WO2012008233A1 - Dispositif électroluminescent de montage en surface, et écran - Google Patents

Dispositif électroluminescent de montage en surface, et écran Download PDF

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Publication number
WO2012008233A1
WO2012008233A1 PCT/JP2011/062678 JP2011062678W WO2012008233A1 WO 2012008233 A1 WO2012008233 A1 WO 2012008233A1 JP 2011062678 W JP2011062678 W JP 2011062678W WO 2012008233 A1 WO2012008233 A1 WO 2012008233A1
Authority
WO
WIPO (PCT)
Prior art keywords
emitting device
display unit
wiring
wiring board
light
Prior art date
Application number
PCT/JP2011/062678
Other languages
English (en)
Japanese (ja)
Inventor
将人 寺西
江藤　力
斎藤　雄作
柳浦　聡
治彦 角谷
博夫 坂本
阿部　修
Original Assignee
三菱電機株式会社
岩谷産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社, 岩谷産業株式会社 filed Critical 三菱電機株式会社
Publication of WO2012008233A1 publication Critical patent/WO2012008233A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present invention relates to a surface-mounted light-emitting device using an LED chip as a light-emitting source, and a display unit using the surface-mounted light-emitting device.
  • surface-mounted LED display units in which surface-mounted LED packages with built-in LED chips are arranged at lattice points have become widespread, and with the increase in outdoor use, development of higher-definition surface-mounted LED display units has been progressing. It is getting popular.
  • a surface mount type LED display unit has a surface mount type LED package mounted on the wiring board by connecting the electrodes of the surface mount type LED package to the wiring portion of the wiring board by soldering or brazing. Composed.
  • a surface-mount LED package is composed of an LED chip that is a light-emitting element, a pair of electrodes connected to the LED chip via bonding wires, and an insulating material such as a transparent epoxy resin that integrally accommodates these electrodes. And a mold part.
  • the wiring board on which the wiring portion is printed is made of an insulating material such as glass epoxy resin obtained by impregnating a glass fiber cloth with an epoxy resin or the like.
  • the conventional surface mount LED display unit configured as described above has a wiring between the electrode portion of the surface mount LED package and the wiring board due to the difference in linear expansion coefficient between the surface mount LED package and the wiring board.
  • electrodes of a surface mount LED package fixed to a circuit pattern of a wiring board via a bonding material are formed in a shape that can be elastically deformed, and the difference in linear expansion coefficient between the surface mount LED package and the wiring board
  • a surface-mounted light-emitting device that absorbs the strain caused by the above by an electrode that can be elastically deformed to prevent the occurrence of the above-mentioned cracks (see, for example, Patent Document 1).
  • a terminal portion in a circuit pattern of a wiring board fixed to an electrode of a surface mounting LED package via a bonding material is formed to be elastically deformable, and linear expansion between the surface mounting LED package and the wiring board is achieved.
  • a surface-mounted light-emitting device that absorbs strain caused by a difference in coefficients by the above-described elastically deformable terminal portion and prevents the occurrence of the above-described cracks (see, for example, Patent Document 2). .
  • the external connection terminal of the surface mount type LED package fixed to the circuit pattern of the wiring board via a bonding material is constituted by a clip portion sandwiching the LED package and an L-shaped elastic portion, and is surface mounted type.
  • a surface mount type light emitting device has been proposed in which distortion caused by a difference in linear expansion coefficient between an LED package and a wiring board is absorbed by an L-shaped elastic portion to prevent the occurrence of the aforementioned cracks ( For example, see Patent Document 3).
  • the conventional device in which the surface on the side in contact with the wiring board in the surface-mount type LED package described above is covered with another insulating material formed of a material having a linear expansion coefficient close to the linear expansion coefficient of the wiring board.
  • another insulating material formed of a material having a linear expansion coefficient close to the linear expansion coefficient of the wiring board.
  • the present invention has been made in order to solve the above-described problems in the conventional surface-mounted light-emitting device, and without causing the configuration to be complicated, the electrode portion of the surface-mounted light-emitting device and the wiring portion of the wiring board It is an object of the present invention to provide a highly reliable surface-mount light-emitting device in which the occurrence of cracks at the joint is reliably suppressed.
  • the present invention has been made in order to solve the above-described problems in the conventional surface-mount display unit, and without causing the configuration to be complicated, the electrode portion and the wiring board of the surface-mount light-emitting device can be obtained.
  • An object of the present invention is to provide a highly reliable display unit in which the occurrence of cracks at the joint with the wiring portion is reliably suppressed.
  • a surface-mount light-emitting device includes an LED chip serving as a light-emitting source, a plurality of electrode parts connected to the LED chip, and a mold part that houses the LED chip and the plurality of electrode parts.
  • a plurality of electrode parts are bonded to a wiring part of a wiring board, and the back surface of the mold part is mounted so as to be opposed to the front surface of the wiring board,
  • the mold part includes a hollow part that forms a space on the back surface side.
  • the display unit according to the present invention is a display unit in which a surface-mounted light-emitting device is disposed at each of a plurality of lattice points, and the surface-mounted light-emitting device includes an LED chip serving as a light source and the LED chip.
  • the back surface of the surface mount type light emitting device is configured to be mounted so as to be opposed to the front surface of the wiring board, and the mold portion of the surface mount light emitting device includes a recess portion that forms a space on the back surface side. It is what.
  • the surface-mounted light-emitting device is placed on the wiring board via glass beads, and bonding between the electrode and the wiring part of the wiring board is performed by soldering or This is performed by brazing, and the solder material by soldering or the brazing material by brazing is filled in the gaps between the respective electrodes formed by the glass beads and the wiring portion.
  • the recess portion that forms the space is provided on the back surface side of the mold portion that accommodates the LED chip and the plurality of electrode portions, the electrode portion and the wiring portion of the wiring board are provided. It is possible to reduce the stress generated at the joint portion.
  • the surface-mounted light-emitting device having a recess portion that forms a space on the back side of the mold portion that houses the LED chip and the plurality of electrode portions is provided with a plurality of lattice points. Therefore, the stress generated at the joint between the electrode portion and the wiring portion of the wiring board can be reduced.
  • the surface-mounted light-emitting device is placed on the wiring board via glass beads, so that the soldering material by soldering for joining the electrode part and the wiring part or the A brazing material by brazing is filled in a gap between each of the electrodes formed by the glass beads and the wiring portion, and the amount of the solder material or brazing material can be increased. The strength of the joint portion with the portion can be increased.
  • FIG. 1 is a cross-sectional side view showing a part of a surface-mounted light-emitting device and a display unit according to Embodiment 1 of the present invention. It is a cross-sectional side view which shows a part of display unit by Embodiment 2 of this invention.
  • a surface-mounted LED package 100 which is a surface-mounted light-emitting device, includes an LED chip 10 that emits light when a predetermined voltage is applied, a chip holding unit 11 that holds the LED chip 10, and an LED.
  • the chip 10 is composed of a pair of electrodes 14 and 15 connected to a pair of electrodes (not shown) of the chip 10 via bonding wires 12 and 13, respectively, and a mold portion 16 made of a transparent epoxy resin.
  • the mold part 16 is formed by molding a transparent epoxy resin, and houses the LED chip 10, the chip holding part 11, the pair of electrode parts 14 and 15, and the bonding wires 12 and 13 therein. These are fixed together.
  • the electrode portions 14 and 15 include wire connection portions 141 and 151 connected to the bonding wires 12 and 13, respectively, and an intermediate portion 142 that is bent substantially perpendicularly from the wire connection portions 141 and 151 and extends in the vertical direction in FIG. 152 and outer conductor connecting portions 143 and 153 which are bent at substantially right angles from the intermediate portions 142 and 152 and extend in the horizontal direction in FIG.
  • the lower surfaces of the external conductor connecting portions 143 and 153 in the electrode portions 14 and 15 are in the same plane as the back surface of the mold portion 16 and are exposed from the back surface of the mold portion 16. Further, the end portions of the outer conductor connecting portions 143 and 153 are exposed from the lower side surface of the mold portion 16.
  • a hollow part 17 formed by a concave groove penetrating from one end face to the other end face.
  • the hollow portion 17 forms a space that separates one electrode portion 14 and the other electrode portion 15 on the back surface side of the mold portion 16. That is, a part of the outer conductor connecting part 143 and the intermediate part 142 of one electrode part 14 and a part of the outer conductor connecting part 153 and the intermediate part 152 of the other electrode part 15 are the space formed by the recess part 17. Are separated from each other.
  • the wiring board 200 is made of an insulating material such as a glass epoxy resin obtained by impregnating a glass fiber cloth with an epoxy resin or the like, and a conductor is formed in a predetermined pattern on the surface by printing. A wiring part (not shown) is provided.
  • the surface-mounted LED package 100 is mounted on the wiring board 200 with a pair of electrode portions 14 and 15 bonded to predetermined wiring portions of the wiring board 200 by soldering.
  • the joint portions 31 and 32 made of solder material by soldering firmly fix the wiring portion of the wiring board 200 and the exposed portions of the external conductor connecting portions 143 and 153 of the surface mount LED package 100, and electrically connect them. Connected to.
  • the back surface of the mold part 16 faces the surface of the wiring board 200, and the back surface may abut against the surface of the wiring board 200.
  • the display unit according to Embodiment 1 of the present invention is configured by mounting the above-described surface-mount LED package 100 on a large number of lattice points on a wiring board.
  • Each surface-mount LED package 100 is configured as shown in FIG.
  • a known technique can be used for the operation relating to the display of video or characters in the display unit configured as described above, and the description thereof is omitted here.
  • the insulating material constituting the wiring board 200 and the mold portion 16 of the surface mount type LED package 100 are configured.
  • the insulating material is made of a different material and has a different linear expansion coefficient. Therefore, in the case of the conventional apparatus, due to the temperature change, stress is generated in the joint portions 31 and 32 due to the difference in the linear expansion coefficient, and the joint portions 31 and 32 may be cracked or peeled off.
  • the recess 17 is formed on the back surface side of the mold part 16 of the surface mount LED package 100, the contact between the surface mount LED package 100 and the wiring board 200 is achieved.
  • the electrode parts 14 and 15 of the surface-mount LED package 100 and the wiring part of the wiring board 200 are reduced. It is possible to suppress the occurrence of cracks in the joint portions 31 and 32 due to soldering, and to improve the reliability of the surface mount LED package 100 and the display unit.
  • FIG. 2 is a cross-sectional side view showing a part of a display unit according to Embodiment 2 of the present invention.
  • the structure of the surface-mounted LED package 100 as the surface-mounted light emitting device is the same as that of the surface-mounted LED package 100 shown in FIG. 1 in the first embodiment.
  • the configuration of wiring board 200 is the same as that of wiring board 200 shown in FIG. 1 in the first embodiment.
  • the surface-mounted LED package 100 is placed on the surface of the wiring board 200 through a large number of glass beads 18, and the external conductor connection parts 143 and 153 of the pair of electrode parts 14 and 15 are provided on the wiring board 200 according to a predetermined wiring.
  • the part is mounted by soldering.
  • a gap corresponding to the diameter of the glass beads 18 is provided between the wiring portion of the wiring substrate 200 and the exposed portions of the external conductor connecting portions 143 and 153 of the surface mount LED package 100. Is formed, and the gap is filled with a solder material by soldering, so that the thickness of the joint portions 31 and 32 is increased.
  • a display unit according to Embodiment 2 of the present invention is configured by mounting the surface-mount LED package 100 described above on a large number of grid points on a wiring board. The mounting is performed by mounting the surface mount LED package 100 on the surface of the wiring substrate 200 through the glass beads 18 as described above and soldering as described above.
  • a known technique can be used for the operation relating to the display of video or characters in the display unit configured as described above, and the description thereof is omitted here.
  • the insulating material constituting the wiring substrate 200 and the insulating material constituting the mold portion 16 of the surface mount LED package 100 are as described above.
  • the surface mount LED package 100 is formed of different materials and has different linear expansion coefficients, but the recess 17 is formed on the back surface side of the mold portion 16 of the surface mount LED package 100. Even if the wiring board 100 expands and contracts due to the lighting of the surface mount LED package 100 or a change in the ambient temperature, the electrode portions 14 and 15 of the surface mount LED package 100 are reduced.
  • the surface mount type LED package can suppress the occurrence of cracks in the joint portions 31 and 32 due to soldering between the wiring board 200 and the wiring portion of the wiring board 200. 00, and it is possible to improve the reliability of the display unit.
  • the glass beads 18 are interposed between the wiring portion of the wiring substrate 200 and the exposed portions of the external conductor connecting portions 143 and 153 of the surface mount LED package 100. Since the gap corresponding to the diameter is formed, the gap is filled with the solder material, the thickness of the joint portions 31 and 32 made of the solder material is increased, and the wiring portion of the wiring board 200 and the surface mount LED package 100 are increased.
  • the bonding force with the outer conductor connecting portions 143 and 153 of the first embodiment is increased as compared with the case of the first embodiment, and the occurrence of cracks occurring in the joint portion 3 can be further suppressed, and the reliability can be further improved. it can.
  • the surface mount LED package as the surface mount light emitting device includes the LED chip 10, the chip holder 11 that holds the LED chip 10, and the pair of electrodes of the LED chip 10. (It was not shown in figure) It comprised from the pair of electrode parts 14 and 15 connected via the bonding wires 12 and 13, respectively, and the mold part 16 which consists of transparent epoxy resins, but other structures, for example, a chip
  • the LED chip 10 may be directly placed on one of the pair of electrode portions 14 and 15 without providing the holding portion 11.
  • the hollow part 17 was formed by the ditch
  • the size and shape of the hollow portion 17 do not necessarily have the shape shown in FIGS. 1 and 2, and the larger the size, the more the stress generated in the joint portions 31 and 32 is alleviated and cracks are generated. The effect of suppressing is increased.
  • the wiring portion of the wiring board 200 and the exposed portions of the external conductor connecting portions 143 and 153 of the surface mount LED package 100 are joined by soldering. Instead of brazing, brazing may be used.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

L'objet de la présente invention est de fournir un dispositif électroluminescent de montage en surface hautement fiable permettant de supprimer de façon fiable la survenue d'une fissure dans un joint situé entre une partie d'électrode du dispositif électroluminescent de montage en surface et une partie de câblage d'un substrat de câblage sans compliquer la configuration ; l'objet de la présente invention est également de fournir un écran. La présente invention a trait à un dispositif électroluminescent de montage en surface qui est équipé d'une puce de diode électroluminescente tenant lieu de source électroluminescente, d'une pluralité de parties d'électrode connectée à la puce de diode électroluminescente, et d'une partie de moule permettant de loger la puce de diode électroluminescente et la pluralité de parties d'électrode, et qui est configuré de manière à ce que la pluralité de parties d'électrode puisse être fixée sur une partie de câblage d'un substrat de câblage et de manière à ce que la surface arrière de la partie de moule puisse être montée en vue de faire face à la surface du substrat de câblage. La partie de moule est équipée d'un évidement qui forme un espace entre au moins deux électrodes parmi la pluralité d'électrodes du côté de la surface arrière. Cet écran est configuré en disposant les dispositifs électroluminescents de montage en surface configurés comme décrit ci-dessus à une pluralité de nœuds.
PCT/JP2011/062678 2010-07-14 2011-06-02 Dispositif électroluminescent de montage en surface, et écran WO2012008233A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010159647 2010-07-14
JP2010-159647 2010-07-14

Publications (1)

Publication Number Publication Date
WO2012008233A1 true WO2012008233A1 (fr) 2012-01-19

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019162443A1 (fr) * 2018-02-23 2019-08-29 Osram Opto Semiconductors Gmbh Module optoélectronique, procédé et pièce moulée

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07226537A (ja) * 1994-02-09 1995-08-22 Matsushita Electron Corp 発光ダイオード整列光源
JPH1090576A (ja) * 1996-09-17 1998-04-10 Fuji Photo Film Co Ltd 光学部材の固定構造
JP2001208627A (ja) * 2000-01-24 2001-08-03 Saginomiya Seisakusho Inc 半導体圧力検出装置
JP2003332632A (ja) * 2002-05-16 2003-11-21 Sony Corp 素子アレイ装置及び素子アレイ装置の製造方法
JP2008192755A (ja) * 2007-02-02 2008-08-21 Fujitsu Ten Ltd 熱膨張率の異なる部材同士の固定構造

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07226537A (ja) * 1994-02-09 1995-08-22 Matsushita Electron Corp 発光ダイオード整列光源
JPH1090576A (ja) * 1996-09-17 1998-04-10 Fuji Photo Film Co Ltd 光学部材の固定構造
JP2001208627A (ja) * 2000-01-24 2001-08-03 Saginomiya Seisakusho Inc 半導体圧力検出装置
JP2003332632A (ja) * 2002-05-16 2003-11-21 Sony Corp 素子アレイ装置及び素子アレイ装置の製造方法
JP2008192755A (ja) * 2007-02-02 2008-08-21 Fujitsu Ten Ltd 熱膨張率の異なる部材同士の固定構造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019162443A1 (fr) * 2018-02-23 2019-08-29 Osram Opto Semiconductors Gmbh Module optoélectronique, procédé et pièce moulée
US11527689B2 (en) 2018-02-23 2022-12-13 Osram Oled Gmbh Optoelectronic assembly, method and molded part

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