CN103050472B - 半导体封装用导线架条及其模具与封胶方法 - Google Patents
半导体封装用导线架条及其模具与封胶方法 Download PDFInfo
- Publication number
- CN103050472B CN103050472B CN201210585687.0A CN201210585687A CN103050472B CN 103050472 B CN103050472 B CN 103050472B CN 201210585687 A CN201210585687 A CN 201210585687A CN 103050472 B CN103050472 B CN 103050472B
- Authority
- CN
- China
- Prior art keywords
- sealing
- conductive wire
- semiconductor
- lead portion
- wire frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003292 glue Substances 0.000 title claims abstract description 80
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000007789 sealing Methods 0.000 title claims abstract description 18
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 31
- 238000003825 pressing Methods 0.000 claims abstract description 29
- 238000005520 cutting process Methods 0.000 claims abstract description 13
- 239000000084 colloidal system Substances 0.000 claims description 26
- 238000004806 packaging method and process Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000007493 shaping process Methods 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 7
- 238000005538 encapsulation Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 235000019994 cava Nutrition 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010057855 Hypotelorism of orbit Diseases 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (15)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210585687.0A CN103050472B (zh) | 2012-12-28 | 2012-12-28 | 半导体封装用导线架条及其模具与封胶方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210585687.0A CN103050472B (zh) | 2012-12-28 | 2012-12-28 | 半导体封装用导线架条及其模具与封胶方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103050472A CN103050472A (zh) | 2013-04-17 |
CN103050472B true CN103050472B (zh) | 2016-04-20 |
Family
ID=48063067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210585687.0A Expired - Fee Related CN103050472B (zh) | 2012-12-28 | 2012-12-28 | 半导体封装用导线架条及其模具与封胶方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103050472B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111509109B (zh) * | 2020-04-27 | 2021-03-12 | 江西省兆驰光电有限公司 | 一种led封装设备及其使用方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5118271A (en) * | 1991-02-22 | 1992-06-02 | Motorola, Inc. | Apparatus for encapsulating a semiconductor device |
US5637273A (en) * | 1993-11-30 | 1997-06-10 | Anam Industrial Co., Ltd. | Method for molding of integrated circuit package |
CN101661893A (zh) * | 2008-08-29 | 2010-03-03 | 三洋电机株式会社 | 树脂密封型半导体装置及其制造方法、引线框 |
CN102077343A (zh) * | 2008-07-10 | 2011-05-25 | 矽马电子股份有限公司 | 引线架及其制造方法 |
CN201927584U (zh) * | 2011-01-27 | 2011-08-10 | 浙江捷华电子有限公司 | 芯片引线共面性调整装置 |
CN101894822B (zh) * | 2010-05-28 | 2012-07-04 | 日月光封装测试(上海)有限公司 | 半导体封装用导线架条构造 |
CN203134786U (zh) * | 2012-12-28 | 2013-08-14 | 日月光封装测试(上海)有限公司 | 半导体封装用导线架条及其模具 |
-
2012
- 2012-12-28 CN CN201210585687.0A patent/CN103050472B/zh not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5118271A (en) * | 1991-02-22 | 1992-06-02 | Motorola, Inc. | Apparatus for encapsulating a semiconductor device |
US5637273A (en) * | 1993-11-30 | 1997-06-10 | Anam Industrial Co., Ltd. | Method for molding of integrated circuit package |
CN102077343A (zh) * | 2008-07-10 | 2011-05-25 | 矽马电子股份有限公司 | 引线架及其制造方法 |
CN101661893A (zh) * | 2008-08-29 | 2010-03-03 | 三洋电机株式会社 | 树脂密封型半导体装置及其制造方法、引线框 |
CN101894822B (zh) * | 2010-05-28 | 2012-07-04 | 日月光封装测试(上海)有限公司 | 半导体封装用导线架条构造 |
CN201927584U (zh) * | 2011-01-27 | 2011-08-10 | 浙江捷华电子有限公司 | 芯片引线共面性调整装置 |
CN203134786U (zh) * | 2012-12-28 | 2013-08-14 | 日月光封装测试(上海)有限公司 | 半导体封装用导线架条及其模具 |
Also Published As
Publication number | Publication date |
---|---|
CN103050472A (zh) | 2013-04-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20010042904A1 (en) | Frame for semiconductor package | |
EP3511147B1 (en) | Method for manufacturing package, method for manufacturing light emitting device, package and light emitting device | |
US10937666B2 (en) | Method for manufacturing lead frame including electrode and hanger lead, method for manufacturing package having lead frame, and method for manufacturing light-emitting device having package | |
CN102522375B (zh) | 半导体装置、半导体装置的制造方法及引线框 | |
JP6691960B2 (ja) | オプトエレクトロニクス部品 | |
CN101150119A (zh) | 堆叠半导体封装及其制造方法 | |
US20140248724A1 (en) | Method for manufacturing light emitting diode packages | |
CN104282634A (zh) | 半导体装置 | |
CN205016508U (zh) | 封装的半导体器件 | |
CN103050472B (zh) | 半导体封装用导线架条及其模具与封胶方法 | |
CN203134786U (zh) | 半导体封装用导线架条及其模具 | |
US8334175B1 (en) | Manufacturing method of LED package structure | |
CN115527957B (zh) | 空腔封装结构及封装方法 | |
CN210040170U (zh) | 一种高密度无基岛芯片封装结构 | |
CN101635291B (zh) | 一种微型封装引线框架的工艺方法 | |
CN203134785U (zh) | 导线架框条及封装体 | |
CN205004351U (zh) | Led支架及led封装结构 | |
US9040321B2 (en) | Method for manufacturing light emitting diode packages | |
CN210245488U (zh) | 非接触式上下芯片封装结构 | |
CN103021997B (zh) | 导线架框条及封装体与封胶方法 | |
CN104253191A (zh) | 发光二极管制造方法 | |
CN2386534Y (zh) | 发光二极管封装装置 | |
CN216958021U (zh) | 一种改进型大管脚引线框架 | |
CN217426746U (zh) | 功率模块封装结构 | |
CN203260572U (zh) | 导线架框条 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20161202 Address after: 201201 room -T3-10-202, No. 5001 East Road, Shanghai, Pudong New Area Patentee after: Advanced integrated circuit manufacturing (Chinese) Co. Ltd. Patentee after: ASE Assembly & Test (Shanghai) Limited Address before: Guo Shou Jing Road, Pudong Zhangjiang hi tech park Shanghai city Pudong New Area No. 669 201203 Patentee before: ASE Assembly & Test (Shanghai) Limited |
|
TR01 | Transfer of patent right |
Effective date of registration: 20170401 Address after: 201203 Shanghai city Chinese (Shanghai) free trade zone 669 GuoShouJing Road No. six building Patentee after: ASE Assembly & Test (Shanghai) Limited Address before: Room 5001, East China Road, No. Patentee before: Advanced integrated circuit manufacturing (Chinese) Co. Ltd. Patentee before: ASE Assembly & Test (Shanghai) Limited |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160420 Termination date: 20181228 |
|
CF01 | Termination of patent right due to non-payment of annual fee |