CN101382580B - 探测器装置以及探测方法 - Google Patents
探测器装置以及探测方法 Download PDFInfo
- Publication number
- CN101382580B CN101382580B CN2008102118163A CN200810211816A CN101382580B CN 101382580 B CN101382580 B CN 101382580B CN 2008102118163 A CN2008102118163 A CN 2008102118163A CN 200810211816 A CN200810211816 A CN 200810211816A CN 101382580 B CN101382580 B CN 101382580B
- Authority
- CN
- China
- Prior art keywords
- measuring head
- probe
- maintaining part
- detector
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007228078A JP5076750B2 (ja) | 2007-09-03 | 2007-09-03 | プローブ装置及びプローブ方法 |
JP2007228078 | 2007-09-03 | ||
JP2007-228078 | 2007-09-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101382580A CN101382580A (zh) | 2009-03-11 |
CN101382580B true CN101382580B (zh) | 2011-07-20 |
Family
ID=40462527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008102118163A Active CN101382580B (zh) | 2007-09-03 | 2008-09-03 | 探测器装置以及探测方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5076750B2 (ja) |
KR (1) | KR101025389B1 (ja) |
CN (1) | CN101382580B (ja) |
TW (1) | TWI453846B (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101688049B1 (ko) | 2010-12-03 | 2016-12-20 | 삼성전자 주식회사 | 테스터 및 그 테스터를 포함한 테스트 장치 |
CN102507996B (zh) * | 2011-09-27 | 2014-02-26 | 沈玉良 | 探针卡升降机构 |
KR101958856B1 (ko) * | 2012-06-08 | 2019-03-15 | 스티칭 컨티뉴테이트 베이제르트 엔지니어링 | 프로브 장치 |
CN103575294B (zh) * | 2012-07-27 | 2016-02-24 | 中国航空工业第六一八研究所 | 硅微陀螺芯片探针卡 |
JP6054150B2 (ja) | 2012-11-22 | 2016-12-27 | 日本電子材料株式会社 | プローブカードケース及びプローブカードの搬送方法 |
KR101380375B1 (ko) | 2013-04-25 | 2014-04-02 | 성정임 | 평판 디스플레이 패널 검사용 프로브장치 |
JP6041175B2 (ja) | 2015-03-30 | 2016-12-07 | 株式会社東京精密 | プローバ |
CN105080803B (zh) * | 2015-08-21 | 2018-08-07 | 京东方科技集团股份有限公司 | 基板承载结构、减压干燥设备及减压干燥方法 |
KR102446953B1 (ko) * | 2016-02-24 | 2022-09-23 | 세메스 주식회사 | 정렬 지그 및 이를 이용하여 테스트 헤드를 프로브 스테이션에 정렬하는 방법 |
JP6885456B2 (ja) * | 2017-02-22 | 2021-06-16 | 新東工業株式会社 | テストシステム |
JP7267058B2 (ja) * | 2019-03-26 | 2023-05-01 | 東京エレクトロン株式会社 | 検査装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2965174B2 (ja) * | 1991-07-05 | 1999-10-18 | 株式会社東京精密 | 半導体素子検査装置 |
JP3095318B2 (ja) * | 1993-11-25 | 2000-10-03 | 東京エレクトロン株式会社 | 被検査体のテスト装置 |
JP2967798B2 (ja) * | 1993-12-16 | 1999-10-25 | 株式会社東京精密 | ウエハプローバ |
JP2967860B2 (ja) * | 1994-11-15 | 1999-10-25 | 株式会社東京精密 | ウエハプローバ |
JPH1050778A (ja) * | 1996-08-03 | 1998-02-20 | Tokyo Electron Ltd | 重量物移動装置及び検査装置 |
US6048750A (en) | 1997-11-24 | 2000-04-11 | Micron Technology, Inc. | Method for aligning and connecting semiconductor components to substrates |
KR19990028749U (ko) * | 1997-12-27 | 1999-07-15 | 구본준 | 반도체 프로버장비 |
US6441629B1 (en) | 2000-05-31 | 2002-08-27 | Advantest Corp | Probe contact system having planarity adjustment mechanism |
-
2007
- 2007-09-03 JP JP2007228078A patent/JP5076750B2/ja active Active
-
2008
- 2008-07-04 KR KR1020080064975A patent/KR101025389B1/ko active IP Right Grant
- 2008-09-02 TW TW097133597A patent/TWI453846B/zh active
- 2008-09-03 CN CN2008102118163A patent/CN101382580B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2009060037A (ja) | 2009-03-19 |
KR101025389B1 (ko) | 2011-03-29 |
TW200935535A (en) | 2009-08-16 |
TWI453846B (zh) | 2014-09-21 |
KR20090024056A (ko) | 2009-03-06 |
JP5076750B2 (ja) | 2012-11-21 |
CN101382580A (zh) | 2009-03-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101382580B (zh) | 探测器装置以及探测方法 | |
US6501289B1 (en) | Inspection stage including a plurality of Z shafts, and inspection apparatus | |
CN101515016B (zh) | 探测装置和探测方法 | |
CN101685132A (zh) | 探测装置 | |
TWI285932B (en) | Electron beam test system with integrated substrate transfer module | |
US10416229B2 (en) | Wafer inspection method and wafer inspection device | |
CN106847723A (zh) | 具有一探针装置的测试***及转位机构 | |
KR101784187B1 (ko) | 반도체 웨이퍼 프로버 | |
JP5517344B2 (ja) | プローブカードの搬送機構、プローブカードの搬送方法及びプローブ装置 | |
KR101696682B1 (ko) | 전자부품 핸들링 장치 및 전자부품 시험장치 | |
CN105452887A (zh) | 探针装置 | |
CN101769987A (zh) | 探测器装置 | |
KR100878211B1 (ko) | 프로브스테이션 및 이를 이용한 웨이퍼 검사방법 | |
KR20100101451A (ko) | 반도체 디바이스 테스트 장치 및 방법 | |
US20080297185A1 (en) | Multi probe card unit, probe test device including the multi probe card unit, and methods of fabricating and using the same | |
KR970011745B1 (ko) | 전기적 프로우빙 시험 장치 | |
KR102413393B1 (ko) | 검사 장치 | |
CN102116835A (zh) | 探测装置以及衬底运送方法 | |
KR100206641B1 (ko) | 핸들러의 로터리 아암 및 디바이스척부의 구조 | |
JP5137965B2 (ja) | 搬送装置および電子部品ハンドリング装置 | |
CN111727363B (zh) | 轮辋更换装置、轮胎试验装置及轮辋更换方法 | |
CN115308677A (zh) | 一种用于电能表计量误差的自动检定*** | |
KR100833286B1 (ko) | 웨이퍼 공급장치 및 이를 이용한 웨이퍼 공급방법 | |
KR20170110863A (ko) | 테스터기가 가변되는 칩 검사장치 | |
KR20230158112A (ko) | 처리 장치 및 기판 반송 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |