TWI618164B - Electronic component transfer device and electronic component inspection device - Google Patents

Electronic component transfer device and electronic component inspection device Download PDF

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Publication number
TWI618164B
TWI618164B TW105127544A TW105127544A TWI618164B TW I618164 B TWI618164 B TW I618164B TW 105127544 A TW105127544 A TW 105127544A TW 105127544 A TW105127544 A TW 105127544A TW I618164 B TWI618164 B TW I618164B
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inspection
temperature
electronic component
unit
section
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TW105127544A
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TW201709378A (en
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Daisuke Kirihara
Masami Maeda
Toshioki Shimojima
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Seiko Epson Corp
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Priority claimed from JP2015170165A external-priority patent/JP2017049018A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

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  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

本發明提供一種可將電子零件設定為第1溫度與第2溫度之各者之電子零件搬送裝置及電子零件檢查裝置。 The present invention provides an electronic component transfer device and an electronic component inspection device capable of setting electronic components to each of a first temperature and a second temperature.

電子零件搬送裝置包含：第1搬送部，其搬送電子零件，且可將上述電子零件設為第1溫度；及第2搬送部，其搬送上述電子零件，且可將上述電子零件設為與上述第1溫度不同之第2溫度。 The electronic component transfer device includes: a first transfer portion that transfers electronic components, and the electronic components can be set to a first temperature; and a second transfer portion, which transfers the electronic components, and can set the electronic components to the same The first temperature is different from the second temperature.

Description

電子零件搬送裝置及電子零件檢查裝置 Electronic component transfer device and electronic component inspection device

本發明係關於一種電子零件搬送裝置及電子零件檢查裝置者。 The present invention relates to an electronic component transfer device and an electronic component inspection device.

過去以來，已知一種例如檢測IC器件等電子零件之電氣特性之電子零件檢查裝置，於該電子零件檢查裝置中，組裝有用於將IC器件搬送至檢查部之保持部之電子零件搬送裝置。於IC器件之檢查時，將IC器件配置於保持部，並使設置於保持部之複數個探針針腳與IC器件之各端子接觸。此種IC器件之檢查有將IC器件冷卻至特定溫度而進行之低溫檢查、及將IC器件加熱至特定溫度而進行之高溫檢查。 Conventionally, there has been known an electronic component inspection device that detects the electrical characteristics of electronic components such as IC devices. In this electronic component inspection device, an electronic component transfer device for transferring an IC device to a holding portion of an inspection portion is assembled. During the inspection of the IC device, the IC device is arranged on the holding portion, and a plurality of probe pins provided on the holding portion are brought into contact with each terminal of the IC device. The inspection of such IC devices includes a low temperature inspection performed by cooling the IC device to a specific temperature, and a high temperature inspection performed by heating the IC device to a specific temperature.

又，於專利文獻1中，記載有一種IC分類機(IC Handler)，其具有於進行IC器件之檢查之情形時，藉由吸附固持IC器件之2個搬送臂。 In addition, Patent Document 1 describes an IC sorter (IC Handler) having two transfer arms for holding and holding the IC device when the IC device is inspected.

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開平8-105937號公報 [Patent Document 1] Japanese Patent Laid-Open No. 8-105937

然而，於專利文獻1所記載之裝置中，無法進行IC器件之低溫檢查與高溫檢查之兩者。 However, in the device described in Patent Document 1, it is impossible to perform both low-temperature inspection and high-temperature inspection of IC devices.

又，於專利文獻1所記載之裝置中，由搬送機械手固持被載置於載置且搬送IC器件之電子零件載置部之特定位置的IC器件，但無法將其載置於該電子零件載置部之其他位置。 Further, in the device described in Patent Document 1, an IC device placed on a specific position of an electronic part placement section on which an IC device is placed and carried is held by a transfer robot, but it cannot be placed on the electronic part. Other positions of the mounting section.

本發明係為解決上述問題之至少一部分而完成者，且可作為以下之形態或應用例而實現。 The present invention has been made to solve at least a part of the problems described above, and can be implemented as the following forms or application examples.

[應用例1]本應用例之電子零件搬送裝置之特徵在於包含：第1搬送部，其搬送電子零件，且可將上述電子零件設為第1溫度；及 第2搬送部，其搬送上述電子零件，且可將上述電子零件設為與上述第1溫度不同之第2溫度。 [Application Example 1] The electronic component transfer device of this application example includes a first transfer unit that transfers electronic components, and the electronic components can be set to a first temperature; and The second transfer unit may transfer the electronic component, and the electronic component may be set to a second temperature different from the first temperature.

藉此，於進行電子零件之檢查之情形時，可以第1溫度與第2溫度之各者進行。又，可減少第1溫度與第2溫度之溫度切換設定步驟數，或縮減使溫度趨於穩定所需之等待時間。 Therefore, when the electronic component is inspected, it can be performed at each of the first temperature and the second temperature. In addition, the number of temperature switching setting steps of the first temperature and the second temperature can be reduced, or the waiting time required to stabilize the temperature can be reduced.

[應用例2]於上述應用例之電子零件搬送裝置中，較佳為，上述第1搬送部具有第1電子零件載置部，其可載置、移動上述電子零件，且可將上述電子零件設為上述第1溫度；及第1電子零件固持部，其可固持、移動上述電子零件，且可將上述電子零件設為上述第1溫度；且 上述第2搬送部具有第2電子零件載置部，其可載置、移動上述電子零件，且可將上述電子零件設為上述第2溫度；及第2電子零件固持部，其可固持、移動上述電子零件，且可將上述電子零件設為上述第2溫度。 [Application Example 2] In the electronic component transfer device according to the above application example, it is preferable that the first transfer section includes a first electronic component placement section that can mount and move the electronic component, and that the electronic component can be transferred. The first temperature is set to the first temperature; and the first electronic component holding portion can hold and move the electronic component, and the electronic component can be set to the first temperature; and The second transporting section includes a second electronic component mounting section that can mount and move the electronic component, and that the electronic component can be set to the second temperature; and a second electronic component holding section that can hold and move the electronic component. The electronic component may be set to the second temperature.

藉此，於進行電子零件之檢查之情形時，可以第1溫度與第2溫度之各者進行。 Therefore, when the electronic component is inspected, it can be performed at each of the first temperature and the second temperature.

[應用例3]於上述應用例之電子零件搬送裝置中，較佳包含：電子零件載置部，其可載置、移動上述電子零件，且具有可將上述電子零件設為上述第1溫度之第1電子零件載置部溫度設定部、及可將上述電子零件設為上述第2溫度之第2電子零件載置部溫度設定部；及電子零件固持部，其可固持、移動上述電子零件，且具有可將 上述電子零件設為上述第1溫度之第1電子零件固持部溫度設定部、及可將上述電子零件設為上述第2溫度之第2電子零件固持部溫度設定部；上述第1搬送部具有上述第1電子零件載置部溫度設定部、及上述第1電子零件固持部溫度設定部；且上述第2搬送部具有上述第2電子零件載置部溫度設定部、及上述第2電子零件固持部溫度設定部。 [Application Example 3] The electronic component transfer device of the above application example preferably includes an electronic component mounting section that can mount and move the electronic component, and that has an electronic component that can be set to the first temperature. A first electronic component mounting portion temperature setting portion, a second electronic component mounting portion temperature setting portion that can set the electronic component to the second temperature, and an electronic component holding portion that can hold and move the electronic component, And has The electronic component is a temperature setting unit of a first electronic component holding portion at the first temperature, and a temperature setting portion of a second electronic component holding portion at which the electronic component can be set at the second temperature; the first transfer portion includes the above The first electronic component mounting portion temperature setting portion and the first electronic component holding portion temperature setting portion; and the second transporting portion includes the second electronic component mounting portion temperature setting portion and the second electronic component holding portion. Temperature setting section.

藉此，可藉由電子零件載置部及電子零件固持部，將電子零件搬送至特定位置。 Thereby, the electronic component can be transported to a specific position by the electronic component mounting portion and the electronic component holding portion.

又，可藉由第1電子零件固持部溫度設定部及第1電子零件載置部溫度設定部，將電子零件設為第1溫度，可藉由第2電子零件固持部溫度設定部及第2電子零件載置部溫度設定部，將電子零件設為第2溫度。 In addition, the electronic component can be set to the first temperature by the first electronic component holding portion temperature setting portion and the first electronic component placing portion temperature setting portion, and the second electronic component holding portion temperature setting portion and the second electronic component holding portion can be set to the first temperature. The electronic component mounting section temperature setting section sets the electronic component to a second temperature.

[應用例4]於上述應用例之電子零件搬送裝置中，較佳包含複數個上述電子零件載置部；且包含複數個上述電子零件固持部。 [Application Example 4] In the electronic component transfer device according to the application example described above, it is preferable that the electronic component placement section includes a plurality of the electronic component placement sections and includes the plurality of electronic component holding sections.

藉此，於進行電子零件之檢查之情形時，可以第1溫度與第2溫度之各者進行。 Therefore, when the electronic component is inspected, it can be performed at each of the first temperature and the second temperature.

[應用例5]於上述應用例之電子零件搬送裝置中，較佳為，於以上述第1搬送部搬送上述電子零件後，以上述第2搬送部搬送上述電子零件。 [Application Example 5] In the electronic component transfer device of the application example described above, it is preferable that after the electronic component is transferred by the first transfer unit, the electronic component is transferred by the second transfer unit.

藉此，於第1溫度低於第2溫度之情形時，電子零件係以設定為第2溫度之狀態被搬送至特定位置，藉此，可防止電子零件之結露。 Accordingly, when the first temperature is lower than the second temperature, the electronic component is transported to a specific position in a state set to the second temperature, thereby preventing dew condensation on the electronic component.

[應用例6]於上述應用例之電子零件搬送裝置中，較佳為，上述第1溫度低於上述第2溫度。 [Application Example 6] In the electronic component transfer device of the application example described above, the first temperature is preferably lower than the second temperature.

藉此，於由第1搬送部搬送電子零件後，由第2搬送部搬送電子 零件之情形時，電子零件係以設定為第2溫度之狀態，被搬送至特定位置，藉此，可防止電子零件結露。 Thereby, after the electronic parts are transferred by the first transfer unit, the electronics are transferred by the second transfer unit. In the case of a component, the electronic component is transported to a specific position in a state of being set to the second temperature, thereby preventing condensation of the electronic component.

[應用例7]於上述應用例之電子零件搬送裝置中，較佳為，以上述第1溫度進行上述電子零件之檢查且上述檢查合格之情形時，以上述第2溫度進行上述電子零件之檢查。 [Application Example 7] In the electronic component transfer device of the above application example, when the inspection of the electronic component is performed at the first temperature and the inspection is satisfactory, the inspection of the electronic component is performed at the second temperature. .

藉此，於第1溫度低於第2溫度之情形時，藉由其後以第2溫度進行電子零件之檢查，於將電子零件搬送至特定位置之情形時，可防止電子零件之結露。 With this, when the first temperature is lower than the second temperature, the electronic component is inspected at the second temperature thereafter, and when the electronic component is transported to a specific position, condensation of the electronic component can be prevented.

[應用例8]上述應用例之電子零件搬送裝置之特徵在於包含：第1搬送部，其搬送電子零件，且可將上述電子零件設為第1溫度；第2搬送部，其搬送上述電子零件，且可將上述電子零件設為與上述第1溫度不同之第2溫度；及檢查部，其檢查上述電子零件。 [Application Example 8] The electronic component transfer device of the above application example is characterized by including: a first transfer section that transfers electronic components, and that the electronic components can be set to a first temperature; a second transfer section that transfers the electronic components And the electronic component may be set to a second temperature different from the first temperature; and an inspection unit that inspects the electronic component.

藉此，可以第1溫度與第2溫度之各者進行電子零件之檢查。又，可減少第1溫度與第2溫度之溫度切換設定步驟數，或減少使溫度直至穩定所需之等待時間。 Thereby, the inspection of electronic components can be performed at each of the first temperature and the second temperature. In addition, it is possible to reduce the number of temperature switching setting steps of the first temperature and the second temperature, or to reduce the waiting time required to stabilize the temperature.

[應用例9]於本應用例之電子零件搬送裝置中，較佳為，於上述檢查部，設置可將上述電子零件設為上述第1溫度之第1溫度設定部、及可將上述電子零件設為上述第2溫度之第2溫度設定部。 [Application Example 9] In the electronic component transporting device of this application example, it is preferable that a first temperature setting section capable of setting the electronic component to the first temperature is provided in the inspection section, and the electronic component can be provided in the inspection section. The second temperature setting unit is set to the second temperature.

藉此，可以第1溫度與第2溫度之各者進行電子零件之檢查。 Thereby, the inspection of electronic components can be performed at each of the first temperature and the second temperature.

[應用例10]本應用例之電子零件搬送裝置之特徵在於包含：電子零件載置部，其具有載置電子零件之第1載置部、及載置上述電子零件之第2載置部，且可搬送上述電子零件；及電子零件固持部，其可自上述第1載置部固持上述電子零件而將其載置於上述第2載置部；且上述第2載置部不同於上述第1載置部。 [Application Example 10] The electronic component transfer device of this application example is characterized by including an electronic component mounting section having a first mounting section on which the electronic components are mounted, and a second mounting section on which the electronic components are mounted. The electronic component can be transported; and an electronic component holding portion that can hold the electronic component from the first placing portion and place the electronic component on the second placing portion; and the second placing portion is different from the first placing portion. 1 placing section.

藉此，於進行電子零件之檢查之情形時，例如，首先，載置於第1載置部，將於特定條件下完成檢查之檢查後之電子零件載置於第2載置部，將檢查前之其他電子零件載置於第1載置部。 Therefore, when the inspection of electronic parts is performed, for example, firstly, the electronic parts are placed on the first placing section, and the electronic parts after the inspections under the specific conditions are completed are placed on the second placing section, and the inspection is performed. The other previous electronic parts are placed on the first placement section.

因此，因可進行檢查條件不同之設定故可實現檢查自由度的提高，特別有利於小批量之情形等。又，可減少變更檢查條件之設定步驟數，或減少使檢查條件(例如溫度條件)直至穩定所需之等待時間。 Therefore, since different inspection conditions can be set, the degree of inspection freedom can be improved, which is particularly advantageous for small batches. In addition, it is possible to reduce the number of setting steps for changing the inspection conditions, or to reduce the waiting time required for the inspection conditions (for example, temperature conditions) to stabilize.

又，無需暫時回收電子零件，即可於不同之2個條件下進行檢查，而且，可於互不相同之條件下，同時檢查2個電子零件。藉此，可提高產出量。 In addition, the electronic components can be inspected under two different conditions without the need to temporarily recover the electronic components, and the two electronic components can be inspected simultaneously under different conditions. This can increase output.

[應用例11]於應用例10之電子零件搬送裝置中，較佳為，沿上述電子零件載置部之移動方向並排上述第1載置部與上述第2載置部。 [Application Example 11] In the electronic component transporting device of Application Example 10, it is preferable that the first mounting section and the second mounting section are arranged side by side along the moving direction of the electronic component mounting section.

藉此，電子零件固持部可藉由電子零件載置部之移動，而將載置於第1載置部之電子零件載置於第2載置部。 Thereby, the electronic component holding portion can move the electronic component placement portion to place the electronic component placed on the first placement portion on the second placement portion.

[應用例12]於應用例10或11之電子零件搬送裝置中，較佳為，上述電子零件載置部具有載置上述電子零件之第3載置部，上述第3載置部不同於上述第1載置部及上述第2載置部。 [Application Example 12] In the electronic component transporting device of Application Example 10 or 11, it is preferable that the electronic component mounting portion has a third mounting portion on which the electronic component is mounted, and the third mounting portion is different from the above. The first placing section and the second placing section.

藉此，電子零件固持部可將載置於第2載置部之電子零件載置於第3載置部。藉此，無需暫時回收電子零件，即可於不同之3個條件下進行檢查，而且，可於互不相同之條件下，同時檢查3個電子零件，可提高產出量。 With this, the electronic component holding portion can place the electronic component placed on the second placing portion on the third placing portion. Thereby, the electronic components can be inspected under three different conditions without the need to temporarily recover the electronic components. Moreover, the three electronic components can be inspected at the same time under different conditions, which can increase the output.

[應用例13]於應用例12之電子零件搬送裝置中，較佳為，上述電子零件固持部可自上述第2載置部固持上述電子零件，將其載置於上述第3載置部。 [Application Example 13] In the electronic component transfer device of Application Example 12, it is preferable that the electronic component holding portion can hold the electronic component from the second placing portion and place the electronic component on the third placing portion.

藉此，無需暫時回收電子零件，即可於不同之3個條件下進行檢查，而且，可於互不相同之條件下，同時檢查3個電子零件，可提高產出量。 Thereby, the electronic components can be inspected under three different conditions without the need to temporarily recover the electronic components. Moreover, the three electronic components can be inspected at the same time under different conditions, which can increase the output.

[應用例14]於應用例10至13中之任一例之電子零件搬送裝置中，較佳為，上述電子零件固持部具有固持上述電子零件之第1固持部、及固持上述電子零件之第2固持部；且上述第1固持部與上述第2固持部不同。 [Application Example 14] In the electronic component transporting device of any one of Application Examples 10 to 13, it is preferable that the electronic component holding portion includes a first holding portion holding the electronic component and a second holding portion holding the electronic component. A holding portion; and the first holding portion is different from the second holding portion.

藉此，電子零件固持部可由第1固持部固持被載置於第1載置部之電子零件，由第2固持部固持被載置於第2載置部之電子零件。 Thereby, the electronic component holding portion can hold the electronic component placed on the first placing portion by the first holding portion, and the second holding portion can hold the electronic component placed on the second placing portion.

[應用例15]於應用例14之電子零件搬送裝置中，較佳為，沿上述電子零件載置部之移動方向並排上述第1固持部與上述第2固持部。 [Application Example 15] In the electronic component conveying device of Application Example 14, it is preferable that the first holding portion and the second holding portion are arranged side by side along the moving direction of the electronic component placing portion.

藉此，電子零件固持部可由第1固持部固持被載置於第1載置部之電子零件，由第2固持部固持被載置於第2載置部之電子零件。 Thereby, the electronic component holding portion can hold the electronic component placed on the first placing portion by the first holding portion, and the second holding portion can hold the electronic component placed on the second placing portion.

[應用例16]於應用例14或15之電子零件搬送裝置中，較佳為，上述第1固持部之溫度與上述第2固持部之溫度不同。 [Application Example 16] In the electronic component transfer device of Application Example 14 or 15, it is preferable that the temperature of the first holding portion is different from the temperature of the second holding portion.

藉此，無需暫時回收電子零件，即可於不同之2個溫度條件下進行檢查，而且，可於互不相同之溫度條件下，同時檢查2個電子零件。 Thereby, the electronic components can be inspected under two different temperature conditions without temporarily recovering the electronic components, and the two electronic components can be inspected simultaneously under different temperature conditions.

[應用例17]於應用例14或15之電子零件搬送裝置中，較佳為，上述第1固持部之溫度低於上述第2固持部之溫度。 [Application Example 17] In the electronic component transfer device of Application Example 14 or 15, the temperature of the first holding portion is preferably lower than the temperature of the second holding portion.

藉此，無需暫時回收電子零件，即可於不同之2個溫度條件下進行檢查，而且，可於互不相同之溫度條件下，同時檢查2個電子零件。 Thereby, the electronic components can be inspected under two different temperature conditions without temporarily recovering the electronic components, and the two electronic components can be inspected simultaneously under different temperature conditions.

[應用例18]於應用例14至17中之任一例之電子零件搬送裝置中，較佳為，上述電子零件固持部具有固持上述電子零件之第3固持部，上述第3固持部不同於上述第1固持部及上述第2固持部。 [Application Example 18] In the electronic component transfer device of any one of Application Examples 14 to 17, it is preferable that the electronic component holding portion has a third holding portion that holds the electronic component, and the third holding portion is different from the above. The first holding portion and the second holding portion.

藉此，無需暫時回收電子零件，即可於不同之3個溫度條件下進行檢查，而且，可於互不相同之溫度條件下，同時檢查3個電子零件。 Thereby, without temporarily recovering the electronic parts, the inspection can be performed at three different temperature conditions, and at the same time, the three electronic parts can be inspected at different temperature conditions.

[應用例19]於應用例18之電子零件搬送裝置中，較佳為，上述第3固持部之溫度不同於上述第1固持部之溫度及上述第2固持部之溫度。 [Application Example 19] In the electronic component transfer device of Application Example 18, the temperature of the third holding portion is preferably different from the temperature of the first holding portion and the temperature of the second holding portion.

藉此，無需暫時回收電子零件，即可於不同之3個溫度條件下進行檢查，而且，可於互不相同之溫度條件下，同時檢查3個電子零件。 Thereby, without temporarily recovering the electronic parts, the inspection can be performed at three different temperature conditions, and at the same time, the three electronic parts can be inspected at different temperature conditions.

[應用例20]於應用例18之電子零件搬送裝置中，較佳為，上述第3固持部之溫度高於上述第1固持部之溫度及上述第2固持部之溫度。 [Application Example 20] In the electronic component transfer device of Application Example 18, the temperature of the third holding portion is preferably higher than the temperature of the first holding portion and the temperature of the second holding portion.

藉此，無需暫時回收電子零件，即可於不同之3個溫度條件下進行檢查，而且，可於互不相同之溫度條件下，同時檢查3個電子零件。 Thereby, without temporarily recovering the electronic parts, the inspection can be performed at three different temperature conditions, and at the same time, the three electronic parts can be inspected at different temperature conditions.

[應用例21]本應用例之電子零件檢查裝置之特徵在於包含：電子零件載置部，其具有載置電子零件之第1載置部、及載置上述電子零件之第2載置部，且可搬送上述電子零件；電子零件固持部，其可自上述第1載置部固持上述電子零件而將其載置於上述第2載置部；及檢查部，其檢查上述電子零件；且上述第2載置部不同於上述第1載置部，上述第1載置部係載置由上述檢查部進行檢查前之上述電子零件，上述第2載置部係載置經上述檢查部檢查後之上述電子零件。 [Application Example 21] The electronic component inspection device of this application example is characterized by including an electronic component mounting section including a first mounting section on which electronic components are mounted, and a second mounting section on which the electronic components are mounted. And the electronic component can be transported; the electronic component holding portion can hold the electronic component from the first placing portion and place the electronic component on the second placing portion; and an inspection portion that inspects the electronic component; and The second mounting section is different from the first mounting section. The first mounting section is configured to mount the electronic components before being inspected by the inspection section, and the second mounting section is disposed after being inspected by the inspection section. The above electronic parts.

藉此，於進行電子零件之檢查之情形時，例如，首先，將其載置於第1載置部，將於特定條件下完成檢查之檢查後之電子零件載置於第2載置部，將檢查前之其他電子零件載置於第1載置部。 Therefore, when the inspection of electronic parts is carried out, for example, firstly, they are placed on the first placing section, and the electronic parts after the inspection under the specific conditions are placed on the second placing section, The other electronic components before the inspection are placed in the first placing section.

因此，因可進行檢查條件不同之設定故可謀求檢查自由度的提高，特別有利於小批量之情形等。又，可減少變更檢查條件之設定步驟數，或減少使檢查條件(例如溫度條件)直至穩定所需之等待時間。 Therefore, since the inspection conditions can be set differently, the degree of inspection freedom can be improved, which is particularly useful in the case of small batches. In addition, it is possible to reduce the number of setting steps for changing the inspection conditions, or to reduce the waiting time required for the inspection conditions (for example, temperature conditions) to stabilize.

又，無需暫時回收電子零件，即可於不同之2個條件下進行檢查，而且，可於互不相同之條件下，同時檢查2個電子零件。藉此，可提高產出量。 In addition, the electronic components can be inspected under two different conditions without the need to temporarily recover the electronic components, and the two electronic components can be inspected simultaneously under different conditions. This can increase output.

1‧‧‧檢查裝置(電子零件檢查裝置) 1‧‧‧Inspection device (electronic parts inspection device)

1c‧‧‧檢查裝置(電子零件檢查裝置) 1c‧‧‧Inspection device (electronic parts inspection device)

6‧‧‧操作部 6‧‧‧Operation Department

11A‧‧‧第1托盤搬送機構 11A‧‧‧The first pallet transfer mechanism

11B‧‧‧第2托盤搬送機構 11B‧‧‧Second pallet transfer mechanism

12a‧‧‧第1溫度調整部(第1均熱板) 12a‧‧‧The first temperature adjustment unit (the first soaking plate)

12b‧‧‧第2溫度調整部(第2均熱板) 12b‧‧‧Second temperature adjustment unit (second soaking plate)

12c‧‧‧第1溫度調整部 12c‧‧‧The first temperature adjustment unit

12d‧‧‧第2溫度調整部 12d‧‧‧The second temperature adjustment unit

13‧‧‧供給用器件搬送頭 13‧‧‧ supply device transfer head

14a‧‧‧第1器件供給部(第1供給梭) 14a‧‧‧ 1st device supply unit (1st supply shuttle)

14b‧‧‧第2器件供給部(第2供給梭) 14b‧‧‧Second device supply unit (second supply shuttle)

14c‧‧‧第1器件供給部 14c‧‧‧The first device supply department

14d‧‧‧第2器件供給部 14d‧‧‧Second Device Supply Department

15‧‧‧第3托盤搬送機構 15‧‧‧3rd pallet transfer mechanism

16‧‧‧檢查部 16‧‧‧ Inspection Department

17a‧‧‧第1檢查用器件搬送頭(第1電子零件固持部) 17a‧‧‧The first inspection device transfer head (first electronic parts holding section)

17b‧‧‧第2檢查用器件搬送頭(第2電子零件固持部) 17b‧‧‧Second inspection device transfer head (second electronic parts holding section)

17c‧‧‧第1檢查用器件搬送頭 17c‧‧‧The first inspection device transfer head

17d‧‧‧第2檢查用器件搬送頭 17d‧‧‧ 2nd inspection device transfer head

18a‧‧‧第1器件回收部(第1回收梭) 18a‧‧‧The first device recovery section (the first recovery shuttle)

18b‧‧‧第2器件回收部(第2回收梭) 18b‧‧‧Second device recovery section (second recovery shuttle)

18c‧‧‧第1器件回收部 18c‧‧‧The first device recycling department

18d‧‧‧第2器件回收部 18d‧‧‧Second Device Recycling Department

19‧‧‧回收用托盤 19‧‧‧Recycling tray

20‧‧‧回收用器件搬送頭 20‧‧‧Recycling device transfer head

21‧‧‧第6托盤搬送機構 21‧‧‧The 6th pallet transfer mechanism

22A‧‧‧第4托盤搬送機構 22A‧‧‧4th pallet transfer mechanism

22B‧‧‧第5托盤搬送機構 22B‧‧‧5th pallet transfer mechanism

41‧‧‧冷卻機構 41‧‧‧cooling mechanism

42‧‧‧冷卻機構 42‧‧‧cooling mechanism

43‧‧‧冷卻機構 43‧‧‧cooling mechanism

44‧‧‧冷卻機構 44‧‧‧cooling mechanism

45‧‧‧冷卻機構 45‧‧‧cooling mechanism

51‧‧‧加熱機構 51‧‧‧Heating mechanism

52‧‧‧加熱機構 52‧‧‧Heating mechanism

53‧‧‧加熱機構 53‧‧‧Heating mechanism

54‧‧‧加熱機構 54‧‧‧Heating mechanism

61‧‧‧顯示部 61‧‧‧Display

62‧‧‧顯示部 62‧‧‧Display

80‧‧‧控制部 80‧‧‧Control Department

90‧‧‧IC器件 90‧‧‧IC device

131‧‧‧手單元 131‧‧‧hand unit

141‧‧‧器件供給部本體 141‧‧‧ Device Supply Department

142‧‧‧配置板 142‧‧‧Configuration board

145‧‧‧凹穴 145‧‧‧Dent

146‧‧‧器件供給部第1溫度設定部 146‧‧‧Device supply section 1st temperature setting section

147‧‧‧器件供給部第2溫度設定部 147‧‧‧ Device supply section Second temperature setting section

161‧‧‧檢查部本體 161‧‧‧ Inspection Department

162‧‧‧保持構件 162‧‧‧holding member

163‧‧‧保持部 163‧‧‧ Holding Department

166‧‧‧第1溫度設定部 166‧‧‧The first temperature setting unit

167‧‧‧第2溫度設定部 167‧‧‧Second temperature setting unit

171a‧‧‧第1手單元 171a‧‧‧First Unit

171b‧‧‧第2手單元 171b‧‧‧Second hand unit

171c‧‧‧第1手單元 171c‧‧‧First Unit

171d‧‧‧第2手單元 171d‧‧‧Second hand unit

172‧‧‧手單元本體 172‧‧‧hand unit body

173‧‧‧固持構件 173‧‧‧ holding member

176‧‧‧器件搬送頭第1溫度設定部 176‧‧‧ Device transfer head first temperature setting section

176c‧‧‧手單元第1溫度設定部(第1機械臂溫度設定部) 176c‧‧‧Hand unit first temperature setting section (the first robot arm temperature setting section)

177‧‧‧器件搬送頭第2溫度設定部 177‧‧‧ Device transfer head second temperature setting section

178c‧‧‧手單元第3溫度設定部(第3機械臂溫度設定部) 178c‧‧‧Hand unit third temperature setting section (third robot arm temperature setting section)

181‧‧‧器件回收部本體 181‧‧‧Device Recovery Department

182‧‧‧配置板 182‧‧‧Configuration board

185‧‧‧凹穴 185‧‧‧Dent

200‧‧‧托盤 200‧‧‧tray

201‧‧‧手單元 201‧‧‧hand unit

261‧‧‧第1載置部 261‧‧‧The first placement section

262‧‧‧第2載置部 262‧‧‧ 2nd placement section

263‧‧‧第3載置部 263‧‧‧3rd placement section

264‧‧‧第4載置部 264‧‧‧The fourth placement section

271‧‧‧第1固持部 271‧‧‧The first holding section

272‧‧‧第2固持部 272‧‧‧The second holding section

273‧‧‧第3固持部 273‧‧‧The third holding section

274‧‧‧第4固持部 274‧‧‧The fourth holding section

801‧‧‧記憶部 801‧‧‧Memory Department

901‧‧‧第1個IC器件(IC器件) 901‧‧‧The first IC device (IC device)

902‧‧‧第2個IC器件(IC器件) 902‧‧‧ 2nd IC device (IC device)

903‧‧‧第3個IC器件(IC器件) 903‧‧‧The third IC device (IC device)

904‧‧‧第4個IC器件(IC器件) 904‧‧‧ 4th IC device (IC device)

905‧‧‧第5個IC器件(IC器件) 905‧‧‧The fifth IC device (IC device)

A1‧‧‧托盤供給區域 A1‧‧‧Tray supply area

A2‧‧‧器件供給區域(供給區域) A2‧‧‧Device supply area (supply area)

A3‧‧‧檢查區域 A3‧‧‧ Inspection area

A4‧‧‧器件回收區域(回收區域) A4‧‧‧device recycling area (recycling area)

A5‧‧‧托盤移除區域 A5‧‧‧Tray removal area

R1‧‧‧第1室 R1‧‧‧Room 1

R2‧‧‧第2室 R2‧‧‧Room 2

R3‧‧‧第3室 R3‧‧‧Room 3

X‧‧‧方向 X‧‧‧ direction

Y‧‧‧方向 Y‧‧‧ direction

Z‧‧‧方向 Z‧‧‧ direction

圖1A係顯示本發明之電子零件檢查裝置之第1實施形態之概略俯視圖。 FIG. 1A is a schematic plan view showing a first embodiment of the electronic component inspection apparatus of the present invention.

圖1B係用於說明圖1A之第1檢查用器件搬送頭及第2檢查用器件搬送頭之俯視圖。 FIG. 1B is a plan view for explaining the first inspection device transfer head and the second inspection device transfer head in FIG. 1A.

圖2係圖1A所示之電子零件檢查裝置之方塊圖。 FIG. 2 is a block diagram of the electronic component inspection apparatus shown in FIG. 1A.

圖3係用於說明電子零件檢查裝置之第2實施形態之動作之圖。 Fig. 3 is a diagram for explaining the operation of the second embodiment of the electronic component inspection device.

圖4係用於說明電子零件檢查裝置之第2實施形態之動作之圖。 Fig. 4 is a diagram for explaining the operation of the second embodiment of the electronic component inspection device.

圖5係用於說明電子零件檢查裝置之第2實施形態之動作之圖。 Fig. 5 is a diagram for explaining the operation of the second embodiment of the electronic component inspection device.

圖6係用於說明電子零件檢查裝置之第2實施形態之動作之圖。 Fig. 6 is a diagram for explaining the operation of the second embodiment of the electronic component inspection device.

圖7係用於說明電子零件檢查裝置之第2實施形態之動作之圖。 Fig. 7 is a diagram for explaining the operation of the second embodiment of the electronic component inspection device.

圖8係用於說明電子零件檢查裝置之第2實施形態之動作之圖。 Fig. 8 is a diagram for explaining the operation of the second embodiment of the electronic component inspection device.

圖9係用於說明電子零件檢查裝置之第2實施形態之動作之圖。 Fig. 9 is a diagram for explaining the operation of the second embodiment of the electronic component inspection device.

圖10係用於說明電子零件檢查裝置之第2實施形態之動作之圖。 FIG. 10 is a diagram for explaining the operation of the second embodiment of the electronic component inspection device.

圖11係用於說明電子零件檢查裝置之第2實施形態之動作之圖。 Fig. 11 is a diagram for explaining the operation of the second embodiment of the electronic component inspection device.

圖12A係用於說明電子零件檢查裝置之第3實施形態之動作之圖。 Fig. 12A is a diagram for explaining the operation of the third embodiment of the electronic component inspection device.

圖12B係用於說明圖12A之第1檢查用器件搬送頭及第2檢查用器件搬送頭之俯視圖。 FIG. 12B is a plan view illustrating the first inspection device transfer head and the second inspection device transfer head of FIG. 12A.

圖13係用於說明電子零件檢查裝置之第3實施形態之動作之圖。 Fig. 13 is a diagram for explaining the operation of the third embodiment of the electronic component inspection device.

圖14係用於說明電子零件檢查裝置之第3實施形態之動作之圖。 Fig. 14 is a diagram for explaining the operation of the third embodiment of the electronic component inspection device.

圖15係用於說明電子零件檢查裝置之第3實施形態之動作之圖。 Fig. 15 is a diagram for explaining the operation of the third embodiment of the electronic component inspection device.

圖16係用於說明電子零件檢查裝置之第3實施形態之動作之圖。 FIG. 16 is a diagram for explaining the operation of the third embodiment of the electronic component inspection device.

圖17係用於說明電子零件檢查裝置之第3實施形態之動作之圖。 FIG. 17 is a diagram for explaining the operation of the third embodiment of the electronic component inspection device.

圖18係用於說明電子零件檢查裝置之第3實施形態之動作之圖。 Fig. 18 is a diagram for explaining the operation of the third embodiment of the electronic component inspection device.

圖19係用於說明電子零件檢查裝置之第3實施形態之動作之圖。 Fig. 19 is a diagram for explaining the operation of the third embodiment of the electronic component inspection device.

圖20A係顯示本發明之電子零件檢查裝置之第4實施形態之概略俯視圖。 FIG. 20A is a schematic plan view showing a fourth embodiment of the electronic component inspection apparatus of the present invention.

圖20B係用於說明圖20A之第1檢查用器件搬送頭及第2檢查用器件搬送頭之俯視圖。 FIG. 20B is a plan view for explaining the first inspection device transfer head and the second inspection device transfer head of FIG. 20A.

圖21係圖20A所示之電子零件檢查裝置之方塊圖。 FIG. 21 is a block diagram of the electronic component inspection apparatus shown in FIG. 20A.

圖22A係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 22A is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖22B係用於說明圖22A之第1檢查用器件搬送頭及第2檢查用器件搬送頭之俯視圖。 22B is a plan view for explaining the first inspection device transfer head and the second inspection device transfer head of FIG. 22A.

圖23係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 23 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖24係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 24 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖25係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 25 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖26係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 26 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖27係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 27 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖28係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 28 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖29係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 29 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖30係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 30 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖31係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 31 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖32係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 32 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖33係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 33 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖34係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 34 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖35係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 35 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖36係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 36 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖37係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 37 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖38係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 38 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖39係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 39 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖40係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 40 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖41係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 41 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖42係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 42 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖43係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 43 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖44係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 44 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖45係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 45 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖46係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 46 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖47係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 47 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖48係用於說明圖20A所示之電子零件檢查裝置之動作之圖。 Fig. 48 is a diagram for explaining the operation of the electronic component inspection device shown in Fig. 20A.

圖49係示意性顯示本發明之電子零件檢查裝置之第5實施形態之第1檢查用器件搬送頭及檢查部之俯視圖。 FIG. 49 is a plan view schematically showing a first inspection device transfer head and an inspection unit according to a fifth embodiment of the electronic component inspection apparatus of the present invention.

以下，就本發明之電子零件搬送裝置及電子零件檢查裝置，基於附加圖式所示之實施形態而詳細地進行說明。 Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the embodiments shown in the attached drawings.

另，以下，為便於說明，例如如圖1A及圖20A所示般，將相互正交之3個軸設為X軸、Y軸、及Z軸。且，包含X軸與Y軸之XY平面係水平，Z軸係鉛垂。又，將平行於X軸之方向亦稱作「X方向」，將平行於Y軸之方向亦稱作「Y方向」，將平行於Z軸之方向亦稱作「Z方向」。又，將X軸、Y軸及Z軸之各軸之箭頭符號之方向稱作正側，將與箭頭符號相反之方向稱作負側。再者，將電子零件之搬送方向之上游側簡稱「上游側」，將下游側簡稱「下游側」。又，本案說明書中所謂之「水平」並非限定於完全水平，只要不阻礙電子零件之搬送，亦包含相對於水平略微(例如未達5°左右)傾斜之狀態。 In the following, for convenience of explanation, for example, as shown in FIG. 1A and FIG. 20A, three axes that are orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. The direction parallel to the X axis is also referred to as "X direction", the direction parallel to the Y axis is also referred to as "Y direction", and the direction parallel to the Z axis is also referred to as "Z direction". In addition, the directions of the arrow signs of the X-axis, Y-axis, and Z-axis are referred to as positive sides, and the directions opposite to the arrow signs are referred to as negative sides. In addition, the upstream side in the direction of conveyance of electronic components is referred to as "upstream side", and the downstream side is referred to as "downstream side". In addition, the so-called "horizontal" in the description of the present case is not limited to a complete level, as long as it does not hinder the transportation of electronic components, it also includes a state inclined slightly (for example, less than about 5 °) with respect to the level.

於以下所說明之檢查裝置(電子零件檢查裝置)1、1c係用於檢查/ 測試(以下簡稱「檢查」)例如BGA(Ball grid array：球狀柵格陣列)封裝或LGA(Land grid array：平面柵格陣列)封裝等IC器件，或LCD(Liquid Crystal Display：液晶顯示器)、CIS(CMOS Image Sensor：CMOS影像感測器)等電子零件之電氣特性的裝置。另，以下，為便於說明，以使用IC器件作為欲進行檢查之上述電子零件之情形為代表進行說明，並將其設為「IC器件90」。 The inspection devices (electronic part inspection devices) 1 and 1c described below are used for inspection / Test (hereinafter referred to as "inspection") IC devices such as BGA (Ball grid array) package or LGA (Land grid array) package, or LCD (Liquid Crystal Display), CIS (CMOS Image Sensor: CMOS image sensor) and other electrical components of electronic components. In the following, for convenience of explanation, a case where an IC device is used as the aforementioned electronic component to be inspected will be described as a representative, and it will be referred to as "IC device 90".

<第1實施形態> <First Embodiment>

圖1A係表示本發明之電子零件檢查裝置之第1實施形態之概略俯視圖。圖1B係用於說明圖1A之第1檢查用器件搬送頭及第2檢查用器件搬送頭之俯視圖。圖2係圖1A所示之電子零件檢查裝置之方塊圖。 FIG. 1A is a schematic plan view showing a first embodiment of the electronic component inspection apparatus of the present invention. FIG. 1B is a plan view for explaining the first inspection device transfer head and the second inspection device transfer head in FIG. 1A. FIG. 2 is a block diagram of the electronic component inspection apparatus shown in FIG. 1A.

另，於圖1A中，因第1檢查用器件搬送頭及第2檢查用器件搬送頭與其他構件重疊，故以兩點鏈線示意之。又，於說明第1檢查用器件搬送頭及第2檢查用器件搬送頭時，於圖1B中記載第1檢查用器件搬送頭及第2檢查用器件搬送頭。 In addition, in FIG. 1A, the first inspection device transfer head and the second inspection device transfer head overlap with other members, so they are indicated by two-dot chain lines. When describing the first inspection device transfer head and the second inspection device transfer head, FIG. 1B describes the first inspection device transfer head and the second inspection device transfer head.

如圖1A所示，檢查裝置1劃分為托盤供給區域A1、器件供給區域(以下簡稱「供給區域」)A2、檢查區域A3、器件回收區域(以下簡稱「回收區域」)A4、及托盤移除區域A5。該等各區域係相互由未圖示之壁部或隔板等分隔。又，供給區域A2成為由壁部或隔板等區劃之第1室R1，且，檢查區域A3成為由壁部或隔板等區劃之第2室R2，又，回收區域A4成為由壁部或隔板等區劃之第3室R3。又，第1室R1(供給區域A2)、第2室R2(檢查區域A3)及第3室R3(回收區域A4)係分別以可確保氣密性或斷熱性之方式構成。藉此，第1室R1、第2室R2及第3室R3可分別儘可能地維持濕度或溫度。另，第1室R1及第2室R2內係分別被控制為特定之濕度及特定之溫度。 As shown in FIG. 1A, the inspection device 1 is divided into a tray supply area A1, a device supply area (hereinafter referred to as "supply area") A2, an inspection area A3, a device recovery area (hereinafter referred to as "recycling area") A4, and tray removal. Area A5. These areas are separated from each other by a wall portion or a partition, etc., which are not shown. The supply area A2 is a first room R1 divided by a wall portion or a partition, and the inspection area A3 is a second room R2 divided by a wall portion or a partition. The recovery area A4 is a wall portion or a partition. The third room R3, such as a partition. The first room R1 (supply area A2), the second room R2 (inspection area A3), and the third room R3 (recovery area A4) are each configured to ensure airtightness or thermal insulation. Thereby, the first room R1, the second room R2, and the third room R3 can maintain the humidity or temperature as much as possible, respectively. The inside of the first room R1 and the second room R2 are controlled to a specific humidity and a specific temperature, respectively.

IC器件90係自托盤供給區域A1至托盤移除區域A5，依序經過上述各區域，於中途之檢查區域A3進行檢查。如此，檢查裝置1係包含 如下者：電子零件搬送裝置，其係於各區域搬送IC器件90，具有控制部80；檢查部16，其係於檢查區域A3內進行檢查；及未圖示之檢查控制部。另，於檢查裝置1中，由除檢查部16及檢查控制部以外之構成，構成電子零件搬送裝置。 The IC device 90 is sequentially inspected from the tray supply area A1 to the tray removal area A5, passing through the above-mentioned areas in the inspection area A3 in the middle. In this way, the inspection device 1 includes The following are: an electronic component conveying device that conveys IC devices 90 in each area and has a control section 80; an inspection section 16 that performs inspections in an inspection area A3; and an inspection control section (not shown). In addition, in the inspection apparatus 1, the electronic component transfer apparatus is comprised by the structure other than the inspection part 16 and the inspection control part.

托盤供給區域A1係供給排列有未檢查狀態之複數個IC器件90之托盤200的區域。另，於托盤供給區域A1中，可堆疊多個托盤200。 The tray supply area A1 is an area for supplying the trays 200 in which the plurality of IC devices 90 are arranged in an unchecked state. In the tray supply area A1, a plurality of trays 200 can be stacked.

供給區域A2係將來自托盤供給區域A1之托盤200上之複數個IC器件90分別供給至檢查區域A3的區域。另，設置有以跨及托盤供給區域A1與供給區域A2之方式逐個搬送托盤200之第1托盤搬送機構11A、及第2托盤搬送機構11B。 The supply area A2 is an area for supplying a plurality of IC devices 90 on the tray 200 from the tray supply area A1 to the inspection area A3, respectively. In addition, a first tray transfer mechanism 11A and a second tray transfer mechanism 11B are provided to transfer the tray 200 one by one across the tray supply area A1 and the supply area A2.

於供給區域A2中，設置有載置IC器件90之第1載置部即第1溫度調整部(第1均熱板)12a、載置IC器件90之第2載置部即第2溫度調整部(第2均熱板)12b、供給用器件搬送頭13、及第3托盤搬送機構15。 In the supply area A2, a first temperature adjustment portion (a first soaking plate) 12a, which is a first placement portion on which the IC device 90 is placed, and a second temperature adjustment, which is a second placement portion on which the IC device 90 is placed, are provided. Unit (second soaking plate) 12b, supply device transfer head 13, and third tray transfer mechanism 15.

第1溫度調整部12a係冷卻複數個IC器件90，將該IC器件90之溫度調整(控制)為適合檢查(低溫檢查)之溫度(第1溫度)的裝置(溫度控制構件)。又，第2溫度調整部12b係加熱複數個IC器件90，將該IC器件90之溫度調整(控制)為適合檢查(高溫檢查)之溫度(第2溫度)的裝置(溫度控制構件)。第1溫度調整部12a與第2溫度調整部12b係沿Y方向配置、固定。而且，由第1托盤搬送機構11A自托盤供給區域A1搬入(搬送而來)之托盤200上之IC器件90被搬送、載置於第1溫度調整部12a或第2溫度調整部12b。另，上述第1溫度低於上述第2溫度(第1溫度與第2溫度不同)。 The first temperature adjustment unit 12a is a device (temperature control member) that cools a plurality of IC devices 90 and adjusts (controls) the temperature of the IC devices 90 to a temperature (first temperature) suitable for inspection (low temperature inspection). The second temperature adjustment unit 12b is a device (temperature control member) that heats a plurality of IC devices 90 and adjusts (controls) the temperature of the IC devices 90 to a temperature (second temperature) suitable for inspection (high temperature inspection). The first temperature adjustment section 12a and the second temperature adjustment section 12b are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in (carried in) from the tray supply area A1 by the first tray transfer mechanism 11A is carried and placed on the first temperature adjustment section 12a or the second temperature adjustment section 12b. The first temperature is lower than the second temperature (the first temperature is different from the second temperature).

供給用器件搬送頭13係可於供給區域A2內，朝X方向、Y方向及Z方向移動地被支持。藉此，供給用器件搬送頭13可擔負自托盤供給區域A1搬入之托盤200與第1溫度調整部12a或第2溫度調整部12b之間之IC器件90的搬送，及第1溫度調整部12a或第2溫度調整部12b與後述 之第1器件供給部14a或第2器件供給部14b之間之IC器件90的搬送。另，供給用器件搬送頭13具有複數個手單元131作為可固持IC器件90之固持部；各手單元131係與後述之第1手單元171a同樣地，具備吸附嘴，可藉由吸附IC器件90而固持。又，於供給用器件搬送頭13之各手單元131中，與第1溫度調整部12a或第2溫度調整部12b同樣地，以可冷卻或加熱IC器件90而將該IC器件90之溫度調整為適合檢查之溫度之方式構成。 The supply device transfer head 13 is supported in the supply area A2 so as to be movable in the X direction, the Y direction, and the Z direction. Thereby, the supply device transfer head 13 can transfer the IC device 90 between the tray 200 carried in from the tray supply area A1 and the first temperature adjustment portion 12a or the second temperature adjustment portion 12b, and the first temperature adjustment portion 12a. Or the second temperature adjustment unit 12b and The IC device 90 is transported between the first device supply portion 14a or the second device supply portion 14b. The supply device transfer head 13 includes a plurality of hand units 131 as holding parts capable of holding the IC device 90. Each of the hand units 131 is provided with a suction nozzle similarly to the first hand unit 171a described later, and can hold the IC device. 90 and hold. In addition, in each hand unit 131 of the supply device transfer head 13, the temperature of the IC device 90 can be adjusted so that the IC device 90 can be cooled or heated in the same manner as the first temperature adjustment portion 12a or the second temperature adjustment portion 12b. It is constructed in a manner suitable for the inspection temperature.

第3托盤搬送機構15係將所有的IC器件90皆已移除之狀態之空的托盤200朝X方向搬送之機構。而且，於該搬送後，空的托盤200係藉由第2托盤搬送機構11B自供給區域A2返回至托盤供給區域A1。 The third tray transfer mechanism 15 is a mechanism that transfers the empty tray 200 in a state where all the IC devices 90 have been removed in the X direction. After the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray transfer mechanism 11B.

檢查區域A3係檢查IC器件90之區域。於該檢查區域A3中，設置有：第1載置部即第1器件供給部(第1電子零件載置部)(第1供給梭)14a，其可載置(配置)IC器件90而搬送(可移動)；第2載置部即第2器件供給部(第2電子零件載置部)(第2供給梭)14b，其可載置(配置)IC器件90而搬送(可移動)；檢查部16；第1檢查用器件搬送頭(第1電子零件固持部)17a；第2檢查用器件搬送頭(第2電子零件固持部)17b；載置部即第1器件回收部(第1回收梭)18a，其可載置、搬送IC器件90；及載置部即第2器件回收部(第2回收梭)18b，其可載置、搬送IC器件90。 The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, a first device supply portion (a first electronic component placement portion) (a first supply shuttle) 14a, which is a first placement portion, is provided (an IC device 90 can be placed (positioned) and transported). (Movable); the second mounting section, which is the second device supply section (second electronic component mounting section) (second supply shuttle) 14b, can mount (arrange) the IC device 90 and carry (movable); Inspection section 16; first inspection device transfer head (first electronic parts holding section) 17a; second inspection device transfer head (second electronic parts holding section) 17b; placement section which is the first device recovery section (first (Recycling shuttle) 18a, which can mount and transport IC devices 90; and a second component recovery section (second recycling shuttle) 18b, which is a mounting section, which can mount and transport IC devices 90.

第1器件供給部14a及第2器件供給部14b係分別將經溫度調整(溫度控制)後之檢查前之IC器件90搬送至檢查部16附近的裝置。 The first device supply unit 14 a and the second device supply unit 14 b are devices that transport the IC devices 90 before the inspection after temperature adjustment (temperature control) to the inspection unit 16, respectively.

第1器件供給部14a及第2器件供給部14b分別具有載置(配置)IC器件90之配置板142、及可朝X方向移動之器件供給部本體141。於配置板142之上表面，設置有收容(保持)IC器件90之凹部即複數個凹穴145。另，於圖示之構成中，凹穴145係於X方向為4個、Y方向為2個之合計8個以矩陣狀排列。該配置板142可裝卸地設置於器件供給部本 體141。第1器件供給部14a及第2器件供給部14b係分別可沿X方向於供給區域A2與檢查區域A3之間移動地被支持。又，第1器件供給部14a與第2器件供給部14b係沿Y方向配置，第1溫度調整部12a或第2溫度調整部12b上之IC器件90係藉由供給用器件搬送頭13，被搬送、載置於第1器件供給部14a或第2器件供給部14b。另，第1器件供給部14a係與第1溫度調整部12a同樣地，可冷卻IC器件90而將該IC器件90之溫度調整(可設定)為適合檢查之溫度(第1溫度)。又，第2器件供給部14b係與第2溫度調整部12b同樣地，可加熱IC器件90而將該IC器件90之溫度調整(可設定)為適合檢查之溫度(第2溫度)。 The first device supply unit 14a and the second device supply unit 14b each include a layout plate 142 on which the IC device 90 is placed (arranged), and a device supply unit body 141 that is movable in the X direction. On the upper surface of the configuration plate 142, a plurality of recesses 145 are provided, which are recesses for accommodating (holding) the IC device 90. In the configuration shown in the figure, a total of eight recesses 145 are arranged in a matrix in the form of four in the X direction and two in the Y direction. This layout plate 142 is detachably provided in the device supply unit 体 141. The first device supply portion 14a and the second device supply portion 14b are supported so as to be movable between the supply area A2 and the inspection area A3 in the X direction, respectively. The first device supply portion 14a and the second device supply portion 14b are arranged along the Y direction. The IC device 90 on the first temperature adjustment portion 12a or the second temperature adjustment portion 12b is transferred by the supply device transfer head 13. The first device supply unit 14a or the second device supply unit 14b is transported and placed. The first device supply unit 14a can cool the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature (first temperature) suitable for inspection, similarly to the first temperature adjustment unit 12a. The second device supply unit 14b is similar to the second temperature adjustment unit 12b in that it can heat the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature (second temperature) suitable for inspection.

另，由第1器件供給部14a及第2器件供給部14b構成電子零件載置部(供給梭)。 The first component supply portion 14a and the second component supply portion 14b constitute an electronic component mounting portion (supply shuttle).

檢查部16係檢查/測試IC器件90之電氣特性(進行電氣檢查)的單元，亦即於檢查IC器件90時保持該IC器件90的構件。 The inspection section 16 is a unit that inspects / tests the electrical characteristics (performs an electrical inspection) of the IC device 90, that is, a component that holds the IC device 90 when inspecting the IC device 90.

檢查部16具有保持IC器件90之保持構件162、及支持保持構件162之檢查部本體161。保持構件162可裝卸地設置於檢查部本體161。 The inspection section 16 includes a holding member 162 that holds the IC device 90 and an inspection section body 161 that supports the holding member 162. The holding member 162 is detachably provided in the inspection unit body 161.

於檢查部16之保持構件162之上表面，設置有收容(保持)IC器件90之凹部，即複數個保持部163。另，於圖示之構成中，保持部163係X方向為4個、Y方向為2個之合計8個以矩陣狀排列。IC器件90收容於保持部163，藉此而配置(載置)於檢查部16。 On the upper surface of the holding member 162 of the inspection section 16, there are provided a plurality of holding portions 163, which are concave portions for accommodating (holding) the IC device 90. In addition, in the configuration shown in the figure, a total of eight holding portions 163 are arranged in a matrix in the form of four in the X direction and two in the Y direction. The IC device 90 is housed in the holding portion 163 and is thereby placed (mounted) on the inspection portion 16.

又，於與檢查部16之各保持部163對應之位置，分別設置有以IC器件90保持於保持部163之狀態，與該IC器件90之端子電性連接之探針針腳。而且，IC器件90之端子與探針針腳電性連接(接觸)，經由探針針腳進行IC器件90之檢查。IC器件90之檢查係基於連接於檢查部16之未圖示之測試器所具備之檢查控制部之記憶部中記憶之程式進行。 Further, probe pins are provided at positions corresponding to the respective holding portions 163 of the inspection portion 16 in a state where the IC device 90 is held on the holding portion 163 and are electrically connected to the terminals of the IC device 90. In addition, the terminals of the IC device 90 are electrically connected (contacted) with the probe pins, and the inspection of the IC device 90 is performed through the probe pins. The inspection of the IC device 90 is performed based on a program stored in a memory section of an inspection control section provided in a tester (not shown) connected to the inspection section 16.

再者，檢查部16之8個保持部163中之圖1A中下側之4個保持部163係與第1溫度調整部12a同樣地，構成可冷卻IC器件90而將該IC器 件90之溫度調整(可設定)為適合檢查之溫度(第1溫度)的第1溫度設定部166。又，檢查部16之8個保持部163中之圖1A中上側之4個保持部163係與第2溫度調整部12b同樣地，構成可加熱IC器件90而將該IC器件90之溫度調整(可設定)為適合檢查之溫度(第2溫度)的第2溫度設定部167。 It should be noted that among the eight holding portions 163 of the inspection portion 16, the four holding portions 163 on the lower side in FIG. 1A are similar to the first temperature adjustment portion 12 a, and are configured to cool the IC device 90 and connect the IC device. The first temperature setting unit 166 adjusts the temperature of the element 90 (settable) to a temperature (first temperature) suitable for inspection. In addition, the four holding portions 163 on the upper side of the eight holding portions 163 of the inspection portion 16 in FIG. 1A are configured to heat the IC device 90 and adjust the temperature of the IC device 90 similarly to the second temperature adjusting portion 12b ( The second temperature setting unit 167 can be set to a temperature (second temperature) suitable for inspection.

第1檢查用器件搬送頭17a及第2檢查用器件搬送頭17b係分別可於檢查區域A3內朝Y方向及Z方向移動地被支持。又，第1檢查用器件搬送頭17a與第2檢查用器件搬送頭17b係沿Y方向配置。第1檢查用器件搬送頭17a可將自供給區域A2搬入之第1器件供給部14a上之IC器件90搬送、載置於檢查部16上，且，可將檢查部16上之IC器件90搬送、載置於第1器件回收部18a上。同樣地，第2檢查用器件搬送頭17b可將自供給區域A2搬入之第2器件供給部14b上之IC器件90搬送、載置於檢查部16上，且，可將檢查部16上之IC器件90搬送、載置於第2器件回收部18b上。又，於檢查IC器件90之情形時，第1檢查用器件搬送頭17a及第2檢查用器件搬送頭17b分別將IC器件90朝檢查部16進行按壓，藉此，使IC器件90抵接於檢查部16。藉此，如上述般，IC器件90之端子與檢查部16之探針針腳電性連接。 The first inspection device transfer head 17a and the second inspection device transfer head 17b are supported so as to be movable in the Y direction and the Z direction in the inspection area A3, respectively. The first inspection device transfer head 17a and the second inspection device transfer head 17b are arranged in the Y direction. The first inspection device transfer head 17 a can transport and place the IC devices 90 on the first device supply section 14 a carried in from the supply area A2 and place them on the inspection section 16, and can transport the IC devices 90 on the inspection section 16. And placed on the first device recovery unit 18a. Similarly, the second inspection device transfer head 17b can transfer and place the IC devices 90 on the second device supply section 14b carried in from the supply area A2 and place them on the inspection section 16, and the IC on the inspection section 16 can The device 90 is transported and placed on the second device recovery unit 18b. When inspecting the IC device 90, the first inspection device transfer head 17a and the second inspection device transfer head 17b press the IC device 90 toward the inspection portion 16, respectively, and thereby the IC device 90 is brought into contact with Examination Department 16. Accordingly, as described above, the terminals of the IC device 90 are electrically connected to the probe pins of the inspection unit 16.

第1檢查用器件搬送頭17a係如圖1B所示般，具有可固持IC器件90之複數個第1手單元(第1固持部)171a。另，於圖示之構成中，第1手單元171a係由X方向4個、Y方向2個之合計8個以矩陣狀排列。同樣地，第2檢查用器件搬送頭17b具有可固持IC器件90之複數個第2手單元(第2固持部)171b。另，於圖示之構成中，第2手單元171b係X方向為4個、Y方向為2個之合計8個以矩陣狀排列。 As shown in FIG. 1B, the first inspection device transfer head 17 a includes a plurality of first hand units (first holding portions) 171 a capable of holding the IC device 90. In the configuration shown in the figure, the first hand unit 171a is arranged in a matrix form with a total of eight in the X direction and two in the Y direction. Similarly, the second inspection device transfer head 17 b includes a plurality of second hand units (second holding portions) 171 b capable of holding the IC device 90. In addition, in the configuration shown in the figure, a total of eight second hand units 171b are arranged in a matrix in the form of four in the X direction and two in the Y direction.

因各第1手單元171a及各第2手單元171b之構成相同，故以下以1個第1手單元171a為代表進行說明。第1手單元171a具有保持IC器件90之固持構件173、及支持固持構件173之手單元本體172。固持構件173 可裝卸地設置於手單元本體172。該第1手單元171a具備吸附嘴，藉由吸附而固持IC器件90。 Since the configurations of each of the first-hand units 171a and each of the second-hand units 171b are the same, a description will be given below using one first-hand unit 171a as a representative. The first hand unit 171 a includes a holding member 173 that holds the IC device 90 and a hand unit body 172 that supports the holding member 173. Holding member 173 The hand unit body 172 is detachably provided. The first hand unit 171a includes a suction nozzle, and holds the IC device 90 by suction.

再者，第1檢查用器件搬送頭17a之各第1手單元171a係與第1溫度調整部12a同樣地，各自冷卻IC器件90而可將IC器件90調整(可設定)為適合檢查之溫度(第1溫度)。 In addition, each of the first hand units 171a of the first inspection device transfer head 17a is the same as the first temperature adjustment unit 12a, and each of the IC devices 90 is cooled, and the IC devices 90 can be adjusted (settable) to a temperature suitable for inspection. (1st temperature).

又，第2檢查用器件搬送頭17b之各第2手單元171b，係分別與第2溫度調整部12b同樣地，可加熱IC器件90而將IC器件90調整(可設定)為適合檢查之溫度(第2溫度)。 In addition, each of the second hand units 171b of the second inspection device transfer head 17b can heat the IC device 90 and adjust (settable) the IC device 90 to a temperature suitable for inspection, similarly to the second temperature adjustment section 12b. (2nd temperature).

另，由第1檢查用器件搬送頭17a及第2檢查用器件搬送頭17b構成電子零件固持部。 The first inspection device transfer head 17a and the second inspection device transfer head 17b constitute an electronic component holding portion.

第1器件回收部18a及第2器件回收部18b係分別將在檢查部16完成檢查之IC器件90搬送至回收區域A4的裝置。 The first device recovery unit 18a and the second device recovery unit 18b are devices that transport the IC devices 90 that have been inspected by the inspection unit 16 to the recovery area A4, respectively.

第1器件回收部18a及第2器件回收部18b分別具有載置(配置)IC器件90之配置板182、及可朝X方向移動之器件回收部本體181。於配置板182之上表面，設置有收容(保持)IC器件90之凹部，即複數個凹穴185。另，於圖示之構成中，凹穴185係X方向為4個、Y方向為2個之合計8個以矩陣狀排列。該配置板182可裝卸地安裝於器件回收部本體181。第1器件回收部18a及第2器件回收部18b係分別可沿X方向於檢查區域A3與回收區域A4之間移動地被支持。又，第1器件回收部18a與第2器件回收部18b係沿Y方向配置。檢查部16上之IC器件90係藉由第1檢查用器件搬送頭17a，被搬送、載置於第1器件回收部18a，或藉由第2檢查用器件搬送頭17b，被搬送、載置於第2器件回收部18b。 The first device recovery unit 18a and the second device recovery unit 18b each include a layout plate 182 on which the IC device 90 is placed (arranged), and a device recovery unit body 181 that is movable in the X direction. On the upper surface of the configuration plate 182, there are provided a plurality of recesses 185 for receiving (holding) the IC device 90. In the configuration shown in the figure, a total of eight recesses 185 are arranged in a matrix in the form of four in the X direction and two in the Y direction. The arrangement plate 182 is detachably attached to the device recovery portion main body 181. The first device recovery unit 18a and the second device recovery unit 18b are supported to be movable between the inspection area A3 and the recovery area A4 in the X direction, respectively. The first device recovery unit 18a and the second device recovery unit 18b are arranged along the Y direction. The IC device 90 on the inspection unit 16 is transported and placed in the first inspection unit 18a by the first inspection device transfer head 17a, or is transported and placed by the second inspection device transfer head 17b. In the second device recovery section 18b.

另，於本實施形態中，雖第1器件回收部18a與第1器件供給部14a係以相互獨立移動之方式構成，但並非限定於此，例如，亦可以第1器件回收部18a與第1器件供給部14a連結或一體化，使第1器件回收部18a與第1器件供給部14a一體移動之方式構成。同樣地，於本實施形 態中，雖第2器件回收部18b與第2器件供給部14b係以相互獨立移動之方式構成，但並非限定於此，例如，亦可以第2器件回收部18b與第2器件供給部14b連結或一體化，使第2器件回收部18b與第2器件供給部14b一體移動之方式構成。 In this embodiment, the first device recovery unit 18a and the first device supply unit 14a are configured to move independently from each other, but the invention is not limited to this. For example, the first device recovery unit 18a and the first device The device supply unit 14a is connected or integrated to move the first device recovery unit 18a and the first device supply unit 14a together. Similarly, in this embodiment In this state, the second device recovery unit 18b and the second device supply unit 14b are configured to move independently from each other, but the invention is not limited to this. For example, the second device recovery unit 18b and the second device supply unit 14b may be connected. Alternatively, the second device recovery unit 18b and the second device supply unit 14b are integrally moved.

回收區域A4係回收完成檢查之IC器件90的區域。於該回收區域A4中，設置有回收用托盤19、回收用器件搬送頭20、及第6托盤搬送機構21。又，於回收區域A4中，亦備有空的托盤200。 The recovery area A4 is an area in which the IC devices 90 having been inspected are recovered. In the collection area A4, a collection tray 19, a collection device transfer head 20, and a sixth tray transfer mechanism 21 are provided. An empty tray 200 is also provided in the collection area A4.

回收用托盤19固定於回收區域A4內，於本實施形態中，沿X方向配置有3個。又，空的托盤200亦沿X方向配置有3個。而且，移動至回收區域A4之第1器件回收部18a或第2器件回收部18b上之IC器件90被搬送、載置於該等回收用托盤19及空的托盤200中之任一者。藉此，IC器件90係根據各個檢查結果而加以回收及分類。 The collection trays 19 are fixed in the collection area A4. In the present embodiment, three collection trays 19 are arranged in the X direction. Three empty trays 200 are also arranged in the X direction. Then, the IC device 90 on the first device recovery section 18 a or the second device recovery section 18 b moved to the recovery area A4 is transported and placed in any one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified based on the results of each inspection.

回收用器件搬送頭20係可於回收區域A4內朝X方向、Y方向及Z方向移動地被支持。藉此，回收用器件搬送頭20可將IC器件90自第1器件回收部18a或第2器件回收部18b，搬送至回收用托盤19或空的托盤200。另，回收用器件搬送頭20具有複數個手單元201作為可固持IC器件90之固持部，各手單元201係與上述第1手單元171a同樣地，具備吸附嘴，可藉由吸附固持IC器件90。 The recovery device transfer head 20 is supported to be movable in the X direction, the Y direction, and the Z direction within the recovery area A4. Thereby, the recovery device transfer head 20 can transfer the IC device 90 from the first device recovery unit 18 a or the second device recovery unit 18 b to the recovery tray 19 or the empty tray 200. In addition, the recycling device transfer head 20 has a plurality of hand units 201 as holding parts capable of holding the IC device 90. Each hand unit 201 is provided with a suction nozzle similar to the first hand unit 171a, and can hold and hold the IC device by suction. 90.

第6托盤搬送機構21係將自托盤移除區域A5搬入之空的托盤200朝X方向搬送之機構。而且，於該搬送後，空的托盤200置於回收IC器件90之位置，亦即其可能成為上述3個空的托盤200中之任一者。 The sixth tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the X direction. Furthermore, after the transfer, the empty tray 200 is placed at a position where the IC device 90 is recycled, that is, it may become any of the three empty trays 200 described above.

托盤移除區域A5係回收及移除排列有檢查完畢狀態之複數個IC器件90之托盤200的區域。另，於托盤移除區域A5中，可堆疊多個托盤200。 The tray removal area A5 is an area for collecting and removing the trays 200 in which the plurality of IC devices 90 in the inspected state are arranged. In the tray removal area A5, a plurality of trays 200 can be stacked.

再者，設置有以跨及回收區域A4與托盤移除區域A5之方式逐個搬送托盤200之第4托盤搬送機構22A、第5托盤搬送機構22B。第4托 盤搬送機構22A係將載置有檢查完畢之IC器件90之托盤200自回收區域A4搬送至托盤移除區域A5的機構。第5托盤搬送機構22B係將用於回收IC器件90之空的托盤200自托盤移除區域A5搬送至回收區域A4的機構。 Furthermore, a fourth tray transfer mechanism 22A and a fifth tray transfer mechanism 22B are provided to transfer the tray 200 one by one so as to span the recovery area A4 and the tray removal area A5. No. 4 The disk transfer mechanism 22A is a mechanism that transfers the tray 200 on which the IC devices 90 having been inspected are loaded from the recovery area A4 to the tray removal area A5. The fifth tray transfer mechanism 22B is a mechanism that transfers the empty tray 200 for collecting the IC devices 90 from the tray removal area A5 to the collection area A4.

又，上述測試器之檢查控制部係例如基於未圖示之記憶部中記憶之程式，而進行配置於檢查部16之IC器件90之電氣特性之(電氣)檢查等。 The inspection control unit of the tester performs, for example, an (electrical) inspection of the electrical characteristics of the IC device 90 arranged in the inspection unit 16 based on a program stored in a memory unit (not shown).

又，如圖2所示，檢查裝置1包含控制部80、電性連接於控制部80且進行檢查裝置1之各操作之操作部6、冷卻IC器件90之冷卻機構41、42、43及44、及加熱IC器件90之加熱機構51、52、53及54。 As shown in FIG. 2, the inspection device 1 includes a control unit 80, an operation unit 6 electrically connected to the control unit 80 and performing each operation of the inspection device 1, and cooling mechanisms 41, 42, 43, and 44 for cooling the IC device 90. And heating mechanisms 51, 52, 53 and 54 for heating the IC device 90.

控制部80具有記憶各資訊(資料)之記憶部801等，例如控制第1托盤搬送機構11A、第2托盤搬送機構11B、第1溫度調整部12a、第2溫度調整部12b、供給用器件搬送頭13、第1器件供給部14a、第2器件供給部14b、第3托盤搬送機構15、第1檢查用器件搬送頭17a、第2檢查用器件搬送頭17b、第1器件回收部18a、第2器件回收部18b、回收用器件搬送頭20、第6托盤搬送機構21、第4托盤搬送機構22A、第5托盤搬送機構22B、顯示部62、冷卻機構41~44、加熱機構51~54等各部之驅動。 The control unit 80 includes a memory unit 801 that stores various information (data), for example, controls the first tray transfer mechanism 11A, the second tray transfer mechanism 11B, the first temperature adjustment unit 12a, the second temperature adjustment unit 12b, and the supply device transfer. Head 13, first device supply unit 14a, second device supply unit 14b, third tray transport mechanism 15, first inspection device transport head 17a, second inspection device transport head 17b, first device recovery unit 18a, first 2 Device recovery unit 18b, recovery device transfer head 20, sixth tray transfer mechanism 21, fourth tray transfer mechanism 22A, fifth tray transfer mechanism 22B, display portion 62, cooling mechanism 41 to 44, heating mechanism 51 to 54, etc. The drive of each department.

再者，操作部6具有進行各輸入之輸入部61、及顯示圖像等各資訊(資料)之顯示部62。作為輸入部61，並未特別限定，例如，可枚舉鍵盤、滑鼠等。又，作為顯示部62，並未特別限定，例如，可枚舉液晶顯示面板、有機EL顯示面板等。作業員(操作者)對操作部6之操作係例如藉由操作輸入部61、使游標移動至顯示部62所顯示之各操作按鈕(圖標)之位置並進行選擇(點擊)而進行。 In addition, the operation unit 6 includes an input unit 61 that performs each input, and a display unit 62 that displays various information (data) such as an image. The input unit 61 is not particularly limited, and examples thereof include a keyboard and a mouse. The display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel and an organic EL display panel. The operation of the operation unit 6 by the operator (operator) is performed by, for example, operating the input unit 61, moving the cursor to the position of each operation button (icon) displayed on the display unit 62, and selecting (clicking).

另，作為輸入部61，並非限定於上述構成者，例如，亦可枚舉按壓式按鈕等機械式操作按鈕等。又，作為操作部6，並非限定於上 述構成者，例如，亦可枚舉觸控面板等可顯示輸入及資訊的器件等。 The input unit 61 is not limited to the above-mentioned configuration, and for example, a mechanical operation button such as a push button may be enumerated. The operation unit 6 is not limited to the above. The constituents described above may, for example, enumerate devices such as a touch panel that can display input and information.

另，冷卻機構41冷卻第1溫度調整部12a，藉由該第1溫度調整部12a冷卻IC器件90。又，冷卻機構42冷卻第1器件供給部14a，藉由該第1器件供給部14a冷卻IC器件90。又，冷卻機構43冷卻第1檢查用器件搬送頭17a，藉由該第1檢查用器件搬送頭17a冷卻IC器件90。又，冷卻機構44冷卻檢查部16之8個保持部163中之圖1A中下側之4個保持部163，亦即第1溫度設定部166，藉由該第1溫度設定部166冷卻IC器件90。 The cooling mechanism 41 cools the first temperature adjustment section 12a, and cools the IC device 90 by the first temperature adjustment section 12a. The cooling mechanism 42 cools the first device supply unit 14a, and the IC device 90 is cooled by the first device supply unit 14a. The cooling mechanism 43 cools the first inspection device transfer head 17a, and cools the IC device 90 by the first inspection device transfer head 17a. In addition, the cooling mechanism 44 cools the four holding parts 163 of the eight holding parts 163 of the inspection part 16 in the lower side in FIG. 1A, that is, the first temperature setting part 166, and cools the IC device by the first temperature setting part 166. 90.

作為冷卻機構41~44，並未特別限定，例如，可枚舉使冷媒(例如，使液氮氣化而成之氮氣等低溫氣體等)流動於配置於冷卻對象物或其附近之管體內而進行冷卻之裝置、及帕爾帖元件等。 The cooling mechanisms 41 to 44 are not particularly limited. For example, it is possible to enumerate the flow of a refrigerant (for example, a low-temperature gas such as nitrogen generated by liquid nitrogen) into a tube disposed in or near a cooling object. Cooling devices, and Peltier elements.

又，加熱機構51加熱第2溫度調整部12b，藉由該第2溫度調整部12b加熱IC器件90。又，加熱機構52加熱第2器件供給部14b，藉由該第2器件供給部14b加熱IC器件90。又，加熱機構53加熱第2檢查用器件搬送頭17b，藉由該第2檢查用器件搬送頭17b，加熱IC器件90。又，加熱機構54加熱檢查部16之8個保持部163中之圖1A中上側之4個保持部163，亦即第2溫度設定部167，藉由該第2溫度設定部167加熱IC器件90。 In addition, the heating mechanism 51 heats the second temperature adjustment portion 12b, and the IC device 90 is heated by the second temperature adjustment portion 12b. The heating mechanism 52 heats the second device supply unit 14b, and the IC device 90 is heated by the second device supply unit 14b. The heating mechanism 53 heats the second inspection device transfer head 17b, and the second inspection device transfer head 17b heats the IC device 90. In addition, the heating mechanism 54 heats the four holding portions 163 on the upper side of the eight holding portions 163 of the inspection portion 16 in FIG. 1A, that is, the second temperature setting portion 167, and the IC device 90 is heated by the second temperature setting portion 167. .

作為加熱機構51~54，並未特別限定，例如，可枚舉具有電熱線之加熱器等。 The heating means 51 to 54 are not particularly limited, and examples thereof include heaters having electric heating wires and the like.

於此種檢查裝置1中，可並行進行將IC器件90冷卻至特定溫度而進行之低溫檢查、及將IC器件90加熱至特定溫度而進行之高溫檢查之各者。 In such an inspection device 1, each of a low-temperature inspection performed by cooling the IC device 90 to a specific temperature and a high-temperature inspection performed by heating the IC device 90 at a specific temperature can be performed in parallel.

於進行低溫檢查之情形時，由第1器件供給部14a搬送經第1溫度調整部12a冷卻後之IC器件90並冷卻，接著，由第1檢查用器件搬送頭17a之第1手單元171a固持IC器件90並冷卻。此後，藉由第1檢查用器 件搬送頭17a搬送IC器件90，將IC器件90保持於檢查部16之第1溫度設定部166而進行低溫檢查。 In the case of a low-temperature inspection, the IC device 90 cooled by the first temperature adjustment unit 12a is transported by the first device supply unit 14a and cooled, and then held by the first hand unit 171a of the first inspection device transport head 17a The IC device 90 is cooled. After that, with the first inspection device The component transfer head 17 a transfers the IC device 90 and holds the IC device 90 at the first temperature setting unit 166 of the inspection unit 16 to perform a low-temperature inspection.

又，於進行高溫檢查之情形時，由第2器件供給部14b搬送經第2溫度調整部12b加熱後之IC器件90並加熱，接著，由第2檢查用器件搬送頭17b之第2手單元171b固持IC器件90並加熱。而且，藉由第2檢查用器件搬送頭17b搬送IC器件90，將IC器件90保持於檢查部16之第2溫度設定部167而進行高溫檢查。 When a high-temperature inspection is performed, the IC device 90 heated by the second temperature adjustment unit 12b is transported by the second device supply unit 14b and heated, and then the second hand unit of the second inspection device transport head 17b is transported and heated. 171b holds the IC device 90 and heats it. Then, the IC device 90 is transported by the second inspection device transfer head 17 b, and the IC device 90 is held in the second temperature setting section 167 of the inspection section 16 to perform a high-temperature inspection.

另，由第1器件供給部14a及第1檢查用器件搬送頭17a等構成可搬送IC器件90，將IC器件90調整為第1溫度之第1搬送部。又，由第2器件供給部14b及第2檢查用器件搬送頭17b等構成可搬送IC器件90，將IC器件90調整為第2溫度之第2搬送部。 The first device supply unit 14a, the first inspection device transfer head 17a, and the like constitute a first transfer unit that can transfer the IC device 90, and adjust the IC device 90 to a first temperature. Further, the second device supply unit 14b, the second inspection device transfer head 17b, and the like constitute a second transfer unit that can transfer the IC device 90, and adjust the IC device 90 to a second temperature.

如以上所說明般，根據該檢查裝置1，可進行IC器件90之低溫檢查及高溫檢查之各者，便利性較高。 As described above, according to the inspection device 1, each of the low-temperature inspection and the high-temperature inspection of the IC device 90 can be performed, and the convenience is high.

又，因可並行進行低溫檢查與高溫檢查，故可提高產出量。 In addition, since the low-temperature inspection and the high-temperature inspection can be performed in parallel, the throughput can be increased.

<第2實施形態> <Second Embodiment>

圖3~圖11係分別用於說明本發明之電子零件檢查裝置之第2實施形態之動作的圖。 3 to 11 are diagrams for explaining the operation of the second embodiment of the electronic component inspection device of the present invention.

另，於圖3~圖11中，因第1檢查用器件搬送頭及第2檢查用器件搬送頭與其他構件重疊，故以兩點鏈線示意之。 In addition, in FIG. 3 to FIG. 11, since the first inspection device transfer head and the second inspection device transfer head overlap with other members, they are indicated by two-dot chain lines.

以下，就第2實施形態進行說明，但就與上述第1實施形態之不同點為中心進行說明，相同之項則省略其說明。 Hereinafter, the second embodiment will be described, but the differences from the first embodiment described above will be mainly described, and descriptions of the same items will be omitted.

於第2實施形態之檢查裝置1中，對IC器件90，首先進行低溫檢查，其次，進行高溫檢查，其後，將完成上述檢查之IC器件90搬送(回收)至回收區域A4。因此，於進行低溫檢查及高溫檢查之情形中，可提高產出量。又，因IC器件90並非以低溫狀態，而是以高溫狀態被搬送至回收區域A4，故可防止IC器件90之結露。以下，說明檢查裝 置1之動作。 In the inspection device 1 of the second embodiment, the IC device 90 is firstly subjected to a low-temperature inspection, and secondly, a high-temperature inspection is performed. Thereafter, the IC device 90 that has completed the inspection is transferred (recovered) to the recovery area A4. Therefore, in the case of performing a low-temperature inspection and a high-temperature inspection, the throughput can be increased. In addition, since the IC device 90 is transported to the recovery area A4 not in a low temperature state, but in a high temperature state, dew condensation of the IC device 90 can be prevented. The following explains the inspection equipment. Set to 1.

首先，如圖3所示，IC器件90配置於第1器件供給部14a之圖3中上側之4個凹穴145而被冷卻。另，IC器件90亦可配置於第1器件供給部14a之圖3中下側之4個凹穴145。 First, as shown in FIG. 3, the IC device 90 is disposed in the four recesses 145 on the upper side in FIG. 3 of the first device supply portion 14 a and is cooled. In addition, the IC device 90 may be disposed in the four recesses 145 on the lower side in FIG. 3 of the first device supply portion 14a.

其次，如圖4所示，藉由第1器件供給部14a，一面冷卻IC器件90，一面將其搬送至與檢查部16對應之位置。 Next, as shown in FIG. 4, the IC device 90 is cooled by the first device supply unit 14 a and is transported to a position corresponding to the inspection unit 16.

其次，如圖5所示，藉由第1檢查用器件搬送頭17a之第1手單元171a，固持、冷卻IC器件90。 Next, as shown in FIG. 5, the IC device 90 is held and cooled by the first hand unit 171a of the first inspection device transfer head 17a.

接著，如圖6所示，藉由第1檢查用器件搬送頭17a，一面冷卻IC器件90，一面將其搬送至檢查部16之第1溫度設定部166而進行低溫檢查。 Next, as shown in FIG. 6, the first inspection device transfer head 17 a cools the IC device 90 and transports it to the first temperature setting unit 166 of the inspection unit 16 to perform a low-temperature inspection.

該低溫檢查後，進行高溫檢查，且針對完成低溫檢查之所有IC器件90進行高溫檢查，但較佳為僅對在低溫檢查中合格之IC器件90進行高溫檢查，無需對不合格之IC器件90進行高溫檢查。藉此，可縮短高溫檢查所需之時間。 After the low-temperature inspection, a high-temperature inspection is performed, and high-temperature inspection is performed for all IC devices 90 that have completed the low-temperature inspection. However, it is preferable to perform high-temperature inspection only on IC devices 90 that pass the low-temperature inspection, and it is not necessary to perform inspection on unqualified IC devices 90 Check for high temperatures. This can shorten the time required for high-temperature inspection.

接著，如圖7所示，藉由第2檢查用器件搬送頭17b之第2手單元171b固持、加熱IC器件90。另，此處，亦可維持藉由第1檢查用器件搬送頭17a之第1手單元171a固持IC器件90之狀態。又，第2器件供給部14b移動至與檢查部16對應之位置。 Next, as shown in FIG. 7, the IC device 90 is held and heated by the second hand unit 171 b of the second inspection device transfer head 17 b. Here, the state in which the IC device 90 is held by the first hand unit 171a of the first inspection device transfer head 17a may be maintained. The second device supply unit 14 b is moved to a position corresponding to the inspection unit 16.

其次，如圖8所示，藉由第2檢查用器件搬送頭17b，一面加熱IC器件90，一面將其搬送至與第2器件供給部14b對應之位置，而配置於其凹穴145。而且，藉由第2器件供給部14b，將IC器件90加熱至特定溫度為止。 Next, as shown in FIG. 8, the IC device 90 is heated by the second inspection device transfer head 17b, and is transported to a position corresponding to the second device supply portion 14b while being disposed in the recess 145 thereof. Then, the IC device 90 is heated to a specific temperature by the second device supply unit 14b.

其次，如圖9所示，藉由第2檢查用器件搬送頭17b之第2手單元171b，一面固持、加熱IC器件90，一面將其搬送至檢查部16之第2溫度設定部167而進行高溫檢查。又，第2器件回收部18b移動至與檢查 部16對應之位置。 Next, as shown in FIG. 9, the second hand unit 171 b of the second inspection device transfer head 17 b holds and heats the IC device 90 while transferring it to the second temperature setting unit 167 of the inspection unit 16. High temperature check. The second device recovery unit 18b moves to and inspects The position corresponding to the section 16.

其次，如圖10所示，藉由第2檢查用器件搬送頭17b，將IC器件90搬送至與第2器件回收部18b對應之位置，並配置於其凹穴185。而且，如圖11所示，藉由第2器件回收部18b，將IC器件90搬送至回收區域A4。另，該IC器件90之朝回收區域A4之搬送係藉由第1器件回收部18a進行。 Next, as shown in FIG. 10, the IC device 90 is transported to a position corresponding to the second device recovery unit 18 b by the second inspection device transport head 17 b and is disposed in the recess 185. As shown in FIG. 11, the IC device 90 is transported to the recovery area A4 by the second device recovery unit 18 b. The transfer of the IC device 90 to the collection area A4 is performed by the first device collection unit 18a.

如以上所說明般，根據該檢查裝置1，可進行IC器件90之低溫檢查及高溫檢查之各者，便利性較高。 As described above, according to the inspection device 1, each of the low-temperature inspection and the high-temperature inspection of the IC device 90 can be performed, and the convenience is high.

再者，於對1個IC器件90進行低溫檢查及高溫檢查之情形時，無需暫時回收IC器件90，即可進行該低溫檢查及高溫檢查，藉此，可提高產出量。 Furthermore, in the case of performing low-temperature inspection and high-temperature inspection on one IC device 90, the low-temperature inspection and high-temperature inspection can be performed without temporarily recovering the IC device 90, thereby increasing the output.

<第3實施形態> <Third Embodiment>

圖12A~圖19係分別用於說明本發明之電子零件檢查裝置之第3實施形態之動作的圖。 FIGS. 12A to 19 are diagrams for explaining the operation of the third embodiment of the electronic component inspection apparatus of the present invention.

另，於圖12A~圖19中，因第1檢查用器件搬送頭及第2檢查用器件搬送頭與其他構件重疊，故以兩點鏈線示意之。又，於說明圖12A之第1檢查用器件搬送頭及第2檢查用器件搬送頭時，於圖12B中記載第1檢查用器件搬送頭及第2檢查用器件搬送頭。 In addition, in FIGS. 12A to 19, the first inspection device transfer head and the second inspection device transfer head overlap with other members, so they are indicated by two-dot chain lines. In describing the first inspection device transfer head and the second inspection device transfer head in FIG. 12A, the first inspection device transfer head and the second inspection device transfer head are described in FIG. 12B.

以下，就第3實施形態進行說明，但以與上述第1實施形態之不同點為中心進行說明，相同之項則省略其說明。 Hereinafter, the third embodiment will be described, but the differences from the first embodiment described above will be mainly described, and descriptions of the same items will be omitted.

如圖12A及圖12B所示，於第3實施形態之檢查裝置1中，第1檢查用器件搬送頭17a之8個第1手單元171a中之圖12A及圖12B中下側之4個第1手單元171a構成器件搬送頭第1溫度設定部(第1電子零件固持部溫度設定部)176，其可冷卻IC器件90而將該IC器件90之溫度調整(可設定)為適合檢查之溫度(第1溫度)。又，第1檢查用器件搬送頭17a之8個第1手單元171a中之圖12A及圖12B中上側之4個第1手單元171a構成 器件搬送頭第2溫度設定部(第2電子零件固持部溫度設定部)177，其可加熱IC器件90而將該IC器件90之溫度調整(可設定)為適合檢查之溫度(第2溫度)。 As shown in FIGS. 12A and 12B, in the inspection device 1 of the third embodiment, among the eight first hand units 171a of the eight first hand units 171a of the first inspection device transfer head 17a, the four fourth The one-hand unit 171a constitutes the first temperature setting section (the first electronic component holding section temperature setting section) 176 of the device transfer head, which can cool the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature suitable for inspection. (1st temperature). 12A and 12B of the eight first-hand units 171a of the eighth first-hand unit 171a of the first inspection device transfer head 17a are configured as four first-hand units 171a. Device transfer head second temperature setting section (second electronic component holding section temperature setting section) 177, which can heat the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature suitable for inspection (second temperature) .

同樣地，第2檢查用器件搬送頭17b之8個第2手單元171b中之圖12A及圖12B中下側之4個第2手單元171b構成器件搬送頭第1溫度設定部(第1電子零件固持部溫度設定部)176，其可冷卻IC器件90而將該IC器件90之溫度調整(可設定)為適合檢查之溫度(第1溫度)。又，第2檢查用器件搬送頭頭17b之8個第2手單元171b中之圖12A及圖12B中上側之4個第2手單元171b構成器件搬送頭第2溫度設定部(第2電子零件固持部溫度設定部)177，其可加熱IC器件90而將該IC器件90之溫度調整(可設定)為適合檢查之溫度(第2溫度)。 Similarly, the eight second hand units 171b of the second inspection device transfer head 17b of FIG. 12A and the lower four second hand units 171b of FIG. 12B constitute the first temperature setting unit of the device transfer head (first electronic The component holding portion temperature setting portion) 176 can cool the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature (first temperature) suitable for inspection. In addition, the eight second hand units 171b of the second inspection device transfer head 17b of FIG. 12A and the upper four second hand units 171b in FIG. 12B constitute the second temperature setting unit of the device transfer head (second electronic component holding The internal temperature setting unit) 177 can heat the IC device 90 to adjust (settable) the temperature of the IC device 90 to a temperature (second temperature) suitable for inspection.

又，第1器件供給部14a之8個凹穴145中之圖12A及圖12B中下側之4個凹穴145構成器件供給部第1溫度設定部(第1電子零件載置部溫度設定部)146，其可冷卻IC器件90而將該IC器件90之溫度調整(可設定)為適合檢查之溫度(第1溫度)。又，第1器件供給部14a之8個凹穴145中之圖12A及圖12B中上側之4個凹穴145構成器件供給部第2溫度設定部(第2電子零件載置部溫度設定部)147，其可加熱IC器件90而可將該IC器件90之溫度調整(可設定)為適合檢查之溫度(第2溫度)。 12A and 12B of the eight recesses 145 of the first device supply section 14a constitute the first temperature setting section of the device supply section (the temperature setting section of the first electronic component mounting section). 146), which can cool the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature (first temperature) suitable for inspection. 12A and 12B of the eight recesses 145 of the first device supply section 14a constitute the second temperature setting section of the device supply section (temperature setting section of the second electronic component mounting section). 147, which can heat the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature (second temperature) suitable for inspection.

同樣地，第2器件供給部14b之8個凹穴145中之圖12A及圖12B中下側之4個凹穴145構成器件供給部第1溫度設定部(第1電子零件載置部溫度設定部)146，其可冷卻IC器件90而將該IC器件90之溫度調整(可設定)為適合檢查之溫度(第1溫度)。又，第2器件供給部14b之8個凹穴145中之圖12A及圖12B中上側之4個凹穴145構成器件供給部第2溫度設定部(第2電子零件載置部溫度設定部)147，其可加熱IC器件90而將該IC器件90之溫度調整(可設定)為適合檢查之溫度(第2溫度)。 Similarly, the four recesses 145 of the eight recesses 145 of the second device supply section 14b in FIG. 12A and FIG. 12B constitute the first temperature setting section of the device supply section (temperature setting of the first electronic component mounting section) 146), which can cool the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature (first temperature) suitable for inspection. 12A and 12B of the eight recesses 145 of the second device supply portion 14b constitute the second temperature setting portion of the device supply portion (the temperature setting portion of the second electronic component mounting portion) 147, which can heat the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature (second temperature) suitable for inspection.

另，由器件供給部第1溫度設定部146及器件搬送頭第1溫度設定 部176等，構成搬送IC器件90，可將IC器件90設定為第1溫度之第1搬送部。又，由器件供給部第2溫度設定部147及器件搬送頭第2溫度設定部177等，構成搬送IC器件90，可將IC器件90設定為第2溫度之第2搬送部。 The first temperature setting unit 146 of the device supply unit and the first temperature setting of the device transfer head The unit 176 and the like constitute the first transfer unit that transfers the IC device 90, and the IC device 90 can be set to the first temperature. In addition, the second temperature setting unit 147 of the device supply unit, the second temperature setting unit 177 of the device transfer head, and the like configure the IC device 90 to be transported, and the IC device 90 can be set to the second temperature transport unit of the second temperature.

於該檢查裝置1中，對IC器件90，首先進行低溫檢查，其次，進行高溫檢查，其後，將完成上述檢查之IC器件90搬送(回收)至回收區域A4。因此，於進行低溫檢查及高溫檢查之情形時，可提高產出量。又，因IC器件90並非以低溫狀態，而是以高溫狀態被搬送至回收區域A4，故可防止IC器件90之結露。以下，說明檢查裝置1之動作，此處，以藉由第1器件供給部14a及第1檢查用器件搬送頭17a進行上述低溫檢查及高溫檢查中之IC器件90之搬送等之情形為代表進行說明。 In this inspection device 1, the IC device 90 is firstly subjected to a low-temperature inspection, and secondly, a high-temperature inspection is performed. After that, the IC device 90 that has completed the inspection is transferred (recovered) to the recovery area A4. Therefore, in the case of performing low-temperature inspection and high-temperature inspection, the output can be increased. In addition, since the IC device 90 is transported to the recovery area A4 not in a low temperature state, but in a high temperature state, dew condensation of the IC device 90 can be prevented. Hereinafter, the operation of the inspection device 1 will be described. Here, the case where the first low-temperature inspection and the high-temperature inspection of the IC device 90 during the above-mentioned low-temperature inspection and high-temperature inspection are performed by the first device supply unit 14a and the first inspection device transfer head 17a will be described as a representative. Instructions.

首先，如圖12A及圖12B所示，IC器件90配置於第1器件供給部14a之器件供給部第1溫度設定部146並被冷卻。 First, as shown in FIG. 12A and FIG. 12B, the IC device 90 is disposed in the device supply section first temperature setting section 146 of the first device supply section 14 a and is cooled.

其次，如圖13所示，藉由第1器件供給部14a冷卻IC器件90，並將其搬送至與檢查部16對應之位置。 Next, as shown in FIG. 13, the IC device 90 is cooled by the first device supply unit 14 a and is transported to a position corresponding to the inspection unit 16.

其次，如圖14所示，藉由第1檢查用器件搬送頭17a之器件搬送頭第1溫度設定部176，固持、冷卻IC器件90，並將其搬送至檢查部16之第1溫度設定部166而進行低溫檢查。 Next, as shown in FIG. 14, the IC device 90 is held and cooled by the first temperature setting unit 176 of the device transfer head of the first inspection device transfer head 17 a and transferred to the first temperature setting unit of the inspection unit 16. 166 and perform a low temperature inspection.

雖可於該低溫檢查後進行高溫檢查，亦可對完成低溫檢查之所有IC器件90進行高溫檢查，但較佳為僅對在低溫檢查中合格之IC器件90進行高溫檢查，無需對不合格之IC器件90進行高溫檢查。藉此，可縮短高溫檢查所需之時間。 Although the high temperature inspection can be performed after the low temperature inspection, and all IC devices 90 that have completed the low temperature inspection can also be subjected to the high temperature inspection, it is preferable to perform the high temperature inspection only on the IC devices 90 that pass the low temperature inspection, and it is not necessary to perform the high temperature inspection The IC device 90 performs a high-temperature inspection. This can shorten the time required for high-temperature inspection.

其次，如圖15所示，藉由第1檢查用器件搬送頭17a，將IC器件90搬送至與第1器件供給部14a對應之位置，並配置於該器件供給部第2溫度設定部147。而且，藉由器件供給部第2溫度設定部147，將IC器件90加熱至特定溫度為止。另，亦可省略藉由該器件供給部第2溫度 設定部147對IC器件90之加熱，而僅由後述之第1檢查用器件搬送頭17a之器件搬送頭第2溫度設定部177加熱IC器件90。 Next, as shown in FIG. 15, the IC device 90 is transported to a position corresponding to the first device supply unit 14 a by the first inspection device transfer head 17 a and is disposed in the device supply unit second temperature setting unit 147. The second temperature setting unit 147 of the device supply unit heats the IC device 90 to a specific temperature. It is also possible to omit the second temperature by the device supply section. The setting unit 147 heats the IC device 90, and the IC device 90 is heated only by the device transfer head second temperature setting unit 177 of the first inspection device transfer head 17a described later.

其次，如圖16所示，藉由第1檢查用器件搬送頭17a之器件搬送頭第2溫度設定部177，固持、加熱IC器件90，並如圖17所示，將該IC器件90搬送至檢查部16之第2溫度設定部167而進行高溫檢查。又，第1器件回收部18a移動至與檢查部16對應之位置。 Next, as shown in FIG. 16, the IC device 90 is held and heated by the device transfer head second temperature setting unit 177 of the first inspection device transfer head 17 a, and as shown in FIG. 17, the IC device 90 is transferred to The second temperature setting unit 167 of the inspection unit 16 performs a high-temperature inspection. The first device recovery unit 18 a moves to a position corresponding to the inspection unit 16.

其次，如圖18所示，藉由第1檢查用器件搬送頭17a，將IC器件90搬送至與第1器件回收部18a對應之位置，並配置於其凹穴185。此後，如圖19所示，藉由第1器件回收部18a，將IC器件90搬送至回收區域A4。 Next, as shown in FIG. 18, the IC device 90 is transported to a position corresponding to the first device recovery unit 18 a by the first inspection device transport head 17 a and is disposed in the recess 185 thereof. Thereafter, as shown in FIG. 19, the IC device 90 is transported to the recovery area A4 by the first device recovery unit 18 a.

以上，已對藉由第1器件供給部14a及第1檢查用器件搬送頭17a進行低溫檢查及高溫檢查中之IC器件90之搬送等之情形進行說明，但亦可藉由第2器件搬送部14b及第2檢查用器件搬送頭17b同樣地執行。 As described above, the case where the low-temperature inspection and the high-temperature inspection of the IC device 90 are performed by the first device supply unit 14a and the first inspection device transfer head 17a has been described, but the second device transport unit 14b and the second inspection device transfer head 17b are performed in the same manner.

又，亦可並行進行藉由第1器件供給部14a及第1檢查用器件搬送頭17a搬送IC器件90而進行之低溫檢查及高溫檢查，及藉由第2器件供給部14b及第2檢查用器件搬送頭17b搬送IC器件90而進行之低溫檢查及高溫檢查。藉此，可提高產出量。 In addition, the low-temperature inspection and the high-temperature inspection performed by the IC device 90 by the first device supply unit 14a and the first inspection device transfer head 17a, and the second inspection unit 14b and the second inspection may be performed in parallel. The low-temperature inspection and the high-temperature inspection performed by the device transfer head 17b for transferring the IC device 90. This can increase output.

如以上所說明般，根據該檢查裝置1，可進行IC器件90之低溫檢查及高溫檢查之各者，便利性較高。 As described above, according to the inspection device 1, each of the low-temperature inspection and the high-temperature inspection of the IC device 90 can be performed, and the convenience is high.

再者，於對1個IC器件90進行低溫檢查及高溫檢查之情形時，無需暫時回收IC器件90即可進行其低溫檢查及高溫檢查，藉此，可提高產出量。 Furthermore, in the case of performing a low-temperature inspection and a high-temperature inspection on one IC device 90, the low-temperature inspection and high-temperature inspection can be performed without temporarily recovering the IC device 90, thereby increasing the throughput.

另，於上述第2、第3實施形態中，首先進行低溫檢查，其後進行高溫檢查，但本發明並非限定於此，而亦可首先進行高溫檢查，其後進行低溫檢查。 In the second and third embodiments, the low-temperature inspection is performed first, and then the high-temperature inspection is performed. However, the present invention is not limited to this, but the high-temperature inspection may be performed first, and the low-temperature inspection may be performed thereafter.

<第4實施形態> <Fourth Embodiment>

圖20A係表示本發明之電子零件檢查裝置之第4實施形態之概略俯視圖。圖20B係用於說明圖20A之第1檢查用器件搬送頭及第2檢查用器件搬送頭之俯視圖。圖21係圖20A所示之電子零件檢查裝置之方塊圖。圖22~圖48分別為用於說明圖20A所示之電子零件檢查裝置之動作之圖。 FIG. 20A is a schematic plan view showing a fourth embodiment of the electronic component inspection device of the present invention. FIG. 20B is a plan view for explaining the first inspection device transfer head and the second inspection device transfer head of FIG. 20A. FIG. 21 is a block diagram of the electronic component inspection apparatus shown in FIG. 20A. 22 to 48 are diagrams for explaining the operation of the electronic component inspection device shown in FIG. 20A.

另，於圖20A中，因第1檢查用器件搬送頭及第2檢查用器件搬送頭與其他構件重疊，故以兩點鏈線示意之(圖22A~圖48亦同樣)。又，於圖20A中，於說明第1檢查用器件搬送頭及第2檢查用器件搬送頭時，於圖20B中記載第1檢查用器件搬送頭及第2檢查用器件搬送頭(圖22A亦同樣，記載於圖22B)。 In FIG. 20A, the first inspection device transfer head and the second inspection device transfer head overlap with other members, and therefore are shown by two-dot chain lines (the same applies to FIGS. 22A to 48). 20A, when the first inspection device transfer head and the second inspection device transfer head are described, the first inspection device transfer head and the second inspection device transfer head are described in FIG. 20B (FIG. 22A also shows FIG. 22A). Similarly, it is described in FIG. 22B).

又，於圖22A~圖48中，僅記載有電子零件檢查裝置之動作說明之必要構件。 In addition, in FIG. 22A to FIG. 48, only components necessary for the description of the operation of the electronic component inspection device are described.

又，檢查裝置1c係構成為可進行將IC器件90冷卻至特定溫度(第1溫度)而進行之低溫檢查、將IC器件90加熱至特定溫度(第3溫度)而進行之高溫檢查、及於常溫(第2溫度)下進行之常溫檢查。另，上述第1溫度低於上述第2溫度，上述第2溫度低於上述第3溫度。 The inspection device 1c is configured to perform low-temperature inspection for cooling the IC device 90 to a specific temperature (first temperature), high-temperature inspection for heating the IC device 90 to a specific temperature (third temperature), and Normal temperature check at normal temperature (second temperature). The first temperature is lower than the second temperature, and the second temperature is lower than the third temperature.

如圖20A及圖20B所示，檢查裝置1c劃分為托盤供給區域A1、器件供給區域(以下簡稱「供給區域」)A2、檢查區域A3、器件回收區域(以下簡稱「回收區域」)A4、及托盤移除區域A5。該等各區域係相互由未圖示之壁部或隔板等分隔。又，供給區域A2成為由壁部或隔板等區劃之第1室R1，且，檢查區域A3成為由壁部或隔板等區劃之第2室R2，又，回收區域A4成為由壁部或隔板等區劃之第3室R3。又，第1室R1(供給區域A2)、第2室R2(檢查區域A3)及第3室R3(回收區域A4)分別以可確保氣密性及斷熱性之方式構成。藉此，第1室R1、第2室R2及第3室R3可分別儘可能地維持濕度或溫度。另，第1室R1及第2室R2內係分別被控制為特定之濕度及特定之溫度。 As shown in FIGS. 20A and 20B, the inspection device 1c is divided into a tray supply area A1, a device supply area (hereinafter referred to as "supply area") A2, an inspection area A3, a device recovery area (hereinafter referred to as "recycling area") A4, and Tray removal area A5. These areas are separated from each other by a wall portion or a partition, etc., which are not shown. The supply area A2 is a first room R1 divided by a wall portion or a partition, and the inspection area A3 is a second room R2 divided by a wall portion or a partition. The recovery area A4 is a wall portion or a partition. The third room R3, such as a partition. The first room R1 (supply area A2), the second room R2 (inspection area A3), and the third room R3 (recovery area A4) are each configured to ensure airtightness and thermal insulation. Thereby, the first room R1, the second room R2, and the third room R3 can maintain the humidity or temperature as much as possible, respectively. The inside of the first room R1 and the second room R2 are controlled to a specific humidity and a specific temperature, respectively.

IC器件90係自托盤供給區域A1至托盤移除區域A5，依序經過上述各區域，於中途之檢查區域A3進行檢查。如此，檢查裝置1c係包含如下者：電子零件搬送裝置，其係於各區域搬送IC器件90，具有控制部80；檢查部16，其係於檢查區域A3內進行檢查；及未圖示之檢查控制部。另，於檢查裝置1c中，由除檢查部16及檢查控制部以外之構成，構成電子零件搬送裝置。 The IC device 90 is sequentially inspected from the tray supply area A1 to the tray removal area A5, passing through the above-mentioned areas in the inspection area A3 in the middle. In this way, the inspection device 1c includes the following: an electronic component transporting device that transports the IC device 90 in each area and has a control unit 80; an inspection unit 16 that performs an inspection in the inspection area A3; and an inspection (not shown) Control department. In addition, the inspection device 1c has a configuration other than the inspection unit 16 and the inspection control unit, and constitutes an electronic component transfer device.

托盤供給區域A1係供給排列有未檢查狀態之複數個IC器件90之托盤200的區域。另，於托盤供給區域A1中，可堆疊多個托盤200。 The tray supply area A1 is an area for supplying the trays 200 in which the plurality of IC devices 90 are arranged in an unchecked state. In the tray supply area A1, a plurality of trays 200 can be stacked.

供給區域A2係將配置於來自托盤供給區域A1之托盤200上之複數個IC器件90分別供給至檢查區域A3的區域。另，設置有以跨及托盤供給區域A1與供給區域A2之方式逐個搬送托盤200之第1托盤搬送機構11A、及第2托盤搬送機構11B。 The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3, respectively. In addition, a first tray transfer mechanism 11A and a second tray transfer mechanism 11B are provided to transfer the tray 200 one by one across the tray supply area A1 and the supply area A2.

於供給區域A2中，設置有載置IC器件90之第1載置部即第1溫度調整部(第1均熱板)12c、載置IC器件90之第2載置部即第2溫度調整部(第2均熱板)12d、供給用器件搬送頭13、及第3托盤搬送機構15。 In the supply area A2, a first temperature adjustment portion (a first soaking plate) 12c, which is a first placement portion on which the IC device 90 is placed, and a second temperature adjustment, which is a second placement portion on which the IC device 90 is placed, are provided. Unit (second soaking plate) 12d, supply device transfer head 13, and third tray transfer mechanism 15.

第1溫度調整部12c及第2溫度調整部12d係分別冷卻或加熱複數個IC器件90，將該IC器件90之溫度調整(控制)為適合檢查之溫度的裝置(溫度控制構件)。第1溫度調整部12c與第2溫度調整部12d係沿Y方向配置、固定。而且，藉由第1托盤搬送機構11A自托盤供給區域A1搬入(搬送而來)之托盤200上之IC器件90被搬送、載置於第1溫度調整部12c或第2溫度調整部12d。另，於本實施形態中，對將第1溫度調整部12c及第2溫度調整部12d分別應用於使IC器件90冷卻之裝置之情形進行說明。 The first temperature adjustment section 12c and the second temperature adjustment section 12d are devices (temperature control means) that cool or heat a plurality of IC devices 90, respectively, and adjust (control) the temperature of the IC devices 90 to a temperature suitable for inspection. The first temperature adjustment section 12c and the second temperature adjustment section 12d are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in (carried in) from the tray supply area A1 by the first tray transfer mechanism 11A is carried and placed on the first temperature adjustment section 12c or the second temperature adjustment section 12d. In this embodiment, a case where the first temperature adjustment section 12c and the second temperature adjustment section 12d are each applied to a device for cooling the IC device 90 will be described.

供給用器件搬送頭13係可於供給區域A2內，朝X方向、Y方向及Z方向移動地被支持。藉此，供給用器件搬送頭13可擔負自托盤供給區域A1搬入之托盤200與第1溫度調整部12c或第2溫度調整部12d之間 之IC器件90的搬送，及第1溫度調整部12c或第2溫度調整部12d與後述之第1器件供給部14c或第2器件供給部14d之間之IC器件90的搬送。另，供給用器件搬送頭13具有複數個手單元131作為可固持IC器件90之機械臂(固持部)；各手單元131係與後述之第1手單元171c同樣地，具備吸附嘴，可藉由吸附而固持IC器件90。又，供給用器件搬送頭13之各手單元131亦可構成為可冷卻或加熱IC器件90，而將該IC器件90之溫度調整為適合檢查之溫度。 The supply device transfer head 13 is supported in the supply area A2 so as to be movable in the X direction, the Y direction, and the Z direction. Thereby, the supply device conveying head 13 can be provided between the tray 200 carried in from the tray supply area A1 and the first temperature adjustment section 12c or the second temperature adjustment section 12d. The IC device 90 is transported, and the IC device 90 is transported between the first temperature adjustment section 12c or the second temperature adjustment section 12d and the first device supply section 14c or the second device supply section 14d described later. The supply device transfer head 13 includes a plurality of hand units 131 as a robot arm (holding portion) capable of holding the IC device 90. Each hand unit 131 is similar to the first hand unit 171c described later, and has a suction nozzle. The IC device 90 is held by adsorption. In addition, each hand unit 131 of the supply device transfer head 13 may be configured to cool or heat the IC device 90, and adjust the temperature of the IC device 90 to a temperature suitable for inspection.

第3托盤搬送機構15係將所有的IC器件90皆已移除之狀態之空的托盤200朝X方向搬送之機構。而且，於該搬送後，空的托盤200係藉由第2托盤搬送機構11B自供給區域A2返回至托盤供給區域A1。 The third tray transfer mechanism 15 is a mechanism that transfers the empty tray 200 in a state where all the IC devices 90 have been removed in the X direction. After the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray transfer mechanism 11B.

檢查區域A3係檢查IC器件90之區域。於該檢查區域A3中，設置有：第1電子零件載置部(電子零件載置部)，即第1器件供給部(第1梭)(第1供給梭)14c，其可載置(配置)IC器件90而進行搬送(可移動)；第2電子零件載置部(電子零件載置部)，即第2器件供給部(第2梭)(第2供給梭)14d，其可載置(配置)IC器件90而進行搬送(可移動)；檢查部16；第1電子零件固持部(電子零件固持部)，即第1檢查用器件搬送頭(第1機械臂)17c；第2電子零件固持部(電子零件固持部)，即第2檢查用器件搬送頭(第2機械臂)17d；載置部即第1器件回收部(第1回收梭)18c，其可載置、搬送IC器件90；及載置部即第2器件回收部(第2回收梭)18d，其可載置、搬送IC器件90。 The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, a first electronic component mounting section (electronic component mounting section), that is, a first device supply section (first shuttle) (first supply shuttle) 14c is provided, which can be mounted (arranged) ) The IC device 90 is transported (movable); the second electronic component mounting section (electronic component mounting section), that is, the second device supply section (second shuttle) (second supply shuttle) 14d, can be mounted thereon. (Arrangement) IC device 90 is transported (movable); inspection section 16; first electronic component holding section (electronic component holding section), that is, the first inspection device transportation head (first robotic arm) 17c; second electronic The part holding part (electronic part holding part), that is, the second inspection device transfer head (second robot arm) 17d; the placement part is the first device recovery part (first recovery shuttle) 18c, which can mount and transport the IC Device 90; and a second device recovery section (second recovery shuttle) 18d, which is a mounting section, which can mount and transport the IC device 90.

第1器件供給部14c及第2器件供給部14d係分別將檢查前之IC器件90搬送至檢查部16附近的裝置。 The first device supply unit 14 c and the second device supply unit 14 d are each a device that transports the IC device 90 before inspection to the vicinity of the inspection unit 16.

第1器件供給部14c及第2器件供給部14d分別具有載置(配置)IC器件90之配置板142、及可朝X方向移動之器件供給部本體141。於配置板142之上表面，設置有收容(保持)IC器件90之凹部，即複數個凹穴145。另，於圖示之構成中，凹穴145係於X方向為4個、Y方向為2個 之合計8個以矩陣狀排列。該配置板142可裝卸地設置於器件供給部本體141。第1器件供給部14c及第2器件供給部14d分別可沿X方向於供給區域A2與檢查區域A3之間移動地被支持。又，第1器件供給部14c及第2器件供給部14d係沿Y方向配置，第1溫度調整部12c或第2溫度調整部12d上之IC器件90係藉由供給用器件搬送頭13，被搬送、載置於第1器件供給部14c或第2器件供給部14d。 The first device supply unit 14c and the second device supply unit 14d each include a layout plate 142 on which the IC device 90 is placed (arranged), and a device supply unit body 141 that is movable in the X direction. A concave portion accommodating (holding) the IC device 90 is provided on an upper surface of the configuration plate 142, that is, a plurality of concave cavities 145. In the illustrated configuration, the number of the recesses 145 is four in the X direction and two in the Y direction. A total of eight are arranged in a matrix. The arrangement plate 142 is detachably provided on the device supply unit body 141. The first device supply portion 14c and the second device supply portion 14d are supported so as to be movable between the supply area A2 and the inspection area A3 in the X direction, respectively. The first device supply unit 14c and the second device supply unit 14d are arranged along the Y direction, and the IC device 90 on the first temperature adjustment unit 12c or the second temperature adjustment unit 12d is transferred by the supply device transfer head 13, The first device supply unit 14c or the second device supply unit 14d is transported and placed.

此處，如圖22A所示，第1器件供給部14c之8個凹穴145中之圖22A中左側之2個凹穴145為第1載置部261，圖22A中自左起第2組之2個凹穴145為第2載置部262，圖22A中自左起第3組之2個凹穴145為第3載置部263，圖22A中右側之2個凹穴145為第4載置部264。該第1載置部261、第2載置部262、第3載置部263、第4載置部264係沿X方向並排。第2器件供給部14d亦為同樣之情形。 Here, as shown in FIG. 22A, among the eight recesses 145 of the first device supply portion 14c, the two recesses 145 on the left in FIG. 22A are the first mounting portions 261, and the second group from the left in FIG. 22A The two pockets 145 are the second placement portion 262, and the two pockets 145 in the third group from the left in FIG. 22A are the third placement portion 263. The two pockets 145 on the right in FIG. Mounting section 264. The first placement portion 261, the second placement portion 262, the third placement portion 263, and the fourth placement portion 264 are arranged side by side in the X direction. The same applies to the second device supply unit 14d.

另，第1器件供給部14c及第2器件供給部14d係可構成為可冷卻或加熱IC器件90而將該IC器件90之溫度調整(可設定)為適合檢查之溫度。 The first device supply unit 14c and the second device supply unit 14d may be configured to cool or heat the IC device 90 and adjust (set) the temperature of the IC device 90 to a temperature suitable for inspection.

於該情形時，例如，第1器件供給部14c之第1載置部261構成器件供給部第1溫度設定部，其可冷卻IC器件90而將該IC器件90之溫度調整(可設定)為適合低溫檢查之溫度(第1溫度)。 In this case, for example, the first mounting portion 261 of the first device supply portion 14c constitutes the first temperature setting portion of the device supply portion, which can cool the IC device 90 and adjust (settable) the temperature of the IC device 90 to Temperature suitable for low-temperature inspection (first temperature).

又，第2載置部262係構成器件供給部第2溫度設定部，其不對IC器件90進行冷卻與加熱之任一者，而將該IC器件90之溫度設為(可設定)適合常溫檢查之溫度(第2溫度)。另，第2載置部262亦可構成為例如可對IC器件90進行冷卻及加熱，藉由該冷卻或加熱，而可將IC器件90之溫度調整為適合常溫檢查之溫度。 The second placement section 262 constitutes a second temperature setting section of the device supply section, and does not cool or heat the IC device 90. Instead, the temperature of the IC device 90 is set (settable) for normal temperature inspection. Temperature (second temperature). In addition, the second mounting portion 262 may be configured to, for example, cool and heat the IC device 90, and the temperature of the IC device 90 may be adjusted to a temperature suitable for normal temperature inspection by the cooling or heating.

再者，第3載置部263係構成器件供給部第3溫度設定部，其可加熱IC器件90而將該IC器件90之溫度調整(可設定)為適合高溫檢查之溫度(第3溫度)。又，第1器件供給部14C之8個載置部中之圖22A中右側 之2個第4載置部264雖於本實施形態中未使用，但亦可構成為加以使用。 The third placement section 263 constitutes a third temperature setting section of the device supply section, and can heat the IC device 90 to adjust (settable) the temperature of the IC device 90 to a temperature suitable for high-temperature inspection (third temperature). . In addition, of the eight placement sections of the first device supply section 14C, the right side in FIG. 22A Although the two fourth mounting portions 264 are not used in this embodiment, they may be configured to be used.

檢查部16係檢查/測試IC器件90之電性特性(進行電性檢查)的單元，即，於檢查IC器件90時保持該IC器件90的構件。 The inspection unit 16 is a unit that inspects / tests the electrical characteristics (performs electrical inspection) of the IC device 90, that is, the components that hold the IC device 90 when inspecting the IC device 90.

如圖20A所示，檢查部16具有保持IC器件90之保持構件162、及支持保持構件162之檢查部本體161。保持構件162可裝卸地設置於檢查部本體161。 As shown in FIG. 20A, the inspection section 16 includes a holding member 162 that holds the IC device 90 and an inspection section body 161 that supports the holding member 162. The holding member 162 is detachably provided in the inspection unit body 161.

於檢查部16之保持構件162之上表面，設置有收容(保持)IC器件90之凹部，即複數個保持部163。另，於圖示之構成中，保持部163係由X方向4個、Y方向2個之合計8個以矩陣狀排列。IC器件90被收容於保持部163，藉此配置(載置)於檢查部16。 On the upper surface of the holding member 162 of the inspection section 16, there are provided a plurality of holding portions 163, which are concave portions for accommodating (holding) the IC device 90. In the configuration shown in the figure, the holding portions 163 are arranged in a matrix form with a total of eight in the X direction and two in the Y direction. The IC device 90 is housed in the holding portion 163 and is thereby placed (mounted) on the inspection portion 16.

又，於與檢查部16之各保持部163對應之位置，分別設置有在將IC器件90保持於保持部163之狀態下，與該IC器件90之端子電性連接之探針針腳。而且，IC器件90之端子與探針針腳電性連接(接觸)，經由探針針腳進行IC器件90之檢查。IC器件90之檢查係基於連接於檢查部16之未圖示之測試器所具備之檢查控制部之記憶部中記憶之程式進行。 Further, at positions corresponding to the respective holding portions 163 of the inspection portion 16, there are provided probe pins which are electrically connected to the terminals of the IC device 90 while the IC device 90 is held by the holding portion 163. In addition, the terminals of the IC device 90 are electrically connected (contacted) with the probe pins, and the inspection of the IC device 90 is performed through the probe pins. The inspection of the IC device 90 is performed based on a program stored in a memory section of an inspection control section provided in a tester (not shown) connected to the inspection section 16.

又，如圖22A所示，檢查部16之8個保持部163中之圖22A中左側之2個保持部163構成可冷卻IC器件90而將該IC器件90之溫度調整(可設定)為適合低溫檢查之溫度(第1溫度)的第1溫度設定部166。 Also, as shown in FIG. 22A, the two holding portions 163 on the left side in FIG. 22A of the eight holding portions 163 of the inspection portion 16 constitute a coolable IC device 90, and the temperature of the IC device 90 can be adjusted (settable) as appropriate The first temperature setting unit 166 is the temperature (first temperature) of the low-temperature inspection.

又，檢查部16之8個保持部163中之圖22A中自左起第2組之2個保持部163構成第2溫度設定部167，其不對IC器件90進行冷卻與加熱之任一者，而將該IC器件90之溫度設為(可設定)適合常溫檢查之溫度(第2溫度)。另，第2溫度設定部167例如亦可構成為可對IC器件90進行冷卻及加熱，藉由該冷卻或加熱，將IC器件90調整為適合常溫檢查之溫度。 22A from the left of the eight holding sections 163 of the inspection section 16 form the second holding section 163 of the second group from the left. The second temperature setting section 167 does not cool or heat the IC device 90. The temperature of the IC device 90 is set (settable) to a temperature (second temperature) suitable for normal temperature inspection. The second temperature setting unit 167 may be configured to cool and heat the IC device 90, for example, and adjust the IC device 90 to a temperature suitable for normal temperature inspection by the cooling or heating.

又，檢查部16之8個保持部163中之圖22A中自左起第3組之2個保持部163構成第3溫度設定部168，其可加熱IC器件90而將該IC器件90調整(可設定)為適合高溫檢查之溫度(第3溫度)。 In addition, among the eight holding portions 163 of the inspection portion 16, two holding portions 163 in the third group from the left in FIG. 22A constitute a third temperature setting portion 168, which can heat the IC device 90 and adjust the IC device 90 ( (Settable) is the temperature (third temperature) suitable for high-temperature inspection.

再者，檢查部16之8個保持部163中之圖22A中右側2個保持部163雖於本實施形態中並未被使用，但亦可成為被使用之構成。 It should be noted that, among the eight holding portions 163 of the inspection portion 16, the two holding portions 163 on the right side in FIG. 22A in FIG. 22A are not used in this embodiment, but may be used.

如圖20A及圖20B所示，第1檢查用器件搬送頭17c及第2檢查用器件搬送頭17d係分別可於檢查區域A3內朝Y方向及Z方向移動地被支持。又，第1檢查用器件搬送頭17c與第2檢查用器件搬送頭17d係沿Y方向配置。第1檢查用器件搬送頭17c可將自供給區域A2搬入之第1器件供給部14c上之IC器件90搬送、載置於檢查部16上，且，可將檢查部16上之IC器件90搬送、載置於第1器件回收部18c上。同樣地，第2檢查用器件搬送頭17d可將自供給區域A2搬入之第2器件供給部14d上之IC器件90搬送、載置於檢查部16上，且，可將檢查部16上之IC器件90搬送、載置於第2器件回收部18d上。又，於檢查IC器件90之情形時，第1檢查用器件搬送頭17c及第2檢查用器件搬送頭17d分別將IC器件90朝檢查部16進行按壓，藉此，使IC器件90抵接檢查部16。藉此，如上述般，IC器件90之端子與檢查部16之探針針腳電性連接。 As shown in FIGS. 20A and 20B, the first inspection device transfer head 17c and the second inspection device transfer head 17d are supported so as to be movable in the Y direction and the Z direction in the inspection area A3, respectively. The first inspection device transfer head 17c and the second inspection device transfer head 17d are arranged along the Y direction. The first inspection device transfer head 17c can transport and place the IC devices 90 on the first device supply section 14c carried in the supply area A2, and place them on the inspection section 16, and can transport the IC devices 90 on the inspection section 16 And placed on the first device recovery section 18c. Similarly, the second inspection device transfer head 17d can transport and place the IC device 90 on the second device supply portion 14d carried in the supply area A2 and place it on the inspection portion 16, and the IC on the inspection portion 16 can be placed thereon. The device 90 is transported and placed on the second device recovery unit 18d. When the IC device 90 is inspected, the first inspection device transfer head 17c and the second inspection device transfer head 17d press the IC device 90 toward the inspection unit 16, respectively, thereby bringing the IC device 90 into contact with the inspection. Department 16. Accordingly, as described above, the terminals of the IC device 90 are electrically connected to the probe pins of the inspection unit 16.

第1檢查用器件搬送頭17c具有可固持IC器件90之複數個第1手單元171c。另，於圖示之構成中，第1手單元171c係X方向為4個、Y方向為2個之合計8個以矩陣狀排列。同樣地，第2檢查用器件搬送頭17d具有可固持IC器件90之複數個第2手單元171d。另，於圖示之構成中，第2手單元171d係X方向為4個、Y方向為2個之合計8個以矩陣狀排列。 The first inspection device transfer head 17c includes a plurality of first hand units 171c capable of holding the IC device 90. In addition, in the configuration shown in the figure, a total of eight first hand units 171c are arranged in a matrix in the form of four in the X direction and two in the Y direction. Similarly, the second inspection device transfer head 17d includes a plurality of second hand units 171d that can hold the IC device 90. In the configuration shown in the figure, a total of eight second hand units 171d are arranged in a matrix, with four in the X direction and two in the Y direction.

因各第1手單元171c及各第2手單元171d之構成相同，故以下以1個第1手單元171c為代表進行說明。如圖22B所示，第1手單元171c具有保持IC器件90之固持構件173、及支持固持構件173之處理單元本體 172。固持構件173可裝卸地設置於手單元本體172。該第1手單元171c具備吸附嘴，可藉由吸附而固持IC器件90。 Since the configurations of each of the first-hand units 171c and each of the second-hand units 171d are the same, a description will be given below using one first-hand unit 171c as a representative. As shown in FIG. 22B, the first hand unit 171c includes a holding member 173 that holds the IC device 90, and a processing unit body that supports the holding member 173. 172. The holding member 173 is detachably provided in the hand unit body 172. The first hand unit 171c includes a suction nozzle, and can hold the IC device 90 by suction.

又，如圖22B所示，第1檢查用器件搬送頭17c之8個第1手單元171c中之圖22B中左側之2個第1手單元171c為第1固持部271，構成手單元第1溫度設定部(第1機械臂溫度設定部)176c，其可冷卻IC器件90而將該IC器件90之溫度調整(可設定)為適合低溫檢查之溫度(第1溫度)。 As shown in FIG. 22B, of the eight first hand units 171c of the first inspection device transfer head 17c, the two first hand units 171c on the left side in FIG. 22B are the first holding portions 271 and constitute the first hand unit The temperature setting unit (first robot arm temperature setting unit) 176c can cool the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature (first temperature) suitable for low-temperature inspection.

又，第1檢查用器件搬送頭17c之8個第1手單元171c中之圖22B中自左起第2組之2個第1手單元171c為第2固持部272，構成手單元第2溫度設定部177c，其不對IC器件90進行冷卻與加熱之任一者，而將該IC器件90之溫度設(可設定)為適合常溫檢查之溫度(第2溫度)。另，第2固持部272(手單元第2溫度設定部177c)亦可構成為例如可對IC器件90進行冷卻及加熱，藉由該冷卻或加熱，將IC器件90之溫度調整為適合常溫檢查之溫度。 In addition, of the eight first hand units 171c of the eighth first hand unit 171c of the first inspection device, the two first hand units 171c of the second group from the left in FIG. 22B are the second holding portions 272, constituting the second temperature of the hand unit The setting section 177c does not cool or heat the IC device 90, but sets (can set) the temperature of the IC device 90 to a temperature (second temperature) suitable for normal temperature inspection. In addition, the second holding portion 272 (the second unit temperature setting unit 177c of the hand unit) may be configured to cool and heat the IC device 90, for example, and adjust the temperature of the IC device 90 to be suitable for normal temperature inspection by cooling or heating. Of temperature.

又，第1檢查用器件搬送頭17c之8個第1手單元171c中之圖22B中自左起第3組之2個第1手單元171c為第3固持部273，構成手單元第3溫度設定部(第3機械臂溫度設定部)178c，其可加熱IC器件90而將該IC器件90之溫度調整(可設定)為適合高溫檢查之溫度(第3溫度)。 In addition, of the eight first hand units 171c of the first inspection device transfer head 17c, two first hand units 171c in the third group from the left in FIG. 22B are the third holding portions 273, and constitute the third temperature of the hand unit The setting unit (third robot arm temperature setting unit) 178c can heat the IC device 90 and adjust (settable) the temperature of the IC device 90 to a temperature (third temperature) suitable for high-temperature inspection.

再者，第1檢查用器件搬送頭17c之8個第1手單元171c中之圖22B中右側之2個第1手單元171c為第4固持部274，雖於本實施形態中並未使用，但亦可成為被使用之構成。 Furthermore, of the eight first-hand units 171c of the first inspection device transfer head 17c, the two first-hand units 171c on the right in FIG. 22B in FIG. 22B are the fourth holding portions 274, which are not used in this embodiment. But it can also be used.

上述第1固持部271、第2固持部272、第3固持部273、第4固持部274係沿X方向並排。 The first holding portion 271, the second holding portion 272, the third holding portion 273, and the fourth holding portion 274 are arranged side by side in the X direction.

第2檢查用器件搬送頭17d亦為同樣之情形。 The same applies to the second inspection device transfer head 17d.

另，於圖23~圖38中，因若以「○」示意第1固持部271，則與其他構件重疊而難以視認，故以與手單元第1溫度設定部176c共用之兩 點鏈線示意之。第2固持部272、第3固持部273及第4固持部274亦為同樣之情形。 In addition, in FIG. 23 to FIG. 38, if the first holding portion 271 is indicated by "○", it overlaps with other components and is difficult to be seen. Therefore, two portions shared with the first unit temperature setting portion 176c of the hand unit are used. The dotted chain line indicates it. The same applies to the second holding portion 272, the third holding portion 273, and the fourth holding portion 274.

如圖20A所示，第1器件回收部18c及第2器件回收部18d分別為將在檢查部16完成檢查之IC器件90搬送至回收區域A4的裝置。 As shown in FIG. 20A, each of the first device recovery unit 18 c and the second device recovery unit 18 d is a device that transports the IC device 90 that has been inspected by the inspection unit 16 to the recovery area A4.

第1器件回收部18c及第2器件回收部18d分別具有載置(配置)IC器件90之配置板182、及可朝X方向移動之器件回收部本體181。於配置板182之上表面，設置有收容(保持)IC器件90之凹部，即複數個凹穴185。另，於圖示之構成中，凹穴185係X方向為4個、Y方向為2個之合計8個以矩陣狀排列。該配置板182可裝卸地安裝於器件回收部本體181。第1器件回收部18c及第2器件回收部18d係分別可沿X方向於檢查區域A3與回收區域A4之間移動地被支持。又，第1器件回收部18c與第2器件回收部18d係沿Y方向配置。檢查部16上之IC器件90係藉由第1檢查用器件搬送頭17c，被搬送、載置於第1器件回收部18c，或藉由第2檢查用器件搬送頭17d，被搬送、載置於第2器件回收部18d。 The first device recovery unit 18c and the second device recovery unit 18d each include a layout plate 182 on which the IC device 90 is placed (arranged), and a device recovery unit body 181 that is movable in the X direction. On the upper surface of the configuration plate 182, there are provided a plurality of recesses 185 for receiving (holding) the IC device 90. In the configuration shown in the figure, a total of eight recesses 185 are arranged in a matrix in the form of four in the X direction and two in the Y direction. The arrangement plate 182 is detachably attached to the device recovery portion main body 181. The first device recovery unit 18c and the second device recovery unit 18d are supported to be movable between the inspection area A3 and the recovery area A4 in the X direction, respectively. The first device recovery unit 18c and the second device recovery unit 18d are arranged along the Y direction. The IC device 90 on the inspection unit 16 is transported and placed in the first inspection unit 18c by the first inspection device transfer head 17c, or is transported and placed by the second inspection device transfer head 17d. In the second device recovery section 18d.

另，於圖20A中，為便於區分第1器件回收部18c與第1器件供給部14c而相互獨立地圖示，但第1器件回收部18c與第1器件供給部14c既可構成為如該圖示般，相互獨立移動，且亦可構成為第1器件回收部18c與第1器件供給部14c連結或一體化，使第1器件回收部18c與第1器件供給部14c一體移動。第2器件回收部18d與第2器件供給部14d亦為同樣之情形。 In addition, in FIG. 20A, in order to facilitate the distinction between the first device recovery section 18c and the first device supply section 14c, they are illustrated independently of each other, but the first device recovery section 18c and the first device supply section 14c may be configured as such As shown in the figure, they can move independently of each other, and the first device recovery unit 18c and the first device supply unit 14c can be connected or integrated to move the first device recovery unit 18c and the first device supply unit 14c as a whole. The same applies to the second device recovery unit 18d and the second device supply unit 14d.

回收區域A4係回收完成檢查之IC器件90之區域。於該回收區域A4中，設置有回收用托盤19、回收用器件搬送頭20、及第6托盤搬送機構21。又，於回收區域A4中，亦備有空的托盤200。 The recovery area A4 is an area where the IC device 90 that has been inspected is recovered. In the collection area A4, a collection tray 19, a collection device transfer head 20, and a sixth tray transfer mechanism 21 are provided. An empty tray 200 is also provided in the collection area A4.

回收用托盤19固定於回收區域A4內，於本實施形態中，沿X方向配置有3個。又，空的托盤200亦沿X方向配置有3個。而且，移動至回收區域A4之第1器件回收部18c或第2器件回收部18d上之IC器件90 被搬送、載置於該等回收用托盤19及空的托盤200中之任一者。藉此，IC器件90係根據各個檢查結果而加以回收及分類。 The collection trays 19 are fixed in the collection area A4. In the present embodiment, three collection trays 19 are arranged in the X direction. Three empty trays 200 are also arranged in the X direction. Then, the IC device 90 on the first device recovery section 18c or the second device recovery section 18d moved to the recovery area A4. Any one of the collection tray 19 and the empty tray 200 is transported and placed. As a result, the IC device 90 is collected and classified based on the results of each inspection.

回收用器件搬送頭20係可於回收區域A4內朝X方向、Y方向及Z方向移動地被支持。藉此，回收用器件搬送頭20可將IC器件90自第1器件回收部18c或第2器件回收部18d，搬送至回收用托盤19或空的托盤200。另，回收用器件搬送頭20具有複數個手單元201作為可固持IC器件90之機械臂(固持部)，各手單元201係與上述第1手單元171c同樣地，具備吸附嘴，可藉由吸附而固持IC器件90。 The recovery device transfer head 20 is supported to be movable in the X direction, the Y direction, and the Z direction within the recovery area A4. Thereby, the recovery device transfer head 20 can transfer the IC device 90 from the first device recovery unit 18c or the second device recovery unit 18d to the recovery tray 19 or the empty tray 200. The recycling device transfer head 20 includes a plurality of hand units 201 as robot arms (holding portions) capable of holding the IC device 90. Each hand unit 201 is provided with a suction nozzle similar to the first hand unit 171c. The IC device 90 is adsorbed and held.

第6托盤搬送機構21係將自托盤移除區域A5搬入之空的托盤200朝X方向搬送之機構。而且，於該搬送後，空的托盤200配置於回收IC器件90之位置，亦即其可能成為上述3個空的托盤200中之任一者。 The sixth tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the X direction. After the transfer, the empty tray 200 is disposed at the position where the IC device 90 is collected, that is, it may become any of the three empty trays 200 described above.

托盤移除區域A5係回收及移除排列有檢查完畢狀態之複數個IC器件90之托盤200的區域。於托盤移除區域A5中，可堆疊多個托盤200。 The tray removal area A5 is an area for collecting and removing the trays 200 in which the plurality of IC devices 90 in the inspected state are arranged. In the tray removing area A5, a plurality of trays 200 can be stacked.

再者，設置有以跨及回收區域A4與托盤移除區域A5之方式逐個搬送托盤200之第4托盤搬送機構22A、及第5托盤搬送機構22B。第4托盤搬送機構22A係將載置有檢查完畢之IC器件90之托盤200自回收區域A4搬送至托盤移除區域A5的機構。第5托盤搬送機構22B係將用於回收IC器件90之空的托盤200自托盤移除區域A5搬送至回收區域A4的機構。 In addition, a fourth tray conveyance mechanism 22A and a fifth tray conveyance mechanism 22B are provided to move the tray 200 one by one so as to span the recovery area A4 and the tray removal area A5. The fourth tray transfer mechanism 22A is a mechanism that transfers the tray 200 on which the IC devices 90 having been inspected are loaded from the recovery area A4 to the tray removal area A5. The fifth tray transfer mechanism 22B is a mechanism that transfers the empty tray 200 for collecting the IC devices 90 from the tray removal area A5 to the collection area A4.

又，上述測試器之檢查控制部係例如基於未圖示之記憶部中記憶之程式，而進行配置於檢查部16之IC器件90之電氣特性(電氣)之檢查等。 The inspection control unit of the tester performs, for example, inspection of electrical characteristics (electricity) of the IC device 90 arranged in the inspection unit 16 based on a program stored in a memory unit (not shown).

又，如圖21所示，檢查裝置1c包含控制部80、電性連接於控制部80且進行檢查裝置1c之各操作之操作部6、冷卻IC器件90之冷卻機構41、42、43、44及45、及加熱IC器件90之加熱機構51、52及53。 As shown in FIG. 21, the inspection device 1 c includes a control unit 80, an operation unit 6 which is electrically connected to the control unit 80 and performs each operation of the inspection device 1 c, and cooling mechanisms 41, 42, 43, 44 that cool the IC device 90. And 45, and heating mechanisms 51, 52, and 53 for heating the IC device 90.

控制部80具有記憶各資訊(資料)之記憶部801等，例如控制第1托盤搬送機構11A、第2托盤搬送機構11B、第1溫度調整部12c、第2溫度調整部12d、供給用器件搬送頭13、第1器件供給部14c、第2器件供給部14d、第3托盤搬送機構15、第1檢查用器件搬送頭17c、第2檢查用器件搬送頭17d、第1器件回收部18c、第2器件回收部18d、回收用器件搬送頭20、第6托盤搬送機構21、第4托盤搬送機構22A、第5托盤搬送機構22B、顯示部62、冷卻機構41~45、加熱機構51~53等各部之驅動。 The control unit 80 includes a memory unit 801 that stores various information (data), for example, controls the first tray transfer mechanism 11A, the second tray transfer mechanism 11B, the first temperature adjustment unit 12c, the second temperature adjustment unit 12d, and the supply device transfer. Head 13, first device supply unit 14c, second device supply unit 14d, third tray transport mechanism 15, first inspection device transport head 17c, second inspection device transport head 17d, first device recovery unit 18c, first 2 Device recovery unit 18d, recovery device transfer head 20, sixth tray transfer mechanism 21, fourth tray transfer mechanism 22A, fifth tray transfer mechanism 22B, display portion 62, cooling mechanism 41 to 45, heating mechanism 51 to 53, etc. The drive of each department.

再者，操作部6具有進行各輸入之輸入部61、及顯示圖像等各資訊(資料)之顯示部62。作為輸入部61，並未特別限定，例如，可枚舉鍵盤、滑鼠等。又，作為顯示部62，並未特別限定，例如，可枚舉液晶顯示面板、有機EL顯示面板等。作業員(操作者)對操作部6之操作係例如藉由操作輸入部61，使游標移動至顯示部62所顯示之各操作按鈕(圖標)之位置並進行選擇(點擊)而進行。 In addition, the operation unit 6 includes an input unit 61 that performs each input, and a display unit 62 that displays various information (data) such as an image. The input unit 61 is not particularly limited, and examples thereof include a keyboard and a mouse. The display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel and an organic EL display panel. The operation of the operation unit 6 by the operator (operator) is performed by, for example, operating the input unit 61, moving the cursor to the position of each operation button (icon) displayed on the display unit 62, and selecting (clicking) it.

另，作為輸入部61，並非限定於上述構成者，例如，亦可枚舉按壓式按鈕等機械式操作按鈕等。又，作為操作部6，並非限定於上述構成者，例如，亦可枚舉觸控面板等可顯示輸入及資訊的器件等。 The input unit 61 is not limited to the above-mentioned configuration, and for example, a mechanical operation button such as a push button may be enumerated. In addition, the operation unit 6 is not limited to the one described above, and for example, a device capable of displaying input and information such as a touch panel may be enumerated.

再者，冷卻機構41冷卻第1溫度調整部12c，藉由該第1溫度調整部12c冷卻IC器件90。又，冷卻機構42冷卻第2溫度調整部12d，藉由該第2溫度調整部12d冷卻IC器件90。又，冷卻機構43冷卻第1檢查用器件搬送頭17c之第1固持部271(手單元第1溫度設定部176c)，藉由該第1固持部271冷卻IC器件90。又，冷卻機構44冷卻第2檢查用器件搬送頭17d之第1固持部271(手單元第1溫度設定部176c)，藉由該第1固持部271，冷卻IC器件90。又，冷卻機構45冷卻檢查部16之8個固持部163中之圖22A中左側之2個保持部163，亦即第1溫度設定部166，藉由該第1溫度設定部166冷卻IC器件90。 The cooling mechanism 41 cools the first temperature adjustment unit 12c, and cools the IC device 90 by the first temperature adjustment unit 12c. The cooling mechanism 42 cools the second temperature adjustment portion 12d, and cools the IC device 90 by the second temperature adjustment portion 12d. The cooling mechanism 43 cools the first holding portion 271 (the first unit temperature setting portion 176c) of the first inspection device transfer head 17c, and cools the IC device 90 by the first holding portion 271. The cooling mechanism 44 cools the first holding portion 271 (the first temperature setting portion 176c of the hand unit) of the second inspection device transfer head 17d, and cools the IC device 90 by the first holding portion 271. In addition, the cooling mechanism 45 cools the two holding parts 163 on the left side in FIG. 22A of the eight holding parts 163 of the inspection part 16, that is, the first temperature setting part 166, and cools the IC device 90 by the first temperature setting part 166. .

作為冷卻機構41~45，並未特別限定，例如，可枚舉使冷媒(例如，使液氮氣化而成之氮氣等低溫氣體等)流動於配置於冷卻對象物或其附近之管體內而進行冷卻之裝置、及帕爾帖元件等。 The cooling mechanisms 41 to 45 are not particularly limited. For example, the cooling mechanism (e.g., a low-temperature gas such as nitrogen generated by liquid nitrogen) can be enumerated to flow in a tube disposed in or near a cooling object. Cooling devices, and Peltier elements.

又，加熱機構51加熱第1檢查用器件搬送頭17c之第3固持部273(手單元第3溫度設定部178c)，藉由該第3固持部273加熱IC器件90。又，加熱機構52加熱第2檢查用器件搬送頭17d之第3固持部273(手單元第3溫度設定部178c)，藉由該第3固持部273加熱IC器件90。又，加熱機構53加熱檢查部16之8個保持部163中之圖22A中自左起第3組之2個保持部163，亦即第3溫度設定部168，藉由該第3溫度設定部168加熱IC器件90。 The heating mechanism 51 heats the third holding portion 273 (the third unit temperature setting portion 178c of the hand unit) of the first inspection device transfer head 17c, and heats the IC device 90 by the third holding portion 273. The heating mechanism 52 heats the third holding portion 273 (the third unit temperature setting portion 178c of the hand unit) of the second inspection device transfer head 17d, and heats the IC device 90 by the third holding portion 273. In addition, the heating mechanism 53 heats the eight holding sections 163 of the inspection section 16 from the left in the third group from the left in the third group of two holding sections 163, that is, the third temperature setting section 168. The third temperature setting section 168 168heats the IC device 90.

作為加熱機構51~53，並未特別限定，例如，可枚舉具有電熱線之加熱器等。 The heating means 51 to 53 are not particularly limited, and examples thereof include heaters having electric heating wires and the like.

其次，就檢查裝置1c之動作進行說明，此處，以藉由第1器件供給部14c、第1檢查用器件搬送頭17c及第1器件回收部18c進行IC器件90之搬送等之情形為代表進行說明。 Next, the operation of the inspection device 1c will be described. Here, the case where the IC device 90 is transported by the first device supply unit 14c, the first inspection device transfer head 17c, and the first device recovery unit 18c will be representative. Be explained.

另，欲檢查之IC器件90係藉由第1器件供給部14c及第1檢查用器件搬送頭17c依序搬送至檢查部16，此處，將首先(第1個)欲檢查(搬送)之IC器件90，稱作「第1個IC器件901」或「IC器件901」，將第2個欲檢查之IC器件90稱作「第2個IC器件902」或「IC器件902」，將第3個欲檢查之IC器件90稱作「第3個IC器件903」或「IC器件903」，將第4個欲檢查之IC器件90稱作「第4個IC器件904」或「IC器件904」，將第5個欲檢查之IC器件90稱作「第5個IC器件905」或「IC器件905」。又，於不區分第1個、第2個、第3個、第4個、第5個等之情形時，則稱作「IC器件90」。又，於圖22A~圖48中，將IC器件901以「I」表示，將IC器件902以「II」表示，將IC器件903以「III」表示，將IC器件904以「IV」表示，將IC器件905以「V」表示。 The IC device 90 to be inspected is sequentially transferred to the inspection unit 16 by the first device supply unit 14c and the first inspection device transfer head 17c. Here, the first (first) unit to be inspected (transported) The IC device 90 is referred to as "the first IC device 901" or "IC device 901", and the second IC device 90 to be inspected is referred to as the "second IC device 902" or "IC device 902". The three IC devices 90 to be inspected are referred to as "third IC device 903" or "IC device 903", and the fourth IC devices 90 to be inspected are referred to as "4th IC device 904" or "IC device 904" ", The fifth IC device 90 to be inspected is referred to as" the fifth IC device 905 "or" IC device 905 ". In addition, when the first, second, third, fourth, fifth, etc. are not distinguished, they are referred to as "IC device 90". In FIGS. 22A to 48, the IC device 901 is represented by “I”, the IC device 902 is represented by “II”, the IC device 903 is represented by “III”, and the IC device 904 is represented by “IV”. The IC device 905 is represented by "V".

首先，如圖22A及圖22B所示，第1個IC器件901係藉由供給用器件搬送頭13，載置(配置)於第1器件供給部14c之第1載置部261。亦即，於第1載置部261中，載置檢查前之IC器件901。較佳為，該IC器件901亦由第1溫度調整部12c或第2溫度調整部12d事先進行冷卻，但亦可不進行冷卻。另，後述之IC器件902及IC器件903亦為同樣之情形。 First, as shown in FIG. 22A and FIG. 22B, the first IC device 901 is placed (arranged) on the first placement portion 261 of the first device supply portion 14c via the supply device transfer head 13. That is, the IC device 901 before inspection is mounted on the first mounting portion 261. Preferably, the IC device 901 is cooled in advance by the first temperature adjustment portion 12c or the second temperature adjustment portion 12d, but it may not be cooled. The same applies to the IC device 902 and the IC device 903 described later.

其次，如圖23所示，藉由第1器件供給部14c，將IC器件901搬送至與檢查部16之第1溫度設定部166對應之位置，亦即第1器件供給部14c之第1載置部261與檢查部16之第1溫度設定部166於Y方向並排之位置。 Next, as shown in FIG. 23, the IC device 901 is transported to a position corresponding to the first temperature setting section 166 of the inspection section 16 by the first device supply section 14c, that is, the first load of the first device supply section 14c The first temperature setting section 166 of the setting section 261 and the inspection section 16 are arranged side by side in the Y direction.

接著，藉由第1檢查用器件搬送頭17c之第1固持部271固持、冷卻IC器件901。 Next, the IC device 901 is held and cooled by the first holding portion 271 of the first inspection device transfer head 17c.

其次，如圖24所示，由第1固持部271固持之IC器件901係藉由該第1固持部271冷卻，並被搬送至檢查部16之第1溫度設定部166。接著，對IC器件901進行低溫檢查。 Next, as shown in FIG. 24, the IC device 901 held by the first holding portion 271 is cooled by the first holding portion 271 and is transferred to the first temperature setting portion 166 of the inspection portion 16. Next, the IC device 901 is subjected to a low-temperature inspection.

另，對IC器件901，雖預設為於此後進行常溫檢查，且亦可對完成低溫檢查之所有IC器件901進行常溫檢查，但較佳為僅對在低溫檢查中合格之IC器件901進行常溫檢查，無需對不合格之IC器件901進行常溫檢查。藉此，可省略不必要之檢查。 In addition, although the IC device 901 is preset to perform normal temperature inspection after that, and all the IC devices 901 that have completed the low temperature inspection can also be subjected to the normal temperature inspection, it is preferable to perform the normal temperature only on the IC devices 901 that pass the low temperature inspection. For inspection, there is no need to perform normal temperature inspection on unqualified IC devices 901. Thereby, unnecessary inspection can be omitted.

另一方面，如圖25所示，第1器件供給部14c為了接收第2個IC器件902，故朝X方向負側移動。 On the other hand, as shown in FIG. 25, in order to receive the second IC device 902, the first device supply unit 14c moves to the negative side in the X direction.

其次，如圖26所示，第2個IC器件902係藉由供給用器件搬送頭13，載置於第1器件供給部14c之第1載置部261。 Next, as shown in FIG. 26, the second IC device 902 is placed on the first placement section 261 of the first device supply section 14c by the supply device transfer head 13.

其次，如圖27所示，第1器件供給部14c朝X方向正側移動，並停止於第1器件供給部14c之第2載置部262與檢查部16之第1溫度設定部166沿Y方向並排之位置。 Next, as shown in FIG. 27, the first device supply portion 14c moves to the positive side in the X direction and stops at the second placement portion 262 of the first device supply portion 14c and the first temperature setting portion 166 of the inspection portion 16 along the Y Position side by side.

其次，如圖28所示，藉由第1檢查用器件搬送頭17c之第1固持部271固持之IC器件901係被搬送、放置於第1器件供給部14c之第2載置部262，並被載置於該第2載置部262。亦即，於第2載置部262中，載置低溫檢查後之IC器件901。 Next, as shown in FIG. 28, the IC device 901 held by the first holding portion 271 of the first inspection device transfer head 17c is transferred and placed in the second placement portion 262 of the first device supply portion 14c, and It is placed on the second placing portion 262. That is, the IC device 901 after the low-temperature inspection is mounted on the second mounting portion 262.

接著，如圖29所示，第1器件供給部14c朝X方向正側移動，並停止於第1器件供給部14c之第1載置部261與檢查部16之第1溫度設定部166沿Y方向並排，第2載置部262與第2溫度設定部167沿Y方向並排之位置。 Next, as shown in FIG. 29, the first device supply portion 14 c moves to the positive side in the X direction and stops at the first placement portion 261 of the first device supply portion 14 c and the first temperature setting portion 166 of the inspection portion 16 along the Y The second mounting portion 262 and the second temperature setting portion 167 are aligned side by side in the Y direction.

其次，藉由第1檢查用器件搬送頭17c之第1固持部271固持、冷卻第2個IC器件902，與此同時，藉由第2固持部272固持第1個IC器件901。 Next, the second IC device 902 is held and cooled by the first holding portion 271 of the first inspection device transfer head 17c, and at the same time, the first IC device 901 is held by the second holding portion 272.

其次，如圖30所示，藉由第1固持部271固持之IC器件902係藉由該第1固持部271被冷卻，並被搬送至檢查部16之第1溫度設定部166，與此同時，藉由第2固持部272固持之IC器件901係藉由該第2固持部272而被搬送至檢查部16之第2溫度設定部167。此後，對IC器件901進行常溫檢查，對IC器件902進行低溫檢查。 Next, as shown in FIG. 30, the IC device 902 held by the first holding portion 271 is cooled by the first holding portion 271 and is transferred to the first temperature setting portion 166 of the inspection portion 16. The IC device 901 held by the second holding portion 272 is transported to the second temperature setting portion 167 of the inspection portion 16 by the second holding portion 272. Thereafter, the IC device 901 is subjected to a normal temperature inspection, and the IC device 902 is subjected to a low temperature inspection.

另，對IC器件901，雖預設為於此後進行高溫檢查，且亦可對完成常溫檢查之所有IC器件901進行高溫檢查，但較佳為僅對在常溫檢查合格之IC器件901進行高溫檢查，無需對不合格之IC器件901進行高溫檢查。又，對IC器件902，雖預設為於此後進行常溫檢查，且亦可對完成低溫檢查之所有IC器件902進行常溫檢查，但較佳為僅對在低溫檢查中合格之IC器件902進行常溫檢查，無需對不合格之IC器件902進行常溫檢查。藉此，可省略不必要之檢查。 In addition, although the IC device 901 is preset to be subjected to a high-temperature inspection after that, and all the IC devices 901 that have completed the normal-temperature inspection can also be subjected to a high-temperature inspection, it is preferable to perform the high-temperature inspection only on the IC devices 901 that pass the normal-temperature inspection. It is not necessary to perform a high-temperature inspection on unqualified IC devices 901. In addition, although the IC device 902 is preset to perform normal temperature inspection after that, and all the IC devices 902 that have completed the low temperature inspection can also be subjected to the normal temperature inspection, it is preferable to perform the normal temperature only on the IC devices 902 that pass the low temperature inspection. For inspection, there is no need to perform normal temperature inspection on the failed IC device 902. Thereby, unnecessary inspection can be omitted.

另一方面，如圖31所示，第1器件供給部14c為了接收第3個IC器件903，故朝X方向負側移動。 On the other hand, as shown in FIG. 31, in order to receive the third IC device 903, the first device supply unit 14c moves to the negative side in the X direction.

其次，如圖32所示，第3個IC器件903係藉由供給用器件搬送頭 13而被載置於第1器件供給部14c之第1載置部261。 Next, as shown in FIG. 32, the third IC device 903 is a supply device transfer head 13 is placed on the first placement portion 261 of the first device supply portion 14c.

其次，如圖33所示，第1器件供給部14c朝X方向正側移動，並停止於第1器件供給部14c之第2載置部262與檢查部16之第1溫度設定部166沿Y方向並排之位置。 Next, as shown in FIG. 33, the first device supply portion 14c moves to the positive side in the X direction and stops at the second placement portion 262 of the first device supply portion 14c and the first temperature setting portion 166 of the inspection portion 16 along Y Position side by side.

其次，如圖34所示，藉由第1檢查用器件搬送頭17c之第1固持部271固持之IC器件902被搬送、放置於第1器件供給部14c之第2載置部262，並被載置於該第2載置部262，同樣地，藉由第2固持部272固持之IC器件901被搬送、放置於第3載置部263，並被載置於該第3載置部263。亦即，於第2載置部262中，載置低溫檢查後之IC器件902，於第3載置部263中，載置常溫檢查後之IC器件901。 Next, as shown in FIG. 34, the IC device 902 held by the first holding portion 271 of the first inspection device transfer head 17c is transported and placed on the second placement portion 262 of the first device supply portion 14c, and is placed Similarly, the IC device 901 held by the second holding portion 272 is placed on the second placing portion 262, and is placed on the third placing portion 263 and placed on the third placing portion 263. . That is, the IC device 902 after the low-temperature inspection is placed on the second placement portion 262, and the IC device 901 after the normal-temperature inspection is placed on the third placement portion 263.

接著，如圖35所示，第1器件供給部14c朝X方向正側移動，並停止於第1器件供給部14c之第1載置部261與檢查部16之第1溫度設定部166沿Y方向並排，第2載置部262與第2溫度設定部167沿Y方向並排，第3載置部263與第3溫度設定部168沿Y方向並排之位置。 Next, as shown in FIG. 35, the first device supply portion 14 c moves to the positive side in the X direction, and stops at the first placement portion 261 of the first device supply portion 14 c and the first temperature setting portion 166 of the inspection portion 16 along the Y The second mounting portion 262 and the second temperature setting portion 167 are arranged side by side in the Y direction, and the third mounting portion 263 and the third temperature setting portion 168 are arranged side by side in the Y direction.

其次，藉由第1檢查用器件搬送頭17c之第1固持部271固持、冷卻第3個IC器件903，與此同時，藉由第2固持部272固持第2個IC器件902，與此同時，藉由第3固持部273，固持、加熱第1個IC器件901。 Next, the third IC device 903 is held and cooled by the first holding portion 271 of the first inspection device transfer head 17c, and the second IC device 902 is held by the second holding portion 272, and at the same time, The first IC device 901 is held and heated by the third holding portion 273.

其次，如圖36所示，藉由第1固持部271固持之IC器件903係藉由該第1固持部271被冷卻，並被搬送至檢查部16之第1溫度設定部166，與此同時，藉由第2固持部272固持之IC器件902係藉由該第2固持部272而被搬送至檢查部16之第2溫度設定部167，與此同時，藉由第3固持部273固持之IC器件901係藉由該第3固持部273被加熱，並被搬送至第3溫度設定部168。此後，對IC器件901進行常溫檢查，對IC器件902進行低溫檢查，對IC器件903進行低溫檢查。 Next, as shown in FIG. 36, the IC device 903 held by the first holding portion 271 is cooled by the first holding portion 271, and is transferred to the first temperature setting portion 166 of the inspection portion 16, and at the same time The IC device 902 held by the second holding portion 272 is transported to the second temperature setting portion 167 of the inspection portion 16 by the second holding portion 272, and at the same time, the IC device 902 held by the third holding portion 272 is The IC device 901 is heated by the third holding portion 273 and is transported to the third temperature setting portion 168. Thereafter, the IC device 901 is subjected to a normal temperature inspection, the IC device 902 is subjected to a low temperature inspection, and the IC device 903 is subjected to a low temperature inspection.

另，對IC器件902，雖預設為於此後進行高溫檢查，且亦可對完成常溫檢查之所有IC器件902進行高溫檢查，但較佳為僅對在常溫檢 查中合格之IC器件902進行高溫檢查，無需對不合格之IC器件902進行高溫檢查。又，對IC器件903，雖預設為於以後進行常溫檢查，且亦可對完成低溫檢查之所有IC器件903進行常溫檢查，但較佳為僅對在低溫檢查中合格之IC器件903進行常溫檢查，無需對不合格之IC器件903進行常溫檢查。藉此，可省略不必要之檢查。 In addition, although the IC device 902 is preset to be subjected to a high-temperature inspection after that, and all IC devices 902 that have completed the normal-temperature inspection can also be subjected to a high-temperature inspection, it is preferable to perform the inspection only at the normal temperature. The qualified IC device 902 is checked for high temperature, and the unqualified IC device 902 is not required to be checked for high temperature. In addition, although the IC device 903 is preset to be subjected to normal temperature inspection at a later time, and all the IC devices 903 that have completed the low temperature inspection can also be subjected to the normal temperature inspection, it is preferable to perform the normal temperature only on the IC devices 903 that pass the low temperature inspection. For inspection, there is no need to perform normal temperature inspection on the failed IC device 903. Thereby, unnecessary inspection can be omitted.

另一方面，如圖37所示，第1器件回收部18c為了接收結束檢查之IC器件901，故朝X方向負側亦即與檢查部16對應之位置移動。 On the other hand, as shown in FIG. 37, in order to receive the IC device 901 that has completed the inspection, the first device recovery unit 18 c moves toward the negative side in the X direction, that is, the position corresponding to the inspection unit 16.

其次，如圖37所示，藉由第1檢查用器件搬送頭17c，將IC器件901搬送至與第1器件回收部18c對應之位置，將其載置於該第1器件回收部18c之8個凹穴185中之圖37中自左起第3個凹穴185。此後，如圖38所示，藉由第1器件回收部18c，將IC器件901搬送至回收區域A4。 Next, as shown in FIG. 37, the IC device 901 is transported to a position corresponding to the first device recovery section 18c by the first inspection device transfer head 17c, and is placed on the eighth of the first device recovery section 18c. Of the three pockets 185, the third pocket 185 is from the left in FIG. Thereafter, as shown in FIG. 38, the IC device 901 is transferred to the collection area A4 by the first device collection unit 18c.

與上述同樣地，第1器件供給部14c接著朝X方向負側移動而接收第4個IC器件904，接著，朝X方向正側移動，如圖39所示，藉由第1檢查用器件搬送頭17c之第1固持部271固持之IC器件903被放置於第1器件供給部14c之第2載置部262而被載置於該第2載置部262；同樣地，藉由第2固持部272固持之IC器件902被放置於第3載置部263並被載置於該第3載置部263。 In the same manner as described above, the first device supply unit 14c then moves to the negative side of the X direction to receive the fourth IC device 904, and then moves to the positive side of the X direction. As shown in FIG. 39, it is transported by the first inspection device The IC device 903 held by the first holding portion 271 of the head 17c is placed on the second placing portion 262 of the first device supply portion 14c and is placed on the second placing portion 262; similarly, by the second holding The IC device 902 held by the portion 272 is placed on the third placement portion 263 and is placed on the third placement portion 263.

其次，如圖40所示，第1器件供給部14c朝X方向正側移動，並停止於第1器件供給部14c之第1載置部261與檢查部16之第1溫度設定部166沿Y方向並排之位置。 Next, as shown in FIG. 40, the first device supply portion 14c moves to the positive side in the X direction and stops at the first placement portion 261 of the first device supply portion 14c and the first temperature setting portion 166 of the inspection portion 16 along Y Position side by side.

其次，藉由第1檢查用器件搬送頭17c之第1固持部271固持、冷卻第4個IC器件904，與此同時，藉由第2固持部272固持第3個IC器件903，與此同時，藉由第3固持部273固持、加熱第2個IC器件902。 Next, the fourth IC device 904 is held and cooled by the first holding portion 271 of the first inspection device transfer head 17c, and the third IC device 903 is held by the second holding portion 272, and at the same time, The second IC device 902 is held and heated by the third holding portion 273.

其次，如圖41所示，藉由第1固持部271固持之IC器件904係藉由該第1固持部271被冷卻，並被搬送至檢查部16之第1溫度設定部166，與此同時，藉由第2固持部272固持之IC器件903係藉由該第2固持部 272而被搬送至檢查部16之第2溫度設定部167，與此同時，藉由第3固持部273固持之IC器件902係藉由該第3固持部273被加熱，並被搬送至第3溫度設定部168。此後，對IC器件902進行高溫檢查，對IC器件903進行常溫檢查，對IC器件904進行低溫檢查。 Next, as shown in FIG. 41, the IC device 904 held by the first holding portion 271 is cooled by the first holding portion 271, and is transferred to the first temperature setting portion 166 of the inspection portion 16, and at the same time The IC device 903 held by the second holding portion 272 is the second holding portion 272 is transferred to the second temperature setting section 167 of the inspection section 16, and at the same time, the IC device 902 held by the third holding section 273 is heated by the third holding section 273, and is transferred to the third Temperature setting section 168. Thereafter, the IC device 902 is subjected to a high temperature inspection, the IC device 903 is subjected to a normal temperature inspection, and the IC device 904 is subjected to a low temperature inspection.

另一方面，如圖42所示，第1器件回收部18c為了接收完成檢查之IC器件902，故朝X方向負側，亦即與檢查部16對應之位置移動。 On the other hand, as shown in FIG. 42, in order to receive the IC device 902 that has completed the inspection, the first device recovery unit 18 c moves to the negative side in the X direction, that is, a position corresponding to the inspection unit 16.

其次，如圖42所示，藉由第1檢查用器件搬送頭17c，將IC器件902搬送至與第1器件回收部18c對應之位置，將其載置於該第1器件回收部18c之8個凹穴185中之圖42中自左起第3個凹穴185。此後，如圖43所示，藉由第1器件回收部18c，將IC器件902搬送至回收區域A4。 Next, as shown in FIG. 42, the IC device 902 is transported to a position corresponding to the first device recovery section 18c by the first inspection device transfer head 17c, and is placed on the eighth part of the first device recovery section 18c. Of the recesses 185, the third recess 185 from the left is shown in FIG. Thereafter, as shown in FIG. 43, the IC device 902 is transported to the recovery area A4 by the first device recovery unit 18c.

與上述同樣地，第1器件供給部14c接著朝X方向負側移動而接收第5個IC器件905，接著，朝X方向正側移動，如圖44所示，藉由第1檢查用器件搬送頭17c之第1固持部271固持之IC器件904被放置於第1器件供給部14c之第2載置部262並被載置於該第2載置部262；同樣地，藉由第2固持部272固持之IC器件903被放置於第3載置部263並被載置於該第3載置部263。 In the same manner as described above, the first device supply unit 14c then moves to the negative side of the X direction to receive the fifth IC device 905, and then moves to the positive side of the X direction. As shown in FIG. 44, it is transported by the first inspection device. The IC device 904 held by the first holding portion 271 of the head 17c is placed and placed on the second placing portion 262 of the first device supply portion 14c; similarly, by the second holding The IC device 903 held by the portion 272 is placed on the third placement portion 263 and is placed on the third placement portion 263.

其次，如圖45所示，第1器件供給部14c朝X方向正側移動，並停止於第1器件供給部14c之第1載置部261與檢查部16之第1溫度設定部166沿Y方向並排之位置。 Next, as shown in FIG. 45, the first device supply portion 14c moves to the positive side in the X direction and stops at the first placement portion 261 of the first device supply portion 14c and the first temperature setting portion 166 of the inspection portion 16 along the Y Position side by side.

其次，藉由第1檢查用器件搬送頭17c之第1固持部271固持、冷卻第5個IC器件905，與此同時，藉由第2固持部272固持第4個IC器件904，與此同時，藉由第3固持部273固持、加熱第3個IC器件903。 Next, the fifth IC device 905 is held and cooled by the first holding portion 271 of the first inspection device transfer head 17c, and the fourth IC device 904 is held by the second holding portion 272, and at the same time, The third IC device 903 is held and heated by the third holding portion 273.

其次，如圖46所示，藉由第1固持部271固持之IC器件905係藉由該第1固持部271被冷卻，並被搬送至檢查部16之第1溫度設定部166，與此同時，藉由第2固持部272固持之IC器件904係藉由該第2固持部272而被搬送至檢查部16之第2溫度設定部167，與此同時，藉由第3固 持部273固持之IC器件903係藉由該第3固持部273被加熱，並被搬送至第3溫度設定部168。此後，對IC器件903進行高溫檢查，對IC器件904進行常溫檢查，對IC器件905進行低溫檢查。 Next, as shown in FIG. 46, the IC device 905 held by the first holding portion 271 is cooled by the first holding portion 271 and is transferred to the first temperature setting portion 166 of the inspection portion 16. The IC device 904 held by the second holding portion 272 is transported to the second temperature setting portion 167 of the inspection portion 16 by the second holding portion 272, and at the same time, by the third fixing portion The IC device 903 held by the holding portion 273 is heated by the third holding portion 273 and is transferred to the third temperature setting portion 168. Thereafter, the IC device 903 is subjected to a high temperature inspection, the IC device 904 is subjected to a normal temperature inspection, and the IC device 905 is subjected to a low temperature inspection.

另一方面，如圖47所示，第1器件回收部18c為了接收完成檢查之IC器件903，故朝X方向負側，亦即與檢查部16對應之位置移動。 On the other hand, as shown in FIG. 47, in order to receive the IC device 903 that has completed the inspection, the first device recovery unit 18 c moves to the negative side in the X direction, that is, a position corresponding to the inspection unit 16.

其次，如圖47所示，藉由第1檢查用器件搬送頭17c，將IC器件903搬送至與第1器件回收部18c對應之位置，將其載置於該第1器件回收部18c之8個凹穴185中之圖47中自左起第3個凹穴185。此後，如圖48所示，藉由第1器件回收部18c，將IC器件903搬送至回收區域A4。 Next, as shown in FIG. 47, the IC device 903 is transported to a position corresponding to the first device recovery unit 18c by the first inspection device transport head 17c, and is placed on the eighth of the first device recovery unit 18c. Of the recesses 185, the third recess 185 from the left is shown in FIG. 47. Thereafter, as shown in FIG. 48, the IC device 903 is transferred to the collection area A4 by the first device collection unit 18c.

以後反復進行相同之動作。 Repeat the same operation afterwards.

此處，如上所述，於僅對在低溫檢查中合格之IC器件90進行常溫檢查，且僅對在低溫檢查及常溫檢查中合格之IC器件90進行高溫檢查之情形中，例如，於IC器件902在常溫檢查中不合格(低溫檢查中為合格)之情形時，該IC器件902係被載置於第1器件回收部18c之8個凹穴185中之圖37中自左起第2個凹穴185，藉由第1器件回收部18c被搬送至回收區域A4。又，於IC器件903在低溫檢查中不合格之情形時，該IC器件903係被載置於第1器件回收部18c之8個凹穴185中之圖37中左側之凹穴185，藉由第1器件回收部18c被搬送至回收區域A4。於該情形時，於第1器件回收部18c之8個凹穴185中之圖37中左側之凹穴185中，載置有在低溫檢查中不合格之IC器件90；於圖37中自左起第2個凹穴185中，載置有在低溫檢查中合格，在常溫檢查中不合格之IC器件90；於圖37中自左起第3個凹穴185中，載置有在低溫檢查及常溫檢查中合格，在高溫檢查中不合格之IC器件90。 Here, as described above, in a case where the normal temperature inspection is performed only on the IC device 90 that passed the low temperature inspection, and only the IC device 90 that passes the low temperature inspection and the normal temperature inspection is subjected to the high temperature inspection, for example, in the IC device When the 902 fails in the normal temperature inspection (passed in the low temperature inspection), the IC device 902 is placed in the eight recesses 185 of the first device recovery section 18c. The second one from the left in FIG. 37 The pocket 185 is transferred to the collection area A4 by the first device collection unit 18c. When the IC device 903 fails the low-temperature inspection, the IC device 903 is placed in the left recess 185 in FIG. 37 of the eight recesses 185 of the first device recovery section 18c. The first device recovery unit 18c is transported to the recovery area A4. In this case, an IC device 90 that failed the low temperature inspection is placed in the left cavity 185 in FIG. 37 of the eight recesses 185 in the first device recovery section 18c; from left in FIG. 37 From the second cavity 185, the IC device 90 that passed the low temperature inspection and failed the normal temperature inspection is placed; in FIG. 37, the third cavity 185 from the left is placed under the low temperature inspection And IC device 90 that passed the normal temperature inspection and failed the high temperature inspection.

以上，雖已對藉由第1器件供給部14c、第1檢查用器件搬送頭17c及第1器件回收部18c進行IC器件90之搬送等之情形進行說明，但亦可藉由第2器件回收部14d、第2檢查用器件搬送頭17d及第2器件回收部 18d同樣地執行。 The above has described the case where the IC device 90 is transported by the first device supply unit 14c, the first inspection device transfer head 17c, and the first device recovery unit 18c, but it can also be recovered by the second device. Section 14d, second inspection device transfer head 17d, and second device recovery section 18d does the same.

再者，亦可並行進行藉由第1器件供給部14c、第1檢查用器件搬送頭17c及第1器件回收部18c搬送IC器件90而進行之檢查、與藉由第2器件供給部14d、第2檢查用器件搬送頭17d及第2器件回收部18d搬送IC器件90而進行之檢查。據此而言，可提高產出量。 In addition, the inspection performed by the IC device 90 by the first device supply unit 14c, the first inspection device transfer head 17c, and the first device recovery unit 18c, and the inspection by the second device supply unit 14d, The inspection performed by the second device transport head 17d and the second device recovery unit 18d transporting the IC device 90. According to this, the output can be increased.

如以上所說明般，根據該檢查裝置1c，可進行IC器件90之低溫檢查、常溫檢查及高溫檢查之各者，便利性高。 As described above, according to the inspection device 1c, each of the low temperature inspection, the normal temperature inspection, and the high temperature inspection of the IC device 90 can be performed, and the convenience is high.

又，於對1個IC器件90進行低溫檢查、常溫檢查及高溫檢查之情形時，無需暫時回收IC器件90，即可進行該低溫檢查、常溫檢查及高溫檢查，藉此，可提高產出量。 In addition, when performing low temperature inspection, normal temperature inspection, and high temperature inspection on one IC device 90, the low temperature inspection, normal temperature inspection, and high temperature inspection can be performed without temporarily recovering the IC device 90, thereby increasing the output. .

再者，因同時進行第1個IC器件901之常溫檢查與第2個IC器件902之低溫檢查，且，因同時進行第1個IC器件901之高溫檢查、第2個IC器件902之常溫檢查、第3個IC器件903之低溫檢查，故可提高產出量。 Furthermore, the normal temperature inspection of the first IC device 901 and the low temperature inspection of the second IC device 902 are performed simultaneously, and the high temperature inspection of the first IC device 901 and the normal temperature inspection of the second IC device 902 are performed simultaneously. 3. The low temperature inspection of the third IC device 903 can increase the output.

又，IC器件90之檢查順序係首先為低溫檢查，第2項為常溫檢查，第3項為高溫檢查，因IC器件90並非以低溫狀態，而是以高溫狀態被搬送至回收區域A4，故可防止IC器件90之結露。 In addition, the inspection order of the IC device 90 is the low temperature inspection first, the second item is the normal temperature inspection, and the third item is the high temperature inspection. Since the IC device 90 is not transported to the recovery area A4 in a high temperature state, it is transported in a high temperature state. Condensation on the IC device 90 can be prevented.

又，低溫檢查與高溫檢查之間存在常溫檢查，因此，由於IC器件90係於暫時成為常溫後升至高溫，而非自低溫升至高溫，故可抑制IC器件90之過於急遽之溫度變化。 In addition, there is a normal temperature inspection between the low temperature inspection and the high temperature inspection. Therefore, since the IC device 90 rises to a high temperature after it becomes a normal temperature temporarily, instead of rising from a low temperature to a high temperature, an excessively rapid temperature change of the IC device 90 can be suppressed.

另，低溫檢查、常溫檢查、高溫檢查之順序並非限定於本實施形態，而可為任一種順序。 The order of low-temperature inspection, normal-temperature inspection, and high-temperature inspection is not limited to this embodiment, and may be any order.

再者，雖可省略低溫檢查、常溫檢查、高溫檢查中之任一者，但較理想為進行低溫檢查。換言之，較理想為不省略低溫檢查。 In addition, although any of the low-temperature inspection, the normal-temperature inspection, and the high-temperature inspection may be omitted, it is preferable to perform the low-temperature inspection. In other words, it is desirable not to omit the low-temperature inspection.

<第5實施形態> <Fifth Embodiment>

圖49係示意性顯示本發明之電子零件搬送裝置之第5實施形態之 第1檢查用器件搬送頭及檢查部之俯視圖。 Fig. 49 is a schematic view showing a fifth embodiment of the electronic component conveying device according to the present invention; Top view of the first inspection device transfer head and inspection unit.

以下，對第5實施形態進行說明，但以與上述第4實施形態之不同點為中心進行說明，相同之項則省略其說明。 Hereinafter, the fifth embodiment will be described, but the differences from the fourth embodiment will be mainly described, and the description of the same items will be omitted.

如圖49所示，於第5實施形態之檢查裝置1c中，檢查部16之8個保持部163中之圖49中左側之2個保持部163構成第1溫度設定部281，其冷卻IC器件90而可將該IC器件90之溫度調整(可設定)為適合低溫檢查之溫度(第1溫度)。 As shown in FIG. 49, in the inspection device 1c of the fifth embodiment, among the eight holding portions 163 of the inspection portion 16, two holding portions 163 on the left in FIG. 49 constitute a first temperature setting portion 281, which cools the IC device. The temperature of the IC device 90 can be adjusted (settable) to a temperature (first temperature) suitable for low-temperature inspection.

又，檢查部16之8個保持部163中之圖49中自左起第2組之2個保持部163構成第2溫度設定部282，其加熱IC器件90而可將該IC器件90之溫度調整(可設定)為適合高溫檢查之溫度(第2溫度)。 In addition, among the eight holding portions 163 of the inspection portion 16, two holding portions 163 in the second group from the left in FIG. 49 constitute a second temperature setting portion 282, which heats the IC device 90 so that the temperature of the IC device 90 can be increased. Adjust (settable) to a temperature (second temperature) suitable for high temperature inspection.

又，檢查部16之8個保持部163中之圖49中自左起第3組之2個保持部163構成第1溫度設定部283，其冷卻IC器件90而將該IC器件90之溫度調整(可設定)為適合低溫檢查之溫度(第1溫度)。 Also, among the eight holding portions 163 of the inspection portion 16, two holding portions 163 in the third group from the left in FIG. 49 constitute a first temperature setting portion 283, which cools the IC device 90 and adjusts the temperature of the IC device 90 (Can be set) A temperature (first temperature) suitable for low temperature inspection.

又，檢查部16之8個保持部163中之圖49中右側之2個保持部163構成第2溫度設定部284，其加熱IC器件90而將該IC器件90之溫度調整(可設定)為適合高溫檢查之溫度(第2溫度)。 Among the eight holding portions 163 of the inspection portion 16, two holding portions 163 on the right in FIG. 49 constitute a second temperature setting portion 284, which heats the IC device 90 to adjust (settable) the temperature of the IC device 90 to Temperature suitable for high-temperature inspection (second temperature).

亦即，於檢查部16中，由第1溫度設定部281、第2溫度設定部282構成之第1單元285與由第1溫度設定部283、第2溫度設定部284構成之第2單元286係沿X方向並排。 That is, the inspection unit 16 includes a first unit 285 including a first temperature setting unit 281 and a second temperature setting unit 282 and a second unit 286 including a first temperature setting unit 283 and a second temperature setting unit 284. Side by side in the X direction.

再者，第1檢查用器件搬送頭17c之8個第1手單元171c中之圖49中左側之2個第1手單元171c為第1固持部291，構成手單元第1溫度設定部(第1機械臂溫度設定部)251，其冷卻IC器件90而將該IC器件90之溫度調整(可設定)為適合低溫檢查之溫度(第1溫度)。 Furthermore, of the eight first hand units 171c of the first inspection device transfer head 17c, the two first hand units 171c on the left in FIG. 49 in FIG. 49 are the first holding portions 291 and constitute the first temperature setting portion of the hand unit (the 1 Robot arm temperature setting unit) 251, which cools the IC device 90 and adjusts (settable) the temperature of the IC device 90 to a temperature (first temperature) suitable for low-temperature inspection.

又，第1檢查用器件搬送頭17c之8個第1手單元171c中之圖49中自左起第2組之2個第1手單元171c為第2固持部292，構成手單元第2溫度設定部252(第2機械臂溫度設定部)，其加熱IC器件90而可將該IC器件 90之溫度調整(可設定)為適合高溫檢查之溫度(第2溫度)。 The eight first hand units 171c of the eighth first hand unit 171c of the first inspection device are shown in FIG. 49 from the left. The two first hand units 171c in the second group are the second holding portions 292, and constitute the second temperature of the hand unit. Setting section 252 (second robot arm temperature setting section), which heats the IC device 90 to enable the IC device The temperature adjustment (settable) of 90 is a temperature (second temperature) suitable for high temperature inspection.

又，第1檢查用器件搬送頭17c之8個第1手單元171c中之圖49中自左起第3組之2個第1處理單元171c為第1固持部293，構成手單元第1溫度設定部(第1機械臂溫度設定部)253，其冷卻IC器件90，可將該IC器件90之溫度調整(可設定)為適合低溫檢查之溫度(第1溫度)。 In addition, the eight first hand units 171c of the eighth first hand unit 171c of the first inspection device transfer device 2 from the third group from the left in FIG. 49. The two first processing units 171c are the first holding portions 293 and constitute the first temperature of the hand unit The setting unit (first robot arm temperature setting unit) 253 cools the IC device 90 and can adjust (settable) the temperature of the IC device 90 to a temperature (first temperature) suitable for low-temperature inspection.

再者，第1檢查用器件搬送頭17c之8個第1手單元171c中之圖49中右側之2個第1手單元171c為第2固持部294，構成手單元第2溫度設定部(第2機械臂溫度設定部)254，其加熱IC器件90而可將該IC器件90之溫度調整(可設定)為適合高溫檢查之溫度(第2溫度)。 Furthermore, of the eight first hand units 171c of the first inspection device transfer head 17c, the two first hand units 171c on the right in FIG. 49 of FIG. 49 are the second holding portions 294 and constitute the second temperature setting portion of the hand unit (the 2 Robot arm temperature setting unit) 254, which heats the IC device 90 to adjust (settable) the temperature of the IC device 90 to a temperature (second temperature) suitable for high-temperature inspection.

亦即，於第1檢查用器件搬送頭17c中，由第1固持部291(手單元第1溫度設定部251)及第2固持部292(手單元第2溫度設定部252)構成之第1單元295與由第1固持部293(手單元第1溫度設定部253)及第2固持部294(手單元第2溫度設定部254)構成之第2單元296係沿X方向並排。 That is, in the first inspection device transfer head 17c, the first holding unit 291 (the first unit temperature setting unit 251) and the second holding unit 292 (the second unit temperature setting unit 252) are first. The unit 295 and the second unit 296 composed of the first holding portion 293 (hand unit first temperature setting portion 253) and the second holding portion 294 (hand unit second temperature setting portion 254) are arranged side by side in the X direction.

該第1單元295與第2單元296執行相同之動作，且，其動作係與第4實施形態中省略常溫檢查之情形時相同。藉此，與1個單元之情形相比，可使產出量增至2倍。 The first unit 295 and the second unit 296 perform the same operations, and the operations are the same as when the normal temperature inspection is omitted in the fourth embodiment. As a result, the output can be doubled compared to the case of one unit.

另，第2檢查用器件搬送頭17d亦為同樣之情形。 The same applies to the second inspection device transfer head 17d.

藉由如以上之第5實施形態之檢查裝置1c，亦可發揮與上述第4實施形態相同之效果。 The inspection device 1c according to the fifth embodiment described above can also exhibit the same effects as the fourth embodiment described above.

另，於本實施形態中，檢查部16、第1檢查用器件搬送頭17c及第2檢查用器件搬送頭17d係上述單元數分別為2個，但亦可為3個以上。 In addition, in the present embodiment, the inspection unit 16, the first inspection device transfer head 17c, and the second inspection device transfer head 17d each have the above-mentioned number of units, but may be three or more.

又，於上述第4實施形態中，亦可與本實施形態同樣地，對檢查部16、第1檢查用器件搬送頭17c及第2檢查用器件搬送頭17d，分別設置複數個單元。 In the fourth embodiment, a plurality of units may be provided for the inspection unit 16, the first inspection device transfer head 17c, and the second inspection device transfer head 17d, as in the present embodiment.

以上，雖已基於圖示之實施形態，就本發明之電子零件搬送裝置及電子零件檢查裝置進行說明，但本發明並非限定於此者，各部之 構成可置換為能夠發揮相同功能之任意構成。又，亦可附加其他任意之構成物。 Although the electronic component transfer device and the electronic component inspection device of the present invention have been described based on the illustrated embodiment, the present invention is not limited to this. The structure can be replaced with an arbitrary structure that can perform the same function. Moreover, you may add another arbitrary structure.

再者，本發明亦可為組合上述各實施形態中之任意2個以上之構成(特徵)者。 In addition, the present invention may be a combination of any two or more configurations (features) in each of the above embodiments.

1‧‧‧檢查裝置(電子零件檢查裝置) 1‧‧‧Inspection device (electronic parts inspection device)

11A‧‧‧第1托盤搬送機構 11A‧‧‧The first pallet transfer mechanism

11B‧‧‧第2托盤搬送機構 11B‧‧‧Second pallet transfer mechanism

12a‧‧‧第1溫度調整部(第1均熱板) 12a‧‧‧The first temperature adjustment unit (the first soaking plate)

12b‧‧‧第2溫度調整部(第2均熱板) 12b‧‧‧Second temperature adjustment unit (second soaking plate)

13‧‧‧供給用器件搬送頭 13‧‧‧ supply device transfer head

14a‧‧‧第1器件供給部(第1供給梭) 14a‧‧‧ 1st device supply unit (1st supply shuttle)

14b‧‧‧第2器件供給部(第2供給梭) 14b‧‧‧Second device supply unit (second supply shuttle)

15‧‧‧第3托盤搬送機構 15‧‧‧3rd pallet transfer mechanism

16‧‧‧檢查部 16‧‧‧ Inspection Department

17a‧‧‧第1檢查用器件搬送頭 17a‧‧‧The first inspection device transfer head

17b‧‧‧第2檢查用器件搬送頭 17b‧‧‧ 2nd inspection device transfer head

18a‧‧‧第1器件回收部(第1回收梭) 18a‧‧‧The first device recovery section (the first recovery shuttle)

18b‧‧‧第2器件回收部(第2回收梭) 18b‧‧‧Second device recovery section (second recovery shuttle)

19‧‧‧回收用托盤 19‧‧‧Recycling tray

20‧‧‧回收用器件搬送頭 20‧‧‧Recycling device transfer head

21‧‧‧第6托盤搬送機構 21‧‧‧The 6th pallet transfer mechanism

22A‧‧‧第4托盤搬送機構 22A‧‧‧4th pallet transfer mechanism

22B‧‧‧第5托盤搬送機構 22B‧‧‧5th pallet transfer mechanism

80‧‧‧控制部 80‧‧‧Control Department

90‧‧‧IC器件 90‧‧‧IC device

131‧‧‧手單元 131‧‧‧hand unit

141‧‧‧器件供給部本體 141‧‧‧ Device Supply Department

142‧‧‧配置板 142‧‧‧Configuration board

145‧‧‧凹穴 145‧‧‧Dent

161‧‧‧檢查部本體 161‧‧‧ Inspection Department

162‧‧‧保持構件 162‧‧‧holding member

163‧‧‧保持部 163‧‧‧ Holding Department

166‧‧‧第1溫度設定部 166‧‧‧The first temperature setting unit

167‧‧‧第2溫度設定部 167‧‧‧Second temperature setting unit

181‧‧‧器件回收部本體 181‧‧‧Device Recovery Department

182‧‧‧配置板 182‧‧‧Configuration board

185‧‧‧凹穴 185‧‧‧Dent

200‧‧‧托盤 200‧‧‧tray

201‧‧‧手單元 201‧‧‧hand unit

A1‧‧‧托盤供給區域 A1‧‧‧Tray supply area

A2‧‧‧器件供給區域(供給區域) A2‧‧‧Device supply area (supply area)

A3‧‧‧檢查區域 A3‧‧‧ Inspection area

A4‧‧‧器件回收區域(回收區域) A4‧‧‧device recycling area (recycling area)

A5‧‧‧托盤移除區域 A5‧‧‧Tray removal area

R1‧‧‧第1室 R1‧‧‧Room 1

R2‧‧‧第2室 R2‧‧‧Room 2

R3‧‧‧第3室 R3‧‧‧Room 3

X‧‧‧方向 X‧‧‧ direction

Y‧‧‧方向 Y‧‧‧ direction

Z‧‧‧方向 Z‧‧‧ direction

Claims (9)

一種電子零件搬送裝置，其特徵在於包含：第1搬送部，其搬送電子零件，且可將上述電子零件設為第1溫度；及第2搬送部，其搬送上述電子零件，且可將上述電子零件設為與上述第1溫度不同之第2溫度。 An electronic parts conveying device, comprising: a first conveying part that conveys electronic parts, and that the electronic parts can be set to a first temperature; and a second conveying part that conveys the electronic parts, and can convey the electronic parts. The component is set to a second temperature different from the first temperature. 如請求項1之電子零件搬送裝置，其中上述第1搬送部具有：第1電子零件載置部，其可載置、移動上述電子零件，且可將上述電子零件設為上述第1溫度；及第1電子零件固持部，其可固持、移動上述電子零件，且可將上述電子零件設為上述第1溫度；且上述第2搬送部具有：第2電子零件載置部，其可載置、移動上述電子零件，且可將上述電子零件設為上述第2溫度；及第2電子零件固持部，其可固持、移動上述電子零件，且可將上述電子零件設為上述第2溫度。 For example, the electronic component transfer device according to claim 1, wherein the first transfer portion includes: a first electronic component placement portion that can mount and move the electronic component, and the electronic component can be set to the first temperature; and The first electronic component holding portion can hold and move the electronic component, and the electronic component can be set to the first temperature; and the second transporting portion includes a second electronic component holding portion that can mount, The electronic component can be moved and the electronic component can be set to the second temperature; and a second electronic component holding section can hold and move the electronic component and set the electronic component to the second temperature. 如請求項1之電子零件搬送裝置，其包含：電子零件載置部，其可載置、移動上述電子零件，且具有可將上述電子零件設為上述第1溫度之第1電子零件載置部溫度設定部、及可將上述電子零件設為上述第2溫度之第2電子零件載置部溫度設定部；及電子零件固持部，其可固持、移動上述電子零件，且具有可將上述電子零件設為上述第1溫度之第1電子零件固持部溫度設定部、及可將上述電子零件設為上述第2溫度之第2電子零件固持部溫度設定部；上述第1搬送部具有上述第1電子零件載置部溫度設定部及上 述第1電子零件固持部溫度設定部；且上述第2搬送部具有上述第2電子零件載置部溫度設定部及上述第2電子零件固持部溫度設定部。 For example, the electronic component transfer device of claim 1 includes an electronic component mounting section that can mount and move the electronic component, and has a first electronic component mounting section that can set the electronic component to the first temperature. A temperature setting unit, and a second electronic component placement unit temperature setting unit that can set the electronic component to the second temperature; and an electronic component holding unit that can hold and move the electronic component, and has the electronic component The first electronic component holding portion temperature setting portion set to the first temperature, and the second electronic component holding portion temperature setting portion to set the electronic component to the second temperature; the first transfer portion includes the first electronic component. Temperature setting part and upper part of part mounting part The first electronic component holding portion temperature setting portion; and the second transport portion includes the second electronic component holding portion temperature setting portion and the second electronic component holding portion temperature setting portion. 如請求項3之電子零件搬送裝置，其包含：複數個上述電子零件載置部；且包含複數個上述電子零件固持部。 For example, the electronic component transfer device of claim 3 includes: a plurality of the above-mentioned electronic component placement portions; and includes a plurality of the above-mentioned electronic component holding portions. 如請求項1至4中任一項之電子零件搬送裝置，其中於以上述第1搬送部搬送上述電子零件後，以上述第2搬送部搬送上述電子零件。 The electronic component transfer device according to any one of claims 1 to 4, wherein after the electronic component is transferred by the first transfer unit, the electronic component is transferred by the second transfer unit. 如請求項1至4中任一項之電子零件搬送裝置，其中上述第1溫度低於上述第2溫度。 The electronic component transfer device according to any one of claims 1 to 4, wherein the first temperature is lower than the second temperature. 如請求項1至4中任一項之電子零件搬送裝置，其中以上述第1溫度進行上述電子零件之檢查且上述檢查合格之情形時，以上述第2溫度進行上述電子零件之檢查。 In the case of the electronic component transfer device according to any one of claims 1 to 4, when the inspection of the electronic component is performed at the first temperature and the inspection is qualified, the inspection of the electronic component is performed at the second temperature. 一種電子零件檢查裝置，其特徵在於包含：第1搬送部，其搬送電子零件，且可將上述電子零件設為第1溫度；第2搬送部，其搬送上述電子零件，且可將上述電子零件設為與上述第1溫度不同之第2溫度；及檢查部，其檢查上述電子零件。 An electronic component inspection device, comprising: a first conveying section that conveys electronic components, wherein the electronic component can be set to a first temperature; and a second conveying section that conveys the electronic components, and can convey the electronic components. The second temperature is different from the first temperature; and an inspection unit that inspects the electronic components. 如請求項8之電子零件檢查裝置，其中於上述檢查部，設置可將上述電子零件設為上述第1溫度之第1溫度設定部、及可將上述電子零件設為上述第2溫度之第2溫度設定部。 The electronic component inspection device according to claim 8, wherein the inspection unit is provided with a first temperature setting unit capable of setting the electronic component to the first temperature and a second temperature setting unit capable of setting the electronic component to the second temperature. Temperature setting section.
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