CN109720860A - Electronic component handling apparatus, electronic component inspection device and adsorption element - Google Patents

Abstract

A kind of electronic component handling apparatus, electronic component inspection device and adsorption element, become easy the replacement operation of adsorption element.Electronic component handling apparatus has the delivery section of conveying electronic component, and the delivery section includes adsorption element, adsorbs the electronic component；And mounting portion, it is mounted the adsorption element, the adsorption element is provided with the first holding section, the mounting portion is provided with the second holding section, the second position that second engagement site moves on to the first position for being sticked in first holding section and do not engage with first holding section.

Description

Electronic component handling apparatus, electronic component inspection device and adsorption element

Technical field

The present invention relates to electronic component handling apparatus, electronic component inspection device and adsorption elements.

Background technique

Conventionally, there is known the IC processor (handler) of electric test can be carried out to IC device (for example, with reference to patent text Part 1).Delivery section of the IC processor that patent document 1 is recorded as conveying IC device has metal gasket adapter and is installed on gold Belong to the rubber pad of pad adapter.Moreover, IC device can be adsorbed with rubber pad and directly transported.In addition, corresponding to IC device Size, type, the different rubber pad such as replacement size.

Prior art document

Patent document

Patent document 1: Japanese Unexamined Patent Publication 08-267383 bulletin

For example, metal gasket adapter and rubber pad are engaged through the thread and be installed on the IC processor of this composition.At this In the case of kind, when carrying out the replacement operation of rubber pad, it is necessary to rotate rubber pad and be held in metal gasket adapter or necessary Torque management etc. is carried out, replacement operation is complicated.

Summary of the invention

The present invention is at least part in order to solve the above problems and completes, and can be accomplished by the following way.

The present invention provides a kind of electronic component handling apparatus, has the delivery section of conveying electronic component, the delivery section tool Have: adsorption element adsorbs the electronic component；And mounting portion, it is mounted the adsorption element, is arranged in the adsorption element There is the first holding section, the mounting portion is provided with the second holding section, second engagement site, which moves on to, is sticked in described first The first position of holding section and the second position not engaged with first holding section.

It, can be easily and rapidly from peace as a result, by pulling the adsorption element being mounted under the installation condition of mounting portion Dress portion is detached from adsorption element.In addition, for the mounting portion for the state for not yet installing adsorption element, by being pressed into adsorption element, energy It is enough that adsorption element is easily and rapidly installed on mounting portion.As above, adsorption element becomes rapid relative to the handling of mounting portion And it is easy.Thereby, it is possible to the types according to electronic component, are easy to carry out the operation of replacement adsorption element.

Preferably, in electronic component handling apparatus of the invention, the adsorption element, which has, is inserted into the mounting portion Tubular portion, first holding section is made of the recess portion that the peripheral part of the tubular portion is arranged in, second holding section by The protrusion that the recess portion is sticked in when being displaced to the first position is constituted.

Thereby, it is possible to be easy to carry out charge and discharge operations of the adsorption element relative to mounting portion, as a result, being based on electronic component The replacement operation of the adsorption element of type becomes easy.

Preferably, in electronic component handling apparatus of the invention, the recess portion is by the peripheral part along the tubular portion The slot of circumferencial direction setting constitute, it is multiple and engage along the slot configuration when protrusion is by being displaced to the first position It is constituted in the sphere of the slot.

Thereby, it is possible to be easy to carry out charge and discharge operations of the adsorption element relative to mounting portion, as a result, being based on electronic component The replacement operation of the adsorption element of type becomes easy.

Preferably, in electronic component handling apparatus of the invention, the mounting portion has operation portion, and the operation portion is used In the operation for carrying out for second holding section being limited in the first position.

As a result, when operating operation portion, it can be detached from the adsorption element for being mounted on mounting portion or opposite to that, still The mounting portion installation adsorption element of adsorption element is not installed.

Preferably, in electronic component handling apparatus of the invention, the mounting portion has force section, the force section pair The operation portion exerts a force and second holding section is limited in the first position.

Thereby, it is possible to prevent the adsorption element under installation condition to be detached from from the non-original idea of mounting portion.

Preferably, in electronic component handling apparatus of the invention, the electronic component handling apparatus is with shape and greatly At least one of small type according to the electronic component and different multiple adsorption elements, select the multiple adsorption section One in part, it is installed on the mounting portion.

Thereby, it is possible to which the adsorption element for being suitable for various electronic components is installed on mounting portion, therefore pass through the adsorption section Part can steadily adsorb electronic component.

Preferably, in electronic component handling apparatus of the invention, the adsorption element includes the first component, has and inserts Enter the tubular portion to the mounting portion；And second component, there is the absorption layer for adsorbing the electronic component, and with described first Component connection.

As a result, for example, preparing different multiple second components such as shape, size, just using the first component as common unit Can by be suitable for various electronic components adsorption element be installed on mounting portion come using.

Preferably, in electronic component handling apparatus of the invention, the electronic component handling apparatus is with shape and greatly At least one of small type according to the electronic component and different multiple second components select the multiple second It one in part, is connect with the first component.

Thereby, it is possible to by the adsorption element for being suitable for various electronic components be installed on mounting portion come using.

Preferably, in electronic component handling apparatus of the invention, the second component is connected to the first component Attended operation and connection release operation that the first component is connect with the second component is released by the adsorption element It is carried out in the state of mounting portion disengaging.

As a result, for example be attached, separating operation when, the case where compared to installation condition is set as, can easily into Its operation of row.

Preferably, in electronic component handling apparatus of the invention, the first component is provided with internal screw thread, described Second component is provided with the external screw thread being screwed with the internal screw thread to connect with the first component.

As a result, for example as second component, existing screw-on adsorption element can be connected to the first component come using.

Preferably, in electronic component handling apparatus of the invention, the mounting portion has limiting unit, the limiting unit limit The electronic component adsorbed by the adsorption element is made to rotate around vertical axis.

As a result, for example when electronic component under vertical view be in quadrilateral shape when, can prevent adjacent electronic component from doing each other It disturbs.

The present invention provides a kind of electronic component inspection device, has: delivery section, conveys electronic component；And inspection portion, inspection The electronic component is looked into, the delivery section includes adsorption element, adsorbs the electronic component；And mounting portion, it is mounted described Adsorption element is provided with the first holding section in the adsorption element, and the mounting portion is provided with the second holding section, and described second Holding section can be displaced to the first position for being sticked in first holding section and not engage with first holding section second Position.

It, can be easily and rapidly from peace as a result, by pulling the adsorption element being mounted under the installation condition of mounting portion Dress portion is detached from adsorption element.In addition, for the mounting portion for the state for not yet installing adsorption element, by being pressed into adsorption element, energy It is enough that adsorption element is easily and rapidly installed on mounting portion.As above, adsorption element becomes rapid relative to the handling of mounting portion And it is easy.Thereby, it is possible to the types according to electronic component, are easy to carry out the operation of replacement adsorption element.

The present invention provides a kind of adsorption element, which is characterized in that and it is installed on mounting portion and adsorbs electronic component, the installation The delivery section for conveying the electronic component is arranged in portion, the adsorption element is provided with the first holding section, in the mounting portion Be provided with the second holding section, second holding section can be displaced to the first position for being sticked in first holding section and with institute State the second position that the first holding section does not engage, the adsorption element has a tubular portion for being inserted into the mounting portion, and described the One holding section is made of the slot that the circumferencial direction of the peripheral part along the tubular portion is arranged, and second holding section is by being displaced to Sphere that is multiple and being sticked in the slot is configured along the slot when first position to constitute.

Thereby, it is possible to which electronic component is transported to inspection portion, therefore the electronic component can be examined by inspection portion It looks into.In addition, the electronic component after checking can be conveyed from inspection portion.

Detailed description of the invention

Fig. 1 is the summary stereogram of the first embodiment of electronic component inspection device of the invention from face side.

Fig. 2 is the schematic top view for showing the working condition of electronic component inspection device shown in FIG. 1.

Fig. 3 is the decomposition for showing the device conveying seat in the device feed region of electronic component inspection device shown in FIG. 1 Perspective view.

Fig. 4 is successively to show from the device in the device feed region of electronic component inspection device shown in fig. 1 to convey seat Process of the installation section from adsorption element vertical cross section.

Fig. 5 is successively to show from the device in the device feed region of electronic component inspection device shown in fig. 1 to convey seat Process of the installation section from adsorption element vertical cross section.

Fig. 6 is successively to show from the device in the device feed region of electronic component inspection device shown in fig. 1 to convey seat Process of the installation section from adsorption element vertical cross section.

Fig. 7 is successively to show from the device in the device feed region of electronic component inspection device shown in fig. 1 to convey seat Process of the installation section from adsorption element vertical cross section.

Fig. 8 is successively to show from the device in the device feed region of electronic component inspection device shown in fig. 1 to convey seat Process of the installation section from adsorption element vertical cross section.

Fig. 9 is successively shown in the device feed region of electronic component inspection device of the invention (second embodiment) Device conveys the main view of the working condition of seat.

Figure 10 is successively shown in the device feed region of electronic component inspection device of the invention (second embodiment) Device conveying seat working condition main view.

Figure 11 is the device shown in the device feed region of electronic component inspection device of the invention (third embodiment) Part conveys the decomposition vertical cross section of the adsorption element of seat.

Figure 12 is the device shown in the device feed region of electronic component inspection device of the invention (the 4th embodiment) Part conveys the decomposition vertical cross section of the adsorption element of seat.

Figure 13 is the device shown in the device feed region of electronic component inspection device of the invention (the 5th embodiment) Part conveys the vertical cross section of the adsorption element of seat.

Description of symbols

1 ... electronic component inspection device；10 ... electronic component handling apparatus；11A ... conveyor pallet structure；11B ... pallet Conveying mechanism；12 ... temperature regulation sections；13 ... devices convey seat；131 ... pumps；132 ... base portions；14 ... device supply departments；14A… Device supply department；14B ... device supply department；141 ... recess portions；142 ... side walls；15 ... conveyor pallet structures；16 ... inspection portions； 17 ... devices convey seat；17A ... device conveys seat；17B ... device conveys seat；18 ... device recoverers；The recycling of 18A ... device Portion；18B ... device recoverer；Pallet is used in 19 ... recycling；20 ... devices convey seat；21 ... conveyor pallet structures；22A ... pallet is defeated Send mechanism；22B ... conveyor pallet structure；231 ... first next doors；232 ... second next doors；233 ... third next doors；234 ... the 4th Next door；235 ... the 5th next doors；241 ... front covers；242 ... side covers；243 ... side covers；244 ... rear covers；245 ... top covers；25 ... conveyings Portion；3 ... adsorption elements；3A ... adsorption element；3B ... adsorption element；30A ... the first component；30B ... second component；30B1 ... Two components；30B2 ... second component；31 ... absorption layers；311 ... lower end surfaces；312 ... opening portions；313 ... wide diameter portions；32 ... bearings Portion's (absorption layer supporting part)；321 ... flange parts；322 ... notch sections；33 ... tubular portions；331 ... first holding sections；331a ... inclines Inclined-plane；332 ... peripheral parts；34 ... supporting parts (tubular portion supporting part)；35 ... inner spaces；36 ... external screw threads；37 ... internal screw threads； 38 ... seal members (liner)；4 ... mounting portions；41 ... inside cylindrical portions；411 ... inner spaces；412 ... inner peripheral portion；413… Slot；414 ... protruding portions；42 ... second holding sections；421 ... spheres；43 ... operation portions；431 ... press sections；44 ... force sections； 441 ... helical springs；442 ... upper ends；443 ... lower ends；45 ... limiting units；451 ... bar-shaped portions；46 ... seal members (liner)； 90 ... IC devices；901 ... stepped parts；200 ... pallets；300 ... monitors；301 ... display pictures；400 ... signal lamps；500… Loudspeaker；600 ... mouse racks；700 ... operation panels；800 ... control units；A1 ... pallet feed region；A2 ... device supply area Domain；The inspection area A3 ...；A4 ... device recovery zone；A5 ... pallet removes region；O3 ... central axis；O141 ... central axis；α 11A ... arrow；α 11B ... arrow；α 13X ... arrow；α 13Y ... arrow；α 14 ... arrow；α 15 ... arrow；α 17Y ... arrow；α 18 ... arrows；α 20X ... arrow；α 20Y ... arrow；α 21 ... arrow；α 22A ... arrow；α 22B ... arrow；α 90 ... arrow.

Specific embodiment

In the following, the preferred embodiment based on the figure electronic component handling apparatus and electricity that the present invention will be described in detail Subassembly check device.

First embodiment

In the following, referring to Fig.1~Fig. 8, illustrates electronic component handling apparatus and electronic component inspection device of the invention First embodiment.In addition, hereinafter, for convenience of explanation, as shown in Figure 1, using three orthogonal axis as X-axis, Y-axis And Z axis.In addition, the X/Y plane comprising X-axis and Y-axis is in level, Z axis vertical.In addition, the direction for being parallel to X-axis is known as the " side X To (first direction) ", the direction for being parallel to Y-axis is known as " Y-direction (second direction) ", the direction for being parallel to Z axis is known as " Z Direction (third direction) ".In addition, the direction that the arrow of all directions is directed toward is known as " just ", by its opposite direction referred to as " negative ".Separately Outside, "horizontal" described in present specification is not limited to fully horizontally, as long as not interfering the conveying of electronic component, is also wrapped Containing relative to horizontal slightly (being, for example, less than ± 5 ° or so) inclined state.In addition, sometimes by Fig. 1, Fig. 3~Fig. 8 (Fig. 9~ Figure 13 is also identical) upside, that is, Z-direction positive side be known as "upper" or " top ", downside, that is, Z-direction negative side is known as "lower" Or " lower section ".

Electronic component handling apparatus 10 of the invention has appearance shown in FIG. 1.The electronic component handling apparatus 10 has Convey the delivery section 25 of the IC device 90 as electronic component.Delivery section 25 have can adsorb IC device 90 (electronic component) Adsorption element 3 and mounting portion 4 for detachably installing adsorption element 3.In adsorption element 3, the first holding section is set 331.Second holding section 42 is set in mounting portion 4, the second holding section 42, which can be displaced to, to be engaged with the first holding section 331 and become It is mounted the first position of the installation condition of adsorption element 3 and releases the second position of installation condition.

In addition, in the present embodiment, as the component of absorption conveying IC device 90, device conveys seat 13, device conveying Seat 17 and device conveying seat 20 are contained in delivery section 25.Hereinafter, illustrate the example for applying the present invention to device conveying seat 13 Son, but application site is not limited to device conveying seat 13, additionally it is possible to it applies and conveys seat 17, device conveying seat 20 in device.

According to such present invention, as described later, by pulling the adsorption section being mounted under the installation condition of mounting portion 4 Part 3 can easily and rapidly be such that adsorption element 3 separates from mounting portion 4.In addition, for being even fitted without adsorption element 3 Adsorption element 3 easily and rapidly can be installed on mounting portion 4 by pressing adsorption element 3 by the mounting portion 4 of state.Such as with On, adsorption element 3 becomes quickly and easily relative to the handling of mounting portion 4.The type for corresponding to IC device 90 as a result, can It is easy to carry out the operation of replacement adsorption element 3.

In addition, as shown in Fig. 2, electronic component inspection device 1 of the invention be with electronic component handling apparatus 10 and It is also equipped with the test macro (test system) for checking the inspection portion 16 of electronic component.That is, electronic component inspection device 1 is tool The delivery section 25 of IC device 90 of the standby conveying as electronic component and the survey in the inspection portion 16 for checking IC device 90 (electronic component) Test system.Delivery section 25 have can adsorb the adsorption element 3 of IC device 90 (electronic component) and for detachably pacifying Fill the mounting portion 4 of adsorption element 3.In adsorption element 3, the first holding section 331 is set.In mounting portion 4, the second holding section 42 is set, Second holding section 42 can become the first position for engaging and installing the installation condition of adsorption element 3 with the first holding section 331 It is displaced between the second position of releasing installation condition.

The electronic component inspection device 1 with above-mentioned electronic component handling apparatus 10 is obtained as a result,.In addition, energy It is enough that IC device 90 (electronic component) is transported to inspection portion 16, therefore, the IC device 90 can be examined by inspection portion 16 It looks into.In addition, the IC device 90 after checking can be conveyed from inspection portion 16.

In the following, explaining Each part in detail.

As shown in Figure 1 and Figure 2, the electronic component inspection device 1 with electronic component handling apparatus 10 is to convey such as BGA (Ball Grid Array: ball grid array) encapsulation be the electronic components such as IC device and checked in its transmission process and test (with Referred to as " check " down) devices of the electrical characteristics of electronic component.In addition, hereinafter, for convenience of description, IC device is used The case where making the electronic component is illustrated for representative, as " IC device 90 ".IC device 90 is in the present embodiment In tabular (referring to Fig. 4).

In addition, as IC device, in addition to above-mentioned, can enumerate for example " LSI (Large Scale Integration: Large scale integrated circuit) ", " CMOS (Complementary MOS: complementary MOS) ", " CCD (Charge Coupled Device: charge-coupled device) ", IC device blocks are turned to " module I C ", " the crystal device ", " pressure sensing of multiple modules Device ", " inertial sensor (acceleration transducer) ", " gyrosensor ", " fingerprint sensor " etc..

Electronic component inspection device 1 (electronic component handling apparatus 10) has pallet feed region A1, device feed region A2, inspection area A3, device recovery zone A4, pallet remove region A5, these regions are divided by aftermentioned each wall portion.And And IC device 90 along 90 direction of arrow α successively removes region A5 from pallet feed region A1 to pallet via each region, Inspection area A3 on the way is checked.In this way, electronic component inspection device 1 has: electronic component handling apparatus 10, have with The delivery section 25 of IC device 90 is conveyed via the mode in each region；Inspection portion 16 is checked in the A3 of inspection area；And control Portion 800 processed.In addition, in addition to this, electronic component inspection device 1 has monitor 300, signal lamp 400, operation panel 700.

In addition, electronic component inspection device 1 will remove side, i.e. Fig. 2 of region A5 with tray feed region A1, pallet Middle downside as face side and by the side of configuration inspection region A3, i.e. Fig. 2 upside as back side come using.

In addition, electronic component inspection device 1 is carried in advance is referred to as " replacement set according to each 90 variety exchanging of IC device Part " and use.There is the mounting portion (electronic component mounting portion) of mounting IC device 90 (electronic component) in the replacement external member.At this In the electronic component inspection device 1 of embodiment, the mounting portion is set in multiple positions, such as there are aftermentioned temperature regulation sections 12, device supply department 14 and device recoverer 18.In addition, in the mounting portion (electronic component of mounting IC device 90 (electronic component) Mounting portion) in, independently of that above-mentioned replacement external member, in addition the pallet 200 prepared there is also user, recycling pallet 19 are gone back There are inspection portions 16.

Pallet feed region A1 is the piece supplying that the pallet 200 for the multiple IC devices 90 for being arranged with non-inspection state is supplied Portion.Pallet feed region A1 is referred to as that the carrying region for carrying multiple pallets 200 can be stacked.In addition, in this embodiment party In formula, multiple recess portions (bag) has been arranged in a matrix in each pallet 200.Each IC device of mounting can be accommodated in each recess portion 90。

Device feed region A2 is will to divide from multiple IC devices 90 on the pallet 200 that pallet feed region A1 conveying comes The region of inspection area A3 Shu Song be supplied to.In addition, being set in a manner of across pallet feed region A1 and device feed region A2 It is equipped with conveyor pallet structure 11A, the 11B for conveying pallet 200 one by one in the horizontal direction.Conveyor pallet structure 11A is delivery section 25 A part, can make pallet 200 and the IC device 90 that is placed on the pallet 200 together into the positive side of Y-direction, i.e. Fig. 2 The direction arrow α 11A it is mobile.Thereby, it is possible to IC device 90 is steadily sent into device feed region A2.In addition, pallet conveys Mechanism 11B is the moving portion for the direction the arrow α 11B movement that empty pallet 200 can be made into the negative side of Y-direction, i.e. Fig. 2.As a result, Empty pallet 200 can be made mobile from device feed region A2 to pallet feed region A1.

Device feed region A2 is provided with temperature regulation section (for example, temperature-uniforming plate (soak plate)) 12, device conveying Seat 13 and conveyor pallet structure 15.It is moved in a manner of across device feed region A2 and inspection area A3 in addition, being additionally provided with Device supply department 14.

Temperature regulation section 12 is to load the mounting portion of multiple IC devices 90, the IC device 90 1 that can will be referred to as loaded Act " temperature-uniforming plate " being heated or cooled.By the temperature-uniforming plate, the IC device 90 before being checked by inspection portion 16 can be added in advance Heat cools down and is adjusted to the temperature suitable for the inspection (high temperature inspection).

Temperature regulation section 12 as this mounting portion is fixed.Thereby, it is possible to the IC device in the temperature regulation section 12 Part 90 steadily carries out temperature adjusting.

In addition, temperature regulation section 12 is grounded (grounded).

In composition shown in Fig. 2, temperature regulation section 12 there are two fixing is configured in the Y direction.Moreover, by conveyor pallet Structure 11A is transported to any temperature regulation section 12 from the IC device 90 on the pallet 200 that pallet feed region A1 conveying is come in.

Device conveying seat 13 is the handle part for holding conveying IC device 90, is supported in device feed region A2 as can It is mobile.The device conveys a part that seat 13 is also delivery section 25, can undertake IC device 90 defeated from pallet feed region A1 The conveying being sent between the pallet 200 come and temperature regulation section 12 and IC device 90 are in temperature regulation section 12 and aftermentioned device Conveying between supply department 14.In addition, showing device in Fig. 2 by arrow α 13X and conveying seat 13 in the movement of X-direction, lead to It crosses arrow α 13Y and the movement of device conveying seat 13 in the Y direction is shown.

Device supply department 14 is the mounting portion for the IC device 90 that mounting is adjusted after temperature, referred to as can be defeated by the IC device 90 " for using shuttle plate " that is sent near inspection portion 16 or referred to as " supply shuttle ".The device supply department 14 can also become delivery section 25 a part.Multiple recess portions (bag) is arranged in a matrix in the device supply department 14.It is each that mounting can be accommodated in each recess portion One IC device 90.

In addition, be supported to can be in device feed region A2 and inspection portion 16 for the device supply department 14 as mounting portion It is in X direction that 14 direction of arrow α moves back and forth (can move) between the A3 of inspection area.Device supply department 14 can incite somebody to action as a result, IC device 90 is stably delivered near the inspection portion 16 of inspection area A3 from device feed region A2, in addition, in inspection area It is after 90s that A3 by device conveying seat 17 takes IC device away, can again return to device feed region A2.

In composition shown in Fig. 2, Liang Ge device supply department 14 is configured in the Y direction, sometimes by the device of Y-direction negative side Supply department 14 is known as " device supply department 14A ", and the device supply department 14 of Y-direction positive side is known as " device supply department 14B ".And And the IC device 90 in temperature regulation section 12 is transported to device supply department 14A or device supply in device feed region A2 Portion 14B.In addition, same as temperature regulation section 12, device supply department 14 is configured to heat or cooling is positioned in the device The IC device 90 of supply department 14.Accordingly, for the IC device 90 for carrying out temperature adjusting in temperature regulation section 12, it can maintained It is transported in the case where temperature adjustment state near the inspection portion 16 of inspection area A3.In addition, device same as temperature regulation section 12 Part supply department 14 is also grounded.

Conveyor pallet structure 15 is the empty pallet 200 that the state of all IC devices 90 will be removed in device feed region A2 The mechanism conveyed to 15 direction of positive side, that is, arrow α of X-direction.Moreover, empty pallet 200 passes through conveyor pallet after its conveying Structure 11B returns to pallet feed region A1 from device feed region A2.

Inspection area A3 is the region for checking IC device 90.In the inspection area, A3, which is provided with, checks IC device 90 Inspection portion 16 and device convey seat 17.

Device conveying seat 17 is a part of delivery section 25, same as temperature regulation section 12, is configured to heating or cold But the IC device 90 held.Thereby, it is possible to hold the IC device 90 for maintaining the temperature adjustment state, in the A3 of inspection area To maintain the temperature adjustment state conveying IC device 90.

Such device conveying seat 17 is supported as can in the Y direction and Z-direction moves back and forth in the A3 of inspection area, A part as the mechanism for being referred to as " index arm ".Device conveying seat 17 can be conveyed from by device feed region A2 as a result, IC device 90 lifts in the device supply department 14 come, and conveying is positioned in inspection portion 16.

In addition, showing device in Fig. 2 by arrow α 17Y and conveying the reciprocating movement of seat 17 in the Y direction.In addition, device Part conveying seat 17 is supported as that can move back and forth in the Y direction, and but not limited to this, can also be supported as also can be It is moved back and forth in X-direction.In addition, device conveying seat 17 configures two in the Y direction, sometimes by Y in composition shown in Fig. 2 The device conveying seat 17 of direction negative side is known as " device conveys seat 17A ", and the device conveying seat 17 of Y-direction positive side is known as " device Convey seat 17B ".Device conveying seat 17A, which can be undertaken in the A3 of inspection area from device supply department 14A to inspection portion 16, conveys IC Device 90, device conveying seat 17B, which can be undertaken in the A3 of inspection area from device supply department 14B to inspection portion 16, conveys IC device 90。

Inspection portion 16 (socket) is the electrical characteristic that mounting checks the IC device 90 as the IC device 90 of electronic component Mounting portion (electronic component mounting portion).The inspection portion 16 has the recess portion for accommodating mounting IC device 90, in the bottom of the recess portion Multiple probes are set.Moreover, contacting by the way that the terminal and probe that enable IC device 90 are conductively connected, it is able to carry out IC device The inspection of part 90.IC is carried out according to the program stored in the inspection control unit that the verifier connecting with inspection portion 16 has The inspection of device 90.Same as temperature regulation section 12, IC device 90 can be also heated or cooled in such inspection portion 16, by the IC Device 90 is adjusted to the temperature suitable for checking.

Device recovery zone A4 is to recycle to check in inspection area A3 and terminate the area of multiple IC devices 90 after the inspection Domain.In the device recovery zone, A4 is provided with recycling pallet 19, device conveying seat 20 and conveyor pallet structure 21.In addition, also It is provided with the device recoverer 18 moved in a manner of across inspection area A3 and device recovery zone A4.In addition, being recycled in device Region A4 has been also prepared for empty pallet 200.

Device recoverer 18 is to be positioned in inspection portion 16 to complete the IC device 90 checked and can convey the IC device 90 To the mounting portion of device recovery zone A4, referred to as " recycling shuttle plate " or referred to as " recycling shuttle ".The device recoverer 18 A part of delivery section 25 can be become.

In addition, be supported to can be between inspection area A3 and device recovery zone A4 in X direction for device recoverer 18 I.e. 18 direction of arrow α moves back and forth.In addition, in composition shown in Fig. 2, it is same as device supply department 14, two are configured in the Y direction The device recoverer 18 of Y-direction negative side is known as " device recoverer 18A " sometimes, by Y-direction positive side by a device recoverer 18 Device recoverer 18 is known as " device recoverer 18B ".It is returned moreover, the IC device 90 in inspection portion 16 is conveyed and loaded to device Receipts portion 18A or device recoverer 18B.IC device 90 is recycled from inspection portion 16 to device in addition, being undertaken from device conveying seat 17A 18A conveying in portion is undertaken from device conveying seat 17B and conveys IC device 90 from inspection portion 16 to device recoverer 18B.In addition, with Temperature regulation section 12, device supply department 14 are same, and device recoverer 18 is also grounded.

Recycling pallet 19 is the mounting portion for being positioned in the IC device 90 after inspection portion 16 checks, in device recovery zone It is fixed as not moving in A4.As a result, even with respect to the device recycling of the various movable parts such as more configuration device conveying seat 20 Region A4, also steadily mounting checks the IC device 90 finished on recycling pallet 19.In addition, in composition shown in Fig. 2, Three recycling pallets 19 are configured in X direction.

In addition, also configuring three empty pallets 200 in X direction.The empty pallet 200 also become be positioned in inspection portion 16 check after IC device 90 mounting portion.Moreover, the conveying of IC device 90 being moved on the device recoverer 18 of device recovery zone A4 is simultaneously It is placed on any of recycling pallet 19 and empty pallet 200.Classify as a result, according to inspection result and recycles IC device 90.

Device conveying seat 20 is supported in the A4 of device recovery zone can be mobile in x-direction and y-direction, and has It can also be in the part of Z-direction movement.Device conveying seat 20 is a part of delivery section 25, can be by IC device 90 from device Recoverer 18 is transported to recycling pallet 19, empty pallet 200.In addition, showing device in Fig. 2 by arrow α 20X and conveying seat 20 X-direction movement, device is shown by arrow α 20Y and conveys the movement in the Y direction of seat 20.

Conveyor pallet structure 21 is will to remove region A5 from pallet in the A4 of device recovery zone to convey the empty pallet to come 200 mechanisms conveyed to X-direction, that is, direction arrow a21.Moreover, the configuration of empty pallet 200 is in recycling IC device after its conveying 90 position can become any of described three empty pallets 200.

It is that recycling removes removing for the pallet 200 for being arranged with the multiple IC devices 90 for checking the state that finishes that pallet, which removes region A5, Part portion.Region A5 can be removed in pallet stack multiple pallets 200.

In addition, being provided in the Y direction conveying support one by one in such a way that across device recovery zone A4 and pallet remove region A5 Conveyor pallet structure 22A, the conveyor pallet structure 22B of disk 200.Conveyor pallet structure 22A is a part of delivery section 25, is energy Enough make pallet 200 in the Y direction i.e. the direction arrow α 22A move back and forth moving portion.Thereby, it is possible to will check the IC device finished 90, which are transported to pallet from device recovery zone A4, removes region A5.In addition, conveyor pallet structure 22B can will be used to recycle IC device Positive side, that is, direction arrow α 22B of the empty pallet 200 of part 90 to Y-direction is mobile.Thereby, it is possible to remove empty pallet 200 from pallet Region A5 is mobile to device recovery zone A4.

Control unit 800 has at least one processor, which carries out various judgements, various orders etc..Control unit 800 Such as conveyor pallet structure 11A, conveyor pallet structure 11B, temperature regulation section 12, device conveying seat 13, device can be controlled to supply Answer portion 14, conveyor pallet structure 15, inspection portion 16, device conveying seat 17, device recoverer 18, device conveying seat 20, pallet defeated Send the work of mechanism 21, conveyor pallet structure 22A, conveyor pallet structure 22B etc..

In addition, in the present embodiment, control unit 800 is built in electronic component inspection device 1, and but not limited to this. For example, control unit 800 also can be set in external equipments such as outer computers.In addition, the external equipment for example exists and electronics The case where the case where component check device 1 is communicated via cable etc., wireless communication and electronic component inspection device 1 are via network The case where (such as internet) connects etc..

Operator can set by monitor 300 or confirm the operation condition etc. of electronic component inspection device 1.The monitoring Device 300 has the display picture 301 being for example made of liquid crystal panel, configures on the top of 1 face side of electronic component inspection device. As shown in Figure 1, right side is provided with the mouse rack 600 of mounting mouse in the figure that pallet removes region A5.Prison is shown in operation The mouse is used when the picture of visual organ 300.

In addition, being configured with operation panel 700 relative to 300 lower right of monitor in Fig. 1.It is different from monitor 300, Operation panel 700 issues the instruction for wishing work to electronic component inspection device 1.

In addition, signal lamp 400 can notify the working condition of electronic component inspection device 1 by the combination of luminescent color Deng.Signal lamp 400 configures on the top of electronic component inspection device 1.It is raised in addition, being built-in in electronic component inspection device 1 Sound device 500 can notify the working condition etc. of electronic component inspection device 1 by the loudspeaker 500.

Electronic component inspection device 1 by the first next door 231 divide pallet feed region A1 and device feed region A2 it Between, it is divided between device feed region A2 and inspection area A3 by the second next door 232, is divided and checked by third next door 233 Between region A3 and device recovery zone A4, device recovery zone A4 is divided by the 4th next door 234 and pallet removes region A5 Between.In addition, also being divided between device feed region A2 and device recovery zone A4 by the 5th next door 235.

Electronic component inspection device 1 covers most external by housing, which for example has front cover 241, side cover 242, side cover 243, rear cover 244, top cover 245.

It " replaces and covers according to being referred to as variety exchanging of IC device 90 as previously mentioned, electronic component inspection device 1 is carried in advance Part " uses.

In device conveying seat 13, there is also the adsorption elements 3 that can adsorb IC device 90 (electronic component), cover as replacement Part.According to the type of IC device 90 (electronic component), prepares at least one in form and dimension in advance and (inhale in the present embodiment The size of attached pad 31) different multiple adsorption elements 3 (referring to Fig. 3).In Fig. 3, as an example, adsorption element 3A is shown And adsorption element 3B.Moreover, one in these multiple adsorption elements 3 (adsorption element 3A and adsorption element 3B) is selected, It is mounted on mounting portion 4.Thereby, it is possible to which the adsorption element 3 for being suitable for various IC devices 90 is installed on mounting portion 4, therefore can IC device 90 is steadily adsorbed by the adsorption element 3.In the present embodiment, according to the size of IC device 90, selection absorption Some of component 3A and adsorption element 3B.When IC device 90 is " small ", adsorption element 3A is selected, is " big " in IC device 90 When, select adsorption element 3B.Hereinafter, the state that adsorption element 3 is mounted on mounting portion 4 is referred to as " installation condition ".

In addition, in the present embodiment, prepared two adsorption elements 3, but its quantity is not particularly limited, such as can be with It is three or more.

In addition, Local size is different in the present embodiment for multiple adsorption elements 3, but not limited to this, such as can also , can also be different with local shape with whole of different sizes, can also be with global shape difference, it can also be (local and whole equal with shape Can) and size (part and whole) both sides it is different.

In addition, multiple adsorption elements 3 are of different sizes in the present embodiment, but not limited to this, such as not except size , can be different with shape (part and whole) with except, can also only shape (part and whole) it is different.

As shown in figure 3, about adsorption element 3A and adsorption element 3B, due to except absorption layer 31 it is of different sizes in addition to constitute It is identical, typically illustrate adsorption element 3A below.

As shown in figure 4, the bearing that adsorption element 3A has the absorption layer 31 that can adsorb IC device 90, supports absorption layer 31 Portion's (absorption layer supporting part) 32, the tubular portion 33 for being inserted into mounting portion 4 in the mounted state, supporting tubular portion 33 supporting part (tubular portion supporting part) 34.

Absorption layer 31 is the part of cylindrical (circular tube shaped) with the opening portion 312 being open in lower end surface 311.The suction Attached pad 31 can make lower end surface 311 abut the upper surface of IC device 90, adsorb IC device by the suction force generated in opening portion 312 Part 90.Moreover, device conveying seat 13 can convey IC device 90 in device feed region A2 under the adsorbed state.

In addition, by the work of the pump 131 connected via mounting portion 4 suction force can be generated in opening portion 312

In addition, the face shaping of absorption layer 31 be in the present embodiment it is cylindric, but not limited to this, such as can be with It is rib tubular.As shown in figure 3, in the present embodiment, the absorption layer 31 of adsorption element 3A and the absorption layer 31 of adsorption element 3B Outer diameter is different, i.e., lower end surface 311 is of different sizes.

Furthermore it is possible to which the cover is arranged in the peripheral side of absorption layer 31.Thereby, it is possible to increase the contact surface with absorption layer 31 Product, therefore can steadily adsorb IC device 90.It about the face shaping of the cover, is not particularly limited, such as can It is set as overlooking lower round or prismatic.

Supporting part 32 is upper end and the outer diameter part bigger than the outer diameter of absorption layer 31 for supporting absorption layer 31.As a result, can It is enough to support absorption layer 31 securely.In addition, the peripheral part in supporting part 32 is formed with plate-like flange part outstanding 321.As general When adsorption element 3A is installed to mounting portion 4, the installation exercise just can easily be done with finger tip grip flange part 321.

Cylindrical tubular portion 33 is being set with 31 opposite side of absorption layer.The tubular portion 33 is slotting in the mounted state Enter to the part of mounting portion 4.The peripheral part 332 of tubular portion 33 is provided with the second engaging for mounting portion 4 in the mounted state The first holding section 331 that portion 42 engages.By the engaging, installation condition is maintained, therefore prevents adsorption element 3A non-from mounting portion 4 Original idea it is detached from.

In addition, in the present embodiment, the first holding section 331 by the peripheral part 332 along tubular portion 33 circumferencial direction The cricoid slot (recess portion) formed is constituted, and but not limited to this, such as according to the structure (shape) of the second holding section 42, can Such as by multiple positions of the peripheral part 332 in tubular portion 33 be recessed the recess portion formed, along the peripheral part 332 of tubular portion 33 The prominent raised line formed of circumferencial direction protrudes the structures such as the multiple protrusions formed in multiple positions of the peripheral part 332 of tubular portion 33 At.

Supporting part 34 is the lower end in supporting tubular portion 33 and the outer diameter part bigger than the outer diameter of tubular portion 33.As a result, can Enough supporting tubular portions 33 securely.In addition, the upper limit that tubular portion 33 is inserted into mounting portion 4 can be limited (referring to Fig. 4).

Absorption layer 31 of the adsorption element 3A from the tubular portion 33 on top to lower part as constructed as above is connected in inside.

In addition, adsorption element 3A both can be integrally formed with absorption layer 31, supporting part 32, tubular portion 33, supporting part 34, It can wherein at least a part be separately formed and monomer engagement.

As the constituent material of adsorption element 3A, there is no particular limitation, such as is able to use the various metal materials of hard Material, various resin materials etc..In addition, adsorption element 3A can also constitute absorption layer 31 with elastic material.

Adsorption element 3A as constructed as above is detachably mounted on mounting portion 4.As shown in figure 3, mounting portion 4 is arranged in device Part conveys the lower end of the base portion 132 of seat 13.In addition, there is no particular limitation for the configuration quantity of mounting portion 4, such as either One, it is also possible to multiple.When being configured with multiple mounting portions 4, for configuration quantity along the X direction and along the Y direction Configuring quantity, also there is no particular limitation, such as both may be the same or different.

As shown in Fig. 4~Fig. 8, mounting portion 4 has inside cylindrical portion 41, can be displaced the bearing of inside cylindrical portion 41 Second holding section 42, the operation portion 43 for carrying out the operation for enabling the second holding section 42 to be displaced, the force to exert a force to operation portion 43 Portion 44.In addition, limiting unit 45 limits the adsorption element 3A under installation condition as shown in figure 3, mounting portion 4 also has limiting unit 45 (adsorption element 3B is also identical) rotates about the z axis.

Inside cylindrical portion 41 is from the part that cylindrical protrusion is formed downward of base portion 132.In the mounted state, it adsorbs The tubular portion 33 of component 3A is inserted in the inner space 411 of the inside cylindrical portion 41.The inside of inside cylindrical portion 41 is empty as a result, Between 411 be connected to the inner space 35 of adsorption element 3A.Moreover, 131 work of pump under the connected state, thus from base portion 132 Connection pump 131 part be depressurized to the inner space of adsorption element 3A 35.As a result, in the absorption layer 31 of adsorption element 3A Opening portion 312 generates suction force, can adsorb IC device 90.

As shown in Fig. 4 (Fig. 5~Fig. 8 is also identical), the inner peripheral portion 412 in inboard cylinder shape portion 41 is provided with along its circumference side To seal member (liner) 46 annular in shape.Seal member 46 is made of elastic material, in the mounted state, in inboard cylinder shape Between the peripheral part 332 of the tubular portion 33 of the inner peripheral portion 412 and adsorption element 3A in portion 41 by compression flexible deformation.In as a result, Airtight sealing between the peripheral part 332 of the tubular portion 33 of the inner peripheral portion 412 and adsorption element 3A of side cylindrical portion 41.Moreover, energy It enough prevents when pump 131 works from the peripheral part 332 of the tubular portion 33 of the inner peripheral portion 412 and adsorption element 3A of inside cylindrical portion 41 Between leadage air, the opening portion of absorption layer 31 312 generate suction force reduce.Thereby, it is possible to sustainedly and stably adsorb IC Device 90.

In addition, inside cylindrical portion 41 have than the part on the lower of seal member 46 it is radial from inner space 411 The slot 413 of formation.Accommodate the sphere 421 for constituting the second holding section 42 one by one in each slot 413.The sphere 421 can be along appearance The slot 413 of the sphere 421 received is formed by direction and moves between following first positions and the second position.

First position is that the second holding section 42 (sphere 421) is sticked in adsorption element 3 (adsorption element 3A or adsorption element The first holding section 331 3B) and the position for becoming the installation condition of installation adsorption element 3 (referring to Fig. 4).The second position is to release The position of installation condition (referring to Fig. 6).

As previously mentioned, adsorption element 3 has the tubular portion 33 for being inserted into mounting portion 4 in the mounted state.In addition, the first card Conjunction portion 331 (recess portion) is made of the slot (recess portion) on the circumferencial direction for the peripheral part 332 for being formed in tubular portion 33.Moreover, second Holding section 42 is made of the protrusion for being sticked in the first holding section 331 (recess portion) in first position.The protrusion is by first position edge The first holding section 331 (slot) configure multiple sphere 421 and constitute (referring to Fig. 4).In this way, the second holding section 42 is by sphere 421 (protrusion) is constituted, and thus as described later, can easily be done charge and discharge operations of the adsorption element 3 relative to mounting portion 4, is tied Fruit replaces the replacement of the replacement operation, i.e. adsorption element 3A and adsorption element 3B of adsorption element 3 based on the type of IC device 90 Operation becomes easy.

In addition, the constituent material as sphere 421, there is no particular limitation, such as the various gold such as be able to use stainless steel Belong to material.

In addition, the second holding section 42 be configured in the present embodiment can with the central axis of inside cylindrical portion 41 just The direction of friendship is mobile, and but not limited to this, such as being both configured to can be in the central axial direction in inboard cylinder shape portion 41 It is mobile, it is also configured to rotate around the central axis of inside cylindrical portion 41.

Mounting portion 4 has operation portion 43, and operation portion 43 makes each sphere 421 (the second holding section 42) can for unified operation It is mobile (displacement) from first position to the second position.Operation portion 43 by inboard cylinder shape portion 41 peripheral side and inside cylindrical portion 41 The cylinder of concentric arrangement is constituted.The operation portion 43 can be upward along the direction z in the central axial direction in inboard cylinder shape portion 41 Position (referring to Fig. 5~Fig. 7) and lower position (referring to Fig. 4, Fig. 8) are mobile.In addition, operation portion 43 is upward again in the limitation of upper position The mobile upper limit limits the moving boundary to its lower section below in lower position.

In addition, operation portion 43 has press section 431, when operation portion 43 is located at lower position, press section 431 can uniformly be pressed Press each sphere 421.Press section 431 protrudes the cricoid protruding portion structure formed by the circumferencial direction of the inner peripheral portion along operation portion 43 At.It is mobile from first position to the second position that each sphere 421 is limited as a result, therefore can prevent the adsorption section under installation condition Part 3 is detached from from mounting portion 4.

In addition, press section 431 is kept out of the way from each sphere 421 when operation portion 43 is located at upper position.Press section is released as a result, The pressing force of 431 pairs of each spheres 421, therefore each sphere 421 can be mobile from first position to the second position.Moreover, in the shape Under state, such as the disengaging of adsorption element 3 (referring to Fig. 5~Fig. 7) or opposite to that for being mounted on mounting portion 4 can be made, not yet The mounting portion 4 for installing adsorption element 3 installs adsorption element 3.

Mounting portion 4 has force section 44, and force section 44 exerts a force downwards to operation portion 43, limits the second holding section 42 It moves.In the present embodiment, force section 44 is by the spiral between inboard cylinder shape portion 41 and operation portion 43 with their concentric arrangements Spring 441 is constituted.The upper end 442 of helical spring 441 abuts the prominent of the prominent peripheral part for being formed in inside cylindrical portion 41 from below Portion 414 out, lower end 443 abut the press section 431 of inside cylindrical portion 41 from top.In addition, helical spring 441 is in protruding portion 414 Compressive state is between press section 431.Bias force to the effect of operation portion 43 downward as a result,.Pass through the bias force, behaviour Make portion 43 and maintains the state for being located at lower position.It is mobile from first position to the second position that each sphere 421 is limited as a result, therefore energy The adsorption element 3 under installation condition is enough prevented to be detached from from the non-original idea of mounting portion 4.

As shown in figure 3, mounting portion 4 has limiting unit 45, limiting unit 45 is adsorbed component according to the limitation of each adsorption element 3 The IC device 90 (electronic component) of 3 absorption about the z axis (join for (vertical axis) rotation by " state that IC device 90 is adsorbed in adsorption element 3 " According to Fig. 4).Limiting unit 45 is set to relative to the direction mounting portion 4Y positive side, from from the base portion 132 of device conveying seat 13 to Z-direction Negative side (lower section) is constituted in the rodlike prominent bar-shaped portion 451 formed.Outer diameter is (thick in the bar-shaped portion 451 composition shown in Fig. 3 Carefully) (longitudinally) is constant along the Z direction, and but not limited to this, is also possible to the part changed along the Z direction.

On the other hand, in the flange part 321 of adsorption element 3, positive side section is formed with notch section 322 in the Y direction.Pacifying Under dress state, bar-shaped portion 451 passes through the notch section 322, can engage.IC device 90 is in the shape for being adsorbed the absorption of component 3 as a result, Under state, by limit according to each adsorption element 3 around mounting portion 4 (adsorption element 3) central axis i.e. Z axis rotate.In this way Rotation limitation, such as when under the vertical view of IC device 90 in quadrilateral shape, IC device 90 adjacent to each other can be prevented interfering with each other. In addition, the posture due to maintaining IC device 90, which is swimmingly placed in it and conveys destination (such as device supply department The recess portion of 14 receiving mounting IC device 90).

Then, the replacement operation that adsorption element 3A is changed to adsorption element 3B in mounting portion 4 is illustrated referring to Fig. 4~Fig. 8.

As shown in figure 4, adsorption element 3A is in the installation condition for being mounted on mounting portion 4.Under the installation condition, such as preceding institute It states, the inner space 35 of adsorption element 3A is connected to the inner space 411 of mounting portion 4.Becoming as a result, can be inhaled by pump 131 The state of attached IC device 90.

In addition, the operation portion 43 of mounting portion 4 is located at lower position, exerted a force by helical spring 441 (force section 44).The operation portion The unified pressing in 43 press section 431 is located at each sphere 421 (the second holding section 42) of first position.Each sphere 421 is limited as a result, It is mobile to the second position, therefore maintain installation condition.

Then, as shown in figure 5, overcoming the bias force of helical spring 441 (force section 44), it is moved to operation portion 43 upper It sets.Each sphere 421 is released from the pressing force of press section 431 as a result, therefore becomes the state that can be moved to the second position.

Then, as shown in fig. 6, adsorption element 3A is pulled downwards.Each sphere 421 crosses adsorption element 3A's as a result, The inclined surface 331a of first holding section, 331 upside, is moved to the second position.In addition, if further downwards by adsorption element 3A It pulls, then each sphere 421 is slided in the peripheral part 332 of the tubular portion 33 of adsorption element 3A.

Moreover, as shown in fig. 7, adsorption element 3A is detached from from mounting portion 4.

Then, if releasing the power for keeping the upward position of operation portion 43 mobile, as shown in figure 8, operation portion 43 by self weight and The bias force of helical spring 441 promptly again returns to lower position.In addition, at this point, the press section 431 of operation portion 43 is uniformly pressed Pressure is located at each sphere 421 of the second position, can send first position back to.

In this way, adsorption element 3A is dragged downwards by the state of still keeping promoting operation portion 43 to upper position Such simple operations are drawn, adsorption element 3A can easily and rapidly be made to be detached from from mounting portion 4.

In addition, by carrying out the inverse operation, being able to carry out it when adsorption element 3B is installed on mounting portion 4 Installation.That is, by the state of keeping promoting operation portion 43 to upper position, in this way by adsorption element 3B indentation mounting portion 4 Adsorption element 3B easily and rapidly can be installed on mounting portion 4 by simple operations.In addition, in inboard cylinder shape portion 41, if The slot that each sphere 421 can move is arranged in 46 side of seal member of each sphere 421, then does not have to for operation portion 43 being lifted up, just Each sphere 421 can be pressed by the peripheral part 332 of tubular portion 33.Just will as a result, by not having to for operation portion 43 being lifted up Adsorption element 3B is pressed into the operation simpler in this way of mounting portion 4, can be easier and promptly be installed on adsorption element 3B Mounting portion 4.

As more than, in electronic component inspection device 1 (electronic component handling apparatus 10), according to the type of IC device 90, It can easily be done and adsorption element 3A is changed to adsorption element 3B (or adsorption element 3B is changed to adsorption element 3A) Operation.As a result, when being transferred to the inspection of different types of IC device 90, its transfer can be carried out rapidly and swimmingly.

Second embodiment

In the following, illustrating electronic component handling apparatus and electronic component inspection device of the invention referring to Fig. 9 and Figure 10 Second embodiment, but using the difference from above embodiment as emphasis illustrate, the description thereof will be omitted for identical item.

Present embodiment is in addition to the limiting unit that mounting portion is omitted for limiting the adsorbed IC device rotation of adsorption element It is identical as the first embodiment.

As shown in figure 9, being adsorbed with IC device 90 in adsorption element 3.Under the state shown in Fig. 9, in adsorption element 3 The central axis O141 of mandrel line O3 and the recess portion of device supply department 14 141 is not on same straight line, but is generated wrong Position.

In addition, in the present embodiment, omitting limiting unit 45 correspondingly in mounting portion 4, generating the suction under installation condition Attached component 3 can be in " gap " that either X-direction, Y-direction and Z-direction slightly move upwards.As a result, as shown in Figure 10, When IC device 90 to be placed in the recess portion 141 of device supply department 14, IC device 90 along recess portion 141 cone-shaped side wall 142, The dislocation of central axis O3 and central axis O141 can be made to offset correspondingly to measure with the gap.It therefore, can be in device The recess portion 141 of supply department 14 smoothly loads IC device 90.

Third embodiment

In the following, 1 illustrating that the third of electronic component handling apparatus and electronic component inspection device of the invention is real referring to Fig.1 Mode is applied, but is illustrated by emphasis of the difference from above embodiment, the description thereof will be omitted for identical item.

Present embodiment is the same as the above first embodiment in addition to the structure of adsorption element is different.

As shown in figure 11, in the present embodiment, adsorption element 3 is the composition for having two components that assembling uses.That is, Adsorption element 3 has: first component 30A, has tubular portion 33 and the supporting tubular portion for being inserted into mounting portion 4 in the mounted state 33 supporting part 34；And second component 30B, have be connected to first component 30A come using and can adsorb IC device 90 (electricity Subassembly) absorption layer 31 and bearing absorption layer 31 supporting part 32.

In addition, preparing at least one in shapes and sizes (in this embodiment party according to the type of IC device 90 (electronic component) The size of absorption layer 31 in formula) different multiple second component 30B.In Figure 11, as an example, second component is shown The size of the 30B1 and absorption layer 31 second component 30B2 bigger than second component 30B1.Moreover, selecting these multiple second components One in 30B (second component 30B1 and second component 30B2), it is connected to first component 30A.Second component 30B1 is connected The adsorption element 3 for being assembled in first component 30A is connect as adsorption element 3A.In addition, assembling second component 30B2 in The adsorption element 3 of one component 30A becomes adsorption element 3B.As long as in this way, preparing big using first component 30A as common unit Small different multiple second component 30B, it will be able to by be suitable for various IC devices 90 adsorption element 3 (adsorption element 3A or Adsorption element 3B) mounting portion 4 is installed on to use.

In addition, in the present embodiment, prepared two second component 30B, but there is no particular limitation for its quantity, such as It can be three or more.

In addition, locality is of different sizes in the present embodiment by multiple second component 30B, but not limited to this, such as Both can be of different sizes with globality, can also be different with locality shape, can also be different with globality shape, it can be with shape (office Portion with it is whole) and size (part and integrally) this both sides it is different.

In addition, multiple second component 30B are of different sizes in the present embodiment, but not limited to this, such as except size , can be different with shape (part and entirety) except difference, can also there was only shape (local and whole) difference.

As shown in figure 11, in the present embodiment, in first component 30A, outside the lower part of supporting part 34 protrudes and is formed Screw thread 36.On the other hand, in second component 30B, be formed with internal screw thread 37 in supporting part 32, internal screw thread 37 with the first component It is screwed when 30A connection with external screw thread 36.

In addition, external screw thread 36 and supporting part 34 interface be provided with along external screw thread 36 circumferencial direction in ring The seal member (liner) 38 of shape.Seal member 38 is made of elastic material, in assembling first component 30A and second component 30B In the state of, between supporting part 34 and supporting part 32 by compression flexible deformation.Airtight sealing supporting part 34 and branch as a result, Between bearing portion 32.Moreover, can prevent the air when pump 131 works from leaking out between supporting part 34 and supporting part 32, adsorbing The suction force that the opening portion 312 of pad 31 generates reduces.Thereby, it is possible to steadily persistently adsorb IC device 90.

In addition, second component 30B is connected to attended operation and first component 30A and the second component of first component 30A The connection release operation of 30B preferably carries out in the state of being detached from adsorption element 3 from mounting portion 4.As a result, for example into When row connection, separating operation, the case where compared to installation condition is set as, its operation can easily be done.

4th embodiment

In the following, 2 illustrating the 4th real of electronic component handling apparatus and electronic component inspection device of the invention referring to Fig.1 Mode is applied, is illustrated by emphasis of the difference from above embodiment, the description thereof will be omitted for identical item.

Present embodiment in addition to the structure for the first component and second component that adsorption element has is different with it is above-mentioned Third embodiment is identical.

As shown in figure 12, in the present embodiment, in first component 30A, internal screw thread 37 is formed in supporting part 34.Separately On the one hand, in second component 30B, the top of supporting part 32 be formed with when being connect with first component 30A with internal screw thread 37 The external screw thread 36 of thread binding.In addition, second component 30B omits flange part 321.

According to this structure, such as second component 30B, existing screw-in adsorption element can be connected to first Component 30A come using.

5th embodiment

In the following, 3 illustrating the 5th real of electronic component handling apparatus and electronic component inspection device of the invention referring to Fig.1 Mode is applied, is illustrated by emphasis of the difference from above embodiment, the description thereof will be omitted for identical item.

Present embodiment is the same as the above first embodiment in addition to the shape of the absorption layer of adsorption element is different.

As shown in figure 13, in the present embodiment, the absorption layer 31 of adsorption element 3 has the widened wide diameter portion of its internal diameter 313.As a result, for example in the case where the upside of IC device 90 has stepped part 901, inhaled when the IC device 90 is adsorbed component 3 When attached, stepped part 901 is contained in wide diameter portion 313.IC device 90 becomes the state for being steadily adsorbed the absorption of component 3 as a result, Therefore it can prevent from being detached from from adsorption element 3 during transportation.

More than, electronic component handling apparatus and electronic component inspection of the invention are illustrated for embodiment illustrated Device, but the present invention is not limited to this, and each portion for constituting electronic component handling apparatus and electronic component inspection device can Replace with the arbitrary structures that can play identical function.Alternatively, it is also possible to add arbitrary structures object.

In addition, electronic component handling apparatus and electronic component inspection device of the invention can also combine each implementation The above structure of any two (feature) in mode.

Claims (13)

1. a kind of electronic component handling apparatus has the delivery section of conveying electronic component,

The delivery section includes adsorption element, adsorbs the electronic component；And mounting portion, it is mounted the adsorption element,

The adsorption element is provided with the first holding section,

The mounting portion is provided with the second holding section, second engagement site, which moves on to, is sticked in the of first holding section One position and the second position not engaged with first holding section.

2. electronic component handling apparatus according to claim 1, wherein

The adsorption element has the tubular portion for being inserted into the mounting portion,

First holding section is made of the recess portion that the peripheral part of the tubular portion is arranged in,

The protrusion that the recess portion is sticked in when second holding section is by being displaced to the first position is constituted.

3. electronic component handling apparatus according to claim 2, wherein

The recess portion is made of the slot that the circumferencial direction of the peripheral part along the tubular portion is arranged, and the protrusion is by being displaced to Sphere that is multiple and being sticked in the slot is configured along the slot when stating first position to constitute.

4. electronic component handling apparatus according to claim 1, wherein

The mounting portion has operation portion, and the operation portion is for carrying out second holding section being limited in the first position Operation.

5. electronic component handling apparatus according to claim 4, wherein

The mounting portion has force section, and the force section exerts a force to the operation portion and second holding section is limited in institute State first position.

6. electronic component handling apparatus according to claim 1, wherein

The electronic component handling apparatus has at least one of shapes and sizes different according to the type of the electronic component Multiple adsorption elements,

One in the multiple adsorption element is selected, the mounting portion is installed on.

7. electronic component handling apparatus according to claim 1, wherein

The adsorption element includes the first component, has the tubular portion for being inserted into the mounting portion；And second component, have The absorption layer of the electronic component is adsorbed, and is connect with the first component.

8. electronic component handling apparatus according to claim 7, wherein

The electronic component handling apparatus has at least one of shapes and sizes different according to the type of the electronic component Multiple second components,

One in the multiple second component is selected, is connect with the first component.

9. electronic component handling apparatus according to claim 7, wherein

The second component is connected to the attended operation of the first component and releases the first component and the second component The connection release operation of connection carried out in the state of being detached from the adsorption element from the mounting portion.

10. electronic component handling apparatus according to claim 7, wherein

The first component is provided with internal screw thread,

The external screw thread being screwed with the internal screw thread to connect with the first component is provided in the second component.

11. electronic component handling apparatus according to claim 1, wherein

The mounting portion has limiting unit, and the electronic component that the limiting unit limitation is adsorbed by the adsorption element is around vertical Axis rotation.

12. a kind of electronic component inspection device, has:

Delivery section conveys electronic component；And

Inspection portion checks the electronic component,

The delivery section includes adsorption element, adsorbs the electronic component；And mounting portion, it is mounted the adsorption element,

The adsorption element is provided with the first holding section,

The mounting portion is provided with the second holding section, second holding section, which can be displaced to, is sticked in first holding section First position and the second position that does not engage with first holding section.

13. a kind of adsorption element, which is characterized in that be installed on mounting portion and adsorb electronic component, the mounting portion is arranged defeated The delivery section of the electronic component is sent,

The adsorption element is provided with the first holding section,

The mounting portion is provided with the second holding section, second holding section, which can be displaced to, is sticked in first holding section First position and the second position that does not engage with first holding section,

The adsorption element has the tubular portion for being inserted into the mounting portion,

First holding section is made of the slot that the circumferencial direction of the peripheral part along the tubular portion is arranged,

Ball that is multiple and being sticked in the slot is configured along the slot when second holding section is by being displaced to the first position Body is constituted.