area A1 is the region for the pallet 200 for being supplied to the multiple IC devices 90 for being arranged with non-inspection state.
In the A1 of pallet supply area, multiple pallets 200 can be laminated.
Supply area A2 is to be fed separately to examine by multiple IC devices 90 on the pallet 200 from pallet supply area A1
Look into the region of region A3.Pallet is conveyed one by one in addition, being provided in a manner of across pallet supply area A1 and supply area A2
200 the first conveyor pallet structure 11A, the second conveyor pallet structure 11B.
In supply area, A2 is provided with the temperature adjustment section (impregnate plate) 12 of the configuration section as configuration IC devices 90, the
One device delivery head (supply handle part) 13 and third conveyor pallet structure 15.
Temperature adjustment section 12 is that the IC devices 90 are adjusted (control) as suitable for inspection by heating or cooling multiple IC devices 90
The device for the temperature looked into.That is, temperature adjustment section 12 is configuration IC devices 90 and can carry out heating and cold to the IC devices 90
But temperature control unit (component).In the construction shown in fig. 1, temperature adjustment section 12 configures along Y-direction, is fixed with 2.And
And the IC devices on the pallet 200 of (convey come) are moved to from pallet supply area A1 by the first conveyor pallet structure 11A
90 are conveyed, are placed in a certain temperature adjustment section 12.
First device delivery head 13 is supported in the A2 of supply area being capable of (first direction), Y-direction (in X direction
Three directions) and Z-direction (second direction) movement.The first device delivery head 13 is responsible for being removed from pallet supply area A1 as a result,
The conveying of IC devices 90 between the pallet 200 entered and temperature adjustment section 12 and temperature adjustment section 12 are supplied with aftermentioned device
The conveying of IC devices 90 between portion 14.
As shown in figure 8, the first device delivery head 13 has multiple first-hand lists as the handle part for holding IC devices 90
Member 131.It is not particularly limited as long as the quantity of the first-hand unit 131 is multiple, in the present embodiment, as an example
The situation of son and explanation 8.In addition, 8 first-hand units 131 are in ranks shape, X-direction is configured with 4, and Y-direction is configured with 2
It is a, it is only capable of seeing 4 first-hand units 131 of 1 row arrangement in X direction in Fig. 8.The structure of each first-hand unit 131 is identical,
So following typically illustrate a first-hand unit 131.In addition, in the explanation of action, typically explanation can be seen
The 4 first-hand units 131 arrived.First-hand unit 131 has the first adsorption nozzle 132, and IC devices 90 are held by absorption.
That is, first-hand unit 131 is in the state that the front end of the first adsorption nozzle 132 is configured with IC devices 90, driving is (not shown)
Pumping draws air (fluid), and the inner cavity of the first adsorption nozzle 132 is made to become negative pressure state, to utilize the first adsorption nozzle 132
Front end hold (absorption hold) IC devices 90.In addition, driving other pumps (not shown) supply air by the first adsorption nozzle
The negative pressure state of 132 inner cavity releases, to be decontroled by 132 IC devices 90 that hold of the first adsorption nozzle.
In addition, spacing (electronic unit holding spacing) P5 of first-hand unit 131 can adjust (adjustment), can suitably adjust
Section.In the present embodiment, to adjusting the spacing P5 of first-hand unit 131 in inspection portion 16 and device supply unit 14
(setting) is spacing (the electronic unit configuration spacing) P1 of the maintaining part 161 with inspection portion 16 and the second device delivery head 17
Spacing (electronic unit holding spacing) P4 (b) of second adsorption nozzle 176 of second-hand's unit 175 1/2, device supply unit
Spacing (the electronic unit configuration spacing) situation identical P2 (a) in 14 supply pocket portion 141 illustrates.
Third conveyor pallet structure 15 be the empty pallet 200 for the state for being removed whole IC devices 90 in X direction
The mechanism of conveying.Moreover, after the conveying, empty pallet 200 is returned by the second conveyor pallet structure 11B from supply area A2
Pallet supply area A1.
Inspection area A3 is the region for checking IC devices 90.In the inspection area, A3 is provided with as can configure and convey
Device supply unit (supply shuttle) 14, inspection portion 16, the second device delivery head of the delivery section (supply delivery section) of IC devices 90
(supply recycling handle part) 17 and device as the delivery section (recycling delivery section) that can configure and convey IC devices 90 return
Receipts portion (recycling shuttle) 18.
The device supply unit master that device supply unit 14 has the configuration plate of configuration IC devices 90 and can move in X direction
Body, configuration plate are set to device supply unit main body in a manner of assemble and unassemble.The device supply unit 14 is that (temperature will be adjusted by temperature
Degree control) after IC devices 90 be transported to the device near inspection portion 16, being supported to can be in supply area A2 and test zone
It is moved in X direction between the A3 of domain.IC devices 90 in temperature adjustment section 12 are conveyed by the first device delivery head 13 and are placed in device
Part supply unit 14.In addition, in device supply unit 14, it is identical as temperature adjustment section 12, IC devices 90 can be heated or cool down,
The IC devices 90 are adjusted to the temperature suitable for checking.
Device supply unit 14 is described in more detail, as shown in figure 5, being provided with storage in the upper surface of device supply unit 14
The multiple recess portions that is, pocket portion (electronic unit configuration section) 141 of (configuration) IC devices 90.Each IC devices 90 are incorporated in each supply
Thus pocket portion 141 is configured at device supply unit 14.
Shape, size (size) and the configuration (position) in each supply pocket portion 141 according to the shapes of the IC devices 90 of inspection,
The settings such as the configuration of maintaining part 161 of size (size), inspection portion 16.In the present embodiment, between supplying pocket portion 141
It is set as away from P2 between the spacing P1 of the maintaining part 161 in inspection portion 16 and the second adsorption nozzle 176 of second-hand's unit 175
Away from P4 1/2 the case where illustrate.
As long as in addition, between spacing P2 (a) and the magnitude relationship spacing P1 and spacing P4 ratios of spacing P1 and spacing P4 (b)
It is not particularly limited greatly away from P2, preferably P1/P2 and P4 (b)/P2 (a) are 2 or more integers.
In addition, in the present embodiment, from the Z-direction in Fig. 1, the shape in supply pocket portion 141 is and IC devices 90
The corresponding shape, that is, quadrangle of shape.
As long as being not particularly limited in addition, the quantity in supply pocket portion 141 is multiple, in the present embodiment, as one
A example and illustrate a situation in 8 (4 × 2).In addition, 8 supply pocket portions 141 are in ranks shape, X-direction is configured with 4, Y-direction
It is only capable of seeing 4 supply pocket portions 141 of 1 row arrangement in X direction configured with 2, in Fig. 5.In addition, in the explanation of action,
4 supply pocket portions 141 that typically explanation can be seen.
Inspection portion 16 is the unit of the electrical characteristics of inspection/experiment IC devices 90, i.e., is protected in the case where checking IC devices 90
Hold the component of the IC devices 90.Inspection portion 16 is provided with terminal in the state of maintaining IC devices 90 with the IC devices 90
Multiple probes of electrical connection.Moreover, the terminal of IC devices 90 is electrically connected (contact) with probe, IC devices 90 are carried out via probe
Inspection.The inspection control unit that the inspection of IC devices 90 has according to the verifier (not shown) being connect with inspection portion 16 is deposited
The program stored in storage portion carries out.In addition, in inspection portion 16, it is identical as temperature adjustment section 12, it can heat or cool down IC
The IC devices 90 are adjusted to the temperature suitable for checking by device 90.
Inspection portion 16 is described in more detail, as shown in Figure 3 and 4, the upper surface in inspection portion 16 is provided with storage and (protects
Hold) the multiple recess portions that is, maintaining part (electronic unit configuration section) 161 of IC devices 90.Each IC devices 90 are incorporated in each holding
Thus portion 161 is configured at inspection portion 16.
The shape of each maintaining part 161, size (size) and configuration (position) according to the shapes of the IC devices 90 of inspection,
The settings such as size (size).In the present embodiment, the spacing P1 of maintaining part 161 is set as and the second device delivery head 17
Second-hand's unit 175 the second adsorption nozzle 176 spacing P4 it is identical.
In addition, in the present embodiment, from the Z-direction in Fig. 1 (vertical view), the shape of IC devices 90 is in quadrangle,
Therefore, the shape of maintaining part 161 is shape corresponding with the shape of IC devices 90 i.e. quadrangle.
As long as being not particularly limited in addition, the quantity of maintaining part 161 is multiple, in the present embodiment, as one
Example and illustrate 8 situations.In addition, 8 maintaining parts 161 are in ranks shape, X-direction is configured with 4, and Y-direction is configured with 2.
In addition, in the explanation of action, typically illustrate 4 maintaining parts 161 of 1 row arrangement in X direction.
Second device delivery head 17 is supported to move along Y-direction and the directions Z in the A3 of inspection area.In addition,
Second device delivery head 17 can will be conveyed and be loaded from the IC devices 90 on the device supply unit 14 that supply area A2 is moved to
In in inspection portion 16, in addition, the IC devices 90 in inspection portion 16 can be conveyed and be placed on device recoverer 18.In addition,
Checking that IC devices 90, the second device delivery head 17 press IC devices 90 to inspection portion 16, thus make IC devices 90 with
Inspection portion 16 abuts.As a result, as described above, the terminal of IC devices 90 is electrically connected with the probe in inspection portion 16.
As shown in fig. 7, the second device delivery head 17 has multiple second-hand's units 175 as the holding for holding IC devices 90
Portion.It is not particularly limited as long as the quantity of second-hand's unit 175 is multiple, in the present embodiment, as an example
And the situation of explanation 8.In addition, 8 second-hand's units 175 are in ranks shape, X-direction is configured with 4, and Y-direction is configured with 2,
It is only capable of seeing 4 second-hand's units 175 of 1 row arrangement in X direction in Fig. 7.The structure of each second-hand's unit 175 is identical, institute
Typically illustrate second-hand's unit 175 with following.In addition, in the explanation of action, typically explanation can be seen
4 second-hand's units 175.Second-hand's unit 175 has the second adsorption nozzle 176, and IC devices 90 are held by absorption.That is,
Second-hand's unit 175 drives pumping (not shown) in the state that the front end of the second adsorption nozzle 176 is configured with IC devices 90
Draw air (fluid), the inner cavity of the second adsorption nozzle 176 is made to become negative pressure state, to using before the second adsorption nozzle 176
End holds (absorption is held) IC devices 90.In addition, driving other pumps (not shown) supply air, by the second adsorption nozzle 176
The negative pressure state of inner cavity release, so that the IC devices 90 held by the second adsorption nozzle 176 be decontroled.
In addition, by the maintaining part 161 of spacing (electronic unit holding spacing) P4 and inspection portion 16 of second-hand's unit 175
Spacing P1 be set as identical.
In addition, in each second-hand's unit 175, it is identical as temperature adjustment section 12, IC devices 90 can be heated or cool down,
IC devices 90 are adjusted to the temperature suitable for checking.
The device recoverer master that device recoverer 18 has the configuration plate of configuration IC devices 90 and can move in X direction
Body, configuration plate are set to device recoverer main body in a manner of assemble and unassemble.The device recoverer 18 is will be in inspection portion 16
Check that the IC devices 90 finished are transported to the device of recovery zone A4, being supported to can be in inspection area A3 and recovery zone
It is moved in X direction between A4.IC devices 90 in inspection portion 16 are conveyed by the second device delivery head 17 and are placed in device recycling
Portion 18.
Device recoverer 18 is described in more detail, as shown in fig. 6, being provided with as receipts in the upper surface of device recoverer 18
Receive (configuration) IC devices 90 multiple recess portions pocket portion (electronic unit configuration section) 181.Each IC devices 90 are incorporated in each recycling
Thus pocket portion 181 is configured at device recoverer 18.
Shape, size (size) and the configuration (position) in each recycling pocket portion 181 according to the shapes of the IC devices 90 of inspection,
The settings such as the configuration of maintaining part 161 of size (size), inspection portion 16.In the present embodiment, between recycling pocket portion 181
Be set as away from (electronic unit configuration spacing) P3 the maintaining part 161 in inspection portion 16 spacing P1 and second-hand's unit 175
The spacing P4 of two adsorption nozzles 176 1/2 the case where illustrate.
As long as in addition, the magnitude relationship spacing P1 and spacing P4 ratios of spacing P3 (a) and spacing P1 and spacing P4 (b)
Spacing P3 is not particularly limited greatly, and preferably P1/P3 and P4 (b)/P3 (a) are 2 or more integers.
In addition, in the present embodiment, from the Z-direction in Fig. 1, the shape in recycling pocket portion 181 is and IC devices 90
The corresponding shape, that is, quadrangle of shape.
As long as being not particularly limited in addition, the quantity in recycling pocket portion 181 is multiple, in the present embodiment, as one
A example and illustrate a situation in 8 (4 × 2).In addition, 8 recycling pocket portions 181 are in ranks shape, X-direction is configured with 4, Y-direction
It is only capable of seeing 4 recycling pocket portions 181 of 1 row arrangement in X direction configured with 2, in Fig. 6.In addition, in the explanation of action,
4 recycling pocket portions 181 that typically explanation can be seen.
Recovery zone A4 is the region that recycling checks the IC devices 90 terminated.In the recovery zone, A4 is provided with recycling and uses
Pallet 19, third device delivery head (recycling handle part) 20 and the 6th conveyor pallet structure 21.In addition, also in recovery zone A4
Empty pallet 200 is prepared.
Recycling pallet 19 is fixed in the A4 of recovery zone, in the construction shown in fig. 1,3 is configured with along the directions X.Separately
Outside, empty pallet 200 is also configured with 3 in X direction.Moreover, the IC devices being moved on the device recoverer 18 of recovery zone A4
Part 90 is conveyed and is placed in any one in the pallet 200 of above-mentioned recycling pallet 19 and sky.It is tied as a result, according to inspection
Fruit is recycled and classification IC devices 90.
Third device delivery head 20 be supported in the A4 of recovery zone can in X direction, Y-direction and Z-direction movement.
IC devices 90 can be delivered to recycling pallet 19, empty pallet by third device delivery head 20 from device recoverer 18 as a result,
200。
As shown in figure 9, third device delivery head 20 has multiple hand units 201 as the handle part for holding IC devices 90.
It is not particularly limited as long as the quantity of the hand unit 201 is multiple, in the present embodiment, illustrates 8 as an example
A situation.In addition, 8 hand units 201 are in ranks shape, X-direction is configured with 4, and Y-direction is configured with 2, is only capable of seeing in Fig. 9
To 4 hand units 201 of 1 row arrangement in X direction.The structure of each hand unit 201 is identical, so typically illustrating one below
A hand unit 201.In addition, in the explanation of action, typically illustrate the 4 hand units 201 that can be seen.Hand unit 201
Have adsorption nozzle 202, IC devices 90 are held by absorption.That is, hand unit 201 is configured in the front end of adsorption nozzle 202
In the state of IC devices 90, pumping (not shown) is driven to draw air (fluid), the inner cavity of adsorption nozzle 202 is made to become negative pressure shape
State, to hold (absorption is held) IC devices 90 using the front end of adsorption nozzle 202.In addition, driving other pumps (not shown)
Air is supplied, the negative pressure state of the inner cavity of adsorption nozzle 202 is released, thus will be by 202 IC devices that hold of adsorption nozzle
90 decontrol.
In addition, spacing (electronic unit holding spacing) P6 of hand unit 201 can adjust (adjustment), can suitably adjust.
In the present embodiment, in inspection portion 16 and device recoverer 18 by the spacing P6 of hand unit 201 adjust (setting) as
The second absorption with second-hand's unit 175 of the spacing P1 and the second device delivery head 17 of the maintaining part 161 in inspection portion 16 is sprayed
The 1/2 of the spacing P4 of mouth 176, the situation that the spacing P3 (a) in the recycling pocket portion 181 of device recoverer 18 is identical illustrates.
6th conveyor pallet structure 21 is will to remove the empty pallet 200 that region A5 is moved to from pallet to convey in X direction
Mechanism.Moreover, after the conveying, empty pallet 200 is configured at the position of recycling IC devices 90, become above-mentioned 3 it is empty
Any one in pallet 200.
It is the pallet 200 that recycling and removing are arranged with the multiple IC devices 90 for checking the state that finishes that pallet, which removes region A5,
Region.In pallet removes region A5, multiple pallets 200 can be laminated.
In addition, in a manner of removing region A5 across recovery zone A4 and pallet, it is provided with the of conveying pallet 200 one by one
Four conveyor pallet structure 22A, the 5th conveyor pallet structure 22B.
4th conveyor pallet structure 22A is will to be placed with to check the pallet 200 of IC devices 90 that finishes from recovery zone A4
It is delivered to the mechanism that pallet removes region A5.5th conveyor pallet structure 22B is the empty pallet that will be used to recycle IC devices 90
200 remove the mechanism that region A5 is delivered to recovery zone A4 from pallet.
The inspection control unit of above-mentioned verifier carries out being configured at inspection according to the program for being for example stored in storage part (not shown)
Look into the inspection etc. of the electrical characteristics of the IC devices 90 in portion 16.
In addition, as shown in Fig. 2, check device 1 has control unit 80 and is electrically connected with control unit 80 and carries out check device
1 operation portion 6 respectively operated.Control unit 80 for example controls the first conveyor pallet structure 11A, the second conveyor pallet structure 11B, temperature
Spend adjustment section 12, the first device delivery head 13, device supply unit 14, third conveyor pallet structure 15, inspection portion 16, the second device
Delivery head 17, device recoverer 18, third device delivery head 20, the 6th conveyor pallet structure 21, the 4th conveyor pallet structure
The driving in each portions such as 22A, the 5th conveyor pallet structure 22B, display unit 62.
In addition, operation portion 6 has the input unit 61 for carrying out each input and shows the display unit 62 of image.Input unit 61 does not have
Be particularly limited to, such as keyboard, mouse can be enumerated etc..In addition, display unit 62 is not particularly limited, such as liquid crystal display can be enumerated
Panel, organic EL display panel etc..The operation of the operation portion 6 of operator (operator) for example makes cursor by operation inputting part 61
It is moved to the position of each operation button (icon) shown on display unit 62 and selection (click) is completed.
In addition, input unit 61 is not limited to above structure, such as the mechanical operation button etc. such as can enumerate button.Separately
Outside, operation portion 6 is not limited to above structure, such as can enumerate and can carry out the inputs such as touch panel and the display of image
Device etc..In addition, constituting reporting unit by the display unit 62 in aforesaid operations portion 6.
Next, action when illustrating to convey the IC devices 90 of check device 1.
In addition, in order to make it easy to understand, action when also illustrating to convey the IC devices 90 of existing check device simultaneously.
The second-hand of the spacing P1 of the maintaining part 161 in the inspection portion 16 of premise check device 1 and the second device delivery head 17
The spacing P4 of second adsorption nozzle 176 of unit 175 is more than the first absorption of the first-hand unit 131 of the first device delivery head 13
The spacing P6 of the adsorption nozzle 202 of the maximum spacing of the spacing P5 of nozzle 132 and the hand unit 201 of third device delivery head 20
Maximum spacing, in this case, check device 1 can increase the quantity of the IC devices 90 conveyed per unit time and constitute.
First, the size in each portion of the check device 1 of present embodiment is as described above, by the maintaining part 161 in inspection portion 16
Spacing P1 and the spacing P4 of the second adsorption nozzle 176 of second-hand's unit 175 of the second device delivery head 17 be set as phase
Together.In addition, P1 and P4 are, for example, 60mm.
In addition, between the spacing P2 in supply pocket portion 141 of device supply unit 14, the recycling pocket portion 181 of device recoverer 18
Away from P3, the spacing P5 of the first adsorption nozzle 132 of the first-hand unit 131 of the first device delivery head 13, third device delivery head
The spacing P6 of the adsorption nozzle 202 of 20 hand unit 201 is identical, and the spacing P2, P3, P5 and P6 are spacing P1 and P4
1/2.In addition, P2, P3, P5 and P6 are, for example, 30mm.
On the other hand, shown in the size such as Figure 10 (b) in each portion of existing check device, by the supply of device supply unit 14
The spacing in the recycling pocket portion 181 of the spacing P12 in pocket portion 141, the spacing P11 of the maintaining part 161 in inspection portion 16, device recoverer 18
P13, the second device delivery head 17 the spacing P14 of the second adsorption nozzle 176 of second-hand's unit 175 be set as identical.
In addition, P11, P12, P13 and P14 are, for example, 60mm.
In addition, the spacing P15 of the first adsorption nozzle 132 of the first-hand unit 131 of the first device delivery head 13, with the
The spacing P16 of the adsorption nozzle 202 of the hand unit 201 of three device delivery heads 20 is identical, and spacing P15 and P16 are spacing
The 1/2 of P11, P12, P13 and P14.In addition, P15 and P16 are, for example, 30mm.
First, illustrate the action of existing check device.
[process 2-1]
In existing check device, as shown in Figure 10 (b), the first device delivery head 13 utilizes each first-hand unit 131,
IC devices 90 to being configured at temperature adjustment section 12 are held, and are moved towards Z-direction positive side, towards at least the 1 of X-direction and Y-direction
A direction movement is moved towards the top of device supply unit 14, is moved towards Z-direction negative side, by two IC in 4 IC devices 90
Device 90 is configured at two supply pocket portions 141 in 4 supply pocket portions 141 of device supply unit 14.Required for process 2-1
Time be set as " 1 ".In addition, above-mentioned required time without units such as " seconds ", but is indicated with relative value, in addition,
It is not accurate value but rough value.
[process 2-2]
Next, as shown in Figure 11 (b), the first device delivery head 13 is moved towards Z-direction positive side, is moved towards X-direction positive side,
It is moved towards Z-direction negative side, remaining two IC devices 90 is configured to remaining two supply pockets portion of device supply unit 14
141.The process 2-2 required times are set as " 1 ".In this way, in existing check device, the first device delivery head 13 will
Divide each supply pocket portion 141 that 2 times (multiple) are configured at device supply unit 14 4 (multiple) the IC devices 90 that hold.
[process 2-3]
Next, as shown in Figure 12 (b), device supply unit 14 is towards the movement of X-direction positive side i.e. towards the second device delivery head 17
Lower section movement.The process 2-3 required times are set as " 0.5 ".
[process 2-4]
Next, as shown in Figure 13 (b), the second device delivery head 17 is moved towards Z-direction negative side, utilizes each second-hand's unit
175, each IC devices 90 to being configured at device supply unit 14 are held (taking-up), are moved towards Z-direction positive side, negative towards Y-direction
Side movement is moved in a manner of making the top of each maintaining part 161 that each IC devices 90 are located at inspection portion 16, towards the shifting of Z-direction negative side
It is dynamic, each IC devices 90 are configured to each maintaining part 161 in inspection portion 16.The process 2-4 required times are set as " 0.5 ".
In this way, in existing check device, 4 IC devices 90 are unified each confession from device supply unit 14 by the second device delivery head 17
It is taken out to pocket portion 141, and is uniformly configured at each maintaining part 161 in inspection portion 16.
In addition, next, pressing each IC devices 90 to each maintaining part 161 using the second device delivery head 17 and utilizing
Inspection portion 16 carries out the inspection of each IC devices 90.
[process 2-5]
Next, as shown in Figure 14 (b), the second device delivery head 17 utilizes each second-hand's unit 175, to being configured at inspection
The IC devices 90 for each maintaining part 161 for looking into portion 16 are held, and are moved towards the directions Z positive side, towards the movement of Y-direction positive side i.e. towards device
The top of part recoverer 18 is moved, and is moved towards Z-direction negative side, each IC devices 90 are configured to each recycling of device recoverer 18
Pocket portion 181.The process 2-5 required times are set as " 0.5 ".In this way, in existing check device, the second device is defeated
It send first 17 to take out 4 unifications of IC devices 90 from each maintaining part 161 in inspection portion 16, and is uniformly configured at device recoverer 18
Each recycling pocket portion 181.
[process 2-6]
Next, as shown in Figure 15 (b), device recoverer 18 is moved towards X-direction positive side.
Moreover, third device delivery head 20 moves i.e. towards at least one direction of X-direction and Y-direction towards device recoverer 18
Top movement, moved towards Z-direction negative side, using 4 hand units 201 in 4 hand units 201, to being configured at device recycling
Two IC devices 90 in 4 IC devices 90 in portion 18 are held.
The process 2-6 required times are set as " 1 ".
[process 2-7]
Next, as shown in Figure 16 (b), third device delivery head 20 is moved towards Z-direction positive side, is moved towards X-direction positive side,
It is moved towards Z-direction negative side, remaining two IC devices 90 of device recoverer 18 is held.Required for process 2-7
Time be set as " 1 ".In this way, in existing check device, third device delivery head 20, which divides 2 times, will be configured at device recoverer
18 4 IC devices 90 take out.
In addition, next, third device delivery head 20 is delivered to recycling support according to inspection result, by each IC devices 90
Disk 19 and sky pallet 200 in some.
Here, the second device delivery head 17 holds the time after IC devices 90 to configuration than the first device delivery head 13
It is short to the time of configuration later to hold IC devices 90.One of its reason is configured to device supply unit 14 in the first device delivery head 13
In the case of IC devices 90, the first device delivery head 13 is not only moved along Z-direction, is also moved in X direction, and defeated in the second device
Send first 17 from device supply unit 14 take out IC devices 90 in the case of and the case where configure device 90 IC to device recoverer 18
Under, the second device delivery head 17 is moved along Z-direction, and device supply unit 14 and device recoverer 18 move in X direction.
Equally, the second device delivery head 17 holds the time after IC devices 90 to configuration than third device delivery head 20
It is short to the time of configuration later to hold IC devices 90.One of its reason is also in third device delivery head 20 to device recoverer 18
In the case of being configured at IC devices 90, third device delivery head 20 is not only moved along Z-direction, is also moved in X direction, and second
Device delivery head 17 from device supply unit 14 take out IC devices 90 in the case of and to device recoverer 18 configure IC devices 90
In the case of, the second device delivery head 17 is moved along Z-direction, and device supply unit 14 and device recoverer 18 move in X direction.
However, in existing check device, the second device delivery head 17 is unified from inspection portion 16 by 4 IC devices 90
Each maintaining part 161 take out, and be uniformly configured at each recycling pocket portion 181 of device recoverer 18, the first device delivery head 13 divides
2 each supply pocket portions 141 that the 4 IC devices 90 that hold will be configured at device supply unit 14, in addition, third device conveys
First 20 points are taken out 4 IC devices 90 for being configured at device recoverer 18 2 times.That is, it needs to the second device delivery head that the time is short
17 action frequency is 1 time in the supply of IC devices 90, is 1 time when IC devices 90 recycle, i.e., 2 times total (process 2-4,
Process 2-5), but it is respectively 2 to need the first device delivery head 13 of time length and the action frequency of third device delivery head 20
It is secondary, that is, add up to 4 times (process 2-1, process 2-2, process 2-6, process 2-7).Therefore, in existing check device, IC devices
90 conveying required time is elongated, and the quantity of the IC devices 90 conveyed per unit time is reduced.
Next, illustrating the action of the check device 1 of present embodiment.
[process 1-1]
In the check device 1 of present embodiment, as shown in Figure 10 (a), the first device delivery head 13 utilizes each first-hand
Unit 131, the IC devices 90 to being configured at temperature adjustment section 12 are held, and are moved towards Z-direction positive side, towards X-direction and Y-direction
At least one direction movement i.e. towards device supply unit 14 top move, towards Z-direction negative side move, each IC devices 90 are configured
In each supply pocket portion 141 of device supply unit 14.The process 1-1 required times are set as " 1 ".In this way, in check device 1
In, the first device delivery head 13 will uniformly be configured at 4 (multiple) the IC devices 90 that hold each supply of device supply unit 14
Pocket portion 141.
[process 1-2]
Next, as shown in Figure 11 (a), device supply unit 14 is towards the movement of X-direction positive side i.e. towards the second device delivery head 17
Lower section movement.
In addition, the second device delivery head 17 is moved towards Z-direction negative side, two second in 4 second-hand's units 175 are utilized
Hand unit 175 holds (taking-up) two IC devices 90 being configured in 4 IC devices 90 of device supply unit 14.It will
The process 1-2 required times are set as " 0.5 ".
[process 1-3]
Next, as shown in Figure 12 (a), the second device delivery head 17 is moved towards Z-direction positive side, and device supply unit 14 is towards X
Direction positive side movement, the second device delivery head 17 is moved towards Z-direction negative side, using remaining two second-hand's units 175, to matching
The remaining two IC devices 90 for being placed in device supply unit 14 are held.The process 1-3 required times are set as
“0.5”.In this way, in check device 1, the second device delivery head 17 divides 2 times (multiple) by 4 (multiple) IC devices 90 from device
It takes out in each supply pocket portion 141 of supply unit 14.
[process 1-4]
Next, as shown in Figure 13 (a), the second device delivery head 17 is moved towards Z-direction positive side, is moved towards Y-direction negative side
It is moved in a manner of making the top of each maintaining part 161 that each IC devices 90 are located at inspection portion 16, is moved towards Z-direction negative side, it will
Each IC devices 90 are configured at each maintaining part 161 in inspection portion 16.The process 1-4 required times are set as " 0.5 ".In this way,
In check device 1,4 IC devices 90 are uniformly configured at each maintaining part 161 in inspection portion 16 by the second device delivery head 17.
In addition, next, pressing each IC devices 90 to each maintaining part 161 using the second device delivery head 17 and utilizing
Inspection portion 16 carries out the inspection of each IC devices 90.
[process 1-5]
Next, as shown in Figure 14 (a), the second device delivery head 17 utilizes each second-hand's unit 175, to being configured at inspection
The IC devices 90 for each maintaining part 161 for looking into portion 16 are held, and are moved towards the directions Z positive side, towards the movement of Y-direction positive side i.e. towards device
The top of part recoverer 18 is moved, and is moved towards Z-direction negative side, two IC devices 90 in 4 IC devices 90 are configured at device
Two recycling pocket portions 181 in 4 recycling pocket portions 181 of recoverer 18.The process 1-5 required times are set as " 0.5 ".
[process 1-6]
Next, as shown in Figure 15 (a), the second device delivery head 17 is moved towards Z-direction positive side, and device recoverer 18 is towards X
Direction positive side movement, the second device delivery head 17 are moved towards Z-direction negative side, and remaining two IC devices 90, which are configured at device, to return
Remaining two recycling pockets portion 181 in receipts portion 18.The process 1-6 required times are set as " 0.5 ".In this way, being filled checking
In setting 1, the second device delivery head 17 divides 4 IC devices 90 to 2 each recycling pocket portions 181 for being configured at device recoverer 18.
[process 1-7]
Next, as shown in Figure 16 (a), device recoverer 18 is moved towards X-direction positive side.
Moreover, third device delivery head 20 moves i.e. towards at least one direction of X-direction and Y-direction towards device recoverer 18
Top movement, towards Z-direction negative side move, using each hand unit 201, to being configured at each IC devices 90 of device recoverer 18
It is held.The process 1-6 required times are set as " 1 ".In this way, in check device 1, third device delivery head 20
The unified taking-up of 4 IC devices 90 that device recoverer 18 will be configured at.
In addition, next, third device delivery head 20 is delivered to recycling support according to inspection result, by each IC devices 90
Disk 19 and sky pallet 200 in some.
In check device 1, the second device delivery head 17 divides 4 IC devices 90 to 2 each confessions from device supply unit 14
Pocket portion 141 is given to take out, in addition, divide 4 IC devices 90 to 2 each recycling pocket portions 181 for being configured at device recoverer 18, and the
One device delivery head 13 will uniformly be configured at the 4 IC devices 90 that hold each supply pocket portion 141 of device supply unit 14, separately
Outside, third device delivery head 20 is unified holds 4 IC devices 90 for being configured at device recoverer 18.That is, it needs to the time it is short
The action frequency of two device delivery heads 17 is 2 times in the supply of IC devices 90, is 2 times in the recycling of IC devices 90, that is, closes
The the first device delivery head 13 and the counted 4 times (process 1-2, process 1-3, process 1-5, process 1-6), and the time is needed to grow
The action frequency of three device delivery heads 20 is respectively 1 time, that is, adds up to 2 times (process 1-1, process 1-7).Therefore, in check device
In 1, the conveying required time of IC devices 90 shortens, and can increase the quantity of the IC devices 90 conveyed per unit time.
The chart of Figure 17 shows above result.The horizontal axis of Figure 17 is the action of the check device 1 of present embodiment
Each process 2-1~2-7 of the action of each process 1-1~1-7 and existing check device, the longitudinal axis are the inspections of present embodiment
Each process 2-1~2-7 of each process 1-1~1-7 required times (the wanted time) and existing check device of device 1
The required time.
As shown in figure 17, in the check device of present embodiment 1, the time that process 1-2 and process 1-6 need divides
It does not shorten to the half of the wanted time of the process 2-2 and process 2-6 of existing check device, it follows that being filled checking
In setting 1, compared with existing check device, the conveying required time of IC devices 90 is shortened.
As described above, according to the check device 1, the number of the IC devices 90 conveyed per unit time can be increased
Amount.
Thereby, it is possible to reduce the inoperative time of inspection portion 16, the inspection of IC devices 90 per unit time can be increased
Quantity.
Second embodiment
Figure 18 is the schematic top for the second embodiment for indicating the electronic component inspection device of the present invention.
Illustrate second embodiment below, but by with illustrated centered on the difference of above-mentioned first embodiment, save
The explanation of slightly identical item.
As shown in figure 18, in the check device of second embodiment 1, device supply unit 14, device recoverer 18 and
Second device delivery head 17 is configured with 2 along Y-direction respectively.Thereby, it is possible to increase the IC devices 90 conveyed per unit time
Quantity can increase the inspection quantity of IC devices 90 per unit time.
In addition, having 2 device supply units 14, so can be supplemented in time each other, equally, there are 2 devices
Part recoverer 18 equally, has 2 the second device delivery heads 17, so each other so can be supplemented in time each other
It can be supplemented in time.
Thereby, it is possible to further increase the quantity of the IC devices 90 conveyed per unit time, every list can be further increased
The inspection quantity of the IC devices 90 of position time.
By above such second embodiment, the effect being the same as the above first embodiment can be played.
More than, illustrated come electronic component handling apparatus of the invention and electronic unit inspection according to embodiment illustrated
Device, but the present invention is not limited thereto, and Each part can be replaced into arbitrary structures with the same function.In addition, also may be used
To add other arbitrary structures objects.
In addition, the present invention can also combine the structure (feature) of arbitrary 2 or more in the respective embodiments described above.
The explanation of reference numeral
1 ... check device (electronic component inspection device)；11A ... the first conveyor pallet structures；The second pallets of 11B ... are defeated
Send mechanism；12 ... temperature adjustment sections (impregnate plate)；13 ... first device delivery heads；131 ... first-hand units；132 ... first
Adsorption nozzle；14 ... device supply units (supply shuttle)；141 ... supply pocket portions；15 ... third conveyor pallet structures；16 ... check
Portion；161 ... maintaining parts；17 ... second device delivery heads；175 ... second-hand's units；176 ... second adsorption nozzles；18 ... devices
Part recoverer (recycling shuttle)；181 ... recycling pocket portions；19 ... recycling pallets；20 ... third device delivery heads；201 ... hand lists
Member；202 ... adsorption nozzles；21 ... the 6th conveyor pallet structures；The 4th conveyor pallet structures of 22A ...；The 5th pallets of 22B ... convey
Mechanism；6 ... operation portions；61 ... input units；62 ... display units；80 ... control units；90 ... IC devices；200 ... pallets；A1 ... pallets
Supply area；A2 ... devices supply area (supply area)；The inspection areas A3 ...；A4 ... devices recovery zone (recovery zone)；
A5 ... pallets remove region；The first Room R1 ...；R2 ... second Rooms；R3 ... thirds room；P1~P6 ... spacing；P11~P16 ...
Away from.
Claims (24)
1. a kind of electronic component handling apparatus, which is characterized in that have：
Delivery section can configure and convey multiple electronic units；
Handle part is supplied, multiple above-mentioned electronic units can be held and multiple above-mentioned electronic units are configured at above-mentioned conveying
Portion；And
Supply recycling handle part can hold multiple above-mentioned electronic units and supply and recycle multiple above-mentioned electronic units,
The electronic unit of above-mentioned supply handle part holds spacing and can be adjusted to configure spacing with the electronic unit of above-mentioned delivery section
It is identical,
The electronic unit holding spacing of above-mentioned supply recycling handle part is bigger than the electronic unit of above-mentioned delivery section configuration spacing,
Multiple above-mentioned electronic units are configured at above-mentioned delivery section by above-mentioned supply handle part,
Above-mentioned supply recycling handle part takes out multiple above-mentioned electronic units from above-mentioned delivery section several times.
2. electronic component handling apparatus according to claim 1, which is characterized in that
Multiple above-mentioned electronic units are uniformly configured at above-mentioned delivery section by above-mentioned supply handle part.
3. electronic component handling apparatus according to claim 1, which is characterized in that
The time of above-mentioned supply recycling handle part above-mentioned electronic unit from is holding to configuring than above-mentioned supply handle part from holding to
The time for configuring above-mentioned electronic unit is short.
4. electronic component handling apparatus according to claim 2, which is characterized in that
The time of above-mentioned supply recycling handle part above-mentioned electronic unit from is holding to configuring than above-mentioned supply handle part from holding to
The time for configuring above-mentioned electronic unit is short.
5. electronic component handling apparatus according to any one of claims 1 to 4, which is characterized in that
Above-mentioned supply handle part can towards the direction for configuring multiple above-mentioned electronic units and with configure multiple above-mentioned electronic units
The orthogonal direction movement in direction.
6. electronic component handling apparatus according to any one of claims 1 to 4, which is characterized in that
The direction that multiple above-mentioned electronic units are configured in above-mentioned delivery section is identical as the conveying direction of above-mentioned delivery section.
7. electronic component handling apparatus according to any one of claims 1 to 4, which is characterized in that
In the case where above-mentioned supply recycling handle part configures or takes out above-mentioned electronic unit, handle part energy is recycled in above-mentioned supply
Enough to be moved towards the direction orthogonal with multiple directions of above-mentioned electronic unit are configured, above-mentioned delivery section can be towards the multiple above-mentioned electricity of configuration
It moves in the direction of subassembly.
8. electronic component handling apparatus according to any one of claims 1 to 4, which is characterized in that
The spacing for being configured at multiple above-mentioned electronic units of above-mentioned delivery section is being set as a, handle part handle is recycled into above-mentioned supply
When the spacing for the multiple above-mentioned electronic units held is set as b, b/a is 2 or more integer.
9. electronic component handling apparatus according to any one of claims 1 to 4, which is characterized in that
Above-mentioned electronic component handling apparatus has the maintaining part that can keep above-mentioned electronic unit,
Above-mentioned supply recycling handle part can press above-mentioned electronic unit to above-mentioned maintaining part.
10. electronic component handling apparatus according to any one of claims 1 to 4, which is characterized in that
Above-mentioned supply recycling handle part and above-mentioned delivery section are each provided with 2.
11. a kind of electronic component handling apparatus, which is characterized in that have：
Delivery section can configure and convey multiple electronic units；
Handle part is recycled, the multiple above-mentioned electronic units for being configured at above-mentioned delivery section can be held and by multiple above-mentioned ministrys of electronics industry
Part takes out from above-mentioned delivery section；And
Supply recycling handle part can hold multiple above-mentioned electronic units and supply and recycle multiple above-mentioned electronic units,
The electronic unit of above-mentioned recycling handle part holds spacing and can be adjusted to configure spacing with the electronic unit of above-mentioned delivery section
It is identical,
The electronic unit holding spacing of above-mentioned supply recycling handle part is bigger than the electronic unit of above-mentioned delivery section configuration spacing,
Multiple above-mentioned electronic units are configured at above-mentioned delivery section by above-mentioned supply recycling handle part several times,
Above-mentioned recycling handle part takes out multiple above-mentioned electronic units from above-mentioned delivery section.
12. electronic component handling apparatus according to claim 11, which is characterized in that
Above-mentioned recycling handle part is unified from the taking-up of above-mentioned delivery section by multiple above-mentioned electronic units.
13. electronic component handling apparatus according to claim 11, which is characterized in that
The time of above-mentioned supply recycling handle part above-mentioned electronic unit from is holding to configuring than above-mentioned recycling handle part from holding to
The time for configuring above-mentioned electronic unit is short.
14. electronic component handling apparatus according to claim 12, which is characterized in that
The time of above-mentioned supply recycling handle part above-mentioned electronic unit from is holding to configuring than above-mentioned recycling handle part from holding to
The time for configuring above-mentioned electronic unit is short.
15. the electronic component handling apparatus according to any one of claim 11~14, which is characterized in that
Above-mentioned recycling handle part can towards the direction for configuring multiple above-mentioned electronic units and with configure multiple above-mentioned electronic units
The orthogonal direction movement in direction.
16. the electronic component handling apparatus according to any one of claim 11~14, which is characterized in that
The direction that multiple above-mentioned electronic units are configured in above-mentioned delivery section is identical as the conveying direction of above-mentioned delivery section.
17. the electronic component handling apparatus according to any one of claim 11~14, which is characterized in that
In the case where above-mentioned supply recycling handle part configures or takes out above-mentioned electronic unit, handle part energy is recycled in above-mentioned supply
Enough to be moved towards the direction orthogonal with multiple directions of above-mentioned electronic unit are configured, above-mentioned delivery section can be towards the multiple above-mentioned electricity of configuration
It moves in the direction of subassembly.
18. the electronic component handling apparatus according to any one of claim 11~14, which is characterized in that
The spacing for being configured at multiple above-mentioned electronic units of above-mentioned delivery section is being set as a, handle part handle is recycled into above-mentioned supply
When the spacing for the multiple above-mentioned electronic units held is set as b, b/a is 2 or more integer.
19. the electronic component handling apparatus according to any one of claim 11~14, which is characterized in that
Above-mentioned electronic component handling apparatus has the maintaining part that can keep above-mentioned electronic unit,
Above-mentioned supply recycling handle part can press above-mentioned electronic unit to above-mentioned maintaining part.
20. the electronic component handling apparatus according to any one of claim 11~14, which is characterized in that
Above-mentioned supply recycling handle part and above-mentioned delivery section are each provided with 2.
21. a kind of electronic component inspection device, which is characterized in that have：
Delivery section can configure and convey multiple electronic units；
Handle part is supplied, multiple above-mentioned electronic units can be held and multiple above-mentioned electronic units are configured at above-mentioned conveying
Portion；
Supply recycling handle part, can hold multiple above-mentioned electronic units and supply and recycle multiple above-mentioned electronic units；With
And
Inspection portion checks above-mentioned electronic unit,
The electronic unit of above-mentioned supply handle part holds spacing and can be adjusted to configure spacing with the electronic unit of above-mentioned delivery section
It is identical,
The electronic unit holding spacing of above-mentioned supply recycling handle part is bigger than the electronic unit of above-mentioned delivery section configuration spacing,
Multiple above-mentioned electronic units are configured at above-mentioned delivery section by above-mentioned supply handle part,
Above-mentioned supply recycling handle part takes out multiple above-mentioned electronic units from above-mentioned delivery section several times.
22. electronic component inspection device according to claim 21, which is characterized in that
Above-mentioned supply recycling handle part can supply and recycle above-mentioned electronic unit to above-mentioned inspection portion.
23. a kind of electronic component inspection device, which is characterized in that have：
Delivery section can configure and convey multiple electronic units；
Handle part is recycled, the multiple above-mentioned electronic units for being configured at above-mentioned delivery section can be held and by multiple above-mentioned ministrys of electronics industry
Part takes out from above-mentioned delivery section；
Supply recycling handle part, can hold multiple above-mentioned electronic units and supply and recycle multiple above-mentioned electronic units；With
And
Inspection portion checks above-mentioned electronic unit,
The electronic unit of above-mentioned recycling handle part holds spacing and can be adjusted to configure spacing with the electronic unit of above-mentioned delivery section
It is identical,
The electronic unit holding spacing of above-mentioned supply recycling handle part is bigger than the electronic unit of above-mentioned delivery section configuration spacing,
Multiple above-mentioned electronic units are configured at above-mentioned delivery section by above-mentioned supply recycling handle part several times,
Above-mentioned recycling handle part takes out multiple above-mentioned electronic units from above-mentioned delivery section.
24. electronic component inspection device according to claim 23, which is characterized in that
Above-mentioned supply recycling handle part can supply and recycle above-mentioned electronic unit to above-mentioned inspection portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015034916A JP2016156715A (en) | 2015-02-25 | 2015-02-25 | Electronic component conveyance device and electronic component inspection device |
| JP2015-034916 | 2015-02-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105905600A CN105905600A (en) | 2016-08-31 |
| CN105905600B true CN105905600B (en) | 2018-08-03 |
Family
ID=56744350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610055013.8A Expired - Fee Related CN105905600B (en) | 2015-02-25 | 2016-01-27 | Electronic component handling apparatus and electronic component inspection device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2016156715A (en) |
| CN (1) | CN105905600B (en) |
| TW (1) | TWI619951B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108414850A (en) * | 2017-01-30 | 2018-08-17 | 精工爱普生株式会社 | Electronic component handling apparatus and electronic component inspection device |
| JP2018141699A (en) * | 2017-02-28 | 2018-09-13 | セイコーエプソン株式会社 | Electronic component conveyance device and electronic component inspection device |
| JP2019045232A (en) * | 2017-08-31 | 2019-03-22 | セイコーエプソン株式会社 | Electronic component conveyance device and electronic component inspection device |
| TWI821780B (en) * | 2021-09-17 | 2023-11-11 | 致茂電子股份有限公司 | Temperature control system, temperature control method and testing apparatus of image sensor with the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1911537A (en) * | 2005-08-09 | 2007-02-14 | 未来产业株式会社 | IC sorter |
| CN101329362A (en) * | 2007-06-22 | 2008-12-24 | 精工爱普生株式会社 | Component conveying apparatus and IC processor |
| CN101533793A (en) * | 2008-03-11 | 2009-09-16 | 精工爱普生株式会社 | Component test apparatus and component transport method |
| CN102974554A (en) * | 2011-09-06 | 2013-03-20 | 精工爱普生株式会社 | Handler and part inspection apparatus |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2628392B2 (en) * | 1990-01-16 | 1997-07-09 | 新明和工業株式会社 | IC package handling method |
| JPH04371419A (en) * | 1991-06-18 | 1992-12-24 | Matsushita Electron Corp | Attaching/removing device for semiconductor device |
| JP3341324B2 (en) * | 1992-12-01 | 2002-11-05 | 日立電子エンジニアリング株式会社 | Work transfer device and work transfer method |
| JP2005127903A (en) * | 2003-10-24 | 2005-05-19 | Seiko Epson Corp | Probing test method of semiconductor chips |
| JP2006292590A (en) * | 2005-04-12 | 2006-10-26 | Seiko Epson Corp | Inspection method and inspection device |
| KR100897068B1 (en) * | 2007-05-03 | 2009-05-14 | (주)테크윙 | Test handler |
| JP2011014583A (en) * | 2009-06-30 | 2011-01-20 | Tesetsuku:Kk | Electronic component transfer device |
| JP5621313B2 (en) * | 2010-05-14 | 2014-11-12 | セイコーエプソン株式会社 | Electronic component inspection apparatus and electronic component conveying method |
| JP5942459B2 (en) * | 2012-02-14 | 2016-06-29 | セイコーエプソン株式会社 | Handler and parts inspection device |
| JP5219056B1 (en) * | 2012-09-06 | 2013-06-26 | 上野精機株式会社 | Taping unit and electronic component inspection device |
| TW201421013A (en) * | 2012-11-16 | 2014-06-01 | Prov Technology Corp | Electronic device inspection and classification equipment |
-
2015
- 2015-02-25 JP JP2015034916A patent/JP2016156715A/en active Pending
-
2016
- 2016-01-27 CN CN201610055013.8A patent/CN105905600B/en not_active Expired - Fee Related
- 2016-02-22 TW TW105105178A patent/TWI619951B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1911537A (en) * | 2005-08-09 | 2007-02-14 | 未来产业株式会社 | IC sorter |
| CN101329362A (en) * | 2007-06-22 | 2008-12-24 | 精工爱普生株式会社 | Component conveying apparatus and IC processor |
| CN101533793A (en) * | 2008-03-11 | 2009-09-16 | 精工爱普生株式会社 | Component test apparatus and component transport method |
| CN102974554A (en) * | 2011-09-06 | 2013-03-20 | 精工爱普生株式会社 | Handler and part inspection apparatus |
| CN103996641A (en) * | 2011-09-06 | 2014-08-20 | 精工爱普生株式会社 | Handler and part inspection apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105905600A (en) | 2016-08-31 |
| JP2016156715A (en) | 2016-09-01 |
| TWI619951B (en) | 2018-04-01 |
| TW201702617A (en) | 2017-01-16 |
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