TWI673808B - Electronic component conveying device and electronic component inspection device - Google Patents

Electronic component conveying device and electronic component inspection device Download PDF

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Publication number
TWI673808B
TWI673808B TW107136419A TW107136419A TWI673808B TW I673808 B TWI673808 B TW I673808B TW 107136419 A TW107136419 A TW 107136419A TW 107136419 A TW107136419 A TW 107136419A TW I673808 B TWI673808 B TW I673808B
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electronic component
temperature
section
inspection
gas
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TW107136419A
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Chinese (zh)
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TW201917805A (en
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荻原武彥
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日商精工愛普生股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

本發明之課題在於提供一種於對電子零件進行檢查時，能夠迅速調整載置部之溫度之電子零件搬送裝置及電子零件檢查裝置。 本發明係一電子零件搬送裝置，其將電子零件搬送至檢查電子零件之檢查部，且具備：載置部，其供載置電子零件；保持部，其保持上述電子零件並予以搬送；噴射部，其對上述載置部噴射氣體；及溫度檢測部，其檢測上述載置部之溫度；且上述噴射部於還未將上述電子零件載置於上述載置部之狀態下，藉由上述溫度檢測部檢測出之上述載置部之溫度高於特定溫度時，對上述載置部噴射上述氣體；上述檢查部於上述氣體之噴射之後，當藉由上述溫度檢測部檢測出之上述載置部之溫度為上述特定溫度以下時，檢查上述電子零件。An object of the present invention is to provide an electronic component transfer device and an electronic component inspection device capable of quickly adjusting the temperature of a mounting portion when inspecting electronic components. The present invention is an electronic parts conveying device, which conveys electronic parts to an inspection section for inspecting electronic parts, and includes: a placing section for placing electronic parts; a holding section that holds and conveys the electronic parts; and a jetting section And sprays gas on the mounting portion; and a temperature detecting portion that detects the temperature of the mounting portion; and the spraying portion passes the temperature in a state where the electronic component has not been mounted on the mounting portion. When the temperature of the mounting portion detected by the detection portion is higher than a specific temperature, the gas is sprayed onto the mounting portion; after the gas is sprayed, the inspection portion detects the mounting portion by the temperature detection portion. When the temperature is below the specified temperature, check the electronic components.

Description

電子零件搬送裝置及電子零件檢查裝置Electronic component transfer device and electronic component inspection device

本發明係關於一種電子零件搬送裝置及電子零件檢查裝置。 The invention relates to an electronic component conveying device and an electronic component inspection device.

自先前以來，已知有一種對例如IC(integrated circuit，積體電路)器件等電子零件(零件)進行電性試驗之電子零件試驗裝置(例如，參照專利文獻1)。於該專利文獻1記載之零件檢查裝置中，構成為對電子零件進行檢查時，將IC器件搬送至插口，且載置於插口，進行該試驗。作為該試驗，係試驗IC器件於施加有高溫或低溫之溫度應力之狀態下是否適當動作者。此外，作為試驗，亦有試驗IC器件於常溫下是否亦適當動作者。 There has been known an electronic component test device for performing an electrical test on an electronic component (part) such as an IC (integrated circuit) device (for example, refer to Patent Document 1). In the component inspection device described in Patent Document 1, when an electronic component is inspected, the IC device is transported to a socket and placed in the socket to perform the test. This test is to test whether an IC device operates properly in a state where a high temperature or low temperature stress is applied. In addition, as a test, there are also people who test whether the IC device is properly operated at normal temperature.

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]國際公開第2008/142753號 [Patent Document 1] International Publication No. 2008/142753

然而，於專利文獻1中記載之電子零件試驗裝置中，於自高溫環境至常溫環境試驗之情形時，因任其自然冷卻，故導致直至環境溫度變為常溫 會耗費太多時間，從而無法進行迅速之試驗。且，良率亦較差。 However, in the electronic component test device described in Patent Document 1, when the test is performed from a high-temperature environment to a normal-temperature environment, it is allowed to cool naturally, so the ambient temperature becomes normal temperature. It takes too much time to make rapid tests impossible. Moreover, the yield is also poor.

本發明係為解決上述課題之至少一部分而完成者，可作為以下者實現。 The present invention has been made to solve at least a part of the problems described above, and can be implemented as the following.

本發明之電子零件搬送裝置之特徵在於具備：載置部，其供載置電子零件；檢查區域，其可配置檢查上述電子零件之檢查部；保持部，其保持上述電子零件並予以搬送；噴射部，其向上述載置部噴射氣體；及溫度檢測部，其檢測上述載置部之溫度；且上述噴射部於還未將上述電子零件載置於上述載置部之狀態下，當藉由上述溫度檢測部檢測出之上述載置部之溫度高於特定溫度時，向上述載置部噴射上述氣體；上述檢查部於上述噴射部對上述載置部噴射上述氣體之後，當藉由上述溫度檢測部檢測出之上述載置部之溫度為上述特定溫度以下時，開始對上述電子零件之檢查。 The electronic component transfer device of the present invention is characterized by including: a mounting section for mounting electronic components; an inspection area where an inspection section for inspecting the above-mentioned electronic components can be arranged; a holding section for holding and transporting the electronic components; and spraying And a temperature detecting unit that detects the temperature of the placing unit; and the ejecting unit is in a state where the electronic component has not been placed on the placing unit by When the temperature of the mounting section detected by the temperature detecting section is higher than a specific temperature, the gas is sprayed onto the mounting section; after the gas is sprayed onto the mounting section by the spraying section, the inspection section uses the temperature When the temperature of the mounting portion detected by the detecting portion is equal to or lower than the specific temperature, the inspection of the electronic component is started.

藉此，例如，當對電子零件進行高溫檢查(例如於100度以上155度以下之溫度環境下之檢查)後進而進行常溫檢查(例如於20度以上80度以下之溫度環境下之檢查)時，對載置部噴射氣體，可強制冷卻載置部。藉此，可使載置部之溫度迅速下降(調整溫度)，因而可迅速地移行至常溫檢查。 Thus, for example, when electronic components are subjected to a high-temperature inspection (such as an inspection under a temperature environment of 100 degrees to 155 degrees) and then an ordinary temperature inspection (such as an inspection under a temperature environment of 20 degrees to 80 degrees) By spraying gas on the mounting portion, the mounting portion can be forcibly cooled. Thereby, the temperature of the mounting portion can be rapidly decreased (adjusted the temperature), so that it can be quickly moved to the normal temperature inspection.

於本發明之電子零件搬送裝置中，較佳為，上述噴射部於上述噴射部與上述載置部之間未有上述電子零件之狀態下，向上述載置部噴射上述氣體。 In the electronic component transfer device of the present invention, it is preferable that the spraying section sprays the gas onto the mounting section when the electronic component is not present between the spraying section and the mounting section.

藉此，例如，當對電子零件進行高溫檢查(例如於100度以上155度以下之溫度環境下之檢查)後進而進行常溫檢查(例如於20度以上80度以下之溫度環境下之檢查)時，對載置部噴射氣體，可強制冷卻載置部。藉此，可使載置部之溫度迅速下降(調整溫度)，因此可迅速地移行至常溫檢查。 Thus, for example, when electronic components are subjected to a high-temperature inspection (such as an inspection under a temperature environment of 100 degrees to 155 degrees) and then an ordinary temperature inspection (such as an inspection under a temperature environment of 20 degrees to 80 degrees) By spraying gas on the mounting portion, the mounting portion can be forcibly cooled. Thereby, the temperature of the mounting portion can be rapidly decreased (adjusted the temperature), so that it can be quickly moved to the normal temperature inspection.

於本發明之電子零件搬送裝置中，較佳為，上述檢查部於第1溫度與低於上述第1溫度之第2溫度各者之環境下對上述電子零件進行檢查；使用上述噴射部進行之上述氣體之噴射係在上述第1溫度下之上述檢查與在上述第2溫度下之上述檢查之間進行。 In the electronic component transfer device of the present invention, preferably, the inspection unit inspects the electronic component in an environment of each of a first temperature and a second temperature lower than the first temperature; The injection of the gas is performed between the inspection at the first temperature and the inspection at the second temperature.

藉此，例如，當對電子零件進行第1檢查(例如於100度以上155度以下之溫度環境下之高溫檢查)後進而進行第2檢查(例如於20度以上80度以下之溫度環境下之常溫檢查)時，對載置部噴射氣體，可強制冷卻載置部。藉此，可迅速地使載置部之溫度下降(調整溫度)，因而可迅速地移行至第2檢查。 Thus, for example, when the first inspection (for example, a high-temperature inspection in a temperature environment of 100 ° C to 155 ° C) is performed on the electronic part, the second inspection (for example, in a temperature environment of 20 ° C to 80 ° C) is performed. During normal temperature inspection), the mounting portion can be forcedly cooled by injecting gas onto the mounting portion. Thereby, since the temperature of a mounting part can be reduced quickly (adjusting temperature), it can move to a 2nd inspection quickly.

於本發明之電子零件搬送裝置中，較佳為，上述噴射部係設置於上述保持部。 In the electronic component transfer device of the present invention, it is preferable that the spraying section is provided on the holding section.

藉此，噴射部可與保持部一起移動，於其移動目的處噴射氣體。 Thereby, the injection part can be moved together with the holding part, and the gas is injected at the moving destination.

於本發明之電子零件搬送裝置中，較佳為，上述保持部具有藉由吸附而保持上述電子零件之吸附部；上述吸附部兼作上述噴射部，於自吸附上述電子零件之狀態放開上述電子零件時，噴射上述氣體；向上述載置部噴射上述氣體之時間長於放開上述電子零件時噴射上述氣體之時間。 In the electronic component transporting device of the present invention, it is preferable that the holding portion has an adsorption portion that holds the electronic component by adsorption; the adsorption portion also serves as the ejection portion, and releases the electrons in a state where the electronic component is self-adsorbed. In the case of parts, the gas is sprayed; the time for which the gas is sprayed onto the mounting portion is longer than the time when the gas is sprayed when the electronic component is released.

藉此，可儘可能確保延長氣體碰觸到載置部之時間，因而可儘可能保持冷卻後之載置部之溫度。 Thereby, the time during which the gas touches the mounting portion can be ensured as much as possible, and the temperature of the mounting portion after cooling can be maintained as much as possible.

於本發明之電子零件搬送裝置中，較佳為，上述吸附部其向上述載置部噴射上述氣體時之高度係高於保持並搬送上述電子零件時之高度。 In the electronic component transporting device of the present invention, it is preferable that the height of the adsorption portion when the gas is sprayed onto the mounting portion is higher than the height when the electronic component is held and transported.

藉此，可自儘可能高之位置噴射氣體，因此，可使氣體碰觸到載置部之較廣範圍。藉此，可防止或抑制於載置部產生溫度不均。 Thereby, the gas can be sprayed from a position as high as possible, so that the gas can touch a wide range of the mounting portion. This can prevent or suppress the occurrence of temperature unevenness in the placement portion.

於本發明之電子零件搬送裝置中，較佳為，上述保持部具有藉由吸附而保持上述電子零件之吸附部；上述噴射部配置於與上述吸附部不同之位置。 In the electronic component transfer device of the present invention, it is preferable that the holding portion includes a suction portion that holds the electronic component by suction; and the ejection portion is disposed at a position different from the suction portion.

藉此，可將噴射部配置於期望之位置。 Thereby, the injection part can be arrange | positioned at a desired position.

於本發明之電子零件搬送裝置中，較佳為具備區劃出上述檢查區域 之壁部；且上述噴射部設置於上述壁部。 In the electronic parts conveying device of the present invention, it is preferable that the inspection area is provided with a division A wall portion; and the spraying portion is provided on the wall portion.

藉此，可冷卻例如檢查部。 Thereby, an inspection part can be cooled, for example.

於本發明之電子零件搬送裝置中，較佳為，上述壁部具有可開關之門，上述噴射部設置於上述門上。 In the electronic component transfer device of the present invention, it is preferable that the wall portion has a door that can be opened and closed, and the ejection portion is provided on the door.

藉此，當構成為於例如關閉門之狀態下使噴射部動作之情形時，安全性高。 Thereby, when it is comprised so that the injection part may be operated in the state which closed the door, safety | security is high.

於本發明之電子零件搬送裝置中，較佳為具備操作上述噴射部開始動作之操作部。 In the electronic component conveying apparatus of the present invention, it is preferable to include an operation unit that operates the ejection unit to start the operation.

藉由對操作部進行操作或不對操作部進行操作，可選擇自噴射部進行氣體之噴射或省略該噴射。 By operating the operating section or not operating the operating section, it is possible to choose to spray gas from the spray section or omit the spray.

本發明之電子零件檢查裝置之特徵在於具備：載置部，其供載置電子零件；檢查部，其檢查上述電子零件；保持部，其保持上述電子零件並予以搬送；噴射部，其向上述載置部噴射氣體；及溫度檢測部，其檢測上述載置部之溫度；且上述噴射部於還未將上述電子零件載置於上述載置部之狀態下，藉由上述溫度檢測部檢測出之上述載置部之溫度高於特定溫度時，向上述載 置部噴射上述氣體； 上述檢查部於上述噴射部對上述載置部噴射上述氣體之後，藉由上述溫度檢測部檢測出之上述載置部之溫度為上述特定溫度以下時，對上述電子零件開始檢查。 The electronic component inspection device of the present invention is characterized by comprising: a mounting section for mounting electronic components; an inspection section for inspecting the electronic components; a holding section for holding and transporting the electronic components; and an injection section for the electronic components. The mounting section sprays gas; and a temperature detecting section that detects the temperature of the mounting section; and the spraying section detects the temperature of the mounting section before the electronic component is mounted on the mounting section. When the temperature of the mounting portion is higher than a specific temperature, The part sprays the above-mentioned gas; The inspection unit starts the inspection of the electronic component when the temperature of the placement unit detected by the temperature detection unit is equal to or lower than the specific temperature after the injection unit injects the gas to the placement unit.

藉此，例如，當對上述電子零件進行高溫檢查(例如於100度以上155度以下之溫度環境下之檢查)後進而進行常溫檢查(例如於20度以上80度以下之溫度環境下之檢查)時，對載置部噴射氣體，可強制冷卻載置部。藉此，可使載置部之溫度迅速下降(調整溫度)，因而可迅速地移行至常溫檢查。 With this, for example, after the above-mentioned electronic parts are subjected to a high-temperature inspection (such as an inspection under a temperature environment of 100 degrees to 155 degrees), and then an ordinary temperature inspection (such as an inspection under a temperature environment of 20 degrees to 80 degrees) At this time, the mounting portion can be forcedly cooled by injecting a gas into the mounting portion. Thereby, the temperature of the mounting portion can be rapidly decreased (adjusted the temperature), so that it can be quickly moved to the normal temperature inspection.

又，可將電子零件搬送至檢查部，因此，可利用檢查部對該電子零件進行檢查。且，可自檢查部搬送檢查後之電子零件。 In addition, since the electronic component can be transported to the inspection unit, the electronic component can be inspected by the inspection unit. In addition, electronic parts after inspection can be transported from the inspection section.

1‧‧‧電子零件檢查裝置 1‧‧‧Electronic parts inspection device

3‧‧‧本體部 3‧‧‧Body

4‧‧‧吸附部 4‧‧‧ Adsorption Department

5‧‧‧噴射部 5‧‧‧jetting department

10‧‧‧電子零件搬送裝置 10‧‧‧Electronic parts transfer device

11A‧‧‧托盤搬送機構 11A‧‧‧Tray transfer mechanism

11B‧‧‧托盤搬送機構 11B‧‧‧Tray transfer mechanism

12‧‧‧溫度調整部 12‧‧‧Temperature Adjustment Department

13‧‧‧器件搬送頭 13‧‧‧ device transfer head

14‧‧‧器件供給部 14‧‧‧Device Supply Department

14A‧‧‧器件供給部 14A‧‧‧Device Supply Department

14B‧‧‧器件供給部 14B‧‧‧Device Supply Department

15‧‧‧托盤搬送機構 15‧‧‧pallet transfer mechanism

16‧‧‧檢查部 16‧‧‧ Inspection Department

17‧‧‧器件搬送頭 17‧‧‧ device transfer head

17A‧‧‧器件搬送頭 17A‧‧‧device transfer head

17B‧‧‧器件搬送頭 17B‧‧‧ Device Transfer Head

18‧‧‧器件回收部 18‧‧‧Device Recycling Department

18A‧‧‧器件回收部 18A‧‧‧Device Recycling Department

18B‧‧‧器件回收部 18B‧‧‧Device Recycling Department

19‧‧‧回收用托盤 19‧‧‧Recycling tray

20‧‧‧器件搬送頭 20‧‧‧ device transfer head

21‧‧‧托盤搬送機構 21‧‧‧Tray transfer mechanism

22A‧‧‧托盤搬送機構 22A‧‧‧Tray transfer mechanism

22B‧‧‧托盤搬送機構 22B‧‧‧Tray transfer mechanism

25‧‧‧搬送部 25‧‧‧Transportation Department

26‧‧‧溫度檢測部 26‧‧‧Temperature detection department

31‧‧‧驅動部 31‧‧‧Driver

32‧‧‧連結部 32‧‧‧Connection Department

41‧‧‧流路形成構件 41‧‧‧Flow path forming member

42‧‧‧吸附墊 42‧‧‧Adsorption pad

43‧‧‧配管 43‧‧‧Piping

44‧‧‧泵 44‧‧‧ pump

51‧‧‧流路形成構件 51‧‧‧flow path forming member

53‧‧‧配管 53‧‧‧Piping

54‧‧‧泵 54‧‧‧Pump

90‧‧‧IC器件 90‧‧‧IC device

141‧‧‧凹部(凹槽) 141‧‧‧Concave (groove)

142‧‧‧上表面 142‧‧‧upper surface

161‧‧‧凹部(凹槽) 161‧‧‧ recess (groove)

200‧‧‧托盤 200‧‧‧tray

231‧‧‧第1間隔壁 231‧‧‧The first partition

232‧‧‧第2間隔壁 232‧‧‧Second partition

233‧‧‧第3間隔壁 233‧‧‧ 3rd partition

234‧‧‧第4間隔壁 234‧‧‧ 4th partition

235‧‧‧第5間隔壁 235‧‧‧ 5th partition

241‧‧‧前蓋 241‧‧‧Front cover

242‧‧‧側蓋 242‧‧‧side cover

243‧‧‧側蓋 243‧‧‧side cover

244‧‧‧後蓋 244‧‧‧back cover

245‧‧‧頂蓋 245‧‧‧Top cover

246‧‧‧門(door) 246‧‧‧door

247‧‧‧鉸鏈 247‧‧‧ hinge

300‧‧‧監視器 300‧‧‧ monitor

301‧‧‧顯示畫面 301‧‧‧display

400‧‧‧信號燈 400‧‧‧ signal light

411‧‧‧流路 411‧‧‧flow

421‧‧‧下表面 421‧‧‧ lower surface

500‧‧‧揚聲器 500‧‧‧Speaker

511‧‧‧流路 511‧‧‧flow

512‧‧‧排氣口 512‧‧‧ exhaust port

600‧‧‧滑鼠台 600‧‧‧Mouse Station

700‧‧‧操作面板 700‧‧‧ operation panel

800‧‧‧控制部 800‧‧‧ Control Department

801‧‧‧CPU(Central Processing Unit) 801‧‧‧CPU (Central Processing Unit)

802‧‧‧記憶部 802‧‧‧Memory Department

902‧‧‧端子(電子零件側端子) 902‧‧‧Terminal (electronic component side terminal)

A1‧‧‧托盤供給區域 A1‧‧‧Tray supply area

A2‧‧‧器件供給區域 A2‧‧‧Device supply area

A3‧‧‧檢查區域 A3‧‧‧ Inspection area

A4‧‧‧器件回收區域 A4‧‧‧device recycling area

A5‧‧‧托盤去除區域 A5‧‧‧Tray removal area

GS‧‧‧氣體 GS‧‧‧Gas

H0‧‧‧高度 H0‧‧‧height

H1‧‧‧高度 H1‧‧‧ height

H2‧‧‧高度 H2‧‧‧ height

S101~S104‧‧‧步驟 S101 ~ S104‧‧‧step

S201~S208‧‧‧步驟 S201 ~ S208‧‧‧ steps

X‧‧‧方向 X‧‧‧ direction

Y‧‧‧方向 Y‧‧‧ direction

Z‧‧‧方向 Z‧‧‧ direction

α11A‧‧‧箭頭 α 11A ‧‧‧ Arrow

α11B‧‧‧箭頭 α 11B ‧‧‧ Arrow

α13X‧‧‧箭頭 α 13X ‧‧‧ Arrow

α13Y‧‧‧箭頭 α 13Y ‧‧‧ Arrow

α14‧‧‧箭頭 α 14 ‧‧‧arrow

α15‧‧‧箭頭 α 15 ‧‧‧arrow

α17Y‧‧‧箭頭 α 17Y ‧‧‧ Arrow

α18‧‧‧箭頭 α 18 ‧‧‧ arrow

α20X‧‧‧箭頭 α 20X ‧‧‧ Arrow

α20Y‧‧‧箭頭 α 20Y ‧‧‧ Arrow

α21‧‧‧箭頭 α 21 ‧‧‧ Arrow

α22A‧‧‧箭頭 α 22A ‧‧‧ Arrow

α22B‧‧‧箭頭 α 22B ‧‧‧ Arrow

α90‧‧‧箭頭 α 90 ‧‧‧ arrow

圖1係自正面側觀察本發明之電子零件檢查裝置之第1實施形態之概略立體圖。 FIG. 1 is a schematic perspective view of a first embodiment of the electronic component inspection device according to the present invention as viewed from the front side.

圖2係顯示圖1所示之電子零件檢查裝置之動作狀態之概略俯視圖。 FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection device shown in FIG. 1. FIG.

圖3係圖1所示之電子零件檢查裝置之主要部之方塊圖。 FIG. 3 is a block diagram of a main part of the electronic component inspection apparatus shown in FIG. 1. FIG.

圖4係顯示圖1所示之電子零件檢查裝置之器件供給區域內之器件搬送頭之動作狀態(IC器件搬送時)之部分垂直剖視圖。 FIG. 4 is a partial vertical cross-sectional view showing the operation state of the device transfer head (when the IC device is transferred) in the device supply area of the electronic component inspection device shown in FIG. 1. FIG.

圖5係顯示圖1所示之電子零件檢查裝置之器件供給區域內之器件搬送頭之動作狀態(冷卻動作時)之部分垂直剖視圖。 FIG. 5 is a partial vertical cross-sectional view showing an operation state (during a cooling operation) of a device transfer head in a device supply region of the electronic component inspection device shown in FIG. 1.

圖6係顯示內置於圖1所示之電子零件檢查裝置之控制部之控制程式之流程圖。 FIG. 6 is a flowchart showing a control program built in a control section of the electronic component inspection device shown in FIG. 1. FIG.

圖7係顯示內置於圖1所示之電子零件檢查裝置之控制部之控制程式之流程圖(子程式)。 FIG. 7 is a flowchart (subroutine) showing a control program built into the control section of the electronic component inspection device shown in FIG. 1. FIG.

圖8係顯示本發明之電子零件檢查裝置(第2實施形態)之器件供給區域內之器件搬送頭之部分垂直剖視圖。 Fig. 8 is a vertical sectional view showing a part of a device transfer head in a device supply area of the electronic component inspection apparatus (second embodiment) of the present invention.

圖9係顯示本發明之電子零件檢查裝置(第3實施形態)之檢查區域內之器件搬送頭之動作狀態(冷卻動作時)之部分垂直剖視圖。 FIG. 9 is a partial vertical cross-sectional view showing the operating state (during cooling operation) of the device transfer head in the inspection area of the electronic component inspection device (third embodiment) of the present invention.

圖10係顯示本發明之電子零件檢查裝置(第3實施形態)之檢查區域內之器件搬送頭之動作狀態(冷卻動作時)之部分垂直剖視圖。 FIG. 10 is a partial vertical cross-sectional view showing the operating state (during cooling operation) of the device transfer head in the inspection area of the electronic component inspection device (third embodiment) of the present invention.

圖11係顯示區劃出本發明之電子零件檢查裝置之檢查區域之壁部(隔板)之部分水平剖視圖。 FIG. 11 is a horizontal cross-sectional view showing a part of a wall portion (partition) which delimits an inspection area of the electronic component inspection device of the present invention.

以下，基於附加圖式所示之較佳之實施形態對本發明之電子零件搬送裝置及電子零件檢查裝置進行詳細說明。 Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the preferred embodiments shown in the attached drawings.

<第1實施形態>以下，參照圖1~圖7，對本發明之電子零件搬送裝置及電子零件檢查裝置之第1實施形態進行說明。另，以下，為了便於說明，如圖1所示，將相互正交之3個軸設為X軸、Y軸及Z軸。又，包含X軸與Y軸之XY平面為水平，Z軸為鉛直。又，將平行於X軸之方向亦稱為「X方向(第1方向)」，將平行於Y軸之方向亦稱為「Y方向(第2方向)」，將平行於Z軸之方向亦稱為「Z方向(第3方向)」。又，將各方向之箭頭朝向之 方向稱為「正」，將其相反方向稱為「負」。又，於本案說明書中言及之「水平」並非限定於完全水平，只要不阻礙電子零件之搬送，則亦包含相對於水平略微(例如未達5°左右)傾斜之狀態。又，有時將圖1、圖4及圖5中(關於圖8~圖10亦相同)之上側即Z軸方向正側稱為「上」或「上方」，將下側即Z軸方向負側稱為「下」或「下方」。 <First Embodiment> Hereinafter, a first embodiment of an electronic component transfer device and an electronic component inspection device according to the present invention will be described with reference to FIGS. 1 to 7. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Also, a direction parallel to the X axis is also referred to as "X direction (first direction)", a direction parallel to the Y axis is also referred to as "Y direction (second direction)", and a direction parallel to the Z axis is also It is called "Z direction (third direction)". Orient the arrows in each direction The direction is called "positive" and the opposite direction is called "negative". In addition, the "horizontal" mentioned in the specification of the present case is not limited to a complete level, and includes a state inclined slightly (for example, less than about 5 °) with respect to the level as long as it does not hinder the transportation of electronic components. In addition, in FIG. 1, FIG. 4 and FIG. 5 (the same applies to FIGS. 8 to 10), the positive side in the Z-axis direction is referred to as “up” or “upward”, and the lower side is the negative in the Z-axis direction. The side is called "below" or "below".

本發明之電子零件搬送裝置10具有圖1所示之外觀。該電子零件搬送裝置10具備：載置部，其供載置電子零件即IC器件90；檢查區域A3，其可配置檢查IC器件90(電子零件)之檢查部16；保持部，其保持並搬送IC器件90(電子零件)；噴射部5，其向載置部噴射氣體GS；溫度檢測部26，其檢測載置部之溫度；且，噴射部5於還未將IC器件90(電子零件)載置於載置部之狀態下，當藉由溫度檢測部26檢測出之載置部之溫度高於特定溫度(例如常溫)時，向載置部噴射氣體GS。又，檢查部16於噴射部5對載置部噴射氣體GS之後，藉由溫度檢測部26檢測出之載置部之溫度為特定溫度以下時，開始對IC器件90(電子零件)之檢查。 The electronic component transfer device 10 of the present invention has the appearance shown in FIG. 1. The electronic component transporting device 10 includes a mounting section for mounting the IC device 90 which is an electronic component, an inspection area A3 in which an inspection section 16 for inspecting the IC device 90 (electronic component) can be arranged, and a holding section for holding and transporting IC device 90 (electronic component); injection unit 5 that injects gas GS to the mounting portion; temperature detection unit 26 that detects the temperature of the mounting portion; and the injection unit 5 has not yet IC device 90 (electronic component) When the temperature of the mounting section detected by the temperature detecting section 26 is higher than a specific temperature (for example, normal temperature) in the state of being mounted on the mounting section, the gas GS is sprayed onto the mounting section. In addition, the inspection unit 16 starts the inspection of the IC device 90 (electronic component) when the temperature of the placement unit detected by the temperature detection unit 26 is equal to or lower than a specific temperature after the injection unit 5 ejects the gas GS to the placement unit.

另，於本實施形態中，作為「載置部」，以器件供給部14為例進行說明，作為「保持部」，以器件搬送頭13為例進行說明，但並未限定於此。於「保持部」為器件搬送頭13時，作為「載置部」，除了器件供給部14以外，例如，亦可列舉溫度調整部12。又，作為「保持部」，除了器件搬送頭13以外，亦可列舉器件搬送頭17。於「保持部」為器件搬送頭17時，作為「載置部」，當然器件供給部14，亦可列舉檢查部16。 In addition, in this embodiment, as the "mounting portion", the device supply portion 14 is described as an example, and as the "holding portion", the device transfer head 13 is described as an example, but it is not limited to this. When the “holding section” is the device transfer head 13, as the “mounting section”, in addition to the device supply section 14, for example, the temperature adjustment section 12 may be mentioned. In addition, as the "holding unit", in addition to the device transfer head 13, a device transfer head 17 may be mentioned. When the "holding unit" is the device transfer head 17, as the "mounting unit", of course, the device supplying unit 14 may also be the inspection unit 16.

根據如此之本發明，如下所述，例如，當對IC器件90(電子零件)進行高溫檢查(例如於100度以上155度以下之溫度環境下之第1檢查)後進而進行常溫檢查(例如於20度以上80度以下之溫度環境下之第2檢查)時，對載置部噴射氣體GS，可強制冷卻載置部。藉此，可使載置部之溫度迅速下降(調整溫度)，因此，可迅速地移行至常溫檢查。 According to the present invention as described below, for example, after a high-temperature inspection (for example, the first inspection under a temperature environment of 100 ° C to 155 ° C) of the IC device 90 (electronic component) is performed, and then an ordinary temperature inspection (for example, at In the second inspection under a temperature environment of 20 ° C to 80 ° C), the mounting portion can be forcedly cooled by injecting gas GS into the mounting portion. Thereby, the temperature of the mounting portion can be rapidly decreased (adjusted the temperature), and therefore, it is possible to quickly move to the normal temperature inspection.

又，如圖2所示，本發明之電子零件檢查裝置1具有電子零件搬送裝置10，進而具有檢查電子零件之檢查部16。即，電子零件檢查裝置1具備：載置部，其供載置電子零件即IC器件90；檢查部16，其檢查IC器件90(電子零件)；保持部，其保持並搬送IC器件90(電子零件)；噴射部5，其向載置部噴射氣體GS；溫度檢測部26，其檢測載置部之溫度。且，噴射部5於還未將IC器件90(電子零件)載置於載置部之狀態下，藉由溫度檢測部26檢測出之載置部之溫度高於特定溫度(例如常溫)時，向載置部噴射氣體GS。又，檢查部16於噴射部5對載置部噴射氣體GS後，且藉由溫度檢測部26檢測出之載置部之溫度為特定溫度以下時，開始對IC器件90(電子零件)之檢查。另，關於載置部及保持部，如上所述。 As shown in FIG. 2, the electronic component inspection device 1 of the present invention includes an electronic component transfer device 10 and further includes an inspection unit 16 for inspecting the electronic components. That is, the electronic component inspection device 1 includes a mounting section for mounting the IC device 90 which is an electronic component, an inspection section 16 for inspecting the IC device 90 (electronic component), and a holding section for holding and transporting the IC device 90 (electronic Parts); the injection unit 5 that injects the gas GS toward the placement unit; and the temperature detection unit 26 that detects the temperature of the placement unit. When the injection unit 5 has not placed the IC device 90 (electronic component) on the placement unit, the temperature of the placement unit detected by the temperature detection unit 26 is higher than a specific temperature (for example, normal temperature), A gas GS is sprayed onto the mounting portion. In addition, the inspection unit 16 starts the inspection of the IC device 90 (electronic component) when the injection unit 5 ejects the gas GS from the placement unit and the temperature of the placement unit detected by the temperature detection unit 26 is equal to or lower than a specific temperature. . The mounting portion and the holding portion are as described above.

藉此，可獲得具有上述之電子零件搬送裝置10之優點之電子零件檢查裝置1。又，可將IC器件90(電子零件)搬送至檢查部16，因此，可利用檢查部16對該IC器件90進行檢查。且，可自檢查部16搬送檢查後之IC器件90。 This makes it possible to obtain the electronic component inspection device 1 having the advantages of the electronic component transfer device 10 described above. Since the IC device 90 (electronic component) can be transported to the inspection unit 16, the IC device 90 can be inspected by the inspection unit 16. In addition, the IC device 90 after the inspection can be transferred from the inspection unit 16.

以下，針對各部之構成詳細地進行說明。 Hereinafter, the configuration of each unit will be described in detail.

如圖1、圖2所示，具有電子零件搬送裝置l0之電子零件檢查裝置1係搬送例如BGA(Ball grid array：球柵格陣列)封裝之IC器件等電子零件，且於其搬送過程中對電子零件之電性特性進行檢查、試驗(以下簡稱為「檢查」)的裝置。再者，於以下，為了便於說明，針對使用IC器件作為上述電子零件之情形作為代表進行說明，且將其設為「IC器件90」。IC器件90於本實施形態中成為呈平板狀者。又，如圖4所示，IC器件90於其下表面具有俯視下呈矩陣狀地配置之複數個端子(電子零件側端子)902。各端子902係形成半球狀。 As shown in FIGS. 1 and 2, the electronic component inspection device 1 having the electronic component transfer device 10 transfers electronic components such as IC devices packaged in BGA (Ball Grid Array), and the electronic components are inspected during the transfer. A device for inspecting and testing the electrical characteristics of electronic parts (hereinafter referred to as "inspection"). In addition, in the following, for convenience of explanation, a case where an IC device is used as the above-mentioned electronic component will be described as a representative, and it will be referred to as "IC device 90". The IC device 90 has a flat shape in this embodiment. As shown in FIG. 4, the IC device 90 has a plurality of terminals (electronic-part-side terminals) 902 arranged in a matrix in a plan view on a lower surface thereof. Each terminal 902 is formed in a hemispherical shape.

再者，作為IC器件，除上述者以外，還可列舉例如「LSI(Large Scale Integration，大型積體電路)」、「CMOS(Complementary MOS，互補型金屬氧化物半導體)」、「CCD(Charge Coupled Device，電荷耦合器件)」、或將IC器件進行複數模組封裝化而成之「模組IC」，又可列舉「石英器件」、「壓力感測器」、「慣性感測器(加速度感測器)」、「陀螺儀感測器」、「指紋感測器」等。 In addition, as the IC device, in addition to the above, for example, "LSI (Large Scale Integration)", "CMOS (Complementary MOS)", "CCD (Charge Coupled)" Device (charge-coupled device) ", or" module IC "obtained by packaging IC devices with multiple modules, including" quartz devices "," pressure sensors "," inertial sensors (acceleration sensors) Sensor) "," gyro sensor "," fingerprint sensor ", etc.

電子零件檢查裝置1(電子零件搬送裝置10)具備托盤供給區域A1、器件供給區域A2、檢查區域A3、器件回收區域A4、及托盤去除區域A5，該等區域如下所述般以各壁部分隔。而且，IC器件90係自托盤供給區域A1至托盤去除區域A5沿箭頭α90方向依序經過上述各區域，並於中途之檢查區域A3進行檢查。如此，電子零件檢查裝置1成為具備如下者：電子零件搬送裝置10，其具有以經過各區域之方式搬送IC器件90之搬送部25；檢查部16，其於檢查區域A3內進行檢查；及控制部800。又，此外，電子零 件檢查裝置1具備監視器300、信號燈400、及操作面板700。 The electronic component inspection device 1 (electronic component transfer device 10) includes a tray supply area A1, a device supply area A2, an inspection area A3, a device recovery area A4, and a tray removal area A5. These areas are separated by respective wall portions as described below. . In addition, the IC device 90 passes through each of the above-mentioned areas in the direction of the arrow α 90 in order from the tray supply area A1 to the tray removal area A5, and is inspected in the inspection area A3 in the middle. In this manner, the electronic component inspection device 1 includes the following: an electronic component transfer device 10 having a transfer section 25 that transfers the IC device 90 through each area; an inspection section 16 that performs an inspection in the inspection area A3; and control Department 800. In addition, the electronic component inspection apparatus 1 includes a monitor 300, a signal light 400, and an operation panel 700.

再者，電子零件檢查裝置1係以配置有托盤供給區域A1、托盤去除區域A5之側、即圖2中之下側作為正面側，且配置有檢查區域A3之側、即圖2中之上側作為背面側而使用。 In addition, the electronic component inspection apparatus 1 uses the side where the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side in FIG. 2 as the front side, and the side where the inspection area A3 is arranged, that is, the upper side in FIG. 2. Used as the back side.

又，電子零件檢查裝置1係預先搭載針對IC器件90之每一種進行更換之被稱為「更換套件」者而使用。於該更換套件，有供載置IC器件90(電子零件)之載置部(電子零件載置部)。於本實施形態之電子零件檢查裝置1中，該載置部係設置於複數個部位，例如，有下述之溫度調整部12、器件供給部14及器件回收部18。又，於供載置IC器件90(電子零件)之載置部(電子零件載置部)中，除了如上所述之更換套件以外，還具有使用者準備之托盤200、回收用托盤19，此外亦具有檢查部16。 In addition, the electronic component inspection apparatus 1 is used in advance by mounting a so-called "replacement kit" that replaces each of the IC devices 90. The replacement kit includes a mounting portion (electronic component mounting portion) on which the IC device 90 (electronic component) is mounted. In the electronic component inspection apparatus 1 according to this embodiment, the placement section is provided at a plurality of locations, and includes, for example, a temperature adjustment section 12, a device supply section 14, and a device recovery section 18 described below. The mounting section (electronic component mounting section) for mounting the IC device 90 (electronic component) includes a tray 200 and a recycling tray 19 prepared by the user in addition to the replacement kit as described above. Also includes an inspection section 16.

托盤供給區域A1係供給排列有複數個未檢查狀態之IC器件90之托盤200的供材部。托盤供給區域A1亦可稱為能夠堆積搭載複數個托盤200之搭載區域。再者，於本實施形態中，於各托盤200，呈矩陣狀配置有複數個凹部(凹槽)。於各凹部，可逐個收納、載置IC器件90。 The tray supply area A1 is a material supply section for supplying a tray 200 in which a plurality of IC devices 90 in an unchecked state are arranged. The tray supply area A1 may also be referred to as a loading area where a plurality of trays 200 can be stacked and mounted. In this embodiment, a plurality of recesses (grooves) are arranged in a matrix in each tray 200. The IC devices 90 can be stored and placed one by one in each recess.

器件供給區域A2係將自托盤供給區域A1搬送來之托盤200上之複數個IC器件90分別搬送、供給至檢查區域A3之區域。再者，以跨及托盤供給區域A1與器件供給區域A2之方式，設置有將托盤200沿水平方向逐片搬送之托盤搬送機構11A、11B。托盤搬送機構11A係搬送部25之一部 分，可使托盤200連同載置於該托盤200之IC器件90一併朝Y方向之正側、即圖2中之箭頭α11A方向移動。藉此，可將IC器件90穩定地送入至器件供給區域A2。又，托盤搬送機構11B係可使空的托盤200向Y方向之負側、即圖2中之箭頭α11B方向移動之移動部。藉此，可使空的托盤200自器件供給區域A2移動至托盤供給區域A1。 The device supply area A2 is an area where a plurality of IC devices 90 on the tray 200 transferred from the tray supply area A1 are transferred and supplied to the inspection area A3, respectively. Furthermore, tray transfer mechanisms 11A and 11B are provided so as to straddle the tray supply area A1 and the device supply area A2, and carry the tray 200 piece by piece in the horizontal direction. The tray transfer mechanism 11A is a part of the transfer unit 25 and can move the tray 200 together with the IC device 90 placed on the tray 200 toward the positive side of the Y direction, that is, the direction of the arrow α 11A in FIG. 2. Thereby, the IC device 90 can be stably fed into the device supply area A2. The tray conveyance mechanism 11B is a moving unit that can move the empty tray 200 to the negative side in the Y direction, that is, in the direction of the arrow α 11B in FIG. 2. Thereby, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1.

於器件供給區域A2，設置有溫度調整部(英文表述：soak plate，中文表述(一例)：均溫板)12、器件搬送頭13、及托盤搬送機構15。又，亦設置有以跨及器件供給區域A2與檢查區域A3之方式移動之器件供給部14。 In the device supply area A2, a temperature adjustment section (English expression: soap plate, Chinese expression (one example): temperature equalizing plate) 12, a device transfer head 13, and a tray transfer mechanism 15 are provided. A device supply unit 14 is also provided that moves across the device supply area A2 and the inspection area A3.

溫度調整部12係供載置複數個IC器件90之載置部，係可對該載置之IC器件90一次地進行加熱之稱為「均溫板」者。藉由該均溫板，可將利用檢查部16檢查之前之IC器件90預先加熱，而調整為適於該檢查(高溫檢查)之溫度。 The temperature adjustment section 12 is a mounting section for mounting a plurality of IC devices 90, and is a so-called "temperature equalizing plate" that can heat the mounted IC devices 90 at a time. With the temperature equalizing plate, the IC device 90 before the inspection by the inspection unit 16 can be heated in advance and adjusted to a temperature suitable for the inspection (high-temperature inspection).

作為此種載置部之溫度調整部12係固定。藉此，可穩定地對該溫度調整部12上之IC器件90進行溫度調整。 The temperature adjustment section 12 serving as such a mounting section is fixed. Thereby, the temperature of the IC device 90 on the temperature adjustment section 12 can be stably adjusted.

又，溫度調整部12被接地(grounded)。 The temperature adjustment unit 12 is grounded.

於圖2所示之構成中，溫度調整部12係於Y方向上配置、固定有2個。而且，藉由托盤搬送機構11A自托盤供給區域A1被搬入之托盤200上之IC器件90被搬送至任一溫度調整部12。 In the configuration shown in FIG. 2, two temperature adjustment sections 12 are arranged and fixed in the Y direction. The IC device 90 on the tray 200 that is carried in from the tray supply area A1 by the tray transfer mechanism 11A is transferred to any one of the temperature adjustment units 12.

器件搬送頭13係保持並搬送IC器件90之保持部，能夠於器件供給區域A2內移動地受到支持。該器件搬送頭13亦係搬送部25之一部分，可承擔自托盤供給區域A1搬入之托盤200與溫度調整部12之間之IC器件90之搬送、及溫度調整部12與下述之器件供給部14之間之IC器件90之搬送。再者，於圖2中，以箭頭α13X表示器件搬送頭13沿X方向之移動，以箭頭α13Y表示器件搬送頭13沿Y方向之移動。 The device transfer head 13 is a holding portion that holds and transfers the IC device 90 and is supported so as to be movable within the device supply area A2. The device transfer head 13 is also a part of the transfer unit 25, and can carry the transfer of the IC device 90 between the tray 200 and the temperature adjustment unit 12 carried in from the tray supply area A1, and the temperature adjustment unit 12 and the device supply unit described below. Transfer of IC devices 90 between 14. In FIG. 2, the movement of the device transfer head 13 in the X direction is indicated by an arrow α 13X, and the movement of the device transfer head 13 in the Y direction is indicated by an arrow α 13Y .

如圖4所示，器件搬送頭13(保持部)具有本體部3與藉由吸附而保持IC器件90(電子零件)之吸附部4。 As shown in FIG. 4, the device transfer head 13 (holding portion) includes a main body portion 3 and a suction portion 4 that holds the IC device 90 (electronic component) by suction.

本體部3被支持為可於器件供給區域A2內沿X方向及Y方向移動。又，本體部3具有驅動部31，其可支持吸附部4對於本體部3於Z方向移動。作為驅動部31之構成，並未特別限定，例如，可採用具有壓電元件之構成或具有伺服馬達之構成等。另，驅動部31之動作係由控制部800所控制。藉此，可適當調整吸附部4沿Z方向之移動量或吸附部4之移動速度等。 The main body portion 3 is supported to be movable in the X direction and the Y direction within the device supply region A2. In addition, the main body portion 3 includes a driving portion 31 that can support the suction portion 4 to move in the Z direction with respect to the main body portion 3. The configuration of the driving section 31 is not particularly limited, and for example, a configuration including a piezoelectric element or a configuration including a servo motor may be adopted. The operation of the driving unit 31 is controlled by the control unit 800. Accordingly, the amount of movement of the suction section 4 in the Z direction or the speed of movement of the suction section 4 can be appropriately adjusted.

吸附部4具有：流路形成構件41，其具有供氣體GS通過之流路411，吸附墊42，其連接於流路形成構件41之一端側；泵44，其經由配管43連接於流路形成構件41之另一端側。 The suction section 4 includes a flow path forming member 41 having a flow path 411 through which the gas GS passes, an adsorption pad 42 connected to one end side of the flow path forming member 41, and a pump 44 connected to the flow path via a pipe 43. The other end side of the member 41.

流路形成構件41係由長條之管體構成，以其長邊方向沿著Z方向之方 式配置。 The flow path forming member 41 is composed of a long pipe body, and the longitudinal direction is along the direction of the Z direction. Configuration.

吸附墊42安裝於流路形成構件41之下端。吸附墊42呈環狀，且其內側與流路411連通。 The suction pad 42 is attached to the lower end of the flow path forming member 41. The suction pad 42 has a ring shape, and an inner side thereof communicates with the flow path 411.

又，於流路形成構件41之吸附墊42之相反側，密封地連接有配管43。藉此，配管43與流路411連通。 A pipe 43 is hermetically connected to the opposite side of the suction pad 42 of the flow path forming member 41. Thereby, the pipe 43 communicates with the flow path 411.

且，經由該配管43連接泵44。泵44之動作係由控制部800控制。藉由該泵44之動作，流路411內成為負壓，從而可使吸附墊42吸附IC器件90。又，與此相反，解除該吸附狀態，可自吸附墊42放開IC器件90。另，吸附部4於自吸附住IC器件90之狀態放開IC器件90時，可噴射氣體GS(參照圖4)。藉此，於放開IC器件90時，與例如僅停止泵44之動作進行該放開之情形相比，可順利且迅速地進行IC器件90之放開。而且，例如，根據IC器件90之大小，亦可調整對IC器件90之吸附力等。另，作為泵44，例如可使用容積式泵等各種泵。 The pump 44 is connected via the pipe 43. The operation of the pump 44 is controlled by the control unit 800. By the operation of the pump 44, the inside of the flow path 411 becomes a negative pressure, so that the suction pad 42 can suck the IC device 90. On the other hand, the IC device 90 can be released from the suction pad 42 by releasing the suction state. When the IC device 90 is released from the state in which the IC device 90 is adsorbed, the suction unit 4 can inject a gas GS (see FIG. 4). Accordingly, when the IC device 90 is released, for example, the IC device 90 can be released smoothly and quickly as compared with a case where the operation is performed by stopping only the operation of the pump 44. Moreover, for example, the adsorption force to the IC device 90 can be adjusted according to the size of the IC device 90. As the pump 44, for example, various pumps such as a positive displacement pump can be used.

另，吸附部4之設置數量於圖4或圖5所示之構成中為1個，但並不限定於此。又，於吸附部4之設置數量為複數個之情形時，沿著X方向之吸附部4的設置數量與沿著Y方向之吸附部4之設置數量亦未特別限定。 The number of the suction sections 4 is one in the configuration shown in FIG. 4 or FIG. 5, but it is not limited to this. When the number of the adsorption sections 4 is plural, the number of the adsorption sections 4 along the X direction and the number of the adsorption sections 4 along the Y direction are not particularly limited.

器件供給部14係供載置經溫度調整後之IC器件90之載置部，且係可將該IC器件90搬送至檢查部16附近之被稱為「供給用梭板」或簡稱為 「供給梭」者。該器件供給部14亦可成為搬送部25之一部分。該器件供給部14具有收納、載置IC器件90之凹部(凹槽)141(參照圖4、圖5)。另，凹部141之設置數量於圖4或圖5所示之構成中為1個，但並未限定於此。又，於凹部141之設置數量為複數個之情形時，沿著X方向之凹部141之設置數量與沿著Y方向之凹部141之設置數量亦未特別限定。 The device supply section 14 is a mounting section for mounting the temperature-adjusted IC device 90, and is referred to as a "supply shuttle" or simply referred to as a "supply plate for supply" that can carry the IC device 90 near the inspection section 16. "Supply shuttle". The device supply section 14 may be a part of the transfer section 25. This device supply section 14 has a recessed portion (groove) 141 (see FIGS. 4 and 5) in which the IC device 90 is housed and placed. The number of the recessed portions 141 is one in the configuration shown in FIG. 4 or FIG. 5, but it is not limited to this. When the number of the recesses 141 is plural, the number of the recesses 141 along the X direction and the number of the recesses 141 along the Y direction are not particularly limited.

又，作為載置部之器件供給部14係能夠於器件供給區域A2與檢查區域A3之間沿X方向、即箭頭α14方向往復移動地(可移動地)受到支持。藉此，器件供給部14可將IC器件90自器件供給區域A2穩定地搬送至檢查區域A3之檢查部16附近，又，可於在檢查區域A3中藉由器件搬送頭17將IC器件90取走後再次返回至器件供給區域A2。 In addition, the device supply section 14 as a mounting section is supported to be able to move back and forth (movably) in the X direction, that is, in the direction of the arrow α 14 between the device supply area A2 and the inspection area A3. With this, the device supply section 14 can stably transport the IC device 90 from the device supply area A2 to the vicinity of the inspection section 16 in the inspection area A3, and can also pick up the IC device 90 in the inspection area A3 by the device transfer head 17. After leaving, it returns to the device supply area A2 again.

於圖2所示之構成中，器件供給部14於Y方向上配置有2個，有時將Y方向負側之器件供給部14稱為「器件供給部14A」，將Y方向正側之器件供給部14稱為「器件供給部14B」。而且，溫度調整部12上之IC器件90係於器件供給區域A2內被搬送至器件供給部14A或器件供給部14B。又，器件供給部14與溫度調整部12同樣，構成為可加熱載置於該器件供給部14之IC器件90。藉此，可對經溫度調整部12溫度調整後之IC器件90，維持其溫度調整狀態而搬送至檢查區域A3之檢查部16附近。再者，器件供給部14亦與溫度調整部12同樣地被接地。 In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction. The device supply unit 14 on the negative side in the Y direction is sometimes referred to as “device supply unit 14A”, and the device on the positive side in the Y direction is sometimes referred to. The supply unit 14 is referred to as a "device supply unit 14B". The IC device 90 on the temperature adjustment section 12 is transported to the device supply section 14A or the device supply section 14B in the device supply region A2. The device supply unit 14 is configured to heat the IC device 90 placed on the device supply unit 14 in the same manner as the temperature adjustment unit 12. Thereby, the IC device 90 temperature-adjusted by the temperature adjustment section 12 can be transported to the vicinity of the inspection section 16 of the inspection area A3 while maintaining its temperature adjustment state. The device supply unit 14 is also grounded in the same manner as the temperature adjustment unit 12.

托盤搬送機構15係將去除所有IC器件90後之狀態之空的托盤200於器件供給區域A2內向X方向之正側、即箭頭α15方向搬送之機構。而且，於 該搬送後，空的托盤200係藉由托盤搬送機構11B而自器件供給區域A2返回至托盤供給區域A1。 The tray transfer mechanism 15 is a mechanism that transfers the empty tray 200 in a state where all IC devices 90 have been removed, to the positive side in the X direction, that is, in the direction of arrow α 15 in the device supply area A2. After this transfer, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B.

檢查區域A3係檢查IC器件90之區域。於該檢查區域A3，設置有對IC器件90進行檢查之檢查部16、及器件搬送頭17。 The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, an inspection section 16 for inspecting the IC device 90 and a device transfer head 17 are provided.

器件搬送頭17係搬送部25之一部分，可與溫度調整部12同樣地構成為可對保持之IC器件90加熱。藉此，可將經維持上述溫度調整狀態之IC器件90予以保持，以維持上述溫度調整之狀態，於檢查區域A3內搬送該IC器件90。 The device transfer head 17 is a part of the transfer unit 25 and can be configured to heat the held IC device 90 in the same manner as the temperature adjustment unit 12. Thereby, the IC device 90 maintained in the above-mentioned temperature adjustment state can be maintained to maintain the above-mentioned temperature adjustment state, and the IC device 90 can be transported in the inspection area A3.

此種器件搬送頭17於檢查區域A3內能夠沿Y方向及Z方向往復移動地受到支持，成為被稱為「分度臂」之機構之一部分。藉此，器件搬送頭17可自從器件供給區域A2搬入來之器件供給部14將IC器件90提起且搬送並載置至檢查部16上。 Such a device transfer head 17 is supported in the inspection area A3 such that it can reciprocate in the Y direction and the Z direction, and becomes a part of a mechanism called an "indexing arm". Thereby, the device transfer head 17 can lift up and transfer the IC device 90 from the device supply section 14 brought in from the device supply area A2 and place it on the inspection section 16.

再者，於圖2中，以箭頭α17Y表示器件搬送頭17於Y方向之往復移動。又，器件搬送頭17雖能夠沿Y方向往復移動地受到支持，但並不限定於此，亦可能夠於X方向往復移動地受到支持。又，於圖2所示之構成中，器件搬送頭17係於Y方向上配置有2個，有時將Y方向負側之器件搬送頭17稱為「器件搬送頭17A」，將Y方向正側之器件搬送頭17稱為「器件搬送頭17B」。器件搬送頭17A於檢查區域A3內可承擔將IC器件90自器件供給部14A向檢查部16之搬送，器件搬送頭17B於檢查區域A3內可承擔將 IC器件90自器件供給部14B向檢查部16之搬送。 In FIG. 2, the reciprocating movement of the device transfer head 17 in the Y direction is indicated by an arrow α 17Y . In addition, although the device transfer head 17 is supported so as to be capable of reciprocating in the Y direction, it is not limited to this, and may be supported so as to be capable of reciprocating in the X direction. In the configuration shown in FIG. 2, two device transfer heads 17 are arranged in the Y direction, and the device transfer heads 17 on the negative side in the Y direction are sometimes referred to as “device transfer heads 17A”, and the Y direction is positive. The device transfer head 17 on the side is referred to as a "device transfer head 17B". The device transfer head 17A can carry the IC device 90 from the device supply unit 14A to the inspection unit 16 in the inspection area A3, and the device transfer head 17B can take the IC device 90 from the device supply unit 14B to the inspection unit 16 in the inspection area A3 Transfer of 16.

檢查部16(插口)係載置作為電子零件之IC器件90、並檢查該IC器件90之電電性特性之載置部(電子零件載置部)。該檢查部16具有收納、載置IC器件90之凹部(凹槽)161(參照圖9、圖10)，且於該凹部161之底部，設置複數個探針接腳(未圖示)。且，可藉由IC器件90之端子902與探針接腳可導電地連接，即，可藉由接觸而進行IC器件90之檢查。IC器件90之檢查係基於記憶於連接於檢查部16之測試器所具備之檢查控制部的程式而進行。 The inspection portion 16 (socket) is a placement portion (electronic component placement portion) on which the IC device 90 as an electronic component is placed and the electrical characteristics of the IC device 90 are inspected. The inspection section 16 includes a recessed portion (groove) 161 (see FIGS. 9 and 10) for accommodating and placing the IC device 90, and a plurality of probe pins (not shown) are provided on the bottom of the recessed portion 161. In addition, the terminal 902 and the probe pin of the IC device 90 can be conductively connected, that is, the inspection of the IC device 90 can be performed by contact. The inspection of the IC device 90 is performed based on a program stored in an inspection control section provided in a tester connected to the inspection section 16.

此種檢查部16與溫度調整部12同樣，可將IC器件90加熱，而將該IC器件90調整為適於檢查之溫度。藉此，於檢查部16中，可對IC器件90(電子零件)於第1溫度與低於第1溫度之第2溫度之各環境下進行檢查。作為第1溫度，並未特別限定，例如，可設為100度以上155度以下。又，作為第2溫度，並未特別限定，例如，可設為20度以上80度以下。以下，將第1溫度下之檢查稱為「第1檢查(高溫檢查)」，將第2溫度下之檢查稱為「第2檢查(常溫檢查)」。 Such an inspection unit 16 can heat the IC device 90 and adjust the IC device 90 to a temperature suitable for inspection, similarly to the temperature adjustment unit 12. With this, the inspection unit 16 can inspect the IC device 90 (electronic component) under each environment of the first temperature and the second temperature lower than the first temperature. The first temperature is not particularly limited, and may be, for example, 100 ° C to 155 ° C. The second temperature is not particularly limited, and may be, for example, 20 ° to 80 °. Hereinafter, the inspection at the first temperature is referred to as "the first inspection (high temperature inspection)", and the inspection at the second temperature is referred to as the "second inspection (normal temperature inspection)".

器件回收區域A4係將於檢查區域A3中被檢查且其檢查已結束之複數個IC器件90回收之區域。於該器件回收區域A4，設置有回收用托盤19、器件搬送頭20、及托盤搬送機構21。又，亦設置有以跨及檢查區域A3與器件回收區域A4之方式移動之器件回收部18。又，於器件回收區域A4，亦準備有空的托盤200。 The device recovery area A4 is an area where a plurality of IC devices 90 to be inspected in the inspection area A3 and whose inspections have been completed are recovered. In this device recovery area A4, a recovery tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided. In addition, a device recovery unit 18 is also provided that moves across the inspection area A3 and the device recovery area A4. An empty tray 200 is also prepared in the device recovery area A4.

器件回收部18係供載置於檢查部16中已結束檢查之IC器件90，且可將該IC器件90搬送至器件回收區域A4的載置部，被稱為「回收用梭板」或簡稱為「回收梭」。該器件回收部18亦可成為搬送部25之一部分。 The device recovery section 18 is a mounting section for placing the IC device 90 that has been inspected in the inspection section 16 and can transport the IC device 90 to the device recovery area A4, which is called a "recycling shuttle" or simply "Recycling shuttle". The device recovery section 18 may be a part of the transport section 25.

又，器件回收部18能夠於檢查區域A3與器件回收區域A4之間沿X方向、即箭頭α18方向往復移動地受到支持。又，於圖2所示之構成中，器件回收部18係與器件供給部14同樣地，於Y方向上配置有2個，有時將Y方向負側之器件回收部18稱為「器件回收部18A」，將Y方向正側之器件回收部18稱為「器件回收部18B」。而且，檢查部16上之IC器件90被搬送並載置於器件回收部18A或器件回收部18B。再者，IC器件90自檢查部16向器件回收部18A之搬送由器件搬送頭17A負責，自檢查部16向器件回收部18B之搬送由器件搬送頭17B負責。又，器件回收部18亦與溫度調整部12或器件供給部14同樣被接地。 The device recovery unit 18 is supported so as to be able to move back and forth between the inspection region A3 and the device recovery region A4 in the X direction, that is, in the direction of the arrow α 18 . In the configuration shown in FIG. 2, the device recovery unit 18 is arranged in the Y direction in the same manner as the device supply unit 14. The device recovery unit 18 on the negative side in the Y direction may be referred to as “device recovery”. The part recovery part 18A "refers to the device recovery part 18 on the positive side in the Y direction as the" device recovery part 18B. " The IC device 90 on the inspection section 16 is transported and placed in the device recovery section 18A or the device recovery section 18B. In addition, the transfer of the IC device 90 from the inspection unit 16 to the device recovery unit 18A is performed by the device transfer head 17A, and the transfer of the IC device 90 from the inspection unit 16 to the device recovery unit 18B is performed by the device transfer head 17B. The device recovery unit 18 is also grounded in the same manner as the temperature adjustment unit 12 or the device supply unit 14.

回收用托盤19係供載置經檢查部16檢查後之IC器件90的載置部，且被固定為於器件回收區域A4內不移動。藉此，即便為配置有相對較多之器件搬送頭20等之各種可動部之器件回收區域A4，亦會於回收用托盤19上穩定地載置已檢查完畢之IC器件90。再者，於圖2所示之構成中，回收用托盤19沿X方向配置有3個。 The recovery tray 19 is a mounting portion on which the IC device 90 inspected by the inspection portion 16 is placed, and is fixed so as not to move within the device recovery area A4. Thereby, even if it is the device recovery area A4 in which various movable parts such as a relatively large number of device transfer heads 20 are arranged, the inspected IC devices 90 are stably placed on the recovery tray 19. In the configuration shown in FIG. 2, three collection trays 19 are arranged in the X direction.

又，空的托盤200亦沿X方向配置有3個。該空的托盤200亦成為供載置經檢查部16予以檢查後之IC器件90的載置部。而且，移動至器件回收 區域A4之器件回收部18上之IC器件90被搬送並載置於回收用托盤19及空的托盤200中之任一者。藉此，IC器件90依每一檢查結果被分類並回收。 Three empty trays 200 are also arranged in the X direction. The empty tray 200 also serves as a mounting section on which the IC devices 90 that are inspected by the inspection section 16 are placed. And move to device recycling The IC devices 90 on the device recovery section 18 in the area A4 are transported and placed in any one of the recovery tray 19 and the empty tray 200. Thereby, the IC device 90 is sorted and recovered according to each inspection result.

器件搬送頭20係能夠於器件回收區域A4內沿X方向及Y方向移動地受到支持，進而具有亦能夠於Z方向上移動之部分。該器件搬送頭20係搬送部25之一部分，可將IC器件90自器件回收部18搬送至回收用托盤19或空的托盤200。再者，於圖2中，以箭頭α20X表示器件搬送頭20於X方向之移動，以箭頭α20Y表示器件搬送頭20於Y方向之移動。 The device transfer head 20 is supported so as to be movable in the X direction and the Y direction in the device recovery area A4, and further has a portion capable of moving in the Z direction. The device transfer head 20 is a part of the transfer unit 25 and can transfer the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. In FIG. 2, the movement of the device transfer head 20 in the X direction is represented by an arrow α 20X, and the movement of the device transfer head 20 in the Y direction is represented by an arrow α 20Y .

托盤搬送機構21係將自托盤去除區域A5搬入之空的托盤200於器件回收區域A4內沿X方向、即箭頭α21方向搬送的機構。而且，於該搬送後，空的托盤200配置於回收IC器件90之位置、即可能成為上述3個空的托盤200中之任一個。 The tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the device recovery area A4 in the X direction, that is, in the direction of the arrow α 21 . After the transfer, the empty tray 200 is placed at a position where the IC device 90 is collected, that is, it may become any of the three empty trays 200 described above.

托盤去除區域A5係將排列有已檢查完畢狀態之複數個IC器件90之托盤200回收並去除之卸材部。於托盤去除區域A5中，可堆疊多個托盤200。 The tray removal area A5 is a material removal section for collecting and removing the trays 200 in which the plurality of IC devices 90 in a checked state are arranged. In the tray removing area A5, a plurality of trays 200 can be stacked.

又，以跨及器件回收區域A4與托盤去除區域A5之方式，設置有將托盤200逐片於Y方向上搬送之托盤搬送機構22A、托盤搬送機構22B。托盤搬送機構22A係搬送部25之一部分，且係可使托盤200沿Y方向、即箭頭α22A方向往復移動之移動部。藉此，可將檢查完畢之IC器件90自器件回收區域A4搬送至托盤去除區域A5。又，托盤搬送機構22B可令用以回收IC 器件90之空的托盤200向Y方向之正側、即箭頭α 22B方向移動。藉此，可使空的托盤200自托盤去除區域A5移動至器件回收區域A4。 In addition, a tray transfer mechanism 22A and a tray transfer mechanism 22B that transfer the tray 200 one by one in the Y direction are provided so as to span the device recovery area A4 and the tray removal area A5. The tray conveying mechanism 22A is a part of the conveying section 25 and is a moving section that can reciprocate the tray 200 in the Y direction, that is, the direction of the arrow α 22A . Thereby, the inspected IC device 90 can be transferred from the device recovery area A4 to the tray removal area A5. In addition, the tray transfer mechanism 22B can move the empty tray 200 for recovering the IC device 90 to the positive side in the Y direction, that is, the direction of the arrow α 22B . Thereby, the empty tray 200 can be moved from the tray removal area A5 to the device recovery area A4.

控制部800可控制例如托盤搬送機構11A、托盤搬送機構11B、溫度調整部12、器件搬送頭13(驅動部31或泵44)、器件供給部14、托盤搬送機構15、檢查部16、器件搬送頭17、器件回收部18、器件搬送頭20、托盤搬送機構21、托盤搬送機構22A、及托盤搬送機構22B之動作，此外，可控制下述之溫度檢測部26之動作等。如圖3所示，控制部800具有CPU(Central Processing Unit：中央處理單元)801及記憶部802。CPU801例如可進行各種判斷或各種命令等。記憶部802例如記憶將IC器件90自托盤供給區域A1搬送至托盤去除區域A5之程式等各種程式。又，該控制部800可內置於電子零件檢查裝置1(電子零件搬送裝置10)，亦可設置於外部之電腦等之外部機器。又，外部機器例如有經由電纜等與電子零件檢查裝置1通信之情形、無線通信之情形、及經由網路(例如互聯網)與電子零件檢查裝置1連接之情形等。又，CPU801與記憶部802例如可一體化，作為1個單元而構成，亦可CPU801內置於電子零件檢查裝置1中，記憶部802設置於外部之電腦等外部機器，又可記憶部802內置於電子零件檢查裝置1中，CPU801設置於外部之電腦等外部機器。 The control unit 800 can control, for example, the tray transfer mechanism 11A, the tray transfer mechanism 11B, the temperature adjustment unit 12, the device transfer head 13 (the drive unit 31 or the pump 44), the device supply unit 14, the tray transfer mechanism 15, the inspection unit 16, and the device transfer The operations of the head 17, the device recovery unit 18, the device transfer head 20, the tray transfer mechanism 21, the tray transfer mechanism 22A, and the tray transfer mechanism 22B can be controlled. In addition, the operations of the temperature detection unit 26 described below can be controlled. As shown in FIG. 3, the control unit 800 includes a CPU (Central Processing Unit) 801 and a memory unit 802. The CPU 801 can perform, for example, various judgments and various commands. The storage unit 802 stores, for example, various programs such as a program for transferring the IC device 90 from the tray supply area A1 to the tray removal area A5. The control unit 800 may be built in the electronic component inspection device 1 (electronic component transfer device 10), or may be installed in an external device such as an external computer. In addition, for example, an external device may communicate with the electronic component inspection device 1 via a cable or the like, a wireless communication case, or a case where it is connected to the electronic component inspection device 1 via a network (for example, the Internet). The CPU 801 and the memory unit 802 may be integrated as one unit, for example. The CPU 801 may be built in the electronic component inspection device 1, the memory unit 802 may be provided in an external device such as an external computer, and the memory unit 802 may be built in In the electronic component inspection apparatus 1, the CPU 801 is installed in an external device such as an external computer.

操作員可經由監視器300設定或確認電子零件檢查裝置1之動作條件等。該監視器300具有例如由液晶畫面構成之顯示畫面301，且配置於電子零件檢查裝置1之正面側上部。如圖1所示，於托盤去除區域A5之圖中之右側，設置有供載置滑鼠之滑鼠台600。該滑鼠係於操作顯示於監視器 300之畫面時使用。 The operator can set or confirm the operating conditions and the like of the electronic component inspection device 1 via the monitor 300. The monitor 300 includes a display screen 301 composed of, for example, a liquid crystal screen, and is arranged on the upper portion of the front side of the electronic component inspection device 1. As shown in FIG. 1, on the right side in the drawing of the tray removal area A5, a mouse stage 600 for placing a mouse is provided. The mouse is attached to the operation display on the monitor Use at 300 frames.

又，於對於監視器300於圖1之右下方，配置有操作面板700。操作面板700係與監視器300分開對電子零件檢查裝置1命令所需之動作者。 An operation panel 700 is disposed at the lower right side of the monitor 300 in FIG. 1. The operation panel 700 is an operator required to instruct the electronic component inspection apparatus 1 separately from the monitor 300.

又，信號燈400可藉由發光之顏色之組合而報知電子零件檢查裝置1之動作狀態等。信號燈400係配置於電子零件檢查裝置1之上部。再者，於電子零件檢查裝置1中，內置有揚聲器500，藉由該揚聲器500亦能夠報知電子零件檢查裝置1之動作狀態等。 In addition, the signal lamp 400 can report the operation state of the electronic component inspection device 1 and the like by the combination of the colors of light emission. The signal lamp 400 is arranged on the upper part of the electronic component inspection device 1. Furthermore, a speaker 500 is built in the electronic component inspection device 1, and the speaker 500 can also report the operation state of the electronic component inspection device 1 and the like.

電子零件檢查裝置1係藉由第1間隔壁231將托盤供給區域A1與器件供給區域A2之間隔開，藉由第2間隔壁232將器件供給區域A2與檢查區域A3之間隔開，藉由第3間隔壁233將檢查區域A3與器件回收區域A4之間隔開，藉由第4間隔壁234將器件回收區域A4與托盤去除區域A5之間隔開。又，器件供給區域A2與器件回收區域A4之間亦藉由第5間隔壁235隔開。 The electronic component inspection device 1 separates the tray supply area A1 and the device supply area A2 by a first partition wall 231, and separates the device supply area A2 and the inspection area A3 by a second partition wall 232, and The 3 partition walls 233 separate the inspection area A3 and the device recovery area A4, and the fourth partition walls 234 separate the device recovery area A4 and the tray removal area A5. The device supply region A2 and the device recovery region A4 are also separated by a fifth partition wall 235.

電子零件檢查裝置1係於最外裝以蓋覆蓋，該蓋有例如前蓋241、側蓋242、側蓋243、後蓋244、及頂蓋245。 The electronic component inspection apparatus 1 is covered with a cover at the outermost, and the cover includes, for example, a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245.

如上所述，於檢查部16中，可對IC器件90(電子零件)進行於第1溫度下之第1檢查與低於第1溫度之第2溫度下之第2檢查。另，第1檢查與第2檢查較佳為依該順序進行。即，較佳為，先進行第1檢查後進行第2檢查。 As described above, the inspection unit 16 can perform the first inspection of the IC device 90 (electronic component) at the first temperature and the second inspection at the second temperature lower than the first temperature. The first inspection and the second inspection are preferably performed in this order. That is, it is preferable to perform the first inspection and then the second inspection.

又，於進行第1檢查時，較佳為使器件供給部14之溫度與第1溫度一致(調整溫度)。於進行第2檢查時，較佳為使器件供給部14之溫度與第2溫度一致(調整溫度)。於第1檢查後，為了使第1溫度之器件供給部14下降至第2溫度，在先前係使器件供給部14自然地散熱，等待溫度下降。然而，亦根據第1溫度與第2溫度之溫度差而定，此種自然冷卻於器件供給部14下降至成為目標之溫度(第2溫度)之前會耗費太多時間。 When the first inspection is performed, the temperature of the device supply unit 14 is preferably made equal to the first temperature (adjusted temperature). When the second inspection is performed, it is preferable that the temperature of the device supply unit 14 be the same as the second temperature (adjustment temperature). After the first inspection, in order to lower the device supply unit 14 at the first temperature to the second temperature, the device supply unit 14 was naturally radiated beforehand and the temperature was waited for the temperature to drop. However, depending on the temperature difference between the first temperature and the second temperature, such natural cooling takes too much time before the device supply unit 14 drops to the target temperature (second temperature).

因此，於電子零件檢查裝置1中，以可防止此種缺點之方式構成。以下對該構成及作用進行說明。 Therefore, the electronic component inspection apparatus 1 is structured so that such a disadvantage can be prevented. This configuration and function will be described below.

如上所述，吸附部4於自吸附IC器件90(電子零件)之狀態放開IC器件90(電子零件)時，可噴射氣體GS(參照圖4)。又，如圖5所示，吸附部4可於還未將IC器件90載置於器件供給部14之凹部141之狀態下，亦對器件供給部14之凹部141進行氣體GS之噴射。如此，吸附部4成為兼作向器件供給部14之凹部141噴射氣體GS之噴射部5者。且，藉由來自噴射部5之氣體GS，可強制冷卻器件供給部14。以下，將該動作稱為「冷卻動作」。 As described above, when the adsorption unit 4 releases the IC device 90 (electronic component) from the state where the IC device 90 (electronic component) is self-adsorbed, the gas GS can be ejected (see FIG. 4). In addition, as shown in FIG. 5, the suction portion 4 can spray the gas GS on the recessed portion 141 of the device supply portion 14 before the IC device 90 is placed on the recessed portion 141 of the device supply portion 14. In this way, the suction section 4 becomes the spray section 5 that also serves as a spray section GS for injecting the gas GS into the recessed section 141 of the device supply section 14. In addition, the device supply unit 14 can be forcibly cooled by the gas GS from the injection unit 5. This operation is hereinafter referred to as a "cooling operation".

冷卻動作係於還未將IC器件90(電子零件)載置於器件供給部14(載置部)之狀態下，於由溫度檢測部26檢測出之器件供給部14之溫度高於特定溫度(例如常溫)時進行。且，於該冷卻動作後，於由溫度檢測部26檢測出之器件供給部14之溫度為特定溫度以下時，藉由檢查部16開始對IC器件90(電子零件)之檢查。 The cooling operation is performed when the IC device 90 (electronic component) is not placed on the device supply section 14 (mounting section), and the temperature of the device supply section 14 detected by the temperature detection section 26 is higher than a specific temperature ( (For example, normal temperature). After the cooling operation, when the temperature of the device supply unit 14 detected by the temperature detection unit 26 is equal to or lower than a specific temperature, the inspection of the IC device 90 (electronic component) by the inspection unit 16 is started.

又，如上所述，檢查部16係對IC器件90(電子零件)於第1溫度與低於上述第1溫度之第2溫度之各環境下進行檢查者。冷卻動作、即噴射部5之氣體GS之噴射係於第1溫度下之第1檢查(檢查)與第2溫度下之第2檢查(檢查)之間進行。 As described above, the inspection unit 16 inspects the IC device 90 (electronic component) in each of the first temperature and the second temperature lower than the first temperature. The cooling operation, that is, the injection of the gas GS from the injection unit 5 is performed between the first inspection (inspection) at the first temperature and the second inspection (inspection) at the second temperature.

若簡單總結以上，則為於電子零件檢查裝置1中，噴射部5可於在噴射部5與器件供給部14(載置部)之間未有IC器件90(電子零件)之狀態下，基於溫度檢測部26之檢測結果，向器件供給部14(載置部)噴射氣體GS。藉此，進行冷卻動作。又，該冷卻動作係於第1檢查與第2檢查之間進行。 If the above is briefly summarized, in the electronic component inspection apparatus 1, the ejection section 5 may be based on the state where there is no IC device 90 (electronic component) between the ejection section 5 and the device supply section 14 (mounting section). As a result of the detection by the temperature detection unit 26, a gas GS is injected to the device supply unit 14 (mounting unit). Thereby, a cooling operation is performed. This cooling operation is performed between the first inspection and the second inspection.

且，當於第1檢查後，使第1溫度之器件供給部14降低至第2溫度時，藉由進行冷卻動作，可強制冷卻器件供給部14。藉此，可迅速地使器件供給部14之溫度降低(調整)至目標之第2溫度。且，於該調整後，可迅速地移行至第2檢查。 When the device supply unit 14 at the first temperature is lowered to the second temperature after the first inspection, the device supply unit 14 can be forcibly cooled by performing a cooling operation. Thereby, the temperature of the device supply unit 14 can be quickly reduced (adjusted) to the target second temperature. And after this adjustment, it can move to a 2nd inspection quickly.

如上所述，器件搬送頭13(保持部)具有藉由吸附而保持IC器件90(電子零件)之吸附部4。又，吸附部4係兼作噴射部5，於自吸附住IC器件90(電子零件)之狀態放開IC器件90(電子零件)時，噴射氣體GS者。於進行冷卻動作時向器件供給部14(載置部)噴射氣體GS之時間較佳為長於放開IC器件90(電子零件)時噴射氣體GS之時間。藉此，可儘可能確保延長氣體GS碰觸器件供給部14之時間，因此，可儘可能保持冷卻後之器件供給部14之溫度。 As described above, the device transfer head 13 (holding section) includes the suction section 4 that holds the IC device 90 (electronic component) by suction. In addition, the adsorption unit 4 also serves as the ejection unit 5, and when the IC device 90 (electronic component) is released from the state where the IC device 90 (electronic component) is adsorbed, the gas GS is ejected. The time during which the gas GS is sprayed to the device supply section 14 (mounting section) during the cooling operation is preferably longer than the time during which the gas GS is sprayed when the IC device 90 (electronic component) is released. Thereby, the time during which the gas GS touches the device supply portion 14 can be ensured as much as possible, and therefore, the temperature of the device supply portion 14 after cooling can be maintained as much as possible.

另，噴射氣體GS之時間之調整能夠藉由控制部800控制泵44之動作而進行。又，除了噴射氣體GS之時間以外，例如，亦可調整每 單位時間之氣體GS之噴射量、噴射速度等。 In addition, the timing of the injection gas GS can be adjusted by controlling the operation of the pump 44 by the control unit 800. In addition to the time for which the gas GS is sprayed, for example, each time The injection amount and injection speed of the gas GS per unit time.

吸附部4較佳為其於進行冷卻動作時向器件供給部14(載置部)噴射氣體GS時之高度(噴射高度)H2高於保持並搬送IC器件90(電子零件)時之高度(搬送高度)H1。藉此，可儘可能從較高之位置噴射氣體GS，因此，可使氣體GS碰觸到器件供給部14之較廣範圍。藉此，可防止或抑制於器件供給部14產生溫度不均。另，高度H1係以例如器件供給部14之上表面142之高度H0為基準高度時至吸附部4之吸附墊42之下表面421為止之高度(參照圖4)。又，高度H2係以高度H0為基準高度時至吸附部4之吸附墊42之下表面421為止之高度(參照圖5)。 The suction section 4 is preferably such that the height (ejection height) H2 when the gas GS is sprayed to the device supply section 14 (mounting section) during the cooling operation is higher than the height (transportation) when the IC device 90 (electronic component) is held and transferred Height) H1. Thereby, the gas GS can be ejected from a higher position as much as possible, and therefore, the gas GS can be brought into contact with a wide range of the device supply portion 14. This can prevent or suppress temperature unevenness in the device supply unit 14. The height H1 is the height up to the lower surface 421 of the suction pad 42 of the suction section 4 when the height H0 of the upper surface 142 of the device supply section 14 is used as a reference height (see FIG. 4). The height H2 is a height up to the lower surface 421 of the suction pad 42 of the suction section 4 when the height H0 is used as a reference height (see FIG. 5).

另，高度H1、高度H2之調整可藉由控制部800控制驅動部31之動作而進行。 The height H1 and the height H2 can be adjusted by controlling the operation of the driving unit 31 by the control unit 800.

又，於電子零件檢查裝置1(電子零件搬送裝置10)構成為於低溫檢查中使用液態氮之情形時，亦可將該氮經氣化者作為氣體GS自吸附部(噴射部5)噴射。 When the electronic component inspection device 1 (electronic component transfer device 10) is configured to use liquid nitrogen for low-temperature inspection, the nitrogen may be ejected as a gas GS from the adsorption unit (injection unit 5) via gasification.

又，氣體GS除了使用於器件供給部14之冷卻以外，例如，亦可使用於器件供給部14之清潔(cleaning)。藉此，可去除器件供給部14上之灰塵或塵埃等。 In addition to the cooling of the device supply unit 14, the gas GS may be used for cleaning of the device supply unit 14, for example. Thereby, dust, dust, etc. on the device supply part 14 can be removed.

如此，於本實施形態中，噴射部5設置於器件搬送頭13(保持部)。且，吸附部4兼作該噴射部5。藉此，可省略分別設置吸附部4與噴射部5 之麻煩，因此，可謀求器件搬送頭13之小型化、簡單化。 As described above, in this embodiment, the ejection section 5 is provided in the device transfer head 13 (holding section). The suction unit 4 also serves as the ejection unit 5. Accordingly, it is possible to omit the separate provision of the suction section 4 and the injection section 5 Therefore, it is possible to reduce the size and simplification of the device transfer head 13.

電子零件檢查裝置1(電子零件搬送裝置10)具備操作噴射部5之開始動作、即操作冷卻動作之開始之操作部。作為該操作部，並未特別限定，例如，亦可包含於操作面板700，但較佳為顯示於監視器300者。且，藉由操作操作部或不操作操作部，可選擇進行冷卻動作或省略冷卻動作。 The electronic component inspection device 1 (electronic component transfer device 10) includes an operation portion that operates the start operation of the ejection unit 5, that is, the start of the operation cooling operation. The operation section is not particularly limited. For example, the operation section may be included in the operation panel 700, but is preferably displayed on the monitor 300. In addition, by operating the operation part or not operating the operation part, a cooling operation can be selected or omitted.

如圖5(圖4亦同樣)所示，於器件供給部14，設置檢測器件供給部14(載置部)之溫度之溫度檢測部26。該溫度檢測部26較佳為內置於凹部141附近。又，溫度檢測部26與控制部800電性連接(參照圖3)。藉此，可藉由控制部800控制溫度檢測部26之檢測結果，即由溫度檢測部26檢測出之器件供給部14之溫度。另，作為溫度檢測部26，並未特別限定，例如，可使用具有熱電偶之溫度感測器或具有測溫電阻體之溫度感測器等。 As shown in FIG. 5 (the same applies to FIG. 4), the device supply unit 14 is provided with a temperature detection unit 26 that detects the temperature of the device supply unit 14 (mounting unit). The temperature detection unit 26 is preferably built in the vicinity of the recessed portion 141. The temperature detection unit 26 is electrically connected to the control unit 800 (see FIG. 3). Thereby, the detection result of the temperature detection section 26, that is, the temperature of the device supply section 14 detected by the temperature detection section 26 can be controlled by the control section 800. The temperature detecting section 26 is not particularly limited, and for example, a temperature sensor having a thermocouple or a temperature sensor having a temperature measuring resistor can be used.

接著，基於圖6、圖7之流程圖說明進行冷卻動作之控制程式。 Next, a control program for performing a cooling operation will be described based on the flowcharts of FIGS. 6 and 7.

於執行第1檢查(步驟S101)後，對操作開始冷卻動作之操作部進行操作，一旦判斷為執行冷卻動作(步驟S102)，則執行冷卻動作(步驟S103)。其後，執行第2檢查(步驟S104)。 After the first inspection is performed (step S101), the operation section that starts the cooling operation is operated, and once it is determined that the cooling operation is performed (step S102), the cooling operation is performed (step S103). Thereafter, a second check is performed (step S104).

另，不對操作開始冷卻動作之操作部進行操作，於步驟S102中，於未判斷為執行冷卻動作之情形時，省略冷卻動作之執行，執行第2檢查。 In addition, the operation unit that starts the cooling operation is not operated. In step S102, if it is not determined that the cooling operation is to be performed, the execution of the cooling operation is omitted, and the second check is performed.

又，步驟S103為子程序。於該子程序中，首先，於器件供給區域A2與檢查區域A3，確認不存在IC器件90(步驟S201)。 Step S103 is a subroutine. In this subroutine, first, it is confirmed that the IC device 90 does not exist in the device supply area A2 and the inspection area A3 (step S201).

其次，藉由溫度檢測部26檢測作為冷卻動作對象之所有載置部(此處為「器件供給部14」)之溫度(步驟S202)。 Next, the temperatures of all the mounting parts (here, the "device supply part 14") which are cooling target objects are detected by the temperature detection part 26 (step S202).

其次，將由溫度檢測部26檢測出之溫度與於記憶部802預先設定(記憶)之溫度(例如常溫)相比，判斷檢測溫度是否大於設定溫度(步驟S203)。於步驟S203中一旦判斷檢測溫度大於設定溫度時，使器件搬送頭13移動至器件供給部14上(步驟S204)。 Next, the temperature detected by the temperature detection unit 26 is compared with a temperature (for example, normal temperature) set (remembered) in advance in the memory unit 802 to determine whether the detected temperature is greater than the set temperature (step S203). When it is determined in step S203 that the detection temperature is higher than the set temperature, the device transfer head 13 is moved to the device supply unit 14 (step S204).

其次，自器件供給部14之吸附部4(噴射部5)噴射氣體GS(步驟S205)。且經過特定時間後，停止氣體GS之噴射(步驟S206)。 Next, the gas GS is ejected from the adsorption part 4 (ejection part 5) of the device supply part 14 (step S205). And after a certain time has elapsed, the injection of the gas GS is stopped (step S206).

其次，再次藉由溫度檢測部26檢測器件供給部14之溫度(步驟S207)。 Next, the temperature of the device supply unit 14 is detected again by the temperature detection unit 26 (step S207).

其次，比較藉由溫度檢測部26檢測出之溫度與上述設定溫度，判斷該檢測溫度是否在上述設定溫度以下(步驟S208)。於步驟S208中一旦判斷檢測溫度為設定溫度以下，則依序執行步驟S104以後之步驟。 Next, the temperature detected by the temperature detection unit 26 is compared with the set temperature to determine whether the detected temperature is lower than the set temperature (step S208). Once it is determined in step S208 that the detected temperature is lower than the set temperature, the steps subsequent to step S104 are sequentially executed.

另，於步驟S203中，一旦判斷檢測溫度未大於設定溫度之情形時，依序執行步驟S104以後之步驟。 In addition, in step S203, once it is determined that the detected temperature is not greater than the set temperature, the steps subsequent to step S104 are sequentially performed.

又，於步驟S208中，一旦判斷檢測溫度並非設定溫度以下，則回到步驟S205，以後，依序執行更下位之步驟。 Further, in step S208, once it is determined that the detected temperature is not lower than the set temperature, the process returns to step S205, and thereafter, the lower steps are sequentially performed.

<第2實施形態>以下，參照圖8對本發明之電子零件搬送裝置及電子零件檢查裝置之第2實施形態進行說明，但以與上述實施形態之不同點為中心進行說明，且對相同之事項省略其說明。 <Second Embodiment> Hereinafter, a second embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIG. 8. However, the differences from the above embodiment will be mainly described, and the same matters The description is omitted.

本實施形態除了噴射部之配置部位不同以外，其他與上述第1實施形態相同。 This embodiment is the same as the first embodiment described above except that the arrangement portion of the ejection portion is different.

如圖8所示，器件搬送頭13(保持部)具有藉由吸附而保持IC器件90(電子零件)之吸附部4(第1噴嘴)。於本實施形態中，噴射部5(第2噴嘴)配置於與吸附部4不同之位置。藉此，可將噴射部5配置於所期望之位置。 As shown in FIG. 8, the device transfer head 13 (holding section) includes a suction section 4 (first nozzle) that holds the IC device 90 (electronic component) by suction. In this embodiment, the ejection section 5 (second nozzle) is disposed at a position different from that of the adsorption section 4. Thereby, the injection part 5 can be arrange | positioned at a desired position.

噴射部5經由連結部32固定並連結於本體部3。噴射部5具有：流路形成構件51，其具有供氣體GS通過之流路511；及泵54，其經由配管53連接於流路形成構件51之與排氣口512相反側。 The spraying portion 5 is fixed to the main body portion 3 via a connecting portion 32. The injection unit 5 includes a flow path forming member 51 having a flow path 511 through which the gas GS passes, and a pump 54 connected to a side of the flow path forming member 51 opposite to the exhaust port 512 via a pipe 53.

流路形成構件51係由長條之管體構成，以其長邊方向沿著Z方向之方式配置。又，於流路形成構件51之下端，開口而形成排氣口512。藉此，可噴射氣體GS。 The flow path forming member 51 is composed of a long pipe body, and the longitudinal direction thereof is arranged along the Z direction. The lower end of the flow path forming member 51 is opened to form an exhaust port 512. Thereby, the gas GS can be injected.

於流路形成構件51之與排氣口512相反之側，氣密地連接配管53。藉 此，配管53與流路511連通。 A pipe 53 is hermetically connected to the flow path forming member 51 on the side opposite to the exhaust port 512. borrow Therefore, the piping 53 communicates with the flow path 511.

且，經由該配管53，連接泵54。泵54之動作藉由控制部800控制。藉由該泵54之動作，經由排氣口512，可噴射氣體GS。另，作為泵54，例如可使用容積式泵等各種泵。 A pump 54 is connected via the pipe 53. The operation of the pump 54 is controlled by the control unit 800. By the operation of the pump 54, the gas GS can be injected through the exhaust port 512. As the pump 54, for example, various pumps such as a positive displacement pump can be used.

另，噴射部5之設置數量於圖8所示之構成中為1個，但並未限定於此。又，於噴射部5之設置數量為複數個之情形時，沿X方向之噴射部5之設置數量與沿Y方向之噴射部5之設置數量亦並未特別限定。 The number of the injection units 5 is one in the configuration shown in FIG. 8, but it is not limited to this. When the number of the injection units 5 is plural, the number of the injection units 5 in the X direction and the number of the injection units 5 in the Y direction are not particularly limited.

又，於噴射部5沿Y方向配置有複數個之情形時，例如於使器件搬送頭13於俯視下位於2個溫度調整部12(載置部)之間之狀態下，可自各噴射部5噴射氣體GS。藉此，可一次地冷卻2個溫度調整部12。 When a plurality of ejection sections 5 are arranged in the Y direction, for example, in a state where the device transfer head 13 is positioned between two temperature adjustment sections 12 (mounting sections) in a plan view, the ejection sections 5 may be separated from each ejection section 5. Spray gas GS. Thereby, the two temperature adjustment parts 12 can be cooled at once.

<第3實施形態>以下，參照圖9及圖10對本發明之電子零件搬送裝置及電子零件檢查裝置之第3實施形態進行說明，但以與上述之實施形態之不同點為中心進行說明，且對相同之事項省略其說明。 <Third Embodiment> Hereinafter, a third embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to Figs. 9 and 10, but the differences from the above embodiment will be mainly described, and The description of the same matters is omitted.

本實施形態除了保持部及載置部之適用部位不同以外，其他與上述第1實施形態相同。 This embodiment is the same as the first embodiment described above, except that the application portions of the holding portion and the placing portion are different.

如圖9及圖10所示，於本實施形態中，進行冷卻動作之保持部為檢查區域A3內之器件搬送頭17。又，藉由冷卻動作冷卻之載置部為檢查區域 A3內之檢查部16與於檢查區域A3內移動之器件供給部14。 As shown in FIGS. 9 and 10, in the present embodiment, the holding portion that performs the cooling operation is the device transfer head 17 in the inspection area A3. The mounting area cooled by the cooling operation is the inspection area. The inspection section 16 in A3 and the device supply section 14 moving in the inspection area A3.

於圖9所示之狀態下，藉由器件搬送頭17A之冷卻動作冷卻器件供給部14A，藉由器件搬送頭17B之冷卻動作冷卻檢查部16。此時，於器件供給區域A2中，亦可藉由器件搬送頭13之冷卻動作冷卻器件供給部14B。 In the state shown in FIG. 9, the device supply unit 14A is cooled by the cooling operation of the device transfer head 17A, and the inspection unit 16 is cooled by the cooling operation of the device transfer head 17B. At this time, in the device supply area A2, the device supply portion 14B may be cooled by the cooling operation of the device transfer head 13.

於圖10所示之狀態下，藉由器件搬送頭17B之冷卻動作冷卻器件供給部14B，藉由器件搬送頭17A之冷卻動作冷卻檢查部16。此時，於器件供給區域A2中，藉由器件搬送頭13之冷卻動作冷卻器件供給部14A。 In the state shown in FIG. 10, the device supply unit 14B is cooled by the cooling operation of the device transfer head 17B, and the inspection unit 16 is cooled by the cooling operation of the device transfer head 17A. At this time, in the device supply area A2, the device supply section 14A is cooled by the cooling operation of the device transfer head 13.

<第4實施形態>以下，參照圖11對本發明之電子零件搬送裝置及電子零件檢查裝置之第4實施形態進行說明，但以與上述之實施形態之不同點為中心進行說明，且對相同之事項省略其說明。 <Fourth Embodiment> Hereinafter, a fourth embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIG. 11. However, the differences from the above embodiment will be mainly described, and the same Matters are omitted from the description.

本實施形態除了噴射部之構成及配置部位不同以外，其他與上述第1實施形態相同。 This embodiment is the same as the above-mentioned first embodiment, except that the configuration and the arrangement portion of the injection unit are different.

如圖11所示，電子零件檢查裝置1(電子零件搬送裝置10)具備區劃出檢查區域A3之後蓋244(壁部)。在本實施形態中，噴射部5係設置於後蓋244(壁部)。尤其，後蓋244(壁部)具有藉由鉸鏈247可開閉之門(door)246。且，噴射部5為風扇(送風機)，設置於門246之外側。又，門246呈網狀。藉此，藉由於關閉門246之狀態下使噴射部5動作，可自噴射部5噴射氣體GS。藉此，可冷卻例如檢查部16(載置部)。 As shown in FIG. 11, the electronic component inspection device 1 (electronic component transfer device 10) includes a rear cover 244 (wall portion) that defines the inspection area A3. In this embodiment, the spraying portion 5 is provided on the rear cover 244 (wall portion). In particular, the rear cover 244 (wall portion) has a door 246 that can be opened and closed by a hinge 247. The spray unit 5 is a fan (blower) and is provided outside the door 246. The door 246 has a mesh shape. Thereby, the gas GS can be ejected from the ejection part 5 by operating the ejection part 5 with the door 246 closed. Thereby, for example, the inspection section 16 (mounting section) can be cooled.

另，於本實施形態中，門246之設置數量為1片，但亦可為複數片，即，門246亦可成為多重門。於該情形時，各門246可藉由鉸鏈247開閉，亦可以滑動式開閉。 In addition, in this embodiment, the number of the door 246 is one, but it may be plural, that is, the door 246 may be a multiple door. In this case, each door 246 can be opened and closed by a hinge 247, and can also be opened and closed by sliding.

又，於電子零件檢查裝置1(電子零件搬送裝置10)構成為於低溫檢查下使用液態氮時，將使該氮氣化者作為氣體GS自噴射部5噴出。 In addition, when the electronic component inspection apparatus 1 (electronic component transfer apparatus 10) is configured to use liquid nitrogen for low-temperature inspection, the nitrogenated person is ejected from the injection unit 5 as a gas GS.

以上，基於圖示之實施形態對本發明之電子零件搬送裝置及電子零件檢查裝置加以說明，但本發明並非限定於此，構成電子零件搬送裝置及電子零件檢查裝置之各部之構成可置換為可發揮相同功能之任意之構成者。又，亦可附加任意之構成物。 The electronic component transfer device and the electronic component inspection device of the present invention have been described based on the illustrated embodiment, but the present invention is not limited to this, and the components constituting the electronic component transfer device and the electronic component inspection device can be replaced with each other. Any constituent of the same function. Moreover, you may add arbitrary structures.

又，本發明之電子零件搬送裝置及電子零件檢查裝置亦可為組合上述各實施形態中之任意2種以上之構成(特徵)者。 In addition, the electronic component transfer device and the electronic component inspection device of the present invention may be a combination (a feature) of any two or more of the embodiments described above.

Claims (20)

一種電子零件搬送裝置，其將電子零件搬送至檢查上述電子零件之檢查部，且具備： 載置部，其供載置上述電子零件； 保持部，其保持上述電子零件並予以搬送； 噴射部，其對上述載置部噴射氣體；及 溫度檢測部，其檢測上述載置部之溫度；且 上述噴射部於還未將上述電子零件載置於上述載置部之狀態下，當藉由上述溫度檢測部檢測出之上述載置部之溫度高於特定溫度時，對上述載置部噴射上述氣體； 上述檢查部於上述氣體之噴射之後，當藉由上述溫度檢測部檢測出之上述載置部之溫度為上述特定溫度以下時，檢查上述電子零件。An electronic component conveying device that conveys electronic components to an inspection section that inspects the electronic components, and includes: a placing section for placing the electronic components; a holding section that holds and conveys the electronic components; a jetting section, It sprays gas on the mounting portion; and a temperature detecting portion that detects the temperature of the mounting portion; and the spraying portion passes the temperature when the electronic component is not mounted on the mounting portion. When the temperature of the mounting section detected by the detection section is higher than a specific temperature, the gas is sprayed onto the mounting section; after the gas is sprayed, the inspection section detects the mounting section detected by the temperature detection section. When the temperature is below the specified temperature, check the electronic components. 如請求項1之電子零件搬送裝置，其中 上述噴射部於在上述噴射部與上述載置部之間未有上述上述電子零件之狀態下，對上述載置部噴射上述氣體。According to the electronic component transfer device of claim 1, wherein the spraying section sprays the gas onto the mounting section in a state where the electronic component is not present between the spraying section and the mounting section. 如請求項1或2之電子零件搬送裝置，其中 上述檢查部於上述載置部之溫度係高於常溫之第1溫度時對上述電子零件進行第1檢查，於上述載置部之溫度係低於上述第1溫度之第2溫度時對上述電子零件進行第2檢查； 上述噴射部於上述第1檢查結束之後且上述第2檢查開始之前，噴射上述氣體。For example, if the electronic component transfer device of item 1 or 2 is requested, the inspection section performs the first inspection on the electronic component when the temperature of the mounting portion is higher than the first temperature of normal temperature, and the temperature of the mounting portion is low. The second inspection is performed on the electronic component at the second temperature of the first temperature; the injection unit ejects the gas after the first inspection is completed and before the second inspection is started. 如請求項1或2之電子零件搬送裝置，其中 上述噴射部設置於上述保持部。The electronic component transfer device according to claim 1 or 2, wherein the spraying section is provided in the holding section. 如請求項4之電子零件搬送裝置，其中 上述噴射部藉由吸附而保持上述電子零件，且於自吸附上述電子零件之狀態放開上述電子零件時，噴射上述氣體； 向上述載置部噴射上述氣體之時間係較於放開上述電子零件時噴射上述氣體之時間更長。For example, the electronic component conveying device according to claim 4, wherein the ejection unit holds the electronic component by adsorption, and ejects the gas when the electronic component is released from the state where the electronic component is adsorbed, and ejects the gas to the mounting portion. The time of the gas is longer than the time of ejecting the gas when the electronic parts are released. 如請求項5之電子零件搬送裝置，其中 於向上述載置部噴射上述氣體時之自上述載置部至上述噴射部之距離係較保持上述電子零件予以搬送時之自上述載置部至上述噴射部之距離更長。For example, the electronic component transfer device according to claim 5, wherein the distance from the mounting portion to the spraying portion when the gas is sprayed onto the mounting portion is longer than the distance from the mounting portion to the above when the electronic component is transferred. The distance of the spraying section is longer. 如請求項4之電子零件搬送裝置，其中 上述保持部具有藉由吸附而保持上述電子零件之吸附部； 上述噴射部配置於與上述吸附部不同之位置。The electronic component transfer device according to claim 4, wherein the holding portion has a suction portion that holds the electronic component by suction; and the ejection portion is disposed at a position different from the suction portion. 如請求項1或2之電子零件搬送裝置，其更具備： 供配置上述檢查部之檢查區域；及 區劃出上述檢查區域之壁部；且 上述噴射部設置於上述壁部。For example, the electronic component transfer device of claim 1 or 2 further includes: an inspection area for disposing the inspection area; and a wall portion for dividing the inspection area; and the spraying portion is provided on the wall portion. 如請求項8之電子零件搬送裝置，其中 上述壁部具有開閉之門； 上述噴射部設置於上述門。In the electronic component conveying device according to claim 8, wherein the wall portion has an opening and closing door, and the spraying portion is provided on the door. 如請求項1或2之電子零件搬送裝置，其更具備： 操作上述噴射部之動作之操作部。If the electronic component transfer device of claim 1 or 2 is provided, it is further equipped with the operation part which operates the said injection part. 一種電子零件檢查裝置，其具備： 載置部，其供載置電子零件； 檢查部，其檢查上述電子零件； 保持部，其保持上述電子零件並予以搬送； 噴射部，其對上述載置部噴射氣體；及 溫度檢測部，其檢測上述載置部之溫度；且 上述噴射部於還未將上述電子零件載置於上述載置部之狀態下，當藉由上述溫度檢測部檢測出之上述載置部之溫度高於特定溫度時，對上述載置部噴射上述氣體； 上述檢查部於上述氣體之噴射之後，當藉由上述溫度檢測部檢測出之上述載置部之溫度為上述特定溫度以下時，檢查上述電子零件。An electronic component inspection device includes: a mounting section for mounting electronic components; an inspection section for checking the electronic components; a holding section for holding and transporting the electronic components; an injection section for the mounting section A spray gas; and a temperature detection unit that detects the temperature of the mounting portion; and in a state where the electronic component has not been mounted on the mounting portion, the spraying portion detects the When the temperature of the mounting section is higher than a specific temperature, the gas is sprayed onto the mounting section; after the gas is sprayed, the inspection section detects the temperature of the mounting section by the temperature detecting section as the specific temperature In the following, check the above-mentioned electronic parts. 如請求項11之電子零件檢查裝置，其中 上述噴射部於在上述噴射部與上述載置部之間未有上述上述電子零件之狀態下，對上述載置部噴射上述氣體。The electronic component inspection device according to claim 11, wherein the spraying section sprays the gas onto the mounting section in a state where the electronic component is not present between the spraying section and the mounting section. 如請求項11或12之電子零件檢查裝置，其中 上述檢查部於上述載置部之溫度係高於常溫之第1溫度時對上述電子零件進行第1檢查，於上述載置部之溫度係低於上述第1溫度之第2溫度時對上述電子零件進行第2檢查； 上述噴射部於上述第1檢查結束之後、上述第2檢查開始之前噴射上述氣體。For example, the electronic component inspection device of claim 11 or 12, wherein the inspection unit performs the first inspection on the electronic component when the temperature of the mounting portion is higher than the first temperature of normal temperature, and the temperature of the mounting portion is low The second inspection is performed on the electronic component at the second temperature of the first temperature; the injection unit ejects the gas after the first inspection is completed and before the second inspection is started. 如請求項11或12之電子零件檢查裝置，其中 上述噴射部設置於上述保持部。The electronic component inspection device according to claim 11 or 12, wherein the spraying section is provided in the holding section. 如請求項14之電子零件檢查裝置，其中 上述噴射部藉由吸附而保持上述電子零件，且於自吸附上述電子零件之狀態放開上述電子零件時，噴射上述氣體； 向上述載置部噴射上述氣體之時間係較於放開上述電子零件時噴射上述氣體之時間更長。The electronic component inspection device according to claim 14, wherein the ejection unit holds the electronic component by adsorption, and ejects the gas when the electronic component is released from the state where the electronic component is adsorbed, and ejects the gas to the mounting portion. The time of the gas is longer than the time of ejecting the gas when the electronic parts are released. 如請求項15之電子零件檢查裝置，其中 於向上述載置部噴射上述氣體時之自上述載置部至上述噴射部之距離係較保持上述電子零件予以搬送時之自上述載置部至上述噴射部之距離更長。The electronic component inspection device according to claim 15, wherein the distance from the mounting portion to the ejection portion when the gas is sprayed onto the mounting portion is longer than the distance from the mounting portion to the above when the electronic component is transported. The distance of the spraying section is longer. 如請求項14之電子零件檢查裝置，其中 上述保持部具有藉由吸附而保持上述電子零件之吸附部； 上述噴射部配置於與上述吸附部不同之位置。The electronic component inspection device according to claim 14, wherein the holding portion includes a suction portion that holds the electronic component by suction; and the ejection portion is disposed at a position different from the suction portion. 如請求項11或12之電子零件檢查裝置，其更具備： 供配置上述檢查部之檢查區域；及 區劃出上述檢查區域之壁部；且 上述噴射部設置於上述壁部。For example, the electronic component inspection device of claim 11 or 12, further comprising: an inspection area for disposing the inspection area; and a wall portion for dividing the inspection area; and the spraying portion is provided on the wall portion. 如請求項18之電子零件檢查裝置，其中 上述壁部具有開閉之門； 上述噴射部設置於上述門。The electronic component inspection device according to claim 18, wherein the wall portion has an opening / closing door, and the spraying portion is provided on the door. 如請求項11或12之電子零件檢查裝置，其更具備： 操作上述噴射部之動作之操作部。The electronic component inspection device according to claim 11 or 12, further comprising: an operation section that operates the operation of the spraying section.
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