CN106711085B - 一种柔性互连金属的制备方法 - Google Patents
一种柔性互连金属的制备方法 Download PDFInfo
- Publication number
- CN106711085B CN106711085B CN201611141945.0A CN201611141945A CN106711085B CN 106711085 B CN106711085 B CN 106711085B CN 201611141945 A CN201611141945 A CN 201611141945A CN 106711085 B CN106711085 B CN 106711085B
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- Prior art keywords
- metal
- manufacturing
- interconnection metal
- flexible
- flexible interconnection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611141945.0A CN106711085B (zh) | 2016-12-12 | 2016-12-12 | 一种柔性互连金属的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611141945.0A CN106711085B (zh) | 2016-12-12 | 2016-12-12 | 一种柔性互连金属的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106711085A CN106711085A (zh) | 2017-05-24 |
CN106711085B true CN106711085B (zh) | 2019-02-19 |
Family
ID=58937302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201611141945.0A Active CN106711085B (zh) | 2016-12-12 | 2016-12-12 | 一种柔性互连金属的制备方法 |
Country Status (1)
Country | Link |
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CN (1) | CN106711085B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101088156A (zh) * | 2004-12-22 | 2007-12-12 | 3M创新有限公司 | 柔性电子电路制品及其制造方法 |
EP1993333A2 (en) * | 2007-05-18 | 2008-11-19 | Augux Co., Ltd. | Method for manufacturing tag integrated circuit flexible board and structure of the same |
CN102045939A (zh) * | 2009-10-19 | 2011-05-04 | 巨擘科技股份有限公司 | 柔性多层基板的金属层结构及其制造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101501574B (zh) * | 2006-08-03 | 2012-01-11 | 3M创新有限公司 | 长柔性电路及其制作方法 |
-
2016
- 2016-12-12 CN CN201611141945.0A patent/CN106711085B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101088156A (zh) * | 2004-12-22 | 2007-12-12 | 3M创新有限公司 | 柔性电子电路制品及其制造方法 |
EP1993333A2 (en) * | 2007-05-18 | 2008-11-19 | Augux Co., Ltd. | Method for manufacturing tag integrated circuit flexible board and structure of the same |
CN102045939A (zh) * | 2009-10-19 | 2011-05-04 | 巨擘科技股份有限公司 | 柔性多层基板的金属层结构及其制造方法 |
Also Published As
Publication number | Publication date |
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CN106711085A (zh) | 2017-05-24 |
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PB01 | Publication | ||
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GR01 | Patent grant | ||
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TR01 | Transfer of patent right |
Effective date of registration: 20200909 Address after: Room 211, second floor, scientific research building, Dongtinghu Road, Gaoyou Economic Development Zone, Yangzhou City, Jiangsu Province Patentee after: YANGZHOU HANXUN TECHNOLOGY Co.,Ltd. Address before: Hsinchu Songshan Lake high tech Industrial Development Zone of Dongguan City, Guangdong province 523000 New Building No. 13 6 4 Zhuyuan building room 607 Co-patentee before: DONGGUAN SOUTH CHINA DESIGN INNOVATION INSTITUTE Patentee before: DONGGUAN GUANGXIN INTELLECTUAL PROPERTY SERVICES Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220106 Address after: 225600 No.82 Qinyou Road, Gaoyou Economic Development Zone, Yangzhou City, Jiangsu Province Patentee after: GAOYOU HENGLI HYDRAULIC WHOLE SET EQUIPMENT Co.,Ltd. Address before: Room 211, 2nd floor, scientific research building, Dongtinghu Road, Gaoyou Economic Development Zone, Yangzhou City, Jiangsu Province 225600 Patentee before: YANGZHOU HANXUN TECHNOLOGY CO.,LTD. |
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TR01 | Transfer of patent right |
Effective date of registration: 20221230 Address after: 225600 second and third floors, building B8, science and technology entrepreneurship center, Dongtinghu Road, Gaoyou City, Yangzhou City, Jiangsu Province Patentee after: Jiangsu Shanghe Dental Technology Co.,Ltd. Address before: 225600 No.82 Qinyou Road, Gaoyou Economic Development Zone, Yangzhou City, Jiangsu Province Patentee before: GAOYOU HENGLI HYDRAULIC WHOLE SET EQUIPMENT Co.,Ltd. |
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TR01 | Transfer of patent right |