TW201813793A - Electronic components conveying apparatus and electronic components inspection device capable of preventing electronic components from being blown away when the holding portion releases the holding of the electronic components and the electronic components have fallen - Google Patents
Electronic components conveying apparatus and electronic components inspection device capable of preventing electronic components from being blown away when the holding portion releases the holding of the electronic components and the electronic components have fallen Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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Abstract
Description
本發明係關於電子零件搬送裝置及電子零件檢查裝置。The present invention relates to an electronic component transfer device and an electronic component inspection device.
先前以來，已知有例如檢查IC(Integrated Circuit：積體電路)器件等電子零件之電氣特性之電子零件檢查裝置，於該電子零件檢查裝置，組入有用以搬送IC器件之電子零件搬送裝置(例如，參照專利文獻1)。 專利文獻1所記載之電子零件檢查裝置具備：吸附噴嘴，其具有可吸附固持IC器件之流道。於吸附噴嘴連接有真空吸引迴路，且可切換吸引或吸引解除。藉此，吸附噴嘴可進行IC器件之固持或解除。 又，於專利文獻1所記載之電子零件檢查裝置中，如下構成：基於設置於真空吸引迴路且檢測真空吸引迴路內之空氣流量之流量計之檢測結果，切換IC器件之固持或解除之時序。藉此，可減少自吸附噴嘴真空吸引之異物之影響，而確保穩定之安裝動作。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2004-193191號公報Conventionally, there has been known an electronic component inspection device for inspecting the electrical characteristics of electronic components such as IC (Integrated Circuit) devices, and the electronic component inspection device incorporates an electronic component conveying device for conveying IC devices ( For example, refer to Patent Document 1). The electronic component inspection device described in Patent Document 1 includes an adsorption nozzle having a flow path capable of adsorbing and holding an IC device. A vacuum suction circuit is connected to the suction nozzle, and suction can be switched or released. Thereby, the suction nozzle can hold or release the IC device. The electronic component inspection device described in Patent Document 1 has a configuration in which the timing of holding or releasing the IC device is switched based on a detection result of a flowmeter installed in the vacuum suction circuit and detecting the air flow rate in the vacuum suction circuit. This can reduce the influence of the foreign matter attracted by the vacuum of the self-adsorption nozzle, and ensure a stable installation operation. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2004-193191
[發明所欲解決之問題] 然而，於專利文獻1所記載之電子零件檢查裝置中，構成為基於真空吸引迴路內之流量而切換IC器件之固持或解除之時序。因此，例如，於將吸附噴嘴更換為真空吸引迴路內之剖面積不同之吸附噴嘴之情形時，無法基於空氣之流量以正確之時序進行IC器件之固持、解除之切換。 尤其，於吸附噴嘴之徑可變之情形等，內腔部321中之流速根據流道剖面積之大小而改變。其結果，難以設為適於解除吸附固持之流量。於該情形時，於解除IC器件之吸附固持後自吸附噴嘴吹出快速之流速之空氣，而導致將整齊收納於收納袋之IC器件吹散。其結果，IC器件成為未整齊地落位於袋之姿勢而產生於接下來之步驟中無法吸附之錯誤(JAM：堵塞)。 [解決問題之技術手段] 本發明係為了解決上述課題之至少一部分而完成者，且可作為以下之形態或應用例而實現。 本發明之電子零件搬送裝置之特徵在於，可配置複數個固持部，該固持部具有可吸附固持電子零件之開口部、及與上述開口部連通之第1流道，且上述流道之流道剖面積不同，且該電子零件搬送裝置具備： 第1壓力產生源，其產生低於大氣壓之第1壓力； 第2壓力產生源，其產生高於大氣壓之第2壓力； 切換部，其經由可與上述第1流道連通之第2流道而連接於上述第1壓力產生源及上述第2壓力產生源，且可切換上述第2流道之壓力； 壓力調節部，其設置於上述切換部與上述第2壓力產生源之間，且可調節上述第1流道之壓力；及 壓力檢測部，其設置於上述固持部與上述切換部之間，且可檢測上述固持部與上述切換部之間之壓力。 藉此，於固持部解除電子零件之吸附固持時，不會因快速之空氣流速對吹電子零件而將已落位之電子零件吹散，且可將流道內之壓力設為大氣壓以上，而可確實地將電子零件隔開。其結果，可使已解除固持之電子零件確實地自固持部離開，且可防止電子零件因過度之力量而遠離固持部，不會因快速之空氣流速將已落位之電子零件吹散，且可將流道內之壓力設為大氣壓以上，而可確實地將電子零件隔開。 於本發明之電子零件搬送裝置中，較佳為上述壓力調節部基於上述壓力檢測部之檢測結果而調節上述流道之壓力。 藉此，壓力調節部可基於固持部與切換部之間之壓力而調節流道內之壓力。因此，可對電子零件更確實且適當地施加力。 於本發明之電子零件搬送裝置中，較佳為於上述壓力調節部之與上述第2壓力產生源相反之側，分別連接有複數個上述壓力檢測部及上述切換部。 藉此，即便設置有複數個固持部，於各固持部解除電子零件之吸附固持時，亦可對各電子零件適當地施加力。 於本發明之電子零件搬送裝置中，較佳為上述壓力調節部以上述各固持部之上述流道之壓力差為特定值以內之方式進行調節。 藉此，於各固持部解除電子零件之吸附固持時，不會因快速之空氣流速對吹各電子零件而將已落位之電子零件吹散，且可將流道內之壓力設為大氣壓以上，而可確實地將電子零件隔開。 於本發明之電子零件搬送裝置中，較佳為上述壓力調節部可於將上述各切換部統一切換之情形、及將上述各切換部於互不相同之時序切換之情形，使上述第1流道之壓力不同。 藉此，於各固持部解除電子零件之吸附固持時，不會因快速之空氣流速對吹各電子零件而將已落位之電子零件吹散，且可將流道內之壓力設為大氣壓以上，而可確實地將電子零件隔開。 於本發明之電子零件搬送裝置中，較佳為上述切換部可調整上述第2壓力產生源對上述固持部產生上述第2壓力之時間。 藉此，於固持部解除電子零件之吸附固持時，不會因快速之空氣流速對吹電子零件而將已落位之電子零件吹散，且可將流道內之壓力設為大氣壓以上，而可確實地將電子零件隔開。其結果，可使已解除固持之電子零件確實地自固持部離開，且可防止電子零件因過度之力量而遠離固持部，不會因快速之空氣流速將已落位之電子零件吹散，且可將流道內之壓力設為大氣壓以上，而可確實地將電子零件隔開。 本發明之電子零件搬送裝置之特徵在於具備：安裝部，其可安裝複數個固持部，該固持部具有可供流體流通之流道，可將上述流道設為負壓而吸附固持電子零件，且上述流道之流道剖面積不同； 負壓產生源，其產生負壓； 正壓產生源，其產生正壓； 切換部，其將上述流道內之壓力切換為負壓與正壓； 壓力調節部，其調節藉由上述正壓產生源產生之正壓之壓力；及 壓力檢測部，其檢測於上述安裝部安裝有上述固持部之狀態之上述流道之壓力。 藉此，於固持部解除電子零件之吸附固持時，不會因快速之空氣流速對吹電子零件而將已落位之電子零件吹散，且可將流道內之壓力設為大氣壓以上，而可確實地將電子零件隔開。其結果，可使已解除固持之電子零件確實地自固持部離開，且可防止電子零件因過度之力量而遠離固持部，不會因快速之空氣流速將已落位之電子零件吹散，且可將流道內之壓力設為大氣壓以上，而可確實地將電子零件隔開。 本發明之電子零件檢查裝置之特徵在於：可配置複數個固持部，該固持部具有可吸附固持電子零件之開口部、及與上述開口部連通之第1流道，且上述流道之流道剖面積不同，且電子零件檢查裝置具備： 第1壓力產生源，其產生低於大氣壓之第1壓力； 第2壓力產生源，其產生高於大氣壓之第2壓力； 切換部，其經由可與上述第1流道連通之第2流道而連接於上述第1壓力產生源及上述第2壓力產生源，且可切換上述第2流道之壓力； 壓力調節部，其設置於上述切換部與上述第2壓力產生源之間，且可調節上述第1流道之壓力； 壓力檢測部，其設置於上述固持部與上述切換部之間，且可檢測上述固持部與上述切換部之間之壓力；及 檢查部，其檢查上述電子零件。 藉此，於固持部解除電子零件之吸附固持時，不會因快速之空氣流速對吹電子零件而將已落位之電子零件吹散，且可將流道內之壓力設為大氣壓以上，而可確實地將電子零件隔開。其結果，可使已解除固持之電子零件確實地自固持部離開，且可防止電子零件因過度之力量而遠離固持部，不會因快速之空氣流速將已落位之電子零件吹散，且可將流道內之壓力設為大氣壓以上，而可確實地將電子零件隔開。又，可以檢查部精度良好地對電子零件進行檢查。[Problems to be Solved by the Invention] However, in the electronic component inspection device described in Patent Document 1, the timing of holding or releasing the IC device is configured based on the flow rate in the vacuum suction circuit. Therefore, for example, when the adsorption nozzle is replaced with an adsorption nozzle having a different cross-sectional area in the vacuum suction circuit, it is impossible to switch the holding and releasing of the IC device at the correct timing based on the air flow rate. In particular, in the case where the diameter of the suction nozzle is variable, the flow velocity in the inner cavity portion 321 changes depending on the cross-sectional area of the flow channel. As a result, it is difficult to set a flow rate suitable for releasing the adsorption and holding. In this case, after the adsorption holding of the IC device is released, a rapid flow rate of air is blown from the adsorption nozzle, which causes the IC device neatly stored in the storage bag to blow off. As a result, the IC device is placed in the bag in a non-uniform manner, and an error (JAM: jam) that cannot be adsorbed in the next step occurs. [Technical means for solving the problem] The present invention has been completed in order to solve at least a part of the problems described above, and can be implemented as the following forms or application examples. The electronic component transporting device of the present invention is characterized in that a plurality of holding portions can be arranged, the holding portion has an opening portion capable of holding the electronic component by suction, and a first flow channel communicating with the opening portion, and the flow channel of the flow channel The cross-sectional area is different, and the electronic component transfer device includes: a first pressure generating source that generates a first pressure lower than the atmospheric pressure; a second pressure generating source that generates a second pressure higher than the atmospheric pressure; A second flow path communicating with the first flow path is connected to the first pressure generation source and the second pressure generation source, and the pressure of the second flow path can be switched; a pressure adjustment section provided in the switching section And the second pressure generating source, and the pressure of the first flow path can be adjusted; and a pressure detecting section, which is provided between the holding section and the switching section, and can detect the holding section and the switching section Time pressure. Thereby, when the holding part releases the adsorption and holding of the electronic parts, the electronic parts that have fallen down will not be scattered due to the fast air flow against the blowing of the electronic parts, and the pressure in the flow channel can be set to above atmospheric pressure, and Electronic parts can be reliably separated. As a result, the electronic parts that have been released from holding can be surely separated from the holding part, and the electronic parts can be prevented from being moved away from the holding part due to excessive force, and the electronic parts that have fallen down will not be scattered due to rapid air flow, and The pressure in the flow path can be set to be higher than atmospheric pressure, and the electronic components can be reliably separated. In the electronic component conveying device of the present invention, it is preferable that the pressure adjusting section adjusts the pressure of the flow path based on a detection result of the pressure detecting section. Thereby, the pressure adjusting part can adjust the pressure in the flow path based on the pressure between the holding part and the switching part. Therefore, a force can be applied to the electronic component more surely and appropriately. In the electronic component conveying device of the present invention, it is preferable that a plurality of the pressure detecting section and the switching section are connected to the pressure adjusting section on the opposite side to the second pressure generating source, respectively. Thereby, even if a plurality of holding portions are provided, when each holding portion releases the suction and holding of the electronic component, a force can be appropriately applied to each electronic component. In the electronic component conveying device of the present invention, it is preferable that the pressure adjustment section adjusts the pressure difference of the flow path of each holding section within a specific value. Thereby, when the holding parts release the electronic parts from being held by the holding parts, the electronic parts that have fallen in place will not be scattered due to the rapid air velocity blow on the electronic parts, and the pressure in the flow channel can be set to above atmospheric pressure , And can reliably separate electronic parts. In the electronic parts conveying device of the present invention, it is preferable that the above-mentioned first flow is performed when the pressure adjusting section can switch the switching sections in a unified manner and when the switching sections are switched at different timings. The pressure of the Tao is different. Thereby, when the holding parts release the electronic parts from being held by the holding parts, the electronic parts that have fallen in place will not be scattered due to the rapid air velocity blow on the electronic parts, and the pressure in the flow channel can be set to above atmospheric pressure , And can reliably separate electronic parts. In the electronic component conveying device of the present invention, it is preferable that the switching section can adjust a time during which the second pressure generating source generates the second pressure to the holding section. Thereby, when the holding part releases the adsorption and holding of the electronic parts, the electronic parts that have fallen down will not be scattered due to the fast air flow against the blowing of the electronic parts, and the pressure in the flow channel can be set to above atmospheric pressure, and Electronic parts can be reliably separated. As a result, the electronic parts that have been released from holding can be surely separated from the holding part, and the electronic parts can be prevented from being moved away from the holding part due to excessive force, and the electronic parts that have fallen down will not be scattered due to rapid air flow, and The pressure in the flow path can be set to be higher than atmospheric pressure, and the electronic components can be reliably separated. The electronic component conveying device of the present invention is characterized by including: a mounting portion capable of mounting a plurality of holding portions, the holding portion having a flow channel through which a fluid can flow, and the above-mentioned flow channel can be set to a negative pressure to adsorb and hold the electronic component, And the cross-sectional area of the flow channel of the above-mentioned flow channel is different; the negative pressure generating source generates negative pressure; the positive pressure generating source generates positive pressure; the switching unit switches the pressure in the flow channel to negative pressure and positive pressure; The pressure adjusting section adjusts the pressure of the positive pressure generated by the positive pressure generating source; and the pressure detecting section detects the pressure of the flow path in a state where the holding section is mounted on the mounting section. Thereby, when the holding part releases the adsorption and holding of the electronic parts, the electronic parts that have fallen down will not be scattered due to the fast air flow against the blowing of the electronic parts, and the pressure in the flow channel can be set to above atmospheric pressure, and Electronic parts can be reliably separated. As a result, the electronic parts that have been released from holding can be surely separated from the holding part, and the electronic parts can be prevented from being moved away from the holding part due to excessive force, and the electronic parts that have fallen down will not be scattered due to rapid air flow, and The pressure in the flow path can be set to be higher than atmospheric pressure, and the electronic components can be reliably separated. The electronic component inspection device of the present invention is characterized in that a plurality of holding portions can be arranged, the holding portions having an opening portion capable of adsorbing and holding the electronic component, and a first flow channel communicating with the opening portion, and the flow channel of the flow channel The cross-sectional area is different, and the electronic component inspection device includes: a first pressure generating source that generates a first pressure lower than the atmospheric pressure; a second pressure generating source that generates a second pressure higher than the atmospheric pressure; The first flow path communicates with the second flow path and is connected to the first pressure generation source and the second pressure generation source, and the pressure of the second flow path can be switched. A pressure adjustment section is provided between the switching section and the switching section. The pressure between the second pressure generating source and the first flow path can be adjusted; a pressure detecting section is provided between the holding section and the switching section, and can detect the pressure between the holding section and the switching section; Pressure; and an inspection section that inspects the electronic components described above. Thereby, when the holding part releases the adsorption and holding of the electronic parts, the electronic parts that have fallen down will not be scattered due to the fast air flow against the blowing of the electronic parts, and the pressure in the flow channel can be set to above atmospheric pressure, and Electronic parts can be reliably separated. As a result, the electronic parts that have been released from holding can be surely separated from the holding part, and the electronic parts can be prevented from being moved away from the holding part due to excessive force, and the electronic parts that have fallen down will not be scattered due to rapid air flow, and The pressure in the flow path can be set to be higher than atmospheric pressure, and the electronic components can be reliably separated. In addition, the inspection unit can inspect electronic components with high accuracy.
以下，基於隨附圖式所示之較佳實施形態而詳細地說明本發明之電子零件搬送裝置及電子零件檢查裝置。 ＜第1實施形態＞ 以下，參照圖1～圖8，對本發明之電子零件搬送裝置及電子零件檢查裝置之第1實施形態進行說明。另，於以下，為了便於說明，如圖1所示，將相互正交之3軸設為X軸、Y軸及Z軸。又，包含X軸與Y軸之XY平面為水平，Z軸為鉛直。又，亦將平行於X軸之方向稱為「X方向(第1方向)」，將平行於Y軸之方向稱為「Y方向(第2方向)」，將平行於Z軸之方向稱為「Z方向(第3方向)」。又，將各方向之箭頭指向之方向稱為「正」，將其相反方向稱為「負」。又，於本案說明書中提及之「水平」不限定於完全水平，只要不妨礙電子零件之搬送，亦包含相對於水平略微(例如未達5°左右)傾斜之狀態。又，有時將圖3、圖4、圖7及圖8中之上側稱為「上」或「上方」，將下側稱為「下」或「下方」。 本發明之電子零件搬送裝置10可配置複數個作為固持部之吸附墊32，該吸附墊32具有可吸附固持電子零件之開口部320、及包含與開口部320連通之第1流道的流道30，且流道30(第1流道)之流道剖面積不同。又，電子零件搬送裝置10具備：作為第1壓力產生源之噴射器4，其產生低於大氣壓之第1壓力；作為第2壓力產生源之壓空泵5，其產生高於大氣壓之第2壓力；作為切換部之切換閥6，其經由流道30連接於噴射器4及壓空泵5，且可切換流道30之壓力；作為壓力調節部之調節器7，其設置於切換閥6與壓空泵5之間，且可調節流道30之壓力；及壓力檢測部8，其設置於吸附墊32與切換閥6之間，且可檢測吸附墊32與切換閥6之間之壓力。 換言之，電子零件搬送裝置10具備：作為安裝部之手部本體31，其可安裝複數個吸附墊32，該吸附墊32具有可供流體流通之流道30，可將流道30設為負壓而吸附固持電子零件，且流道30之流道剖面積不同；作為負壓產生源之噴射器4，其產生負壓；作為正壓產生源之壓空泵5，其產生正壓；切換閥6，其將流道30內之壓力切換為負壓與正壓；作為壓力調節部之調節器7，其調節由壓空泵5產生之正壓之壓力；及壓力檢測部8，其檢測於手部本體31安裝有吸附墊32之狀態之流道30之壓力。 根據此種電子零件搬送裝置10，於吸附墊32解除電子零件之吸附固持時，不會因來自吸附墊之快速之空氣流速對吹電子零件而將已落位之電子零件吹散，且可將流道內之壓力設為大氣壓以上，而可確實地將電子零件隔開。其結果，可使已解除固持之電子零件確實地自吸附墊32離開，且可防止電子零件因過度之力量而遠離吸附墊32。 本發明之電子零件檢查裝置1可配置複數個作為固持部之吸附墊32，該吸附墊32具有可吸附固持電子零件之開口部320、及包含與開口部320連通之第1流道的流道30，且流道30(第1流道)之流道剖面積不同。又，電子零件檢查裝置1具備：作為第1壓力產生源之噴射器4，其產生低於大氣壓之第1壓力；作為第2壓力產生源之壓空泵5，其產生高於大氣壓之第2壓力；作為切換部之切換閥6，其經由流道30連接於噴射器4及壓空泵5，且可切換流道30之壓力；作為壓力調節部之調節器7，其設置於切換閥6與壓空泵5之間，且可調節流道30之壓力；壓力檢測部8，其設置於吸附墊32與切換閥6之間，且可檢測吸附墊32與切換閥6之間之壓力；及檢查部16，其檢查電子零件。 藉此，獲得具有上述之電子零件搬送裝置10之優點之電子零件檢查裝置1。又，可將電子零件搬送至檢查部16，因此，可以檢查部16對該電子零件進行檢查。又，可將檢查後之電子零件自檢查部16搬送。 以下，對各部之構成進行說明。 如圖1、圖2所示，內置電子零件搬送裝置10之電子零件檢查裝置1係如下之裝置：搬送例如BGA(Ball Grid Array：球狀柵格陣列)封裝即IC器件等電子零件，且於該搬送過程中檢查、試驗(以下簡稱為「檢查」)電子零件之電氣特性。另，於以下，為了便於說明，對使用IC器件作為上述電子零件之情形代表性進行說明，而將其設為「IC器件90」。IC器件90於本實施形態中為呈平板狀者。 另，作為IC器件，除了上述者以外，列舉例如「LSI(Large Scale Integration：大型積體電路)」、「CMOS(Complementary MOS：互補型金屬氧化物半導體)」、「CCD(Charge Coupled Device：電荷耦合器件)」、或將IC器件複數模組封裝化之「模組IC」，又，「水晶器件」、「壓力感測器」、「慣性感測器(加速度感測器)」、「陀螺感測器」、「指紋感測器」等。 又，電子零件檢查裝置1(電子零件搬送裝置10)預先搭載按照IC器件90之種類而更換之被稱為「變更套件」者而使用。於該變更套件有載置IC器件90之載置部，作為該載置部有例如後述之溫度調整部12、器件供給部14等。又，作為載置IC器件90之載置部，除如上述之變更套件外，亦有由使用者準備之檢查部16或托盤200。 電子零件檢查裝置1具備托盤供給區域A1、器件供給區域(以下簡稱為「供給區域」)A2、檢查區域A3、器件回收區域(以下簡稱為「回收區域」)A4、及托盤去除區域A5，且該等區域如後述般由各壁部隔開。且，IC器件90於托盤供給區域A1至托盤去除區域A5於箭頭α90方向依序經過上述各區域，且於中途之檢查區域A3進行檢查。如此，電子零件檢查裝置1形成為具備：電子零件搬送裝置10即處理機，其於各區域搬送IC器件90；檢查部16，其於檢查區域A3內進行檢查；及控制部800。又，此外，電子零件檢查裝置1具備監視器300、信號燈400、及操作面板700。 另，電子零件檢查裝置1將配置有托盤供給區域A1、托盤去除區域A5者，即圖2中之下側作為正面側使用，將配置有檢查區域A3者，即圖2中之上側作為背面側使用。 托盤供給區域A1係供給排列有未檢查狀態之複數個IC器件90之托盤200的供材部。於托盤供給區域A1中，可堆疊多個托盤200。 供給區域A2係將自托盤供給區域A1搬送之托盤200上之複數個IC器件90分別搬送、供給至檢查區域A3之區域。另，以跨及托盤供給區域A1與供給區域A2之方式，設置有於水平方向逐片搬送托盤200之托盤搬送機構11A、11B。托盤搬送機構11A係可使托盤200連同載置於該托盤200之IC器件90朝Y方向正側，即圖2中之箭頭α11A 方向移動的移動部。藉此，可將IC器件90穩定地送入供給區域A2。又，托盤搬送機構11B係可使空托盤200朝Y方向負側，即圖2中之箭頭α11B 方向移動的移動部。藉此，可將空托盤200自供給區域A2移動至托盤供給區域A1。 於供給區域A2設置有溫度調整部(均熱板(英語表述：soak plate，中文表述(一例)：均溫板))12、器件搬送頭13、及托盤搬送機構15。 溫度調整部12構成為載置複數個IC器件90之載置部，且被稱為可將該載置之IC器件90統一加熱或冷卻之「均熱板」。藉由該均熱板，可將以檢查部16檢查前之IC器件90預先加熱或冷卻，而調整為適於該檢查(高溫檢查或低溫檢查)之溫度。於圖2所示之構成中，溫度調整部12於Y方向配置並固定有2個。且，由托盤搬送機構11A自托盤供給區域A1搬入之托盤200上之IC器件90被搬送至任一溫度調整部12。另，藉由該作為載置部之溫度調整部12固定，可對該溫度調整部12上之IC器件90穩定地進行溫度調整。 器件搬送頭13於供給區域A2內可於X方向及Y方向移動地受支持，且進而具有亦可於Z方向移動之部分。藉此，器件搬送頭13可承擔自托盤供給區域A1搬入之托盤200與溫度調整部12之間之IC器件90之搬送、及溫度調整部12與後述之器件供給部14之間之IC器件90之搬送。另，於圖2中，以箭頭α13X 表示器件搬送頭13之X方向之移動，以箭頭α13Y 表示器件搬送頭13之Y方向之移動。 托盤搬送機構15係將已去除所有IC器件90之狀態之空托盤200於供給區域A2內向X方向正側，即箭頭α15 方向搬送的機構。且，於該搬送後，空托盤200藉由托盤搬送機構11B而自供給區域A2返回至托盤供給區域A1。 檢查區域A3係檢查IC器件90之區域。於該檢查區域A3，設置有對IC器件90進行檢查之檢查部16、及器件搬送頭17。又，亦設置有以跨及供給區域A2與檢查區域A3之方式移動之器件供給部14、及以跨及檢查區域A3與回收區域A4之方式移動之器件回收部18。 器件供給部14構成為載置已以溫度調整部12調整溫度之IC器件90之載置部，且被稱為可將該IC器件90搬送至檢查部16附近之「供給用梭板」或簡稱為「供給梭」。 又，該作為載置部之器件供給部14於供給區域A2與檢查區域A3之間可沿著X方向，即箭頭α14 方向往復移動地受支持。藉此，器件供給部14可將IC器件90穩定地自供給區域A2搬送至檢查區域A3之檢查部16附近，又，可於檢查區域A3中藉由器件搬送頭17去除IC器件90後再次返回至供給區域A2。 於圖2所示之構成中，器件供給部14於Y方向配置有2個，溫度調整部12上之IC器件90被搬送至任一器件供給部14。又，器件供給部14與溫度調整部12同樣，構成為可將載置於該器件供給部14之IC器件90加熱或冷卻。藉此，可對已以溫度調整部12調整溫度之IC器件90維持其溫度調整狀態，並搬送至檢查區域A3之檢查部16附近。 器件搬送頭17係固持維持上述溫度調整狀態之IC器件90，並將該IC器件90於檢查區域A3內搬送的動作部。該器件搬送頭17於檢查區域A3內可於Y方向及Z方向往復移動地受支持，且成為被稱為「指臂」之機構之一部分。藉此，器件搬送頭17可將自供給區域A2搬入之器件供給部14上之IC器件90搬送並載置於檢查部16上。另，於圖2中，以箭頭α17Y 表示器件搬送頭17之Y方向之往復移動。又，器件搬送頭17可於Y方向往復移動地受支持，但並未限定於此，亦可為亦能於X方向往復移動地受支持。 又，器件搬送頭17與溫度調整部12同樣，構成為可將固持之IC器件90加熱或冷卻。藉此，可於器件供給部14至檢查部16繼續維持IC器件90之溫度調整狀態。 檢查部16構成為載置電子零件即IC器件90，並檢查該IC器件90之電氣特性之載置部。於該檢查部16，設置有與IC器件90之端子電性連接之複數個探針接腳。且，可藉由將IC器件90之端子與探針接腳電性連接，即接觸而進行IC器件90之檢查。IC器件90之檢查基於連接於檢查部16之測試器具備之檢查控制部所記憶之程式而進行。另，檢查部16亦與溫度調整部12同樣，構成為可將IC器件90加熱或冷卻，而將該IC器件90調整為適於檢查之溫度。 器件回收部18構成為載置已結束以檢查部16檢查之IC器件90，並可將該IC器件90搬送至回收區域A4之載置部，且被稱為「回收用梭板」或簡稱為「回收梭」。 又，器件回收部18於檢查區域A3與回收區域A4之間可沿著X方向即箭頭α18 方向往復移動地受支持。又，於圖2所示之構成中，器件回收部18與器件供給部14同樣，於Y方向配置有2個，且檢查部16上之IC器件90被搬送、載置於任一器件回收部18。該搬送由器件搬送頭17進行。 回收區域A4係回收於檢查區域A3進行檢查，且已結束該檢查之複數個IC器件90之區域。於該回收區域A4，設置有回收用托盤19、器件搬送頭20、及托盤搬送機構21。又，於回收區域A4，亦準備有空托盤200。 回收用托盤19係載置已以檢查部16檢查之IC器件90之載置部，且以於回收區域A4內不移動之方式固定。藉此，即便為相對較多地配置有器件搬送頭20等各種可動部之回收區域A4，亦可於回收用托盤19上穩定地載置檢查完畢之IC器件90。另，於圖2所示之構成中，回收用托盤19沿著X方向配置有3個。 又，空托盤200亦沿著X方向配置有3個。該空托盤200亦成為載置已以檢查部16檢查之IC器件90之載置部。且，移動至回收區域A4之器件回收部18上之IC器件90被搬送、載置於回收用托盤19及空托盤200中之任一者。藉此，IC器件90按照檢查結果分類並回收。 器件搬送頭20於回收區域A4內可於X方向及Y方向移動地受支持，且進而具有亦可於Z方向移動之部分。藉此，器件搬送頭20可將IC器件90自器件回收部18搬送至回收用托盤19或空托盤200。另，於圖2中，以箭頭α20X 表示器件搬送頭20之X方向之移動，以箭頭α20Y 表示器件搬送頭20之Y方向之移動。 托盤搬送機構21係將自托盤去除區域A5搬入之空托盤200於回收區域A4內向X方向即箭頭α21 方向搬送之機構。且，於該搬送後，空托盤200可配置於回收IC器件90之位置，即成為上述3個空托盤200中之任一者。 托盤去除區域A5係回收並去除排列有檢查完畢狀態之複數個IC器件90之托盤200的除材部。於托盤去除區域A5中，可將多個托盤200堆疊。 又，以跨及回收區域A4與托盤去除區域A5之方式，設置有於Y方向逐片搬送托盤200之托盤搬送機構22A、22B。托盤搬送機構22A係可使托盤200於Y方向即箭頭α22A 方向往復移動之移動部。藉此，可將檢查完畢之IC器件90自回收區域A4搬送至托盤去除區域A5。又，托盤搬送機構22B可使用以回收IC器件90之空托盤200向Y方向之正側即箭頭α22B 方向移動。藉此，可將空托盤200自托盤去除區域A5移動至回收區域A4。 控制部800可控制例如托盤搬送機構11A、托盤搬送機構11B、溫度調整部12、器件搬送頭13、器件供給部14、托盤搬送機構15、檢查部16、器件搬送頭17、器件回收部18、器件搬送頭20、托盤搬送機構21、托盤搬送機構22A、及托盤搬送機構22B各部之作動。 操作者可經由監視器300設定或確認電子零件檢查裝置1之動作條件等。該監視器300具有例如以液晶畫面構成之顯示畫面301，且配置於電子零件檢查裝置1之正面側上部。如圖1所示，於托盤去除區域A5之圖中右側，設置有載置滑鼠之滑鼠台600。該滑鼠於操作顯示於監視器300之畫面時使用。 又，相對於監視器300於圖1之右下方，配置有操作面板700。操作面板700係與監視器300分開對電子零件檢查裝置1命令所期望之動作者。 又，信號燈400可藉由發光之顏色之組合，而報知電子零件檢查裝置1之作動狀態等。信號燈400配置於電子零件檢查裝置1之上部。另，於電子零件檢查裝置1內置有揚聲器500，藉由該揚聲器500亦可報知電子零件檢查裝置1之作動狀態等。 電子零件檢查裝置1藉由第1隔板231將托盤供給區域A1與供給區域A2之間隔開，藉由第2隔板232將供給區域A2與檢查區域A3之間隔開，藉由第3隔板233將檢查區域A3與回收區域A4之間隔開，藉由第4隔板234將回收區域A4與托盤去除區域A5之間隔開。又，供給區域A2與回收區域A4之間亦由第5隔板235隔開。 電子零件檢查裝置1由蓋覆蓋最外裝，且於該蓋有例如前蓋241、側蓋242、側蓋243、後蓋244、頂蓋245。 接著，對器件搬送頭13、器件搬送頭17及器件搬送頭20之構成進行說明，但由於器件搬送頭13、器件搬送頭17及器件搬送頭20係大致同樣之構成，故於以下代表性說明器件搬送頭13。 如圖3所示，器件搬送頭13具有基底2、及固定於基底2之圖3中下側之複數個手部3。由於各手部3係同樣之構成，故以下對1個手部3代表性進行說明。 手部3具有手部本體31、及安裝於手部本體31之圖3中之下端部之吸附墊32。 手部本體31由呈長條狀之構件構成，且具有內腔部311。又，於手部本體31內置有未圖示之姿勢調節部或溫度調節部等。 吸附墊32具有內腔部321，且相對於手部本體31自由裝卸地安裝。又，於其安裝狀態下，內腔部321與手部本體31之內腔部311連通，內腔部321與內腔部311包含於流道30。又，流道30於內腔部321至切換閥6作為第1流道發揮功能，於較切換閥6更靠噴射器4側之流道及壓空泵5側之流道作為第2流道發揮功能。 藉由使流道30產生負壓，吸附墊32可吸附固持IC器件90，又，於該吸附狀態下，藉由解除負壓，可解除IC器件之吸附固持。關於該情況係於後文詳細敘述。 如圖3及圖4所示，於電子零件檢查裝置1中，自內腔部321之內徑互不相同即流道剖面積互不相同之複數個吸附墊32選擇性安裝1個吸附墊32。該選擇係根據IC器件90之大小或形狀等而進行。藉此，不論IC器件90之大小或形狀等，皆可進行良好之吸附固持。 如此，於電子零件檢查裝置1中，手部本體31構成為可配置複數個作為固持部之吸附墊32，該吸附墊32具有可吸附固持作為電子零件之IC器件90之流道30，且流道30之流道剖面積不同。 此外，於先前之電子零件搬送裝置中，構成為基於真空吸引迴路內之空氣流量而切換電子零件之吸附固持及吸附固持之解除。然而，若只基於空氣流量而進行上述切換，則於如電子零件檢查裝置1般，自流道30即內腔部321之流道剖面積不同之吸附墊32選擇性安裝1個之情形時，真空吸引迴路內之壓力根據選擇之吸附墊32而變動。 因此，根據內腔部321之流道剖面積，有時會對電子零件施加過度之壓力而強勢地進行IC器件90之解除，或施加於IC器件90之力不夠充分而無法良好地進行IC器件90之吸附固持之解除。 因此，於電子零件檢查裝置1中，可解決此種問題。以下，對該情況進行說明。 如圖5所示，電子零件檢查裝置1具有噴射器4、壓空泵5、切換閥6、調節器7、壓力檢測部8、及設置於切換閥6與噴射器4之間之切換閥9。 噴射器4係產生真空之真空產生源，係藉由其作動而使流道30內產生低於大氣壓之負壓(第1壓力)者。該噴射器4與控制部800電性連接而控制其作動。另，於本實施形態中，噴射器4不論吸附固持或吸附固持之解除，皆會作動。 壓空泵5係藉由將空氣送入至流道30內而使流道30內產生高於大氣壓之正壓(第2壓力)之第2壓力產生源。該壓空泵5與控制部800電性連接而控制其作動。另，於本實施形態中，壓空泵5不論吸附固持或吸附固持之解除，皆會作動。 切換閥6係經由流道30連接於壓空泵5及噴射器4，且可切換流道30之壓力之切換部。切換閥6於本實施形態中由所謂之單動螺線管型電磁閥構成。該切換閥6與控制部800電性連接而控制其作動。 又，切換閥6於圖5所示之構成中，係使吸附墊32與噴射器4連通，而於流道30內成為產生負壓之狀態。藉此，可進行IC器件90之吸附固持。 另一方面，若根據圖5所示之構成使切換閥6與上述相反地作動，則成為吸附墊32與壓空泵5連通之狀態。藉此，可於流道30內產生正壓，而解除IC器件90之吸附固持。 調節器7係設置於切換閥6與壓空泵5之間，且可調節流道30之壓力之壓力調節部。調節器7構成為可根據壓力設定而調節流道30內之壓力。作為調節器7，較佳使用例如電空調節器。該調節器7與控制部800電性連接而控制其作動。 根據此種調節器7，可無階段地調整流道30之壓力，即吸引力。因此，可穩定地吸附各種大小(重量)之IC器件90。且，可維持該吸附狀態不變，而於檢查區域A3內搬送IC器件90。藉此，可防止IC器件90於搬送中落下。 壓力檢測部8係設置於吸附墊32與切換閥6之間，且檢測吸附墊32與切換閥6之間之壓力者。壓力檢測部8與控制部800電性連接，壓力檢測部8檢測出之檢測結果被發送至控制部800。 切換閥9於本實施形態中由所謂之兩側螺線管型電磁閥構成。該切換閥9與控制部800電性連接而控制其作動。 又，切換閥9於圖5所示之構成中，使吸附墊32與噴射器4連通，而於流道30內成為產生負壓之狀態。藉此，可進行IC器件90之吸附固持。 另一方面，若根據圖5所示之構成使切換閥9與上述相反地作動，則成為吸附墊32與噴射器4被阻斷之狀態。藉此，停止流道30內之吸引。 另，如圖5所示，構成為：於手部3逐一內置有切換閥6、壓力檢測部8及切換閥9，且將各手部3之切換閥6、壓力檢測部8及切換閥9分別統一連接於噴射器4、壓空泵5及調節器7。 接著，對電子零件檢查裝置1之控制動作，使用圖6所示之流程圖進行說明。另，如上所述，於器件搬送頭13設置有複數個手部3，但各手部3中之控制動作係同樣，故對1個手部3代表性進行說明。 首先，於步驟S101中，以使噴射器4作動之狀態，使器件搬送頭13移動，而使吸附墊32抵接於IC器件90。藉此，可吸附固持IC器件90。另，於本實施形態中，設為亦使壓空泵5作動之狀態。 然後，於步驟S102中，以吸附固持IC器件90之狀態移動至所期望之位置，並解除IC器件90之吸附固持。該解除係藉由使切換閥6作動設為吸附墊32與壓空泵5連通之狀態而進行。藉此，可於流道30內產生正壓，而解除IC器件90之吸附固持。 此處，於例如吸附墊32由橡膠或矽等黏著力相對較高之材料構成之情形、或使流道30產生之正壓不夠充分之情形時，有時無法進行IC器件90之吸附固持之解除。即，儘管將流道30內設為正壓，亦有成為IC器件90黏附於吸附墊32之狀態的情況。 於電子零件檢查裝置1中，於步驟S103中，檢測流道30內之壓力之實測值即壓力P30。接著，於步驟S104中，判斷流道30之壓力P30是否正常化。即，判斷流道30之壓力是否為進行吸附固持之解除時之理想壓力之理想範圍即下限值Pmin以上，且上限值Pmax以下。另，上述理想範圍係於預先實驗性進行吸附固持之解除而實驗性測定之良好解除時之壓力的值。另，下限值Pmin為1 kPa以上且5 kPa以下左右。另一方面，上限值Pmax為9 kPa以上且20 kPa以下左右。 於步驟S104中，於判斷為壓力P30超出理想範圍即壓力P30非下限值Pmin以上且上限值Pmax以下之情形時，於步驟S105中使調節器7作動而調節流道30內之壓力。另，該調節係基於調節器7之開度、及對應於此之壓力P30之檢量線而進行。 於電子零件檢查裝置1中，於步驟S105中進行調節後，再次返回至步驟S103，且依序重複進行以下之步驟直至壓力P30變為下限值Pmin以上且上限值Pmax以下之範圍內。藉此，可將解除IC器件90之吸附固持時之吸附墊32之壓力設為理想範圍。 藉此，於吸附墊32解除IC器件90之吸附固持時，不會因來自吸附墊之快速之空氣流速對吹IC器件90而將已落位之IC器件吹散，且可將流道內之壓力設為大氣壓以上，而可確實地將IC器件隔開。其結果，可使已解除固持之IC器件90確實地自吸附墊32離開，且可防止電子零件因過度之力量而遠離吸附墊32。 尤其，先前，構成為於解除吸附固持時，檢測流道內之空氣之流速，並基於其檢測結果而調節解除所需之空氣流量。然而，因吸附墊32之內腔部321之流道剖面積之大小而導致內腔部321之流量改變。其結果，難以設為適於解除吸附固持之流速。 於本發明中，構成為調節壓力而代替檢測流量。藉由該構成，不論流道剖面積之大小，皆不會因來自吸附墊之快速之空氣流速對吹IC器件90而將已落位之IC器件吹散，且可將流道內之壓力設為大氣壓以上，而可確實地將IC器件隔開。 又，調節器7較佳可調整對吸附墊32產生第2壓力之時間。即，調節器7較佳可調節提高流道30內之壓力之時間。藉此，例如可藉由延長提高流道30內之壓力之時間，而減小提高之壓力之程度。因此，可更確實地防止過度地提高流道30之壓力。 又，於電子零件檢查裝置1中，如上所述，於調節器7之與壓空泵5相反之側，根據手部3之數量而分別連接有複數個壓力檢測部8及切換閥6。藉此，即便設置有複數個手部3，於各吸附墊32解除IC器件90之吸附固持時，亦不會因來自吸附墊32之快速之空氣流速對吹各IC器件90而將已落位之IC器件90吹散，且可將流道內之壓力設為大氣壓以上，而可確實地將IC器件90隔開。 於以上，將各手部3之控制動作設為相同者，且對1個手部3代表性說明控制動作，但亦可使各手部3之控制動作不同。 於電子零件檢查裝置1中，調節器7不論手部3及吸附墊32之數量，皆以各吸附墊32中之流道30彼此之壓力差為理想範圍(特定值)之方式，較佳以各吸附墊32之壓力為壓力P1之方式進行調節。藉此，於各吸附墊32解除IC器件90之吸附固持時，不會因來自吸附墊之快速之空氣流速對吹各IC器件90而將已落位之IC器件90吹散，且可將流道內之壓力設為大氣壓以上，而可確實地將IC器件90隔開。以下，詳細地進行說明。 於電子零件檢查裝置1中，調節器7於將各切換閥6統一切換之情形、及將各切換閥6於互不相同之時序切換之情形，使第1流道之壓力不同。例如，如圖7所示，於使各IC器件90統一進行吸附固持之解除之情形時，以將各吸附墊32之壓力調節為壓力P1之方式，將調節器7中之壓力設為大於壓力P1之壓力P2。另，壓力P1係下限值Pmin以上且上限值Pmax以下之值。又，壓力P2設為壓力P1之1.2倍以上且60.0倍以下左右。 另一方面，作為將各切換閥6於互不相同之時序切換之情形，例如如圖8所示，列舉先進行2個IC器件90之吸附固持之解除之情形。於該情形時，以將先進行解除之2個吸附墊32之壓力調節為壓力P1之方式，將調節器7中之壓力設為大於壓力P1之壓力P3。壓力P3設為壓力P1之1.2倍以上且50.0倍以下左右，且設定為小於壓力P2。 此處，由於例如流道30內分支之條數根據進行吸附固持之解除之IC器件90之數量而不同。即，進行吸附固持之解除之IC器件90越多，流量受分支而於每一個吸附墊流通之流量越少。可藉由將壓力P2設定為大於P3而抵消因分支所致之流量減少。其結果，可不論進行吸附固持之解除之IC器件90之數量，而將各吸附墊32中之壓力皆設為壓力P1，不會因來自吸附墊之快速之空氣流速對吹各IC器件90而將已落位之IC器件吹散，且可將流道內之壓力設為大氣壓以上，而可確實地將IC器件隔開。 ＜第2實施形態＞ 以下，參照圖9對本發明之電子零件搬送裝置及電子零件檢查裝置之第2實施形態進行說明，但以與上述之實施形態之不同點為中心進行說明，且同樣事項省略其說明。 本實施形態除了第1壓力產生源之構成不同以外皆與上述第1實施形態同樣。 如圖9所示，於本實施形態中，省略圖5所示之切換閥9及噴射器4，取而代之於各手部3之每一者設置噴射器4A。噴射器4A係產生真空之真空產生源，且內置有閥體。因此，可省略設置噴射器4A以外之閥體。該噴射器4A與控制部800電性連接而控制其作動。 根據此種本實施形態，可省略圖5所示之切換閥9，而可謀求構成之簡化。又，由於將噴射器4A設置於各手部3之每一者，故可容易於各手部3之每一者進行吸附固持及吸附固持之解除。 以上，對圖示本發明之電子零件搬送裝置及電子零件檢查裝置之實施形態進行說明，但本發明並非限定於此者，構成電子零件搬送裝置及電子零件檢查裝置之各部可置換為能發揮同樣功能之任意構成者。又，可附加任意之構成物。 又，本發明之電子零件搬送裝置及電子零件檢查裝置可為組合上述各實施形態中之任意2個以上之構成(特徵)者。 又，於上述第1實施形態中，壓力調節部係不論固持部之數量而以各固持部中之壓力為壓力P1之方式，即為相同值之方式進行調節者，但本發明並未限定於此，亦可以上述各固持部中之壓力差為特定值(下限值Pmin以上且上限值Pmax以下之範圍內)之方式進行調節。Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the preferred embodiments shown in the accompanying drawings. <First Embodiment> Hereinafter, a first embodiment of an electronic component transfer device and an electronic component inspection device according to the present invention will be described with reference to Figs. 1 to 8. In the following, for convenience of explanation, as shown in FIG. 1, three axes that are orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. The direction parallel to the X axis is also referred to as "X direction (first direction)", the direction parallel to the Y axis is referred to as "Y direction (second direction)", and the direction parallel to the Z axis is referred to as "Z direction (third direction)". The direction in which the arrows in each direction point is called "positive", and the opposite direction is called "negative". In addition, the "horizontal" mentioned in the specification of this case is not limited to a complete level, as long as it does not hinder the transportation of electronic parts, it also includes a state inclined slightly (for example, less than about 5 °) with respect to the level. In addition, the upper side in FIG. 3, FIG. 4, FIG. 7, and FIG. 8 may be called "up" or "upper", and the lower side may be called "down" or "down." The electronic component conveying device 10 of the present invention may be provided with a plurality of adsorption pads 32 as holding parts. The adsorption pads 32 have an opening part 320 capable of holding the electronic parts and a flow path including a first flow path communicating with the opening part 320. 30, and the cross-sectional area of the flow path 30 (the first flow path) is different. The electronic component transfer device 10 includes an ejector 4 as a first pressure generating source that generates a first pressure lower than atmospheric pressure, and an air pump 5 as a second pressure generating source that generates a second pressure higher than atmospheric pressure. Pressure; the switching valve 6 as the switching part is connected to the ejector 4 and the pressure pump 5 through the flow channel 30, and the pressure of the flow channel 30 can be switched; the regulator 7 as the pressure adjusting part is provided on the switching valve 6 And the pressure pump 5 and can adjust the pressure of the flow path 30; and the pressure detecting section 8 is provided between the adsorption pad 32 and the switching valve 6, and can detect the pressure between the adsorption pad 32 and the switching valve 6. . In other words, the electronic component transfer device 10 includes a hand body 31 as a mounting portion, which can mount a plurality of suction pads 32 having a flow passage 30 through which fluid can flow, and the flow passage 30 can be set to a negative pressure. And the electronic components are adsorbed and held, and the cross-sectional area of the flow channel 30 is different; the ejector 4 as a negative pressure generating source generates negative pressure; the air pressure pump 5 as a positive pressure generating source generates positive pressure; switching valve 6. It switches the pressure in the flow channel 30 to negative pressure and positive pressure; as a regulator 7 of the pressure regulating section, it regulates the pressure of the positive pressure generated by the air pump 5; and a pressure detecting section 8 that detects at The pressure of the flow path 30 in the state where the suction pad 32 is attached to the hand body 31. According to such an electronic parts conveying device 10, when the adsorption pad 32 releases the adsorption and holding of the electronic parts, the electronic parts that have fallen down will not be scattered due to the rapid air flow from the adsorption pads, and the electronic parts that have fallen down will be scattered, and The pressure in the flow path is set to be equal to or higher than the atmospheric pressure, and the electronic components can be reliably separated. As a result, the released electronic components can be surely separated from the suction pad 32, and the electronic components can be prevented from moving away from the suction pad 32 due to excessive force. The electronic component inspection device 1 of the present invention may be provided with a plurality of suction pads 32 as holding parts. The suction pads 32 have openings 320 that can hold and hold electronic parts, and a flow path including a first flow path communicating with the openings 320. 30, and the cross-sectional area of the flow path 30 (the first flow path) is different. The electronic component inspection apparatus 1 includes an ejector 4 as a first pressure generating source that generates a first pressure lower than atmospheric pressure, and an air pump 5 as a second pressure generating source that generates a second pressure higher than atmospheric pressure. Pressure; the switching valve 6 as the switching part is connected to the ejector 4 and the pressure pump 5 through the flow channel 30, and the pressure of the flow channel 30 can be switched; the regulator 7 as the pressure adjusting part is provided on the switching valve 6 And the pressure pump 5 and can adjust the pressure of the flow channel 30; the pressure detection section 8 is disposed between the adsorption pad 32 and the switching valve 6 and can detect the pressure between the adsorption pad 32 and the switching valve 6; And an inspection unit 16 that inspects electronic components. As a result, the electronic component inspection device 1 having the advantages of the electronic component transfer device 10 described above is obtained. In addition, since the electronic component can be transported to the inspection unit 16, the inspection unit 16 can inspect the electronic component. In addition, the electronic components after inspection can be transported from the inspection unit 16. The configuration of each unit will be described below. As shown in FIGS. 1 and 2, the electronic component inspection device 1 with the built-in electronic component transfer device 10 is a device that transfers electronic components such as IC devices such as BGA (Ball Grid Array) packages, and The electrical characteristics of electronic parts are inspected and tested (hereinafter referred to as "inspection") during the transportation process. In the following, for convenience of explanation, a representative case where an IC device is used as the above-mentioned electronic component will be described, and it will be referred to as "IC device 90". The IC device 90 is a flat plate in this embodiment. In addition, as the IC device, in addition to the above, for example, "LSI (Large Scale Integration)", "CMOS (Complementary MOS: Complementary Metal Oxide Semiconductor)", "CCD (Charge Coupled Device: Charge) Coupling devices) ", or" module ICs "that package multiple IC devices, and" crystal devices "," pressure sensors "," inertial sensors (acceleration sensors) "," gyros " Sensor "," fingerprint sensor ", etc. In addition, the electronic component inspection device 1 (electronic component transfer device 10) is used by previously mounting a so-called "change kit" that is replaced according to the type of the IC device 90. A mounting section on which the IC device 90 is mounted is provided in the change kit, and the mounting section includes, for example, a temperature adjustment section 12 and a device supply section 14 described later. In addition, as the mounting portion on which the IC device 90 is mounted, in addition to the above-mentioned change kit, there is also an inspection portion 16 or a tray 200 prepared by a user. The electronic component inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter referred to as "supply area") A2, an inspection area A3, a device recovery area (hereinafter referred to as "recycling area") A4, and a tray removal area A5, and These areas are separated by respective wall portions as described later. In addition, the IC device 90 passes through the above-mentioned areas in the direction of the arrow α90 in the order from the tray supply area A1 to the tray removal area A5, and performs inspection in the inspection area A3 in the middle. In this way, the electronic component inspection apparatus 1 is formed to include an electronic component transfer apparatus 10 that is a processing machine that transports IC devices 90 in each area, an inspection unit 16 that performs inspection in the inspection area A3, and a control unit 800. In addition, the electronic component inspection apparatus 1 includes a monitor 300, a signal light 400, and an operation panel 700. In addition, the electronic component inspection device 1 uses the tray supply area A1 and the tray removal area A5, that is, the lower side in FIG. 2 as the front side, and the electronic part inspection device 1 that has the inspection area A3, that is, the upper side in FIG. 2 as the back side. use. The tray supply area A1 is a material supply section for supplying a tray 200 in which a plurality of IC devices 90 are arranged in an unchecked state. In the tray supply area A1, a plurality of trays 200 can be stacked. The supply area A2 is an area where a plurality of IC devices 90 on the tray 200 transferred from the tray supply area A1 are transferred and supplied to the inspection area A3, respectively. In addition, tray transfer mechanisms 11A and 11B are provided so as to straddle the tray supply area A1 and the supply area A2 in the horizontal direction to transfer the tray 200 one by one. The tray conveying mechanism 11A is a moving portion that can move the tray 200 and the IC device 90 placed on the tray 200 toward the positive side in the Y direction, that is, in the direction of the arrow α 11A in FIG. 2. Thereby, the IC device 90 can be stably fed into the supply area A2. The tray conveyance mechanism 11B is a moving unit that can move the empty tray 200 toward the negative side in the Y direction, that is, in the direction of the arrow α 11B in FIG. 2. Thereby, the empty tray 200 can be moved from the supply area A2 to the tray supply area A1. The supply area A2 is provided with a temperature adjustment section (a soaking plate (English expression: soak plate, Chinese expression (one example): soaking plate)) 12, a device transfer head 13, and a tray transfer mechanism 15. The temperature adjustment section 12 is a mounting section on which a plurality of IC devices 90 are mounted, and is referred to as a "heating plate" that can uniformly heat or cool the mounted IC devices 90. With this soaking plate, the IC device 90 before the inspection by the inspection unit 16 can be heated or cooled in advance, and adjusted to a temperature suitable for the inspection (high-temperature inspection or low-temperature inspection). In the configuration shown in FIG. 2, two temperature adjustment units 12 are arranged and fixed in the Y direction. The IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transfer mechanism 11A is transferred to any one of the temperature adjustment units 12. In addition, by fixing the temperature adjustment section 12 as the mounting section, the IC device 90 on the temperature adjustment section 12 can be stably adjusted in temperature. The device transfer head 13 is supported in the supply area A2 so as to be movable in the X direction and the Y direction, and further includes a portion that can also be moved in the Z direction. With this, the device transfer head 13 can transfer the IC device 90 between the tray 200 and the temperature adjustment section 12 carried in from the tray supply area A1, and the IC device 90 between the temperature adjustment section 12 and the device supply section 14 described later. Of transportation. In FIG. 2, the movement in the X direction of the device transfer head 13 is indicated by an arrow α 13X , and the movement in the Y direction of the device transfer head 13 is indicated by an arrow α 13Y . The tray transfer mechanism 15 is a mechanism that transfers the empty tray 200 in a state where all IC devices 90 have been removed, to the positive side in the X direction, that is, in the direction of arrow α 15 in the supply area A2. After the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B. The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, an inspection section 16 for inspecting the IC device 90 and a device transfer head 17 are provided. Also, a device supply unit 14 that moves across the supply area A2 and the inspection area A3, and a device recovery unit 18 that moves across the inspection area A3 and the recovery area A4 are also provided. The device supply section 14 is a mounting section for placing an IC device 90 whose temperature has been adjusted by the temperature adjustment section 12, and is referred to as a “supply shuttle” or an abbreviation that can transport the IC device 90 to the vicinity of the inspection section 16. "Supply shuttle". In addition, the device supply section 14 as a mounting section is supported to reciprocate along the X direction, that is, the direction of the arrow α 14 between the supply area A2 and the inspection area A3. With this, the device supply section 14 can stably transport the IC device 90 from the supply area A2 to the vicinity of the inspection section 16 of the inspection area A3, and can return to the inspection area A3 after removing the IC device 90 by the device transfer head 17 and return again. Go to supply area A2. In the configuration shown in FIG. 2, two device supply sections 14 are arranged in the Y direction, and the IC devices 90 on the temperature adjustment section 12 are transported to any of the device supply sections 14. The device supply unit 14 is configured to heat or cool the IC device 90 placed on the device supply unit 14 in the same manner as the temperature adjustment unit 12. Thereby, the IC device 90 whose temperature has been adjusted by the temperature adjustment section 12 can be maintained in the temperature adjustment state, and can be transported to the vicinity of the inspection section 16 in the inspection area A3. The device transfer head 17 is an operation unit that holds the IC device 90 that maintains the temperature adjustment state described above, and transfers the IC device 90 in the inspection area A3. The device transfer head 17 is supported to reciprocate in the Y direction and the Z direction in the inspection area A3, and becomes a part of a mechanism called a "finger arm". Thereby, the device transfer head 17 can transfer and place the IC device 90 on the device supply section 14 carried in from the supply area A2 and place it on the inspection section 16. In FIG. 2, the Y-direction reciprocating movement of the device transfer head 17 is indicated by an arrow α 17Y . In addition, the device transfer head 17 can be supported while reciprocating in the Y direction, but it is not limited to this, and can also be supported while being reciprocating in the X direction. The device transfer head 17 is configured to heat or cool the held IC device 90 in the same manner as the temperature adjustment unit 12. Thereby, the temperature adjustment state of the IC device 90 can be continuously maintained in the device supply section 14 to the inspection section 16. The inspection unit 16 is a mounting unit that mounts an IC device 90 that is an electronic component and checks the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins electrically connected to the terminals of the IC device 90. In addition, the IC device 90 can be inspected by electrically connecting the terminals of the IC device 90 with the probe pins, that is, making contact. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. The inspection unit 16 is also configured to heat or cool the IC device 90 as in the temperature adjustment unit 12, and adjust the IC device 90 to a temperature suitable for inspection. The device recovery section 18 is configured to place the IC device 90 that has been inspected by the inspection section 16 and can transport the IC device 90 to the placement section in the recovery area A4, and is referred to as a "recycling shuttle" or simply "Recycling shuttle". The device recovery unit 18 is supported between the inspection area A3 and the recovery area A4 so as to reciprocate in the X direction, that is, in the direction of the arrow α 18 . In the configuration shown in FIG. 2, the device recovery unit 18 is the same as the device supply unit 14, and two IC devices 90 are disposed in the Y direction, and the IC devices 90 on the inspection unit 16 are transported and placed in any of the device recovery units. 18. This transfer is performed by the device transfer head 17. The recovery area A4 is an area where a plurality of IC devices 90 have been recovered from the inspection area A3 for inspection, and the inspection has been completed. In this collection area A4, a collection tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4. The recovery tray 19 is a mounting portion on which the IC device 90 that has been inspected by the inspection portion 16 is placed, and is fixed so as not to move within the recovery area A4. Thereby, even if the recovery area A4 where various movable parts such as the device transfer head 20 are relatively arranged, the inspected IC devices 90 can be stably placed on the recovery tray 19. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction. In addition, three empty trays 200 are also arranged along the X direction. The empty tray 200 also serves as a mounting portion on which the IC device 90 that has been inspected by the inspection portion 16 is placed. Then, the IC device 90 on the device recovery section 18 moved to the recovery area A4 is transported and placed on any one of the recovery tray 19 and the empty tray 200. Thereby, the IC device 90 is sorted and recovered according to the inspection result. The device transfer head 20 is supported in the recovery area A4 so as to be movable in the X direction and the Y direction, and further includes a portion that can also be moved in the Z direction. Thereby, the device transfer head 20 can transfer the IC device 90 from the device collection part 18 to the collection tray 19 or the empty tray 200. In FIG. 2, the movement in the X direction of the device transfer head 20 is indicated by an arrow α 20X , and the movement in the Y direction of the device transfer head 20 is indicated by an arrow α 20Y . The tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the recovery area A4 in the X direction, that is, in the direction of the arrow α 21 . In addition, after the conveyance, the empty tray 200 may be disposed at a position where the IC device 90 is collected, that is, any one of the three empty trays 200 described above. The tray removal area A5 collects and removes the material removal portion of the tray 200 in which the plurality of IC devices 90 in the inspected state are arranged. In the tray removal area A5, a plurality of trays 200 can be stacked. In addition, tray transfer mechanisms 22A and 22B are provided so as to span the collection area A4 and the tray removal area A5, and carry the tray 200 piece by piece in the Y direction. The tray conveying mechanism 22A is a moving part that can reciprocate the tray 200 in the Y direction, that is, the direction of the arrow α 22A . Thereby, the inspected IC device 90 can be transferred from the recovery area A4 to the tray removal area A5. The tray transfer mechanism 22B can be used to move the empty tray 200 of the recovered IC device 90 in the Y direction, that is, in the direction of the arrow α 22B . Thereby, the empty tray 200 can be moved from the tray removal area A5 to the recovery area A4. The control unit 800 can control, for example, the tray transfer mechanism 11A, the tray transfer mechanism 11B, the temperature adjustment unit 12, the device transfer head 13, the device supply unit 14, the tray transfer mechanism 15, the inspection unit 16, the device transfer head 17, the device recovery unit 18, The operation of each part of the device transfer head 20, the tray transfer mechanism 21, the tray transfer mechanism 22A, and the tray transfer mechanism 22B. The operator can set or confirm the operating conditions and the like of the electronic component inspection apparatus 1 via the monitor 300. The monitor 300 includes a display screen 301 made of, for example, a liquid crystal screen, and is arranged on the upper portion of the front side of the electronic component inspection device 1. As shown in FIG. 1, on the right side in the drawing of the tray removal area A5, a mouse stage 600 for placing a mouse is provided. This mouse is used when operating the screen displayed on the monitor 300. An operation panel 700 is disposed on the lower right of FIG. 1 with respect to the monitor 300. The operation panel 700 instructs the electronic component inspection apparatus 1 separately from the monitor 300 to perform a desired operation. In addition, the signal lamp 400 can report the operation state and the like of the electronic component inspection device 1 by a combination of the colors of light emission. The signal lamp 400 is arranged on the upper part of the electronic component inspection apparatus 1. In addition, a speaker 500 is built in the electronic component inspection device 1, and the operating state and the like of the electronic component inspection device 1 can also be notified through the speaker 500. The electronic component inspection device 1 separates the tray supply area A1 and the supply area A2 by a first partition plate 231, and separates the supply area A2 and the inspection area A3 by a second partition plate 232, and a third partition plate 233 separates the inspection area A3 and the collection area A4, and separates the collection area A4 and the tray removal area A5 by the fourth partition plate 234. The supply area A2 and the recovery area A4 are also separated by a fifth partition plate 235. The electronic component inspection device 1 covers the outermost case with a cover, and the cover includes, for example, a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245. Next, the configurations of the device transfer head 13, the device transfer head 17, and the device transfer head 20 will be described. However, since the device transfer head 13, the device transfer head 17, and the device transfer head 20 have substantially the same configuration, the following representative description will be given. Device transfer head 13. As shown in FIG. 3, the device transfer head 13 includes a base 2 and a plurality of hands 3 fixed to the lower side of the base 2 in FIG. 3. Since each hand 3 has the same structure, a representative of one hand 3 will be described below. The hand 3 includes a hand body 31 and an adsorption pad 32 attached to a lower end portion of the hand body 31 in FIG. 3. The hand body 31 is composed of a member having a long shape and has an inner cavity portion 311. In addition, a posture adjustment unit, a temperature adjustment unit, and the like (not shown) are built into the hand body 31. The suction pad 32 has an inner cavity portion 321 and is detachably attached to the hand body 31. In the mounted state, the inner cavity portion 321 communicates with the inner cavity portion 311 of the hand body 31, and the inner cavity portion 321 and the inner cavity portion 311 are included in the flow path 30. The flow passage 30 functions as a first flow passage from the inner cavity portion 321 to the switching valve 6, and serves as a second flow passage in a flow passage on the injector 4 side and a pressure pump 5 side on the switching valve 6 side. Function. By making the flow path 30 generate a negative pressure, the suction pad 32 can suck and hold the IC device 90, and in this suction state, by releasing the negative pressure, the suction and holding of the IC device can be released. This case will be described in detail later. As shown in FIGS. 3 and 4, in the electronic component inspection device 1, one adsorption pad 32 is selectively installed from a plurality of adsorption pads 32 whose inner diameters of the inner cavity portions 321 are different from each other, that is, the cross-sectional area of the flow path is different from each other. . This selection is performed according to the size, shape, and the like of the IC device 90. Thereby, irrespective of the size or shape of the IC device 90, good adsorption and holding can be performed. In this way, in the electronic component inspection device 1, the hand body 31 is configured to be provided with a plurality of suction pads 32 as holding parts. The suction pads 32 have a flow path 30 that can hold and hold the IC device 90 as an electronic part. The cross-sectional areas of the channels of the channel 30 are different. In addition, in the conventional electronic component transfer device, it is configured to switch the adsorption and holding of the electronic component based on the air flow in the vacuum suction circuit. However, if the above switching is performed based only on the air flow rate, when one of the suction pads 32 with different cross-sectional areas of the flow path 30, that is, the inner cavity portion 321, is selectively installed as in the electronic component inspection device 1, the vacuum is applied. The pressure in the suction circuit varies according to the selected suction pad 32. Therefore, depending on the cross-sectional area of the flow path of the inner cavity portion 321, excessive pressure may be applied to the electronic component to release the IC device 90 strongly, or the force applied to the IC device 90 is insufficient to perform the IC device well Release of 90's adsorption hold. Therefore, the electronic component inspection apparatus 1 can solve such a problem. This case will be described below. As shown in FIG. 5, the electronic component inspection device 1 includes an injector 4, a pressure pump 5, a switching valve 6, a regulator 7, a pressure detecting section 8, and a switching valve 9 provided between the switching valve 6 and the injector 4. . The ejector 4 is a vacuum generating source that generates a vacuum, and is a person that generates a negative pressure (first pressure) below the atmospheric pressure in the flow path 30 by its operation. The injector 4 is electrically connected to the control unit 800 to control its operation. In addition, in this embodiment, the ejector 4 operates regardless of the adsorption holding or the release of the adsorption holding. The air pressure pump 5 is a second pressure generating source that generates positive pressure (second pressure) higher than atmospheric pressure in the flow path 30 by sending air into the flow path 30. The air pressure pump 5 is electrically connected to the control unit 800 to control its operation. In addition, in this embodiment, the air pressure pump 5 operates regardless of the adsorption holding or the release of the adsorption holding. The switching valve 6 is a switching unit that is connected to the air pressure pump 5 and the ejector 4 through a flow passage 30 and can switch the pressure of the flow passage 30. The switching valve 6 is constituted by a so-called single-acting solenoid-type solenoid valve in this embodiment. The switching valve 6 is electrically connected to the control unit 800 and controls its operation. In the configuration shown in FIG. 5, the switching valve 6 communicates the suction pad 32 and the ejector 4 and is in a state where a negative pressure is generated in the flow path 30. Thereby, the IC device 90 can be sucked and held. On the other hand, when the switching valve 6 is operated opposite to the above according to the configuration shown in FIG. 5, the suction pad 32 and the pressure pump 5 are in a state of being communicated. Thereby, a positive pressure can be generated in the flow channel 30, and the adsorption and holding of the IC device 90 can be released. The regulator 7 is a pressure regulating portion which is provided between the switching valve 6 and the air pump 5 and can regulate the pressure of the flow channel 30. The regulator 7 is configured to adjust the pressure in the flow path 30 according to the pressure setting. As the regulator 7, for example, an electric air regulator is preferably used. The regulator 7 is electrically connected to the control unit 800 to control its operation. According to such a regulator 7, the pressure of the flow path 30, that is, the attraction force can be adjusted steplessly. Therefore, IC devices 90 of various sizes (weights) can be stably adsorbed. Furthermore, the IC device 90 can be transported in the inspection area A3 while maintaining the suction state. This prevents the IC device 90 from dropping during transportation. The pressure detecting section 8 is provided between the adsorption pad 32 and the switching valve 6 and detects the pressure between the adsorption pad 32 and the switching valve 6. The pressure detection section 8 is electrically connected to the control section 800, and the detection result detected by the pressure detection section 8 is sent to the control section 800. The switching valve 9 is constituted by a so-called two-side solenoid type solenoid valve in this embodiment. The switching valve 9 is electrically connected to the control unit 800 and controls its operation. In the configuration shown in FIG. 5, the switching valve 9 communicates the suction pad 32 with the ejector 4 and is in a state where a negative pressure is generated in the flow path 30. Thereby, the IC device 90 can be sucked and held. On the other hand, when the switching valve 9 is operated opposite to the above according to the configuration shown in FIG. 5, the suction pad 32 and the ejector 4 are blocked. Thereby, the attraction in the flow path 30 is stopped. As shown in FIG. 5, the hand valve 3 includes a switching valve 6, a pressure detecting unit 8, and a switching valve 9 built in one by one, and the switching valve 6, the pressure detecting unit 8, and the switching valve 9 of each hand 3. They are connected to the ejector 4, the air pressure pump 5 and the regulator 7 in a unified manner. Next, the control operation of the electronic component inspection apparatus 1 will be described using a flowchart shown in FIG. 6. In addition, as described above, the device transfer head 13 is provided with a plurality of hands 3. However, since the control operation in each of the hands 3 is the same, a representative example of one hand 3 will be described. First, in step S101, in a state where the ejector 4 is operated, the device transfer head 13 is moved, and the suction pad 32 is brought into contact with the IC device 90. Thereby, the IC device 90 can be adsorbed and held. It should be noted that in the present embodiment, the pressure pump 5 is also operated. Then, in step S102, the IC device 90 is moved to a desired position in a state of being held by holding the IC device 90, and the holding of the IC device 90 is released. This release is performed by operating the switching valve 6 in a state where the suction pad 32 and the pressure pump 5 are in communication. Thereby, a positive pressure can be generated in the flow channel 30, and the adsorption and holding of the IC device 90 can be released. Here, for example, when the adsorption pad 32 is made of a material with relatively high adhesion such as rubber or silicon, or when the positive pressure generated by the flow channel 30 is insufficient, the IC device 90 may not be adsorbed and held. Lifted. That is, although the inside of the flow path 30 is set to a positive pressure, there may be a state where the IC device 90 is adhered to the adsorption pad 32. In the electronic component inspection device 1, in step S103, the pressure P30, which is a measured value of the pressure in the flow channel 30, is detected. Next, in step S104, it is determined whether the pressure P30 of the flow path 30 is normalized. That is, it is determined whether or not the pressure of the flow channel 30 is an ideal range of the ideal pressure at the time of releasing the adsorption and holding, that is, the lower limit value Pmin or more and the upper limit value Pmax or less. In addition, the said ideal range is the value of the pressure at the time of performing the release of adsorption | holding holding | maintenance experimentally, and performing an experimentally measured good release. The lower limit Pmin is about 1 kPa to about 5 kPa. On the other hand, the upper limit value Pmax is about 9 kPa to about 20 kPa. In step S104, when it is determined that the pressure P30 exceeds the ideal range, that is, the pressure P30 is not lower than the lower limit value Pmin and higher than the upper limit value Pmax, the regulator 7 is operated to adjust the pressure in the flow path 30 in step S105. The adjustment is performed based on the opening degree of the regulator 7 and a calibration curve corresponding to the pressure P30. In the electronic component inspection device 1, after adjusting in step S105, return to step S103 again, and repeat the following steps in order until the pressure P30 becomes within the range of the lower limit Pmin and the upper limit Pmax. Thereby, the pressure of the adsorption pad 32 when the adsorption holding of the IC device 90 is released can be set to an ideal range. Thereby, when the adsorption pad 32 releases the adsorption holding of the IC device 90, the IC devices 90 that have fallen down will not be scattered due to the blowing of the IC device 90 due to the rapid air velocity from the adsorption pad, and the IC devices in the flow path can be blown away. The pressure is set to be equal to or higher than the atmospheric pressure, and the IC devices can be surely separated. As a result, the released IC device 90 can be surely separated from the suction pad 32, and the electronic component can be prevented from moving away from the suction pad 32 due to excessive force. In particular, previously, it was configured to detect the flow velocity of air in the flow channel when the adsorption holding is released, and adjust the air flow rate required for the release based on the detection result. However, the flow volume of the inner cavity portion 321 changes due to the cross-sectional area of the flow passage of the inner cavity portion 321 of the adsorption pad 32. As a result, it is difficult to set a flow rate suitable for releasing the adsorption and holding. In the present invention, the pressure is adjusted instead of detecting the flow rate. With this structure, regardless of the cross-sectional area of the flow path, the IC devices 90 that have fallen down will not be blown off due to the rapid air flow rate from the adsorption pad to blow the IC devices 90, and the pressure in the flow path can be set. The IC device can be reliably separated from the atmospheric pressure or higher. In addition, the regulator 7 is preferably capable of adjusting the time during which the second pressure is applied to the adsorption pad 32. That is, the regulator 7 is preferably capable of adjusting the time for increasing the pressure in the flow path 30. Thereby, for example, by increasing the time for increasing the pressure in the flow path 30, the degree of the increased pressure can be reduced. Therefore, it is possible to more surely prevent the pressure of the flow path 30 from being increased excessively. In the electronic component inspection apparatus 1, as described above, a plurality of pressure detection units 8 and a switching valve 6 are connected to the regulator 7 on the side opposite to the air pressure pump 5 according to the number of the hands 3. Thus, even if a plurality of hands 3 are provided, when each adsorption pad 32 releases the adsorption holding of the IC device 90, the IC devices 90 will not fall into place due to the rapid air flow from the adsorption pad 32 against the IC devices 90. The IC devices 90 are blown apart, and the pressure in the flow path can be set to be higher than the atmospheric pressure, so that the IC devices 90 can be surely separated. In the above, the control operation of each hand 3 is set to be the same, and the control operation will be representatively described for one hand 3, but the control operation of each hand 3 may be different. In the electronic component inspection device 1, regardless of the number of the hand 3 and the suction pad 32, the regulator 7 uses a pressure difference between the flow channels 30 in each suction pad 32 as an ideal range (specific value). The pressure of each adsorption pad 32 is adjusted so that the pressure P1. Thereby, when the adsorption pads 32 release the adsorption holding of the IC devices 90, the IC devices 90 that have fallen down will not be blown away due to the rapid air flow from the adsorption pads against the IC devices 90, and the flow of the IC devices 90 can be dissipated. The pressure in the channel is equal to or higher than the atmospheric pressure, and the IC device 90 can be surely separated. Hereinafter, it will be described in detail. In the electronic component inspection device 1, the regulator 7 makes the pressure of the first flow path different when the switching valves 6 are uniformly switched and when the switching valves 6 are switched at different timings. For example, as shown in FIG. 7, in a case where the IC devices 90 are collectively released from adsorption and holding, the pressure in the regulator 7 is set to be greater than the pressure by adjusting the pressure of each adsorption pad 32 to a pressure P1. The pressure of P1 is P2. The pressure P1 is a value that is equal to or higher than the lower limit Pmin and equal to or lower than the upper limit Pmax. The pressure P2 is about 1.2 times to 60.0 times the pressure P1. On the other hand, as a case where the switching valves 6 are switched at different timings, for example, as shown in FIG. 8, a case where the adsorption and holding of the two IC devices 90 are released first is listed. In this case, the pressure in the regulator 7 is set to a pressure P3 that is greater than the pressure P1 in such a manner that the pressure of the two adsorption pads 32 to be released first is adjusted to the pressure P1. The pressure P3 is set to about 1.2 times to 50.0 times the pressure P1, and is set to be smaller than the pressure P2. Here, for example, the number of branches in the flow path 30 differs depending on the number of IC devices 90 that are released for adsorption and holding. That is, the more IC devices 90 that are released for adsorption holding, the smaller the flow is branched and the less the flow is through each adsorption pad. The reduction in flow due to branching can be offset by setting the pressure P2 to be greater than P3. As a result, it is possible to set the pressure in each adsorption pad 32 to the pressure P1 regardless of the number of IC devices 90 that are released for adsorption holding, and it is not possible to blow each IC device 90 due to the rapid air velocity from the adsorption pad. The IC devices that have fallen down are scattered, and the pressure in the flow channel can be set to be higher than atmospheric pressure, so that the IC devices can be surely separated. <Second Embodiment> Hereinafter, a second embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIG. 9, but the differences from the above embodiment will be mainly described, and the same matters will be omitted. Its description. This embodiment is the same as the first embodiment described above except that the configuration of the first pressure generating source is different. As shown in FIG. 9, in this embodiment, the switching valve 9 and the injector 4 shown in FIG. 5 are omitted, and the injectors 4A are provided for each of the hands 3 instead. The ejector 4A is a vacuum generating source for generating a vacuum, and a valve body is built in. Therefore, the valve body other than the injector 4A can be omitted. The injector 4A is electrically connected to the control unit 800 to control its operation. According to this embodiment, the switching valve 9 shown in FIG. 5 can be omitted, and the configuration can be simplified. In addition, since the ejector 4A is provided on each of the hand parts 3, it is possible to easily perform the adsorption holding and the release of the adsorption holding on each of the hand parts 3. The embodiments of the electronic component transfer device and the electronic component inspection device according to the present invention have been described above. However, the present invention is not limited to this. Each part constituting the electronic component transfer device and the electronic component inspection device can be replaced to perform the same function. Arbitrary constituents of function. Moreover, arbitrary components can be added. In addition, the electronic component transfer device and the electronic component inspection device of the present invention may be a combination (a feature) of any two or more of the above-mentioned embodiments. Moreover, in the above-mentioned first embodiment, the pressure adjusting unit is a system that adjusts the pressure of each holding unit as the pressure P1 regardless of the number of the holding units, that is, the method of adjusting the pressure to the same value. This can also be adjusted such that the pressure difference in each of the holding portions is a specific value (within a range from the lower limit value Pmin to the upper limit value Pmax).
1‧‧‧電子零件檢查裝置1‧‧‧Electronic parts inspection device
2‧‧‧基底2‧‧‧ substrate
3‧‧‧手部3‧‧‧hand
4‧‧‧噴射器4‧‧‧ injector
4A‧‧‧噴射器4A‧‧‧Ejector
5‧‧‧壓空泵5‧‧‧Air pressure pump
6‧‧‧切換閥6‧‧‧ switching valve
7‧‧‧調節器7‧‧‧ Regulator
8‧‧‧壓力檢測部8‧‧‧Pressure detection department
9‧‧‧切換閥9‧‧‧ switching valve
10‧‧‧電子零件搬送裝置10‧‧‧Electronic parts transfer device
11A‧‧‧托盤搬送機構11A‧‧‧Tray transfer mechanism
11B‧‧‧托盤搬送機構11B‧‧‧Tray transfer mechanism
12‧‧‧溫度調整部12‧‧‧Temperature Adjustment Department
13‧‧‧器件搬送頭13‧‧‧ device transfer head
14‧‧‧器件供給部14‧‧‧Device Supply Department
15‧‧‧托盤搬送機構15‧‧‧pallet transfer mechanism
16‧‧‧檢查部16‧‧‧ Inspection Department
17‧‧‧器件搬送頭17‧‧‧ device transfer head
18‧‧‧器件回收部18‧‧‧Device Recycling Department
19‧‧‧回收用托盤19‧‧‧Recycling tray
20‧‧‧器件搬送頭20‧‧‧ device transfer head
21‧‧‧托盤搬送機構21‧‧‧Tray transfer mechanism
22A‧‧‧托盤搬送機構22A‧‧‧Tray transfer mechanism
22B‧‧‧托盤搬送機構22B‧‧‧Tray transfer mechanism
30‧‧‧流道30‧‧‧ runner
31‧‧‧手部本體31‧‧‧hand body
32‧‧‧吸附墊32‧‧‧Adsorption pad
90‧‧‧IC器件90‧‧‧IC device
200‧‧‧托盤200‧‧‧tray
231‧‧‧第1隔板231‧‧‧The first partition
232‧‧‧第2隔板232‧‧‧Second partition
233‧‧‧第3隔板233‧‧‧3rd partition
234‧‧‧第4隔板234‧‧‧ 4th partition
235‧‧‧第5隔板235‧‧‧5th partition
241‧‧‧前蓋241‧‧‧Front cover
242‧‧‧側蓋242‧‧‧side cover
243‧‧‧側蓋243‧‧‧side cover
244‧‧‧後蓋244‧‧‧back cover
245‧‧‧頂蓋245‧‧‧Top cover
300‧‧‧監視器300‧‧‧ monitor
301‧‧‧顯示畫面301‧‧‧display
311‧‧‧內腔部311‧‧‧ Internal cavity
320‧‧‧開口部320‧‧‧ opening
321‧‧‧內腔部321‧‧‧ Internal cavity
400‧‧‧信號燈400‧‧‧ signal light
500‧‧‧揚聲器500‧‧‧Speaker
600‧‧‧滑鼠台600‧‧‧Mouse Station
700‧‧‧操作面板700‧‧‧ operation panel
800‧‧‧控制部800‧‧‧ Control Department
A1‧‧‧托盤供給區域A1‧‧‧Tray supply area
A2‧‧‧供給區域A2‧‧‧ Supply Area
A3‧‧‧檢查區域A3‧‧‧ Inspection area
A4‧‧‧回收區域A4‧‧‧Recycling area
A5‧‧‧托盤去除區域A5‧‧‧Tray removal area
P1‧‧‧壓力P1‧‧‧Pressure
P2‧‧‧壓力P2‧‧‧Pressure
P3‧‧‧壓力P3‧‧‧Pressure
P30‧‧‧壓力P30‧‧‧Pressure
Pmax‧‧‧上限值Pmax‧‧‧upper limit
Pmin‧‧‧下限值Pmin‧‧‧lower limit
S101～S105‧‧‧步驟Steps S101 ～ S105‧‧‧‧
α11A‧‧‧箭頭α 11A ‧‧‧ Arrow
α11B‧‧‧箭頭α 11B ‧‧‧ Arrow
α13X‧‧‧箭頭α 13X ‧‧‧ Arrow
α13Y‧‧‧箭頭α 13Y ‧‧‧ Arrow
α14‧‧‧箭頭α 14 ‧‧‧arrow
α15‧‧‧箭頭α 15 ‧‧‧arrow
α17Y‧‧‧箭頭α 17Y ‧‧‧ Arrow
α18‧‧‧箭頭α 18 ‧‧‧ arrow
α20X‧‧‧箭頭α 20X ‧‧‧ Arrow
α20Y‧‧‧箭頭α 20Y ‧‧‧ Arrow
α21‧‧‧箭頭α 21 ‧‧‧ Arrow
α22A‧‧‧箭頭α 22A ‧‧‧ Arrow
α22B‧‧‧箭頭α 22B ‧‧‧ Arrow
α90‧‧‧箭頭α 90 ‧‧‧ arrow
X‧‧‧方向X‧‧‧ direction
Y‧‧‧方向Y‧‧‧ direction
Z‧‧‧方向Z‧‧‧ direction
圖1係自正面側觀察本發明第1實施形態之電子零件檢查裝置之概略立體圖。 圖2係圖1所示之電子零件檢查裝置之俯視圖。 圖3係顯示圖1所示之電子零件檢查裝置所具備之器件搬送頭之圖。 圖4係圖3所示之固持部之放大剖視圖。 圖5係圖1所示之電子零件檢查裝置之空壓電路圖。 圖6係用以說明圖1所示之電子零件檢查裝置所具備之控制部之控制動作的流程圖。 圖7係圖1所示之器件搬送頭之模式圖。 圖8係圖1所示之器件搬送頭之模式圖。 圖9係本發明第2實施形態之電子零件檢查裝置之空壓電路圖。FIG. 1 is a schematic perspective view of an electronic component inspection apparatus according to a first embodiment of the present invention as viewed from the front side. FIG. 2 is a top view of the electronic component inspection device shown in FIG. 1. FIG. FIG. 3 is a diagram showing a device transfer head provided in the electronic component inspection apparatus shown in FIG. 1. FIG. 4 is an enlarged sectional view of the holding portion shown in FIG. 3. FIG. 5 is a pneumatic circuit diagram of the electronic component inspection device shown in FIG. 1. FIG. 6 is a flowchart for explaining a control operation of a control section provided in the electronic component inspection apparatus shown in FIG. 1. FIG. 7 is a schematic diagram of the device transfer head shown in FIG. 1. FIG. FIG. 8 is a schematic diagram of the device transfer head shown in FIG. 1. FIG. Fig. 9 is a circuit diagram of a pneumatic circuit of an electronic component inspection device according to a second embodiment of the present invention.
Claims (8)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016190783A JP2018054463A (en) | 2016-09-29 | 2016-09-29 | Electronic component conveyance device and electronic component inspection device |
| JP??2016-190783 | 2016-09-29 |
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| Publication Number | Publication Date |
|---|---|
| TW201813793A true TW201813793A (en) | 2018-04-16 |
| TWI686277B TWI686277B (en) | 2020-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106132928A TWI686277B (en) | 2016-09-29 | 2017-09-26 | Electronic parts conveying device and electronic parts inspection device |
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| JP (1) | JP2018054463A (en) |
| CN (1) | CN107884698A (en) |
| TW (1) | TWI686277B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI738065B (en) * | 2018-09-27 | 2021-09-01 | 日商北星科技股份有限公司 | Electronic component conveying device and electronic component inspection device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002301683A (en) * | 2001-03-30 | 2002-10-15 | Star Seiki Co Ltd | Carrying device |
| JP4401937B2 (en) * | 2004-11-17 | 2010-01-20 | ヤマハ発動機株式会社 | Surface mount machine |
| JP2006286781A (en) * | 2005-03-31 | 2006-10-19 | Yamagata Casio Co Ltd | Mounting head of electronic parts, parts mounting device, and its control method |
| US7839138B2 (en) * | 2007-01-29 | 2010-11-23 | Electro Scientific Industries, Inc. | Adjustable force electrical contactor |
| US9980419B2 (en) * | 2013-06-28 | 2018-05-22 | Yamaha Hatsudoki Kabushiki Kaisha | Pressure control device, surface mount machine and pressure control method |
| JP6236957B2 (en) * | 2013-07-23 | 2017-11-29 | セイコーエプソン株式会社 | Electronic component conveying device, electronic component inspection device, and cooling system |
| JP2016023961A (en) * | 2014-07-16 | 2016-02-08 | セイコーエプソン株式会社 | Electronic component conveyance device and electronic component inspection device |
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2016
- 2016-09-29 JP JP2016190783A patent/JP2018054463A/en active Pending
-
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- 2017-09-26 CN CN201710885802.9A patent/CN107884698A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI738065B (en) * | 2018-09-27 | 2021-09-01 | 日商北星科技股份有限公司 | Electronic component conveying device and electronic component inspection device |
Also Published As
| Publication number | Publication date |
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| CN107884698A (en) | 2018-04-06 |
| JP2018054463A (en) | 2018-04-05 |
| TWI686277B (en) | 2020-03-01 |
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