Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
  • H05K3/4007—Surface contacts, e.g. bumps
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/46—Manufacturing multilayer circuits
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/10—Bump connectors; Manufacturing methods related thereto
  • H01L2224/11—Manufacturing methods
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/11—Printed elements for providing electric connections to or between printed circuits
  • H05K1/111—Pads for surface mounting, e.g. lay-out
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/11—Printed elements for providing electric connections to or between printed circuits
  • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/03—Conductive materials
  • H05K2201/0332—Structure of the conductor
  • H05K2201/0364—Conductor shape
  • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
  • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
  • H05K2201/09845—Stepped hole, via, edge, bump or conductor
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
  • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/05—Patterning and lithography; Masks; Details of resist
  • H05K2203/0562—Details of resist
  • H05K2203/0588—Second resist used as pattern over first resist
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/05—Patterning and lithography; Masks; Details of resist
  • H05K2203/0562—Details of resist
  • H05K2203/0594—Insulating resist or coating with special shaped edges
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
  • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
  • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
  • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern

Definitions

• the present invention relates to a metal layer structure of a multilayer substrate and a method of fabricating the same, and more particularly to a metal layer structure of a flexible multilayer package substrate and a method of fabricating the same.
• Multi-layer substrates are used in the fields of packaging substrates, printed circuit boards, flexible package substrates, and flexible circuit boards.
• the integration of high-density systems is an inevitable trend in the miniaturization of today's electronic products, especially when flexible flexible substrates are used to make flexible package structures. It can be effectively applied to various products and meets the needs of miniaturization.
• the thickness of the flexible multilayer substrate is thinner, and the higher the routing density of the multilayer substrate, the finer the dimensional requirements of the metal layer structure of the flexible multilayer substrate.
• the flexible multilayer substrate of the prior art is usually only two to three layers, each layer having a thickness of about 50 to 60 ⁇ m, and a metal layer having a thickness of about 30 ⁇ m.
• FIG. 1 is a schematic view showing a state in which bubbles are generated on the side of the metal layer structure of the flexible multilayer substrate in the prior art.
• the existing flexible multilayer substrate has a metal layer 100 and a dielectric layer 102 overlying it.
• the metal layer 100 of the conventional flexible multilayer substrate is formed by a etching method or a lamination method. If the metal layer 100 is used as a metal wiring or a pad, the cross-sectional shape is rectangular or rectangular as shown.
• a common problem when making metal layers is that bubbles are generated at the edges of the metal layer, and as shown, the adhesion or peeling phenomenon is caused. Further, it may result in a decrease in the manufacturing yield of the flexible multilayer substrate. In particular, when the thickness of the above-mentioned flexible multilayer substrate is further thinned and the thickness of the metal layer is also thinner, the influence of the above-mentioned adhesion failure or peeling phenomenon becomes more and more conspicuous.
• FIG. 2 is a schematic view showing that the metal layer structure of the flexible multilayer substrate of the prior art may be peeled off from the multilayer substrate together with the packaged solder balls due to external force.
• the metal layer 100 is used as a metal line or a pad, the cross-sectional shape is rectangular or rectangular as shown. And if the metal layer 100 is used as a metal layer for encapsulating and bonding the IC, the dielectric layer 102 coated on the metal layer 100 in the flexible multilayer substrate is opened, and the metal material 106 is filled and packaged. The solder balls 108 are joined.
• the flexible multilayer substrate When the flexible multilayer substrate is used as a flexible package substrate and a flexible circuit board as described above, it is applied to a multi-flex product, in other words, when the flexible substrate is bent, the metal layer 100 and the package may occur.
• the bonding force between the solder balls 108 is strong, and the metal layer 100 and the package solder ball 108 are peeled off from the multilayer substrate together due to the bending external force.
• Question. The above situation is shown in Figure 2.
• the thickness of the above-mentioned flexible multilayer substrate is further thinner and the thickness of the metal layer is also thinner, the influence of the aforementioned peeling phenomenon becomes more apparent.
• the technical problem to be solved by the present invention is to study the metal layer structure of a flexible multilayer substrate and a manufacturing method thereof, which can still be effective when the thickness of the flexible multilayer substrate is further reduced and the thickness of the metal layer is also thinner.
• the metal layer structure is not easily delaminated or separated from the dielectric layer to be contacted, and has higher reliability.
• the present invention provides a metal layer structure of a flexible multilayer substrate comprising a first metal layer and a dielectric layer.
• the first metal layer has a body and an embedded base, and the body is located above the embedded base, and the bottom area of the embedded base is larger than the bottom area of the body.
• the dielectric layer is disposed on the body and the embedded layer of the first metal layer, and a via hole is formed at the position of the first metal layer for the second metal layer on the body of the first metal layer and the dielectric layer Engage.
• the body and the insert base may be integrally formed and formed at the same time. Alternatively, the same or different metal materials may be used, and after the embedded substrate is formed by different processes, the body is formed on the embedded substrate.
• the present invention also provides a method for fabricating a metal layer structure of a flexible multilayer substrate, comprising the steps of: coating at least one photoresist layer on the first dielectric layer; and performing photolithography on a predetermined position of the first metal layer Developing a glue layer; removing a photoresist layer at a predetermined position; and forming a first metal layer at a predetermined position, wherein a bottom edge area of the first metal layer is larger than a top area, or may be resisted to the photoresist layer to form A metal layer structure having a body and an embedded base.
• the present invention further provides a method for fabricating a metal layer structure of another flexible multilayer substrate, comprising the steps of: coating a first photoresist layer on the first dielectric layer; at a predetermined position of the first metal layer, a photoresist layer is developed; removing a first photoresist layer at a predetermined position; forming an embedded layer of the first metal layer at a predetermined position; and removing the first photoresist layer, coating the second photoresist Developing a second photoresist layer at a predetermined position of the first metal layer; removing the second photoresist layer at the predetermined position, so that the opening of the second photoresist layer is smaller than the first photoresist layer And a body forming a first metal layer at a predetermined position, forming a metal layer structure in which the embedded base is located below the body, and the bottom area of the embedded base is larger than the bottom area of the body.
• An advantage of the present invention is that the metal layer structure of the flexible multilayer substrate can be used not only for a package substrate but also for the technical field of manufacturing a flexible printed circuit board or a flexible package substrate.
• the invention The spirit of the method for fabricating a layer structure is to fabricate a metal layer structure having a body and an embedded layer.
• the metal layer structure of the thin flexible multilayer substrate is not easily contacted with the adjacent layer.
• the delamination or separation phenomenon of the dielectric layer can be used as a hole pad or a metal line of a flexible multilayer substrate, and can have higher reliability.
• FIG. 1 is a schematic view showing a state in which a bubble is generated on a side of a metal layer structure of a prior art flexible multilayer substrate
• FIG. 2 is a metal layer structure of a prior art flexible multilayer substrate which may be self-layered with a packaged solder ball due to an external force. a schematic view of the substrate being peeled off;
• Figure 3 is a cross-sectional view showing a first embodiment of a metal layer structure of a flexible multilayer substrate of the present invention
• Figure 4 is a cross-sectional view showing a second embodiment of a metal layer structure of a flexible multilayer substrate of the present invention.
• Figure 5 is a view showing a manufacturing method of a first embodiment of a metal layer structure of a flexible multilayer substrate of the present invention
• Figure 6 is a view showing a second embodiment of a metal layer structure of a flexible multilayer substrate of the present invention.
• FIG. 3 there is shown a cross-sectional view of a first embodiment of a metal layer structure of a flexible multilayer substrate of the present invention.
• the metal layer structure of the flexible multilayer substrate is used as a hole pad, and the flexible multilayer substrate is used for package connection of a not shown:).
• the metal layer structure of the flexible multilayer substrate includes a first metal layer 300 having a body 302 and an embedded substrate 304 and a second dielectric layer 308.
• the flexible multilayer substrate also has a first dielectric layer 200 beneath it.
• the body 302 is positioned over the embedded substrate 304, and the bottom area of the embedded base 304 is greater than the bottom area of the body 302.
• the second dielectric layer 308 is overlying the body 302 and the embedded substrate 304 of the first metal layer 300. After the second dielectric layer 308 is applied, the embedded substrate 304 is sandwiched by the first dielectric layer 200 and the second dielectric layer 308 as shown.
• a via hole is disposed on the second dielectric layer 308 above the body 302 to bond the body 302 to the package solder ball 310, and the package is not shown to the IC:). If bubbles are generated on the side of the first metal layer 300, the embedded The base 304 can reduce the effects of peeling and delamination due to bubbles. Moreover, although the bonding between the first metal layer 300 and the first dielectric layer 200 has a certain strength, the present embodiment is sandwiched by the first dielectric layer 200 and the second dielectric layer 308 by using the embedded substrate 304. The force can effectively prevent the problem that the first metal layer 300 and the package solder ball 310 are peeled off from the multilayer substrate when the flexible multilayer substrate is bent.
• the thickness of the first metal layer 300 is only about 5 ⁇ m.
• the metal layer structure of the flexible multilayer substrate is used as an aperture pad.
• the metal layer structure of the flexible multilayer substrate is used as a metal line, the upper layer is bonded to the other layer. Metal lines.
• the metal layer structure of the multi-layer substrate of the specific embodiment can solve the disadvantages faced by the prior art, and more effectively improve the reliability of the flexible multi-layer substrate.
• the metal layer structure of the flexible multilayer substrate includes a first metal layer 400 having a body 402 and an embedded base 404 and a second dielectric layer 308.
• the flexible multilayer substrate further has a first dielectric layer 200 beneath it. As shown, the body 402 is positioned over the embedded base 404, and the bottom surface of the embedded base 404 is larger than the bottom area of the body 402.
• the second dielectric layer 308 is coated on the body 302 and the embedded substrate 304 of the first metal layer 300. After the second dielectric layer 308 is applied, the embedded substrate 404 is sandwiched by the first dielectric layer 200 and the second dielectric layer 308 as shown. A via hole is disposed on the second dielectric layer 308 above the body 402, and the body 402 is bonded to the package solder ball 310 to encapsulate the IC (not shown).
• the body 402 and the insert base 404 may be formed of the same or different metal materials. Moreover, the body 402 and the insert base 404 can be integrally formed by the same process and formed at the same time. Furthermore, it is also possible to employ two processes, first forming the embedded base 404 and then forming the body 402 on the embedded base 404. Similarly, if the metal layer structure of the flexible multilayer substrate is used as a metal wiring, the metal layer which is joined to the upper side is another metal wiring.
• the metal layer structure of the flexible multilayer substrate of the present invention can solve the disadvantages described in the prior art, and more effectively improve the reliability of the flexible multilayer substrate.
• the material of the metal layer may be copper, and the material of the dielectric layer may be polyimide.
• the metal layer structure manufacturing method of the flexible multilayer substrate of the present embodiment includes the following steps: coating a negative photoresist layer 306 on the first dielectric layer 200.
• the negative photoresist layer 306 is exposed and developed at a predetermined position of the first metal layer 300.
• the negative photoresist layer 306 at the predetermined location is removed. Since the photoresist layer above the negative photoresist layer 306 receives more light than the lower negative photoresist layer 306, the edge of the negative photoresist layer 306 adjacent to the predetermined position will form an upper side as shown in the figure.
• a first metal layer 300 having a metal layer structure of the body 302 and the embedded base 304 is formed at a predetermined position as shown.
• the embedded substrate 304 may extend outside the body 302 or may abut the negative photoresist layer 306.
• the bottom edge area of the first metal layer is larger than the area of the top portion, i.e., the area of the embedded base 304 is larger than the area of the body 302.
• the second dielectric layer 308 is overlying the body 302 and the embedded substrate 304 of the first metal layer 300.
• the embedded substrate 304 is sandwiched by the first dielectric layer 200 and the second dielectric layer 308.
• the via hole is formed at the position of the first metal layer 300, it can be bonded to the upper second metal layer (the package tin ball 310 or another metal line). If the first metal layer 300 is used as a hole pad, The package solder balls 310 are bonded and packaged. If the first metal layer 300 is used as a metal line, it is bonded to another metal line to realize internal communication of the flexible multilayer substrate.
• FIG. 6 is a schematic diagram showing a manufacturing method of a second embodiment of a metal layer structure of a flexible multilayer substrate according to the present invention.
• the first way is to directly form at least two upper and lower first photoresist layers 406 and a second photoresist layer 408 having different development rates.
• the first photoresist layer 406 and the second photoresist layer 408 may be a positive photoresist layer or a negative photoresist layer, while the first photoresist layer 406 and the second photoresist layer 408 are simultaneously developed.
• first photoresist layer 406 and the second photoresist layer 408 since the development rates of the first photoresist layer 406 and the second photoresist layer 408 are different, openings having different sizes as shown are formed.
• the opening of the first photoresist layer 406 is larger than the opening of the second photoresist layer 408.
• first metal layer 400 is formed at a predetermined position, a metal layer structure having the body 402 and the embedded base 404 is formed.
• This manufacturing method can simultaneously form the body 402 and the embedded base 404 with the same metal material.
• the method for fabricating the metal layer structure of the flexible multilayer substrate of the present invention comprises the following steps: coating the first dielectric layer 200 A photoresist layer 406.
• the first photoresist layer 406 is developed at a predetermined position of the first metal layer 400.
• the first photoresist layer 406 at a predetermined location is removed.
• the embedded base 404 of the first metal layer 402 is formed at a predetermined position.
• a second photoresist layer 408 is applied.
• the second photoresist layer 408 is developed at a predetermined position of the first metal layer 400.
• the second photoresist layer 408 at the predetermined position is removed such that the opening of the second photoresist layer 408 is smaller than the opening of the first photoresist layer 406.
• the body 402 of the first metal layer 400 is formed at a predetermined position, and the formed body 402 is located above the embedded base 404, that is, the metal layer structure in which the bottom area of the embedded base 404 is larger than the bottom area of the body 402.
• a second dielectric layer 308 is coated on the body 402 and the embedded substrate 404 of the first metal layer 400.
• the embedded substrate 404 is sandwiched by the first dielectric layer 200 and the second dielectric layer 308.
• the upper second metal layer (the package tin ball 310 or another metal line) can be bonded. If the first metal layer 400 is used as a hole pad, The package solder balls 310 are bonded and packaged; if the first metal layer 400 is used as a metal line, it is bonded to another metal line to realize internal communication of the flexible multilayer substrate.
• the manufacturing method of the present invention can form the body 402 with the same or different metal materials in a two-step process, and then form the body 402 on the embedded substrate 404.

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• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Production Of Multi-Layered Print Wiring Board (AREA)
• Structure Of Printed Boards (AREA)
• Laminated Bodies (AREA)

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• 2009
  • 2009-10-19 CN CN200910205487.6A patent/CN102045939B/zh active Active
• 2010
  • 2010-01-25 WO PCT/CN2010/070351 patent/WO2011047544A1/zh active Application Filing
  • 2010-01-25 EP EP20100824385 patent/EP2493274A4/en not_active Withdrawn
  • 2010-01-25 KR KR1020127011539A patent/KR101395336B1/ko active IP Right Grant
  • 2010-01-25 JP JP2012533460A patent/JP5507697B2/ja active Active

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