CN101661893A - 树脂密封型半导体装置及其制造方法、引线框 - Google Patents
树脂密封型半导体装置及其制造方法、引线框 Download PDFInfo
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- CN101661893A CN101661893A CN200910168127A CN200910168127A CN101661893A CN 101661893 A CN101661893 A CN 101661893A CN 200910168127 A CN200910168127 A CN 200910168127A CN 200910168127 A CN200910168127 A CN 200910168127A CN 101661893 A CN101661893 A CN 101661893A
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Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (9)
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JP2008-220980 | 2008-08-29 | ||
JP2008220981 | 2008-08-29 | ||
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JP2009108812 | 2009-04-28 | ||
JP2009-108812 | 2009-04-28 | ||
JP2009108812A JP5634033B2 (ja) | 2008-08-29 | 2009-04-28 | 樹脂封止型半導体装置とその製造方法 |
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CN201110157820.8A Division CN102244016B (zh) | 2008-08-29 | 2009-08-28 | 树脂密封型半导体装置及其制造方法、引线框 |
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CN101661893A true CN101661893A (zh) | 2010-03-03 |
CN101661893B CN101661893B (zh) | 2011-07-27 |
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CN201110157820.8A Expired - Fee Related CN102244016B (zh) | 2008-08-29 | 2009-08-28 | 树脂密封型半导体装置及其制造方法、引线框 |
CN2009101681273A Expired - Fee Related CN101661893B (zh) | 2008-08-29 | 2009-08-28 | 树脂密封型半导体装置及其制造方法、引线框 |
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CN201110157820.8A Expired - Fee Related CN102244016B (zh) | 2008-08-29 | 2009-08-28 | 树脂密封型半导体装置及其制造方法、引线框 |
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US (3) | US8704342B2 (zh) |
JP (1) | JP5634033B2 (zh) |
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Cited By (7)
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CN102468260A (zh) * | 2010-11-04 | 2012-05-23 | 无锡华润安盛科技有限公司 | 兼容高低电压的引线框、引线框阵列及其封装结构 |
CN103050472A (zh) * | 2012-12-28 | 2013-04-17 | 日月光封装测试(上海)有限公司 | 半导体封装用导线架条及其模具与封胶方法 |
CN103681379A (zh) * | 2012-09-07 | 2014-03-26 | 瑞萨电子株式会社 | 半导体装置的制造方法和半导体装置 |
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Families Citing this family (26)
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JP5714280B2 (ja) | 2010-09-17 | 2015-05-07 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 半導体装置 |
JP2013149779A (ja) * | 2012-01-19 | 2013-08-01 | Semiconductor Components Industries Llc | 半導体装置 |
JP5919087B2 (ja) | 2012-05-10 | 2016-05-18 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
JP6114134B2 (ja) * | 2013-07-29 | 2017-04-12 | トヨタ自動車株式会社 | リードフレーム、電力変換装置、半導体装置及び半導体装置の製造方法 |
JP6284397B2 (ja) * | 2014-03-10 | 2018-02-28 | エイブリック株式会社 | 半導体装置及びその製造方法 |
JP6370071B2 (ja) * | 2014-03-19 | 2018-08-08 | エイブリック株式会社 | 半導体装置及びその製造方法 |
JP6420617B2 (ja) | 2014-09-30 | 2018-11-07 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
DE112014007140B4 (de) * | 2014-11-07 | 2024-05-02 | Mitsubishi Electric Corporation | Leistungshalbleiteranordnung und Verfahren zum Herstellen derselben |
JP1537980S (zh) * | 2015-04-20 | 2015-11-16 | ||
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- 2009-08-28 CN CN2009101681273A patent/CN101661893B/zh not_active Expired - Fee Related
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2014
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CN107342247A (zh) * | 2016-05-02 | 2017-11-10 | 东和株式会社 | 吸附单元、板状构件输送单元、树脂密封装置、板状构件输送方法以及树脂密封方法 |
CN112382576A (zh) * | 2016-05-26 | 2021-02-19 | 三菱电机株式会社 | 半导体装置及其制造方法 |
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US9171761B2 (en) | 2015-10-27 |
US8704342B2 (en) | 2014-04-22 |
CN102244016A (zh) | 2011-11-16 |
US20100052125A1 (en) | 2010-03-04 |
CN101661893B (zh) | 2011-07-27 |
US20150380344A1 (en) | 2015-12-31 |
JP2010080914A (ja) | 2010-04-08 |
CN102244016B (zh) | 2015-06-17 |
JP5634033B2 (ja) | 2014-12-03 |
US20140179063A1 (en) | 2014-06-26 |
US9905497B2 (en) | 2018-02-27 |
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