TWI619951B - Electronic component transfer device and electronic component inspection device - Google Patents

Abstract

本發明提供一種可增加平均單位時間搬送之電子零件之數量之電子零件搬送裝置及電子零件檢查裝置。 The invention provides an electronic component conveying device and an electronic component inspection device which can increase the number of electronic components conveyed per unit time.

本發明之電子零件搬送裝置包含：搬送部，其可配置並搬送複數個電子零件；供給固持部，其可將複數個上述電子零件固持，而配置於上述搬送部；及供給回收固持部，其可將複數個上述電子零件固持，而予以供給及回收；且上述供給固持部之電子零件固持間距可調節為與上述搬送部之電子零件配置間距相同，上述供給回收固持部之電子零件固持間距大於上述搬送部之電子零件配置間距，上述供給固持部將複數個上述電子零件配置於上述搬送部，上述供給回收固持部將複數個上述電子零件分為複數次自上述搬送部取出。 The electronic component conveying device of the present invention includes a conveying section that can arrange and convey a plurality of electronic components, a supply holding section that can hold a plurality of the electronic components and is disposed in the conveying section, and a supply and recovery holding section that A plurality of the above-mentioned electronic parts can be held and supplied and recovered; and the holding pitch of the electronic parts of the supply holding part can be adjusted to be the same as the placement pitch of the electronic parts of the conveying part, and the holding pitch of the electronic parts of the supply recovery holding part is greater than The electronic component is arranged at a pitch of the conveying section, the supply and holding section arranges the plurality of electronic components in the conveying section, and the supply and recovery holding section divides the plurality of electronic components from the conveying section into a plurality of times.

Description

電子零件搬送裝置及電子零件檢查裝置 Electronic component transfer device and electronic component inspection device

本發明係關於一種電子零件搬送裝置及電子零件檢查裝置。 The invention relates to an electronic component conveying device and an electronic component inspection device.

自先前以來，已知有一種檢查例如IC器件等電子零件之電性特徵之電子零件檢查裝置，於該電子零件檢查裝置，組裝有用以將IC器件搬送至檢查部之保持部之電子零件搬送裝置。於IC器件之檢查時，將IC器件配置於保持部，且使設置於保持部之複數個探針銷與IC器件之各端子接觸。 There has been known an electronic component inspection device for inspecting the electrical characteristics of electronic components such as IC devices, and an electronic component transfer device for assembling an IC device to a holding portion of an inspection portion is assembled in the electronic component inspection device. . During the inspection of the IC device, the IC device is arranged on the holding portion, and a plurality of probe pins provided on the holding portion are brought into contact with each terminal of the IC device.

上述電子零件搬送裝置包含下述等構件：浸漬板，其預先將IC器件加熱或冷卻，而調整為適於檢查IC器件之溫度；供給梭，其將於浸漬板調整溫度後之IC器件搬送至檢查部附近；第1器件搬送頭，其進行配置有IC器件之托盤與浸漬板之間之IC器件之搬送、及浸漬板與供給梭之間之IC器件之搬送；回收梭，其搬送檢查後之IC器件；第2器件搬送頭，其進行供給梭與檢查部之間之IC器件之搬送，及檢查部與回收梭之間之IC器件之搬送；及第3器件搬送頭，其進行回收梭與配置回收之IC器件之托盤之間之IC器件之搬送。 The above-mentioned electronic component transfer device includes the following components: an immersion board that heats or cools the IC device in advance to adjust the temperature suitable for checking the IC device; and a supply shuttle that transfers the IC device after the temperature of the immersion board is adjusted to Near the inspection department; the first device transfer head, which transfers the IC devices between the tray on which the IC devices are arranged and the dipping board, and the IC devices between the dipping board and the supply shuttle; IC device; the second device transfer head, which transfers the IC devices between the supply shuttle and the inspection section, and the IC device transfer between the inspection section and the recovery shuttle; and the third device transfer head, which performs the recovery shuttle Transportation of IC devices between the trays with the IC devices for recycling.

第1器件搬送頭、第2器件搬送頭及第3器件搬送頭分別包含固持IC器件之複數個手組件。又，各手組件分別包含吸附IC器件之吸嘴，而利用該吸嘴，藉由吸附固持IC器件90。又，供給梭及回收梭分別具有供IC器件配置之複數個凹穴(pocket)，且檢查部具有供IC器件配置之複數個保持部。 The first device transfer head, the second device transfer head, and the third device transfer head each include a plurality of hand assemblies holding IC devices. Further, each hand assembly includes a suction nozzle for sucking the IC device, and the suction nozzle is used to hold and hold the IC device 90 by suction. In addition, the supply shuttle and the recovery shuttle each have a plurality of pockets for arranging the IC devices, and the inspection section has a plurality of holding sections for arranging the IC devices.

又，於專利文獻1，揭示有一種多聯吸附頭80之各吸附頭81之吸附頭間隔90可調節之IC處理機用器件搬送裝置。 In addition, Patent Document 1 discloses a device transfer device for an IC processing machine in which the head interval 90 of each head 81 of the multi-head head 80 can be adjusted.

於該IC處理機用器件搬送裝置中，將吸附頭間隔90設為客製托盤100之器件收容凹穴間隔202之N倍，而一次性吸附/解放複數個被試驗器件(DUT)。 In this device handling device for IC processing machine, the suction head interval 90 is set to N times the device receiving cavity interval 202 of the custom tray 100, and a plurality of devices under test (DUT) are suctioned / released at one time.

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開平8-264993號公報 [Patent Document 1] Japanese Patent Laid-Open No. 8-264993

於先前之電子零件搬送裝置中，將檢查部之保持部之間距與供給梭之凹穴之間距設定為相同。於該情形時，只要供給梭之凹穴之間距為第1器件搬送頭之手組件之吸嘴之最大間距以下，則可藉由將第1器件搬送頭之手組件之吸嘴之間距調節為與供給梭之凹穴之間距相同，而第1器件搬送頭之全部之手組件同時將IC器件配置於供給梭之凹穴。 In the conventional electronic component transfer device, the distance between the holding portion of the inspection portion and the distance between the pockets of the supply shuttle was set to be the same. In this case, as long as the distance between the pockets of the supply shuttle is less than the maximum distance between the nozzles of the hand assembly of the first device transport head, the distance between the nozzles of the hand assembly of the first device transport head can be adjusted to The distance between the pockets of the supply shuttle is the same, and all the hand components of the first device transfer head simultaneously arrange the IC devices in the pockets of the supply shuttle.

然而，於供給梭之凹穴之間距大於第1器件搬送頭之手組件之吸嘴之最大間距之情形時，第1器件搬送頭之全部之手組件無法同時將IC器件配置於供給梭之凹穴，從而第1器件搬送頭將IC器件分為複數次配置於供給梭之凹穴。因此，平均單位時間搬送之IC器件之數量降低。對於第3器件搬送頭亦相同。 However, in the case where the distance between the pockets of the supply shuttle is larger than the maximum distance between the nozzles of the hand components of the first device transfer head, all the hand components of the first device transfer head cannot simultaneously arrange the IC devices in the recesses of the supply shuttle. Therefore, the first device transfer head divides the IC device into a plurality of recesses arranged in the supply shuttle. Therefore, the number of IC devices transferred per unit time is reduced. The same applies to the third device transfer head.

又，於專利文獻1所記述之IC處理機用器件搬送裝置中，雖形成為藉由多聯吸附頭80，於客製托盤100中，一次性吸附/解放複數個被試驗器件，但於專利文獻1中，未記述於檢查部之複數個保持部，以何種方式配置複數個被試驗器件。因此，於專利文獻1所記述之IC處理機用器件搬送裝置中，無法增加平均單位時間搬送之IC器件之數 量。 Moreover, in the device transfer device for an IC processing machine described in Patent Document 1, although the multiple test heads 80 are used to adsorb / liberate a plurality of test devices at one time in a custom tray 100, the patent In Document 1, it is not described in which manner the plurality of holding sections in the inspection section are arranged in the plurality of devices under test. Therefore, in the device transfer device for an IC processor described in Patent Document 1, the number of IC devices transferred per unit time cannot be increased. the amount.

本發明之目的在於，提供一種可增加平均單位時間搬送之電子零件之數量之電子零件搬送裝置及電子零件檢查裝置。 An object of the present invention is to provide an electronic component transfer device and an electronic component inspection device that can increase the number of electronic components transferred per unit time.

本發明係為解決上述問題之至少一部分而完成者，可作為以下形態或應用例而實現。 The present invention has been made to solve at least a part of the problems described above, and can be implemented as the following forms or application examples.

[應用例1] [Application Example 1]

本發明之電子零件搬送裝置之特徵在於包含：搬送部，其可配置並搬送複數個電子零件；供給固持部，其可將複數個上述電子零件固持，而配置於上述搬送部；及供給回收固持部，其可將複數個上述電子零件固持，而予以供給及回收；且上述供給固持部之電子零件固持間距可調節為與上述搬送部之電子零件配置間距相同；上述供給回收固持部之電子零件固持間距大於上述搬送部之電子零件配置間距；上述供給固持部將複數個上述電子零件配置於上述搬送部；上述供給回收固持部將複數個上述電子零件分為複數次自上述搬送部取出。 The electronic component transfer device of the present invention is characterized by including: a transfer unit that can arrange and transfer a plurality of electronic parts; a supply holding unit that can hold a plurality of the above-mentioned electronic parts and is arranged in the transfer unit; and a supply recovery hold It can hold and supply and recover a plurality of the electronic parts; and the holding pitch of the electronic parts of the supply holding part can be adjusted to be the same as the placement distance of the electronic parts of the conveying part; the electronic parts of the supply and holding part can be adjusted. The holding pitch is greater than the electronic component placement pitch of the conveying section; the supply holding section arranges a plurality of the electronic components in the conveying section; the supply recovery holding section separates the plurality of electronic components from the conveying section into a plurality of times.

藉此，可增加平均單位時間搬送之電子零件之數量。 This can increase the number of electronic parts transferred per unit time.

[應用例2] [Application Example 2]

於本發明之電子零件搬送裝置中，較佳為上述供給固持部將複數個上述電子零件總括地配置於上述搬送部。 In the electronic component transfer device of the present invention, it is preferable that the supply and holding unit collectively arrange the plurality of the electronic components in the transfer unit.

藉此，可增加平均單位時間搬送之電子零件之數量。 This can increase the number of electronic parts transferred per unit time.

[應用例3] [Application Example 3]

於本發明之電子零件搬送裝置中，較佳為上述供給回收固持部自固持至配置上述電子零件之時間短於上述供給固持部自固持至配置上述電子零件之時間。 In the electronic component transfer device of the present invention, it is preferable that the time from when the supply recovery holding portion is held to the placement of the electronic part is shorter than the time from when the supply holding portion is held from the placement to the placement of the electronic part.

藉此，可增加平均單位時間搬送之電子零件之數量。 This can increase the number of electronic parts transferred per unit time.

[應用例4] [Application Example 4]

於本發明之電子零件搬送裝置中，較佳為上述供給固持部可於配置複數個上述電子零件之方向、及與配置複數個上述電子零件之方向正交之方向移動。 In the electronic component conveying device of the present invention, it is preferable that the supply and holding portion can move in a direction in which the plurality of electronic components are arranged and a direction orthogonal to the direction in which the plurality of electronic components are arranged.

藉此，可容易地固持電子零件。 Thereby, the electronic component can be easily held.

[應用例5] [Application Example 5]

本發明之電子零件搬送裝置之特徵在於包含：搬送部，其可配置並搬送複數個電子零件；回收固持部，其可將配置於上述搬送部之複數個上述電子零件固持，而自上述搬送部取出；及供給回收固持部，其可將複數個上述電子零件固持，而予以供給及回收；且上述回收固持部之電子零件固持間距可調節為與上述搬送部之電子零件配置間距相同；上述供給回收固持部之電子零件固持間距大於上述搬送部之電子零件配置間距；上述供給回收固持部將複數個上述電子零件分為複數次配置於上述搬送部；上述回收固持部將複數個上述電子零件自上述搬送部取出。 The electronic component transfer device of the present invention is characterized by including: a transfer unit that can arrange and transfer a plurality of electronic parts; and a recycling and holding unit that can hold the plurality of electronic parts arranged in the transfer unit and transfer the plurality of electronic parts from the transfer unit Take out; and supply a recycling holding part, which can hold and supply and recycle a plurality of the electronic parts; and the electronic part holding pitch of the recycling holding part can be adjusted to be the same as the electronic part configuration pitch of the transferring part; the above supply The electronic component holding pitch of the recycling holding portion is greater than the electronic component disposing pitch of the transferring portion; the supply recycling holding portion divides the plurality of electronic components into the transferring portion; the recycling holding portion separates the plurality of electronic components from The above-mentioned transfer section is taken out.

藉此，可增加平均單位時間搬送之電子零件之數量。 This can increase the number of electronic parts transferred per unit time.

[應用例6] [Application Example 6]

於本發明之電子零件搬送裝置中，較佳為上述回收固持部將複 數個上述電子零件總括地自上述搬送部取出。 In the electronic component transfer device of the present invention, it is preferable that the above-mentioned recovery holding portion is to be restored. The plurality of electronic components are collectively taken out from the transfer unit.

藉此，可增加平均單位時間搬送之電子零件之數量。 This can increase the number of electronic parts transferred per unit time.

[應用例7] [Application Example 7]

於本發明之電子零件搬送裝置中，較佳為上述供給回收固持部自固持至配置上述電子零件之時間短於上述回收固持部自固持至配置上述電子零件之時間。 In the electronic component transfer device of the present invention, it is preferable that the time from when the supply and recovery holding section self-holds to disposing the electronic component is shorter than the time from when the recovery holding section self-holds to disposing the electronic component.

藉此，可增加平均單位時間搬送之電子零件之數量。 This can increase the number of electronic parts transferred per unit time.

[應用例8] [Application Example 8]

於本發明之電子零件搬送裝置中，較佳為上述回收固持部可於配置複數個上述電子零件之方向、及與配置複數個上述電子零件之方向正交之方向移動。 In the electronic component transfer device of the present invention, it is preferable that the recovery holding portion is movable in a direction in which the plurality of electronic components are arranged and a direction orthogonal to the direction in which the plurality of electronic components are arranged.

藉此，可容易地固持電子零件。 Thereby, the electronic component can be easily held.

[應用例9] [Application Example 9]

於本發明之電子零件搬送裝置中，較佳為於上述搬送部中配置複數個上述電子零件之方向與上述搬送部之搬送方向相同。 In the electronic component transfer device of the present invention, it is preferable that a direction in which a plurality of the electronic components are arranged in the transfer portion is the same as a transfer direction of the transfer portion.

藉此，可縮短供給回收固持部配置或取出電子零件時所需之時間。 This can shorten the time required for the supply and recovery holding portion to arrange or take out electronic components.

[應用例10] [Application Example 10]

於本發明之電子零件搬送裝置中，較佳於上述供給回收固持部配置或取出上述電子零件情形時，上述供給回收固持部可於與配置複數個上述電子零件之方向正交之方向移動，上述搬送部可於配置複數個上述電子零件之方向移動。 In the electronic component transfer device of the present invention, it is preferable that when the supply and recovery holding portion is arranged or taken out, the supply and recovery holding portion may be moved in a direction orthogonal to a direction in which a plurality of the electronic components are arranged. The transfer unit can move in a direction in which a plurality of the electronic components are arranged.

藉此，可縮短供給回收固持部配置或取出電子零件時所需之時間。 This can shorten the time required for the supply and recovery holding portion to arrange or take out electronic components.

[應用例11] [Application Example 11]

於本發明之電子零件搬送裝置中，較佳於將配置於上述搬送部 之複數個上述電子零件之間距設為a，將上述供給回收固持部固持之複數個上述電子零件之間距設為b時，b/a為2以上之整數。 In the electronic component transfer device of the present invention, it is preferable that the electronic component transfer device is disposed in the transfer portion. When the distance between the plurality of electronic parts is set to a, and when the distance between the plurality of electronic parts held by the supply recovery holding section is set to b, b / a is an integer of 2 or more.

藉此，可於供給回收固持部配置或取出電子零件時，以最小限之次數配置或取出電子零件。 Thereby, the electronic parts can be arranged or taken out a minimum number of times when the electronic parts are arranged or taken out in the supply and recovery holding portion.

[應用例12] [Application Example 12]

於本發明之電子零件搬送裝置中，較佳為具有可保持上述電子零件之保持部；且上述供給回收固持部可向上述保持部按壓上述電子零件。 In the electronic component transfer device of the present invention, it is preferable that the electronic component transfer device includes a holding portion capable of holding the electronic component; and the supply recovery holding portion can press the electronic component against the holding portion.

藉此，可藉由檢查用固持部按壓電子零件而使電子零件之端子與設置於保持部之探針銷電性連接。 Thereby, the terminal of the electronic component can be electrically connected to the probe pin provided on the holding portion by pressing the electronic component by the holding portion for inspection.

[應用例13] [Application Example 13]

於本發明之電子零件搬送裝置中，較佳上述供給回收固持部與上述搬送部分別設置有2個。 In the electronic component conveying device of the present invention, it is preferable that the supply recovery holding section and the conveying section are provided with two.

藉此，2個搬送部及2個供給回收固持部相互時間性補充，而可進一步增加平均單位時間搬送之電子零件之數量。 Thereby, the two conveying sections and the two supply recovery holding sections are mutually supplemented in time, and the number of electronic parts conveyed per unit time can be further increased.

[應用例14] [Application Example 14]

本發明之電子零件檢查裝置之特徵在於包含：搬送部，其可配置並搬送複數個電子零件；供給固持部，其可將複數個上述電子零件固持，而配置於上述搬送部；供給回收固持部，其可將複數個上述電子零件固持，而予以供給及回收；及檢查部，其檢查上述電子零件；且上述供給固持部之電子零件固持間距可調節為與上述搬送部之電子零件配置間距相同；上述供給回收固持部之電子零件固持間距大於上述搬送部之電 子零件配置間距；上述供給固持部將複數個上述電子零件配置於上述搬送部；上述供給回收固持部將複數個上述電子零件分為複數次自上述搬送部取出。 The electronic component inspection device of the present invention is characterized in that it includes: a conveying section that can arrange and convey a plurality of electronic components; a supply and holding section that can hold and hold a plurality of the electronic components and is arranged in the conveying section; and a supply and recovery holding section , Which can hold and supply a plurality of the above-mentioned electronic parts, and supply and recycle them; and an inspection section, which checks the above-mentioned electronic parts; and the holding pitch of the electronic parts supplied to the holding part can be adjusted to be the same as the placement pitch of the electronic parts of the above-mentioned transportation part ; The holding distance of the electronic parts supplied to the recovery holding part is larger than that of the conveying part. The sub-components are arranged at a pitch; the supply and holding section arranges the plurality of electronic components in the conveying section; and the supply and recovery holding section divides the plurality of electronic components into the conveying section in a plurality of times.

藉此，可增加平均單位時間搬送之電子零件之數量。藉此，可使檢查部不運轉之時間減少，而可使平均單位時間之電子零件之檢查數增加。 This can increase the number of electronic parts transferred per unit time. With this, the time during which the inspection section is not in operation can be reduced, and the number of inspections of electronic parts per unit time can be increased.

[應用例15] [Application Example 15]

本發明之電子零件檢查裝置之特徵在於包含：搬送部，其可配置並搬送複數個電子零件；回收固持部，其可將配置於上述搬送部之複數個上述電子零件固持，而自上述搬送部取出；供給回收固持部，其可將複數個上述電子零件固持，而予以供給及回收；及檢查部，其檢查上述電子零件；且上述回收固持部之電子零件固持間距可調節為與上述搬送部之電子零件配置間距相同；上述供給回收固持部之電子零件固持間距大於上述搬送部之電子零件配置間距；上述供給回收固持部將複數個上述電子零件分為複數次配置於上述搬送部；上述回收固持部將複數個上述電子零件自上述搬送部取出。 The electronic component inspection device of the present invention is characterized in that it includes a transfer unit that can arrange and transfer a plurality of electronic parts, and a recycling and holding unit that can hold a plurality of the electronic parts arranged in the transfer unit and transfer the plurality of electronic parts from the transfer unit. Take out; supply a recycling holding unit that can hold and supply a plurality of the above-mentioned electronic parts to supply and recycle; and an inspection unit that checks the electronic parts; and the electronic part holding space of the recycling holding unit can be adjusted to the above-mentioned transfer unit The electronic component arrangement pitch is the same; the electronic component retention pitch of the supply recovery holding part is greater than the electronic part configuration pitch of the conveying part; the supply recovery holding part divides a plurality of the electronic parts into the transportation part; the recovery The holding unit takes out the plurality of electronic components from the transfer unit.

藉此，可增加平均單位時間搬送之電子零件之數量。藉此，可使檢查部不運轉之時間減少，而可使平均單位時間之電子零件之檢查數增加。 This can increase the number of electronic parts transferred per unit time. With this, the time during which the inspection section is not in operation can be reduced, and the number of inspections of electronic parts per unit time can be increased.

[應用例16] [Application Example 16]

於本發明之電子零件檢查裝置中，較佳為上述供給回收固持部可將上述電子零件供給至上述檢查部及自上述檢查部回收。 In the electronic component inspection device of the present invention, it is preferable that the supply and recovery holding section can supply the electronic component to the inspection section and recover from the inspection section.

藉此，可藉由供給回收固持部將電子零件供給至檢查部而進行檢查，且於檢查後，可藉由供給回收固持部自檢查部回收電子零件。 Thereby, the electronic parts can be supplied to the inspection unit for inspection by the supply recovery holding part, and after the inspection, the electronic parts can be recovered from the inspection part by the supply recovery holding part.

1‧‧‧檢查裝置(電子零件檢查裝置) 1‧‧‧Inspection device (electronic parts inspection device)

1-1~1-7‧‧‧步驟 1-1 ~ 1-7‧‧‧step

2-1~2-7‧‧‧步驟 2-1 ~ 2-7‧‧‧step

6‧‧‧操作部 6‧‧‧Operation Department

11A‧‧‧第1托盤搬送機構 11A‧‧‧The first pallet transfer mechanism

11B‧‧‧第2托盤搬送機構 11B‧‧‧Second pallet transfer mechanism

12‧‧‧溫度調整部(浸漬板) 12‧‧‧Temperature adjustment section (dipping board)

13‧‧‧第1器件搬送頭 13‧‧‧The first device transfer head

14‧‧‧器件供給部(供給梭) 14‧‧‧ Device Supply Department (Supply Shuttle)

15‧‧‧第3托盤搬送機構 15‧‧‧3rd pallet transfer mechanism

16‧‧‧檢查部 16‧‧‧ Inspection Department

17‧‧‧第2器件搬送頭 17‧‧‧ 2nd device transfer head

18‧‧‧器件回收部(回收梭) 18‧‧‧Device Recycling Department (Recycling Shuttle)

19‧‧‧回收用托盤 19‧‧‧Recycling tray

20‧‧‧第3器件搬送頭 20‧‧‧ 3rd device transfer head

21‧‧‧第6托盤搬送機構 21‧‧‧The 6th pallet transfer mechanism

22A‧‧‧第4托盤搬送機構 22A‧‧‧4th pallet transfer mechanism

22B‧‧‧第5托盤搬送機構 22B‧‧‧5th pallet transfer mechanism

61‧‧‧輸入部 61‧‧‧Input Department

62‧‧‧顯示部 62‧‧‧Display

80‧‧‧控制部 80‧‧‧Control Department

90‧‧‧IC器件 90‧‧‧IC device

131‧‧‧手組件 131‧‧‧hand assembly

132‧‧‧吸嘴 132‧‧‧Nozzle

141‧‧‧凹穴 141‧‧‧Dent

161‧‧‧保持部 161‧‧‧holding department

175‧‧‧手組件 175‧‧‧hand assembly

176‧‧‧吸嘴 176‧‧‧Nozzle

181‧‧‧凹穴 181‧‧‧Dent

200‧‧‧托盤 200‧‧‧tray

201‧‧‧手組件 201‧‧‧hand assembly

2)2‧‧‧吸嘴 2) 2‧‧‧ Nozzle

A1‧‧‧托盤供給區域 A1‧‧‧Tray supply area

A2‧‧‧器件供給區域(供給區域) A2‧‧‧Device supply area (supply area)

A3‧‧‧檢查區域 A3‧‧‧ Inspection area

A4‧‧‧器件回收區域(回收區域) A4‧‧‧device recycling area (recycling area)

A5‧‧‧托盤去除區域 A5‧‧‧Tray removal area

R1‧‧‧第1室 R1‧‧‧Room 1

R2‧‧‧第2室 R2‧‧‧Room 2

R3‧‧‧第3室 R3‧‧‧Room 3

P1~P6‧‧‧間距 P1 ~ P6‧‧‧Pitch

P11~P16‧‧‧間距 P11 ~ P16‧‧‧Pitch

X‧‧‧方向 X‧‧‧ direction

Y‧‧‧方向 Y‧‧‧ direction

Z‧‧‧方向 Z‧‧‧ direction

圖1係顯示本發明之電子零件檢查裝置之第1實施形態之概略俯視圖。 FIG. 1 is a schematic plan view showing a first embodiment of the electronic component inspection apparatus of the present invention.

圖2係圖1所示之電子零件檢查裝置之方塊圖。 FIG. 2 is a block diagram of the electronic component inspection apparatus shown in FIG. 1. FIG.

圖3係顯示圖1所示之電子零件檢查裝置之檢查部之主要部分之俯視圖。 FIG. 3 is a plan view showing a main part of an inspection section of the electronic component inspection apparatus shown in FIG. 1. FIG.

圖4係顯示圖1所示之電子零件檢查裝置之檢查部之主要部分之剖視圖。 FIG. 4 is a cross-sectional view showing a main part of an inspection section of the electronic component inspection apparatus shown in FIG. 1. FIG.

圖5係顯示圖1所示之電子零件檢查裝置之器件供給部之主要部分之剖視圖。 FIG. 5 is a cross-sectional view showing a main part of a device supply section of the electronic component inspection apparatus shown in FIG. 1. FIG.

圖6係顯示圖1所示之電子零件檢查裝置之器件回收部之主要部分之剖視圖。 FIG. 6 is a cross-sectional view showing a main part of a device recovery section of the electronic component inspection apparatus shown in FIG. 1. FIG.

圖7係顯示圖1所示之電子零件檢查裝置之第2器件搬送頭之主要部分之剖視圖。 FIG. 7 is a cross-sectional view showing a main part of a second device transfer head of the electronic component inspection apparatus shown in FIG. 1. FIG.

圖8係顯示圖1所示之電子零件檢查裝置之第1器件搬送頭之主要部分之剖視圖。 FIG. 8 is a cross-sectional view showing a main part of a first device transfer head of the electronic component inspection apparatus shown in FIG. 1. FIG.

圖9係顯示圖1所示之電子零件檢查裝置之第3器件搬送頭之主要部分之剖視圖。 FIG. 9 is a cross-sectional view showing a main part of a third device transfer head of the electronic component inspection apparatus shown in FIG. 1. FIG.

圖10(a)、(b)係用以說明圖1所示之電子零件檢查裝置及先前之電子零件檢查裝置之動作之圖。 10 (a) and 10 (b) are diagrams for explaining the operation of the electronic part inspection device shown in FIG. 1 and the conventional electronic part inspection device.

圖11(a)、(b)係用以說明圖1所示之電子零件檢查裝置及先前之電子零件檢查裝置之動作之圖。 11 (a) and (b) are diagrams for explaining the operation of the electronic component inspection device shown in FIG. 1 and the conventional electronic component inspection device.

圖12(a)、(b)係用以說明圖1所示之電子零件檢查裝置及先前之電子零件檢查裝置之動作之圖。 12 (a) and 12 (b) are diagrams for explaining the operation of the electronic component inspection device shown in FIG. 1 and the conventional electronic component inspection device.

圖13(a)、(b)係用以說明圖1所示之電子零件檢查裝置及先前之電子零件檢查裝置之動作之圖。 13 (a) and (b) are diagrams for explaining the operation of the electronic component inspection device shown in FIG. 1 and the conventional electronic component inspection device.

圖14(a)、(b)係用以說明圖1所示之電子零件檢查裝置及先前之電子零件檢查裝置之動作之圖。 14 (a) and 14 (b) are diagrams for explaining the operation of the electronic part inspection device shown in FIG. 1 and the conventional electronic part inspection device.

圖15(a)、(b)係用以說明圖1所示之電子零件檢查裝置及先前之電子零件檢查裝置之動作之圖。 15 (a) and (b) are diagrams for explaining the operation of the electronic part inspection device shown in FIG. 1 and the conventional electronic part inspection device.

圖16(a)、(b)係用以說明圖1所示之電子零件檢查裝置及先前之電子零件檢查裝置之動作之圖。 16 (a) and 16 (b) are diagrams for explaining the operation of the electronic part inspection device shown in FIG. 1 and the conventional electronic part inspection device.

圖17係顯示關於圖1所示之電子零件檢查裝置及先前之電子零件檢查裝置之動作所需之時間之曲線圖。 FIG. 17 is a graph showing the time required for the operation of the electronic part inspection device shown in FIG. 1 and the previous electronic part inspection device.

圖18係顯示本發明之電子零件檢查裝置之第2實施形態之概略俯視圖。 Fig. 18 is a schematic plan view showing a second embodiment of the electronic component inspection device of the present invention.

以下，對本發明之電子零件搬送裝置及電子零件檢查裝置，根據附加圖式所示之實施形態進行詳細說明。 Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the embodiments shown in the attached drawings.

<第1實施形態> <First Embodiment>

圖1係顯示本發明之電子零件檢查裝置之第1實施形態之概略俯視圖。圖2係圖1所示之電子零件檢查裝置之方塊圖。圖3係顯示圖1所示之電子零件檢查裝置之檢查部之主要部分之俯視圖。圖4係顯示圖1所示之電子零件檢查裝置之檢查部之主要部分之剖視圖。圖5係顯示圖1所示之電子零件檢查裝置之器件供給部之主要部分之剖視圖。圖6係顯示圖1所示之電子零件檢查裝置之器件回收部之主要部分之剖視圖。圖7係顯示圖1所示之電子零件檢查裝置之第2器件搬送頭之主要部分之剖視圖。圖8係顯示圖1所示之電子零件檢查裝置之第1器件搬 送頭之主要部分之剖視圖。圖9係顯示圖1所示之電子零件檢查裝置之第3器件搬送頭之主要部分之剖視圖。圖10~圖16分別係用以說明圖1所示之電子零件檢查裝置及先前之電子零件檢查裝置之動作之圖。圖17係顯示關於圖1所示之電子零件檢查裝置及先前之電子零件檢查裝置之動作所需之時間之曲線圖。圖18係顯示本發明之電子零件檢查裝置之第2實施形態之概略俯視圖。 FIG. 1 is a schematic plan view showing a first embodiment of the electronic component inspection apparatus of the present invention. FIG. 2 is a block diagram of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 3 is a plan view showing a main part of an inspection section of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 4 is a cross-sectional view showing a main part of an inspection section of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 5 is a cross-sectional view showing a main part of a device supply section of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 6 is a cross-sectional view showing a main part of a device recovery section of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 7 is a cross-sectional view showing a main part of a second device transfer head of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 8 shows the first device moving of the electronic component inspection apparatus shown in FIG. 1. FIG. Sectional view of the main part of the feed head. FIG. 9 is a cross-sectional view showing a main part of a third device transfer head of the electronic component inspection apparatus shown in FIG. 1. FIG. 10 to 16 are diagrams for explaining operations of the electronic component inspection device shown in FIG. 1 and the conventional electronic component inspection device, respectively. FIG. 17 is a graph showing the time required for the operation of the electronic part inspection device shown in FIG. 1 and the previous electronic part inspection device. Fig. 18 is a schematic plan view showing a second embodiment of the electronic component inspection device of the present invention.

另，於以下，為了便於說明，如圖1所示，將相互正交之3軸設為X軸、Y軸及Z軸(對於圖18亦相同)。又，包含X軸與Y軸之XY平面成為水平，Z軸成為鉛直。又，將平行於X軸之方向亦稱為「X方向」，將平行於Y軸之方向亦稱為「Y方向」，將平行於Z軸之方向亦稱為「Z方向」。又，將X軸、Y軸及Z軸之各軸之箭頭之方向稱為正側，將與箭頭相反之方向稱為負側。又，將電子零件之搬送方向之上游側亦簡稱為「上游側」，將下游側亦簡稱為「下游側」。又，於本說明書言及之「水平」並非限定於完全水平，只要不阻礙電子零件之搬送，則亦包含相對於水平稍微(例如未達5°左右)傾斜之狀態。 In the following, for convenience of explanation, as shown in FIG. 1, the three axes that are orthogonal to each other are the X axis, the Y axis, and the Z axis (the same is true for FIG. 18). The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Further, a direction parallel to the X axis is also referred to as "X direction", a direction parallel to the Y axis is also referred to as "Y direction", and a direction parallel to the Z axis is also referred to as "Z direction". The directions of the arrows of the X-axis, Y-axis, and Z-axis are referred to as positive sides, and the directions opposite to the arrows are referred to as negative sides. The upstream side in the direction of transport of electronic components is also simply referred to as the "upstream side", and the downstream side is also simply referred to as the "downstream side". In addition, the "horizontal" mentioned in this specification is not limited to a complete level, and includes a state inclined slightly (for example, less than about 5 °) with respect to the level as long as it does not hinder the transportation of electronic components.

又，於以下，為了便於說明，將圖4~圖9中之上側稱為「上」或「上方」，下側稱為「下」或「下方」，右側稱為「右」，左側稱為「左」。 In the following, for convenience of explanation, the upper side in FIG. 4 to FIG. 9 is referred to as “upper” or “upper”, the lower side is referred to as “down” or “lower”, the right side is referred to as “right”, and the left side is referred to as "left".

另，於圖10~圖16中，為便於理解，對先前之檢查裝置亦標註與本實施形態之檢查裝置1相同之符號。 In addition, in FIG. 10 to FIG. 16, for the sake of easy understanding, the same reference numerals as those of the inspection apparatus 1 of this embodiment are also given to the previous inspection apparatus.

圖1所示之檢查裝置(電子零件檢查裝置)1係用以檢測．試驗(以下簡稱為「檢查」)例如BGA(Ball grid array：球狀柵格陣列)封裝或LGA(Land grid array：平台柵格陣列)封裝等IC器件、LCD(Liquid Crystal Display：液晶顯示器)、CIS(CMOS Image Sensor：CMOS影像感測器)等電子零件之電性特徵之裝置。另，於以下，為了便於說明，針對使用IC器件作為進行檢查之上述電子零件之情形，作為代表 進行說明，且將該IC器件設為「IC器件90」。 The inspection device (electronic parts inspection device) 1 shown in Fig. 1 is used for inspection. Test (hereinafter referred to as "inspection") IC devices such as BGA (Ball grid array) package or LGA (Land grid array) package, LCD (Liquid Crystal Display), CIS (CMOS Image Sensor: CMOS image sensor) and other electronic components of electronic devices. In addition, in the following, for convenience of explanation, a case where an IC device is used as the above-mentioned electronic component for inspection will be representative. This IC device will be described as "IC device 90".

如圖1所示，將檢查裝置1區分成如下：托盤供給區域A1、器件供給區域(以下簡稱為「供給區域」)A2、檢查區域A3、器件回收區域(以下簡稱為「回收區域」)A4、及托盤去除區域A5。該等各區域相互藉由未圖示之壁部或閘門等分隔。因此，供給區域A2成為以壁部或閘門等區劃出之第1室R1，又，檢查區域A3成為以壁部或閘門等區劃出之第2室R2，又，回收區域A4成為以壁部或閘門等區劃出之第3室R3。又，第1室R1(供給區域A2)、第2室R2(檢查區域A3)及第3室R3(回收區域A4)分別構成為可確保氣密性及絕熱性。藉此，第1室R1、第2室R2及第3室R3可分別儘可能地維持濕度及溫度。另，可將第1室R1及第2室R2內分別控制為特定之濕度及特定之溫度。 As shown in FIG. 1, the inspection device 1 is divided into the following: a tray supply area A1, a device supply area (hereinafter referred to as the "supply area") A2, an inspection area A3, and a device recovery area (hereinafter referred to as the "recycling area") A4 , And the tray removal area A5. These areas are separated from each other by a wall portion or a gate, etc., which are not shown. Therefore, the supply area A2 becomes the first room R1 divided by the wall portion or the gate, and the inspection area A3 becomes the second room R2 divided by the wall portion or the gate. The recovery area A4 becomes the wall or gate. The third room R3 is divided by the gate and other areas. The first room R1 (supply area A2), the second room R2 (inspection area A3), and the third room R3 (recovery area A4) are each configured to ensure airtightness and thermal insulation. Thereby, the first room R1, the second room R2, and the third room R3 can maintain humidity and temperature as much as possible. In addition, the first room R1 and the second room R2 can be controlled to a specific humidity and a specific temperature, respectively.

IC器件90自托盤供給區域A1至托盤去除區域A5依序經由上述各區域，且於中途之檢查區域A3被進行檢查。依此，檢查裝置1形成為具備如下者：於各區域搬送IC器件90、且具有控制部80之電子零件搬送裝置，於檢查區域A3內進行檢查之檢查部16，及未圖示之檢查控制部。另，於檢查裝置1中，藉由除檢查部16及檢查控制部以外之構成，構成電子零件搬送裝置。 The IC device 90 passes through each of the above-mentioned areas in order from the tray supply area A1 to the tray removal area A5, and is inspected in the inspection area A3 in the middle. According to this, the inspection apparatus 1 is formed to include an electronic component transporting apparatus that transports the IC device 90 and the control unit 80 in each area, an inspection unit 16 that performs inspection in the inspection area A3, and inspection control (not shown). unit. In addition, the inspection device 1 has a configuration other than the inspection unit 16 and the inspection control unit to constitute an electronic component conveying device.

托盤供給區域A1係供給排列有未檢查狀態之複數個IC器件90之托盤200之區域。於托盤供給區域A1中，可重疊配置多數個托盤200。 The tray supply area A1 is an area where trays 200 in which a plurality of IC devices 90 are arranged in an unchecked state are supplied. In the tray supply area A1, a plurality of trays 200 may be arranged in an overlapping manner.

供給區域A2係將來自托盤供給區域A1之托盤200上之複數個IC器件90分別供給至檢查區域A3之區域。另，以橫跨托盤供給區域A1與供給區域A2之方式，設置有逐枚搬送托盤200之第1托盤搬送機構11A、第2托盤搬送機構11B。 The supply area A2 is an area for supplying a plurality of IC devices 90 on the tray 200 from the tray supply area A1 to the inspection area A3, respectively. A first tray transfer mechanism 11A and a second tray transfer mechanism 11B are provided so as to straddle the tray supply area A1 and the supply area A2.

於供給區域A2，設置有作為配置IC器件90之配置部之溫度調整部(浸漬板)12、第1器件搬送頭(供給固持部)13、及第3托盤搬送機構 15。 In the supply area A2, a temperature adjustment section (dip plate) 12, which is an arrangement section where the IC device 90 is arranged, a first device transfer head (supply holding section) 13, and a third tray transfer mechanism are provided. 15.

溫度調整部12係將複數個IC器件90加熱或冷卻，而調整(控制)為適於檢查該IC器件90之溫度之裝置。即，溫度調整部12係可配置IC器件90，且進行該IC器件90之加熱及冷卻之兩者之溫度控制構件(構件)。於圖1所示之構成中，於Y方向配置並固定有2個溫度調整部12。而且，將藉由第1托盤搬送機構11A自托盤供給區域A1搬入(搬送來)之托盤200上之IC器件90搬送至任一溫度調整部12，並載置。 The temperature adjustment section 12 is a device that heats or cools the plurality of IC devices 90, and adjusts (controls) the devices suitable for checking the temperature of the IC devices 90. That is, the temperature adjustment unit 12 is a temperature control member (component) that can arrange the IC device 90 and perform both heating and cooling of the IC device 90. In the configuration shown in FIG. 1, two temperature adjustment sections 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in (carried in) from the tray supply area A1 by the first tray transfer mechanism 11A is transferred to any one of the temperature adjustment units 12 and placed.

第1器件搬送頭13係可於X方向(第1方向)、Y方向(第3方向)、及Z方向(第2方向)移動地被支持於供給區域A2內。藉此，第1器件搬送頭13可承擔自托盤供給區域A1搬入之托盤200與溫度調整部12之間之IC器件90之搬送，及溫度調整部12與後述之器件供給部14之間之IC器件90之搬送。 The first device transfer head 13 is supported in the supply area A2 so as to be movable in the X direction (the first direction), the Y direction (the third direction), and the Z direction (the second direction). With this, the first device transfer head 13 can transfer the IC device 90 between the tray 200 and the temperature adjustment section 12 carried in from the tray supply area A1, and the IC between the temperature adjustment section 12 and the device supply section 14 described later. Transport of device 90.

如圖8所示，第1器件搬送頭13具有複數個手組件131，作為固持IC器件90之固持部。該等手組件131之數量只要為複數個即可，不用特別限定，於本實施形態中，作為1例而說明8個之情形。再者，將8個手組件131按矩陣狀於X方向配置4個，於Y方向配置2個，故於圖8中，僅可看到X方向之排列為1行之4個手組件131。因各手組件131之構成相同，故於以下，代表性地針對1個手組件131進行說明。另，於動作之說明中，代表性地針對可看到之4個手組件131進行說明。手組件131具備吸嘴132，而藉由吸附IC器件90而予固持。即，手組件131以將IC器件90配置於吸嘴132之前端部之狀態，藉由驅動未圖示之泵吸引空氣(流體)，將吸嘴132之內腔設為負壓狀態，而以吸嘴132之前端部固持(吸附固持)IC器件90。又，藉由驅動未圖示之其他泵供給空氣(流體)，解除吸嘴132之內腔之負壓狀態，而放開以吸嘴132固持之IC器件90。 As shown in FIG. 8, the first device transfer head 13 includes a plurality of hand assemblies 131 as holding parts for holding the IC device 90. The number of such hand assemblies 131 may be plural, and it is not particularly limited. In this embodiment, the case of eight is described as an example. Furthermore, the eight hand assemblies 131 are arranged in a matrix form with four in the X direction and two in the Y direction. Therefore, in FIG. 8, only the four hand assemblies 131 arranged in a row in the X direction can be seen. Since the configuration of each of the hand units 131 is the same, one hand unit 131 will be representatively described below. In addition, in the description of the operation, four hand assemblies 131 that can be seen are representatively described. The hand unit 131 includes a suction nozzle 132 and is held by holding the IC device 90. That is, the hand assembly 131 is in a state in which the IC device 90 is disposed at the front end of the suction nozzle 132, and a pump (not shown) is driven to suck air (fluid), and the inner cavity of the suction nozzle 132 is set to a negative pressure state. The front end of the suction nozzle 132 holds (adsorbs and holds) the IC device 90. In addition, by driving other pumps (not shown) to supply air (fluid), the negative pressure state of the inner cavity of the suction nozzle 132 is released, and the IC device 90 held by the suction nozzle 132 is released.

又，手組件131之間距(電子零件固持間距)P5係可調節，而適當 地調節。於本實施形態中，針對於檢查部16及器件供給部14中，將手組件131之間距P5調節(設定)為檢查部16之保持部161之間距(電子零件配置間距)P1及第2器件搬送頭17之手組件175之吸嘴176之間距(電子零件固持間距)P4(b)之1/2，且與器件供給部14之凹穴141之間距(電子零件配置間距)P2(a)相同之情形進行說明。 In addition, the distance between the hand units 131 (holding distance of electronic parts) P5 is adjustable, and it is appropriate To adjust. In the present embodiment, for the inspection unit 16 and the device supply unit 14, the distance P5 between the hand assemblies 131 is adjusted (set) to the distance between the holding portions 161 of the inspection unit 16 (electronic component placement pitch) P1 and the second device. The distance between the suction nozzles 176 of the hand assembly 175 of the transfer head 17 (the electronic component holding distance) P4 (b) is 1/2, and the distance from the cavity 141 of the device supply section 14 (the electronic component placement distance) P2 (a) The same situation will be described.

第3托盤搬送機構15係使去除全部之IC器件90後之狀態之空的托盤200於X方向搬送之機構。然後，於該搬送後，將空的托盤200藉由第2托盤搬送機構11B自供給區域A2運回托盤供給區域A1。 The third tray transfer mechanism 15 is a mechanism that transfers the empty tray 200 in the state after removing all the IC devices 90 in the X direction. Then, after the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray transfer mechanism 11B.

檢查區域A3係檢查IC器件90之區域。於該檢查區域A3，設置有作為可配置並搬送IC器件90之搬送部(供給搬送部)之器件供給部(供給梭)14、檢查部16、第2器件搬送頭(供給回收固持部)17、及作為可配置並搬送IC器件90之搬送部(回收搬送部)之器件回收部(回收梭)18。 The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, a device supply section (supply shuttle) 14, a check section 16, and a second device transfer head (supply recovery holding section) 17 as a transfer section (supply transfer section) capable of arranging and transferring IC devices 90 are provided. And a device recovery section (recovery shuttle) 18 as a transfer section (recovery transfer section) that can arrange and transport the IC devices 90.

器件供給部14具有：配置IC器件90之配置板，及可於X方向移動之器件供給部本體，且配置板係可裝卸地設置於器件供給部本體。該器件供給部14係將經溫度調整(溫度控制)後之IC器件90搬送至檢查部16附近之裝置，且沿X方向可移動地支持於供給區域A2與檢查區域A3之間。將溫度調整部12上之IC器件90藉由第1器件搬送頭13搬送至器件供給部14，並載置。另，於器件供給部14中，可與溫度調整部12同樣，將複數個IC器件90加熱或冷卻，而調整為適於檢查該IC器件90之溫度。 The device supply section 14 includes a configuration board on which the IC device 90 is arranged, and a device supply section body that is movable in the X direction, and the configuration board is detachably provided on the device supply section body. This device supply unit 14 is a device that transports the IC device 90 after temperature adjustment (temperature control) to the vicinity of the inspection unit 16 and is movably supported between the supply area A2 and the inspection area A3 in the X direction. The IC device 90 on the temperature adjustment unit 12 is transferred to the device supply unit 14 by the first device transfer head 13 and placed thereon. In addition, in the device supply section 14, similarly to the temperature adjustment section 12, a plurality of IC devices 90 may be heated or cooled to be adjusted to a temperature suitable for inspecting the IC devices 90.

若對器件供給部14更加詳細說明，則如圖5所示，於器件供給部14之上表面，設置有作為收容(配置)IC器件90之複數個凹部之凹穴(電子零件配置部)141。將各IC器件90收容入各凹穴141，藉此，配置於器件供給部14。 If the device supply portion 14 is described in more detail, as shown in FIG. 5, a cavity (electronic component placement portion) 141 is provided on the upper surface of the device supply portion 14 as a plurality of recesses for accommodating (arranging) the IC device 90. . Each of the IC devices 90 is housed in each of the recesses 141, and is thereby placed in the device supply unit 14.

各凹穴141之形狀、大小(尺寸)及配置(位置)係根據檢查之IC器件90之形狀、大小(尺寸)、及檢查部16之保持部161之配置等而設定。 於本實施形態中，針對將凹穴141之間距P2設定為檢查部16之保持部161之間距P1及手組件175之吸嘴176之間距P4之1/2之情形進行說明。 The shape, size (size), and arrangement (position) of each pocket 141 are set according to the shape, size (size) of the IC device 90 to be inspected, and the arrangement of the holding portion 161 of the inspection portion 16. In the present embodiment, a case where the distance P2 between the pockets 141 is set to be 1/2 of the distance P1 between the holding portion 161 of the inspection unit 16 and the distance P4 between the suction nozzles 176 of the hand unit 175 will be described.

另，間距P2(a)、間距P1、及間距P4(b)之大小關係雖係只要間距P1及間距P4大於間距P2則不特別限定，但P1/P2及P4(b)/P2(a)為2以上之整數較佳。 In addition, although the magnitude relationship between the pitch P2 (a), the pitch P1, and the pitch P4 (b) is not particularly limited as long as the pitch P1 and the pitch P4 are larger than the pitch P2, P1 / P2 and P4 (b) / P2 (a) It is preferably an integer of 2 or more.

另，於本實施形態中，自圖1中之Z方向觀看，凹穴141之外形呈對應於IC器件90之外形之形狀、即四角形。 In addition, in this embodiment, when viewed from the Z direction in FIG. 1, the outer shape of the cavity 141 is a shape corresponding to the outer shape of the IC device 90, that is, a quadrangle.

又，凹穴141之數量只要為複數個即不特別限定，於本實施形態中，作為1例而說明8個(4×2)之情形。且，將8個凹穴141按矩陣狀於X方向配置4個，於Y方向配置2個，故於圖5中，僅可看到X方向之排列為1行之4個凹穴141。另，於動作之說明中，代表性地針對可看到之4個凹穴141進行說明。 The number of the recesses 141 is not particularly limited as long as the number of the recesses 141 is plural. In this embodiment, a case of eight (4 × 2) will be described as an example. In addition, four recesses 141 are arranged in a matrix in the X direction and two in the Y direction. Therefore, in FIG. 5, only the four recesses 141 arranged in a row in the X direction can be seen. In the description of the operation, four recesses 141 that can be seen are representatively described.

檢查部16係檢查．試驗IC器件90之電性特徵之組件、即於檢查IC器件90時保持該IC器件90之構件。於檢查部16，設置有以保持IC器件90之狀態與該IC器件90之端子電性連接之複數個探針銷。然後，將IC器件90之端子與探針銷電性連接(接觸)，而經由探針銷進行IC器件90之檢查。IC器件90之檢查係根據連接於檢查部16之未圖示之測試器具備之檢查控制部之記憶部所記憶之程式而進行。另，於檢查部16中，可與溫度調整部12同樣，將複數個IC器件90加熱或冷卻，而調整為適於檢查該IC器件90之溫度。 Inspection Department 16 Department inspection. A component that tests the electrical characteristics of the IC device 90, that is, a component that holds the IC device 90 when the IC device 90 is inspected. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while maintaining the state of the IC device 90. Then, the terminals of the IC device 90 are electrically connected (contacted) with the probe pins, and the inspection of the IC device 90 is performed through the probe pins. The inspection of the IC device 90 is performed based on a program stored in a memory section of an inspection control section provided in a tester (not shown) connected to the inspection section 16. In addition, in the inspection section 16, similarly to the temperature adjustment section 12, the plurality of IC devices 90 may be heated or cooled to adjust the temperature suitable for inspecting the IC devices 90.

若對檢查部16更加詳細說明，則如圖3及圖4所示，於檢查部16之上表面，設置有作為收容(保持)IC器件90之複數個凹部之保持部(電子零件配置部)161。將各IC器件90收容入各保持部161，藉此，配置於檢查部16。 If the inspection section 16 is described in more detail, as shown in FIG. 3 and FIG. 4, on the upper surface of the inspection section 16, a holding section (electronic component placement section) is provided as a plurality of recesses for accommodating (holding) the IC device 90. 161. Each of the IC devices 90 is housed in each of the holding portions 161 and is thereby arranged in the inspection portion 16.

各保持部161之形狀、大小(尺寸)及配置(位置)係根據檢查之IC器件90之形狀、大小(尺寸)等而設定。於本實施形態中，將保持部161 之間距P1設定為與第2器件搬送頭17之手組件175之吸嘴176之間距P4相同。 The shape, size (size), and arrangement (position) of each holding portion 161 are set according to the shape, size (size), and the like of the IC device 90 to be inspected. In this embodiment, the holding portion 161 is The distance P1 is set to be the same as the distance P4 between the suction nozzles 176 of the hand unit 175 of the second device transfer head 17.

另，於本實施形態中，自圖1中之Z方向觀看(俯視下)，IC器件90之外形呈四角形，因此，保持部161之外形呈對應於IC器件90之外形之形狀、即四角形。 In addition, in this embodiment, the outer shape of the IC device 90 is a quadrangle when viewed from the Z direction in FIG. 1 (in a plan view). Therefore, the outer shape of the holding portion 161 has a shape corresponding to the outer shape of the IC device 90, that is, a quadrangle.

又，保持部161之數量只要為複數個即不特別限定，於本實施形態中，作為1例而說明8個之情形。且，將8個保持部161按矩陣狀於X方向配置4個，於Y方向配置2個。另，於動作之說明中，代表性地針對X方向之排列為1行之4個保持部161進行說明。 The number of the holding portions 161 is not particularly limited as long as it is plural. In the present embodiment, a case of eight will be described as an example. In addition, four holding portions 161 are arranged in a matrix form in the X direction and four in the Y direction. In addition, in the description of the operation, four holding portions 161 arranged in one line in the X direction will be representatively described.

第2器件搬送頭17係可於Y方向及Z方向移動地支持於檢查區域A3內。又，第2器件搬送頭17可將自供給區域A2搬入之器件供給部14上之IC器件90搬送至檢查部16上，並載置，又，可將檢查部16上之IC器件90搬送至器件回收部18上，並載置。又，於檢查IC器件90時，第2器件搬送頭17朝向檢查部16按壓IC器件90，藉此，使IC器件90抵接於檢查部16。藉此，如上述般，將IC器件90之端子與檢查部16之探針銷電性連接。 The second device transfer head 17 is supported in the inspection area A3 so as to be movable in the Y direction and the Z direction. In addition, the second device transfer head 17 can transfer and place the IC devices 90 on the device supply section 14 carried in from the supply area A2 to the inspection section 16 and can also transfer the IC devices 90 on the inspection section 16 to It is placed on the device recovery unit 18. When the IC device 90 is inspected, the second device transfer head 17 presses the IC device 90 toward the inspection section 16, and thereby the IC device 90 is brought into contact with the inspection section 16. Thereby, as described above, the terminals of the IC device 90 and the probe pins of the inspection section 16 are electrically connected.

如圖7所示，第2器件搬送頭17具有複數個手組件175，作為固持IC器件90之固持部。該等手組件175之數量只要為複數個即不特別限定，於本實施形態中，作為1例而說明8個之情形。且，將8個手組件175按矩陣狀於X方向配置4個，於Y方向配置2個，故於圖7中，僅可看到於X方向之排列為1行之4個手組件175。因各手組件175之構成相同，故於以下，代表性地針對1個手組件175進行說明。另，於動作之說明中，代表性地針對可看到之4個手組件175進行說明。手組件175具備吸嘴176，而藉由吸附固持IC器件90。即，手組件175以將IC器件90配置於吸嘴176之前端部之狀態，藉由驅動未圖示之泵吸引空氣(流體)，將吸嘴176之內腔設為負壓狀態，而以吸嘴176之前端部固持(吸 附固持)IC器件90。又，藉由驅動未圖示之其他泵供給空氣(流體)，解除吸嘴176之內腔之負壓狀態，而放開以吸嘴176固持之IC器件90。 As shown in FIG. 7, the second device transfer head 17 includes a plurality of hand assemblies 175 as holding portions for holding the IC device 90. The number of such hand assemblies 175 is not particularly limited as long as they are plural. In the present embodiment, the case of eight is described as an example. In addition, four hand assemblies 175 are arranged in a matrix in the X direction and two are arranged in the Y direction. Therefore, in FIG. 7, only the four hand assemblies 175 arranged in a row in the X direction can be seen. Since the configuration of each hand unit 175 is the same, one hand unit 175 will be representatively described below. In addition, in the description of the operation, four hand assemblies 175 that can be seen are representatively described. The hand unit 175 includes a suction nozzle 176 and holds the IC device 90 by suction. That is, the hand assembly 175 is in a state where the IC device 90 is arranged at the front end of the suction nozzle 176, and a pump (not shown) is driven to suck air (fluid), and the inner cavity of the suction nozzle 176 is set to a negative pressure state, and Hold the front end of the suction nozzle 176 (suction With holding) IC device 90. In addition, by driving other pumps (not shown) to supply air (fluid), the negative pressure state of the inner cavity of the suction nozzle 176 is released, and the IC device 90 held by the suction nozzle 176 is released.

又，將手組件175之間距(電子零件固持間距)P4與檢查部16之保持部161之間距P1設定為相同。 The distance P1 between the hand units 175 (electronic component holding distance) P4 and the holding portion 161 of the inspection unit 16 is set to be the same.

又，於各手組件175中，可與溫度調整部12同樣，將複數個IC器件90加熱或冷卻，而調整為適於檢查IC器件90之溫度。 In addition, in each of the hand assemblies 175, similarly to the temperature adjustment unit 12, the plurality of IC devices 90 can be heated or cooled to be adjusted to a temperature suitable for inspecting the IC devices 90.

器件回收部18具有：配置IC器件90之配置板，及可於X方向移動之器件回收部本體，且配置板係可裝卸地設置於器件回收部本體。該器件回收部18係將於檢查部16之檢查結束後之IC器件90搬送至回收區域A4之裝置，且沿X方向可移動地支持於檢查區域A3與回收區域A4之間。將檢查部16上之IC器件90藉由第2器件搬送頭17搬送至器件回收部18，並載置。 The device recovery section 18 includes a configuration board on which the IC device 90 is disposed, and a device recovery section body that can be moved in the X direction, and the configuration board is detachably provided on the device recovery section body. The device recovery section 18 is a device that transports the IC device 90 after the inspection by the inspection section 16 to the recovery area A4, and is movably supported between the inspection area A3 and the recovery area A4 in the X direction. The IC device 90 on the inspection section 16 is transferred to the device recovery section 18 by the second device transfer head 17 and placed.

若對器件回收部18更加詳細說明，則如圖6所示，於器件回收部18之上表面，設置有作為收容(配置)IC器件90之複數個凹部之凹穴(電子零件配置部)181。將各IC器件90收容入各凹穴181，藉此，配置於器件回收部18。 If the device recovery section 18 is described in more detail, as shown in FIG. 6, a recess (electronic component configuration section) 181 is provided on the upper surface of the device recovery section 18 as a plurality of recesses for accommodating (arranging) the IC device 90. . Each of the IC devices 90 is housed in each of the recesses 181, and is thereby placed in the device recovery unit 18.

各凹穴181之形狀、大小(尺寸)及配置(位置)係根據檢查之IC器件90之形狀、大小(尺寸)、及檢查部16之保持部161之配置等而設定。於本實施形態中，針對將凹穴181之間距(電子零件配置間距)P3設定為檢查部16之保持部161之間距P1及手組件175之吸嘴176之間距P4之1/2之情形進行說明。 The shape, size (size), and arrangement (position) of each recess 181 are set according to the shape, size (size) of the IC device 90 to be inspected, and the arrangement of the holding portion 161 of the inspection portion 16. In the present embodiment, the case where the distance between the pockets 181 (the disposition pitch of the electronic components) P3 is set to be 1/2 of the distance between the holding portion 161 of the inspection section 16 and the distance P1 between the suction nozzle 176 of the hand assembly 175 Instructions.

另，間距P3(a)、間距P1、及間距P4(b)之大小關係雖係只要間距P1及間距P4大於間距P3則不特別限定，但P1/P3及P4(b)/P3(a)為2以上之整數較佳。 In addition, although the magnitude relationship between the pitch P3 (a), the pitch P1, and the pitch P4 (b) is not particularly limited as long as the pitch P1 and the pitch P4 are larger than the pitch P3, P1 / P3 and P4 (b) / P3 (a) It is preferably an integer of 2 or more.

另，於本實施形態中，自圖1中之Z方向觀看，凹穴181之外形呈對應於IC器件90之外形之形狀、即四角形。 In addition, in this embodiment, when viewed from the Z direction in FIG. 1, the outer shape of the cavity 181 is a shape corresponding to the outer shape of the IC device 90, that is, a quadrangle.

又，凹穴181之數量只要為複數個即不特別限定，於本實施形態中，作為1例而說明8個(4×2)之情形。且，將8個凹穴181按矩陣狀於X方向配置4個，於Y方向配置2個，故於圖6中，僅可看到於X方向之排列為1行之4個凹穴181。另，於動作之說明中，代表性地針對可看到之4個凹穴181進行說明。 The number of the recesses 181 is not particularly limited as long as the number of the recesses 181 is plural. In this embodiment, a case of eight (4 × 2) will be described as an example. In addition, four recesses 181 are arranged in a matrix in the X direction and two in the Y direction. Therefore, in FIG. 6, only four recesses 181 arranged in a row in the X direction can be seen. In the description of the operation, four recesses 181 that can be seen are typically described.

回收區域A4係回收檢查結束後之IC器件90之區域。於該回收區域A4，設置有回收用托盤19、第3器件搬送頭(回收固持部)20、及第6托盤搬送機構21。又，於該回收區域A4，亦準備有空的托盤200。 The recovery area A4 is an area of the IC device 90 after the recovery inspection is completed. In this collection area A4, a collection tray 19, a third device transfer head (recovery holding portion) 20, and a sixth tray transfer mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

回收用托盤19固定於回收區域A4內，且於圖1所示之構成中，沿X方向配置有3個。又，空的托盤200亦沿X方向配置有3個。然後，將移動至回收區域A4之器件回收部18上之IC器件90搬送至該等回收用托盤19及空的托盤200中之任一者，並載置。藉此，將IC器件90針對檢查結果而回收、並分類。 The collection trays 19 are fixed in the collection area A4, and in the configuration shown in FIG. 1, three collection trays are arranged in the X direction. Three empty trays 200 are also arranged in the X direction. Then, the IC device 90 on the device recovery section 18 moved to the recovery area A4 is transported to one of these recovery trays 19 and the empty tray 200 and placed. Thereby, the IC device 90 is collected and classified based on the inspection result.

第3器件搬送頭20係可於X方向、Y方向、及Z方向移動地支持於回收區域A4內。藉此，第3器件搬送頭20可將IC器件90自器件回收部18搬送至回收用托盤19或空的托盤200。 The third device transfer head 20 is supported in the recovery area A4 so as to be movable in the X direction, the Y direction, and the Z direction. Thereby, the third device transfer head 20 can transfer the IC device 90 from the device collection unit 18 to the collection tray 19 or the empty tray 200.

如圖9所示，第3器件搬送頭20具有複數個手組件201，作為固持IC器件90之固持部。該等手組件201之數量只要為複數個即不特別限定，於本實施形態中，作為1例而說明8個之情形。且，將8個手組件201按矩陣狀於X方向配置4個，於Y方向配置2個，故於圖9中，僅可看到於X方向之排列為1行之4個手組件201。因各手組件201之構成相同，故於以下，代表性地針對1個手組件201進行說明。另，於動作之說明中，代表性地針對可看到之4個手組件201進行說明。手組件201具備吸嘴202，而藉由吸附固持IC器件90。即，手組件201以將IC器件90配置於吸嘴202之前端部之狀態，藉由驅動未圖示之泵吸引空氣(流體)，將吸嘴202之內腔設為負壓狀態，而以吸嘴202之前端部固持(吸 附固持)IC器件90。又，藉由驅動未圖示之其他泵供給空氣(流體)，解除吸嘴202之內腔之負壓狀態，而放開以吸嘴202固持之IC器件90。 As shown in FIG. 9, the third device transfer head 20 includes a plurality of hand assemblies 201 as holding parts for holding the IC device 90. The number of such hand assemblies 201 is not particularly limited as long as there are a plurality of them. In this embodiment, the case of eight will be described as an example. Furthermore, eight hand assemblies 201 are arranged in a matrix in four directions in the X direction and two are arranged in the Y direction. Therefore, in FIG. 9, only four hand assemblies 201 arranged in a row in the X direction can be seen. Since the configuration of each hand unit 201 is the same, one hand unit 201 will be representatively described below. In addition, in the description of the operation, four hand assemblies 201 that can be seen are representatively described. The hand unit 201 includes a suction nozzle 202, and the IC device 90 is held by suction. That is, the hand assembly 201 is in a state where the IC device 90 is arranged at the front end of the suction nozzle 202, and a pump (not shown) is driven to suck air (fluid), and the inner cavity of the suction nozzle 202 is set to a negative pressure state, and the Hold the front end of the nozzle 202 (suction With holding) IC device 90. In addition, the air (fluid) is supplied by driving another pump (not shown) to release the negative pressure state of the inner cavity of the suction nozzle 202, and the IC device 90 held by the suction nozzle 202 is released.

又，手組件201之間距(電子零件固持間距)P6係可調節，且已適當調整。於本實施形態中，針對於檢查部16及器件回收部18中，將手組件201之間距P6調節(設定)為檢查部16之保持部161之間距P1及第2器件搬送頭17之手組件175之吸嘴176之間距P4之1/2，且與器件回收部18之凹穴181之間距P3(a)相同之情形進行說明。 In addition, the distance between the hand assemblies 201 (holding distance of electronic parts) P6 is adjustable, and has been adjusted appropriately. In this embodiment, for the inspection unit 16 and the device recovery unit 18, the distance P6 between the hand units 201 is adjusted (set) to the distance P1 between the holding unit 161 of the inspection unit 16 and the hand unit of the second device transfer head 17. A description will be given of a case where the distance between the suction nozzles 176 of 175 is 1/2 of the distance P4 and the distance between the suction holes 176 of the device recovery portion 18 is the same as the distance P3 (a).

第6托盤搬送機構21係使自托盤去除區域A5搬入之空的托盤200於X方向搬送之機構。然後，於該搬送後，托盤200成為排列於回收IC器件90之位置，即可成為上述3個空的托盤200中之任一個。 The sixth tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the X direction. Then, after the conveyance, the tray 200 is arranged at the position where the IC devices 90 are collected, and may be any one of the three empty trays 200 described above.

托盤去除區域A5係將排列有檢查完成狀態之複數個IC器件90之托盤200回收並去除之區域。於托盤去除區域A5中，可重疊配置多數個托盤200。 The tray removal area A5 is an area where the trays 200 on which the plurality of IC devices 90 of the inspection completion state are arranged are recovered and removed. In the tray removal area A5, a plurality of trays 200 may be arranged to overlap.

又，以橫跨回收區域A4與托盤去除區域A5之方式，設置有逐枚搬送托盤200之第4托盤搬送機構22A、第5托盤搬送機構22B。第4托盤搬送機構22A係將載置有檢查完成之IC器件90之托盤200自回收區域A4搬送至托盤去除區域A5之機構。第5托盤搬送機構22B係將用以回收IC器件90之空的托盤200自托盤去除區域A5搬送至回收區域A4之機構。 Further, a fourth tray conveyance mechanism 22A and a fifth tray conveyance mechanism 22B that convey the tray 200 one by one are provided so as to span the recovery area A4 and the tray removal area A5. The fourth tray transfer mechanism 22A is a mechanism that transfers the tray 200 on which the IC devices 90 having been inspected are placed from the recovery area A4 to the tray removal area A5. The fifth tray transfer mechanism 22B is a mechanism that transfers the empty tray 200 for recycling the IC devices 90 from the tray removal area A5 to the collection area A4.

上述測試器之檢查控制部根據例如未圖示之記憶部所記憶之程式，而進行配置於檢查部16之IC器件90之電性特徵之檢查等。 The inspection control section of the tester performs, for example, inspection of the electrical characteristics of the IC device 90 arranged in the inspection section 16 based on a program stored in a memory section (not shown).

又，如圖2所示，檢查裝置1具有：控制部80，及與控制部80電性連接、且進行檢查裝置1之各操作之操作部6。控制部80控制例如、第1托盤搬送機構11A、第2托盤搬送機構11B、溫度調整部12、第1器件搬送頭13、器件供給部14、第3托盤搬送機構15、檢查部16、第2器件搬送頭17、器件回收部18、第3器件搬送頭20、第6托盤搬送機構 21、第4托盤搬送機構22A、第5托盤搬送機構22B、及顯示部62等各部之驅動。 As shown in FIG. 2, the inspection device 1 includes a control unit 80 and an operation unit 6 that is electrically connected to the control unit 80 and performs each operation of the inspection device 1. The control unit 80 controls, for example, the first tray transfer mechanism 11A, the second tray transfer mechanism 11B, the temperature adjustment unit 12, the first device transfer head 13, the device supply unit 14, the third tray transfer mechanism 15, the inspection unit 16, and the second Device transfer head 17, device recovery unit 18, third device transfer head 20, and sixth tray transfer mechanism 21. The driving of each unit such as the fourth tray conveyance mechanism 22A, the fifth tray conveyance mechanism 22B, and the display portion 62.

又，操作部6具有：進行各輸入之輸入部61、及顯示圖像之顯示部62。作為輸入部61，並未特別限定，可列舉例如、鍵盤、滑鼠等。又，作為顯示部62，並未特別限定，可列舉例如、液晶顯示面板、有機EL顯示面板等。作業者(操作者)之操作部6之操作係藉由例如、操作輸入部61使游標移動至顯示部62所顯示之各操作按鈕(圖標)之位置，並進行選擇(點擊)而進行。 The operation unit 6 includes an input unit 61 that performs each input, and a display unit 62 that displays an image. The input unit 61 is not particularly limited, and examples thereof include a keyboard and a mouse. The display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel and an organic EL display panel. The operation of the operation unit 6 of the operator (operator) is performed by, for example, operating the input unit 61 by moving the cursor to the position of each operation button (icon) displayed on the display unit 62 and selecting (clicking) it.

另，作為輸入部61，並非限定於上述構成者，可列舉例如、按壓按鈕等機械式之操作按鈕等。又，作為操作部6，並非限於上述之構成者，可列舉例如、觸控面板等可進行輸入及圖像之顯示之器件等。另，藉由上述操作部6之顯示部62，而構成報知部。 The input unit 61 is not limited to the one described above, and examples include a mechanical operation button such as a push button. In addition, the operation unit 6 is not limited to the one described above, and examples thereof include a device capable of inputting and displaying an image, such as a touch panel. The display unit 62 of the operation unit 6 constitutes a notification unit.

其次，對檢查裝置1之搬送IC器件90時之動作進行說明。 Next, the operation when the IC device 90 is transported by the inspection device 1 will be described.

又，為了便於理解，而同時亦對先前之檢查裝置之搬送IC器件90時之動作進行說明。 In order to facilitate understanding, the operation of the conventional inspection device when the IC device 90 is transported will be described.

前提在於構成為，檢查裝置1之檢查部16之保持部161之間距P1、與第2器件搬送頭17之手組件175之吸嘴176之間距P4超過第1器件搬送頭13之手組件131之吸嘴132之間距P5之最大間距、與第3器件搬送頭20之手組件201之吸嘴202之間距P6之最大間距，於該情形時，檢查裝置1可增加平均單位時間搬送之IC器件90之數量。 The premise is that the distance P1 between the holding portion 161 of the inspection portion 16 of the inspection device 1 and the suction nozzle 176 of the hand assembly 175 of the second device transfer head 17 is greater than the distance P4 of the hand assembly 131 of the first device transfer head 13. The maximum distance between the suction nozzle 132 and P5, and the maximum distance between the suction nozzle 202 and the nozzle 202 of the hand assembly 201 of the third device transport head 20. In this case, the inspection device 1 can increase the IC device 90 that is transported on average per unit time. Of quantity.

首先，本實施形態之檢查裝置1之各部之尺寸係如上述般，將檢查部16之保持部161之間距P1與第2器件搬送頭17之手組件175之吸嘴176之間距P4設定為相同。另，P1及P4設為例如60mm。 First, the dimensions of the various parts of the inspection device 1 of the present embodiment are as described above, and the distance P4 between the holding portion 161 of the inspection portion 16 and the suction nozzle 176 of the hand assembly 175 of the second device transfer head 17 is set to be the same. . In addition, P1 and P4 are set to 60 mm, for example.

又，器件供給部14之凹穴141之間距P2、器件回收部18之凹穴181之間距P3、第1器件搬送頭13之手組件131之吸嘴132之間距P5、及第3器件搬送頭20之手組件201之吸嘴202之間距P6相同，且該等間距 P2、P3、P5及P6為間距P1及P4之1/2。另，P2、P3、P5及P6設為例如30mm。 Further, the distance P3 between the recesses 141 of the device supply unit 14 and the distance P3 between the recesses 181 of the device recovery unit 18, the distance P5 between the suction nozzles 132 of the hand assembly 131 of the first device transfer head 13, and the third device transfer head. The distance between the nozzles 202 of the hand assembly 201 of 20 is the same as P6, and the intervals are P2, P3, P5 and P6 are 1/2 of the pitches P1 and P4. The P2, P3, P5, and P6 are set to, for example, 30 mm.

另一方面，先前之檢查裝置之各部之尺寸係如圖10(b)所示般，將器件供給部14之凹穴141之間距P12、檢查部16之保持部161之間距P11、器件回收部18之凹穴181之間距P13、及第2器件搬送頭17之手組件175之吸嘴176之間距P14設定為相同。另，P11、P12、P13及P14設為例如60mm。 On the other hand, as shown in FIG. 10 (b), the dimensions of each part of the previous inspection device are separated from the cavity 141 of the device supply unit 14 by P12, the distance of the holding portion 161 of the inspection unit 16 by P11, and the device recovery unit. The distance P13 between the recesses 181 of 18 and the distance P14 between the suction nozzles 176 of the hand assembly 175 of the second device transfer head 17 are set to be the same. The P11, P12, P13, and P14 are set to, for example, 60 mm.

又，第1器件搬送頭13之手組件131之吸嘴132之間距P15、及第3器件搬送頭20之手組件201之吸嘴202之間距P16相同，且該等間距P15及P16為間距P11、P12、P13及P14之1/2。另，P15及P16設為例如30mm。 In addition, the distance P15 between the suction nozzles 132 of the hand assembly 131 of the first device transfer head 13 and the nozzle P202 between the suction assembly 132 of the hand assembly 201 of the third device transfer head 20 is the same, and the distances P15 and P16 are the distance P11 , P12, P13 and 1/2 of P14. The P15 and P16 are set to, for example, 30 mm.

首先，對先前之檢查裝置之動作進行說明。 First, the operation of the conventional inspection device will be described.

[步驟2-1] [Step 2-1]

於先前之檢查裝置中，如圖10(b)所示，第1器件搬送頭13藉由各手組件131固持配置於溫度調整部12之IC器件90，並向Z方向正側移動，且於X方向與Y方向之至少1個方向移動、即移動至器件供給部14之上方，然後向Z方向負側移動，而將4個IC器件90中之2個IC器件90配置於器件供給部14之4個凹穴141中之2個凹穴141。將於該步驟2-1所需時間設為「1」。另，對上述所需時間，不標註「秒」等單位，而以相對值顯示，且並非嚴密之值，而係粗略之值。 In the previous inspection device, as shown in FIG. 10 (b), the first device transfer head 13 holds the IC device 90 disposed on the temperature adjustment section 12 by each hand assembly 131, and moves it toward the positive side in the Z direction. Move at least one of the X direction and the Y direction, that is, above the device supply section 14, and then move to the negative side of the Z direction, and arrange two IC devices 90 of the four IC devices 90 on the device supply section 14. Two of the four recesses 141. Set the time required for this step 2-1 to "1". In addition, the above-mentioned required time is not marked with units such as "second", but is displayed as a relative value, and is not a strict value, but a rough value.

[步驟2-2] [Step 2-2]

其次，如圖11(b)所示，第1器件搬送頭13向Z方向正側移動，且向X方向正側移動，然後向Z方向負側移動，而將其餘2個IC器件90配置於器件供給部14之其餘2個凹穴141。於該步驟2-2所需時間為「1」。如此，於先前之檢查裝置中，第1器件搬送頭13將固持之4個(複數個)IC器件90分為2次(複數次)配置於器件供給部14之各凹穴 141。 Next, as shown in FIG. 11 (b), the first device transfer head 13 moves toward the positive side in the Z direction, moves toward the positive side in the X direction, and then moves toward the negative side in the Z direction, and arranges the remaining two IC devices 90 on the The remaining two recesses 141 of the device supply section 14. The time required for this step 2-2 is "1". In this way, in the previous inspection device, the first device transfer head 13 divided the four (plural) IC devices 90 held therein into two (plural) positions and placed them in the pockets of the device supply unit 14. 141.

[步驟2-3] [Step 2-3]

其次，如圖12(b)所示，器件供給部14向X方向正側移動，即、移動至第2器件搬送頭17之下方。於該步驟2-3所需時間為「0.5」。 Next, as shown in FIG. 12 (b), the device supply unit 14 moves to the positive side in the X direction, that is, below the second device transfer head 17. The time required in this step 2-3 is "0.5".

[步驟2-4] [Step 2-4]

其次，如圖13(b)所示，第2器件搬送頭17向Z方向負側移動，而藉由各手組件175固持(取出)配置於器件供給部14之各IC器件90，並向Z方向正側移動，且向Y方向負側移動、即移動至各IC器件90位於檢查部16之各保持部161之上方，然後向Z方向負側移動，而將各IC器件90配置於檢查部16之各保持部161。於該步驟2-4所需時間為「0.5」。如此，於先前之檢查裝置中，第2器件搬送頭17將4個IC器件90總括地自器件供給部14之各凹穴141取出，並總括地配置於檢查部16之各保持部161。 Next, as shown in FIG. 13 (b), the second device transfer head 17 moves to the negative side in the Z direction, and holds (removes) each IC device 90 disposed in the device supply section 14 with each hand assembly 175, and moves it toward Z Move in the positive direction and move in the negative direction in the Y direction, that is, move each IC device 90 above the holding portions 161 of the inspection section 16 and then move it in the negative direction of the Z direction to arrange each IC device 90 in the inspection section. 16 的 each holding portion 161. The time required in this step 2-4 is "0.5". As described above, in the conventional inspection device, the second device transfer head 17 collectively takes out the four IC devices 90 from the recesses 141 of the device supply section 14 and collectively arranges them in the holding sections 161 of the inspection section 16.

再者，其次，一邊藉由第2器件搬送頭17朝向各保持部161按壓各IC器件90，一邊藉由檢查部16進行各IC器件90之檢查。 Furthermore, the inspection of each IC device 90 is performed by the inspection unit 16 while pressing each IC device 90 toward each holding portion 161 by the second device transfer head 17.

[步驟2-5] [Step 2-5]

其次，如圖14(b)所示，第2器件搬送頭17藉由各手組件175固持配置於檢查部16之各保持部161之IC器件90，並向Z方向正側移動，且向Y方向正側移動、即移動至器件回收部18之上方，然後向Z方向負側移動，而將各IC器件90配置於器件回收部18之各凹穴181。於該步驟2-5所需時間為「0.5」。如此，於先前之檢查裝置中，第2器件搬送頭17將4個IC器件90總括地自器件檢查部16之各保持部161取出，並總括地配置於器件回收部18之各凹穴181。 Next, as shown in FIG. 14 (b), the second device transfer head 17 holds the IC device 90 disposed in each holding portion 161 of the inspection portion 16 by each hand assembly 175, and moves toward the positive side in the Z direction and toward Y Moving in the positive direction, that is, above the device recovery unit 18 and then moving in the negative direction of the Z direction, each IC device 90 is disposed in each of the recesses 181 of the device recovery unit 18. The time required for this step 2-5 is "0.5". As described above, in the previous inspection device, the second device transfer head 17 took out the four IC devices 90 collectively from the holding portions 161 of the device inspection portion 16 and placed them collectively in the recesses 181 of the device recovery portion 18.

[步驟2-6] [Step 2-6]

其次，如圖15(b)所示，器件回收部18向X方向正側移動。 Next, as shown in FIG. 15 (b), the device recovery unit 18 moves to the positive side in the X direction.

然後，第3器件搬送頭20於X方向與Y方向之至少1個方向移動、 即移動至器件回收部18之上方，然後向Z方向負側移動，而藉由4個手組件201中之4個手組件201，固持配置於器件回收部18之4個IC器件90中之2個IC器件90。於該步驟2-6所需時間為「1」。 Then, the third device transfer head 20 moves in at least one of the X direction and the Y direction, That is, it moves above the device recycling section 18, and then moves to the negative side in the Z direction. With 4 of the 4 hand modules 201, 2 of the 4 IC devices 90 held in the device recycling section 18 are held. IC device 90. The time required for this step 2-6 is "1".

[步驟2-7] [Step 2-7]

其次，如圖16(b)所示，第3器件搬送頭20向Z方向正側移動，且向X方向正側移動，然後向Z方向負側移動，而固持器件回收部18之其餘2個IC器件90。於該步驟2-7所需時間為「1」。如此，於先前之檢查裝置中，第3器件搬送頭20將配置於器件回收部18之4個IC器件90分為2次取出。 Next, as shown in FIG. 16 (b), the third device transfer head 20 moves to the positive side of the Z direction, moves to the positive side of the X direction, and then moves to the negative side of the Z direction, and holds the other two of the device recovery unit 18. IC 装置 90. The time required for this step 2-7 is "1". As described above, in the conventional inspection device, the third device transfer head 20 separates the four IC devices 90 arranged in the device recovery section 18 into two times.

再者，其次，第3器件搬送頭20根據檢測結果，將各IC器件90搬送至回收用托盤19及空的托盤200中之任一者。 Further, the third device transfer head 20 transfers each IC device 90 to one of the collection tray 19 and the empty tray 200 based on the detection result.

此處，第2器件搬送頭17自固持至配置IC器件90之時間短於第1器件搬送頭13自固持至配置IC器件90之時間。其原因之一在於，相對於在第1器件搬送頭13將IC器件90配置於器件供給部14時，第1器件搬送頭13不僅於Z方向，亦於X方向移動，而於第2器件搬送頭17將IC器件90自器件供給部14取出時及將IC器件90配置於器件回收部18時，第2器件搬送頭17於Z方向移動，但於X方向，係器件供給部14及器件回收部18移動。 Here, the time for the second device transfer head 17 to hold the IC device 90 is shorter than the time for the first device transfer head 13 to hold the IC device 90. One of the reasons is that the first device transfer head 13 moves not only in the Z direction but also in the X direction when the IC device 90 is disposed in the device supply unit 14 in the first device transfer head 13 and is transferred in the second device. When the head 17 removes the IC device 90 from the device supply section 14 and when the IC device 90 is disposed in the device recovery section 18, the second device transfer head 17 moves in the Z direction, but in the X direction, the device supply section 14 and the device recovery The section 18 moves.

同樣，第2器件搬送頭17自固持至配置IC器件90之時間短於第3器件搬送頭20自固持至配置IC器件90之時間。其原因之一同樣在於，相對於在第3器件搬送頭20將IC器件90配置於器件回收部18時，第3器件搬送部20不僅於Z方向，亦於X方向移動，而於第2器件搬送頭17將IC器件90自器件供給部14取出時及將IC器件90配置於器件回收部18時，第2器件搬送頭17於Z方向移動，但於X方向，係器件供給部14及器件回收部18移動。 Similarly, the time for the second device transfer head 17 to hold the IC device 90 is shorter than the time for the third device transfer head 20 to hold the IC device 90. One of the reasons is that the third device transfer unit 20 moves not only in the Z direction but also in the X direction when the IC device 90 is disposed in the device recovery unit 18 in the third device transfer head 20, and is in the second device. When the transfer head 17 removes the IC device 90 from the device supply section 14 and when the IC device 90 is placed in the device recovery section 18, the second device transfer head 17 moves in the Z direction, but in the X direction, the device supply section 14 and the device The collection unit 18 moves.

然而，於先前之檢查裝置中，相對於第2器件搬送頭17將4個IC 器件90總括地自檢查部16之各保持部161取出，並總括地配置於器件回收部18之各凹穴181，而第1器件搬送頭13將固持之4個IC器件90分為2次配置於器件供給部14之各凹穴141，且，第3器件搬送頭20將配置於器件回收部18之4個IC器件90分為2次取出。即，所需時間較短之第2器件搬送頭17之動作之次數為於IC器件90之供給時1次，於IC器件90之回收時1次，即共計2次(步驟2-4、步驟2-5)，但所需時間較長之第1器件搬送頭13及第3器件搬送頭20之動作之次數分別為2次，即共計4次(步驟2-1、步驟2-2、步驟2-6、步驟2-7)。因此，於先前之檢查裝置中，IC器件90之搬送所需之時變長，而平均單位時間搬送之IC器件90之數量較少。 However, in the previous inspection apparatus, four ICs were transferred to the second device transfer head 17. The device 90 is taken out from each holding section 161 of the inspection section 16 in an integrated manner, and is arranged in the recesses 181 of the device recovery section 18 in an integrated manner. The first device transfer head 13 divides the four IC devices 90 that are held into two positions. In each of the pockets 141 in the device supply section 14, the third device transfer head 20 separates the four IC devices 90 arranged in the device recovery section 18 into two times. That is, the number of operations of the second device transfer head 17 that requires a short time is once when the IC device 90 is supplied, and once when the IC device 90 is recovered, that is, two times in total (steps 2-4, steps 2-5), but the time required for the first device transfer head 13 and the third device transfer head 20 to take a long time is 2 respectively, that is, a total of 4 times (step 2-1, step 2-2, step 2-6, steps 2-7). Therefore, in the conventional inspection apparatus, the time required for the transportation of the IC device 90 becomes longer, and the number of the IC devices 90 transported per unit time is smaller.

其次，對本實施形態之檢查裝置1之動作進行說明。 Next, the operation of the inspection device 1 according to this embodiment will be described.

[步驟1-1] [Step 1-1]

於本實施形態之檢查裝置中，如圖10(a)所示，第1器件搬送頭13藉由各手組件131固持配置於溫度調整部12之IC器件90，並向Z方向正側移動，且於X方向與Y方向之至少1個方向移動、即移動至器件供給部14之上方，然後向Z方向負側移動，而將各IC器件90配置於器件供給部14之各凹穴141。於該步驟1-1所需時間為「1」。如此，於檢查裝置1中，第1器件搬送頭13將固持之4個(複數個)IC器件90總括地配置於器件供給部14之各凹穴141。 In the inspection device of this embodiment, as shown in FIG. 10 (a), the first device transfer head 13 holds the IC device 90 disposed on the temperature adjustment unit 12 by each hand assembly 131 and moves it toward the positive side in the Z direction. Further, each IC device 90 is disposed in each of the pockets 141 of the device supply section 14 by moving in at least one of the X direction and the Y direction, that is, above the device supply section 14 and then toward the negative direction of the Z direction. The time required in this step 1-1 is "1". As described above, in the inspection device 1, the first device transfer head 13 collectively arranges the four (plural) IC devices 90 held in the recesses 141 of the device supply unit 14.

[步驟1-2] [Step 1-2]

其次，如圖11(a)所示，器件供給部14向X方向正側移動，即、移動至第2器件搬送頭17之下方。 Next, as shown in FIG. 11 (a), the device supply unit 14 moves to the positive side in the X direction, that is, below the second device transfer head 17.

然後，第2器件搬送頭17向Z方向負側移動，而藉由4個手組件175中之2個手組件175，固持(取出)配置於器件供給部14之4個IC器件90中之2個IC器件90。於該步驟1-2所需時間為「0.5」。 Then, the second device transfer head 17 moves to the negative side in the Z direction, and two of the four hand modules 175 hold (remove) two of the four IC devices 90 arranged in the device supply section 14. IC device 90. The time required for this step 1-2 is "0.5".

[步驟1-3] [Steps 1-3]

其次，如圖12(a)所示，第2器件搬送頭17向Z方向正側移動，且器件供給部14向X方向正側移動，然後第2器件搬送頭17向Z方向負側移動，而藉由其餘2個手組件175固持配置於器件供給部14之其餘2個IC器件90。於該步驟1-3所需時間為「0.5」。如此，於檢查裝置1中，第2器件搬送頭17將4個(複數個)IC器件90分為2次(複數次)自器件供給部14之各凹穴141取出。 Next, as shown in FIG. 12 (a), the second device transfer head 17 moves to the positive side in the Z direction, and the device supply unit 14 moves to the positive side in the X direction, and then the second device transfer head 17 moves to the negative side in the Z direction. The other two IC components 90 disposed on the device supply unit 14 are held by the remaining two hand components 175. The time required in this step 1-3 is "0.5". As described above, in the inspection device 1, the second device transfer head 17 separates four (plural) IC devices 90 into two (plural) times and takes them out of the recesses 141 of the device supply unit 14.

[步驟1-4] [Steps 1-4]

其次，如圖13(a)所示，第2器件搬送頭17向Z方向正側移動，且向Y方向負側移動、即移動至各IC器件90位於檢查部16之各保持部161之上方，然後向Z方向負側移動，而將各IC器件90配置於檢查部16之各保持部161。於該步驟1-4所需時間為「0.5」。如此，於檢查裝置1中，第2器件搬送頭17將4個IC器件90總括地配置於檢查部16之各保持部161。 Next, as shown in FIG. 13 (a), the second device transfer head 17 moves to the positive side in the Z direction and moves to the negative side in the Y direction, that is, each IC device 90 is positioned above each holding portion 161 of the inspection portion 16. Then, the IC devices 90 are moved to the negative side in the Z direction, and the IC devices 90 are arranged on the holding portions 161 of the inspection portion 16. The time required in this step 1-4 is "0.5". As described above, in the inspection device 1, the second device transfer head 17 collectively arranges the four IC devices 90 on each of the holding portions 161 of the inspection portion 16.

再者，其次，一邊藉由第2器件搬送頭17朝向各保持部161按壓各IC器件90，一邊藉由檢查部16進行各IC器件90之檢查。 Furthermore, the inspection of each IC device 90 is performed by the inspection unit 16 while pressing each IC device 90 toward each holding portion 161 by the second device transfer head 17.

[步驟1-5] [Steps 1-5]

其次，如圖14(a)所示，第2器件搬送頭17藉由各手組件175固持配置於檢查部16之各保持部161之IC器件90，並向Z方向正側移動，且向Y方向正側移動、即移動至器件回收部18之上方，然後向Z方向負側移動，而將4個IC器件90中之2個IC器件90配置於器件回收部18之4個凹穴181中之2個凹穴181。於該步驟1-5所需時間為「0.5」。 Next, as shown in FIG. 14 (a), the second device transfer head 17 holds the IC device 90 disposed in each holding portion 161 of the inspection portion 16 by each hand assembly 175, and moves toward the positive side in the Z direction and toward Y Move in the positive direction, that is, above the device recovery section 18, and then move to the negative direction in the Z direction. Two of the four IC devices 90 are arranged in the four recesses 181 of the device recovery section 18. Of the two recesses 181. The time required for this step 1-5 is "0.5".

[步驟1-6] [Steps 1-6]

其次，如圖15(a)所示，第2器件搬送頭17向Z方向正側移動，且器件回收部18向X方向正側移動，然後第2器件搬送頭17向Z方向負側移動，而將其餘2個IC器件90配置於器件回收部18之其餘2個凹穴181。於該步驟1-6所需時間為「0.5」。如此，於檢查裝置1中，第2器 件搬送頭17將4個IC器件90分為2次配置於器件回收部18之各凹穴181。 Next, as shown in FIG. 15 (a), the second device transfer head 17 moves to the positive side of the Z direction, and the device recovery unit 18 moves to the positive side of the X direction, and then the second device transfer head 17 moves to the negative side of the Z direction. The remaining two IC devices 90 are disposed in the remaining two recesses 181 of the device recovery unit 18. The time required in this step 1-6 is "0.5". In this way, in the inspection device 1, the second device The component transfer head 17 divides the four IC devices 90 into the recesses 181 of the component recovery unit 18 in two stages.

[步驟1-7] [Steps 1-7]

其次，如圖16(a)所示，器件回收部18向X方向正側移動。 Next, as shown in FIG. 16 (a), the device recovery unit 18 moves to the positive side in the X direction.

然後，第3器件搬送頭20於X方向與Y方向之至少1個方向移動、即移動至器件回收部18之上方，然後向Z方向負側移動，而藉由各手組件201固持配置於器件回收部18之各IC器件90。於該步驟1-6所需時間為「1」。如此，於檢查裝置1中，第3器件搬送頭20將配置於器件回收部18之4個IC器件90總括地取出。 Then, the third device transfer head 20 moves in at least one of the X direction and the Y direction, that is, above the device recovery unit 18, and then moves to the negative side of the Z direction, and is held and arranged on the device by each hand assembly 201 Each IC device 90 in the collection unit 18. The time required for this step 1-6 is "1". As described above, in the inspection device 1, the third device transfer head 20 takes out the four IC devices 90 arranged in the device recovery unit 18 collectively.

再者，其次，第3器件搬送頭20根據檢測結果，將各IC器件90搬送至回收用托盤19及空的托盤200中之任一者。 Further, the third device transfer head 20 transfers each IC device 90 to one of the collection tray 19 and the empty tray 200 based on the detection result.

於檢查裝置1中，第2器件搬送頭17係將4個IC器件90分為2次自器件供給部14之各凹穴141取出，且將4個IC器件90分為2次配置於器件回收部18之各凹穴181，但第1器件搬送頭13係將固持之4個IC器件90總括地配置於器件供給部14之各凹穴141，且，第3器件搬送頭20將配置於器件回收部18之4個IC器件90總括地固持。即，所需時間較短之第2器件搬送頭17之動作之次數為於IC器件90之供給時2次，於IC器件90之回收時2次，即共計4次(步驟1-2、步驟1-3、步驟1-5、步驟1-6)，但所需時間較長之第1器件搬送頭13及第3器件搬送頭20之動作之次數分別為1次，即共計2次(步驟1-1、步驟1-7)。因此，於檢查裝置1中，IC器件90之搬送所需之時間變短，而可增加平均單位時間搬送之IC器件90之數量。 In the inspection device 1, the second device transfer head 17 separates the four IC devices 90 from the recesses 141 of the device supply unit 14 twice, and arranges the four IC devices 90 into the device recovery twice. Each of the pockets 181 of the part 18, but the first device transfer head 13 is a collective arrangement of the four IC devices 90 held in each of the pockets 141 of the device supply part 14, and the third device transfer head 20 is arranged on the device The four IC devices 90 of the collection unit 18 are held collectively. That is, the number of operations of the second device transfer head 17 that requires a short time is two times when the IC device 90 is supplied, and two times when the IC device 90 is recovered, that is, a total of four times (steps 1-2, step 1-3, steps 1-5, steps 1-6), but the time required for the first device transfer head 13 and the third device transfer head 20 to take a long time is 1 each, that is, 2 times in total (step 1-1, steps 1-7). Therefore, in the inspection device 1, the time required to transport the IC device 90 becomes shorter, and the number of IC devices 90 to be transported per unit time can be increased.

以上之結果顯示於圖17之曲線圖。圖17之橫軸係本實施形態之檢查裝置1之各步驟1-1~1-7、及先前之檢查裝置之動作之各步驟2-1~2-7，縱軸係於本實施形態之檢查裝置1之各步驟1-1~1-7所需之時間(所需時間)、及於先前之檢查裝置之動作之各步驟2-1~2-7所需之 時間。 The above results are shown in the graph of FIG. 17. The horizontal axis in FIG. 17 is each step 1-1 to 1-7 of the inspection device 1 of this embodiment, and each step 2-1 to 2-7 of the operation of the previous inspection device, and the vertical axis is in this embodiment. The time (required time) required for each step 1-1 to 1-7 of the inspection device 1, and the time required for each step 2-1 to 2-7 of the operation of the previous inspection device time.

如圖17所示，本實施形態之檢查裝置1中，步驟1-2及步驟1-6之所需時間分別縮短至先前之檢查裝置之步驟2-2及步驟2-6之所需時間之一半，據此可知，於檢查裝置1中，與先前之檢查裝置相比，IC器件90之搬送所需之時間縮短。 As shown in FIG. 17, in the inspection device 1 of this embodiment, the time required for steps 1-2 and 1-6 is shortened to the time required for steps 2-2 and 2-6 of the previous inspection device, respectively. According to this, it can be seen that, in the inspection device 1, compared with the previous inspection device, the time required to transport the IC device 90 is shortened.

如以上說明般，根據該檢查裝置1，可增加平均單位時間搬送之IC器件90之數量。 As described above, according to the inspection device 1, the number of IC devices 90 that can be transported per unit time can be increased.

藉此，可使檢查部16不運轉之時間減少，而可使平均單位時間之IC器件90之檢查數增加。 Accordingly, the time during which the inspection unit 16 is not in operation can be reduced, and the number of inspections of the IC device 90 per unit time can be increased.

<第2實施形態> <Second Embodiment>

圖18係顯示本發明之電子零件檢查裝置之第2實施形態之概略俯視圖。 Fig. 18 is a schematic plan view showing a second embodiment of the electronic component inspection device of the present invention.

以下，雖對第2實施形態進行說明，但以與上述之第1實施形態之不同點為中心進行說明，且對相同之事項省略其說明。 Hereinafter, although the second embodiment is described, the differences from the first embodiment described above will be mainly described, and the description of the same matters will be omitted.

如圖18所示，於第2實施形態之檢查裝置1中，將器件供給部14、器件回收部18、及第2器件搬送頭17分別於Y方向配置2個。藉此，可增加平均單位時間搬送之IC器件90之數量，從而可增加平均單位時間之IC器件90之檢查數。 As shown in FIG. 18, in the inspection apparatus 1 of the second embodiment, two device supply sections 14, a device recovery section 18, and a second device transfer head 17 are arranged in the Y direction, respectively. Thereby, the number of IC devices 90 that are transported per unit time can be increased, so that the number of inspections of the IC devices 90 per unit time can be increased.

又，器件供給部14因有2個，故可彼此時間性補充，同樣，器件回收部18因有2個，故可彼此時間性補充，同樣，第2器件搬送頭17因有2個，故可彼此時間性補充。藉此，可進一步增加平均單位時間搬送之IC器件90之數量，從而可進一步增加平均單位時間之IC器件90之檢查數。 In addition, since there are two device supply units 14, they can be supplemented with each other in time. Similarly, since there are two device recovery units 18, they can be supplemented in time with each other. Similarly, since there are two second device transfer heads 17, Can complement each other in time. Thereby, the number of IC devices 90 transported per unit time can be further increased, and the number of inspections of the IC devices 90 per unit time can be further increased.

根據如以上之第2實施形態，亦可發揮與上述之第1實施形態相同之效果。 According to the second embodiment as described above, the same effects as those of the first embodiment described above can be exhibited.

以上，雖對本發明之電子零件搬送裝置及電子零件檢查裝置， 根據圖示之實施形態加以說明，但本發明並非限定於此，亦可將各部之構成置換為具有相同功能之任意之構成者。又，亦可附加其他任意之構成物。 As mentioned above, although the electronic component transfer device and the electronic component inspection device of the present invention are described, The description is based on the illustrated embodiment, but the present invention is not limited to this, and the configuration of each part may be replaced with an arbitrary configuration having the same function. Moreover, you may add another arbitrary structure.

又，本發明亦可為組合上述各實施形態中之、任意2種以上之構成(特徵)者。 In addition, the present invention may be a combination of any two or more configurations (features) in each of the embodiments described above.

Claims (16)

一種電子零件搬送裝置，其特徵在於包含：搬送部，其可配置並搬送複數個電子零件；供給固持部，其可將複數個上述電子零件固持，而配置於上述搬送部；及供給回收固持部，其可將複數個上述電子零件固持，而予以供給及回收；且上述供給固持部之電子零件固持間距可調節為與上述搬送部之電子零件配置間距相同；上述供給回收固持部之電子零件固持間距大於上述搬送部之電子零件配置間距；上述供給固持部將複數個上述電子零件配置於上述搬送部；上述供給回收固持部將複數個上述電子零件分為複數次自上述搬送部取出。 An electronic parts conveying device, comprising: a conveying part that can arrange and convey a plurality of electronic parts; a supply and holding part that can hold a plurality of the electronic parts and is arranged in the conveying part; and a supply and recovery holding part It can hold a plurality of the above-mentioned electronic parts and supply and recycle them; and the holding pitch of the electronic parts of the above-mentioned supply holding part can be adjusted to be the same as the placement pitch of the electronic parts of the above-mentioned conveying part; The spacing is greater than the placement distance of the electronic parts of the conveying section; the supply and holding section arranges a plurality of the electronic components in the conveying section; the supply and recovery holding section divides the plurality of electronic components into the conveying section and separates them from the conveying section. 如請求項1之電子零件搬送裝置，其中：上述供給固持部將複數個上述電子零件總括地配置於上述搬送部。 For example, the electronic component transfer device according to claim 1, wherein the supply and holding unit collectively arranges the plurality of electronic components in the transfer unit. 如請求項1或2之電子零件搬送裝置，其中：上述供給回收固持部自固持至配置上述電子零件之時間短於上述供給固持部自固持至配置上述電子零件之時間。 For example, the electronic component transfer device of claim 1 or 2, wherein the time from the supply recovery holding portion to holding the electronic component is shorter than the time from the supply holding portion to holding the electronic component. 如請求項1或2之電子零件搬送裝置，其中：上述供給固持部可於配置複數個上述電子零件之方向、及與配置複數個上述電子零件之方向正交之方向移動。 For example, the electronic component transfer device according to claim 1 or 2, wherein the supply holding part can move in a direction in which the plurality of electronic components are arranged and a direction orthogonal to the direction in which the plurality of electronic components are arranged. 一種電子零件搬送裝置，其特徵在於包含：搬送部，其可配置並搬送複數個電子零件； 回收固持部，其可將配置於上述搬送部之複數個上述電子零件固持，而自上述搬送部取出；及供給回收固持部，其可將複數個上述電子零件固持，而予以供給及回收；且上述回收固持部之電子零件固持間距可調節為與上述搬送部之電子零件配置間距相同；上述供給回收固持部之電子零件固持間距大於上述搬送部之電子零件配置間距；上述供給回收固持部將複數個上述電子零件分為複數次配置於上述搬送部；上述回收固持部將複數個上述電子零件自上述搬送部取出。 An electronic parts conveying device, comprising: a conveying section, which can be configured to convey a plurality of electronic parts; A recovery and holding unit that can hold and remove a plurality of the electronic components arranged in the transporting unit from the transporting unit; and a supply and recovery holding unit that can hold and supply and recover the plurality of electronic parts; and The electronic component holding pitch of the recycling holding part can be adjusted to be the same as the electronic part configuration spacing of the carrying part; the electronic component holding pitch of the supply recycling holding part is larger than the electronic part configuration pitch of the carrying part; the supply recycling holding part will have a plurality of Each of the electronic components is divided into a plurality of times and is arranged in the conveying section; and the recovery and holding section takes out the plurality of electronic components from the conveying section. 如請求項5之電子零件搬送裝置，其中：上述回收固持部將複數個上述電子零件總括地自上述搬送部取出。 For example, the electronic component transfer device of claim 5, wherein the recovery and holding unit takes out a plurality of the electronic components from the transfer unit collectively. 如請求項5或6之電子零件搬送裝置，其中：上述供給回收固持部自固持至配置上述電子零件之時間短於上述回收固持部自固持至配置上述電子零件之時間。 For example, the electronic component transfer device of claim 5 or 6, wherein the time from the supply and recovery holding section to holding the electronic parts is shorter than the time from the recovery holding section to holding the electronic parts. 如請求項1、2、5、6中任一項之電子零件搬送裝置，其中：上述回收固持部可於配置複數個上述電子零件之方向、及與配置複數個上述電子零件之方向正交之方向移動。 For example, the electronic component transfer device according to any one of claims 1, 2, 5, and 6, wherein the recovery holding portion may be arranged in a direction in which a plurality of the electronic components are arranged and orthogonal to a direction in which the plurality of the electronic components are arranged. Move in the direction. 如請求項1、2、5、6中任一項之電子零件搬送裝置，其中：於上述搬送部中配置複數個上述電子零件之方向與上述搬送部之搬送方向相同。 For example, the electronic component transfer device according to any one of claims 1, 2, 5, and 6, wherein the direction in which the plurality of electronic components are arranged in the transfer portion is the same as the transfer direction of the transfer portion. 如請求項1、2、5、6中任一項之電子零件搬送裝置，其中：於上述供給回收固持部配置或取出上述電子零件之情形時，上述供給回收固持部可於與配置複數個上述電子零件之方向正 交之方向移動，上述搬送部可於配置複數個上述電子零件之方向移動。 For example, if the electronic component transfer device according to any one of items 1, 2, 5, and 6 is configured or taken out of the supply recovery holding portion, the supply recovery holding portion may be configured with a plurality of the above. Orientation of electronic parts When the cross direction moves, the conveying section can move in a direction where a plurality of the electronic components are arranged. 如請求項1、2、5、6中任一項之電子零件搬送裝置，其中：於將配置於上述搬送部之複數個上述電子零件之間距設為a，將上述供給回收固持部固持之複數個上述電子零件之間距設為b時，b/a為2以上之整數。 For example, the electronic component transfer device according to any one of claims 1, 2, 5, and 6, wherein a distance between a plurality of the electronic components arranged in the transfer unit is set to a, and the plurality of the supply recovery holding units are held by the plurality. When the distance between the aforementioned electronic components is set to b, b / a is an integer of 2 or more. 如請求項1、2、5、6中任一項之電子零件搬送裝置，其具有可保持上述電子零件之保持部；且上述供給回收固持部可向上述保持部按壓上述電子零件。 For example, the electronic component transfer device according to any one of claims 1, 2, 5, and 6 has a holding portion capable of holding the electronic component; and the supply recovery holding portion may press the electronic component against the holding portion. 如請求項1、2、5、6中任一項之電子零件搬送裝置，其中：上述供給回收固持部與上述搬送部分別設置有2個。 According to the electronic component transfer device of any one of claims 1, 2, 5, and 6, the supply recovery holding portion and the transfer portion are respectively provided with two. 一種電子零件檢查裝置，其特徵在於包含：搬送部，其可配置並搬送複數個電子零件；供給固持部，其可將複數個上述電子零件固持，而配置於上述搬送部；供給回收固持部，其可將複數個上述電子零件固持，而予以供給及回收；及檢查部，其檢查上述電子零件；且上述供給固持部之電子零件固持間距可調節為與上述搬送部之電子零件配置間距相同；上述供給回收固持部之電子零件固持間距大於上述搬送部之電子零件配置間距；上述供給固持部將複數個上述電子零件配置於上述搬送部；上述供給回收固持部將複數個上述電子零件分為複數次自上述搬送部取出。 An electronic component inspection device, comprising: a conveying section that can arrange and convey a plurality of electronic components; a supply and holding section that can hold and hold a plurality of the electronic components and are arranged in the conveying section; and a supply and recovery holding section, It can hold and supply a plurality of the above-mentioned electronic parts, and supply and recycle them; and an inspection section that checks the above-mentioned electronic parts; and the holding pitch of the electronic parts of the above-mentioned holding parts can be adjusted to be the same as the placement pitch of the electronic parts of the above-mentioned conveying parts; The electronic component holding pitch of the supply recovery holding part is greater than the electronic part arrangement pitch of the conveying part; the supply holding part arranges a plurality of the electronic parts in the conveying part; the supply recovery holding part divides the plurality of electronic parts into a plurality of Take out from the above-mentioned conveying section. 一種電子零件檢查裝置，其特徵在於包含： 搬送部，其可配置並搬送複數個電子零件；回收固持部，其可將配置於上述搬送部之複數個上述電子零件固持，而自上述搬送部取出；供給回收固持部，其可將複數個上述電子零件固持，而予以供給及回收；及檢查部，其檢查上述電子零件；且上述回收固持部之電子零件固持間距可調節為與上述搬送部之電子零件配置間距相同；上述供給回收固持部之電子零件固持間距大於上述搬送部之電子零件配置間距；上述供給回收固持部將複數個上述電子零件分為複數次配置於上述搬送部；上述回收固持部將複數個上述電子零件自上述搬送部取出。 An electronic parts inspection device, comprising: The transfer unit can be configured to transfer a plurality of electronic parts; the recycling and holding unit can hold and remove the plurality of electronic parts arranged in the transferring unit from the above-mentioned transferring unit; and the recycling and holding unit can transfer the plurality of electronic parts The above-mentioned electronic parts are held and supplied and recycled; and an inspection section that inspects the above-mentioned electronic parts; and the electronic parts holding pitch of the above-mentioned recycling holding parts can be adjusted to be the same as the arrangement pitch of the electronic parts of the above-mentioned conveying parts; the above-mentioned supply and recycling holding parts The electronic component holding pitch is greater than the electronic component disposition pitch of the conveying section; the supply recovery holding section divides the plurality of electronic components into the conveying section in a plurality of times; the recovery holding section separates the plurality of electronic components from the conveying section. take out. 如請求項14或15之電子零件檢查裝置，其中：上述供給回收固持部可將上述電子零件供給至上述檢查部及自上述檢查部回收。 The electronic component inspection device according to claim 14 or 15, wherein the supply and recovery holding unit can supply the electronic component to the inspection unit and recover from the inspection unit.