JPH04371419A - Attaching/removing device for semiconductor device - Google Patents
Attaching/removing device for semiconductor deviceInfo
- Publication number
- JPH04371419A JPH04371419A JP3146227A JP14622791A JPH04371419A JP H04371419 A JPH04371419 A JP H04371419A JP 3146227 A JP3146227 A JP 3146227A JP 14622791 A JP14622791 A JP 14622791A JP H04371419 A JPH04371419 A JP H04371419A
- Authority
- JP
- Japan
- Prior art keywords
- intervals
- pallets
- semiconductor device
- attachment
- semiconductor devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims description 7
- 238000005192 partition Methods 0.000 abstract 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Manipulator (AREA)
- Specific Conveyance Elements (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明は、ＩＣ，ＬＳＩ等の半
導体装置のマシン間あるいはパレット間等の搬送に用い
られる半導体装置用着脱装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting/dismounting device for semiconductor devices used for transporting semiconductor devices such as ICs and LSIs between machines or between pallets.
【０００２】0002
【従来の技術】従来の半導体装置用着脱装置の構成を図
２に示す。この従来の半導体装置用着脱装置は、アーム
５の先端に複数の吸着パッド６が設けられ、この吸着パ
ッド６によって半導体装置を吸着し、他のマシンやパレ
ット上まで移動した後、吸着パッド６への真空源などか
らの供給を断って半導体装置を離脱させるようにしてい
る。2. Description of the Related Art The structure of a conventional attaching/detaching device for semiconductor devices is shown in FIG. This conventional semiconductor device attachment/detachment device has a plurality of suction pads 6 provided at the tip of an arm 5, and the semiconductor devices are sucked by the suction pads 6, moved to another machine or onto a pallet, and then transferred to the suction pads 6. The semiconductor device is separated by cutting off the supply from a vacuum source or the like.
【０００３】0003
【発明が解決しようとする課題】しかしながら上記従来
の構成では、吸着パッド６の相互の間隔が固定されてい
るため、その間隔の整数倍の間隔の区画を有するマシン
やパレット間の搬送にしか使用できなかった。この発明
の目的は、任意の区画間隔を有するマシンやパレット間
の半導体装置の搬送を可能とする半導体装置用着脱装置
を提供することである。[Problems to be Solved by the Invention] However, in the above-mentioned conventional configuration, since the mutual spacing between the suction pads 6 is fixed, it can only be used for conveyance between machines or pallets that have sections with an interval that is an integral multiple of the spacing. could not. An object of the present invention is to provide a semiconductor device attachment/detachment device that allows semiconductor devices to be transferred between machines or pallets having arbitrary compartment intervals.
【０００４】0004
【課題を解決するための手段】この発明の半導体装置用
着脱装置は、複数の着脱機構の相互の間隔を任意に変更
可能としている。SUMMARY OF THE INVENTION A semiconductor device attachment/detachment device of the present invention allows the mutual spacing of a plurality of attachment/detachment mechanisms to be arbitrarily changed.
【０００５】[0005]
【作用】この発明の構成によれば、複数の着脱機構の相
互の間隔を、マシンやパレットの有する区画間隔に応じ
て任意に変更できるため、任意の区画間隔を有するマシ
ンやパレット間の半導体装置の搬送を行なうことができ
る。[Operation] According to the configuration of the present invention, the mutual spacing between the plurality of attachment/detachment mechanisms can be arbitrarily changed according to the compartment spacing of the machine or pallet, so semiconductor devices between machines or pallets having arbitrary compartment spacing can be changed. can be transported.
【０００６】[0006]
【実施例】この発明の一実施例を図面に基づいて説明す
る。図１はこの発明の一実施例の半導体装置用着脱装置
の構成図である。図１（ａ），（ｂ） において、１は
着脱機構としての吸着パッド、２は吸着パッド１を複数
取り付けるビーム、３，４は半導体装置を収納するパレ
ットである。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram of a semiconductor device attachment/detachment device according to an embodiment of the present invention. In FIGS. 1A and 1B, reference numeral 1 indicates a suction pad as an attachment/detachment mechanism, 2 a beam to which a plurality of suction pads 1 are attached, and 3 and 4 pallets for storing semiconductor devices.
【０００７】この半導体装置用着脱装置は、区画間隔の
小さいパレット３に半導体装置を出し入れするときは、
複数の吸着パッド１の間隔を小さくする。図１（ａ）
では、最も間隔の小さい場合であり、吸着パッド１が相
互に接触している状態を示している。また、区画間隔の
大きいパレット４に半導体装置を出し入れするときは、
複数の吸着パッド１の間隔を大きくする。図１（ｂ）
では、最も間隔の大きい場合であり、吸着パッド１が相
互に最も離れた状態を示している。[0007] When loading and unloading semiconductor devices onto and from the pallet 3 with small interval between compartments, this loading/unloading device for semiconductor devices
To reduce the interval between a plurality of suction pads 1. Figure 1(a)
This is the case where the spacing is the smallest, and shows a state where the suction pads 1 are in contact with each other. Also, when loading and unloading semiconductor devices onto the pallet 4 with large compartment intervals,
The interval between the plurality of suction pads 1 is increased. Figure 1(b)
This is the case where the spacing is the largest, and shows a state in which the suction pads 1 are farthest from each other.
【０００８】このようにこの実施例では、吸着パッド１
の間隔を任意に設定することができるため、任意の区画
間隔のパレット間またはマシン間の搬送に使用すること
ができる。なお、吸着パッド１のビーム２上の移動は手
動で行なってもよいが、個々の吸着パッド１に駆動手段
を設けておき、作業対象となるパレット等の区画間隔に
応じて自動的に吸着パッド１の位置を設定することもで
きる。As described above, in this embodiment, the suction pad 1
Since the interval can be set arbitrarily, it can be used for conveyance between pallets or between machines with arbitrary compartment intervals. Although the suction pads 1 may be moved manually on the beam 2, each suction pad 1 is provided with a driving means so that the suction pads 1 can be moved automatically according to the interval between sections of pallets, etc. to be worked on. 1 position can also be set.
【０００９】[0009]
【発明の効果】この発明の半導体装置用着脱装置は、複
数の着脱機構の相互の間隔を、マシンやパレットの有す
る区画間隔に応じて任意に変更できるため、任意の区画
間隔を有するマシンやパレット間の半導体装置の搬送を
行なうことができ、作業能率を大幅に向上させることが
できる。Effects of the Invention The semiconductor device attachment/detachment device of the present invention allows the mutual spacing of the plurality of attachment/detachment mechanisms to be arbitrarily changed according to the compartment spacing of the machine or pallet. Semiconductor devices can be transported between locations, and work efficiency can be greatly improved.
【図１】この発明の一実施例の半導体装置用着脱装置の
構成図である。FIG. 1 is a configuration diagram of a semiconductor device attachment/detachment device according to an embodiment of the present invention.
【図２】従来の半導体装置用着脱装置の構成図である。FIG. 2 is a configuration diagram of a conventional attachment/detachment device for semiconductor devices.
１ 吸着パッド（着脱機構） 1 Suction pad (removal mechanism)
Claims (1)
を備え、この複数の着脱機構の相互の間隔を任意に変更
可能とした半導体装置用着脱装置。1. A semiconductor device attachment/detachment device comprising a plurality of attachment/detachment mechanisms for attaching and detaching semiconductor devices, and in which the mutual spacing between the plurality of attachment/detachment mechanisms can be arbitrarily changed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3146227A JPH04371419A (en) | 1991-06-18 | 1991-06-18 | Attaching/removing device for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3146227A JPH04371419A (en) | 1991-06-18 | 1991-06-18 | Attaching/removing device for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04371419A true JPH04371419A (en) | 1992-12-24 |
Family
ID=15402988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3146227A Pending JPH04371419A (en) | 1991-06-18 | 1991-06-18 | Attaching/removing device for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04371419A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4432909A1 (en) * | 1993-09-17 | 1995-03-30 | Mitsubishi Electric Corp | Object-arranging device |
| CN105905600A (en) * | 2015-02-25 | 2016-08-31 | 精工爱普生株式会社 | Electronic component conveying apparatus and electronic component inspecting device |
| JP2016201511A (en) * | 2015-04-14 | 2016-12-01 | 株式会社ディスコ | Carrying jig |
-
1991
- 1991-06-18 JP JP3146227A patent/JPH04371419A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4432909A1 (en) * | 1993-09-17 | 1995-03-30 | Mitsubishi Electric Corp | Object-arranging device |
| DE4432909C2 (en) * | 1993-09-17 | 2001-12-06 | Mitsubishi Electric Corp | Item placement device |
| CN105905600A (en) * | 2015-02-25 | 2016-08-31 | 精工爱普生株式会社 | Electronic component conveying apparatus and electronic component inspecting device |
| JP2016201511A (en) * | 2015-04-14 | 2016-12-01 | 株式会社ディスコ | Carrying jig |
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