CN105658377A - 研磨装置以及研磨方法 - Google Patents
研磨装置以及研磨方法 Download PDFInfo
- Publication number
- CN105658377A CN105658377A CN201480054424.4A CN201480054424A CN105658377A CN 105658377 A CN105658377 A CN 105658377A CN 201480054424 A CN201480054424 A CN 201480054424A CN 105658377 A CN105658377 A CN 105658377A
- Authority
- CN
- China
- Prior art keywords
- polished
- structural unit
- grinding structural
- machining object
- grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/08—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding non-circular cross-sections, e.g. shafts of elliptical or polygonal cross-section
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/002—Grinding heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
- B24B9/107—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass for glass plates while they are turning
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-209602 | 2013-10-04 | ||
JP2013209602 | 2013-10-04 | ||
PCT/JP2014/076360 WO2015050186A1 (ja) | 2013-10-04 | 2014-10-02 | 研磨装置及び研磨方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN105658377A true CN105658377A (zh) | 2016-06-08 |
Family
ID=52778773
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201480054424.4A Pending CN105658377A (zh) | 2013-10-04 | 2014-10-02 | 研磨装置以及研磨方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20160236314A1 (ja) |
EP (1) | EP3053703A4 (ja) |
JP (2) | JPWO2015050186A1 (ja) |
KR (1) | KR20160067106A (ja) |
CN (1) | CN105658377A (ja) |
TW (1) | TW201529224A (ja) |
WO (1) | WO2015050186A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019169813A1 (zh) * | 2018-03-08 | 2019-09-12 | 北京铂阳顶荣光伏科技有限公司 | 磨边方法及装置 |
CN115365928A (zh) * | 2022-08-23 | 2022-11-22 | 北京航空航天大学宁波创新研究院 | 一种研磨方法及研磨机 |
CN117773697A (zh) * | 2024-02-23 | 2024-03-29 | 山东旭辉玻璃科技有限公司 | 一种用于农机玻璃的切割边角打磨设备 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015174180A (ja) * | 2014-03-14 | 2015-10-05 | 株式会社東京精密 | 超音波面取り機 |
JP6398902B2 (ja) * | 2014-08-19 | 2018-10-03 | 信越化学工業株式会社 | インプリント・リソグラフィ用角形基板及びその製造方法 |
JP6568006B2 (ja) * | 2016-04-08 | 2019-08-28 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
US11799150B2 (en) | 2020-07-17 | 2023-10-24 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling structure for hybrid-electric vehicle battery cell assemblies |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5317836A (en) * | 1991-11-27 | 1994-06-07 | Shin-Etsu Handotai Co., Ltd. | Apparatus for polishing chamfers of a wafer |
US5658189A (en) * | 1994-09-29 | 1997-08-19 | Tokyo Seimitsu Co., Ltd. | Grinding apparatus for wafer edge |
US20070066192A1 (en) * | 2005-09-21 | 2007-03-22 | Elpida Memory, Inc. | Wafer-edge polishing system |
CN101284365A (zh) * | 2007-04-13 | 2008-10-15 | 奇美电子股份有限公司 | 基板的旋转装置、磨边装置及磨边方法 |
CN101612717A (zh) * | 2009-07-17 | 2009-12-30 | 李留江 | 数控球轴承内圈沟道多功能磨床 |
CN201380419Y (zh) * | 2009-03-02 | 2010-01-13 | 湖北新火炬科技股份有限公司 | 金刚滚轮磨削砂轮用于磨削轮毂总成内滚道的装置 |
JP2010182813A (ja) * | 2009-02-04 | 2010-08-19 | Noritake Super Abrasive Co Ltd | Cmpパッドコンディショナー |
US20110136411A1 (en) * | 2009-12-03 | 2011-06-09 | Masayuki Nakanishi | Method and apparatus for polishing a substrate having a grinded back surface |
CN102427913A (zh) * | 2009-05-15 | 2012-04-25 | 旭硝子株式会社 | 玻璃端面磨削用磨具的加工位置设定方法 |
CN203077043U (zh) * | 2012-02-03 | 2013-07-24 | 中村留精密工业株式会社 | 硬质脆性板的侧边加工装置 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1082418A (en) * | 1966-07-22 | 1967-09-06 | Toolmasters Ltd | Improvements relating to grinding wheels |
JPS5250088A (en) * | 1975-10-15 | 1977-04-21 | Monsanto Co | Crush forming roll |
JPS5388291A (en) * | 1977-01-12 | 1978-08-03 | Fukuyama Tetsukoushiyo Kk | Machine for automatically pol shuing all circumference of plate glass |
JPS591548U (ja) * | 1982-06-29 | 1984-01-07 | 小出 ▲けん▼ | 倣い研磨用砥石装置 |
JPS60143646U (ja) * | 1984-03-02 | 1985-09-24 | 豊田工機株式会社 | 研削装置 |
JPS6165762A (ja) * | 1984-09-06 | 1986-04-04 | Nippon Sheet Glass Co Ltd | 板状体の端面研磨装置 |
JPS6165763A (ja) * | 1984-09-06 | 1986-04-04 | Nippon Sheet Glass Co Ltd | 板状体の端面研磨装置 |
JPH01170558U (ja) * | 1988-05-24 | 1989-12-01 | ||
US5083401A (en) * | 1988-08-08 | 1992-01-28 | Mitsubishi Denki Kabushiki Kaisha | Method of polishing |
JPH04360772A (ja) * | 1991-06-05 | 1992-12-14 | Toto Ltd | 平板面取用砥石及び平板面取装置 |
KR100277320B1 (ko) * | 1992-06-03 | 2001-01-15 | 가나이 쓰도무 | 온라인 롤 연삭 장치를 구비한 압연기와 압연 방법 및 회전 숫돌 |
JPH1170471A (ja) * | 1997-07-03 | 1999-03-16 | Asahi Glass Co Ltd | ガラス面取り方法およびその装置 |
JPH11188590A (ja) | 1997-12-22 | 1999-07-13 | Speedfam Co Ltd | エッジポリッシング装置 |
JP2000176805A (ja) * | 1998-12-17 | 2000-06-27 | Mitsubishi Materials Silicon Corp | 半導体ウェーハの面取り装置 |
DE19914174A1 (de) * | 1999-03-29 | 2000-10-12 | Wernicke & Co Gmbh | Verfahren und Vorrichtung zum Formbearbeiten des Umfangsrandes von Brillengläsern |
JP2001038589A (ja) * | 1999-08-03 | 2001-02-13 | Speedfam Co Ltd | ワーク外周部用研磨装置 |
JP2001062686A (ja) * | 1999-08-25 | 2001-03-13 | Speedfam Co Ltd | インデックス式エッジポリッシャー |
JP2001205549A (ja) | 2000-01-25 | 2001-07-31 | Speedfam Co Ltd | 基板エッジ部の片面研磨方法およびその装置 |
EP1306891A4 (en) * | 2000-07-10 | 2007-05-23 | Shinetsu Handotai Kk | MIRROR BROWN WARP, MIRROR BAG AND MIRROR BAG MACHINE AND METHOD |
TWI352645B (en) * | 2004-05-28 | 2011-11-21 | Ebara Corp | Apparatus for inspecting and polishing substrate r |
ES2279719B1 (es) * | 2006-01-26 | 2008-07-16 | Timac Agro España, S.A. | Nuevo activador metabolico y nutricional para las plantas. |
US20080293329A1 (en) * | 2007-05-21 | 2008-11-27 | Applied Materials, Inc. | Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile |
WO2009116945A1 (en) * | 2008-03-20 | 2009-09-24 | Telefonaktiebolaget Lm Ericsson (Publ) | Method and apparatus for communication of data packets between local networks |
US8585467B2 (en) * | 2008-10-31 | 2013-11-19 | Corning Incorporated | Linear pressure feed grinding with voice coil |
JP5352331B2 (ja) * | 2009-04-15 | 2013-11-27 | ダイトエレクトロン株式会社 | ウェーハの面取り加工方法 |
US8892238B2 (en) * | 2009-10-06 | 2014-11-18 | Edward T. Sweet | Edge break details and processing |
US8747188B2 (en) * | 2011-02-24 | 2014-06-10 | Apple Inc. | Smart automation of robotic surface finishing |
US8986072B2 (en) * | 2011-05-26 | 2015-03-24 | Corning Incorporated | Methods of finishing an edge of a glass sheet |
EP2537634A1 (de) * | 2011-06-21 | 2012-12-26 | WENDT GmbH | Verfahren zum Schleifen der umlaufenden Kantenfläche einer Verglasung |
-
2014
- 2014-10-02 US US15/026,089 patent/US20160236314A1/en not_active Abandoned
- 2014-10-02 WO PCT/JP2014/076360 patent/WO2015050186A1/ja active Application Filing
- 2014-10-02 TW TW103134429A patent/TW201529224A/zh unknown
- 2014-10-02 EP EP14851309.6A patent/EP3053703A4/en not_active Withdrawn
- 2014-10-02 KR KR1020167008523A patent/KR20160067106A/ko not_active Application Discontinuation
- 2014-10-02 CN CN201480054424.4A patent/CN105658377A/zh active Pending
- 2014-10-02 JP JP2015540534A patent/JPWO2015050186A1/ja active Pending
-
2017
- 2017-10-06 JP JP2017196150A patent/JP2018001406A/ja active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5317836A (en) * | 1991-11-27 | 1994-06-07 | Shin-Etsu Handotai Co., Ltd. | Apparatus for polishing chamfers of a wafer |
US5658189A (en) * | 1994-09-29 | 1997-08-19 | Tokyo Seimitsu Co., Ltd. | Grinding apparatus for wafer edge |
US20070066192A1 (en) * | 2005-09-21 | 2007-03-22 | Elpida Memory, Inc. | Wafer-edge polishing system |
CN101284365A (zh) * | 2007-04-13 | 2008-10-15 | 奇美电子股份有限公司 | 基板的旋转装置、磨边装置及磨边方法 |
JP2010182813A (ja) * | 2009-02-04 | 2010-08-19 | Noritake Super Abrasive Co Ltd | Cmpパッドコンディショナー |
CN201380419Y (zh) * | 2009-03-02 | 2010-01-13 | 湖北新火炬科技股份有限公司 | 金刚滚轮磨削砂轮用于磨削轮毂总成内滚道的装置 |
CN102427913A (zh) * | 2009-05-15 | 2012-04-25 | 旭硝子株式会社 | 玻璃端面磨削用磨具的加工位置设定方法 |
CN101612717A (zh) * | 2009-07-17 | 2009-12-30 | 李留江 | 数控球轴承内圈沟道多功能磨床 |
US20110136411A1 (en) * | 2009-12-03 | 2011-06-09 | Masayuki Nakanishi | Method and apparatus for polishing a substrate having a grinded back surface |
CN203077043U (zh) * | 2012-02-03 | 2013-07-24 | 中村留精密工业株式会社 | 硬质脆性板的侧边加工装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019169813A1 (zh) * | 2018-03-08 | 2019-09-12 | 北京铂阳顶荣光伏科技有限公司 | 磨边方法及装置 |
CN115365928A (zh) * | 2022-08-23 | 2022-11-22 | 北京航空航天大学宁波创新研究院 | 一种研磨方法及研磨机 |
CN117773697A (zh) * | 2024-02-23 | 2024-03-29 | 山东旭辉玻璃科技有限公司 | 一种用于农机玻璃的切割边角打磨设备 |
CN117773697B (zh) * | 2024-02-23 | 2024-05-14 | 山东旭辉玻璃科技有限公司 | 一种用于农机玻璃的切割边角打磨设备 |
Also Published As
Publication number | Publication date |
---|---|
EP3053703A1 (en) | 2016-08-10 |
EP3053703A4 (en) | 2017-07-26 |
TW201529224A (zh) | 2015-08-01 |
JP2018001406A (ja) | 2018-01-11 |
WO2015050186A1 (ja) | 2015-04-09 |
JPWO2015050186A1 (ja) | 2017-03-09 |
US20160236314A1 (en) | 2016-08-18 |
KR20160067106A (ko) | 2016-06-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105658377A (zh) | 研磨装置以及研磨方法 | |
US20110034112A1 (en) | Polishing apparatus, polishing auxiliary apparatus and polishing method | |
CN105451938A (zh) | 研磨加工工具以及构件的加工方法 | |
JP2011245574A (ja) | 2次元(楕円)超音波援用化学・機械複合加工法および装置 | |
CN106466805A (zh) | 用于局部轮廓控制的化学机械抛光(cmp)平台 | |
JP2016155204A (ja) | 研削加工装置 | |
WO2015050218A1 (ja) | 研磨物の製造方法 | |
JP2008194771A (ja) | レンズ球面研削方法及び装置 | |
JP6474861B2 (ja) | 研磨装置、研磨部材の加工又は修正用工具、研磨部材の加工又は修正方法、及び研磨部材の製造方法 | |
US20140364041A1 (en) | Apparatus and method for polishing wafer | |
CN105150034B (zh) | 一种实现端面超声辅助研磨和抛光的磨头 | |
CN111300218B (zh) | 钉枪铸件披锋打磨工艺 | |
JP2010069594A (ja) | 研削研磨装置と研削研磨方法 | |
JPH11221757A (ja) | 回転加工工具を用いた加工方法及び加工装置 | |
WO2022210721A1 (ja) | 加工装置および加工方法 | |
JPH05170B2 (ja) | ||
JP2003071706A (ja) | ラッピング装置 | |
JP2002064074A (ja) | 基板の研磨装置および研磨方法 | |
CN105965373B (zh) | 一种石英石抛光打蜡装置 | |
CN101148028A (zh) | 振动研磨机的振动电机安装方法 | |
CN203485007U (zh) | 一种车床砂带抛光装置 | |
JP2003022992A (ja) | 半導体製造装置および半導体製造方法 | |
CN1446667A (zh) | 蓝宝石的固相反应cmp加工方法 | |
JP2024067484A (ja) | 研磨工具 | |
JP2001239458A (ja) | 基板の化学機械研磨装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160608 |
|
WD01 | Invention patent application deemed withdrawn after publication |