CN105658377A - Polishing device and polishing method - Google Patents
Polishing device and polishing method Download PDFInfo
- Publication number
- CN105658377A CN105658377A CN201480054424.4A CN201480054424A CN105658377A CN 105658377 A CN105658377 A CN 105658377A CN 201480054424 A CN201480054424 A CN 201480054424A CN 105658377 A CN105658377 A CN 105658377A
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- China
- Prior art keywords
- polished
- structural unit
- grinding structural
- machining object
- grinding
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/08—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding non-circular cross-sections, e.g. shafts of elliptical or polygonal cross-section
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/002—Grinding heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
- B24B9/107—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass for glass plates while they are turning
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The purpose of the present invention is to provide a polishing device and a polishing method capable of polishing workpieces of various shapes. This polishing device is provided with: a motor moving mechanism (33) which moves the workpiece to be polished (K) in a direction tangential to the outer peripheral surface of a polishing member (10) in the radial direction, and moves the workpiece to be polished (K) in a direction orthogonal to the rotational axis of the polishing member (10),and a second motor (20) which rotates the workpiece to be polished (K).
Description
Technical field
The present invention relates to lapping device and Ginding process.
Background technology
In the lapping device of recording at patent documentation 1, patent documentation 2, make to be polished processing by one sideThing (will carry out the object of attrition process) rotation contacts with Grinding structural unit on one side, to being polished machining objectPeriphery grind.
Prior art document
Patent documentation
Patent documentation 1: Japanese kokai publication hei 11-188590 communique
Patent documentation 2: TOHKEMY 2001-205549 communique
Summary of the invention
The problem that invention will solve
But, in above-mentioned lapping device in the past, the periphery that is polished machining object of rotating with grindMill member contact, therefore, being polished machining object is just with regard to being limited to such profile such as discoid, cylindricThe member of toroidal, the machining object that is polished being difficult to having other various profiles is ground.
In addition, above-mentioned " positive toroidal " refer to, with by plane, apart from certain any equidistantThe shape that the curve that the set of point forms is described. In addition, above-mentioned " profile " refers to, is polished machining objectIn the shape of perspective view of the orthogonal face in the side with grinding.
The present invention makes in view of such situation, and its object is to provide the one can be each to havingPlant lapping device and the Ginding process that machining object is ground that be polished of profile.
For the scheme of dealing with problems
The lapping device addressing the above problem is the device for grinding being polished machining object, its bagDraw together: Grinding structural unit, it has the shape matching with the shape of the described portion that is polished that is polished machining objectAbradant surface; And travel mechanism, it is polished described in making in machining object and described Grinding structural unit at leastThe tangential direction of one outer peripheral face upwards along the footpath of described Grinding structural unit moves.
In addition, another lapping device addressing the above problem is for grinding being polished machining objectDevice, it comprises: Grinding structural unit, it has the shape phase with the described portion that is polished that is polished machining objectThe abradant surface of the shape of coupling; The 1st travel mechanism, its for be polished described in making machining object and described in grindThe tangential direction of the outer peripheral face upwards of at least one footpath along described Grinding structural unit in mill member moves;And the 2nd travel mechanism, it is polished at least one of machining object and described Grinding structural unit described in makingPerson is along moving with the orthogonal direction of the rotation of described Grinding structural unit.
In addition, another lapping device addressing the above problem is for grinding being polished machining objectDevice, it comprises: Grinding structural unit, it has the shape phase with the described portion that is polished that is polished machining objectThe abradant surface of the shape of coupling; And rotating mechanism, it is polished machining object and described grinding structure described in makingAt least one rotation in part.
In addition, another lapping device addressing the above problem is for grinding being polished machining objectDevice, it comprises: Grinding structural unit, it has the shape phase with the described portion that is polished that is polished machining objectThe abradant surface of the shape of coupling; And pressing mechanism, its for will described in be polished machining object and described in grindAt least one in member of mill is along pressing with the orthogonal direction of the rotation of described Grinding structural unit.
In addition, another lapping device addressing the above problem is for grinding being polished machining objectDevice, it comprises: Grinding structural unit, it has the shape phase with the described portion that is polished that is polished machining objectThe abradant surface of the shape of coupling; Travel mechanism, it is polished machining object and described grinding structure described in makingThe tangential direction of the outer peripheral face upwards along the footpath of described Grinding structural unit of at least one in part moves; AndRotating mechanism, it is for being polished at least one rotation of machining object and described Grinding structural unit described in making.
In addition, another lapping device addressing the above problem is for grinding being polished machining objectDevice, it comprises: Grinding structural unit, it has the shape phase with the described portion that is polished that is polished machining objectThe abradant surface of the shape of coupling; Travel mechanism, it is polished machining object and described grinding structure described in makingThe tangential direction of the outer peripheral face upwards along the footpath of described Grinding structural unit of at least one in part moves; AndPressing mechanism, its for be polished machining object and described Grinding structural unit by described at least one along withThe orthogonal direction of rotation of described Grinding structural unit is pressed.
In addition, another lapping device addressing the above problem is for grinding being polished machining objectDevice, it comprises: Grinding structural unit, it has the shape phase with the described portion that is polished that is polished machining objectThe abradant surface of the shape of coupling; Travel mechanism, it is polished machining object and described grinding structure described in makingThe tangential direction of the outer peripheral face upwards along the footpath of described Grinding structural unit of at least one in part moves; RotationMechanism, it is for being polished at least one rotation of machining object and described Grinding structural unit described in making; AndPressing mechanism, its for be polished machining object and described Grinding structural unit by described at least one along withThe orthogonal direction of rotation of described Grinding structural unit is pressed.
In addition, preferably, above-mentioned lapping device has the motor that makes Grinding structural unit rotation from below, orHave platform, this platform revolves with Grinding structural unit one under the state that Grinding structural unit is placed on to its upper surfaceTurn.
In addition, the Ginding process addressing the above problem is to utilize Grinding structural unit to grind being polished machining objectThe method of mill, described Grinding structural unit has with the shape of the described portion that is polished that is polished machining object and matchesThe abradant surface of shape, in this Ginding process,, making when being polished machining object and grinding describedDescribed be polished in machining object and described Grinding structural unit at least one along described Grinding structural unit radiallyOn the tangential direction of outer peripheral face move.
In addition, another Ginding process addressing the above problem is to utilize Grinding structural unit to enter being polished machining objectThe method that row grinds, described Grinding structural unit has the shape phase with the described portion that is polished that is polished machining objectThe abradant surface of shape of coupling, in this Ginding process, to described when being polished machining object and grinding,Described in making, be polished at least one footpath along described Grinding structural unit in machining object and described Grinding structural unitThe tangential direction of outer peripheral face upwards moves; Described in making, be polished in machining object and described Grinding structural unit extremelyFew one is along moving with the orthogonal direction of the rotation of described Grinding structural unit.
In addition, another Ginding process addressing the above problem is to utilize Grinding structural unit to enter being polished machining objectThe method that row grinds, described Grinding structural unit has the shape phase with the described portion that is polished that is polished machining objectThe abradant surface of the shape of coupling, in this Ginding process, is polished machining object and described grinding structure described in makingAt least one rotation in part.
In addition, another Ginding process addressing the above problem is to utilize Grinding structural unit to enter being polished machining objectThe method that row grinds, described Grinding structural unit has the shape phase with the described portion that is polished that is polished machining objectThe abradant surface of the shape of coupling, in this Ginding process, is polished machining object and described grinding structure described in inciting somebody to actionAt least one in part is along pressing with the orthogonal direction of the rotation of described Grinding structural unit.
In addition, another Ginding process addressing the above problem is to utilize Grinding structural unit to enter being polished machining objectThe method that row grinds, described Grinding structural unit has the shape phase with the described portion that is polished that is polished machining objectThe abradant surface of the shape of coupling, in this Ginding process, is polished machining object and described grinding structure described in makingThe tangential direction of the outer peripheral face upwards along the footpath of described Grinding structural unit of at least one in part moves; Make instituteState at least one rotation being polished in machining object and described Grinding structural unit.
In addition, another Ginding process addressing the above problem is to utilize Grinding structural unit to enter being polished machining objectThe method that row grinds, described Grinding structural unit has the shape phase with the described portion that is polished that is polished machining objectThe abradant surface of the shape of coupling, in this Ginding process, is polished machining object and described grinding structure described in makingThe tangential direction of the outer peripheral face upwards along the footpath of described Grinding structural unit of at least one in part moves; By instituteState be polished in machining object and described Grinding structural unit at least one along with the rotation of described Grinding structural unitThe orthogonal direction of axis is pressed.
In addition, another Ginding process addressing the above problem is to utilize Grinding structural unit to enter being polished machining objectThe method that row grinds, described Grinding structural unit has the shape phase with the described portion that is polished that is polished machining objectThe abradant surface of the shape of coupling, in this Ginding process, is polished machining object and described grinding structure described in makingThe tangential direction of the outer peripheral face upwards along the footpath of described Grinding structural unit of at least one in part moves; Make instituteState at least one rotation being polished in machining object and described Grinding structural unit; Will described in be polished machining object andAt least one in described Grinding structural unit is along pressing with the orthogonal direction of the rotation of described Grinding structural unitPress.
In addition, preferably, in above-mentioned Ginding process, make Grinding structural unit rotation from below or inciting somebody to actionGrinding structural unit is placed under the state of upper surface of platform and makes Grinding structural unit one rotation together with platform.
In said apparatus, method, Grinding structural unit has and the shape of the portion that is polished that is polished machining objectThe abradant surface of the shape matching, therefore, even be polished machining object the portion that is polished shape for exampleAs curved surface, triangle etc. from plane different shape, also can grind.
In said apparatus, method, make to be polished in machining object and Grinding structural unit at least one alongIn the situation that the tangential direction of the footpath of Grinding structural unit outer peripheral face has upwards moved, be polished machining object and grindMember is linearly relatively moves for mill. Thereby, can to have linearity profile be polished machining objectGrind.
In said apparatus, method, make to be polished in machining object and Grinding structural unit at least one alongThe tangential direction of the footpath of Grinding structural unit outer peripheral face upwards makes to be polished machining object and grinds when movementAt least one in member of mill is along situation about having moved with the rotation of Grinding structural unit orthogonal directionUnder, can make the position relationship being polished between machining object and Grinding structural unit change arbitrarily. Therefore, canFollow various be polished the outer shape of machining object while will be polished member be maintained in grinding and addThe state of work thing contact. Thereby, can grind the machining object that is polished with various profiles.
In addition, in said apparatus, method, making to be polished at least one in machining object and Grinding structural unitIn the situation that person has rotated, can change the face that will grind that is polished machining object. Thereby, canGrind for example part of whole periphery, periphery that is polished machining object being suitable for having various profilesMill.
In addition, in said apparatus, method, will be polished at least one in machining object and Grinding structural unitPerson, in the situation of having pressed with the direction of the rotating shaft direct cross of Grinding structural unit, can promote to be polished to addWhen the milled processed of work thing, can impel the contact condition (institute that is polished machining object and abradant surfaceMeaning touch) homogenising.
In addition, in said apparatus, method, from below Grinding structural unit has been rotated or will grindMember is placed on and under the state of upper surface of platform, makes Grinding structural unit one together with this platform rotateIn situation, can obtain the rotation of the less stable Grinding structural unit such as axle beat, therefore, can carry out moreHigh-precision processing.
The effect of invention
According to the present invention, can grind the machining object that is polished with various profiles.
Brief description of the drawings
Fig. 1 is the top view that represents the schematic configuration of the lapping device of an embodiment.
Fig. 2 is the side view that represents the schematic configuration of the lapping device of this embodiment.
Fig. 3 is the top view that represents the schematic configuration of the lapping device of the variation of this embodiment.
Fig. 4 is be polished machining object one that represents that the lapping device of the variation that uses Fig. 3 grindsThe top view of example.
Fig. 5 is the part that is polished machining object and Grinding structural unit in another variation of this embodimentSide view.
Fig. 6 is the part that is polished machining object and Grinding structural unit in another variation of this embodimentSide view.
Fig. 7 is the part that is polished machining object and Grinding structural unit in another variation of this embodimentSide view.
Fig. 8 is the part that is polished machining object and Grinding structural unit in another variation of this embodimentSide view.
Fig. 9 is the part that is polished machining object and Grinding structural unit in another variation of this embodimentSide view.
Figure 10 represents that the lapping device of another variation of this embodiment is to being polished adding of machining objectThe schematic diagram of work form.
Figure 11 represents that the lapping device of another variation of this embodiment is to being polished adding of machining objectThe schematic diagram of work form.
Figure 12 is the schematic configuration that represents pressure applying mechanism in another variation of this embodimentSchematic diagram.
Detailed description of the invention
Below, with reference to Fig. 1 and Fig. 2 to by lapping device of the present invention, Ginding process and be polished and addThe embodiment that work thing is specialized describes.
As shown in Figure 1, this lapping device has discoid Grinding structural unit 10. Use this Grinding structural unit 10Outer peripheral face upwards of the footpath end that is polished portion to being polished the conduct of machining object K grind.
Be polished machining object K profile, that is to say this be polished in machining object K with to grindThe projection of shape (shape that is polished machining object K shown in Fig. 1) of the orthogonal face in side is quadrangle shape.More specifically, Bu Shi right angle, tetragonal bight and with circular arc. But, as other shapes, alsoCan become right angle in tetragonal bight.
As shown in Figure 2, the shape (being polished the shape of portion) that is polished the end KE of machining object K is passed throughProcess in advance as curve form, the end KE that is processed to this curve form is polished member 10 and grindsMill.
The material of Grinding structural unit 10 can at random be used the most applicable material that end KE is ground.For example, in the case of using the material of resin as Grinding structural unit 10, can use synthetic tree arbitrarilyFat. As its example, can list heat-curing resin (phenolic resins, epoxy resin, polyurethane treeFat, polyimides etc.), thermoplastic resin (polyethylene, polypropylene, acrylic resin, polyamide,Merlon etc.). In addition, can be also the process of resin product, synthetic of fabric, nonwoven, nonwovenLeather or their combination product, the hardness of the abradant surface of Grinding structural unit 10 is preferably in Xiao A hardnessBe more than 5. Xiao A hardness is more than 5 to refer to, will have for the corpse or other object for laboratory examination and chemical testing that hardness is measuredThe Grinding structural unit 10 of abradant surface under the drying regime of humidity 20%～60%, be placed in room temperature more than 60 minutes itAfter, it is more than 5 utilizing the hardness of the abradant surface of measuring according to the durometer (A type) of JISK6253.As long as Xiao A hardness is more than 5, the surface that just can be suitable for being polished machining object K processes,The abradant surface that in addition, can suppress Grinding structural unit 10 is out of shape after the grinding short time.
In addition, the Xiao A hardness of the abradant surface of Grinding structural unit 10 is more preferably more than 40, further preferredBe 70～95, be particularly preferably 70～85.
In addition, in the case of using the material of metal as Grinding structural unit 10, as material, can makeWith magnesium, aluminium, titanium, iron, nickel, cobalt, copper, zinc, manganese or the alloy taking them as principal component.
In addition, in the case of use resin or the material of metal as Grinding structural unit 10, Grinding structural unit 10Also can there is abrasive particle. The kind of the abrasive particle using is not particularly limited, and can use silica, oxygenChange aluminium, zirconia, cerium oxide, magnesia, calcium oxide, titanium oxide, manganese oxide, iron oxide, oxidationThe carbide such as metal oxide particle, carborundum such as chromium, other nitride, boride, diamond etc.
In addition, in the case of using the material of pottery as Grinding structural unit 10, as material, except potteryOutside chinaware, glass, can also use oxide, nitride, the boron of silicon, aluminium, zirconium, calcium, barium etc.Compound, carbide etc., aluminium oxide, zirconia, silica, carborundum, silicon nitride, boron nitride etc.
The material that is polished machining object K also can be used material arbitrarily. For example, using resin conductBe polished in the situation of material of machining object K, can use synthetic resin arbitrarily. As its example,Can list heat-curing resin (phenolic resins, epoxy resin, polyurethane resin, polyimides etc.),Thermoplastic resin (polyethylene, polypropylene, acrylic resin, polyamide, Merlon etc.).
In addition, in the case of using pottery as being polished the material of machining object K, except pottery chinaware,Outside glass, fine ceramics, can also use silicon, aluminium, zirconium, calcium, barium etc. oxide, carbide,Nitride, boride etc.
In addition, in the case of use metal as being polished the material of machining object K, can use magnesium,Aluminium, titanium, iron, nickel, cobalt, copper, zinc, manganese or the alloy taking them as principal component etc.
In addition, the concrete purposes that is polished machining object K is also arbitrarily. For example can by wheel, axle,Container, housing (shell, shell etc.), frame (framework etc.), ball, wire, ornament etc. are as its useOn the way.
Grinding structural unit 10 is fixed on the upper surface of discoid platform 20 in the mode that can dismantle. At platform20 central part lower surface is fixed with the rotating shaft of the 1st motor 21. If the 1st motor 21 is driven and is rotated,Platform 20 and Grinding structural unit 10 all rotate. Under Grinding structural unit 10 and platform 20, be provided with the 1stMotor 21, by making the Grinding structural unit 10 of the upper surface that is disposed at platform 20 together with this platform 20 from belowRotation, can obtain the rotation of the less stable Grinding structural unit 10 such as axle beat, therefore, can carry out moreHigh-precision processing.
In the footpath of Grinding structural unit 10, outer peripheral face is upwards provided with the song that has along the groove shape of circumferential extensionThe abradant surface 11 of face shape. The curved surface of this abradant surface 11 becomes and the shape of end KE that is polished machining object KThe shape that shape matches. The curvature that is to say abradant surface 11 is identical with the curvature of end KE.
Say down along band, if increase as far as possible Grinding structural unit in the scope that can be suitable for maintaining grinding precision10 diameter, can be simultaneously to multiple ends that are polished machining object K on the outer peripheral face of Grinding structural unit 10The KE of portion grinds, and therefore, can boost productivity. In addition, if can increase as much as possible grindingThe diameter of member 10, even if the rotary speed of Grinding structural unit 10 is identical, also can obtain larger in peripheryLinear velocity, therefore, even if make the rotary speed of Grinding structural unit 10 lower when carrying out attrition process,Also can obtain sufficient linear velocity. Therefore, can suppress dispersing of such as working fluid described later etc.
Be polished machining object K and keep fixed station 32 in the mode that can dismantle. Fixed station 32 is fixed on the 2ndThe rotating shaft 31 of motor 30. Driven by the 2nd motor 30, be polished machining object K with rotating shaft 31Centered by be rotated (the arrow R direction shown in Fig. 1 before or arrow L direction). In addition the 2nd horse,Reach 30 and formed above-mentioned rotating mechanism.
The 2nd motor 30 is installed on motor travel mechanism 33. This motor travel mechanism 33 has makes the 2nd motor 30Along the mechanism moving back and forth with the orthogonal direction of the rotation of Grinding structural unit 10. In addition, below, willThe direction orthogonal with the rotation of Grinding structural unit 10 is called " arrow directions X " (being shown in Fig. 2).
In addition, motor travel mechanism 33 also has and makes the 2nd motor 30 along the footpath of Grinding structural unit 10 upwardsThe mechanism that the tangential direction of outer peripheral face moves back and forth. In addition, below, by the footpath of Grinding structural unit 10 upwardsThe tangential direction of outer peripheral face is called " arrow Y-direction " (in the Fig. 1 before being shown in).
If the 2nd motor 30 is moved by motor travel mechanism 33, the 2nd motor 30, rotating shaft 31, fixed station32 and be polished that machining object K becomes one and along with the orthogonal side of the rotation of Grinding structural unit 10To the footpath of, Grinding structural unit 10, the tangential direction of outer peripheral face upwards moves. This motor travel mechanism 33 formsAbove-mentioned the 1st travel mechanism and above-mentioned the 2nd travel mechanism.
And lapping device has along pressing and ground with the orthogonal direction of the rotation of Grinding structural unit 10The pressing mechanism 40 of mill machining object K. This pressing mechanism 40 is the abradant surface with respect to Grinding structural unit 10 with pressure P11 press and are polished machining object K. Can at random adjust the pressure P being produced by such pressing mechanism 40.For example, utilize load sensor etc. to being polished the contact between end KE and the abradant surface 11 of machining object KThe contact at place of portion is measured. Then, above-mentioned pressure P is adjusted, so that this contactThe constant value in regulation. In addition, also can adjust pressure P according to the area of contact site (is for example connecingPressure P is improved at the larger position of area of the portion of touching, and the position less at the area of contact site reduces pressure PDeng).
In addition, the above-mentioned contact in bight etc. is easily higher than the above-mentioned contact of planar portions. Therefore,Also can be to shorten the grinding of the part that contact uprises as bight etc. that is polished machining object KTime, while extending the grinding of the part that contact uprises as planar portions etc. that is polished machining object KBetween etc. the basis shape that is polished machining object K etc. carry out appropriate grinding control or with such pressure PAdjustment adjust process time in the lump and carry out constant grinding.
As the power source of motor travel mechanism 33, pressing mechanism 40, can use electric power, hydraulic pressure, skyThe suitable power source that air pressure, air pressure etc. are such. In addition, motor travel mechanism 33, pressing mechanism 40Driving can drive automatically by the control device with CPU, RAM and ROM etc., can be by passing throughThe operator's of operation lapping device switching manipulation etc. is carried out.
Movement by such motor travel mechanism 33 to the 2nd motor 30 and pressing mechanism 40 are to being polishedMachining object K presses, and the end KE that is polished machining object K is pressed against abradant surface 11. Then, to fitWhen form supply with working fluid etc. to contact site between end KE and abradant surface 11. Such working fluidSupply can directly be supplied with by the contact site from outside to end KE and between abradant surface 11. Or, make revolutionThe working fluid feed mechanisms such as joint (are more specifically fixed with the flat of Grinding structural unit 10 between Grinding structural unit 10Platform 20) and the 1st motor 21 between connecting portion. Then, from this working fluid feed mechanism to Grinding structural unit10 internal feed working fluid, also can be by the working fluid of inside that is supplied to Grinding structural unit 10 via formationFeed path in the inside of Grinding structural unit 10 is supplied with to above-mentioned contact site. By so from Grinding structural unit 10Inside supply with working fluid towards contact site, can supply with more efficiently working fluid. In addition, for efficientlyGround uses working fluid, has the organic efficiency that cover is set around Grinding structural unit 10 promotes working fluidRetracting device is even more ideal.
The kind of above-mentioned working fluid can make according to the material that is polished machining object K, Grinding structural unit 10By appropriate kind. Particularly, can use cutting use, working fluid, grinding-material, throwing for grindingPhoto etching, lapping liquid etc. for cmp. Working fluid also can contain abrasive particle. The abrasive particle usingKind is not particularly limited, but can use silica, aluminium oxide, zirconia, cerium oxide, oxidationMetal oxide particle, the carborundum such as magnesium, calcium oxide, titanium oxide, manganese oxide, iron oxide, chromium oxideIn carbide, nitride, boride, diamond etc.
For example, preferably the content of the abrasive particle in working fluid is more than 1 quality %, more preferably 2 quality % withOn. In addition, the content of the abrasive particle in working fluid is preferably below 50 quality %, more preferably 40 quality %Below.
More than the average aggregate particle size of the abrasive particle in working fluid is preferably 0.1 μ m, more preferably 0.3 μ m withOn. Along with the average aggregate particle size of abrasive particle becomes large, the process velocity of working fluid improves.
On the other hand, the average aggregate particle size of the abrasive particle in working fluid is preferably below 20 μ m, more preferablyBe below 5 μ m. Along with the average aggregate particle size of the abrasive particle in working fluid diminishes, can be more equably to quiltGrind on the surface of attrition process thing K. Say down along band, the average aggregate particle size of abrasive particle refers to, for example,Use hole field makes laser diffraction/diffuse transmission type particle size distribution analyzers such as " LA-950 " of society of institute systemThe volume average particle size of measuring etc.
As required, above-mentioned working fluid also can further contain pH adjusting agent, etchant, oxidant,Water-soluble polymer, copolymer and salt thereof, derivative, anticorrosive, chelating agent, dispersing aid, anti-Other compositions such as rotten agent, mould inhibitor.
As the example of above-mentioned pH adjusting agent, can use known acid, base or their salt. DoFor can be as the sour example of pH adjusting agent, for example can list hydrochloric acid, sulfuric acid, nitric acid, hydrofluoric acid,The inorganic acids such as boric acid, carbonic acid, hypophosphorous acid, phosphorous acid and phosphoric acid, formic acid, acetic acid, propionic acid, butyric acid,Valeric acid, 2-Methyl Butyric Acid, n-caproic acid, 3,3-acid dimethyl, 2 Ethylbutanoic acid, 4-methylValeric acid, positive enanthic acid, 2 methyl caproic acid, caprylic acid, 2 ethyl hexanoic acid, benzoic acid, glycolic, waterPoplar acid, glyceric acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, maleic acid,Phthalic acid, malic acid, tartaric acid, citric acid, lactic acid, diglycolic acid, 2-furancarboxylic acid, 2,5-furandicarboxylic acid, 3-furancarboxylic acid, 2-tetrahydrofuran formic acid, methoxyacetic acid, methoxyl group secondThe organic acid such as acid and phenoxyacetic acid.
As can, as the example of the base of pH adjusting agent, listing aliphatic amine, aromatic amine etc.The hydrogen of the alkali-metal hydroxide such as the organic base such as amine, quaternary ammonium hydroxide, potassium hydroxide, alkaline-earth metalOxide and ammonia etc.
In addition, also can substitute above-mentioned acid or with above-mentioned acid combine to use above-mentioned acid ammonium salt,The salt such as alkali metal salt are as pH adjusting agent. In addition, such pH adjusting agent is polished processing for basisThe kind of thing K and the pH value of working fluid is adjusted to different optimum values.
As the example of above-mentioned etchant, can list the inorganic acids such as nitric acid, sulfuric acid, phosphoric acid, acetic acid,The inorganic bases such as the organic acids such as citric acid, tartaric acid, methanesulfonic acid, potassium hydroxide, NaOH, ammonia, amine,The organic bases such as quaternary ammonium hydroxide etc.
As the example of above-mentioned oxidant, except hydrogen peroxide, peracetic acid, percarbonate, urea peroxide,Outside perchlorate, persulfate etc., also can list sulfuric acid, nitric acid, phosphoric acid and sulfate, nitreThe oxyacid such as hydrochlorate, phosphate, oxysalt etc.
As above-mentioned water-soluble polymer, copolymer, their salt, the example of derivative, can list:The poly-sulfonic acid such as the polycarboxylic acids such as polyacrylate, polyphosphonic acid, polystyrolsulfon acid, xanthans, mosanom etc.Cellulose derivative, polyethylene glycol, the polyethylene such as polysaccharide, hydroxyethylcellulose, carboxymethyl celluloseAlcohol, PVP, sorbitan monooleate, there is single kind or multiple oxyalkylene unitsOxyalkylene based polymer, nonionic surfactant, anionic surfactant etc. As non-Ionic surfactant's example, can list: polyoxyethylene alkyl ether, polyoxyethylene alkylphenylEther, sorbitan monooleate, there is single kind or the oxyalkylene based polymer of multiple oxyalkylene units etc.As anionic surfactant's example, can list: alkyl sulfonic acid based compound, benzene sulfonamideAcid based compound, alkyl naphthalene sulfonic acid based compound, N-methyltaurine based compound, alkyl diphenyl base ether twoSulfonic acid based compound, alpha-olefin sulfonic acid based compound, naphthalene sulfonic acid condensate, sulfosuccinic acid diester-basedCompound etc.
As the example of above-mentioned anticorrosive, can list: amine, pyridines, tetraphenyl phosphonium salt, benzeneAnd the monocyclic compound such as triazole type, triazole type, tetrazolium class, benzoic acid, have condensed ring polycyclic compound,Hetero ring type compound etc.
As the example of above-mentioned chelating agent, can list: the carboxylic acids such as gluconic acid be chelating agent, ethylenediamine,The amine such as diethylenetriamines, trimethyl tetramine are chelating agent, ethylenediamine tetra-acetic acid, nitrilotriacetic acid(nitrilotriaceticacid), hydroxyethylethylene diamine tri-acetic acid, triethylenetetraaminehexaacetic acid, two sub-secondThe polyamines polycarboxylic acids such as base pentaacetic acid are chelating agent, 2-amino-ethyl phosphonic acids, 1-hydroxy ethylidene base-1,1-Di 2 ethylhexyl phosphonic acid, amino three (methylene see acid), ethylenediamine tetraacetic (methylene see acid), diethylenetriamines five(methylene see acid), ethane-1,1-di 2 ethylhexyl phosphonic acid, ethane-1,1,2-tri methylene phosphonic acid, methane hydroxyethylidene diphosphonic acid, 1-phosphineAcidic group butane-2, the organic phospho acids such as 3,4-tricarboxylic acids are chelating agent, amphyl, 1,3-diketone etc.
As the example of above-mentioned dispersing aid, can list the condensed phosphoric acid such as pyrophosphate, hexametaphosphateSalt etc.
As the example of foregoing preservatives, can list clorox etc.
As the example of above-mentioned mould inhibitor, can Lie Ju Chu oxazolidine-2, the oxazolines such as 5-diketone etc.
And, by adjust the rotary speed of the 1st motor 21 in supplying with above-mentioned working fluid etc., canEnd KE to curve form grinds. The grinding of end KE for example can be entered successively with following operationOK.
Operation 1: utilize motor travel mechanism 33 make to be polished machining object K on arrow directions X towards grindingThe pivot of member 10 moves, thereby end KE is contacted with abradant surface 11.
Operation 2: then, under the state having contacted with abradant surface 11 at end KE, drive pressing mechanism 40 andUtilize motor travel mechanism 33 to make to be polished machining object K and move in arrow Y-direction, thus end KE andContact site between abradant surface 11 changes. Thus, a limit that is polished machining object K is ground.
Operation 3: finish if be polished the grinding on a limit of machining object K, make pressing mechanism 40 and endKE separately. Then, utilize motor travel mechanism 33 to make to be polished machining object K and move on arrow directions X,Utilize the 2nd motor 30 to make to be polished machining object K rotation simultaneously. Maintain and be polished machining object by one side like thisThe state that K has contacted with abradant surface 11 makes to be polished machining object K rotation on one side, grinds the limit of having finishedAdjacent side is towards abradant surface 11 sides, and the limit that grind is switched.
Then,, by repeatedly carrying out operation 2 and operation 3,4 limits that are polished machining object K are all groundMill. In addition, the operation of above-mentioned grinding is an example, motor travel mechanism 33, pressing mechanism 40Drive form can consider process time etc. and suitably change.
According to present embodiment described above, can obtain following action effect.
(1) utilize motor travel mechanism 33 to make to be polished machining object K along the footpath of Grinding structural unit 10 upwardsThe tangential direction (arrow Y-direction) of outer peripheral face is mobile. Therefore, be polished machining object K and Grinding structural unit10 linearly relatively moving. Thereby, can to have wire limit quadrangle shape be polished processingThe end KE of thing K grinds.
(2) by utilizing the 2nd motor 30 to make to be polished machining object K rotation, can change and be polished processingThe face that will grind (limit) in thing K. Thereby, can be to thering is being polished of profile of quadrangle shapeThe whole periphery of machining object K is ground.
(3) when being polished machining object K and grinding, will be polished machining object K and press on grinding structurePart 10. Therefore, can promote to be polished the milled processed of machining object K. In addition, can impel and be polishedThe contact condition of machining object K and abradant surface 11, so-called homogenising of touching.
(4) lapping device comprises having the shape matching with the shape of end KE that is polished machining object KThe Grinding structural unit 10 of the abradant surface 11 of shape. Thereby, even be polished end KE and the plane of machining object KThe curve form that shape is different, also can grind this end KE.
(5), in above-mentioned Ginding process, use lapping device to grind being polished machining object K.Thereby, be and plane different curved surface shaped even be polished the shape (shape of end KE) of portionShape and be quadrangle shape be polished machining object K, also can grind its periphery.
In addition, above-mentioned embodiment also can change to implement as below.
By making to be polished machining object K rotation, the whole periphery that is polished machining object K is groundMill, but replaces, also can be polished machining object K periphery a part, be for example only polishedGrind on limit of machining object K or only two limits or only 3 limits.
In above-mentioned operation 3, on one side make to be polished machining object K on arrow directions X to leaving grinding structureThe direction of the pivot of part 10 moves rotation on one side, but replaces, and also can make to be polished processingThing K moves along arrow Y-direction until grind after the end KE having finished separates with abradant surface 11,Make this be polished machining object K rotation. And, also can be to be polished then will grind in machining object KLimit make to be polished machining object K near the mode of abradant surface 11 and move in arrow Y-direction. Even soThe limit that conversion will be ground, also can grind the each limit that is polished machining object K respectively. In addition exist,In the situation of this variation, can omit and make to be polished the motor that machining object K moves along arrow directions XThe function of travel mechanism 33.
If only a limit in above-mentioned 4 limits that are polished machining object K is ground, motor movesActuation mechanism 33 also can only have and make to be polished the function that machining object K moves along arrow Y-direction, and economizesSlightly rotating mechanism (the 2nd motor 30 etc.). In this case, also utilize motor travel mechanism 33 to make to be polishedMachining object K and Grinding structural unit 10 is linearly relatively moves, therefore, can be to thering is the limit of linearityGrind on a limit of the end KE that is polished machining object K of quadrangle shape.
In the above-described embodiment, being polished machining object K can be along arrow directions X and arrow YDirection moves, and in addition, also can be provided with the mechanism that the pivot of Grinding structural unit 10 is moved. And,Also can make to be polished machining object K moves and makes Grinding structural unit 10 along arrow Y side along arrow directions XTo motion. Or, also can make to be polished machining object K and move and make Grinding structural unit along arrow Y-direction10 move along arrow directions X.
Or, also can make to be polished machining object K and Grinding structural unit 10 all along arrow directions X move,Or make to be polished machining object K and Grinding structural unit 10 all moves along arrow Y-direction.
In the above-described embodiment, being polished machining object K can move, and replaces, also can structureBecoming Grinding structural unit 10 can move. The summary of such variation is illustrated in Fig. 3.
As shown in Figure 3, the machining object K that is polished of quadrangle shape is clamped in grinding dress with suitable formPut. In addition, be provided with this Grinding structural unit is moved at the pivot of the Grinding structural unit 10 being driven and rotateMoving travel mechanism 50. This travel mechanism 50 has as making Grinding structural unit 10 along Grinding structural unit 10 simultaneouslyThe 1st mobile travel mechanism of tangential direction (the arrow Y-direction shown in Fig. 3) of outer peripheral face upwards of footpathFunction and as make Grinding structural unit 10 along with the orthogonal direction (Fig. 3 of the rotation of Grinding structural unit 10Shown arrow directions X) function of mobile the 2nd travel mechanism. As such travel mechanism 50, energyEnough adopt suitable mechanism. Can adopt for example linkage, similar with said motor travel mechanism 33Mechanism etc.
In lapping device in this variation, can utilize travel mechanism 50 to make the relative of Grinding structural unit 10At random change in the position that is polished machining object K, therefore, can follow on one side and be polished machining object KOuter shape maintain on one side the contact condition being polished between machining object K and Grinding structural unit 10. NamelySay, as in Fig. 3 with as shown in double dot dash line, can make Grinding structural unit 10 along the periphery that is polished machining object K(end KE) is mobile. Therefore, in such variation, also can to have quadrangle shape outsideThe whole periphery that is polished machining object K of shape is ground. In addition, in the case of such variation,With above-mentioned embodiment comparison, even if the size of Grinding structural unit 10 is smaller, also can be to being polished processingThe whole periphery of thing K is ground. Say down along band, the travel mechanism 50 in the variation of alternate figures 3, alsoCan arrange respectively and make the travel mechanism that Grinding structural unit 10 moves along the arrow Y-direction shown in Fig. 3 and makeThe travel mechanism that Grinding structural unit 10 moves along the arrow directions X shown in Fig. 3. In addition, in the distortion of Fig. 3In example, also can be polished machining object K periphery a part, be for example only polished machining object K'sGrind on limit or only two limits or only 3 limits.
Be provided with Grinding structural unit 10 at the upper surface of platform 20, but also can omit platform 20 and by the 1stThe rotating shaft of motor 21 is directly fixed on Grinding structural unit 10 center.
By driving pressing mechanism 40, end KE is pressed on to abradant surface 11, as long as but can utilize horseReach travel mechanism 33 the 2nd motor 30 is moved along arrow directions X, thereby end KE is pressed on to grindingFace 11, just also can omit pressing mechanism 40.
Utilize motor travel mechanism 33 to make the 2nd motor 30 along orthogonal with the rotation of Grinding structural unit 10Direction (the arrow directions X shown in Fig. 2 before) and along the footpath of Grinding structural unit 10 periphery upwardsThe tangential direction (the arrow Y-direction shown in Fig. 1 before) of face moves back and forth, but replaces, and also canWith arrange respectively make the 2nd motor 30 along with the orthogonal direction of the rotation of Grinding structural unit 10 (beforeArrow directions X shown in Fig. 2) mobile mechanism and make the 2nd motor 30 along the footpath of Grinding structural unit 10 upwardsThe mobile mechanism of tangential direction (the arrow Y-direction shown in Fig. 1 before) of outer peripheral face.
Move in order to make to be polished machining object K, the 2nd motor 30 is moved, but also can be with other formsMaking to be polished machining object K moves.
The end KE that is polished machining object K is ground, but the portion of being polished is not limited to like thisEnd, can be also other positions.
The shape that is polished the end KE of machining object K can be both non-planar beyond curved surface, also couldBeing example triangle, as shown in Figure 6 general triangular shape and top as shown in Figure 5 with circular arcShape. In addition, the shape that is polished the end KE of machining object K can be also the stairstepping shown in Fig. 7,As shown in Figure 8 roughly stairstepping and bight with the shape of circular arc. In addition, as shown in Figure 9, endThe KE curve form forming that also can cave in towards the inner side that is polished machining object K. In addition, can be alsoThe curved surface being formed by multiple curvature, the curved surface that part has line part. In these variation, also pass throughThe abradant surface of Grinding structural unit 10 11 is made as with the shape of the end KE that is polished machining object K and (is polished portionShape) shape that matches, can grind end KE.
The profile that is polished machining object K can be also the various shapes arbitrarily beyond quadrangle shape. ExampleAs being both the shape being formed by multiple planes, curved surface, can be also triangle, elliptical shape.Say down along band, in above-mentioned embodiment and variation thereof, can add thering is being polished of various profilesWork thing K grinds, for example, also can to profile be circular drum be polished machining object KSide face grind.
In addition, in the variation shown in Fig. 3 before, can at random change the phase of Grinding structural unit 10For the position that is polished machining object K, therefore, as shown in Figure 4, even if be polished the profile of machining object KBe the shape being shaped with multiple curvature, also can grind its periphery.
In addition, in the above-described embodiment, in order to make to be polished end KE and the abradant surface 11 of machining object KContact or the end KE that grinding has been finished separate with abradant surface 11, make to be polished machining object K along arrowDirections X moves. At this, adopt said motor travel mechanism 33, can make to be polished machining object K edgeArrow directions X and arrow Y-direction moves, therefore, can at random change and be polished machining object KThe position with respect to Grinding structural unit 10. Therefore, can follow the profile shape that is polished machining object K on one sideShape maintains the contact condition being polished between machining object K and Grinding structural unit 10 on one side. And, above-mentioned enforcementThe lapping device of mode also has the rotating mechanism that makes to be polished machining object K rotation. Thereby, in above-mentioned realityExecute in mode, also by being polished the movement along arrow directions X and arrow Y-direction of machining object KWith the rotation combination that is polished machining object K, even being polished of shape as shown in Figure 4 before addsWork thing K, that is to say the shape that the profile that is polished machining object K is shaped with multiple curvature, also can be rightIts periphery is ground.
As feature (A), make to be polished at least one in machining object K and Grinding structural unit 10 as long as adoptThe mobile way of tangential direction (arrow Y-direction) of person's outer peripheral face upwards along the footpath of Grinding structural unit 10,Just can grind a limit that is polished machining object K. In addition, as feature (B), as long as adoptWith make to be polished in machining object K and Grinding structural unit 10 at least one along with the rotating shaft of Grinding structural unit 10The orthogonal direction (arrow directions X) of line is mobile and make to be polished in machining object K and Grinding structural unit 10 extremelyThe tangential direction (arrow Y-direction) of few one outer peripheral face upwards along the footpath of Grinding structural unit 10 is mobileWay, just can at random change the position relationship being polished between machining object K and Grinding structural unit 10. SeparatelyOutward, as feature (C), as long as employing makes to be polished at least one in machining object K and Grinding structural unit 10The way of rotation, just can change the face that will grind being polished in machining object K. In addition, asFeature (D), if adopt by be polished in machining object K and Grinding structural unit 10 at least one along with grindThe way that the orthogonal direction of rotation of mill member 10 is pressed, just can promote to be polished grinding of machining objectWhen mill is processed, can impel the contact condition being polished between machining object and abradant surface (so-calledTouch) homogenising. Thereby, these features (A)～(D) can be according to being polished machining object KShape, processing object suitably combine adopt or separately adopt, in this case, can obtain and instituteThe corresponding effect of feature (A)～(D) adopting.
By making Grinding structural unit 10, be polished machining object K rotation and this be polished machining object K and enteredIn the situation that row grinds, the face after the grinding that is polished machining object K is likely residual along direction of rotationThere is grinding marks. Therefore, in order to suppress such grinding marks, except above-mentioned various mechanisms,Also can also have make Grinding structural unit 10 and be polished in machining object K at least one along with rotation sideThe reciprocating device moving back and forth to the direction of intersecting. Before such reciprocating device is arranged atThe lapping device of above-mentioned embodiment of Fig. 2 shown in waiting time two examples be illustrated in Figure 10 and Figure 11In.
The lapping device of the variation shown in Figure 10 have make to be polished machining object K along with Grinding structural unit 10The swing mechanism 60 that swings of the orthogonal direction of direction of rotation. As this swing mechanism 60, can adopt exampleAs suitable mechanisms such as linkages.
In this variation, Grinding structural unit 10 is rotated, the end KE that is polished machining object K is carried outWhen grinding, swing mechanism 60 is worked. Utilize the work of this swing mechanism 60, make to be polished machining object KAlong swinging with the orthogonal direction (the arrow RO direction shown in Figure 10) of the direction of rotation of Grinding structural unit 10.Then, utilize this oscillating motion that is polished machining object K, in spin finishing process, be polished machining objectThe end KE of K swings along the curved surface of abradant surface 11. Utilize the swing of such end KE, end KEGrinding marks become cross-like, compared with the grinding being only rotated, grinding marks diminishes. Thereby,The grinding marks that can suppress to be caused by spin finishing.
In addition, being polished the swaying direction of the direction of rotation with respect to Grinding structural unit 10 of machining object K may notBe limited to orthogonal direction, as long as putting along the direction of at least intersecting with the direction of rotation of Grinding structural unit 10Moving, grinding marks becomes cross-like, therefore, and the grinding marks that just can suppress to be caused by spin finishing.In addition, also can make Grinding structural unit 10 swing and not make to be polished machining object K swing. In addition, also canMake to be polished machining object K and Grinding structural unit 10 all swings.
The lapping device of the variation shown in Figure 11 have make to be polished machining object K along with Grinding structural unit 10The slightly vibrating mechanism 70 of vibration of the orthogonal direction of direction of rotation. As this vibrating mechanism 70, can adoptWith for example having utilized the suitable mechanisms such as the mechanism of ultrasonic vibration.
In this variation, Grinding structural unit 10 is rotated, the end KE that is polished machining object K is carried outWhen grinding, vibrating mechanism 70 is worked. Utilize the work of this vibrating mechanism 70, make to be polished machining object KAlong small size with the orthogonal direction (the arrow UD direction shown in Figure 11) of the direction of rotation of Grinding structural unit 10Vibration. Then. Utilize this vibration that is polished machining object K, in spin finishing process, be polished processingThe end KE of thing K makes this end KE along arrow UD under the state having contacted with the curved surface of abradant surface 11Direction slightly moves back and forth. Utilize the reciprocating motion of such end KE, the grinding marks of end KE becomesFor cross-like, compared with the grinding being only rotated, grinding marks diminishes. Thereby, in this variation,The grinding marks that also can suppress to be caused by spin finishing.
In addition, being polished the direction of vibration of the direction of rotation with respect to Grinding structural unit 10 of machining object K may notBe limited to orthogonal direction, as long as vibrate along the direction of at least intersecting with the direction of rotation of Grinding structural unit 10, grindPolishing scratch mark becomes cross-like, therefore, and the grinding marks that just can suppress to be caused by spin finishing. In addition,Also can make Grinding structural unit 10 vibrate and not make to be polished machining object K vibration. In addition, also can make to be groundMill machining object K and Grinding structural unit 10 all vibrate.
Say down along band, above-mentioned reciprocating device also can be equally applicable to the distortion of above-mentioned embodimentLapping device (lapping device shown in routine Fig. 3 as in the previous etc. etc.) in example, in this case, also canThe grinding marks that enough inhibition are caused by spin finishing.
Shown in Fig. 2 waits as in the previous, in the above-described embodiment, by being polished machining object KAlong pressing on the orthogonal direction (the arrow directions Xs shown in Fig. 2 etc.) of the rotation of Grinding structural unit 10Abradant surface 11, grinds the end KE that is polished machining object K. In this case, although canThe end KE being pressed is like this ground, but for the upper surface and the following table that are polished machining object KFace, that is to say with the orthogonal parallel plane machining object K that is polished of the rotation of Grinding structural unit 10Two faces, when grinding, how not exert pressure, therefore likely cannot carry out fullyAttrition process. Therefore,, except above-mentioned various mechanisms, also can also have such being polishedTwo faces of machining object K apply the pressure applying mechanism of the pressure vertical with these two faces.
In Figure 12, represent the schematic configuration of an example of such pressure applying mechanism. As this Figure 12 instituteShow, pressure applying mechanism comprises roller 80, actuator 82 etc. Roller 80 for discoid and taking rotating shaft 81 as inThe heart is rotated. In addition, the upper surface 10U of the outer peripheral face of roller 80 in Grinding structural unit 10 and with its peripheryNear butt, roller 80 also rotates along with the rotation of upper surface 10U. In addition roller 80 and upper surface 10U,At least in the process of lapping that is polished machining object K, carry out butt. Thereby, roller 80 and upper surface 10UBoth butt all the time also can only carry out butt in the process of lapping that is polished machining object K.
Actuator 82 is the mechanisms that roller 80 pressed on to upper surface 10U, suitable by electrodynamic type, fluid pressure type etc.Mechanism form. Being polished in the process of lapping of machining object K, utilize the work of actuator 82 by roller 80Press on upper surface 10U (the arrow VT direction shown in Figure 12).
If so roller 80 is pressed on to upper surface 10U, on the upper surface KU that is polished machining object K, executeBe added with the pressing force F of the abradant surface 11 of pressing Grinding structural unit 10. In addition, if so upper surface KU is appliedPressing force F, the lower surface KD that is polished machining object K is pressed against the grinding that this lower surface KD will contactThe abradant surface 11 of member 10, therefore, as a result of, also applies the lower surface KD that is polished machining object KThe pressing force F same with the upper surface KU that is polished machining object K. By to being so polished machining objectUpper surface KU and the lower surface KD of K apply pressing force F, are grinding being polished machining object KTime, not only can grind end KE, also can be simultaneously to upper surface KU and lower surface KDGrind. Say down along band, in the variation shown in Figure 12, by utilizing pressure applying mechanism to pressThe one side (upper surface U) of Grinding structural unit 10, to being polished upper surface KU and the lower surface of machining object KKD applies pressing force F. Thereby, with the situation that pressure applying mechanism is set at two faces of Grinding structural unit 10Compare, can reduce the magnitude setting of this pressure applying mechanism.
In addition, in the variation shown in Figure 12, utilize actuator 82 by pressure roller 80, but as long as roller 80Quality is enough large, only just can apply sufficient pressing force F with the deadweight of roller 80, just also can omit and causeMoving device 82. In addition, in this variation, the one side of Grinding structural unit 10 is pressed, but also canFor example to press two sides to clip the modes such as two faces of Grinding structural unit 10. Press if so two faces,Compare with the situation of pressing one side, for example, can suppress the distortion of Grinding structural unit 10 etc. In addition, enteringWhen row grinds, the in the situation that of making to be polished machining object K rotation at fixing Grinding structural unit 10, without structureBecome roller 80 can be rotated, therefore, in this case, for example, also roller 80 can be altered to simplyWeight etc.
The explanation of Reference numeral
10 ... Grinding structural unit, 10U ... (Grinding structural unit) upper surface, 11 ... abradant surface, 20 ... platform,21 ... the 1st motor, 30 ... the 2nd motor, 31 ... rotating shaft, 32 ... fixed station, 33 ... motor travel mechanism,40 ... pressing mechanism, 50 ... travel mechanism, K ... be polished machining object, KE ... (being polished machining object)End, KU ... (being polished machining object) upper surface, KD ... (being polished machining object) lower surface,60 ... swing mechanism, 70 ... vibrating mechanism, 80 ... roller, 81 ... rotating shaft, 82 ... actuator.
Claims (18)
1. a lapping device, it is the device for grinding being polished machining object, its featureBe,
This lapping device comprises:
Grinding structural unit, it has the shape matching with the shape of the described portion that is polished that is polished machining objectAbradant surface; And
Travel mechanism, it is for being polished at least one edge of machining object and described Grinding structural unit described in makingThe tangential direction of the footpath that described Grinding structural unit outer peripheral face upwards moves.
2. a lapping device, it is the device for grinding being polished machining object, its featureBe,
This lapping device comprises:
Grinding structural unit, it has the shape matching with the shape of the described portion that is polished that is polished machining objectAbradant surface;
The 1st travel mechanism, it is polished at least one of machining object and described Grinding structural unit described in makingThe tangential direction of person's outer peripheral face upwards along the footpath of described Grinding structural unit moves; And
The 2nd travel mechanism, it is polished at least one of machining object and described Grinding structural unit described in makingPerson is along moving with the orthogonal direction of the rotation of described Grinding structural unit.
3. a lapping device, it is the device for grinding being polished machining object, its featureBe,
This lapping device comprises:
Grinding structural unit, it has the shape matching with the shape of the described portion that is polished that is polished machining objectAbradant surface; And
Rotating mechanism, it revolves at least one that is polished machining object and described Grinding structural unit described in makingTurn.
4. a lapping device, it is the device for grinding being polished machining object, its featureBe,
This lapping device comprises:
Grinding structural unit, it has the shape matching with the shape of the described portion that is polished that is polished machining objectAbradant surface; And
Pressing mechanism, it is for by described at least one edge that is polished machining object and described Grinding structural unitThe direction orthogonal with the rotation of described Grinding structural unit presses.
5. a lapping device, it is the device for grinding being polished machining object, its featureBe,
This lapping device comprises:
Grinding structural unit, it has the shape matching with the shape of the described portion that is polished that is polished machining objectAbradant surface;
Travel mechanism, it is for being polished at least one edge of machining object and described Grinding structural unit described in makingThe tangential direction of the footpath that described Grinding structural unit outer peripheral face upwards moves; And
Rotating mechanism, it revolves at least one that is polished machining object and described Grinding structural unit described in makingTurn.
6. a lapping device, it is the device for grinding being polished machining object, its featureBe,
This lapping device comprises:
Grinding structural unit, it has the shape matching with the shape of the described portion that is polished that is polished machining objectAbradant surface;
Travel mechanism, it is for being polished at least one edge of machining object and described Grinding structural unit described in makingThe tangential direction of the footpath that described Grinding structural unit outer peripheral face upwards moves; And
Pressing mechanism, it is for by described at least one edge that is polished machining object and described Grinding structural unitThe direction orthogonal with the rotation of described Grinding structural unit presses.
7. a lapping device, it is the device for grinding being polished machining object, its featureBe,
This lapping device comprises:
Grinding structural unit, it has the shape matching with the shape of the described portion that is polished that is polished machining objectAbradant surface;
Travel mechanism, it is for being polished at least one edge of machining object and described Grinding structural unit described in makingThe tangential direction of the footpath that described Grinding structural unit outer peripheral face upwards moves;
Rotating mechanism, it revolves at least one that is polished machining object and described Grinding structural unit described in makingTurn; And
Pressing mechanism, it is for by described at least one edge that is polished machining object and described Grinding structural unitThe direction orthogonal with the rotation of described Grinding structural unit presses.
8. according to the lapping device described in any one in claim 1～7, wherein,
This lapping device has the motor that makes described Grinding structural unit rotation from below.
9. according to the lapping device described in any one in claim 1～8, wherein,
This lapping device has platform, and this platform is being placed on described Grinding structural unit the state of its upper surfaceLower and described Grinding structural unit one rotation.
10. a Ginding process, it is the method for utilizing Grinding structural unit to grind being polished machining object,It is characterized in that,
Described Grinding structural unit has the shape matching with the shape of the described portion that is polished that is polished machining objectThe abradant surface of shape,
When being polished machining object and grinding, being polished machining object and described grinding structure to described described in makingThe tangential direction of the outer peripheral face upwards along the footpath of described Grinding structural unit of at least one in part moves.
11. 1 kinds of Ginding process, it is the method for utilizing Grinding structural unit to grind being polished machining object,It is characterized in that,
Described Grinding structural unit has the shape matching with the shape of the described portion that is polished that is polished machining objectThe abradant surface of shape,
When being polished machining object and grinding, being polished machining object and described grinding structure to described described in makingThe tangential direction of the outer peripheral face upwards along the footpath of described Grinding structural unit of at least one in part moves;
Described in making, be polished in machining object and described Grinding structural unit at least one along with described grinding structureThe orthogonal direction of rotation of part moves.
12. 1 kinds of Ginding process, it is the method for utilizing Grinding structural unit to grind being polished machining object,It is characterized in that,
Described Grinding structural unit has the shape matching with the shape of the described portion that is polished that is polished machining objectThe abradant surface of shape,
Described in making, be polished at least one rotation in machining object and described Grinding structural unit.
13. 1 kinds of Ginding process, it is the method for utilizing Grinding structural unit to grind being polished machining object,It is characterized in that,
Described Grinding structural unit has the shape matching with the shape of the described portion that is polished that is polished machining objectThe abradant surface of shape,
By described be polished in machining object and described Grinding structural unit at least one along with described grinding structureThe orthogonal direction of rotation of part is pressed.
14. 1 kinds of Ginding process, it is the method for utilizing Grinding structural unit to grind being polished machining object,It is characterized in that,
Described Grinding structural unit has the shape matching with the shape of the described portion that is polished that is polished machining objectThe abradant surface of shape,
Described in making, be polished at least one in machining object and described Grinding structural unit along described Grinding structural unitThe tangential direction of outer peripheral face upwards of footpath move;
Described in making, be polished at least one rotation in machining object and described Grinding structural unit.
15. 1 kinds of Ginding process, it is the method for utilizing Grinding structural unit to grind being polished machining object,It is characterized in that,
Described Grinding structural unit has the shape matching with the shape of the described portion that is polished that is polished machining objectThe abradant surface of shape,
Described in making, be polished at least one in machining object and described Grinding structural unit along described Grinding structural unitThe tangential direction of outer peripheral face upwards of footpath move;
By described be polished in machining object and described Grinding structural unit at least one along with described grinding structureThe orthogonal direction of rotation of part is pressed.
16. 1 kinds of Ginding process, it is the method for utilizing Grinding structural unit to grind being polished machining object,It is characterized in that,
Described Grinding structural unit has the shape matching with the shape of the described portion that is polished that is polished machining objectThe abradant surface of shape,
Described in making, be polished at least one in machining object and described Grinding structural unit along described Grinding structural unitThe tangential direction of outer peripheral face upwards of footpath move;
Described in making, be polished at least one rotation in machining object and described Grinding structural unit;
By described be polished in machining object and described Grinding structural unit at least one along with described grinding structureThe orthogonal direction of rotation of part is pressed.
17. according to the Ginding process described in any one in claim 10～16, wherein,
In this Ginding process, make described Grinding structural unit rotation from below.
18. according to the Ginding process described in any one in claim 10～17, wherein,
Being placed under the state of upper surface of platform, described Grinding structural unit makes described Grinding structural unit and instituteState platform one rotation together.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013209602 | 2013-10-04 | ||
| JP2013-209602 | 2013-10-04 | ||
| PCT/JP2014/076360 WO2015050186A1 (en) | 2013-10-04 | 2014-10-02 | Polishing device and polishing method |
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| Publication Number | Publication Date |
|---|---|
| CN105658377A true CN105658377A (en) | 2016-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480054424.4A Pending CN105658377A (en) | 2013-10-04 | 2014-10-02 | Polishing device and polishing method |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20160236314A1 (en) |
| EP (1) | EP3053703A4 (en) |
| JP (2) | JPWO2015050186A1 (en) |
| KR (1) | KR20160067106A (en) |
| CN (1) | CN105658377A (en) |
| TW (1) | TW201529224A (en) |
| WO (1) | WO2015050186A1 (en) |
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| WO2019169813A1 (en) * | 2018-03-08 | 2019-09-12 | 北京铂阳顶荣光伏科技有限公司 | Edge grinding method and device |
| CN115365928A (en) * | 2022-08-23 | 2022-11-22 | 北京航空航天大学宁波创新研究院 | Grinding method and grinding machine |
| CN117773697A (en) * | 2024-02-23 | 2024-03-29 | 山东旭辉玻璃科技有限公司 | Cutting corner polishing equipment for agricultural machinery glass |
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| JP6398902B2 (en) * | 2014-08-19 | 2018-10-03 | 信越化学工業株式会社 | Rectangular substrate for imprint lithography and method for manufacturing the same |
| JP6568006B2 (en) * | 2016-04-08 | 2019-08-28 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
| US11799150B2 (en) | 2020-07-17 | 2023-10-24 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling structure for hybrid-electric vehicle battery cell assemblies |
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Also Published As
| Publication number | Publication date |
|---|---|
| EP3053703A1 (en) | 2016-08-10 |
| JP2018001406A (en) | 2018-01-11 |
| TW201529224A (en) | 2015-08-01 |
| EP3053703A4 (en) | 2017-07-26 |
| US20160236314A1 (en) | 2016-08-18 |
| JPWO2015050186A1 (en) | 2017-03-09 |
| WO2015050186A1 (en) | 2015-04-09 |
| KR20160067106A (en) | 2016-06-13 |
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